JP2003007585A - Optical component and projection aligner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical product having an optical thin film exhibiting different optical characteristics depending on the position on a lens substrate. SOLUTION: In the optical product having a multilayer optical thin film 4 on a lens substrate 2, each layer 4a, 4b and 4c constituting the optical thin film 4 has a concentric film thickness distribution dependent on the distance from the center of the lens substrate 2 and the film thickness distribution of at least one layer is differentiated from that of other layers.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical component having an optical thin film composed of a multilayer film on a lens substrate and a projection exposure apparatus having this optical component.

[0002]

2. Description of the Related Art Conventionally, there is an optical thin film forming apparatus shown in FIG. 9 as an apparatus for making the film thickness distribution of an optical thin film composed of a multilayer film laminated on a lens substrate with high accuracy. This optical thin film forming apparatus has a plurality of evaporation sources 5 in a vacuum chamber 50.
2 and 54 are arranged, and a shielding plate 56 that shields a part of the evaporation particles evaporated from each evaporation source is arranged to control the film thickness distribution formed on the lens substrates 58 and 60. That is, in this optical thin film forming apparatus, the lens substrates 58 and 60 mounted on the lens substrate holder 62 are revolved and rotated, and the amount of evaporated particles evaporated from each evaporation source is controlled to shield the evaporated particles. Opening 56 in 56
By reaching the lens substrates 58 and 60 via a and 56b, the film thickness of the optical thin film laminated on the lens substrates 58 and 60 is controlled to be uniform.

In the optical thin film forming apparatus shown in FIG. 9, by making the amount of evaporated particles from the two evaporation sources 52 and 54 equal, for example, for a lens having an effective diameter of 235 mm and a curvature of 152.6 mm. An optical thin film having a uniform film thickness can be formed. In this case, the rate of contribution of the two evaporation sources 52 and 54 to the film formation at each position on the lens substrate is different depending on the position on the lens substrate as shown in FIG. The total film thickness based on the sources 52 and 54 can reduce the film thickness variation to 3% or less. That is, an optical thin film having a substantially uniform film thickness can be formed. Here, the contribution ratio refers to the ratio of the film thickness formed by each evaporation source.
In FIG. 10, when the evaporation amounts from the evaporation source 52 and the evaporation source 54 are the same, the contribution rate of the evaporation source 52 to the film formation at each position on the lens substrate is RH1 and the evaporation source 54. The contribution rate to the film formation at each position on the lens substrate is indicated by RH2.

[0004]

By the way, considering the relationship between the position on the lens substrate and the incident angle of the light beam, in general, the incident angle of the light beam to the center part of the lens and the incident angle of the light beam to the peripheral part of the lens are considered. Incident angle is different. As shown in FIG. 11, since the light rays emitted from A, B, and C on the lens 2 have a spread of a predetermined angle, A on the lens 1 (center on the lens substrate) is The ray emitted from B is incident, but the ray emitted from C is not incident. Therefore, the incident angle range of the light ray at a of the lens 1 is 0 °.
~ Θ1. On the other hand, at b on the lens 1 (peripheral portion on the lens substrate), the light rays emitted from B and C of the lens 2 are incident, but the light rays emitted from A of the lens 2 are not incident. Here, since the incident angle of the light beam on the b of the lens 1 is defined with reference to the normal direction of the lens surface of the b of the lens 1, the incident angle range of the light beam on the b of the lens 1 is θ3 to θ2.

Therefore, in order to make the optical performance (here, antireflection performance) uniform at all positions on the lens substrate, it is necessary to form an optical thin film having different optical characteristics depending on the position on the lens substrate.

An object of the present invention is to provide an optical component having an optical thin film having different optical characteristics depending on the position on the lens substrate, and a projection exposure apparatus having this optical component.

[0007]

An optical component according to claim 1 is an optical component having an optical thin film made of a multilayer film on a lens substrate, wherein each layer constituting the optical thin film is formed from a center of the lens substrate. It is characterized in that it has a concentric film thickness distribution depending on the distance, and that the film thickness distribution of at least one layer constituting each layer is different from the film thickness distribution of other layers.

According to the optical component of the present invention, the film thickness distribution of at least one layer among the layers forming the optical thin film is made different from the film thickness distribution of the other layers, so that the film thickness on the lens substrate is increased. The optical characteristics of the optical thin film at all positions can be made uniform.

In the optical component according to a second aspect of the present invention, the film thickness of the at least one layer in the peripheral portion of the lens substrate is compared with the film thicknesses of other layers according to the incident angle of the light beam on the lens substrate. It is characterized by being thickened. According to the optical component of the second aspect, the optical characteristics at all positions on the lens substrate can be made uniform in consideration of the incident angle of the light ray.

Further, the optical component according to a third aspect is characterized in that each layer forming the optical thin film is formed of a fluoride thin film. According to the optical component of the third aspect, even when vacuum ultraviolet rays are used as the exposure light, the optical characteristics between all positions on the lens substrate are:
It can be uniform considering the incident angle of the light beam.

The optical component according to a fourth aspect is an optical component in which the thickness distribution of the film formed on the convex lens substrate is concentric with the optical axis of the lens substrate as the center, The ratio (a / b) of the thickness (a) of the central portion and the thickness (b) of the peripheral portion in at least one layer formed is 1
It is characterized by being less than.

The optical component according to a fifth aspect is an optical component in which the thickness distribution of the film formed on the concave lens substrate is concentric with the optical axis of the lens substrate as the center. The ratio (b / a) of the film thickness (a) of the central portion and the film thickness (b) of the peripheral portion in at least one formed layer is 1
It is characterized by being less than.

A projection exposure apparatus according to a sixth aspect is a projection exposure apparatus which projects and exposes a pattern image of a mask onto a substrate by using a projection optical system, and which illuminates the mask using vacuum ultraviolet rays as exposure light. An optical system and claims 3 to 5.
And a projection optical system that includes the optical component according to any one of items 1 to 5 and forms a pattern image of the mask on a substrate.

A projection exposure apparatus according to a seventh aspect is a projection exposure apparatus which projects and exposes a pattern image of a mask onto a substrate by using a projection optical system, and the projection exposure apparatus according to any one of the third to fifth aspects. And a projection optical system that forms a pattern image of the mask on a substrate.

According to the projection exposure apparatus of the sixth and seventh aspects, the projection optical system or the illumination optical system includes the optical component according to any one of the third to fifth aspects. The vacuum ultraviolet rays as the exposure light from the light source can be efficiently guided onto the substrate.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION An optical component according to an embodiment of the present invention will be described below with reference to the drawings. Figure 1
FIG. 4 is a diametrical sectional view of a lens according to an embodiment of the present invention. This lens has an optical thin film 4 made of a multilayer film on a lens substrate 2 made of a quartz substrate having a semicircular cross section passing through the center of the lens. This optical thin film 4
Has a three-layer structure including a first layer (MgF ₂ ) 4a, a second layer (LaF ₃ ) 4b, and a third layer (MgF ₂ ) 4c from the lens substrate 2 side.

Further, each layer (4a, 4a,
4b and 4c) have a concentric film thickness distribution depending on the distance from the center of the lens substrate 2. That is, the optical thin film 4
The first layer 4a and the third layer 4c are formed such that the film thickness of the central portion of the lens substrate 2 and the film thickness of the peripheral portion of the lens substrate 2 are the same. Therefore, the first layer 4a and the third layer 4c
Are formed with the same film thickness for any distance from the center of the lens substrate 2, that is, for the entire lens substrate 2.

The second layer 4b of the optical thin film 4 is formed so that the film thickness at the peripheral portion of the lens substrate 2 is twice the film thickness at the central portion of the lens substrate 2. . Therefore, the second layer 4b is formed so that the film thickness gradually increases from the center portion of the lens substrate 2 toward the peripheral portion of the lens substrate 2 depending on the distance from the center of the lens substrate 2.
Here, the film thickness in the peripheral portion of the lens substrate 2 of the second layer 4b is determined according to the incident angle of the light ray on the lens substrate 2.
It is formed to have a larger film thickness than the film thicknesses of the first layer 4a and the third layer 4c.

In the lens shown in FIG. 1, the thickness distribution of the film formed on the convex lens substrate is concentric with respect to the optical axis of the lens substrate, and at least one film is formed in multiple layers. The ratio (a / b) of the film thickness (a) at the central part and the film thickness (b) at the peripheral part in one layer is less than 1. When a multilayer film is formed on the concave lens substrate, the thickness distribution of the film formed on the concave lens substrate is concentric with the optical axis of the lens substrate as the center, and the multilayer film is formed. The ratio (b / a) of the film thickness (a) of the central portion and the film thickness (b) of the peripheral portion in the formed at least one layer is less than 1.

Next, an optical thin film forming apparatus for manufacturing an optical component according to an embodiment of the present invention will be described. FIG. 2 is a diagram showing a schematic configuration of the optical thin film deposition apparatus 10. The optical thin film forming apparatus 10 has a vacuum chamber 12 which is hermetically sealed and capable of being evacuated, and a substrate holder 14 is arranged in the vacuum chamber 12 so as to be rotatable and revolving.

As shown in FIG. 3, the substrate holder 14 has a substrate rotating mechanism and holds four lens substrates 2. Circular hole 14 in the center of substrate holder 14
Reference numeral a denotes a film thickness monitor hole, and a crystal oscillator attached to the hole 14a can detect a change in the film thickness formed on the lens substrate 2 as a change in the frequency of the crystal oscillator. .

An evaporation source 16 is provided at the bottom of the vacuum chamber 12.
Is provided, and the evaporation source 16 is the first evaporation source 16
a, a second evaporation source 16b and a third evaporation source 16c. The first evaporation source 16a is arranged at the center position of the substrate holder 14 of the evaporation source 16, that is, on the revolution axis Ca of the lens substrate 2, and on the trajectory of the center of the lens substrate 2, that is, the rotation axis trajectory of the lens substrate 2. The second evaporation source 16b and the third evaporation source 16c are arranged on Cb and Cc. That is,
The positional relationship between the second evaporation source 16b and the third evaporation source 16c is
There is a point-symmetrical relationship with the first evaporation source 16a as the center.

Between the evaporation source 16 and the substrate holder 14,
A diaphragm plate 18 is arranged to control the evaporation flow from the evaporation source 16. As shown in FIG. 4, the diaphragm plate 18 has circular openings 18 corresponding to the evaporation sources 16a, 16b, 16c.
a, 18b, 18c are formed. First evaporation source 16
The first opening 18a in the central portion formed corresponding to a is formed with a smaller diameter than the second opening 18b and the third opening 18c formed corresponding to the second evaporation source 16b and the third evaporation source 16c. Has been done.

Therefore, the evaporation flow of the evaporation sample evaporated from the first evaporation source 16a is limited so as to spread upward by θa about the central axis Ca, and the second evaporation source 16a.
b, the evaporation flow of the evaporation sample evaporated from the third evaporation source 16c is limited so as to spread upward by θb and θc which are angles larger than θa about the central axes Cb and Cc.

As a result, the amount of vaporized particles attached to the central portion of the lens substrate 2 is limited to some extent for each lens substrate 2, and the amount of vaporized particles attached to the vicinity of the peripheral portion of the lens substrate 2 is limited. I am.

Each of the evaporation sources 16a to 16c, as shown in FIG. 5 in plan view, heats and evaporates the sample holding member 17 for holding the evaporation sample and the evaporation sample held in the sample holding member 17. And an electron gun 20 for Since each of the evaporation sources 16a to 16c has the same configuration, only one evaporation source 16 is shown in FIG.

The sample holding member 17 is composed of a plurality of kinds of evaporated samples.
To hold a plurality of holding chambers (shown in FIG. 5).
In the sample holding member 17, three holding chambers, that is, M
gF ₂Holding chamber 17a, LaF for holding₃Hold hold
Chamber 17b, MgF₂Divided into a holding chamber 17c)
Is formed. The sample holding member 17 has a center position P.
It is configured to rotate freely (right rotation in Fig. 5) as the center.
Has been. Then, the electron gun 20 is mounted on the sample holding member 17.
Arranged to heat the position O, which is eccentric to the center position P.
It is set up. For this reason, one holding chamber (for example, 17
When the evaporation sample in a) is being heated and evaporated, another
The evaporation sample in the holding chamber (17b, 17c) should not be heated and evaporated.
Yes.

Optical thin film deposition apparatus 1 having the above structure
At 0, first, the first evaporation sample held in the first holding chamber 17a of each evaporation source 16a to 16c is heated and evaporated by the electron gun 20. In this case, the evaporation sources 16a to 16c
16a-1 of each evaporation source so that the amount of evaporation from
By controlling the evaporation time from 6c, a thin film of the first layer 4a having a uniform film thickness is deposited on the entire lens substrate 2.

After depositing the thin film of the first layer 4a in this manner, the sample holding member 17 of each evaporation source 16a to 16c is formed.
With the center position P of the sample holding member 17 as the center.
Rotate rightward, and the second evaporation sample held in the second holding chamber 17b is heated and evaporated by the electron gun 20. In this case, the amount of evaporation from the evaporation source 16a is determined by the evaporation sources 16b, 16
Each evaporation source 16 so that the amount of evaporation from c increases.
By controlling the evaporation time from a to 16c, the thin film of the second layer 4b, which is thicker in the peripheral portion of the lens substrate 2 than in the central portion of the lens substrate 2, is deposited.

Further, after vapor deposition of the second thin film,
Each of the evaporation sources 16a to 16c is rotated rightward by 120 ° about the center position P of the sample holding member 17, and the third evaporation sample held in the third holding chamber 17c is moved by the electron gun 20. Heat and evaporate. In this case, the evaporation time from each evaporation source 16a to 16c is controlled so that the evaporation amount from each evaporation source 16a to 16c becomes the same, so that the lens substrate 2 has a uniform film thickness. The thin film of the layer 4c is deposited. In this way, the optical component (lens) having the optical thin film 4 of the multilayer film shown in FIG. 1 is manufactured.

In the optical thin film forming apparatus according to this embodiment, the concentric film thickness distribution depending on the distance from the center of the lens substrate 2 is controlled by controlling the evaporation amount from each evaporation source 16a to 16c. It is possible to easily form the optical thin film 4 having Further, each evaporation source 16a to 16c
By controlling the evaporation time from, the film thickness distribution of the thin films forming each layer of the optical thin film 4 can be easily made different. That is, the film thickness at the peripheral portion of the lens substrate 2 of only one of the layers forming the optical thin film 4 is made easier than the film thickness of other layers by making the incident angle of the light ray at the peripheral portion of the lens substrate 2 correspond. Can be thickened.

The optical component manufactured in this manner has optical characteristics such as a uniform antireflection effect in consideration of the incident angle of a light ray at all positions on the lens substrate. Moreover, since each layer forming the optical thin film is formed of a fluoride thin film, even when vacuum ultraviolet rays are used as the exposure light, the optical characteristics can be made uniform at all positions on the lens substrate. . As a result, it is possible to manufacture an optical component having an optical thin film according to the optical design, and it is possible to realize the optical performance of the optical device as designed.

In the above embodiment, the optical thin film is composed of three layers of thin films, and each thin film is formed of the fluoride material (2 substances), but the invention is not limited to this. More film materials may be used and more layers may be used to form an optical thin film with uniform optical properties at all locations on the lens substrate.

Next, an example of the exposure apparatus according to the embodiment of the present invention will be described. FIG. 6 shows a basic structure of an exposure apparatus using an optical component (optical element) having a fluoride thin film obtained by the above-described optical thin film deposition apparatus, which shows a reticle pattern on a wafer coated with photoresist. It has particular application to projection exposure apparatus, such as steppers, for projecting images.

As shown in FIG. 6, this exposure apparatus irradiates at least a wafer stage 301 on which a substrate W coated with a photosensitizer can be placed on the surface 301a, and vacuum ultraviolet light having a wavelength prepared as exposure light. An illumination optical system 101 for transferring the prepared mask pattern (reticle R) onto the substrate W, a light source 100 for supplying exposure light to the illumination optical system 101, and an image of the pattern of the mask R on the substrate W It includes a projection optical system 500 placed between a first surface P1 (object plane) on which a mask R for projection is arranged and a second surface (image plane) matched with the surface of the substrate W.

The illumination optical system 101 includes a mask R and a wafer W.
It also includes an alignment optical system 110 for adjusting the relative position between the mask R and the wafer R.
It is arranged on a reticle stage 201 which can move parallel to the surface of the first unit. The reticle exchange system 200 exchanges and carries the reticle (mask R) set on the reticle stage 201. The reticle exchange system 200 includes a stage driver for moving the reticle stage 201 in parallel with the surface 301a of the wafer stage 301. The projection optical system 500 has an alignment optical system applied to a scan type exposure apparatus. The light source 100, the reticle exchange system 200, and the stage control system 300 are controlled by the main controller 400.

This exposure apparatus uses an optical component (optical element) including the fluoride thin film formed by the above-mentioned optical thin film forming apparatus. Specifically, the exposure apparatus shown in FIG. 6 can include an optical component (optical lens) according to the present invention as the optical lens 90 of the illumination optical system 101 and / or the optical lens 92 of the projection optical system 500. .

In this exposure apparatus, the projection optical system 500 or the illumination optical system 101 is provided with an optical component having uniform optical characteristics such as antireflection effect at all positions on the lens substrate.
Therefore, the vacuum ultraviolet rays as the exposure light from the light source 100 can be efficiently guided onto the substrate W.

[0039]

EXAMPLES Examples of the present invention are shown below. In this embodiment, a lens which is an optical component used in an optical system having a main wavelength of 193.4 nm will be described. This lens uses quartz as the lens substrate material, and MgF ₂ , La is added from the substrate side.
It has a three-layer structure of F ₃ and MgF ₂ . The lens shape has an effective diameter of 235 mm and a radius of curvature of 152.3 mm.

When this lens is used in an optical system, the angle of incidence of the light ray on the central portion a of the lens is in the range of 0 to 25 °, whereas the incident angle of the light ray on the peripheral portion b of the lens is 20 ° to 20 °.
It became 40 °. In order to have an effect of preventing reflection (reflectance of 0.3% or less) with respect to light rays in these incident angle ranges, it is necessary to set the film thickness constitution of three layers as shown in Table 1. Table 1 shows the film thickness constitutions of the respective antireflection films in a at the center of the lens and b at the peripheral of the lens. At this time, the reflectance angle characteristic, that is, the lens central portion a and the lens peripheral portion b
FIG. 7 shows the reflectance angle characteristics of the optical thin film with respect to the light rays in FIG.
Shown in.

[0041]

[Table 1]

At each position on the lens substrate, the optical thin film forming apparatus 10 shown in FIG. 2 is used in order to realize the film structure shown in Table 1. As shown in Table 1, the film thicknesses of the first and third layers of MgF ₂ are the same in both the central part and the peripheral part of the lens, so the evaporation amounts of the evaporation sources 16a to 16c are the same. Regarding the film thickness of LaF ₃ of the second layer, the film thickness in the lens peripheral portion is about 1.1 times that in the lens central portion. In order to realize this film thickness difference, the evaporation amount from the evaporation sources 16b and 16c is set to 1.45 times the evaporation amount from the evaporation source 16a. As a result, as shown in FIG. 8, the film thickness in the lens peripheral portion can be made 1.1 times the film thickness in the lens central portion. In FIG. 8, the contribution rate of the evaporation source 16a to the film formation at each position on the lens substrate is RH1, and the evaporation source 16 is
The contribution rate of b and 16c to the film formation at each position on the lens substrate is indicated by RH2.

In this lens, the reflectance at the center of the lens is 0.3% with respect to a light ray having an incident angle in the range of 0 to 35 °.
The characteristics are as follows, and the incident angle is 10 to 40 at the periphery of the lens.
The reflectance for light rays in the range of ° is 0.3% or less. Table 2 shows the design optical characteristics at the points a and b (see FIG. 11) on the lens 1 and the optical performances of the optical thin films in the present embodiment and the prior art.

[0044]

[Table 2]

By using the optical thin film forming apparatus shown in FIG. 2, the first to third layers can be continuously formed, and by controlling the film thickness distribution for each layer, the lens substrate can be formed. It is possible to realize desired optical characteristics at all the positions.

The incident angle of the light ray at the position between the lens center a and the lens periphery b (horizontal distance 117.5 mm from a) gradually changes from the angular range of a to the angular range of b, and gradually approaches from a to b. Shift to. Further, as shown in this embodiment, the film thickness gradually changes. As a result, at any position on the lens substrate, a thin film having an antireflection effect with respect to the incident angle of the light beam can be formed.

Since the lens described in this embodiment has the optical thin film in consideration of the incident angle of the light beam which differs depending on the position on the lens substrate, the optical thin film has the performance as designed, and the optical device Optical performance can be achieved as designed.

[0048]

According to the optical component of the present invention, by making the film thickness distribution of at least one layer among the layers constituting the optical thin film different from the film thickness distribution of the other layers, all of the layers on the lens substrate can be obtained. The optical characteristics of the optical thin film at the position of can be made uniform. Further, the optical characteristics at all positions on the lens substrate where the incident angles of the light rays are different can be made uniform in consideration of the incident angles of the light rays. Furthermore, even when using vacuum ultraviolet rays as the exposure light,
The optical characteristics at all positions on the lens substrate can be made uniform in consideration of the incident angle of light rays.

According to the projection exposure apparatus of the present invention,
Since the optical component of the present invention is included in the projection optical system or the illumination optical system, vacuum ultraviolet rays as the exposure light from the light source can be efficiently guided onto the substrate.

[Brief description of drawings]

FIG. 1 is a diagram for explaining an optical component according to an embodiment of the present invention.

FIG. 2 is a schematic configuration diagram of an optical thin film deposition apparatus for manufacturing an optical component according to an embodiment of the present invention.

FIG. 3 is a configuration diagram of a substrate holder of the optical thin film forming apparatus according to the embodiment of the present invention.

FIG. 4 is a configuration diagram of a diaphragm plate of an optical thin film forming apparatus according to an embodiment of the present invention.

FIG. 5 is a configuration diagram of an evaporation source of the optical thin film forming apparatus according to the embodiment of the present invention.

FIG. 6 is a basic configuration diagram of an exposure apparatus according to an embodiment of the present invention.

FIG. 7 is a diagram showing reflectance angle characteristics at the center and the periphery of the lens of the optical component according to the example of the present invention.

FIG. 8 is a diagram showing a film thickness distribution of an optical component according to an example of the present invention.

FIG. 9 is a configuration diagram of a conventional optical thin film deposition apparatus.

FIG. 10 is a diagram showing a film thickness distribution of a conventional optical component.

FIG. 11 is a diagram for explaining a position of a lens and an incident angle of a light ray.

[Explanation of symbols]

2 ... Lens substrate, 4 ... Optical thin film, 10 ... Optical thin film deposition apparatus, 12 ... Vacuum chamber, 14 ... Substrate holder, 16 ... Evaporation source, 18 ... Aperture plate, 90, 92 ... Optical lens, 100
... light source, 101 ... illumination optical system, 500 ... projection optical system, R
… Mask, W… Substrate.

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 2H048 GA07 GA11 GA33 GA51 GA60                       GA61                 2K009 AA01 AA06 BB02 CC06 DD03                       DD09                 5F046 BA04 BA05 CA04 CB12 CB23                       CB25

Claims (7)

[Claims] 1. An optical component having an optical thin film made of a multilayer film on a lens substrate, wherein each layer forming the optical thin film has a concentric film thickness distribution depending on a distance from the center of the lens substrate. An optical component, wherein the film thickness distribution of at least one layer constituting each of the layers is different from the film thickness distribution of other layers. 2. The film thickness of the at least one layer in the peripheral portion of the lens substrate is made thicker than the film thicknesses of other layers in accordance with the incident angle of the light beam to the lens substrate. The optical component according to claim 1. 3. The respective layers forming the optical thin film are formed of a fluoride thin film.
Alternatively, the optical component according to claim 2. 4. An optical component in which the thickness distribution of a film formed on a convex lens substrate is concentric with the optical axis of the lens substrate as a center, and in at least one layer formed in the multiple layers. The optical component, wherein the ratio (a / b) of the film thickness (a) in the central part to the film thickness (b) in the peripheral part is less than 1. 5. An optical component in which the thickness distribution of a film formed on a concave lens substrate is concentric with the optical axis of the lens substrate as a center, and in at least one layer formed in the multiple layers. The optical component, wherein the ratio (b / a) of the film thickness (a) in the central part to the film thickness (b) in the peripheral part is less than 1. 6. A projection exposure apparatus for projecting a pattern image of a mask onto a substrate using a projection optical system, the illumination optical system illuminating the mask using vacuum ultraviolet rays as exposure light. 6. A projection exposure system including the optical component according to any one of 5 to form a pattern image of the mask on a substrate. 7. A projection exposure apparatus for projecting a pattern image of a mask onto a substrate using a projection optical system, the vacuum exposure apparatus including the optical component according to any one of claims 3 to 5. A projection exposure apparatus comprising: an illumination optical system for illuminating a mask with the exposure light as an exposure light; and a projection optical system for forming a pattern image of the mask on a substrate.