JP2003007580A - Thermoregulating air supply device and semiconductor manufacturing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize highly precise device manufacturing and enable space saving of an apparatus. SOLUTION: A chamber 1 wherein an aligner body 2 is disposed inside and an air conditioner chamber 10 for performing air conditioning for the chamber 1 are provided. A cooler 11 and heaters 12, 12B, 12W, 12R for thermoregulating the temperature of air to be supplied and chemical filters 14A, 14B and dust removing filters 15, 15W, 15R for cleaning air to be supplied are provided. Thermoregulating air supply parts 16W, 16R for supplying cleaned thermoregulating air to a wafer stage space 4 and a reticle stage space 5 of the aligner body 2 are disposed. The dust removing filters 15W, 15R are disposed in the middle of an air supply path of the air conditioner chamber 10 separated from an air blow-off surface of the thermoregulating air supply parts 16W, 16R.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature controlled air supply apparatus and a semiconductor manufacturing apparatus, and belongs to the technical field of a semiconductor manufacturing system which is preferably used mainly for manufacturing semiconductor devices.

[0002]

2. Description of the Related Art In a manufacturing process of a semiconductor device such as an IC, an LSI, a liquid crystal panel, a substrate (semiconductor wafer substrate or glass substrate) is subjected to a lot of processing. Among them, an exposure process for pattern printing is a semiconductor. This is an important process that is the key to manufacturing. An exposure apparatus (stepper or scanner) is known as an apparatus that performs this process.

The resist applied to the wafer is subjected to a baking process (PEB) in which a polymer film that causes a chemical reaction efficiently when exposed to ionizing radiation (ultraviolet rays, X-rays, electron beams, etc.) and a catalyst (acid) is generated by exposure. By the above, it can be roughly classified into chemically amplified resists in which image formation is performed by a catalyst. The chemically amplified resist is easily formed into a high sensitivity because of image formation using a catalyst, and has been generally used in recent years as a resist for excimer laser light in which it is difficult to obtain illuminance. On the other hand, the catalyst generated by exposure diffuses in the air or on the wafer surface, and the baking process (PEB) accelerates the catalyst work and deteriorates the image profile. It is necessary to control chemical contamination with basic gases such as amines and amides in an environmental atmosphere that goes through a baking process (PEB).

On the other hand, various optical members such as a lens and a mirror are used in the exposure apparatus, including an illumination optical system for irradiating the reticle surface with light emitted from a light source. Along with the shortening of the exposure wavelength, there is a problem that the optical member that transmits and irradiates the exposure light is fogged and the exposure amount reaching the wafer surface is reduced. This cloudy material is an organic compound or ammonium sulfate (NH ₄ ) ₂ SO ₄ , and the cause is ammonium ion (NH ₄ ) ⁺ or sulfate ion (SO ₄ ²⁻ ) present in the air or their compounds, or organic It is considered that the gas is attached to the optical member in a photochemical reaction by the irradiation of the exposure light.

To solve the problems of surface insolubility of chemically amplified resists and fogging of optical members, an impurity gas removing filter is mounted in an environmental chamber for controlling temperature, humidity or dust in the ambient environment surrounding the exposure apparatus main body, It has been conventionally performed to remove substances such as basic gas, sulfuric acid gas, and organic compound gas existing in this atmosphere.

As the impurity gas removing filter, for example, a chemical filter using ion exchange fibers, an activated carbon filter using activated carbon particles or activated carbon fibers, and a chemical filter in which an acidic substance or an alkaline substance is impregnated on these activated carbons are used. It is used, but it is desirable to select the optimum filter in consideration of the type of gas to be removed and the characteristics of the filter. When removing multiple types of gas,
In some cases, the optimum filters for each gas are used in combination.

FIG. 3 is a block diagram of a semiconductor manufacturing apparatus according to a conventional example. In this semiconductor manufacturing apparatus, an exposure apparatus main body 2 is arranged in a chamber 1. This chamber 1 is mainly provided with an air conditioner room 10 for adjusting the temperature of air, a filter box 20 for filtering fine foreign matters to form a uniform flow of clean air, and a booth 30 for shutting off the environment of the apparatus from the outside. There is. In the air conditioner room 10, a temperature controller 8, a cooler 11, a base heater 12, and reheat heaters 12B and 12 are provided.
W, 12R, blower 13, and chemical filter 14A for circulation and chemical filter 14B for outside air inlet 18
Are arranged.

A dust filter 15 is arranged in the filter box 20. In the booth 30, the wafer stage space 4 and the reticle stage space 5 of the exposure apparatus main body 2, temperature control air supply units 16W and 16R for supplying temperature control air to these, dust removal filters 15W and 15R,
In addition, the supply air duct 7 and the like are arranged, and the temperature sensors 9, 9W, 9R are also arranged. In the figure, 17 is a return port for circulating the air in the chamber 1.

In a general environment chamber, a dust filter (ULPA or the like) is provided on the ceiling, and the inside of the chamber 1 is downflowed. Further, an interferometer is used for accurate positioning and drive control of a stage, which is a photosensitive substrate such as a wafer and a reticle. This interferometer detects position information by utilizing an interference phenomenon of laser light emitted from a laser light source mounted for the interferometer. However, since the wavelength of the laser light changes due to the temperature change, the interferometer laser optical path and the stage spaces 4 and 5 must be kept at a uniform temperature in order to perform accurate stage position control. Therefore, temperature control air supply units 16W and 16R for supplying temperature-controlled air to the stage spaces 4 and 5 are arranged near the stage spaces 4 and 5. Further, dust removal filters 15W and 15R are mounted on the temperature control air supply units 16W and 16R. In general, the dust removal filters 15W and 15R are arranged at the most downstream portion of the air supply path at the place where high-precision temperature control is required. The reason is that it is possible to remove dust that enters from the air supply path, and to make the wind velocity distribution on the blowing surface uniform due to the laminar flow effect of the filter medium.

[0010]

With the recent increase in wafer size and miniaturization of exposure patterns, it is required to control the temperature of the stage spaces 4 and 5 in a more uniform and stable state than ever before. However, as the wafer size increases, the stage spaces 4 and 5 expand, and it has become difficult to control the temperature of the entire stage space with higher accuracy than ever before. In order to solve this, it is necessary to increase the supply amount of temperature-controlled air and expand the blowing area. The problem here is that the temperature control air supply units 16W and 16R become large in size. Due to the increase in size, the temperature distribution in the temperature control air supply units 16W and 16R becomes large, which deteriorates the temperature stability of the stage spaces 4 and 5. In addition, the size of the exposure apparatus is increased by disposing a number of large-sized temperature control air supply units in the exposure apparatus main body 2. If you forcefully reduce the size of the exposure device in this state,
The degree of freedom in design is lost, and optimal placement of each unit cannot be performed. As a result, the length of the piping tube and the communication cable is lengthened, and the influence of fluid pressure loss and electric noise increases, which may affect the device performance. Further, by disposing a number of filters, which are long-life parts, in the exposure apparatus main body 2, there are problems that the running cost increases and the workability during maintenance deteriorates.

The present invention has been made to solve the above-mentioned problems of the prior art, and is equipped with a small temperature control air supply section for each filter which controls the temperature of the entire stage space uniformly and stably. Therefore, it is an object of the present invention to provide a temperature-controlled air supply device and a semiconductor manufacturing device that enable more accurate device manufacturing and space saving of the device size than ever before.

[0012]

In order to achieve this object, the present invention provides a temperature controlled air supply apparatus including a chamber in which a temperature control target is placed and an air conditioner room for air conditioning the chamber. , A cooler and a heater for controlling the temperature of the supplied air, a chemical filter and a dust filter for cleaning the supplied air, and the temperature-controlled air for supplying the cleaned temperature-controlled air to the temperature control target It is characterized in that a supply unit is arranged.

Further, in the present invention, it is desirable to dispose the dust filter in the middle of an air supply path, separated from the air blowing surface of the temperature control air supply section, and to supply the temperature control air from the dust filter. It is desirable to connect the path to the part with a highly airtight supply air duct where dust does not enter, it is preferable to provide a fluorine gasket at the connection part of the high airtight supply air duct, and the temperature control air supply part When there are a plurality of the dust removal filters separated from the air blowing surface, it is preferable to arrange them all together, and a rectifying device for making the wind velocity distribution uniform is provided on the air blowing surface of the temperature control air supply unit. The rectifying device may be a honeycomb-shaped rectifying plate.

With the above structure, it is possible to improve the alignment performance by improving the measurement accuracy of the interferometer and save the apparatus space. Further, the running cost is reduced and maintenance workability is improved by reducing the number of filters.

The present invention can also be applied to a semiconductor manufacturing apparatus that includes any one of the temperature control air supply devices described above and that has an exposure apparatus main body disposed inside the chamber as the temperature control target.

According to the present invention, a step of installing a manufacturing apparatus group for various processes including the semiconductor manufacturing apparatus in a semiconductor manufacturing factory, and a step of manufacturing a semiconductor device by a plurality of processes using the manufacturing apparatus group are included. It is also applicable to a semiconductor device manufacturing method having The method further includes the steps of connecting the manufacturing apparatus group with a local area network, and performing data communication between the local area network and an external network outside the semiconductor manufacturing factory for information regarding at least one of the manufacturing apparatus group. It is desirable to have. A database provided by a vendor or a user of the semiconductor manufacturing apparatus is accessed through the external network to obtain maintenance information of the manufacturing apparatus by data communication, or between a semiconductor manufacturing factory different from the semiconductor manufacturing factory. It is preferable to manage the production by data communication via the external network.

Further, according to the present invention, a group of manufacturing apparatuses for various processes including the above semiconductor manufacturing apparatus, a local area network for connecting the group of manufacturing apparatuses, and an external network outside the factory can be accessed from the local area network. The present invention can also be applied to a semiconductor manufacturing factory having a gateway that enables data communication of information regarding at least one of the manufacturing apparatus group.

Further, the present invention is a method for maintaining the semiconductor manufacturing apparatus installed in a semiconductor manufacturing factory, wherein a vendor or a user of the semiconductor manufacturing apparatus stores a maintenance database connected to an external network of the semiconductor manufacturing factory. A step of providing, a step of permitting access to the maintenance database from the semiconductor manufacturing factory via the external network, and maintenance information accumulated in the maintenance database to the semiconductor manufacturing factory side via the external network. It is also applicable to a maintenance method of a semiconductor manufacturing apparatus having a step of transmitting.

Further, the semiconductor manufacturing apparatus according to the present invention is
It may be characterized in that it further has a display, a network interface, and a computer that executes software for the network, and enables data communication of maintenance information of the semiconductor manufacturing apparatus via a computer network. The network software is connected to an external network of a factory in which the semiconductor manufacturing apparatus is installed, and provides a user interface on the display for accessing a maintenance database provided by a vendor or a user of the semiconductor manufacturing apparatus. It is preferable to be able to obtain information from the database via an external network.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment of Semiconductor Manufacturing Apparatus Equipped with Temperature Controlled Air Supply Device) FIG. 1 shows the configuration of a semiconductor manufacturing apparatus including a temperature controlled air supply device and an exposure apparatus (scanner) according to an embodiment of the present invention. It is a figure. This semiconductor manufacturing equipment
The chamber 1 is used for air conditioning of the exposure apparatus main body 2. This chamber 1 is mainly provided with an air conditioner room 10 for adjusting the temperature of air, a filter box 20 for filtering fine foreign matters to form a uniform flow of clean air, and a booth 30 for shutting off the environment of the apparatus from the outside. Has been done.

In the air conditioner room 10, a temperature controller 8, a cooler 11, a base heater 12, a reheat heater 12B for a booth, a reheat heater 12W for a wafer stage, a reheat heater 12R for a reticle stage, and a blower. 13, a chemical filter 14A, 14B, a dust removal filter 15W for the wafer stage, a dust removal filter 15R for the reticle stage, and the like are arranged.

A dust removing filter 15 is arranged in the filter box 20. In the booth 30, the wafer stage space 4 and the reticle stage space 5 of the exposure apparatus main body 2, temperature control air supply units 16W and 16R for supplying temperature control air to these, rectifiers 19W and 19R, and high airtightness Supply air ducts 7W, 7R and the like are arranged, and temperature sensors 9, 9W, 9R are arranged.

In the chamber 1, the temperature of the air 25A flowing from the return port 17 is adjusted by the cooler 11 and the base heater 12 in the air conditioner room 10, and the temperature-adjusted air 25B is supplied by the blower 13 to the chemical filter 1.
Clean air 25C passes through 4A and reheat heater 12
The air 25D whose temperature is strictly adjusted in B is supplied to the booth 30 as the dust removal air 25E via the dust removal filter 15. The air supplied to the booth 30 is again taken into the air conditioner room 10 as the air 25A from the return port 17 and circulates in the chamber 1. Normally, this chamber 1 is not a complete circulation system in a strict sense, and in order to keep the inside of the booth 30 at a positive pressure at all times, about 10% of the circulating air amount of outside air 25 corresponding to the air inside the booth is supplied to the air conditioner room 10. Outside air inlet 18 provided in
By the external air inlet chemical filter 14B and the blower 1
Introduced through 3.

The reason why the booth 30 is kept at a positive pressure is the booth 3
This is to prevent minute foreign matter from entering the booth 30 from the outside of the booth 30 through the minute gap at 0.

In the wafer stage space 4, the temperature is strictly controlled by a dedicated reheat heater 12W and a dust removal filter 15W is provided.
Temperature control air supply unit 16 for supplying 25 W of air removed by
W is arranged near the stage space. The dust filter 15 is attached to the temperature-controlled air supply unit 16W in the exposure apparatus main body 2.
There is no W, and only the rectifying device 19W for equalizing the wind speed distribution on the blowing surface is mounted on the air blowing surface.

Similarly, the reticle stage space 5 is also dust-removed by a dedicated dust-removal filter 15R and the reheat heater 12R.
The temperature control air supply unit 16R for supplying the air 25R whose temperature is strictly controlled is arranged in the vicinity of the stage space, and the temperature control air supply unit 16R in the exposure apparatus main body 2 does not have the dust filter 15R. Only the rectifying device 19R for equalizing the wind velocity distribution on the air blowing surface is mounted on the air blowing surface.

The dust removing filters 15W and 15R separated from the temperature control air supply units 16W and 16R are arranged in the air conditioner room 10 in the air supply path, and dust may enter from the air supply path. Clean air whose temperature is controlled is sent to the temperature-controlled air supply units 16W and 16R through the airtight supply air ducts 7W and 7R that are not provided.

The temperature control of the air is performed by the temperature controller 8 in the air conditioner room 10. Temperature controller 8
Is the temperature information of the air 25W for the wafer stage space 4 detected by the temperature sensors 9W and 9R arranged near the rectifiers 19W and 19R, the temperature information of the air 25R for the reticle stage space 5, and the dust removal filter 1.
5, the temperature information of the air 25E for the booth 30 detected by the temperature sensor 9 arranged in the vicinity of 5 is received, and the wafer stage reheat heater 12W and the reticle stage reheat heater 12R are controlled to perform temperature control. .

On the other hand, FIG. 2 shows the dust filter 15W, 1
It is a block diagram of a semiconductor manufacturing apparatus including a temperature control air supply device and an exposure device (scanner) when 5Rs are collectively arranged. 2, the same elements as those in FIG. 1 are designated by the same reference numerals. In this case, since the temperature of the wafer stage space 4 and the temperature of the reticle stage space 5 are individually controlled, the dust removal filters 15W, 15R are connected to the reheat heater 12W,
It is arranged on the upstream side of 12R, and reheat heaters 12W, 1
It is necessary to branch the routes after 2R and perform adiabatic treatment.

Here, as the rectifying devices 19W and 19R, for example, a rectifying plate having a honeycomb shape can be considered.

Further, highly airtight supply air ducts 7W, 7R
For example, a highly airtight duct having a fluorine gasket such as Teflon (registered trademark) at the connecting portion can be considered.

(Embodiment of Semiconductor Production System) Next,
Semiconductor devices (ICs and LSs) using the apparatus according to the present invention
An example of a production system of a semiconductor chip such as I, a liquid crystal panel, a CCD, a thin film magnetic head, a micromachine, etc. will be described. This is to perform maintenance services such as troubleshooting of a manufacturing apparatus installed in a semiconductor manufacturing factory, periodic maintenance, or software provision using a computer network outside the manufacturing factory.

FIG. 4 shows the entire system cut out from a certain angle. In the figure, 101 is a business office of a vendor (apparatus supplier) that provides a semiconductor device manufacturing apparatus. As an example of the manufacturing apparatus, a semiconductor manufacturing apparatus for various processes used in a semiconductor manufacturing factory, for example,
Pre-process equipment (lithography equipment such as exposure equipment, resist processing equipment, etching equipment, heat treatment equipment, film forming equipment,
Flattening equipment, etc.) and post-process equipment (assembling equipment, inspection equipment, etc.) are assumed. In the business office 101, a host management system 10 that provides a maintenance database for manufacturing equipment is provided.
8, a plurality of operation terminal computers 110, and a local area network (LAN) 109 that connects these to construct an intranet or the like. Host management system 1
08 is provided with a gateway for connecting the LAN 109 to the Internet 105, which is an external network of the office, and a security function for restricting access from the outside.

On the other hand, 102 to 104 are manufacturing factories of semiconductor manufacturers as users of manufacturing equipment. The manufacturing factories 102 to 104 may be factories belonging to different manufacturers or may be factories belonging to the same manufacturer (for example, a factory for pre-process, a factory for post-process, etc.). In each of the factories 102 to 104, a plurality of manufacturing apparatuses 106, a local area network (LAN) 111 that connects them to construct an intranet, and a host as a monitoring apparatus that monitors the operating status of each manufacturing apparatus 106 are provided. A management system 107 is provided. Each factory 1
02-104 host management system 107
Is equipped with a gateway for connecting the LAN 111 in each factory to the Internet 105, which is an external network of the factory. 0 This allows the LAN 111 of each factory to access the host management system 108 on the side of the business office 101 of the vendor via the Internet 105. The security function of the host management system 108 allows access to only limited users. Specifically, each manufacturing apparatus 1 is connected via the Internet 105.
In addition to notifying status information indicating the operating status of 06 (for example, a symptom of a manufacturing apparatus in which a trouble has occurred) from the factory side to the vendor side, response information corresponding to the notification (for example, information instructing a troubleshooting method, You can receive maintenance information such as software (data and data for handling), the latest software, and help information from the vendor side. A communication protocol (TCP / IP) generally used on the Internet is used for data communication between each of the factories 102 to 104 and the vendor's office 101 and data communication via the LAN 111 in each factory. . In addition,
Instead of using the Internet as an external network outside the factory, it is possible to use a leased line network (ISDN or the like) having high security without being accessed by a third party. Further, the host management system is not limited to one provided by a vendor, and a user may construct a database and place it on an external network to permit access from a plurality of factories of the user to the database.

Now, FIG. 5 is a conceptual diagram showing the entire system of this embodiment cut out from an angle different from that shown in FIG. In the above example, a plurality of user factories each equipped with a manufacturing apparatus and a management system of a vendor of the manufacturing apparatus are connected by an external network, and production management of each factory or at least one unit is performed via the external network. The information of the manufacturing apparatus was data-communicated. On the other hand, in this example, a factory equipped with manufacturing equipment of a plurality of vendors and a management system of each vendor of the plurality of manufacturing equipments are connected by an external network outside the factory, and maintenance information of each manufacturing equipment is displayed. It is for data communication. In the figure, reference numeral 201 denotes a manufacturing plant of a manufacturing apparatus user (semiconductor device manufacturing maker), and a manufacturing apparatus for performing various processes is installed on a manufacturing line of the factory.
The film forming processing device 204 is introduced. Although only one manufacturing factory 201 is shown in FIG. 5, a plurality of factories are actually networked in the same manner. Each device in the factory is connected by LAN 206 to form an intranet,
The host management system 205 manages the operation of the manufacturing line.

On the other hand, each business office of a vendor (apparatus supply manufacturer) such as an exposure apparatus maker 210, a resist processing apparatus maker 220, a film forming apparatus maker 230, etc., has a host management system 21 for remote maintenance of the supplied apparatus.
1, 221, 231, which are provided with the maintenance database and the gateway of the external network as described above. A host management system 205 that manages each device in the user's manufacturing plant, and a vendor management system 2 for each device
11, 221, and 231 are connected to each other via the external network 200 such as the Internet or a dedicated line network. In this system, when trouble occurs in any of the series of production equipment on the production line,
Although the operation of the manufacturing line is suspended, it is possible to quickly respond by receiving remote maintenance via the Internet 200 from the vendor of the device in which the trouble has occurred, and the suspension of the manufacturing line can be minimized. .

Each manufacturing apparatus installed in the semiconductor manufacturing factory is provided with a display, a network interface, and a computer for executing the network access software and the apparatus operating software stored in the storage device. The storage device is a built-in memory, a hard disk, or a network file server. The network access software includes a dedicated or general-purpose web browser, and provides a user interface having a screen, an example of which is shown in FIG. 6, on the display. The operator who manages the manufacturing equipment at each factory refers to the screen and refers to the manufacturing equipment model 401, serial number 402, and subject 40 of the trouble.
3. Input information such as date of occurrence 404, urgency 405, symptom 406, coping method 407, and progress 408 in input items on the screen. The input information is transmitted to the maintenance database via the Internet, and the appropriate maintenance information as a result is returned from the maintenance database and presented on the display. In addition, the user interface provided by the web browser further has hyperlink functions 410 to 4 as shown in the figure.
12 enables operators to access more detailed information on each item, pull out the latest version of software used for manufacturing equipment from the software library provided by the vendor, and use the operation guide (help Information) can be withdrawn. Here, the maintenance information provided by the maintenance database includes the information about the present invention described above, and the software library also provides the latest software for implementing the present invention.

Next, a semiconductor device manufacturing process using the above-described production system will be described. FIG. 7 shows a flow of the whole manufacturing process of the semiconductor device. In step 1 (circuit design), the circuit of the semiconductor device is designed. In step 2 (mask manufacturing), a mask having the designed circuit pattern is manufactured. On the other hand, step 3
In (wafer manufacture), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by the lithography technique using the mask and the wafer prepared above. The next step 5 (assembly) is called a post-process, which is a process of forming a semiconductor chip using the wafer manufactured in step 4, and includes an assembly process (dicing, bonding), a packaging process (chip encapsulation), and the like. Including steps. In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test. A semiconductor device is completed through these processes and shipped (step 7). The front-end process and the back-end process are performed in separate dedicated factories, and maintenance is performed for each of these factories by the remote maintenance system described above. Information for production management and device maintenance is also data-communicated between the front-end factory and the back-end factory via the Internet or the leased line network.

FIG. 8 shows a detailed flow of the wafer process. In step 11 (oxidation), the surface of the wafer is oxidized. In step 12 (CVD), an insulating film is formed on the wafer surface. In step 13 (electrode formation), electrodes are formed on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted in the wafer. Step 15
In (resist processing), a photosensitive agent is applied to the wafer. In step 16 (exposure), the circuit pattern of the mask is printed and exposed on the wafer by the exposure apparatus described above. In step 17 (development), the exposed wafer is developed. In step 18 (etching), parts other than the developed resist image are removed. In step 19 (resist stripping), the resist that is no longer needed after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. Since the manufacturing equipment used in each process is maintained by the remote maintenance system described above, troubles can be prevented in advance, and even if troubles occur, quick recovery is possible, and semiconductor devices can be compared to conventional devices. Productivity can be improved.

[0040]

As described above, the dust filter is arranged separately from the temperature control air supply section, and the small temperature control air supply section having the rectifying device mounted on the air blowing surface is arranged to control the temperature control air. Since the temperature distribution in the supply section becomes small, highly accurate temperature control becomes possible. Further, each unit can be optimally arranged, and the device performance can be improved and the device size can be saved. Furthermore, by arranging the filters of each temperature control air supply device together and sharing them,
The number of filters used can be reduced, leading to a reduction in running costs and improved workability during maintenance.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a semiconductor manufacturing apparatus including a temperature-controlled air supply device according to an embodiment of the present invention.

FIG. 2 is a configuration diagram of a semiconductor manufacturing apparatus including a temperature controlled air supply device according to another embodiment of the present invention.

FIG. 3 is a configuration diagram of a semiconductor manufacturing apparatus including a temperature controlled air supply device according to a conventional example.

FIG. 4 is a conceptual view of a semiconductor device production system using the apparatus according to the present invention viewed from an angle.

FIG. 5 is a conceptual view of a semiconductor device production system using the apparatus according to the present invention viewed from another angle.

FIG. 6 is a specific example of a user interface.

FIG. 7 is a diagram illustrating a flow of a device manufacturing process.

FIG. 8 is a diagram illustrating a wafer process.

[Explanation of symbols]

1: chamber, 2: exposure apparatus main body, 4: wafer stage space, 5: reticle stage space, 7W, 7R: highly airtight supply air duct, 8: temperature controller, 9, 9W,
9R: temperature sensor, 10: air conditioner room, 11: cooler, 1
2: base heater, 12B: reheat heater (for booth),
12W: Reheat heater (for wafer stage), 12R: Reheat heater (for reticle stage), 13: Blower, 14
A: Chemical filter (for circulation), 14B: Chemical filter (for outside air inlet), 15: Dust filter, 15
W: Dust filter (for wafer stage), 15R: Dust filter (for reticle stage), 16W: Temperature control air supply unit (for wafer stage), 16R: Temperature control air supply unit (for reticle stage), 17: Return port , 18: outside air inlet port, 19W: rectifying device (for wafer stage), 1
9R: Rectifier (for reticle stage), 20: Filter box, 25 (25A to 25E): Air, 30: Booth, 101: Vendor's office, 102, 103, 10
4: Manufacturing factory, 105: Internet, 106: Manufacturing apparatus, 107: Factory host management system, 108: Vendor side host management system, 109: Vendor side local area network (LAN), 110: Operating terminal computer, 111 : Factory local area network (LAN), 200: External network, 201:
Manufacturing apparatus Manufacturing factory of user, 202: Exposure apparatus, 20
3: resist processing device, 204: film forming processing device, 20
5: Factory host management system, 206: Factory local area network (LAN), 210: Exposure apparatus manufacturer, 211: Host management system of business office of exposure apparatus manufacturer, 220: Resist processing apparatus manufacturer, 221: Resist processing apparatus Host management system of maker's office,
230: film forming apparatus maker, 231: host management system of film forming apparatus maker's office, 401: manufacturing apparatus model,
402: serial number, 403: subject of trouble,
404: Date of occurrence, 405: Urgency, 406: Symptom, 40
7: Remedy, 408: Progress, 410, 411, 412:
Hyperlink function.

Claims (15)

[Claims] 1. A cooler and a heater for controlling the temperature of air to be supplied in a temperature-controlled air supply device comprising a chamber in which a temperature control target is arranged and an air conditioner room for air conditioning the chamber. A temperature-controlled air supply device having a chemical filter and a dust filter for cleaning the supplied air, and arranging a temperature-controlled air supply unit for supplying the cleaned temperature-controlled air to the temperature control target. . 2. The temperature controlled air supply device according to claim 1, wherein the dust removal filter is arranged in the middle of an air supply path, separated from the air blowing surface of the temperature controlled air supply unit. 3. The temperature control air according to claim 1, wherein a path from the dust removal filter to the temperature control air supply unit is connected by a highly airtight supply air duct that prevents dust from entering. Supply device. 4. A fluorine gasket is provided at a connection portion of the highly airtight supply air duct.
The temperature-controlled air supply device described in. 5. When there are a plurality of the dust removal filters separated from the air blowing surface of the temperature control air supply unit, they are collectively arranged as one.
The temperature-controlled air supply device according to any one of 4 above. 6. The temperature-controlled air supply device according to claim 1, wherein a rectifying device for making the wind velocity distribution uniform is mounted on the air blowing surface of the temperature-controlled air supply unit. . 7. The temperature-controlled air supply device according to claim 6, wherein the rectifying device is a rectifying plate having a honeycomb shape. 8. A semiconductor manufacturing apparatus comprising the temperature-controlled air supply device according to claim 1, further comprising an exposure apparatus main body arranged inside the chamber as the temperature control target. . 9. A step of installing a manufacturing apparatus group for various processes including the semiconductor manufacturing apparatus according to claim 8 in a semiconductor manufacturing factory, and a step of manufacturing a semiconductor device by a plurality of processes using the manufacturing apparatus group. And a method for manufacturing a semiconductor device. 10. A process of connecting the manufacturing device group with a local area network, and data communication of information about at least one of the manufacturing device group between the local area network and an external network outside the semiconductor manufacturing factory. The method for manufacturing a semiconductor device according to claim 9, further comprising: 11. A database provided by a vendor or a user of the semiconductor manufacturing apparatus is accessed through the external network to obtain maintenance information of the manufacturing apparatus by data communication, or a semiconductor manufacturing different from the semiconductor manufacturing factory. 11. The semiconductor device manufacturing method according to claim 10, wherein production management is performed by data communication with a factory via the external network. 12. A manufacturing apparatus group for various processes including the semiconductor manufacturing apparatus according to claim 8, a local area network connecting the manufacturing apparatus group, and an external network outside the factory accessible from the local area network. A semiconductor manufacturing factory, comprising a gateway for enabling data communication of information regarding at least one of the manufacturing apparatus group. 13. The semiconductor device manufacturing plant according to claim 8, wherein the semiconductor manufacturing plant is installed.
The method for maintaining a semiconductor manufacturing apparatus according to claim 1, wherein a vendor or a user of the semiconductor manufacturing apparatus provides a maintenance database connected to an external network of a semiconductor manufacturing factory, and the external network is provided from within the semiconductor manufacturing factory. A semiconductor manufacturing apparatus comprising: a step of permitting access to the maintenance database via a network; and a step of transmitting maintenance information accumulated in the maintenance database to a semiconductor manufacturing factory side via the external network. Maintenance method. 14. The semiconductor manufacturing apparatus according to claim 8, further comprising a display, a network interface, and a computer executing network software, and data communication of maintenance information of the semiconductor manufacturing apparatus via a computer network. A semiconductor manufacturing apparatus characterized in that it has been made possible. 15. The network software comprises:
A user interface for accessing a maintenance database provided by a vendor or a user of the semiconductor manufacturing apparatus connected to an external network of a factory in which the semiconductor manufacturing apparatus is installed is provided on the display, and the user interface is provided via the external network. 15. The semiconductor manufacturing apparatus according to claim 14, wherein information can be obtained from a database.