JP2007170813A - Clean unit-process unit merged system, clean unit system, clean unit, connected clean units, portable clean unit, and process method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a clean unit-process unit merged system capable of inexpensively and easily carrying out not only moisture removal and oxidation prevention, but also dust proofing and dust removal in a load lock used in putting in and out of samples, and easily applicable to a series of production process lines, in regard to a process unit such as a vacuum device or a film growing device. <P>SOLUTION: The clean unit-process unit merged system is composed by connecting the process unit 1 and the clean unit 10 capable of maintaining a clean environment. The process unit 1 is a vacuum device such as a vapor deposition device, a molecular beam epitaxial device, or an ion beam spatter device, or a film growing device, a surface treatment device or the like such as an organic metal vapor phase growing device, a liquid phase epitaxial device or the like. The clean unit 10 maintains a clean environment by a circulation type filter composed of an active dust filter 16 and a circulation duct 15. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a clean unit-process device fusion system, a clean unit system, a clean unit, a connected clean unit, a portable clean unit, and a process method, and in particular, to realize a clean air (air) environment free from dust and chemical substances. It is suitable for application.

  Conventional vapor deposition equipment, molecular beam epitaxy (MBE) equipment, ion beam sputtering (IBS) equipment and other vacuum equipment, metal organic chemical vapor deposition (MOCVD) equipment, thin film growth equipment such as liquid phase epitaxy (LPE) equipment, etc. In the process equipment, the load lock used for loading and unloading the sample when the atmosphere is opened has taken only measures for removing moisture and preventing oxidation. However, there is a possibility that contaminants such as carbon adhere to the surface of the element manufactured by these process apparatuses. Since the size of the contaminants ranges from approximately 1 nm to 100 nm, it greatly affects the progress of device miniaturization represented by the Moore's Law of LSI. In other words, in the progress of device miniaturization, not only measures for removing moisture and preventing oxidation in a load lock, but also removal of contaminants must be the key. However, vacuum devices such as vapor deposition equipment, molecular beam epitaxial equipment, ion beam sputtering equipment, thin film growth equipment such as metal organic vapor phase epitaxy equipment, liquid phase epitaxy equipment, etc., which are produced with a view to removing contaminants, exist. do not do.

  On the other hand, in a device including physical operations such as a magnetic recording device, an optical recording device, and a magneto-optical recording device, conventionally, only air cooling by a fan has been used, so the cooling efficiency greatly depends on the installation environment, and the inside of the device In a magnetic recording device, a high NA lens is used in a magnetic head, an optical recording device, a magneto-optical recording device, etc. whose flying distance from a magnetic recording medium such as a hard disk is about several tens to 100 nm. This was a major cause of failure of the optical pickup and the like. As a method for solving this problem, there is a method for preventing the intrusion of dust by keeping a sealing degree inside the device by using a hard disk device, which is called a computer seal, with a sealing material of a rotating shaft of the hard disk (Non-Patent Document 1). reference). However, in the case of this computer seal, there is a possibility that dust will enter the inside of the apparatus when sticking the sticker and remain inside the apparatus as it is. Further, this computer seal is not suitable for a recording / reproducing apparatus such as an optical recording apparatus or a magneto-optical recording apparatus that employs a recording / reproducing medium attaching / detaching method. It has also been reported that brominated flame retardants and polybrominated diphenyl ethers that are harmful to the human body were detected from dust attached to the CPU in the computer (see Non-Patent Document 2). Regarding this, there is a problem that dust generated from the inside of the computer leaks to the outside, but at present there is no solution. In other words, a new proposal is required to realize a highly clean environment for including all of the magnetic recording apparatus, the optical recording apparatus, the magneto-optical recording apparatus and the like including physical operations.

[Search on December 25, 2004] Internet <URL: http://www.ferrotec.co.jp/products/computer/computer.html>

Alexandra McPherson, Beverley Thorpe, and Ann Blake, “Brominated Flame Retardants in Dust on Computers”, BFR 2004 Conference, Toronto, 2004 June

  In addition to the realization of a highly clean environment including physical operation, there is a high demand for the construction of a chemically highly clean environment. For example, in a volatile component material storage device such as a refrigerator, high cleanliness cannot be maintained, and a decrease in freshness of fish, meat, vegetables, fruits, etc. and bacterial growth are the causes of promoting these spoilage. Yes. In order to solve this, a deodorizing method using an activated carbon adsorption method has been conventionally used. However, in a volatile component material storage device such as a refrigerator, only deodorization is focused, and there is no viewpoint for realizing high cleanliness.

  In order to solve the above problems, it is essential to realize an environment having high cleanliness. In order for nanotechnology to blossom its original potential, it is necessary to move away from the paradigm that, as represented by Moore's Law of LSI, etc., the advancement of device miniaturization requires huge precision infrastructure and equipment. Considering that it is necessary to work, an inexpensive and small-scale clean unit or clean unit system suitable for producing an environment having high cleanliness is suitable. However, there is no conventional clean unit or clean unit system that has a dust removal function after the apparatus is introduced into the unit that is open to the atmosphere. In addition, no system has been built that can bridge each physically independent fusion platform.

An example of adhesion to a stripe-shaped metal substrate has been reported (Non-patent Document 3 and Patent Document 1).
Surface Science 557 (2004) pp.5-12

International Publication No. 04/079450 Pamphlet

Therefore, the problem to be solved by the present invention is a process apparatus such as a vacuum apparatus such as a vapor deposition apparatus, a molecular beam epitaxial apparatus or an ion beam sputtering apparatus, or a thin film growth apparatus such as a metal organic vapor phase epitaxy apparatus or a liquid phase epitaxial apparatus. In the case of, the load lock used for loading and unloading samples not only removes moisture and prevents oxidation, but also can perform dust prevention and dedusting at low cost and can be easily put on a series of production process lines. A unit-process device fusion system and a process method using the same.
Another problem to be solved by the present invention is that it does not depend on the installation environment, maintains high cleanliness, can realize a sealed structure, and includes a magnetic recording device, an optical recording device, a magneto-optical recording device, etc. including a mechanical operation. It is to provide a clean unit system that can prevent the failure of the system.
Still another problem to be solved by the present invention is that it can prevent the deterioration of freshness of fish, meat, vegetables, fruits, etc. and the growth of bacteria and suppress spoilage. It is to provide a clean unit system suitable for use.
Still another problem to be solved by the present invention is to provide a clean unit and a connected clean unit capable of performing a debris treatment of an object to be treated by performing an air shower process in a high cleanliness environment. is there.
A further problem to be solved by the present invention is that samples can be stored in a high cleanliness environment, independent of the external environment, can be carried anywhere, anytime, and each physically independent fusion platform. The purpose is to provide a compact portable clean unit and a connected clean unit that can be used for bridging.
The above and other problems will become apparent from the following description of the present specification with reference to the accompanying drawings.

In order to solve the above problem, the first invention is:
A clean unit-process apparatus fusion system characterized in that a clean unit and a process apparatus that can be maintained in a clean environment are connected.
Here, the process apparatus may be basically any apparatus, but for example, a vacuum apparatus such as a vapor deposition apparatus, a molecular beam epitaxial apparatus, an ion beam sputtering apparatus, a metal organic vapor phase growth apparatus, a liquid apparatus, etc. Thin film growth devices such as phase epitaxial devices, surface processing devices, and the like. In some cases, this process apparatus may also be a clean unit.
Typically, the clean unit can be maintained in a clean environment by a circulating filter. The circulation type filter is typically composed of an active dustproof filter and a circulation duct.

The second invention is
A clean unit system including a circulation type filter, a fan unit, and a heat exchanger, and a device including a mechanical operation housed in a clean unit that can be maintained in a clean environment.
Here, the device including the mechanical operation may be basically any device, for example, a magnetic recording device, an optical recording device, a magneto-optical recording device, or the like.
The third invention is
A clean unit that has a circulating filter and can be maintained in a clean environment.
An adsorption tower for removing chemical substances is installed at the circulation site.
The fourth invention is:
In a connected clean unit in which multiple clean units that can be maintained in a clean environment are connected,
At least one clean unit
A clean unit having a circulation type filter and capable of being maintained in a clean environment, wherein a chemical substance removal adsorption tower is installed at the circulation site.
By installing an adsorption tower for removing chemical substances at the circulation site of the clean unit as in the third and fourth aspects of the invention, it is possible to maintain a clean environment and at the same time realize a sealed space. And it can prevent the decay and deterioration of the parts. As the chemical substance removing adsorption tower, for example, a replaceable cartridge type can be used, and it can be attached and detached in accordance with the substance generated from the generation source. For example, what uses activated carbon as an adsorption tower for chemical substance removal can be used.

The fifth invention is:
A clean unit that has a circulating filter and can be maintained in a clean environment.
The object to be treated is detrashed by an air shower process.
The sixth invention is:
In a connected clean unit in which multiple clean units that can be maintained in a clean environment are connected,
At least one clean unit
A clean unit having a circulation filter and capable of being maintained in a clean environment, is characterized in that it performs a dedusting process on an object to be processed by an air shower process.

The seventh invention
It is a portable clean unit that has a circulating filter and can be maintained in a clean environment.
The eighth invention
In a connected clean unit in which multiple clean units that can be maintained in a clean environment are connected,
At least one clean unit
The portable clean unit has a circulation type filter and can be maintained in a clean environment.
The portable clean unit in the seventh and eighth inventions typically has a sample inlet / outlet.

The ninth invention
A clean unit that has a circulating filter and can be maintained in a clean environment.
The inner product of the area vector of the surface of the object to be processed in the process and the macro wind flow vector is configured to be zero.
The tenth invention is
In a connected clean unit in which multiple clean units that can be maintained in a clean environment are connected,
At least one clean unit
This is a clean unit that has a circulation type filter and can be maintained in a clean environment, and is configured such that the inner product of the surface area vector of the object to be processed in the process and the macro wind flow vector becomes zero. It is characterized by being.
In the ninth and tenth aspects, typically, the air flow by the circulation filter is set in the horizontal direction.

The eleventh invention is
A clean unit that has a circulating filter and can be maintained in a clean environment.
When processing the object to be processed in the required time τ, when n is the allowable upper limit density of dust particles per unit area incident on the surface of the object to be processed and v is the velocity of the air flow with respect to the surface , Cleanliness class N ₀
N ₀ <n / vτ
It is characterized by being set to satisfy.
The twelfth invention is
In a connected clean unit in which multiple clean units that can be maintained in a clean environment are connected,
At least one clean unit
This is a clean unit that has a circulation type filter and can be maintained in a clean environment. When processing the target object in the required time τ, the unit per unit area incident on the surface of the target object When the allowable upper limit density of dust particles is n and the velocity of air flow with respect to the surface is v, the cleanliness class N ₀ is
N ₀ <n / vτ
It is characterized by being set to satisfy.

The thirteenth invention
A clean unit that has a circulating filter and can be maintained in a clean environment.
When bonding is performed with a required length τ and a passing length L, the ratio of the unit area of the area invalidated by the inclusion of dust particles in the bonding to S is the surface area of the area generated by the circulation filter. when the speed of the vertical direction of the air flow and v, cleanliness class N ₀ on the dust particles having a particle size of r ₀
N ₀ <S / (2k ² πr ₀ ² vτln (L / r ₀ ))
However, it is characterized by being set so as to satisfy a constant of about k = 3-10.
The fourteenth invention is
In a connected clean unit in which multiple clean units that can be maintained in a clean environment are connected,
At least one clean unit
This is a clean unit that has a circulation type filter and can be maintained in a clean environment. When bonding is performed with a required length τ and a passing length L, the bonding is invalidated due to the presence of dust particles. The cleanliness class N ₀ for dust particles having a particle size r ₀ is defined as S, where the ratio of the area to the unit area is S and the velocity of the air flow in the direction perpendicular to the surface of the area generated by the circulation filter is v.
N ₀ <S / (2k ² πr ₀ ² vτln (L / r ₀ ))
However, it is set so that the constant of about k = 3-10 may be satisfy | filled.
In the second to fourteenth inventions, the circulation filter is typically composed of an active dustproof filter and a circulation duct.

The fifteenth invention
A process method executed by the above-described process device of a clean unit-process device fusion system in which a clean unit and a process device that can be maintained in a clean environment are connected,
It is characterized in that the inner product of the area vector of the surface of the object to be processed in the process and the macro wind flow vector becomes zero.
The sixteenth invention is
A process method executed by the above-described process device of a clean unit-process device fusion system in which a clean unit and a process device that can be maintained in a clean environment are connected,
When processing the object to be processed in the required time τ, when n is the allowable upper limit density of dust particles per unit area incident on the surface of the object to be processed and v is the velocity of the air flow with respect to the surface , Cleanliness class N ₀
N ₀ <n / vτ
It is characterized by setting to satisfy.
The seventeenth invention
A process method executed by the above-described process device of a clean unit-process device fusion system in which a clean unit and a process device that can be maintained in a clean environment are connected,
When bonding is performed with a required length τ and a passing length L, the ratio of the unit area of the area invalidated by the inclusion of dust particles in the bonding to S is the surface area of the area generated by the circulation filter. when the speed of the vertical direction of the air flow and v, cleanliness class N ₀ on the dust particles having a particle size of r ₀
N ₀ <S / (2k ² πr ₀ ² vτln (L / r ₀ ))
However, it is characterized by setting so as to satisfy a constant of about k = 3-10.
In the fifteenth to seventeenth inventions, typically, the clean unit can be maintained in a clean environment by a circulation filter. The circulation type filter is typically composed of an active dustproof filter and a circulation duct. In this case, typically, the air flow by the circulation filter is set in the horizontal direction.
In the first to seventeenth inventions, two or more clean units can be connected as necessary. The shape of the clean unit may be various shapes, and is selected as necessary.Specific examples include a rectangular parallelepiped shape or a cubic shape, a rectangular parallelepiped shape or a deformed shape of a rectangular parallelepiped shape, a spherical shape, a hemispherical shape, an ellipsoidal shape, It may be cylindrical. The size of the inside of the work room is basically determined as appropriate according to the design according to the purpose of use. For example, the operator can use a glove or the like to perform various operations (processes) inside the work room. In order to be able to perform maintenance, such as cleaning, cleaning, etc.), it is desirable that the size of the work chamber reaches the entire work space from the outside, generally, Is selected within 1 m in width, height and depth. On the other hand, if the size of the working chamber is too small, there is a risk that the work may be hindered. If you do not need to put your hands into the work chamber from the outside, for example when automating the work, or when carrying the clean unit with samples etc., make the work chamber smaller. It is possible.
The clean unit may be constituted by a plate-like hard member, or may be constituted by using a balloon or a balloon-like soft material.

  A compact device can be accommodated in the clean unit according to the purpose of use. Specifically, this apparatus is, for example, a scanning probe such as various process apparatuses, wrapping apparatuses, and analysis apparatuses (for example, an optical microscope, a scanning electron microscope (SEM), an atomic force microscope (AFM), etc., as described later). Microscope (SPM, etc.), reaction device, microchemical system, microchemical reactor, exposure device, etching device, growth device, processing device, sterilization device, particle size filter, artificial light source, bio device, food processing device, inspection device, Such as a driving device. As the artificial light source, a light-emitting diode or a semiconductor laser having a spectral half width of 30 nm or less, particularly a pulse-driven semiconductor laser is preferably used when a cell system or a plant body is grown.

According to the present invention, in a process apparatus such as a vacuum apparatus such as a vapor deposition apparatus, a molecular beam epitaxial apparatus or an ion beam sputtering apparatus, or a thin film growth apparatus such as a metal organic vapor phase epitaxy apparatus or a liquid phase epitaxy apparatus, The load lock to be used can not only remove moisture and prevent oxidation, but also perform dust prevention and dust removal at low cost and can be easily put on a series of production process lines.
In addition, it is a clean unit that can maintain high cleanliness, can achieve a sealed structure, and can prevent failures of magnetic recording devices, optical recording devices, magneto-optical recording devices, etc., including mechanical operations, regardless of the installation environment. A system can be realized.
In addition, to achieve a clean unit system suitable for sealing and storing volatile components and preventing deterioration of fish, meat, vegetables, fruits, etc. You can do it.
Further, it is possible to realize a clean unit capable of performing a dedusting process on an object to be processed by performing an air shower process in a high cleanliness environment.
A compact portable clean unit that can store samples in a high cleanliness environment, can be carried anywhere and anytime without depending on the external environment, and can be used to bridge each physically independent fusion platform. Can be realized.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows a clean unit-process apparatus fusion system according to a first embodiment of the present invention. This clean unit-process apparatus fusion system includes a process apparatus 1 and a clean unit 10 connected to the process apparatus 1 by a transfer cylinder described later.
The process apparatus 1 is a vacuum apparatus such as a vapor deposition apparatus, a molecular beam epitaxial apparatus or an ion beam sputtering apparatus, or a thin film growth apparatus such as a metal organic vapor phase growth apparatus or a liquid phase epitaxial apparatus.

  The clean unit 10 has a hexagonal box-shaped work chamber 11. In this work chamber 11, for example, both side surfaces are parallel to each other, the top surface and the bottom surface are also parallel to each other, both side surfaces and the top surface, the bottom surface, the front surface, and the back surface are at right angles to each other. The upper portion is inclined by a predetermined angle, for example, 70 to 80 ° C., in a direction approaching the back surface.

  A transfer box 12, which also serves as a connector between the clean units and a conveyance path, is detachably provided on the back surface of the work chamber 11. Using this transfer box 12, another clean unit 13 such as a sample loading / unloading creep unit can be connected to the back surface, and a sample or the like is transported through the transfer box 12. Can be done. The transfer box 12 typically has an opening provided on the back wall of the work chamber 11 and a blocking plate provided so that the opening can be opened and closed. The blocking plate may be basically any one as long as it can be opened and closed, but is typically a sliding door or a door. The shut-off plate can be opened and closed manually, or a sensor such as an optical sensor is installed inside the work chamber, and an open-close mechanism for the shut-off plate is provided so that when the operator's hand or sample approaches the shut-off plate You may make it open and close. In addition, when a transport mechanism such as a belt conveyor is provided in the work chamber and a sample is transported between the entrance and the exit by this transport mechanism, when the sample is transported to the vicinity of the exit by the transport mechanism, this is detected by a sensor. The blocking plate may be opened and closed by an opening / closing mechanism upon detection. A sealing member such as packing may be provided on the barrier plate or the wall surface of the working chamber to improve the airtightness at the time of blocking. The size of the transfer box 12 is 15 to 20 cm, for example.

  In order to minimize the release of dust or dust from the inner wall of the work chamber 11, preferably, an adhesive sheet is attached to at least a part of the inner wall of the work chamber 11, for example, when used for a certain period of time. When a multilayered adhesive sheet is used, a clean sheet surface can be obtained by peeling the adhesive sheets one by one. Further, by smoothing the inner wall surface of the work chamber 11 so as not to have a Fourier component of surface irregularities in the same order as the diameter of the dust fine particles to be removed from the work chamber 11 at the spatial frequency, this particle size is reduced. Adsorption of the dust particles on the inner wall surface of the working chamber can be minimized.

  Two circular openings are provided in the front wall of the work chamber 11, and a pair of manual gloves 14 are attached to these openings. An operator can put both hands into these manual work gloves 14 and perform necessary work in the work chamber 11. A circulation duct 15 and an active dustproof filter 16 having blasting power are attached to the upper surface of the work chamber 11, thereby maintaining the inside of the work chamber 11 in a clean environment of class 0.1 or class 1, for example. Be able to. As this active dustproof filter 16, for example, a HEPA filter or a ULPA filter can be used.

  The size of the work room 11 is selected so that the operator can put both hands into the manual work gloves 14 and can perform necessary work in the work room 11 and depends on the installation space. For example, the depth is 50 to 70 cm, the width is 70 to 90 cm, and the height is 50 to 100 cm. Moreover, as a material which comprises the working chamber 11, stainless steel (SUS) is used suitably in order to respond | correspond to pressurization, pressure reduction, or vacuum. Since stainless steel is opaque, a glass window 17 capable of observing the inside of the work chamber 11 is installed on the front surface of the work chamber 11.

  The process apparatus 1 and the clean unit 10 are connected by a transfer cylinder 18 made of, for example, stainless steel, which is integrated with the load lock mechanism of the process apparatus 1. Specifically, the front portion of the transfer cylinder 18 is attached in a sealed state to an opening provided on the left side surface of the working chamber 11 of the clean unit 10. The arm 19 of the transfer cylinder 18 can move back and forth, and the arm 19 can carry a sample or the like.

  A gas inlet 20 is provided in the upper part of the work chamber 11. However, the gas inlet 20 may be provided in a portion other than the upper portion of the work chamber 11 as long as it does not come into contact with other clean units. The gas inlet 20 is for introducing gas into the working chamber 11. The type of gas is not particularly limited, and a gas corresponding to the purpose of sample preparation is used, and specifically, for example, nitrogen, argon, oxygen, and the like. A gas outlet valve 21 is provided in the lower part of the working chamber 11.

A method of using this clean unit-process apparatus fusion system will be described as follows.
The inside of the working chamber 11 of the clean unit 10 is maintained in a clean environment of class 0.1 or class 1, for example. In this state, first, a sample (for example, a semiconductor wafer) transported into the creep unit 10 via a sample loading / unloading creep unit or the like is held by the arm 19 of the transfer cylinder 18, and the arm 19 is transferred. The cylinder 18 is pulled in and introduced into the vacuum chamber or growth chamber of the process apparatus 1 through a load lock mechanism. Then, after a predetermined process is executed in the process apparatus 1, the processed sample is returned to the cree unit 10 again by the arm 19 of the transfer cylinder 18 through the load lock mechanism, and the clea unit for sample loading / unloading is carried out. Take it out via etc.

  As described above, according to the clean unit-process apparatus fusion system according to the first embodiment, since the sample is always placed in a high cleanliness environment from when the sample is put in to when it is taken out, dust on the sample is removed. Adhesion of contaminants such as fine particles can be greatly reduced. For this reason, the yield of elements can be improved. Moreover, since this clean unit-process apparatus fusion system can realize a high cleanliness environment by the cree unit 10, it can be installed in a low clean environment such as a normal office environment. Thus, it is not necessary to install in a huge clean room, and the equipment cost can be greatly reduced. As a result, the manufacturing cost of the element can be greatly reduced.

  Next explained is a clean unit system according to the second embodiment of the invention. FIG. 2 shows this clean unit system. This clean unit system includes a clean unit 30 having a sealed structure and a magnetic recording device 31 such as a hard disk device housed therein. The clean unit 30 is, for example, a tower type case of a desktop personal computer. A filter 32 and a fan 33 are installed on the upper part of the clean unit 30. The fan 33 cools the mother board 34, the memory 35, and the like installed in the lower portion, and at the same time, sends air to the entrance of the filter 32 by the fan 33 and sends clean air from the exit of the filter 32 to thereby clean the inside of the clean unit 30. It is responsible for maintaining a high cleanliness environment. Here, since this clean unit system has a sealed structure, it is sent to the inlet of the filter 32 by the fan 33, and the clean air sent from the outlet circulates in the clean unit 30 and is sent to the filter 32 by the fan 33 again. Therefore, there is no waste of air. On the other hand, since the clean unit system has a sealed structure, the internal temperature rises due to heat generated by the operation of the magnetic recording device 31. Therefore, in order to keep the internal temperature low, a heat exchanger 36 is installed vertically in the air circulation portion of the clean unit 30 so that the internal heat can be released to the outside. As this heat exchanger 36, what comprises a Peltier device, for example can be used.

  As described above, according to the clean unit system according to the second embodiment, the magnetic recording device 31 with physical operation is accommodated in the clean unit 30 capable of maintaining a high cleanliness environment and sealed. Since the structure is adopted, it is possible to greatly reduce failures due to dust adhering to the magnetic recording device 31. In addition, in the conventional desktop personal computer, air is exhausted to the outside of the apparatus by the fan, so that air is wasted, whereas in this clean unit system, the air sent by the fan 33 is not wasted. A high cleanliness environment can be efficiently maintained. Furthermore, since this clean unit system has a sealed structure, it does not depend on the installation environment and can maintain a high cleanliness environment even when installed in a normal office environment with a low cleanliness.

Next explained is a clean unit system according to the third embodiment of the invention. 3A to C show this clean unit, FIG. 3A is a top view, FIG. 3B is a front view, and FIG. 3C is a side view. This clean unit mainly performs chemical processes aimed at maintaining high cleanliness and adsorbing chemical substances.
As shown in FIGS. 3A to 3C, this clean unit (hereinafter referred to as “type A”) has a hexahedral box-like work chamber 41. Both side surfaces of the work chamber 41 are parallel to each other, the top surface and the bottom surface are also parallel to each other, the side surfaces and the top surface, the bottom surface, the front surface and the back surface are perpendicular to each other. It is inclined by a predetermined angle, for example, 70 to 80 ° in the approaching direction. Transfer boxes 42 and 43 that also serve as connectors and transport paths between the clean units are detachably provided on the back surface and both side surfaces of the work chamber 41, respectively. Although not shown in FIGS. 3A to 3C, an opening is provided in the wall of the work chamber 41 where the transfer boxes 42 and 43 are attached. Using these transfer boxes 42 and 43, it is possible to connect other clean units from the two directions of the back and side, and to carry samples and the like through these transfer boxes 42 and 43. It can be done. Two circular openings are provided in the front wall of the work chamber 41, and a pair of manual gloves 44 are attached to these openings. The operator can put both hands into these manual work gloves 44 and perform necessary work in the work chamber 41. An active dustproof filter 45 and a fan 46 are attached to the upper surface of the work chamber 41, so that the inside of the work chamber 41 can be maintained in a highly clean environment of class 0.1 or class 1, for example. ing. As the active dustproof filter 45, for example, a HEPA filter or a ULPA filter can be used.

  A circulation duct 47 is attached so as to connect the fan 46 and the active dust filter 45 on the upper surface of the work chamber 11 of the clean unit to the lower right side of the work chamber 11. An adsorption tower 48 is installed in the middle of the circulation duct 47. An adsorbent corresponding to the substance to be adsorbed is attached to the adsorption tower 48. By making this adsorption tower 48 into a cartridge exchange type, it becomes possible to adsorb all chemical substances. For example, the adsorption tower 48 using activated carbon can be used. The inlet / outlet concentrations of the adsorption tower 48 are 0.320 ppm / 0.024 ppm for ammonia, 0.004 ppm / 0.001 ppm for trimethylamine, 0.05 ppm / 0.002 ppm for hydrogen sulfide, and 0.003 ppm / 0 for methyl sulfide. 0.001 ppm, 0.002 ppm / 0.001 ppm for methyl mercaptan, and 0.002 ppm / 0.001 ppm for methyl disulfide. The fan 46 plays a role of improving the blowing ability of the chemical substance.

The front surface of the work chamber 41 can be removed, and necessary devices such as a process device and an observation device can be put in the front surface with the front surface removed.
The size of the work chamber 41 can accommodate necessary process devices and the like, and an operator can put both hands into the manual work glove 44 and perform necessary work in the work chamber 41. Chosen for size. When the specific example of the dimension of the working chamber 41 is given, it is depth a = 50-70 cm, width b = 70-90 cm, and height h = 50-100 cm. Further, as a material constituting the working chamber 41, a transparent material, for example, an acrylic resin plate is preferably used so that the inside can be seen from the outside. You may make it attach this acrylic resin board to a metal frame for mechanical reinforcement. The dimensions of the transfer boxes 42 and 43 are, for example, 15 to 20 cm.

  According to the clean unit according to the third embodiment, the work chamber 41 can be maintained in a highly clean environment, and the chemical substance can be adsorbed and removed by the adsorption tower 48 installed in the circulation duct 47. It is possible to prevent harmful chemical substances from being present in the work chamber 41. Moreover, since this clean unit has a sealed structure, it does not depend on the installation environment, and can maintain an internal high cleanliness environment even when installed in a normal office environment with a low cleanliness.

Next, an example of the clean unit system according to the fourth embodiment of the present invention will be described. FIG. 4 shows this clean unit system. In this clean unit system, the volatile component enclosing and storing device 51 is a part of the clean unit system.
A fan 52, a dustproof filter 53, and an adsorption tower 54 are installed on the upper part of the volatile component inclusion sealing and storage device 51, and thereby the inside of the volatile component inclusion sealing and storage device 51 is, for example, class 0.1. Alternatively, it can be maintained in a highly clean environment of class 1 or so, and volatile components, that is, chemical substances can be adsorbed and removed. The adsorption tower volatile component-containing sealing and storage device 51 is, for example, a refrigerator. A divided storage chamber 55 is installed below the volatile component-containing enclosure and storage device 51. This divided storage room 55 is, for example, a vegetable room. An openable / closable door 56 is installed on the side surface of the volatile component-containing enclosure and storage device 51. This open / close door 56 makes it possible to enclose and seal substances and materials with respect to the volatile component-containing enclosure and the storage device 51. The adsorption tower 54 is provided with a chemical adsorbent according to the purpose. For example, carbon 60.9%, iron 17.2%, silicon 7. An ethylene gas adsorbent composed mainly of 4%, magnesium 6.3%, barium 3.4%, aluminum 2.1%, etc. is installed.

  According to the clean unit system according to the fourth embodiment, both the volatile component inclusion sealing and storage device 51 and the divided storage chamber 55 can be maintained in a high cleanliness environment from which volatile components have been removed. For example, spoilage of fish, meat, vegetables, fruits, etc. can be greatly suppressed. In addition, since this clean unit system has a sealed structure, it does not depend on the installation environment and can maintain an internal high cleanliness environment even when installed in a normal environment such as a home with low cleanliness.

A clean unit system according to a fifth embodiment of the invention will be described. FIG. 5 shows this clean unit system. In this clean unit system, the volatile component enclosing and storing device 61 is a part of the clean unit system.
A fan 62 and a dustproof filter 63 are installed in the upper part of the volatile component-containing enclosure and storage device 61. Further, an adsorption tower 64 is installed on the inner side of the volatile component enclosing and storage device 61. The volatile component-containing sealing and storage device 61 is, for example, a freshness holding room of a showcase or a supermarket or a convenience store. For example, a laterally openable / closable door 65 is installed at the front upper portion of the volatile component-containing enclosure and storage device 61. The laterally openable / closable door 65 allows the volatile component-containing enclosure to be sealed and the substances and materials to be taken in and out of the storage device 61. A chemical adsorbent according to the purpose is installed in the adsorption tower 65. For example, carbon 60.9%, iron 17.2%, silicon 7.4 enabling deodorizing and maintaining freshness of fresh food products and the like. %, Magnesium 6.3%, barium 3.4%, aluminum 2.1%, etc. are installed as ethylene gas adsorbents.

  According to the clean unit system according to the fifth embodiment, since the volatile component-containing sealing and storage device 61 can be maintained in a high cleanliness environment from which volatile components have been removed, for example, fish, meat, Rotation of vegetables and fruits can be greatly suppressed. In addition, since this clean unit system has a sealed structure, it does not depend on the installation environment, and it can maintain a high cleanliness environment even if it is installed in a normal environment such as a supermarket or a convenience store with low cleanliness. it can.

Next explained is a clean unit according to the sixth embodiment of the invention. 6A to C show the clean unit, FIG. 6A is a top view, FIG. 6B is a front view, and FIG. 6C is a side view. This clean unit is a clean unit having an air shower function. For example, the clean unit is for removing debris from devices, parts, and the like.
This clean unit has a handy blower 71 inside the working chamber 41 in addition to the same configuration as the type A clean unit according to the third embodiment. The handy blower 71 can perform an air shower process.
In addition, you may abbreviate | omit the adsorption tower 48 as needed.

Next, an example of how to use this clean unit will be described.
First, after introducing an object to be treated such as a dedusting process into the work chamber 41 via one of the transfer boxes 42 and 43, parts to be treated, an air shower process is performed by the handy blower 71, and dedusting is performed. Process. Thereafter, the object to be processed that has been subjected to the dedusting process is carried out of the work chamber 41 via one of the transfer boxes 42 and 43, and the subsequent processes are executed as necessary. When the debris treatment of the object 72 to be processed such as a large device or part that cannot pass through the transfer boxes 42 and 43 is performed, for example, the front wall of the work chamber 41 is temporarily removed to remove the object 72 to be processed. After introducing into the interior, attaching the wall as it is, and maintaining the inside of the work chamber 41 in a high cleanliness environment, an air shower process is performed by the handy blower 71 and a dedusting process is performed.
According to the clean unit according to the sixth embodiment, it is possible to easily carry out detrashing processing of various devices and parts under a normal environment such as an office.

7A to C show a clean unit according to a seventh embodiment of the present invention. FIG. 7A is a top view, FIG. 7B is a front view, and FIG. 7C is a side view. This clean unit is a clean unit having an air shower function, and performs, for example, a debris treatment of a small device or a small part.
This clean unit has a blower 81 on the inner upper side of the work chamber 41 in addition to the same configuration as the type A clean unit according to the third embodiment. The blower 81 can perform an air shower process.
In addition, you may abbreviate | omit the adsorption tower 48 as needed.

Next, an example of how to use this clean unit will be described.
First, after introducing an object to be treated such as a dedusting process into the work chamber 41 via one of the transfer boxes 42 and 43, parts to be treated, an air shower process is performed by the handy blower 71, and dedusting is performed. Process. Thereafter, the object to be processed that has been subjected to the dedusting process is carried out of the work chamber 41 via one of the transfer boxes 42 and 43, and the subsequent processes are executed as necessary. When the debris treatment of the object 72 to be processed such as a large device or part that cannot pass through the transfer boxes 42 and 43 is performed, for example, the front wall of the work chamber 41 is temporarily removed to remove the object 72 to be processed. After introducing into the interior, attaching the wall as it is, and maintaining the inside of the work chamber 41 in a high cleanliness environment, an air shower process is performed by the handy blower 71 and a dedusting process is performed.
According to the clean unit according to the seventh embodiment, it is possible to easily carry out detrashing processing of various devices and parts under a normal environment such as an office.

Next explained is a clean unit according to the eighth embodiment of the invention. FIG. 8 shows this clean unit. This clean unit is a portable unit having a sample receiving port with respect to the sample outlet at the sample outlet of the clean unit system in which a plurality of clean units having a working chamber that can be maintained in a clean environment are connected. It is a small clean unit.
In this clean unit, a transfer box 92 that is a sample outlet is installed on one side surface of a work chamber 91 that also serves as a storage chamber. The sample is transported and stored in the work chamber 91 through the transfer box 92. A fan 93 and an active dustproof filter 94 are installed in the upper part of the work chamber 91. As the active dustproof filter 94, for example, a small HEPA filter or ULPA filter can be used. As a result, the inside of the work chamber 91 can be maintained in a clean environment of class 0.1 or class 1, for example. In the work chamber 91, air is circulated as shown by arrows. One circular opening is provided in the front wall of the work chamber 91, and a manual work glove 95 is attached to the opening. An operator can put a hand into the manual work glove 95 to perform the transfer work in the work chamber 91.
The size of the working chamber 91 is, for example, about several tens of cm square or less, although it depends on the size of the sample or the like put in the working chamber 91.

A specific use example of this clean unit is shown in FIG. FIG. 9 shows a clean unit system in which a plurality of clean units are connected. As shown in FIG. 9, in this clean unit system, clean units 121 to 128 that can be connected in three directions are connected via a transfer box 129. In this case, the clean units 122 to 127 are connected in a loop arrangement.
The work performed in each of the clean units 121 to 128 is, for example, as follows. First, the clean unit 121 is a storage unit, in which a sample storage (for example, a wafer cassette 130 containing a substrate) is installed, and a transfer box 129 on the right side surface that is not used for connection is used as a sample insertion port. The rear transfer box 129 is an emergency sample outlet. The clean unit 122 is a chemical unit, and a chemical pretreatment system 131 is installed to perform chemical pretreatment. The clean unit 123 is a resist process unit, and a spin coater 132 and a developing device 133 are installed to perform resist coating and development. The clean unit 124 is a lithography unit, and an exposure apparatus 134 is installed, and a transfer box 128 on the right side surface not used for connection is an emergency sample outlet. The clean unit 125 is a growth / metallization unit. The electrochemical device 135 and the microreactor system 136 are installed, and the transfer box 128 on the right side surface not used for connection is an emergency sample outlet. The clean unit 126 is an etching unit, and an etching apparatus 137 is installed. The transfer box 129 on the back surface of the clean unit 126 is connected to the transfer box 129 on the back surface of the clean unit 123 via a relay box 138. The clean unit 127 is an assembly unit in which a microscope 139 and a prober 140 are installed. The clean unit 128 is a scanning probe microscope (SPM) observation unit. A desktop STM 141 and a desktop AFM 142 are installed, and a transfer box 129 on the right side surface that is not used for connection is a sample outlet, and a transfer on the back surface that is also not used for connection. Box 129 is an emergency sample outlet. The spin coater 132 of the clean unit 123, the exposure device 134 of the clean unit 124, the electrochemical device 135 and microreactor system 136 of the clean unit 125, the etching device 137 of the clean unit 126, the prober 140 of the clean unit 127 are connected to the power source 143. Power is supplied. The electrochemical device 135 of the clean unit 125 is connected to the electrochemical device controller 145 by a signal cable 144 and is controlled by the electrochemical device controller 145. Further, the observation images obtained by the microscope 139 of the clean unit 127, the desktop STM 141 of the clean unit 128, and the desktop AFM 142 can be displayed on the liquid crystal monitor 146.

In the clean unit system shown in FIG. 9, for example, the transfer box 92 of the clean unit 200 is cleaned while the sample (for example, a semiconductor wafer) is stored in the work chamber 91 of the clean unit 200 according to the eighth embodiment. The unit 128 is attached and connected to the sample outlet. In this state, the sample is transported from the clean unit 200 to the clean unit 128 via the transfer box 92 and observed by the desktop STM 141 or the desktop AFM 142.
According to the eighth embodiment, it is possible to provide a portable and compact clean unit that can be carried anywhere and anytime and can be bridged between each physically independent fusion platform. Moreover, since this clean unit has a sealed structure, it does not depend on the installation environment, and can maintain an internal high cleanliness environment even when installed in a normal environment such as an office environment with low cleanliness.

  FIG. 10 is a schematic diagram showing the particle size dependence of dust particles with high cleanliness of the clean unit according to the first, second and eighth embodiments. Class 0.1 to Class 1 high cleanliness has been achieved by flattening the surface state inside the clean unit and reducing the number of dusts that peel from the unit surface area per unit time. Show.

Next, a clean unit-process apparatus fusion system according to a ninth embodiment of the invention will be described. FIG. 11 shows this clean unit-process apparatus fusion system. In this clean unit-process apparatus fusion system, a clean unit 301 capable of pressure bonding and heat treatment and a process apparatus 302 including a vacuum apparatus, a thin film growth apparatus, a printing apparatus under an inert gas atmosphere, and a vacuum surface processing apparatus are transferred. They are connected via a box 303. An active dustproof filter 304 is attached to the upper surface of the clean unit 301 so that the inside of the clean unit 301 can be maintained in a highly clean environment of class 0.1 or class 1, for example. As the active dustproof filter 304, for example, a HEPA filter or a ULPA filter can be used. A circulation duct 305 is attached so as to connect the active dustproof filter 45 on the upper surface of the clean unit 301 to the lower portion on the right side. Gas inlets 306 and 307 are provided on the upper surface of the clean unit 301. For example, an inert gas such as Xe, Ar, Kr or the like is introduced from the gas inlet 306 as necessary, and is required from the gas inlet 307. Accordingly, high-purity gases such as Ar and N ₂ are introduced. A surface polishing apparatus 308 is further connected to the process apparatus 302 via a transfer box 309. Further, a chip forming process apparatus 310 is connected to the clean unit 301 via a transfer box 311.

Next, an example of how to use this clean unit-process apparatus fusion system will be described.
First, as shown in FIG. 11, in a process apparatus 302, a thin film is grown on a substrate (not shown) by a vacuum apparatus, a thin film growth apparatus, a printing apparatus in an inert gas atmosphere, or a vacuum surface processing apparatus. Process into a thin piece 312.
Next, as shown in FIG. 12, the thin piece 312 is conveyed into the surface polishing apparatus 308, and the surface of the thin piece 312 is polished in the surface polishing apparatus 308 to flatten the surface.

Next, as shown in FIG. 13, the thin piece 312 is transferred to the process apparatus 302, and in this process apparatus 302, an inert gas such as Xe, Ar, and Kr is used in a vacuum apparatus, a thin film growth apparatus, and a vacuum surface processing apparatus. Surface residue such as an oxide film remaining on the uppermost layer of the thin piece 312 is removed by surface milling or the like.
When a third layer such as an active molecular layer is inserted between the two slices, the insertion of the third layer is performed by a technique such as vapor deposition, printing, or single molecule adsorption after the completion of this stage. This case will be described below.

That is, as shown in FIG. 14, the thin piece 312 is transported to the clean unit 301, and an inert atom or molecule of group VIII such as Xe, Ar, Kr or group VI such as Se, S is further contained in the clean unit 301. Introduced in a certain low-temperature environment, the atoms or molecules 313 are physically adsorbed on the surface of the flakes 312.
Next, as shown in FIG. 15, in the clean unit 301, another thin piece 314 prepared in advance is pressure-bonded onto the inert atoms or molecules 313 physically adsorbed on the surface of the thin piece 312. And paste them together. At the time of this pressure bonding, an active dustproof filter 304 such as a HEPA filter is operated, and a high cleanliness process described later is applied.

Next, as shown in FIG. 16, in order to desorb the inert atoms or molecules 313 physically adsorbed on the surface of the thin piece 312, excitation including heat treatment or light irradiation process is performed. For example, if the upper flake 314 is a metal / polyethylene naphthalate superlattice structure element, inert atoms or molecules 313 will penetrate the polyethylene naphthalate. In this way, the inert atoms or molecules 313 are desorbed by excitation including heat treatment or light irradiation process, thereby completing a two-layer structure in which the thin pieces 312 and 314 are pressure-bonded as shown in FIG.
Next, as shown in FIG. 18, the two-layer structure to which the thin pieces 312 and 314 are pressure-bonded is carried into the chip-forming process device 310 to be chipped.

で記述される。このとき、

および

と定義すると、ダスト密度は

となり、時間がたっても外気のダスト密度の一次の関数となってしまう。つまり設置環境に大きく左右されてしまう。 Here, the high cleanliness process will be described.
Consider a case where only the active dustproof filter 45 is provided in the clean unit 301 and the circulation duct 305 is not provided, that is, the case where air is not circulated. At this time, the dust density n (t) in the working chamber of the clean unit 301 is as follows: the air volume of the dust filter is V, the volume of the working chamber is V ₀ , the inner area is S, and the dust particles are desorbed per unit area / unit time. The rate is σ, the dust density of the installation environment is N ₀ , and the dust collection rate of the dustproof filter is γ.

It is described by. At this time,

and

And the dust density is

And over time, it becomes a linear function of the dust density of the outside air. In other words, it greatly depends on the installation environment.

で記述される。このとき

および

と定義すると、ダスト微粒子濃度は

となり、時間が十分たてば、第２項は急速にゼロに近づくため、第１項、すなわちα_n ／β_n ＝（Ｓσ／Ｖ₀ ）／（γＶ／Ｖ₀ ）＝Ｓσ／γＶのみが残る。この項は外気のダスト密度を含まないため、このクリーンユニットの設置環境によらず、究極の清浄度が得られることがわかる。ここで特徴的なことは、ターボシステムを用いないクリーンユニットでは、作業室の清浄度は１−γあるいはそのべき乗（１−γ）ⁿ で支配されるのに対し、ターボシステムを用いるクリーンユニットでは、作業室の清浄度は１／γで支配されることである。また、Ｓσ／γＶを最小化することが重要である。 Next, consider the case where the clean unit 301 is provided with an active dustproof filter 45 and a circulation duct 305 (turbo system). In this case, the dust density n (t) is

It is described by. At this time

and

The dust particle concentration is defined as

When the time is sufficient, the second term rapidly approaches zero, so only the first term, that is, α _n / β _n = (Sσ / V ₀ ) / (γV / V ₀ ) = Sσ / γV Remains. Since this term does not include the dust density of the outside air, it can be seen that the ultimate cleanliness can be obtained regardless of the installation environment of the clean unit. What is characteristic here is that in a clean unit that does not use a turbo system, the cleanliness of the working room is governed by 1-γ or its power (1-γ) ⁿ , whereas in a clean unit that uses a turbo system, The cleanliness of the working room is governed by 1 / γ. It is also important to minimize Sσ / γV.

と表せる。ここで、ｆ（ｒ）は半径ｒと半径ｒ＋ｄｒとの間にあるダスト微粒子の分布密度である。 In the graph of particle size (r) vs. airborne particle number (N (r)) shown in FIG. 10, the vertical axis is the sum of the number of dust particles having a particle size of r or larger. That is, N (r) is

It can be expressed. Here, f (r) is the distribution density of dust particles between the radius r and the radius r + dr.

と与えられる（また、これをもって、図１０に示される粒径ｒ対ダスト微粒子数Ｎ（ｒ）の両対数プロットのグラフにおいて、ほぼ傾き２の直線になるということが十分説明されることがわかる）。左辺は体積密度であるので、Ａは長さ分の１の次元をもつことがわかる。 This is proportional to how many dust particles with radius r can be packed in a certain finite volume.
f (r) = A / r ³
You can. Therefore, cleanliness class N _o (related to particle size r _o) is

(Also, it can be fully explained that the logarithmic plot of particle size r vs. number of dust particles N (r) shown in FIG. ). Since the left side is the volume density, it can be seen that A has one-dimensional dimension.

で与えられる。 The number of dust particles that enter the unit area per unit time and between the radius r and the radius r + dr is given by fvdr, where v is the velocity of the dust particles. If bonding is not successful in the region of kr (k = about 3 to 10) around it due to the presence of dust particles with a radius r in the bonding by pressure bonding, invalidation due to all dust particles with a radius r or more. Area S integrates the above quantities

Given in.

S has an inverse dimension of time because A has an inverse dimension of length. That is, the relative area of Sτ is invalidated during the process of length τ. That is, for example, when bonding elements having an effective area of 1 cm ² in size is considered, an invalid area of S [cm ² ] is generated.
From the above equation, S is proportional to A, but A is
A = 2r ₀ ² N ₀
Therefore, in the logarithmic plot of particle size r versus number of dust particles N (r) in FIG. 10, for each straight line corresponding to each cleanliness class, the amount of dust particles is proportional to the inverse square of the radius. However, since the area invalidated by dust particles decreases with the square of the radius, both effects cancel each other out) and take a constant value. Therefore, even when fine dust particles are a problem in the pasting, the increase in S only increases with a dependency of ln (1 / r) at most.

を満たすように設定すればよい。ダスト微粒子はブラウン運動していると考えられるが、拡散長は１０〜１００μｍのオーダーであるので、ダスト微粒子の被処理対象物表面への供給は、マクロな風流が担っていると考えてよく、典型的には、風速ｖ＝１ｍ／min.の環境下ＵＳ２０９Ｄクラス１の清浄度にいおいて、１００秒のプロセスタイムで貼り合せを行うときのＳの値は０．１ｐｐｍ程度である。 Therefore, to make the relative invalid area smaller than a certain value S,

What is necessary is just to set so that it may satisfy | fill. Dust fine particles are considered to be in Brownian motion, but since the diffusion length is on the order of 10 to 100 μm, it may be considered that the supply of dust fine particles to the surface of the object to be processed is carried by a macro wind flow. Typically, in the cleanliness of US209D class 1 in an environment where the wind speed v = 1 m / min., The value of S when bonding is performed with a process time of 100 seconds is about 0.1 ppm.

を満たすように設定すればよい。例えば、ＵＳ２０９Ｄクラス１０の清浄度では、粒径１０ｎｍ（以上）のダスト微粒子総量は１立米あたり百万個と見積もられるので、試料表面に風速１ｍ／min.で垂直に風が当たっているとするときは
ｎ〜１０⁶ ／ｍ³ ×１ｍ／min.×１００ｓ
〜１０⁶ ／ｍ²
＝１０² ／ｃｍ²
となり、１ｃｍ² 当たり１個以下にするには、ＵＳ２０９Ｄクラス１０の２桁上、すなわちクラス０．１程度の清浄度にする必要があることがわかる。上記のダスト密度ｎ（ｔ）の解析に基づくクリーンシステム３０１は図１０に示すようにこれを満足している。 The Brownian motion depends on the particle size of the object. However, under the clean unit 301, the macro air volume is in a situation that exceeds the movement of the dust particles due to the Brownian motion. The number of dust particles with a radius r or more incident on the unit area is
N _o (r) vτ
Therefore, in order to make this smaller than the allowable upper limit density n of the number of dust fine particles per unit area for the object to be processed,

What is necessary is just to set so that it may satisfy | fill. For example, in the cleanliness of US209D class 10, the total amount of dust fine particles having a particle size of 10 nm (or more) is estimated to be 1 million per square meter, and therefore, the sample surface is exposed to wind at a wind speed of 1 m / min. when the ^{n~10 6 / m 3 × 1m /} min. × 100s
-10 ⁶ / m ²
= 10 ² / cm ²
It can be seen that in order to reduce the number to 1 or less per 1 cm ² , it is necessary to make the degree of cleanliness two orders of magnitude higher than that of US209D class 10, that is, about class 0.1. The clean system 301 based on the above analysis of the dust density n (t) satisfies this as shown in FIG.

と書ける。３００Ｋ付近では、空気の粘性係数η＝０．９×１０^-3Ｐａ・ｓであるので、今粒径１０ｎｍのダスト微粒子を考えると

となるので、１００秒のプロセスタイムの間に、貼り合せ領域Ｓ＝１ｃｍ² を通過する粒子数ｎ、したがって当該エリアへ付着するダスト微粒子の個数は、たとえばＵＳ２０９Ｄクラス１０の清浄度では、粒径１０ｎｍ（以上）のダスト微粒子総量は１立米あたり百万個と見積もられるので

個程度と見積もられ、すなわちブラウン運動によるダスト微粒子の表面への供給量は、マクロな風流によるものに比べると十分少ないと見ることができる。 The reason why it can be considered that the supply to the surface of the object to be treated is carried by a macro wind is as follows. Approximating that the dust particles are spherical, by using the Stokes law of fluid mechanics, the mobility can be expressed using the particle radius a and the gas viscosity coefficient η. The coefficient D is

Can be written. In the vicinity of 300K, the viscosity coefficient of air is η = 0.9 × 10 ⁻³ Pa · s.

Therefore, during the process time of 100 seconds, the number n of particles passing through the bonding region S = 1 cm ² , and therefore the number of dust particles adhering to the area, is, for example, the cleanliness of US209D class 10 Since the total amount of dust particles of 10nm (or more) is estimated to be 1 million per square meter

It can be estimated that the amount of dust particles supplied to the surface by Brownian motion is sufficiently smaller than that by a macro wind flow.

Further, the value of n is sufficiently smaller than the previously obtained values n to 10 ² / cm ² , although the same cleanliness is assumed, and the area of the sample surface during the process It can be seen that it is extremely effective to take an arrangement in which the inner product of the vector and the macro wind flow vector (which also takes into account the air flow, gravity effect, and temperature convection by the HEPA filter or the ULPA filter) is zero. At this time, the supply of dust to the surface is due to the Brownian motion described above, and more processes can be performed on the extremely clean surface. Typically, since the sample is processed in a horizontal state, in this case, it is desirable to take the macro wind flow in the horizontal direction. On the other hand, in general, it is also effective to carry out the processing by standing the sample vertically and vertically in view of the fact that cleaning with a HEPA filter or the like is often due to downflow.
This will be described again with reference to FIG. 19 and FIG. As shown in FIG. 19, the vector V is the net (net) flow as a result of the effects of wind, gravity and thermal convection by a HEPA filter or the like. In the case of dS · V> 0 or dS · V <0, the touchdown of the dust particles to the sample surface has a small Brownian motion component, so the contribution by V becomes dominant.
In FIG. 20, the vector V is the net flow as a result of the effects of wind, gravity and thermal convection by the HEPA filter or the like, as in FIG. 19, but this V is parallel to the sample. The touch-down of the dust particles to the sample surface when set in such a way becomes only the Brownian motion component. As mentioned above, this amount is very small.

Next explained is the tenth embodiment of the invention. In the tenth embodiment, as shown in FIG. 20, a specific example of executing the process of the object to be processed under the condition of dS · V = 0 will be described. Here, the following new solar cell is considered as the object to be processed.
First, the configuration of this solar cell will be described.
21A, B and C show this solar cell. Here, FIG. 21A is a front view, FIG. 21B is a back view, and FIG. 21C is a side view. As shown in FIGS. 21A, 21B and 21C, this solar cell has an anode electrode 1151 and a cathode electrode 1152 spirally sandwiched by a pn junction 1153 comprising a p-type semiconductor layer and an n-type semiconductor layer. It is formed and has a thin disk shape as a whole. These p-type semiconductor layer and n-type semiconductor layer may be inorganic semiconductors or organic semiconductors. Reference numeral 1155 denotes an extraction electrode for the cathode electrode 1152.

FIG. 22 schematically shows the detailed structure of this solar cell. In FIG. 22, reference numeral 1191 denotes a p-type semiconductor layer, and 1192 denotes an n-type semiconductor layer. As shown in FIG. 22, an insulating film 1193 made of various insulators such as a resin is provided at a portion where the anode electrode 1151 and the cathode electrode 1152 are back to back, and the insulating film 1193 and the anode electrode 1151 are connected to the cathode. The electrodes 1152 are electrically insulated from each other. In this case, the cathode electrode 152 is a full-surface electrode and is in ohmic contact with the n-type semiconductor layer 1192, whereas the anode electrode 1151 has n elongated microscopic pieces separated from each other in the thickness (W) direction of the disk. It consists of anode electrodes 1511-1 to 1511-n. These fine anode electrodes 1151-1 to 1151-n have widths W ₁ , W ₂ ,..., W _n , respectively, which may be the same or different.

The band gap E _g of the p-type semiconductor layer 1191 and the n-type semiconductor layer 1192 gradually decreases in n steps (n ≧ 2) in the thickness direction of the disk from the light incident surface, and from the light incident surface side. In this order, E _g1 , E _g2 ,..., E _gn (E _g1 > E _g2 >...> E _gn ). A region of the p-type semiconductor layer 1191 and the n-type semiconductor layer 1192 in which the band gap E _g is E _gk (1 ≦ k ≦ n) is referred to as an E _gk region. The p-type semiconductor layer 1191 in the E _gk region and the minute anode electrode 1151-k are in ohmic contact. These E _gk regions may be integrated or separated from each other. A structure in which an E _gk region is sandwiched between the minute anode electrode 1151-k and the cathode electrode 1152 constitutes a minute solar cell, and the n number of minute solar cells using the cathode electrode 1152 as a common electrode constitutes this solar cell. Is configured.

E _gk can be set as follows. For example, the wavelength is divided into n sections in the entire wavelength range of the AM1.5 sunlight spectrum or its main wavelength range (including a portion with a high incident energy). These sections are numbered in order from the short wavelength side (high energy side) 1, 2,..., N, and E _gk is selected to be equal to the minimum photon energy of the kth section. In this way, when a photon having photon energy in the kth section is incident on the E _gk region, an electron-hole pair is generated and photoelectric conversion is performed. In this case, the depth from the light incident surface to the E _gk region is selected so that photons having the photon energy in the k-th section reach each E _gk region and are sufficiently absorbed. As a result, the sunlight incident on the light incident surface of the solar cell is first incident on the E _g1 region, the photon energy of E _g1 or higher in the spectrum is absorbed and photoelectrically converted, and then the E _g2 region. And the photon energy of which is greater than E _{g2 and} smaller than E _g1 is absorbed and photoelectrically converted, and finally enters the E _gn region and the photon energy of the spectrum is greater than E _gn and E Things smaller than _gn-1 are absorbed and photoelectrically converted. As a result, light in almost the entire solar spectrum or in the main wavelength range can be used for photoelectric conversion.

Each E _gk can be set by changing the composition of the semiconductor constituting each E _gk region. Specifically, each E _gk region is composed of another kind of semiconductor. Some specific examples of using an inorganic semiconductor are as follows. In the simplest case where n = 2, for example, the E _g1 region is composed of GaAs (E _g = 1.43 eV) and the E _g2 region is composed of Si (E _g = 1.11 eV). When n = 3, for example, the E _g1 region is GaP (E _g = 2.25 eV), the E _g2 region is GaAs (E _g = 1.43 eV), and the E _g3 region is Si (E _g = 1). .11 eV). When n = 4, for example, the E _g1 region is GaP (E _g = 2.25 eV), the E _g2 region is GaAs (E _g = 1.43 eV), and the E _g3 region is Si (E _g = 1). .11 eV), the E _g4 region is composed of Ge (E _g = 0.76 eV). Furthermore, it is also possible to configure the E _gk region in the case of n to 10 using only GaInN _x As _1-x or GaInN _x P _1-x and controlling x. In addition, the E _gk region may be formed using II-VI group compound semiconductors that are known to exhibit large bowing when Te is included.

This solar cell is manufactured as follows, for example.
First, for example, a thin flat tape-shaped resin base film having a predetermined width is wound around a roller, and a plurality of vapor deposition sources are used on one surface of the resin base film using a vapor deposition mask or the like as necessary. A plurality of types of n-type semiconductors are separately evaporated to form n-type semiconductor layers having different band gaps, and then, if necessary, a plurality of types of p-types from a plurality of deposition sources using a deposition mask or the like. The p-type semiconductor layer is formed by separately evaporating the type semiconductor, and then the anode electrodes 1151-1 to 1151-n are formed by evaporating the metal for the anode electrode from another vapor deposition source or the like using the vapor deposition mask. Then, after an insulating material is evaporated from another vapor deposition source or the like to form an insulating film 1193, a metal for a cathode electrode is evaporated from another vapor deposition source or the like to form a cathode electrode 1152, and then this vapor deposition film is attached. Tree . Take up the manufacturing base film with roller-like extraction electrode 1155.
In order to prevent the resin base film from being caught when each of the layers formed by vapor deposition or the like is formed in a spiral shape, a roller heated to a high temperature on the back surface of the resin base film immediately before being wound. The resin base film is peeled off by pressing or irradiating the back surface with light.

In the tenth embodiment, the above-described process such as vapor deposition is performed in a clean unit provided with an active dustproof filter and a circulation duct. At this time, the inner product dS · V of the area vector dS of the deposition surface and the macro wind vector V is set to be zero. By carrying out like this, as already stated, processes, such as vapor deposition, can be performed in a very high cleanliness environment, and a solar cell can be manufactured with a high yield.
According to the tenth embodiment, for example, in a conventional amorphous Si solar cell, light having a wavelength of photon energy smaller than 1.12 eV cannot be used in the solar spectrum, but by design of the E _gk region. In addition, the light of the entire solar spectrum or the main part can be used for photoelectric conversion, and a solar cell with extremely high photoelectric conversion efficiency can be manufactured with a high yield.

As mentioned above, although embodiment of this invention was described concretely, this invention is not limited to the above-mentioned embodiment, The various deformation | transformation based on the technical idea of this invention is possible.
For example, the numerical values, materials, shapes, arrangements, and the like given in the above-described embodiments are merely examples, and different numerical values, materials, shapes, arrangements, and the like may be used as necessary.
Specifically, for example, the invention includes all basically to those having closed environment is applicable, for example, very applied noxious gases, dust, removal of such NO _x in closed vehicles and automobiles It is valid. In this case, even if the air is not completely sealed, it is needless to say that even if external air is taken in, it functions sufficiently if the amount is small compared to the amount of air generated by the clean unit purification system.

1 is a schematic diagram showing a clean unit-process apparatus fusion system according to a first embodiment of the present invention. It is a basic diagram which shows the clean unit system by 2nd Embodiment of this invention. It is the top view, front view, and side view which show the clean unit by 3rd Embodiment of this invention. It is a basic diagram which shows the clean unit system by 4th Embodiment of this invention. It is a basic diagram which shows the clean unit system by 5th Embodiment of this invention. It is the top view, front view, and side view which show the clean unit by 6th Embodiment of this invention. It is the top view, front view, and side view which show the clean unit by 7th Embodiment of this invention. It is a basic diagram which shows the clean unit by 8th Embodiment of this invention. It is a basic diagram for demonstrating the usage example of the clean unit by 8th Embodiment of this invention. It is a basic diagram which shows the measurement result of the cleanliness obtained by the clean unit provided with the active dustproof filter and the circulation duct. It is a basic diagram for demonstrating the usage example of the clean unit-process apparatus fusion system by 9th Embodiment of this invention. It is a basic diagram for demonstrating the usage example of the clean unit-process apparatus fusion system by 9th Embodiment of this invention. It is a basic diagram for demonstrating the usage example of the clean unit-process apparatus fusion system by 9th Embodiment of this invention. It is a basic diagram for demonstrating the usage example of the clean unit-process apparatus fusion system by 9th Embodiment of this invention. It is a basic diagram for demonstrating the usage example of the clean unit-process apparatus fusion system by 9th Embodiment of this invention. It is a basic diagram for demonstrating the usage example of the clean unit-process apparatus fusion system by 9th Embodiment of this invention. It is a basic diagram for demonstrating the usage example of the clean unit-process apparatus fusion system by 9th Embodiment of this invention. It is a basic diagram for demonstrating the usage example of the clean unit-process apparatus fusion system by 9th Embodiment of this invention. It is a basic diagram for demonstrating the usage example of the clean unit-process apparatus fusion system by 9th Embodiment of this invention. It is a basic diagram for demonstrating the usage example of the clean unit-process apparatus fusion system by 9th Embodiment of this invention. It is the front view, back view, and side view which show the solar cell manufactured by the 10th Embodiment of this invention. It is a basic diagram which shows the solar cell manufactured by the 10th Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1,302 ... Process apparatus, 10 ... Clean unit, 11, 41 ... Working room, 12, 42, 43, 92 ... Transfer box, 16, 32, 45, 54, 64, 94, 304 ... Active dustproof filter

Claims (22)

  A clean unit-process apparatus fusion system characterized in that a clean unit capable of being maintained in a clean environment and a process apparatus are connected.   2. The clean unit-process apparatus fusion system according to claim 1, wherein the process apparatus is a vacuum apparatus, a thin film growth apparatus or a surface processing apparatus.   2. The clean unit-process apparatus fusion system according to claim 1, wherein the clean unit can be maintained in a clean environment by a circulation type filter.   A clean unit system comprising a circulation type filter, a fan unit, and a heat exchanger, wherein a device including a mechanical operation is accommodated in a clean unit that can be maintained in a clean environment.   5. The clean unit system according to claim 4, wherein the apparatus including the mechanical operation is a magnetic recording apparatus, an optical recording apparatus, or a magneto-optical recording apparatus. A clean unit that has a circulating filter and can be maintained in a clean environment.
A clean unit that removes the object to be treated by air shower treatment. In a connected clean unit in which multiple clean units that can be maintained in a clean environment are connected,
At least one clean unit
A connected clean unit having a circulation type filter and capable of being maintained in a clean environment, wherein the object to be treated is removed by an air shower process.   A portable clean unit that has a circulating filter and can be maintained in a clean environment.   The portable clean unit according to claim 8, further comprising a sample inlet / outlet. In a connected clean unit in which multiple clean units that can be maintained in a clean environment are connected,
At least one clean unit
A connected clean unit characterized by being a portable clean unit having a circulation type filter and capable of being maintained in a clean environment. A clean unit that has a circulating filter and can be maintained in a clean environment.
A clean unit characterized in that an inner product of an area vector of a surface of an object to be processed in a process and a macro wind flow vector becomes zero.   12. The clean unit according to claim 11, wherein the air flow by the circulation filter is set in a horizontal direction. In a connected clean unit in which multiple clean units that can be maintained in a clean environment are connected,
At least one clean unit
This is a clean unit that has a circulation type filter and can be maintained in a clean environment, and is configured such that the inner product of the surface area vector of the object to be processed in the process and the macro wind flow vector becomes zero. A connected clean unit characterized by A clean unit that has a circulating filter and can be maintained in a clean environment.
When processing the object to be processed in the required time τ, when n is the allowable upper limit density of dust particles per unit area incident on the surface of the object to be processed and v is the velocity of the air flow with respect to the surface , Cleanliness class N ₀
N ₀ <n / vτ
A clean unit that is set to satisfy In a connected clean unit in which multiple clean units that can be maintained in a clean environment are connected,
At least one clean unit
This is a clean unit that has a circulation type filter and can be maintained in a clean environment. When processing the target object in the required time τ, the unit per unit area incident on the surface of the target object When the allowable upper limit density of dust particles is n and the velocity of air flow with respect to the surface is v, the cleanliness class N ₀ is
N ₀ <n / vτ
Connected clean unit characterized in that it is set to satisfy A clean unit that has a circulating filter and can be maintained in a clean environment.
When bonding is performed with a required length τ and a passing length L, the ratio of the unit area of the area invalidated by the inclusion of dust particles in the bonding to S is the surface area of the area generated by the circulation filter. when the speed of the vertical direction of the air flow and v, cleanliness class N ₀ on the dust particles having a particle size of r ₀
N ₀ <S / (2k ² πr ₀ ² vτln (L / r ₀ ))
However, the clean unit is set so as to satisfy a constant of about k = 3 to 10. In a connected clean unit in which multiple clean units that can be maintained in a clean environment are connected,
At least one clean unit
This is a clean unit that has a circulation type filter and can be maintained in a clean environment. When bonding is performed with a required length τ and a passing length L, the bonding is invalidated due to the presence of dust particles. The cleanliness class N ₀ for dust particles having a particle size r ₀ is defined as S, where the ratio of the area to the unit area is S and the velocity of the air flow in the direction perpendicular to the surface of the area generated by the circulation filter is v.
N ₀ <S / (2k ² πr ₀ ² vτln (L / r ₀ ))
However, the connected clean unit is set to satisfy a constant of about k = 3 to 10. A process method executed by the above-described process device of a clean unit-process device fusion system in which a clean unit and a process device that can be maintained in a clean environment are connected,
A process method characterized in that an inner product of an area vector of a surface of an object to be processed in a process and a macro wind flow vector becomes zero. A process method executed by the above-described process device of a clean unit-process device fusion system in which a clean unit and a process device that can be maintained in a clean environment are connected,
When processing the object to be processed in the required time τ, when n is the allowable upper limit density of dust particles per unit area incident on the surface of the object to be processed and v is the velocity of the air flow with respect to the surface , Cleanliness class N ₀
N ₀ <n / vτ
The process method characterized by setting so that it may satisfy | fill. A process method executed by the above-described process device of a clean unit-process device fusion system in which a clean unit and a process device that can be maintained in a clean environment are connected,
When bonding is performed with a required length τ and a passing length L, the ratio of the unit area of the area invalidated by the inclusion of dust particles in the bonding to S is the surface area of the area generated by the circulation filter. when the speed of the vertical direction of the air flow and v, cleanliness class N ₀ on the dust particles having a particle size of r ₀
N ₀ <S / (2k ² πr ₀ ² vτln (L / r ₀ ))
However, the process method is characterized by setting so as to satisfy a constant of about k = 3-10.   The process method according to any one of claims 18 to 20, wherein the clean unit can be maintained in a clean environment by a circulation filter.   The process according to claim 21, wherein the air flow by the circulation filter is set in a horizontal direction.

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