JP2003059811A - Aligner, device-manufacturing method, semiconductor manufacturing plant and maintenance method of the aligner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable easy operation even for an inexperienced operator of aligner, by reducing operation load of an operator during adjustment recognition operation and installation of an aligner and restraining troubles caused by misoperations. SOLUTION: The device has a storage means for storing an operation file where operation content such as operating instructions for an aligner is described one by one and a means for executing each treatment sequentially, according to each operation content described in the operation file one by one, and enables data processing of gained numerical information, storage process of gained information or process using gained information to be described in an operation file.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus for manufacturing a device such as a semiconductor element or a liquid crystal element, and more particularly, to create an operation file and analyze the content of the file when selecting or executing the operation file. Therefore, it relates to a function of performing automatic operation. The present invention is suitably applied to a semiconductor manufacturing apparatus, particularly a semiconductor exposure apparatus that prints a circuit pattern on a wafer.

[0002]

2. Description of the Related Art Conventionally, in a reduction projection type exposure apparatus used in a semiconductor manufacturing (exposure) process, an operation procedure is required for adjustment and confirmation work (adjustment work) of the assembled device and installation work by a user. It was decided that the operator repeatedly performed the same procedure every time the device was assembled. However, in order to reduce the operator's work load as much as possible, a desired sequence can be created by repeating the device command several times as disclosed in Japanese Patent Laid-Open No. 7-311607, and It was possible to run it as one command.

[0003]

However, the value is read and calculated from the result of the measurement command of the device,
It was not possible to describe and execute a series of subsequent operations such as inputting the calculation result as a parameter at one time. Therefore, the operator has transferred the execution result of the measurement command to a notebook, calculated based on it, wrote the result into the notebook, and manually input the parameters. In this way, there is a concern that a trouble may occur due to an operation error due to the simple operation of repeating the same operation for each device.

In view of the above problems of the prior art, an object of the present invention is to reduce the work load of an operator at the time of adjusting work and installation in an exposure apparatus, and suppress the occurrence of troubles due to operation mistakes. To do. Second
In addition, it is intended that even a person who is not skilled in operating the exposure apparatus can easily perform the operation.

[0005]

Therefore, the semiconductor exposure apparatus of the present invention stores the operation file in which the operation contents are described in order, and the storage means for each operation content described in the operation file in order. It is characterized in that it has means for sequentially executing the processing, and can describe the arithmetic processing of the acquired numerical information, the storage processing of the acquired information or the processing using the acquired information in the operation file. Further, in the present exposure apparatus, an operator normally creates and saves an operation file, selects an operation file and executes it, and analyzes the contents of the operation file to issue an instruction to an internal process. And means for displaying the result.

Here, the operation content described in the operation file includes, in particular, an operation command for designating a program for operating the exposure apparatus and executing the designated program. This operation command is an xystg command for moving the wafer to the initial value, or j for performing automatic alignment observation.
Examples thereof include an sma command, a wafer command for performing focus adjustment, and a system command such as a syscon command for performing wafer alignment offset measurement while stepwise moving the stage. And the processing using the acquired information is, for example, when the processing by these programs is controlled by a parameter file consisting of a series of control parameters, the parameter file is edited with a value derived from the measurement result or the like. Then, the program is executed using this edited parameter file.

Further, the operation file may include general control processing including determination processing (branching) and repetitive processing (loop), file operation and the like.

From the above, the operator can easily perform the work including the continuous operation by creating the operation file and selecting and executing the operation file, and the adjustment work after the exposure apparatus is assembled. It is possible to reduce the load on the operator at the time of installation at the user site. Also,
Even a person who is not skilled in the operation of the exposure apparatus only needs to select and execute the operation file, so that various operations can be performed by simple operations regardless of the skill of the operator.

For example, a process of measuring the accuracy of the exposure apparatus after assembling, a process of calculating the measurement result to obtain a device offset, a process of editing a parameter file using the device offset, and the edited parameter If the process of controlling the program by the file and performing the test operation is described in the operation file, this series of processes is automatically executed only by selecting and executing the operation file.

Further, the exposure apparatus of the present invention may have means for connecting to a management computer or another exposure apparatus via a communication network to mutually communicate with the management computer or another exposure apparatus. It is also possible to execute processing according to the description content of the operation file stored in the management computer or other exposure apparatus.

Further, in addition to the reason for sharing the operation file described above, a display, a network interface, and a computer that executes network software are provided so that maintenance information of the exposure apparatus and the like can be data-communicated through the computer network. You may have. This network software is connected to an external network of a factory in which the exposure apparatus is installed, provides a user interface for accessing a maintenance database provided by a vendor or a user of the exposure apparatus on the display, and the user interface is accessed via the external network. Allows you to get information from a database.

The device manufacturing method of the present invention comprises the steps of installing a manufacturing apparatus group for various processes including the above-described exposure apparatus of the present invention in a semiconductor manufacturing factory, and a semiconductor device manufactured by a plurality of processes using this manufacturing apparatus group. It has a manufacturing process. In this case, the manufacturing apparatus group may be connected by a local area network, and data communication of information about at least one of the manufacturing apparatus group may be performed by the local area network and an external network outside the semiconductor manufacturing factory. At this time, for example, a database provided by the vendor or user of the exposure apparatus is accessed via an external network to obtain maintenance information of the exposure apparatus by data communication, or between a semiconductor manufacturing factory different from the semiconductor manufacturing factory. Data communication may be performed via an external network to control production.

The semiconductor manufacturing factory of the present invention comprises a group of manufacturing apparatuses for various processes including the exposure apparatus of the present invention, a local area network connecting the manufacturing apparatus groups, and an external network outside the factory from the local area network. It is characterized in that it has a gateway for making it possible to perform data communication of information between an external network and at least one of the manufacturing apparatus group.

The maintenance method of the present invention is the above-mentioned maintenance method for an exposure apparatus installed in a semiconductor manufacturing factory, wherein the vendor or user of the exposure apparatus is a maintenance database connected to an external network of the semiconductor manufacturing factory. And a step of permitting access to the maintenance database from within the semiconductor manufacturing plant via an external network,
And transmitting the maintenance information accumulated in the maintenance database to the semiconductor manufacturing factory side via an external network.

[0015]

According to the present invention, instead of repeating the same operation at the time of confirmation work after assembling the device or installation at the user's place, an operation file describing the operation contents is created instead, and the operation file is created. By selecting and executing
It is possible to perform automatic operation and reduce the load on the operator.

Further, even a person who is not skilled in the operation can perform the work regardless of the skill of the operator, because the operation file can be selected and executed.

[0017]

EXAMPLES Example 1 (Exposure Apparatus and Automatic Operation Processing) The present invention will be described in more detail below through examples. FIG. 1 is a perspective view showing the outer appearance of a semiconductor exposure apparatus according to an embodiment of the present invention. As shown in the figure, this semiconductor exposure apparatus is an EWS having a temperature control chamber 101 for controlling the environmental temperature of the apparatus main body and a CPU arranged inside the temperature control chamber 101 for controlling the apparatus main body.
Main body 106, EWS display device 102 for displaying predetermined information in the device, monitor TV 105 for displaying image information obtained through the image pickup means in the device main body, operation panel 103 for performing predetermined input to the device. , A console section including the EWS keyboard 104 and the like. In the figure, 107 is an ON-OFF switch, 108 is an emergency stop switch, 109 is various switches, a mouse, etc., 110 is a LAN communication cable, 111
Is an exhaust duct of heat generated from the console function, and 11
2 is an exhaust device for the chamber. The main body of the semiconductor exposure apparatus is installed inside the chamber 101.

The EWS display 102 is a thin flat type such as EL, plasma, liquid crystal, etc., is housed in the front of the chamber 101, and is connected to the EWS main body 106 by a LAN cable 110. Operation panel 10
3, a keyboard 104, a monitor TV 105 and the like are also installed on the front surface of the chamber 101 so that the console operation similar to the conventional one can be performed from the front surface of the chamber 101.

FIG. 2 is a diagram showing the internal structure of the apparatus shown in FIG. In the figure, a stepper as a semiconductor exposure apparatus is shown. In the figure, 202 is a reticle, and 203 is a wafer. When the light flux emitted from the light source device 204 passes through the illumination optical system 205 and illuminates the reticle 202, the pattern on the reticle 202 is exposed on the wafer 203 by the projection lens 206. It can be transferred to a layer. The reticle 202 is supported by a reticle stage 207 for holding and moving the reticle 202. Wafer 203
Is exposed by the wafer chuck 291 while being vacuum-adsorbed. The wafer chuck 291 is the wafer stage 20.
It is possible to move in each axial direction by 9. A reticle optical system 281 for detecting a positional deviation amount of the reticle is arranged above the reticle 202. An off-axis microscope 282 is arranged above the wafer stage 209 and adjacent to the projection lens 206. Off-axis microscope 282
The main role is to detect the relative position between the internal reference mark and the alignment mark on the wafer 203.
Further, a reticle library 220 and a wafer carrier elevator 230, which are peripheral devices, are arranged adjacent to these stepper bodies, and necessary reticles and wafers are carried to the stepper body by the reticle carrier device 221 and the wafer carrier device 231.

The chamber 101 is mainly composed of an air conditioner room 210 for controlling the temperature of air, a filter box 213 for crushing fine foreign matters to form a uniform flow of clean air, and a booth 214 for shutting off the environment of the apparatus from the outside. Has been done. In the chamber 101, the air whose temperature is adjusted by the cooler 215 and the reheat heater 216 in the air conditioner room 210 is supplied by the blower 217 into the booth 214 via the air filter g. The air supplied to the booth 214 is again taken into the air conditioner room 210 from the return port ra and circulates in the chamber 101. Usually, this chamber 101 is not a complete circulation system in a strict sense, and about 10% of the amount of circulating air outside the booth 214 is introduced into the air conditioning chamber 210 in order to maintain the positive pressure inside the booth 214 at all times. It is introduced through the blower from the mouth oa. In this way, the chamber 101 makes it possible to keep the ambient temperature in which the apparatus is placed constant and keep the air clean. Further, the light source device 204 is provided with an intake port sa and an exhaust port e in preparation for cooling of the ultra-high pressure mercury lamp and preparation of toxic gas in the event of a laser abnormality
a is provided, and a part of the air in the booth 214 is forcedly exhausted to the factory equipment via the light source device 204 and the exclusive exhaust fan provided in the air conditioner room 210. Further, a chemical adsorption filter cf for removing chemical substances in the air is provided by being connected to the outside air introduction port oa and the return port ra of the air conditioner chamber 210, respectively.

FIG. 3 is a block diagram showing an electric circuit configuration of the apparatus shown in FIG. In the figure, reference numeral 321 denotes a main body C incorporated in the EWS main body 106, which controls the entire apparatus.
The PU is a central processing unit such as a microcomputer or a minicomputer. 322 is a wafer stage drive device, 323 is an alignment detection system such as the off-axis microscope 282, 324 is a reticle stage drive device, 325 is an illumination system such as the light source device 204, 326.
Is a shutter drive device, 327 is a focus detection system, 32
Reference numeral 8 denotes a Z drive device, which are controlled by the main body CPU 321. Reference numeral 329 denotes the reticle transport device 2
21, a wafer transfer device 231, and the like. 330
Is a console unit having the display 102, the keyboard 104, etc., and is for giving various commands and parameters relating to the operation of the exposure apparatus to the main body CPU 321. That is, it is for exchanging information with the operator. Also, 331
Is a console CPU, and 332 is an external memory. The external memory 332 is, for example, a hard disk, has a database built therein, and records various parameters and management data thereof, a group of operators, and the like.

FIG. 4 is a pop-up window (operation file editing screen) displayed on the display screen of the display 102 of FIG. 1 for newly creating or editing an operation file which is a file in which an operation procedure is described.

An item is selected from the operation content classification 401 vertically arranged on the editing screen of FIG. 4 by the keyboard 104 or the like,
List selection button 40 from the list that matches the selected content
Select the operation content with 2. Then, the condition input area 4
In 03, enter the operation conditions. Here, OK button 4
When 04 is pressed, one line of the operation file is created and displayed in the file content display area 410. Repeat this,
Finally, by pressing the Save button 422, an operation file can be created and saved in the external memory 332. When editing is completed, the Exit button 423 can be pressed to close this editing screen. Further, in the case of editing the created operation file, when the file is selected by the File button 421, the content is displayed in the file content display area 410, and the operation file can be edited again.

FIG. 5 shows an example of the operation file created by the operation file editor shown in FIG. As shown in the figure, in the operation file, at the beginning of each line, "load" meaning loading of data, "edit" meaning editing of parameters, and "lin" meaning linking of programs.
Keywords such as “k” and “save” that mean saving data are described, and each process is executed based on these keywords. Thus, even if the operation file is created by a dedicated operation file editor. You can create it with a general text editor if it matches the grammar of the operation file.

The operation procedure for selecting and executing the created operation file will be described below with reference to FIG. (1) When the operation file selection / execution screen is launched, as shown in FIG. 6, "Machine" item has "
"local" is displayed and "/ home / ca" in the device
A file under the default directory such as "non / operation" is displayed in the file name display area 601.
This selection / execution screen is displayed on the display 104 as the initial screen of the. This default directory can be set in any directory by the configuration file. (2) If you want to move a directory, select the directory you want to move from the directory name display area 602. The directory name will be highlighted. By pressing the Change button 613 in that state, you can move to the selected directory. It is possible to move. (3) When the operation file to be executed is found and the file name is selected in the file name display area 601,
The file name will be highlighted and Execute in that state
When the e button 611 is pressed, processing according to the selected operation file starts. (4) The state of execution is displayed on the terminal screen so that the progress of processing can be confirmed. When the execution is completed, as shown in Fig. 9, "Are you"
Sure? [RETURN] ”is displayed and a comment waiting for input is displayed, waiting for return input, and when the return key is pressed on the keyboard 104, the terminal screen is closed and the screen returns to the initial state of Fig. 6. (5) Follow the operation file When the processing is finished,
The Cancel button 612 terminates this operation file selection / execution screen.

In the above example, the flow of operations from new creation of an operation file to selection / execution has been described. The flow of automatic operation processing according to the operation file will be described with reference to FIGS. 7 and 8.

FIG. 7 is a flowchart showing the procedure of the automatic driving process. As mentioned above, the Execute button 6
When the automatic driving process is started by pressing 11, the console CPU 331 first opens the operation file in step S101. In the next step S102, one line of the operation file is read. In the next step S103,
The contents read in step S102 are analyzed (details will be described with reference to FIG. 8). In the next step S104, an instruction is issued to the related process based on the contents of the operation file. In the next step S105, the execution of the related process is awaited. In the next step S106, it is determined whether the read content is the content of the last line of the operation file,
If it is not the last line, proceed to the next line (step S1
07), and returns to step S102. On the other hand, step S1
When it is judged that the last line of the file is reached in 06,
The automatic driving process ends.

FIG. 8 is a flow chart showing the procedure of the operation file content analysis processing in step S103.

When the operation file content analysis process is started, first, in step S201, the console CPU 3
31 acquires a keyword from the contents of the operation file read in step S102 (FIG. 7). Next step S
In 202, the keyword "cm" means command.
If it is "cmd", the process proceeds to step S204. If it is not "cmd", the process proceeds to step S203.
Keywords are "load", "edit", "lin"
If either "k" or "save" is matched,
The process proceeds to step S205, and if they do not match, the process proceeds to step S206. Then, in step S204, a command issuing process (for example, a step of transmitting the read command to the main body CPU 321 and controlling each unit of the exposure apparatus according to the command received by the main body CPU 321 and notifying the console CPU 331 of the end of processing execution)
F Create instructions. In step S205, the instruction content for the parameter editing process is created. On the other hand, in step S206, control such as file operation, calculation, branching, looping, etc. is processed in its own process (as part of automatic operation processing). These steps S204 to S206
When any one of the processes is finished, the operation file content analysis process is finished, and the process is returned to step S104 in FIG.

(Example of Confirmation Work) The mechanism of the automatic driving process has been described above, but the confirmation work will be described more specifically. For example, 1 of the adjustment work after device assembly
One is the process of inputting the wafer magnification and its offset, and the following process operations are required. (1) Move the wafer to the initial position with the xystg command. (2) Observe the AA mark with the jsma command. (3) Focusing is performed by the wiaf command. (4) Wafer alignment offset measurement is performed while the stage is stepped by the syscon command of the apparatus side CPU 321. (5) Drop each measured value in the log file. (6) This log file is statistically calculated by the tool software to calculate the wafer magnification offset. (7) Input the calculated offset into the system offset of the exposure apparatus and save it. (8) After the offset input, in order to confirm that the offset is correct, the above-mentioned measurement is performed 10 times in each of the wafer alignment scope for X-direction and Y-direction measurement and each illumination mode (5 modes).

In the conventional exposure apparatus, in order to carry out such an operation, the operator has to be particular about the exposure apparatus, the command execution of the above (1) to (4), the file operation of (5) and the operation of (6). Statistical calculation (computation processing), parameter editing in (7), repeated execution for confirmation in (8), etc.
The steps (1) to (8) had to be carried out step by step. However, according to the present embodiment, this (1)-
By creating and executing the operation file in which the operation procedure of (8) is described in order, the steps of the above contents can be realized by only one operation, and the operator's burden is significantly reduced. Further, since a series of processes can be executed by only one operation, it is possible for an unskilled person to easily execute a continuous process, which leads to a reduction in operation mistakes.

As described above, it is possible to describe a series of operation contents in the operation file by combining not only device command execution but also calculation and parameter editing.

<Embodiment 2> In the above-described Embodiment 1, the case where an operation file is created and executed by a single exposure apparatus has been described. However, as shown in FIG. 10, the same network (LAN) is used.
Network management is also possible by connecting a management computer (server) 1000 and a plurality of exposure apparatuses to the computer 1001 and inserting a communication program 1002 into each of them.

In FIG. 10, the operation file does not exist in the exposure apparatus A, but from the communication program 1002,
Management computer (server) via LAN 1001
Operation file 100 on 1000 or another exposure apparatus (for example, exposure apparatus B) connected to the same network
By referring to 3, it is possible to automatically operate even the exposure apparatus A in which the operation file 1003 does not exist.

The operation file 1003 is stored on a medium such as a floppy (registered trademark) disk or MO.
It is possible to distribute to each device, and it is also possible to transmit a file via the network or share the file by using a known network technique.

From the above, the same network 100
The operation file 1003 can be displayed, created, changed, and executed anywhere on the management computer 1000 and each device connected to the device 1.

<Example of Semiconductor Production System> Next, an example of a production system of semiconductor devices (semiconductor chips such as IC and LSI, liquid crystal panels, CCDs, thin film magnetic heads, micromachines, etc.) will be described. This is for maintenance services such as troubleshooting and regular maintenance of manufacturing equipment installed in semiconductor manufacturing plants, or software provision.
This is done using a computer network outside the manufacturing plant.

FIG. 11 shows the entire system cut out from a certain angle. In the figure, reference numeral 701 denotes a business office of a vendor (apparatus supplier) that provides a semiconductor device manufacturing apparatus. As an example of the manufacturing apparatus, a semiconductor manufacturing apparatus for various processes used in a semiconductor manufacturing factory, for example, pre-process equipment (exposure apparatus, resist processing apparatus, lithography apparatus such as etching apparatus, heat treatment apparatus, film forming apparatus, planarization apparatus) Equipment) and post-process equipment (assembling equipment, inspection equipment, etc.). The business office 701 includes a host management system 708 that provides a maintenance database for manufacturing equipment, a plurality of operation terminal computers 710, and a local area network (LAN) 709 that connects these to form an intranet. The host management system 708 includes a gateway for connecting the LAN 709 to the Internet 705, which is an external network of a business office, and a security function for restricting access from the outside.

On the other hand, reference numerals 702 to 704 are manufacturing plants of semiconductor manufacturers as users of manufacturing equipment. The manufacturing factories 702 to 704 may be factories belonging to different manufacturers or may be factories belonging to the same manufacturer (for example, a pre-process factory, a post-process factory, etc.). In each of the factories 702 to 704, a plurality of manufacturing apparatuses 706 and a local area network (LAN) 711 that connects them and constructs an intranet, respectively.
And a host management system 707 as a monitoring device for monitoring the operating status of each manufacturing device 706. Host management system 7 provided in each factory 702-704
07 includes a gateway for connecting the LAN 711 in each factory to the Internet 705 which is an external network of the factory. As a result, it becomes possible to access the host management system 708 on the vendor 701 side from the LAN 711 of each factory via the Internet 705, and only the limited user is permitted to access by the security function of the host management system 708. Specifically, each manufacturing device 7 is connected via the Internet 705.
In addition to notifying the vendor of the status information indicating the operating status of 06 (for example, a symptom of a manufacturing apparatus in which a trouble has occurred) from the factory side, response information corresponding to the notification (for example,
It is possible to receive maintenance information such as information instructing how to deal with troubles, software and data for dealing with troubles, latest software, and help information from the vendor side. A communication protocol (TCP / IP) generally used on the Internet is used for data communication between the factories 702 to 704 and the vendor 701 and data communication on the LAN 711 in each factory. Instead of using the Internet as an external network outside the factory, it is also possible to use a leased line network (ISDN or the like) which is highly secure without being accessed by a third party. Further, the host management system is not limited to the one provided by the vendor, and a user may construct a database and place it on an external network so that the user can access the database from a plurality of factories.

Now, FIG. 12 is a conceptual diagram showing the entire system of this embodiment cut out from an angle different from that shown in FIG. In the above example, a plurality of user factories each provided with a manufacturing apparatus and a management system of the vendor of the manufacturing apparatus are connected by an external network, and production management of each factory or at least one unit of the factory is performed via the external network. The information of the manufacturing apparatus was data-communicated. On the other hand, in this example, a factory equipped with manufacturing apparatuses of a plurality of vendors and a management system of each vendor of the plurality of manufacturing apparatuses are connected by an external network outside the factory, and maintenance information of each manufacturing apparatus is displayed. It is for data communication. In the figure, reference numeral 801 denotes a manufacturing factory of a manufacturing apparatus user (semiconductor device manufacturing manufacturer), and a manufacturing apparatus for performing various processes on a manufacturing line of the factory, here, as an example, an exposure apparatus 802, a resist processing apparatus 803, a film processing apparatus. 804 has been introduced.
Although only one manufacturing factory 801 is drawn in FIG. 12, a plurality of factories are actually networked in the same manner. Each device in the factory is connected via a LAN 806 to form an intranet, and the host management system 805 manages the operation of the manufacturing line. On the other hand, host business management systems 811 and 821 for performing remote maintenance of the supplied equipments are provided to each business office of the vendor (equipment supply manufacturer) such as the exposure equipment manufacturer 810, the resist processing equipment manufacturer 820, and the film formation equipment manufacturer 830. 831 which, as mentioned above, comprises a maintenance database and a gateway for external networks. A host management system 805 that manages each device in the user's manufacturing plant,
Vendor management system 811, 821, 83 for each device
1 is connected to the external network 800 by the Internet or a leased line network.
In this system, if a trouble occurs in any of the series of manufacturing equipment on the manufacturing line, the operation of the manufacturing line is suspended, but the vendor of the equipment in trouble receives remote maintenance via the Internet 800. This enables quick response and minimizes production line downtime.

Each manufacturing apparatus installed in the semiconductor manufacturing factory is provided with a display, a network interface, and a computer that executes network access software and apparatus operating software stored in a storage device. The storage device is a built-in memory, a hard disk, or a network file server. The network access software includes a dedicated or general-purpose web browser, and provides a user interface with a screen as shown in FIG. 13 on the display. The operator who manages the manufacturing apparatus in each factory refers to the screen, and the manufacturing apparatus model (901), serial number (902), trouble subject (903), date of occurrence (904), urgency (905), Information such as a symptom (906), a coping method (907), and a progress (908) is input to input items on the screen. The input information is transmitted to the maintenance database via the Internet, and the appropriate maintenance information as a result is returned from the maintenance database and presented on the display. Further, the user interface provided by the web browser is further provided with a hyperlink function (910-91) as shown in the figure.
2) is realized, the operator can access more detailed information of each item, pull out the latest version of software to be used for manufacturing equipment from the software library provided by the vendor, and use it as a reference for the factory operator. Help information) can be retrieved. Here, the maintenance information provided by the maintenance database includes the information related to the present invention such as the operation file described above. The software library also provides the latest software for implementing the present invention.

Next, a semiconductor device manufacturing process using the above-described production system will be described. FIG. 14 shows a flow of the whole manufacturing process of the semiconductor device.
In step S1 (circuit design), a semiconductor device circuit is designed. In step S2 (mask manufacturing), a mask having the designed circuit pattern is manufactured. On the other hand, in step S3 (wafer manufacture), a wafer is manufactured using a material such as silicon. Step S4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by the lithography technique using the mask and the wafer prepared above. The next step S5 (assembly) is called a post-process, which is a process of forming a semiconductor chip using the wafer manufactured in step S4, and includes an assembly process (dicing, bonding), a packaging process (chip encapsulation), and the like. Including steps. In step S6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step S5 are performed. A semiconductor device is completed through these steps and shipped (step S7). The front-end process and the back-end process are performed in separate dedicated factories, and maintenance is performed for each of these factories by the remote maintenance system described above. Information for production management and device maintenance is also data-communicated between the front-end factory and the back-end factory via the Internet or the leased line network.

FIG. 15 shows the detailed flow of the wafer process. In step S11 (oxidation), the surface of the wafer is oxidized. In step S12 (CVD), an insulating film is formed on the wafer surface. In step S13 (electrode formation), electrodes are formed on the wafer by vapor deposition. Step S1
In 4 (ion implantation), ions are implanted in the wafer. In step S15 (resist process), a photosensitive agent is applied to the wafer. In step S16 (exposure), the circuit pattern of the mask is printed and exposed on the wafer by the exposure apparatus described above. In step S17 (development), the exposed wafer is developed. In step S18 (etching), parts other than the developed resist image are scraped off. In step S19 (resist peeling), the unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer.
Since the manufacturing equipment used in each process is maintained by the remote maintenance system described above, troubles can be prevented in advance, and even if troubles occur, quick recovery is possible, and Productivity can be improved.

[0044]

As described above, according to the present invention, instead of repeating the same operation at the time of adjusting work after assembling the device or at the installation at the user's place, an operation file in which the operation contents are described is written instead. By creating, selecting and executing the operation file, it is possible to perform automatic operation and reduce the load on the operator.

Further, even a person who is not skilled in the operation can perform the operation regardless of the skill of the operator, since only the operation of selecting and executing the operation file is required.

[Brief description of drawings]

FIG. 1 is a perspective view showing an overview of a semiconductor exposure apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing the internal structure of the apparatus shown in FIG.

FIG. 3 is a block diagram showing an electric circuit configuration of the apparatus shown in FIG.

FIG. 4 is a plan view of an operation file editor that edits an operation file in the apparatus shown in FIG.

5 is a diagram showing an example of an operation file created by the operation file editor of FIG.

FIG. 6 is a diagram showing a display example of an operation file selection / execution screen for selecting and executing an operation file.

FIG. 7 is a flowchart showing a procedure of automatic driving processing.

FIG. 8 is a flowchart showing the procedure of an operation file content analysis process in the automatic driving process.

FIG. 9 is a diagram showing a display example of an automatic driving process result.

FIG. 10 is a schematic diagram of a system in which a plurality of devices of the present invention and a management computer (server) are connected to a network.

FIG. 11 is a conceptual view of the semiconductor device production system viewed from an angle.

FIG. 12 is a conceptual diagram of the semiconductor device production system viewed from another angle.

FIG. 13 is a diagram showing a specific example of a user interface.

FIG. 14 is a diagram illustrating a flow of a device manufacturing process.

FIG. 15 is a diagram illustrating a wafer process.

[Explanation of symbols]

101: a temperature control chamber containing a semiconductor exposure apparatus main body,
102: EWS display device (display),
103: operation panel, 104: EWS keyboard, 1
05: Monitor TV, 106: EWS main body, 107: ON
-OFF switch, 108: emergency stop switch, 10
9: Various switches, mouse, etc. 202: Reticle, 20
3: wafer, 204: light source device, 205: illumination optical system,
206: projection lens, 207: reticle stage, 21
3: Filter box, 321: CPU body, 33
0: console unit, 331: console CPU,
332: external memory, 401: operation content classification, 402:
Various list selection buttons, 403: Condition input area, 40
4: 0K button, 410: file content display area, 4
11: scroll bar, 421: File button, 42
2: Save button, 423: Exit button, 60
1: File name display area, 602: Directory name display area, 603: Scroll bar, 61l: Exe
cute button, 612: Cancel button, 61
3: Change button, 1000: management computer (server), 1001: LAN, 1002: communication program, 1003: operation file.

Claims (13)

[Claims] 1. A storage means for storing an operation file in which operation contents are described in order, and a means for sequentially executing each processing according to each operation content described in order in the operation file, and acquired. An exposure apparatus, wherein a calculation process of numerical information, a storage process of acquired information, or a process using the acquired information can be described in the operation file. 2. The exposure apparatus according to claim 1, wherein a program for operating the exposure apparatus can be designated as the processing, and an operation command for executing the designated program can be described in the operation file. . 3. The process using the acquired information is a process of editing a parameter file including a series of control parameters for controlling the process by the program, and executing the program using the edited parameter file. The exposure apparatus according to claim 2, wherein 4. The exposure apparatus according to claim 1, wherein a control process including a determination process and a repetitive process can be described in the operation file as the process. 5. As the series of processes, a process of measuring the accuracy of the exposure apparatus after assembling, a process of calculating the measurement result to obtain a device offset, and a process of editing a parameter file using the device offset. The exposure apparatus according to any one of claims 1 to 4, wherein the operation file can describe a process of controlling a program by the edited parameter file and performing a test operation. 6. Means for connecting to a management computer or other exposure apparatus via a communication network to mutually communicate with the management computer or other exposure apparatus, and stored in the management computer or other exposure apparatus. 6. The exposure apparatus according to claim 1, wherein the processing can be executed according to the description content of the operation file. 7. A step of installing a manufacturing apparatus group for various processes including the exposure apparatus according to claim 1 in a semiconductor manufacturing factory, and a plurality of processes using the manufacturing apparatus group. And a step of manufacturing a semiconductor device. 8. A step of connecting the manufacturing device group with a local area network, and data communication of information about at least one of the manufacturing device group between the local area network and an external network outside the semiconductor manufacturing factory. The method according to claim 7, further comprising: 9. A semiconductor manufacturing factory which is different from the semiconductor manufacturing factory by accessing a database provided by a vendor or a user of the exposure apparatus via the external network to obtain maintenance information of the manufacturing apparatus by data communication. 8. The method according to claim 7, wherein production control is performed by performing data communication with the device via the external network. 10. A manufacturing apparatus group for various processes including the exposure apparatus according to claim 1, a local area network connecting the manufacturing apparatus group, and a local area network to outside the factory. A semiconductor manufacturing factory having a gateway that enables access to the external network, and capable of performing data communication of information regarding at least one of the manufacturing apparatus groups. 11. The method according to claim 1, wherein the semiconductor manufacturing factory is installed.
7. The exposure apparatus maintenance method according to any one of claims 6 to 6, wherein the exposure apparatus vendor or user provides a maintenance database connected to an external network of the semiconductor manufacturing factory, and the semiconductor manufacturing factory. A step of permitting access to the maintenance database from the inside via the external network; and a step of transmitting the maintenance information accumulated in the maintenance database to the semiconductor manufacturing factory side via the external network. Maintenance method for semiconductor manufacturing equipment. 12. The exposure apparatus according to claim 1, further comprising a display, a network interface, and a computer that executes network software, and maintenance information for the exposure apparatus is stored in a computer network. An exposure apparatus that enables data communication via the. 13. The network software comprises:
A user interface for accessing a maintenance database provided by a vendor or a user of the exposure apparatus, which is connected to an external network of a factory in which the exposure apparatus is installed, is provided on the display, and from the database via the external network. Device according to claim 12, which makes it possible to obtain information.