JP2003004700A - Chip for cataphoresis - Google Patents
Chip for cataphoresisInfo
- Publication number
- JP2003004700A JP2003004700A JP2001189340A JP2001189340A JP2003004700A JP 2003004700 A JP2003004700 A JP 2003004700A JP 2001189340 A JP2001189340 A JP 2001189340A JP 2001189340 A JP2001189340 A JP 2001189340A JP 2003004700 A JP2003004700 A JP 2003004700A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- molded body
- shaped member
- chip
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Optical Measuring Cells (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、流体物質混合物を
キャピラリー内で泳動分離するために利用される電気泳
動用チップに関する。TECHNICAL FIELD The present invention relates to an electrophoretic chip used for electrophoretic separation of a mixture of fluid substances in a capillary.
【０００２】[0002]
【従来の技術】生体物質である極微量の核酸やタンパク
質あるいはその他の低分子物質を分離同定する手法とし
て、キャピラリー電気泳動法がある。これは、内径が１
００ミクロン以下程度のガラスキャピラリーを用い、こ
の中に電気泳動用バッファと分子ふるい用のポリマを充
填し、キャピラリーの一端に混合試料を導入した後、そ
の両端に高電圧を印加して試料をキャピラリー内で移動
させ、その電荷や分子量の差などにより分離し、これを
ＵＶ吸収や蛍光等により検出するものである。このキャ
ピラリー電気泳動法は、長所として、（１）必要試料量
が極微量で済む、（２）分離特性に優れる、（３）高速
分離が可能、（４）様々の分離モードにより幅広い試料
分析に対応可能、等が挙げられる。キャピラリー装置に
使用する、従来のキャピラリーは内径が１００ミクロン
以下程度のファイバー状であったため、その強度は非常
に低く、キャピラリーの交換等の作業時は、極めて取り
扱いにくいものであった。また、複数回キャピラリーを
使用するためには、その度に洗浄する必要もあり、分析
方法としてはユーザの簡便性の面でも問題があった。2. Description of the Related Art Capillary electrophoresis is known as a method for separating and identifying a very small amount of nucleic acid, protein or other low molecular weight substance which is a biological substance. It has an inner diameter of 1
Use a glass capillary of about 100 microns or less, fill it with a buffer for electrophoresis and a polymer for molecular sieving, introduce the mixed sample into one end of the capillary, and then apply a high voltage to both ends of the capillary to sample the sample. It is moved inside, separated by the difference in its charge or molecular weight, and detected by UV absorption or fluorescence. This capillary electrophoresis method has the advantages that (1) a small amount of sample is required, (2) excellent separation characteristics, (3) high-speed separation is possible, and (4) various separation modes enable analysis of a wide range of samples. Available, etc. The conventional capillary used for the capillary device has a fiber shape with an inner diameter of about 100 μm or less, so its strength is very low and it is extremely difficult to handle when replacing the capillary. Further, in order to use the capillary a plurality of times, it is necessary to wash each time, and there is a problem in terms of user convenience as an analysis method.
【０００３】これに対し、キャピラリー電気泳動法の概
念をさらに推し進めた一般に‘マイクロチップケミスト
リー’と呼ばれる手法が提案されている（Ｄ．Ｊ．Ｈａ
ｒｒｉｓｏｎ ｅｔ ａｌ．：Ａｎａｌ．Ｃｈｅｍ．１
９９２ ６４，１９２６−１９３２）。これは、ガラス
基板上に微細溝を造り、この基板面に他の基板を貼り合
わせることによりキャピラリーを形成し、この流路中で
キャピラリー電気泳動を行うというものである。このキ
ャピラリーを内在したガラス基板を貼り合わせたもの
が、マイクロチップと呼ばれている。構造としては、前
記キャピラリー部の端部には、上記のバッファやポリマ
を供給するための液溜め部を有する。また、樹脂製のマ
イクロチップも提案されている。On the other hand, a method generally called "microchip chemistry" has been proposed which further advances the concept of the capillary electrophoresis method (DJ Ha.
rrison et al. : Anal. Chem. 1
992 64, 1926-1932). In this method, a micro groove is formed on a glass substrate, another substrate is attached to the surface of this substrate to form a capillary, and capillary electrophoresis is performed in this channel. The one obtained by bonding glass substrates having the capillaries therein is called a microchip. As a structure, a liquid reservoir for supplying the above-mentioned buffer or polymer is provided at an end of the capillary portion. Also, a resin-made microchip has been proposed.
【０００４】[0004]
【発明が解決しようとする課題】上記のマイクロチップ
ケミストリーという手法では、キャピラリーがマイクロ
チップ内に形成されたことで、取り扱い性や分析速度
は、従来のキャピラリー電気泳動法に比べ大きく改善さ
れたが、更なる高機能化、取り扱い性改善が望まれてい
る。即ち、より多くの分析ができたり、より多くの機能
が集約でき、且つ、取り扱い性が良い物でなくてはなら
ない。このことからまず第１に、チップはより多くのサ
ンプルを効率的に供給、電気印加、検出できる必要か
ら、大きなサイズにも対応できる必要がある。ところ
が、基板の大サイズ化は種々の問題がある。１つはチッ
プの精度の問題である。このマイクロチップにおける分
析対象物は、光照射及び光検出手段を用いて分析される
ものであり、分析対象部の位置精度は高精度が要求され
る。前記の光照射、光検出手段の形態にもよるが、高感
度の要求から集光手段を用いることが多く、特に焦点深
度は０．１ｍｍ程度以下に抑えなければ十分な分析が困
難となる。このため、チップは、大サイズでも検出位置
における焦点方向精度が０．１ｍｍ以下を満足する必要
があるが、例えば、１００ｍｍ角程度のサイズで、そり
を含めた焦点深度方向精度を０．１ｍｍに抑えること
は、樹脂材料では困難となる。２つ目の問題は、加工性
の問題である。これは特に、ガラス製のチップの場合に
問題となる。流体用管路形成のためにガラスを貼り合わ
せる場合には、全体に渡り均一な面圧で加圧し、貼り合
わせることができずに、エアを巻き込む等の問題が発生
し、大サイズ化が困難となる。即ち、ガラスとガラスを
貼り付ける場合には、ガラスの剛性が高いために相互の
平面が馴染まず、ある程度の面積を超えると部分的な密
着の欠陥が発生してしまう。例えば、１ｍｍ厚みのガラ
ス同士を貼り付ける場合は、３〜４ｃｍ角以上の面積で
は欠陥が生じ易く、このサイズのチップは加工性が極め
て悪いことになる。このように大サイズ化は、要求があ
りながらも問題があった。次に、第２の要求として、チ
ップの液溜め部の仕様の自由度が挙げられる。チップと
しては、多くのサンプルや多くの機能を搭載させたい
為、液溜め部に関してはサイズ、形成、配置等の適正化
が要求されるもので、例えば、液溜め部の液量は、蒸発
の考慮からある程度の液量が欲しい、一方で分析流路の
稠密度を上げるために各溝は近接させたい為、液溜め部
も面積を小さくしたい、或いは液溜め部は一括で複数箇
所注入できるように所定のピッチでライン状に並べたい
等の要求がある。ところが、これを満足するために基板
の板厚を厚くしたり、基板にボス状形成を追加すること
には問題があった。厚肉化した場合は、ガラス製基板の
場合は、さらに剛性が上がるため、前述した理由で流体
管路形成のための貼り合わせ加工の大サイズ化がより難
しくなり、樹脂製基板の場合は、成形収縮変形のために
平面度が悪化し、貼り合わせ加工がやはり困難となる場
合が発生する。又、基板にボス形状が追加され平面状で
なくなる場合は、加圧が均一にできにくくなり、貼り合
わせ加工が困難となるのは明らかである。In the above-mentioned method called microchip chemistry, although the capillaries are formed in the microchip, the handling property and the analysis speed are greatly improved as compared with the conventional capillary electrophoresis method. Therefore, further enhancement of functionality and improvement of handling are desired. That is, it must be capable of performing more analysis, consolidating more functions, and being easy to handle. From this, first of all, the chip needs to be able to efficiently supply, electrically apply, and detect a larger amount of sample, and therefore, need to be able to handle a large size. However, increasing the size of the substrate has various problems. One is the problem of chip accuracy. The object to be analyzed in this microchip is analyzed by using light irradiation and light detection means, and the position accuracy of the object to be analyzed is required to be high. Although it depends on the form of the light irradiation and light detecting means, a light collecting means is often used because of the requirement of high sensitivity, and in particular, sufficient analysis becomes difficult unless the depth of focus is suppressed to about 0.1 mm or less. Therefore, even if the chip has a large size, the accuracy in the focal direction at the detection position needs to satisfy 0.1 mm or less. For example, if the size is about 100 mm square, the accuracy in the depth direction including the warp is 0.1 mm. Suppression is difficult with resin materials. The second problem is the problem of workability. This is especially a problem with glass chips. When glass is bonded to form a fluid conduit, it is difficult to increase the size due to problems such as air entrapment that cannot be bonded by applying uniform surface pressure over the entire glass. Becomes That is, when the glass and the glass are attached to each other, the mutual flatness of the surfaces does not fit due to the high rigidity of the glass, and if a certain area is exceeded, a partial adhesion defect occurs. For example, when glass with a thickness of 1 mm is attached to each other, defects are likely to occur in an area of 3 to 4 cm square or more, and chips of this size have extremely poor workability. As described above, there is a problem in increasing the size, although there is a demand. Next, the second requirement is the degree of freedom in the specifications of the liquid reservoir of the chip. Since it is desired to mount many samples and many functions as a chip, it is necessary to optimize the size, formation, arrangement, etc. of the liquid reservoir, and for example, the amount of liquid in the liquid reservoir is Considering this, we want a certain amount of liquid, but we also want the grooves to be close to each other in order to increase the density of the analysis channel, so we want to reduce the area of the liquid reservoir, or we can inject multiple liquid reservoirs at once. There is a demand to line up at a predetermined pitch. However, there is a problem in increasing the thickness of the substrate or adding a boss-like formation to the substrate in order to satisfy this. When the thickness is increased, the rigidity is further increased in the case of a glass substrate, and thus it becomes more difficult to increase the size of the bonding process for forming the fluid conduit due to the reason described above, and in the case of a resin substrate, The flatness is deteriorated due to the molding shrinkage deformation, and the bonding process may be difficult. Further, if the substrate is not flat due to the addition of the boss shape, it is difficult to uniformly apply pressure, and it becomes apparent that the bonding process becomes difficult.
【０００５】本発明は、かかる状況に鑑みなされたもの
で、より多くの分析ができたり、より多くの機能が集約
でき、且つ、取り扱い性を良くするために必要な大サイ
ズ化と液溜め部の自由度の向上を可能にしたチップを提
供することを目的とする。The present invention has been made in view of the above situation, and it is possible to carry out more analysis and aggregate more functions, and to increase the size and the liquid reservoir required for better handling. It is an object of the present invention to provide a chip capable of improving the degree of freedom of.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決するた
め、請求項１の発明に係る電気泳動用チップは、板厚方
向に開口した２個以上の貫通孔と少なくとも一方の面に
形成される前記貫通孔を連結する１個以上の溝を有する
板状部材と、該板状部材の溝形成面に接合されたシール
部材と、前記貫通孔の周りの板状部材面に当接する開口
部を有する成形体とを備え、前記成形体を板状部材又は
板状部材及びシール部材の隅部に接合させたことを特徴
とする。請求項２の発明は、請求項１の発明において、
板状部材及びシール部材が樹脂製であることを特徴とす
る。請求項３の発明は、請求項１又は２の発明におい
て、成形体が樹脂製であることを特徴とする。請求項４
の発明は、請求項１〜３のいずれかの発明において、成
形体の接合が接着剤によりなされることを特徴とする。
請求項５の発明は、請求項１〜４のいずれかの発明にお
いて、板状部材及び／又はシール部材の開口部周りに電
極及び回路を形成した後に、成形体を接合させているこ
とを特徴とする。In order to solve the above problems, the electrophoresis chip according to the invention of claim 1 is formed on at least one surface and two or more through holes opened in the plate thickness direction. A plate member having one or more grooves connecting the through holes, a seal member joined to the groove forming surface of the plate member, and an opening portion abutting the plate member surface around the through hole. And a molded body having the molded body, wherein the molded body is joined to a corner of the plate-shaped member or the plate-shaped member and the seal member. The invention of claim 2 is the same as the invention of claim 1,
The plate-shaped member and the seal member are made of resin. The invention of claim 3 is characterized in that, in the invention of claim 1 or 2, the molded body is made of resin. Claim 4
The invention of, in any one of claims 1 to 3, is characterized in that the molded body is bonded by an adhesive.
According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the molded body is joined after the electrode and the circuit are formed around the opening of the plate member and / or the seal member. And
【０００７】[0007]
【発明の実施の形態】まず、本発明の構成について説明
する。板状部材は、板厚方向に貫通した孔と貫通孔を連
結する溝を有する可撓性の部材である。金型を用い、射
出成形や注入成形、プレス成形などの生産性の高い工法
を適用することで寸法、形状共に再現性が高い上記板状
部材が得られる。他に機械加工でも同様の板状部材を形
成することができる。貫通穴は、バッファやポリマの液
溜め部及び／又は液溜め部と溝部の中継部となるが、液
溜め部には、常に溝の両端に電極部として必要なことか
ら、板厚方向に貫通した２個以上の孔が必要となる。一
方、溝の形状は分析の精度、形態により任意に設計でき
る。例えば、溝は複数の溝を交叉させて設けるか、或い
は平行に設ける。構成としては、板状部材の一方の面に
形状される貫通孔を連結する１個以上の溝が必要であ
る。ここで使用される材料は、ＵＶ吸収や蛍光等により
検出することを考慮し、透明材料が用いられているが、
特にこれに限定されない。更に、撓み性が得られるに十
分な形態で成形可能なものであれば好ましい。例えば、
注型可能なガラス、熱硬化性、熱可塑性樹脂材料等があ
る。特に、樹脂材料は、可撓性の面と生産性の面から有
効であり、例えばポリメチルメタクリレート、ポリカー
ボネート、ナイロン６、ナイロン６６、ポリエチレンテ
レフタレート、ポリスチレン等が挙げられる。一方、本
発明のチップは、生産性が高く化学的検体を扱うため
に、使い捨て製品として使用されることも考えられ、生
分解性プラスチックであることも好ましい。尚、樹脂製
の場合、板厚は０．３ｍｍ程度〜１．５ｍｍ程度が好ま
しい。DETAILED DESCRIPTION OF THE INVENTION First, the structure of the present invention will be described. The plate member is a flexible member having a hole penetrating in the plate thickness direction and a groove connecting the through hole. The plate member having high reproducibility in size and shape can be obtained by applying a highly productive method such as injection molding, injection molding or press molding using a mold. Alternatively, the same plate-shaped member can be formed by machining. The through-hole serves as a buffer or polymer reservoir and / or a relay between the reservoir and the groove. Since the reservoir is always required as an electrode at both ends of the groove, it penetrates in the plate thickness direction. Two or more holes are required. On the other hand, the shape of the groove can be arbitrarily designed depending on the accuracy and form of analysis. For example, the groove is provided by crossing a plurality of grooves or provided in parallel. The structure requires one or more grooves for connecting the through holes formed on one surface of the plate member. The material used here is a transparent material in consideration of detection by UV absorption, fluorescence, etc.
It is not particularly limited to this. Furthermore, it is preferable that it can be molded in a form sufficient to obtain flexibility. For example,
Castable glass, thermosetting and thermoplastic resin materials are available. In particular, the resin material is effective in terms of flexibility and productivity, and examples thereof include polymethyl methacrylate, polycarbonate, nylon 6, nylon 66, polyethylene terephthalate, and polystyrene. On the other hand, the chip of the present invention may be used as a disposable product because it has high productivity and handles chemical specimens, and is preferably biodegradable plastic. In the case of resin, the plate thickness is preferably about 0.3 mm to 1.5 mm.
【０００８】次に、シール部材となる透明成形品を板状
部材の溝が形成されている面に接合させる。これにより
前記溝は、キャピラリーを形成する。ここで、シール部
材を接合させる方法としては、機械的に対向する面を圧
接させるように接合させる方法、接着剤を用いる方法、
熱融着による方法等があるが、いずれにしてもシール部
材は、可撓性を持つもので、板状部材と接合されキャピ
ラリーを形成したものが可撓性を持つことが必要であ
る。この可撓性は、チップのそりを外部からの軽い押圧
で無くすことができるようにするために必要であり、検
出位置における焦点方向精度を０．１ｍｍ以下に保つこ
とを容易にする。勿論、大サイズ化においては非常に有
効な特性である。尚、板状部材に設ける貫通孔は、後述
の成形体の接合位置と関係があり、検出位置において十
分に可撓性を持てるように、検出位置からある程度離れ
て設けられる必要がある。同時に貫通孔は、板状部材の
隅部に寄せて設ける必要があるが、一般的に貫通孔は電
気泳動の液溜め部、かつ電極部であり、隅部に寄せるこ
とは容易である。ここで、板状部材の隅部とは、上記検
出位置から板状部材の外周に向かう範囲である。シール
部材の材料としては、樹脂材料であることが好ましい。
接合方法にもよるが、板状部材と同様の材料が好まし
い。尚、板状部材とシール部材を熱融着させる方法にお
いては、フィルムが最適である。フィルムは薄くするこ
とで低い熱量で熱融着でき、しかも低熱量であるために
接合時に溝を変形させることもない。また、蛍光、ＵＶ
吸光による検出時のノイズが小さいといった理由から
も、フィルムであることが好ましい。Next, a transparent molded product to be a sealing member is bonded to the surface of the plate-shaped member on which the groove is formed. Thereby, the groove forms a capillary. Here, as a method of joining the seal members, a method of joining so as to press-contact mechanically opposed surfaces, a method of using an adhesive,
There is a method such as heat fusion, but in any case, the seal member is flexible, and it is necessary that the seal member joined to the plate member to form a capillary has flexibility. This flexibility is necessary so that the warp of the chip can be eliminated by a light pressure from the outside, and it is easy to keep the accuracy of the focus direction at the detection position at 0.1 mm or less. Of course, it is a very effective characteristic in increasing the size. The through-hole provided in the plate-shaped member is related to the joining position of the molded body described later, and needs to be provided at some distance from the detection position so as to have sufficient flexibility at the detection position. At the same time, the through-holes need to be provided close to the corners of the plate-shaped member, but generally the through-holes are the electrophoretic liquid storage section and the electrode section, and it is easy to get close to the corners. Here, the corner of the plate-shaped member is a range from the detection position toward the outer periphery of the plate-shaped member. The material of the seal member is preferably a resin material.
Although it depends on the joining method, the same material as the plate-like member is preferable. A film is most suitable for the method of heat-sealing the plate member and the seal member. By making the film thin, it can be heat-sealed with a low amount of heat, and since the amount of heat is low, the groove is not deformed at the time of joining. Also, fluorescence, UV
The film is preferable because the noise at the time of detection by absorption of light is small.
【０００９】次に、板状部材に電気泳動時の電極又は電
極及び回路を形成する場合について説明する。電気泳動
に必要な電極は、直接液溜め部に測定装置の電極端子を
挿入する方法もあるが、予めチップ上に液体と接触する
電極又は電極及び回路を設けておき、測定装置との接触
は、電気端子上で行うことができる。これは、直接端子
を液体に接触させることによる汚れ又は洗浄の工数を避
ける利点がある。電極又は電極及び回路の形成は、前述
のシール部材を接合する前に行う場合と、後述の成形体
を接合する前に行う場合がある。成形体を接合する前に
電極及び回路を形成すると、平面上の形成で液体との接
触が得られる為、信頼性が向上される。また、基板とな
る部材は、絶縁性や回路の形成法の自由度から樹脂製で
あることが好ましい。特に、装置の電極との接触におい
ては、基板となる板状部材が樹脂製である場合は、弾力
性があるために接触面積が面圧により確保でき、ガラス
基板より有利な電気条件となり好ましい。回路形成法と
しては、従来から有る種々の工法が適用できる。例え
ば、メッキ工法は、板状部材が透明樹脂の場合は、薬液
に対する保護等の面で難がある。また、印刷工法は生産
性の面で有効である。構造的に液溜め部の内面に回路を
形成する場合には、スパッタリング又はイオンプレーテ
ィングが有効である。ここで、電極の材質は、液による
腐食等で接触電気抵抗が変化すると、泳動条件に悪影響
を及ぼすため、耐食性の良い金属が望ましい。Next, the case where electrodes or electrodes and circuits for electrophoresis are formed on the plate member will be described. For electrodes required for electrophoresis, there is also a method of inserting the electrode terminals of the measuring device directly into the liquid reservoir, but electrodes or electrodes and circuits that come into contact with the liquid are provided in advance on the chip, and contact with the measuring device is not provided. , Can be done on electrical terminals. This has the advantage of avoiding stains or man-hours for cleaning by directly contacting the terminals with the liquid. The formation of the electrode or the electrode and the circuit may be carried out before joining the above-mentioned seal member or before joining the below-mentioned molded body. If the electrodes and circuits are formed before joining the molded bodies, the contact with the liquid can be obtained by forming on the plane, so that the reliability is improved. Further, it is preferable that the member to be the substrate is made of resin in view of the insulating property and the degree of freedom of the circuit forming method. In particular, when the plate-shaped member serving as the substrate is made of resin in contact with the electrodes of the device, the contact area can be secured by the surface pressure because of elasticity, and it is preferable because the electrical condition is more advantageous than that of the glass substrate. As a circuit forming method, various conventional construction methods can be applied. For example, the plating method is difficult in terms of protection against chemicals when the plate-shaped member is made of transparent resin. The printing method is effective in terms of productivity. When structurally forming a circuit on the inner surface of the liquid reservoir, sputtering or ion plating is effective. Here, the material of the electrode is preferably a metal having good corrosion resistance, because if the contact electric resistance changes due to corrosion by a liquid or the like, the migration conditions are adversely affected.
【００１０】開口された貫通孔の周りの板状部材面に当
接する開口部を有する成形体を板状部材又は板状部材及
びシール部材の隅部に接合させる。成形体は、板状部材
に設けられた液溜め部を量的に補足するのみでなく、配
置的にも液の供給や測定装置の電極に対し適切に設定す
ることができるように、貫通孔だけでなく凹み形状を持
ってもよい成形体である。そして、成形体は、板状部材
又は板状部材及びシール部材の隅部に接合されること
で、板状部材及びシール部材の持つ可撓性を損ねること
がない。成形体と板状部材又は板状部材及びシール部材
の接合は、板状部材及びシール部材の接合と同様に種々
の工法がある。両者間の液体流動時に洩れが発生しない
十分な接合を得るためには、立体形状である成形体のひ
け等の平面度悪化も考慮し、接着剤を使用する工法が好
ましい。さらに、板状部材上に電極及び回路が設けられ
ている場合は、より接着剤を使用する工法が好ましい。
接着剤は、接着する部材に合わせて選択されるべきもの
であるが、特に限定されるものではない。A molded body having an opening that abuts the surface of the plate member around the opened through hole is joined to the plate member or the corners of the plate member and the seal member. The formed body not only quantitatively supplements the liquid reservoir provided on the plate-shaped member, but also can be set appropriately for the liquid supply and the electrode of the measuring device in terms of placement. Not only is it a molded product that may have a concave shape. The molded body is joined to the corners of the plate-shaped member or the plate-shaped member and the seal member, so that the flexibility of the plate-shaped member and the seal member is not impaired. There are various methods for joining the molded body and the plate-shaped member or the plate-shaped member and the seal member, as in the case of joining the plate-shaped member and the seal member. In order to obtain a sufficient joint that does not cause leakage when the liquid flows between the two, a method using an adhesive is preferable in consideration of deterioration of flatness such as sink marks of a three-dimensional molded body. Furthermore, when electrodes and circuits are provided on the plate-shaped member, a construction method using an adhesive is more preferable.
The adhesive should be selected according to the members to be bonded, but is not particularly limited.
【００１１】[0011]
【発明の実施の形態】以下、本発明を実施例に基づいて
詳しく説明するが、本発明はこれに限定されるものでは
ない。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail based on Examples, but the present invention is not limited thereto.
【００１２】（実施例１）図１〜図３は、本発明の実施
例１の構成を示すもので、図１は板状部材の斜視図、図
２は成形体の斜視図、図３はチップの断面図である。板
状部材１は透明樹脂材料による射出成形した。成形品は
外形が５０ｍｍ×１００ｍｍ×１ｔの形状とし、片側表
面には幅が１００μｍ、深さが３０μｍの溝３を設ける
と共に、直径２ｍｍの貫通穴が検出部から２０ｍｍ以上
離れた隅部に設けられている。射出成形は、以下の条件
で実施した。
成形機 ：５０トン射出成形機
使用材料：ＰＭＭＡ
成形温度：２４０℃
射出圧力：４００ｋｇ／ｃｍ2
次に、板状部材１の溝３がある平面側に、ＰＭＭＡ製の
５０μｍフィルム（シール部材）２を熱融着させる。融
着条件は以下の通り。
プレス圧：１ｋｇ／ｃｍ2
温度 ：１０４℃
次に、得られた貼り付け品の板状部材１の隅部には、図
３に示すように貫通孔４の周りの板状部材１面に当接す
る開口部７を持つ成形体５を酢酸ビニル−エチレン系接
着剤６で接着する。これにより、成形体５の開口部８が
注入口として、液体を溝部に供給することができるよう
構成される。以上によりキャピラリー電気泳動が可能な
チップ１３が得られる。このチップ１３は、必要な電解
液及びサンプルを充填した後、電気泳動用装置の所定の
位置にセットされ、装置に用意された電極を開口部８か
ら接触させることで、容易に分析を行うことができる。(Embodiment 1) FIGS. 1 to 3 show the structure of Embodiment 1 of the present invention. FIG. 1 is a perspective view of a plate member, FIG. 2 is a perspective view of a molded body, and FIG. It is sectional drawing of a chip. The plate member 1 was injection-molded with a transparent resin material. The molded product has an outer shape of 50 mm × 100 mm × 1 t, and a groove 3 having a width of 100 μm and a depth of 30 μm is provided on one surface, and a through hole having a diameter of 2 mm is provided at a corner 20 mm or more away from the detecting portion. Has been. The injection molding was carried out under the following conditions. Molding machine: 50-ton injection molding machine Material used: PMMA Molding temperature: 240 ° C. Injection pressure: 400 kg / cm 2 Next, a 50 μm film (seal member) 2 made of PMMA on the flat side where the groove 3 of the plate-shaped member 1 is present. Heat seal. The fusion conditions are as follows. Pressing pressure: 1 kg / cm 2 Temperature: 104 ° C. Next, at the corner of the plate-shaped member 1 of the obtained bonded product, as shown in FIG. The molded body 5 having the contacting opening 7 is bonded with a vinyl acetate-ethylene adhesive 6. Thus, the opening 8 of the molded body 5 serves as an injection port, and the liquid can be supplied to the groove. As described above, the chip 13 capable of performing capillary electrophoresis is obtained. The chip 13 is set at a predetermined position of the electrophoresis apparatus after being filled with the necessary electrolytic solution and sample, and the electrode prepared in the apparatus is brought into contact with the opening 8 to facilitate the analysis. You can
【００１３】（実施例２）図４〜図７は、本発明の実施
例２の構成を示すもので、図４は板状部材の斜視図、図
５は成形体の斜視図、図６は電極及び回路を示す図、図
７はチップの断面図である。実施例１と同様にして板状
部材９とシール部材２を接合させた後、板状部材９側の
面には白金のスパッタリングにより電極１２及び回路１
１を形成する。ここで、シール部材２には予め電極１２
及び回路１１を形成しておき、その後に板状部材９とシ
ール部材２を接合させることもできる。板状部材９の隅
部には貫通孔４の周りの板状部材９面に当接する接着側
開口部７を持つ成形体１０を、酢酸ビニル−エチレン系
接着剤６で接着する。これにより、成形体１０の開口部
８が注入口として、液体を溝部３に供給することができ
るよう構成される。以上によりキャピラリー電気泳動が
可能なチップ１４が得られた。このチップ１４は、必要
な電解液及びサンプルを充填した後、電気泳動用装置の
所定の位置にセットされ、装置に用意された電極を、板
状部材９上の電極１２と接触させることで、容易に分析
を行うことができる。(Embodiment 2) FIGS. 4 to 7 show the structure of Embodiment 2 of the present invention. FIG. 4 is a perspective view of a plate member, FIG. 5 is a perspective view of a molded body, and FIG. FIG. 7 is a diagram showing electrodes and circuits, and FIG. 7 is a sectional view of a chip. After joining the plate member 9 and the seal member 2 in the same manner as in Example 1, the electrode 12 and the circuit 1 are formed on the plate member 9 side surface by platinum sputtering.
1 is formed. Here, the electrode 12 is previously attached to the seal member 2.
It is also possible to form the circuit 11 and the circuit 11 and then to join the plate member 9 and the seal member 2 together. At the corners of the plate-shaped member 9, a molded body 10 having a bonding-side opening 7 that abuts the surface of the plate-shaped member 9 around the through hole 4 is bonded with a vinyl acetate-ethylene adhesive 6. As a result, the opening 8 of the molded body 10 serves as an injection port so that the liquid can be supplied to the groove 3. As described above, the chip 14 capable of performing capillary electrophoresis was obtained. This chip 14 is set at a predetermined position of the electrophoresis device after filling the necessary electrolyte and sample, and the electrode prepared in the device is brought into contact with the electrode 12 on the plate-shaped member 9, The analysis can be done easily.
【００１４】（実施例３）図８は、本発明の実施例３の
成形体の開口部を通る断面を示す斜視図、図９は成形体
の背面側の斜視図である。成形体１０には、板状部材１
の複数の貫通穴４をつなぐ複数の開口部８が形成されて
おり、板状部材１との当接面には貫通孔４同士をつなぐ
ための凹部１５が形成されている。これにより、成形体
１０の開口部８が注入口として、液体を溝部３に供給す
ることができるよう構成され、実施例１及び実施例２と
同様のチップが得られる。(Embodiment 3) FIG. 8 is a perspective view showing a cross section passing through an opening of a molded article of Example 3 of the present invention, and FIG. 9 is a perspective view of the rear surface side of the molded article. The molded body 10 includes a plate-shaped member 1
A plurality of openings 8 that connect the plurality of through holes 4 are formed, and a recess 15 that connects the through holes 4 to each other is formed on the contact surface with the plate member 1. As a result, the opening 8 of the molded body 10 serves as an injection port so that the liquid can be supplied to the groove 3, and the same chips as those of the first and second embodiments can be obtained.
【００１５】[0015]
【発明の効果】本発明によれば、チップが板状部材とシ
ール部材からなり、かつ隅部に成形体が設けられている
ので、チップとしての撓み性と液溜め部の仕様自由度を
合わせ持つことができるようになる。これによりチップ
の大サイズ化が可能となり、かつ液溜め部及び電極部の
自由度が向上し、高機能化ができ、取り扱い性の良い電
気泳動用チップを提供することができる。According to the present invention, since the chip is composed of the plate member and the seal member and the molded body is provided at the corner, the flexibility as the chip and the degree of freedom of specification of the liquid reservoir are matched. You will be able to have it. As a result, the size of the chip can be increased, the degree of freedom of the liquid reservoir portion and the electrode portion can be improved, the function can be enhanced, and the electrophoresis chip having good handleability can be provided.
【図１】本発明の実施例１の板状部材を示す斜視図であ
る。FIG. 1 is a perspective view showing a plate-shaped member according to a first embodiment of the present invention.
【図２】本発明の実施例１の成形体を示す斜視図であ
る。FIG. 2 is a perspective view showing a molded body of Example 1 of the present invention.
【図３】本発明の実施例１のチップの断面図である。FIG. 3 is a cross-sectional view of the chip of Example 1 of the present invention.
【図４】本発明の実施例２の板状部材を示す斜視図であ
る。FIG. 4 is a perspective view showing a plate-shaped member of Example 2 of the present invention.
【図５】本発明の実施例２の成形体を示す斜視図であ
る。FIG. 5 is a perspective view showing a molded body of Example 2 of the present invention.
【図６】本発明の実施例２の回路及び電極を示す図であ
る。FIG. 6 is a diagram showing a circuit and electrodes of Example 2 of the present invention.
【図７】本発明の実施例２のチップの断面図である。FIG. 7 is a cross-sectional view of a chip of Example 2 of the present invention.
【図８】本発明の実施例３の成形体の開口部を通る断面
を示す斜視図である。FIG. 8 is a perspective view showing a cross section passing through an opening of a molded body of Example 3 of the present invention.
【図９】本発明の実施例３の成形体の背面側から見た斜
視図である。FIG. 9 is a perspective view of a molded body of Example 3 of the present invention viewed from the back side.
１…板状部材、２…シール部材、３…溝、４…貫通孔、
５…成形体、６…接着剤、７…成形体の開口部（接着
剤）、８…成形体の開口部（注入側）、９…板状部材、
１０…成形体、１１…回路、１２…電極、１３，１４…
チップ。1 ... Plate-shaped member, 2 ... Seal member, 3 ... Groove, 4 ... Through hole,
5 ... Molded body, 6 ... Adhesive agent, 7 ... Molded body opening (adhesive), 8 ... Molded body opening (injection side), 9 ... Plate-shaped member,
10 ... Molded body, 11 ... Circuit, 12 ... Electrode, 13, 14 ...
Chips.
Claims (5)
なくとも一方の面に形成される前記貫通孔を連結する１
個以上の溝を有する板状部材と、 該板状部材の溝形成面に接合されたシール部材と、 前記貫通孔の周りの板状部材面に当接する開口部を有す
る成形体と、を備え、 前記成形体を板状部材又は板状部材及びシール部材の隅
部に接合させたことを特徴とする電気泳動用チップ。1. A connection 1 for connecting two or more through-holes opened in the plate thickness direction and the through-holes formed on at least one surface.
A plate-shaped member having at least one groove; a seal member joined to the groove-forming surface of the plate-shaped member; and a molded body having an opening that abuts the plate-shaped member surface around the through hole. A chip for electrophoresis, wherein the molded body is bonded to a plate-shaped member or a corner of the plate-shaped member and a sealing member.
ることを特徴とする請求項１に記載の電気泳動用チッ
プ。2. The electrophoresis chip according to claim 1, wherein the plate-shaped member and the sealing member are made of resin.
る請求項１又は請求項２に記載の電気泳動用チップ。3. The electrophoresis chip according to claim 1, wherein the molded body is made of resin.
ことを特徴とする請求項１〜３のいずれかに記載の電気
泳動用チップ。4. The electrophoresis chip according to any one of claims 1 to 3, wherein the molded body is bonded with an adhesive.
りに電極及び回路を形成した後に、成形体を接合させて
いることを特徴とする請求項１〜４のいずれかに記載の
チップ。5. The chip according to any one of claims 1 to 4, wherein the molded body is bonded after the electrodes and the circuits are formed around the openings of the plate member and / or the seal member. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001189340A JP2003004700A (en) | 2001-06-22 | 2001-06-22 | Chip for cataphoresis |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001189340A JP2003004700A (en) | 2001-06-22 | 2001-06-22 | Chip for cataphoresis |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003004700A true JP2003004700A (en) | 2003-01-08 |
Family
ID=19028281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001189340A Pending JP2003004700A (en) | 2001-06-22 | 2001-06-22 | Chip for cataphoresis |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003004700A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009109240A (en) * | 2007-10-26 | 2009-05-21 | Shimadzu Corp | Chip for electrophoresis, kit of chip for electrophoresis, and method of manufacturing chip for electrophoresis |
| JPWO2007138654A1 (en) * | 2006-05-26 | 2009-10-01 | 株式会社島津製作所 | Electrophoresis pretreatment method, analysis substrate and electrophoresis pretreatment apparatus |
| JP2010014437A (en) * | 2008-07-01 | 2010-01-21 | Enplas Corp | Fluid handling device |
| US7785533B2 (en) | 2003-09-12 | 2010-08-31 | Nec Corporation | Chip, device using the chip, and method of using the same |
| EP2269800A1 (en) * | 2008-03-28 | 2011-01-05 | Konica Minolta Opto, Inc. | Injection molding method and injection molding die |
| EP2312321A1 (en) * | 2008-08-08 | 2011-04-20 | Konica Minolta Opto, Inc. | Microchip and process for producing microchip |
| US8524173B2 (en) | 2006-09-01 | 2013-09-03 | Tosoh Corporation | Microchannel structure and fine-particle production method using the same |
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| JP2000310614A (en) * | 1999-02-26 | 2000-11-07 | Hitachi Chem Co Ltd | Chip for electrophoresis, its manufacture, and electrophoresis device and chargeable material separating method using the same |
| JP2001088098A (en) * | 1999-09-14 | 2001-04-03 | Kawamura Inst Of Chem Res | Micro chemical device with depressurized liquid feeding mechanism |
| JP2001108655A (en) * | 1999-10-14 | 2001-04-20 | Nippon Telegr & Teleph Corp <Ntt> | Electrochemical detector for capillary electrophoresis and its manufacture |
-
2001
- 2001-06-22 JP JP2001189340A patent/JP2003004700A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000310614A (en) * | 1999-02-26 | 2000-11-07 | Hitachi Chem Co Ltd | Chip for electrophoresis, its manufacture, and electrophoresis device and chargeable material separating method using the same |
| JP2001088098A (en) * | 1999-09-14 | 2001-04-03 | Kawamura Inst Of Chem Res | Micro chemical device with depressurized liquid feeding mechanism |
| JP2001108655A (en) * | 1999-10-14 | 2001-04-20 | Nippon Telegr & Teleph Corp <Ntt> | Electrochemical detector for capillary electrophoresis and its manufacture |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7785533B2 (en) | 2003-09-12 | 2010-08-31 | Nec Corporation | Chip, device using the chip, and method of using the same |
| JP4692628B2 (en) * | 2006-05-26 | 2011-06-01 | 株式会社島津製作所 | Electrophoresis pretreatment method and electrophoresis pretreatment apparatus |
| JPWO2007138654A1 (en) * | 2006-05-26 | 2009-10-01 | 株式会社島津製作所 | Electrophoresis pretreatment method, analysis substrate and electrophoresis pretreatment apparatus |
| US8043492B2 (en) | 2006-05-26 | 2011-10-25 | Shimadzu Corporation | Method for pretreatment of electrophoresis, substrate for analysis, and pretreatment apparatus for electrophoresis |
| US8524173B2 (en) | 2006-09-01 | 2013-09-03 | Tosoh Corporation | Microchannel structure and fine-particle production method using the same |
| JP2009109240A (en) * | 2007-10-26 | 2009-05-21 | Shimadzu Corp | Chip for electrophoresis, kit of chip for electrophoresis, and method of manufacturing chip for electrophoresis |
| EP2269800A1 (en) * | 2008-03-28 | 2011-01-05 | Konica Minolta Opto, Inc. | Injection molding method and injection molding die |
| EP2269800A4 (en) * | 2008-03-28 | 2011-11-02 | Konica Minolta Opto Inc | Injection molding method and injection molding die |
| US8123998B2 (en) | 2008-03-28 | 2012-02-28 | Konica Minolta Opto, Inc. | Injection molding method and injection molding die |
| JP2010014437A (en) * | 2008-07-01 | 2010-01-21 | Enplas Corp | Fluid handling device |
| EP2312321A1 (en) * | 2008-08-08 | 2011-04-20 | Konica Minolta Opto, Inc. | Microchip and process for producing microchip |
| US20110135539A1 (en) * | 2008-08-08 | 2011-06-09 | Kanji Sekihara | Microchip and Process for Producing Microchip |
| US8404193B2 (en) * | 2008-08-08 | 2013-03-26 | Konica Minolta Opto, Inc. | Microchip and process for producing microchip |
| EP2312321A4 (en) * | 2008-08-08 | 2014-07-02 | Konica Minolta Opto Inc | Microchip and process for producing microchip |
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