JP2009109240A - Chip for electrophoresis, kit of chip for electrophoresis, and method of manufacturing chip for electrophoresis - Google Patents

Chip for electrophoresis, kit of chip for electrophoresis, and method of manufacturing chip for electrophoresis Download PDF

Info

Publication number
JP2009109240A
JP2009109240A JP2007279359A JP2007279359A JP2009109240A JP 2009109240 A JP2009109240 A JP 2009109240A JP 2007279359 A JP2007279359 A JP 2007279359A JP 2007279359 A JP2007279359 A JP 2007279359A JP 2009109240 A JP2009109240 A JP 2009109240A
Authority
JP
Japan
Prior art keywords
substrate
reservoir
adhesive
electrophoresis
electrophoresis chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007279359A
Other languages
Japanese (ja)
Other versions
JP4844533B2 (en
Inventor
Hiroyuki Matsumoto
博幸 松本
Rintaro Yamamoto
林太郎 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shimadzu Corp
Original Assignee
Shimadzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corp filed Critical Shimadzu Corp
Priority to JP2007279359A priority Critical patent/JP4844533B2/en
Publication of JP2009109240A publication Critical patent/JP2009109240A/en
Application granted granted Critical
Publication of JP4844533B2 publication Critical patent/JP4844533B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Apparatus Associated With Microorganisms And Enzymes (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an easily-manufacturable chip for electrophoresis with a reserver. <P>SOLUTION: This chip includes a substrate 32 provided with a hole 36 linking to a channel 35; a cylindrical reserver 100A arranged on the substrate 32 to enclose the hole 36, which is a reserver 100A provided with a hollow 50A on an installation surface facing to the substrate 32, and provided with an injection hole reaching the hollow 50A on the installation surface from an outer wall; and a sticking part 20A injected inside the hollow 50A, for sticking the substrate 32 onto the reserver 100A. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は電気泳動技術に関し、特に電気泳動用チップ、電気泳動用チップのキット及び電気泳動用チップの製造方法に関する。   The present invention relates to an electrophoresis technique, and more particularly to an electrophoresis chip, an electrophoresis chip kit, and a method for manufacturing an electrophoresis chip.

デオキシリボ核酸(DNA)等の生体分子の解析装置として、ゲルを2枚のガラス板で挟んだ電気泳動装置が従来知られている。さらに近年、基板に設けられた流路を用いて生体分子を泳動させる電気泳動装置も広まっている（例えば、特許文献1, 2参照。）。しかしリソグラフィ法等によって作成された基板デバイスによる電気泳動において、基板に設けられた開口穴をリザーバとしてバッファを溜めると、基板の厚さが例えば0.7mm等と薄いため、リザーバの容量が限定される。そのため、基板上に別途設けられた円筒状のリザーバが必要となる。しかしガラス基板へのリザーバの接着は、正確な位置決め、液漏れ対策、及び泳動流路への接着剤の進入回避等が必要であった。
特開2002-310858号公報 特表2007-506092号公報 As an apparatus for analyzing biomolecules such as deoxyribonucleic acid (DNA), an electrophoresis apparatus in which a gel is sandwiched between two glass plates is conventionally known. In recent years, electrophoretic devices that migrate biomolecules using a channel provided on a substrate have also become widespread (see, for example, Patent Documents 1 and 2). However, in electrophoresis using a substrate device created by a lithography method or the like, if the buffer is stored using the opening hole provided in the substrate as a reservoir, the thickness of the substrate is thin, for example, 0.7 mm, so the capacity of the reservoir is limited. . Therefore, a cylindrical reservoir provided separately on the substrate is required. However, adhesion of the reservoir to the glass substrate requires accurate positioning, countermeasures against liquid leakage, avoidance of the adhesive entering the electrophoresis channel, and the like.
JP 2002-310858 JP Special Publication 2007-506092 Publication

本発明は、製作が容易なリザーバ付き電気泳動用チップ、電気泳動用チップのキット及び電気泳動用チップの製造方法を提供することを目的とする。   An object of the present invention is to provide an electrophoresis chip with a reservoir, a kit for electrophoresis chip, and a method for manufacturing the electrophoresis chip that can be easily manufactured.

本発明の第1の特徴は、（イ）流路につながる穴が設けられた基板と、（ロ）穴を囲むようにして基板上に配置された筒状のリザーバであって、基板に対する設置面に窪みが設けられ、外壁から設置面の窪みに達する注入孔が設けられたリザーバと、（ハ）窪みの内部に配置された、基板及びリザーバを接着する接着部とを備える電気泳動用チップであることを要旨とする。   The first feature of the present invention is (a) a substrate provided with a hole connected to a flow path, and (b) a cylindrical reservoir disposed on the substrate so as to surround the hole, and is provided on an installation surface with respect to the substrate. An electrophoresis chip comprising a reservoir provided with a depression and an injection hole provided from the outer wall to reach a depression on the installation surface, and (c) an adhesive portion disposed inside the depression for bonding the substrate and the reservoir. This is the gist.

本発明の第2の特徴は、（イ）流路につながる穴が設けられた基板と、（ロ）穴を囲むようにして基板上に配置される筒状のリザーバであって、基板に対する設置面に窪みが設けられ、外壁から設置面の窪みに達する注入孔が設けられたリザーバと、（ハ）窪みの内部に注入される、基板及びリザーバを接着する接着剤とを備える電気泳動用チップのキットであることを要旨とする。   The second feature of the present invention is (a) a substrate provided with a hole connected to a flow path, and (b) a cylindrical reservoir disposed on the substrate so as to surround the hole, on the installation surface with respect to the substrate. An electrophoresis chip kit comprising a reservoir provided with a depression and an injection hole provided from the outer wall to the depression on the installation surface, and (c) an adhesive that is injected into the depression and adheres the substrate and the reservoir. It is a summary.

本発明の第3の特徴は、（イ）流路が設けられた基板上に、筒状のリザーバであって、基板に対する設置面に窪みが設けられ、外壁から設置面の窪みに達する注入孔が設けられたリザーバを配置するステップと、（ロ）注入孔を介して、窪みに接着剤を注入するステップと、（ハ）接着剤を硬化して、基板及びリザーバを接着するステップとを含む電気泳動用チップの製造方法であることを要旨とする。   The third feature of the present invention is (a) a cylindrical reservoir on a substrate provided with a flow path, where a recess is provided in the installation surface with respect to the substrate, and an injection hole reaching the recess in the installation surface from the outer wall And (b) injecting an adhesive into the recess through the injection hole, and (c) curing the adhesive to bond the substrate and the reservoir. The gist of the method is a method for manufacturing an electrophoresis chip.

本発明によれば、製作が容易なリザーバ付き電気泳動用チップ、電気泳動用チップのキット及び電気泳動用チップの製造方法を提供可能である。   According to the present invention, it is possible to provide an electrophoresis chip with a reservoir, an electrophoresis chip kit, and a method for manufacturing the electrophoresis chip that are easy to manufacture.

以下に本発明の実施の形態を説明する。以下の図面の記載において、同一又は類似の部分には同一又は類似の符号で表している。但し、図面は模式的なものである。したがって、具体的な寸法等は以下の説明を照らし合わせて判断するべきものである。また、図面相互間においても互いの寸法の関係や比率が異なる部分が含まれていることは勿論である。   Embodiments of the present invention will be described below. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, the drawings are schematic. Therefore, specific dimensions and the like should be determined in light of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

（第1の実施の形態）
本発明の第1の実施の形態に係る電気泳動用チップは、図1、II-II方向から見た断面図である図2、及びIII-III方向から見た断面図である図3に示すように、流路35が設けられた第1の基板31、第1の基板31上に配置された、流路35につながる穴36, 37が設けられた第2の基板32、穴36を囲むようにして第2の基板32上に配置された筒状のリザーバ100A、及び穴37を囲むようにして第2の基板32上に配置された筒状のリザーバ100Bを備える。 (First embodiment)
The electrophoresis chip according to the first embodiment of the present invention is shown in FIG. 1, FIG. 2 which is a sectional view seen from the II-II direction, and FIG. 3 which is a sectional view seen from the III-III direction. As described above, the first substrate 31 provided with the flow path 35, the second substrate 32 provided on the first substrate 31 and provided with the holes 36, 37 connected to the flow path 35, and the hole 36 are surrounded. A cylindrical reservoir 100A disposed on the second substrate 32, and a cylindrical reservoir 100B disposed on the second substrate 32 so as to surround the hole 37.

図4及びV-V方向から見た断面図である図5に示すように、第1の基板31の表面には溝である流路35が設けられている。例えば、流路35の幅は90μmであり、深さは40μmである。図6及びVII-VII方向から見た断面図である図7に示すように、第2の基板32の穴36は流路35の一方の端部に位置合わせされ、穴37は流路35の他方の端部に位置合わせされている。穴36, 37のそれぞれの直径は、例えば2mmである。第1の基板31及び第2の基板32のそれぞれの材料としては、例えばケイ酸塩ガラス、石英(SiO2)、及びシリコン(Si)等が使用可能である。流路35は、例えばフォトリソグラフィ法あるいはマイクロマシニング法等により形成されている。穴36, 37のそれぞれは、例えばサンドブラスト法等により形成されている。 As shown in FIG. 4 and FIG. 5 which is a cross-sectional view seen from the VV direction, a channel 35 which is a groove is provided on the surface of the first substrate 31. For example, the width of the flow path 35 is 90 μm and the depth is 40 μm. As shown in FIG. 6 and FIG. 7 which is a cross-sectional view seen from the VII-VII direction, the hole 36 of the second substrate 32 is aligned with one end of the flow path 35, and the hole 37 is aligned with the flow path 35. It is aligned with the other end. The diameter of each of the holes 36 and 37 is 2 mm, for example. As materials of the first substrate 31 and the second substrate 32, for example, silicate glass, quartz (SiO 2 ), silicon (Si), or the like can be used. The flow path 35 is formed by, for example, a photolithography method or a micromachining method. Each of the holes 36 and 37 is formed by, for example, a sandblast method.

図2及び図3に示すように、少なくとも筒状の部分を有するリザーバ100Aの第2の基板32に対する設置面には窪み50Aが設けられている。またリザーバ100Aには、上方から見た斜視図である図8に示すように、外壁から設置面の窪み50Aに達する注入孔121Aと排出孔122Aが設けられている。下方から見た斜視図である図9に示すように、筒状のリザーバ100Aの設置面140Aにおいて、窪み50Aは少なくとも1周している。図2及び図3に示す少なくとも筒状の部分を有するリザーバ100Bの第2の基板32に対する設置面には窪み50Bが設けられている。またリザーバ100Bには、外壁から窪み50Bに達する注入孔121Bと排出孔122Bが設けられている。リザーバ100A, 100Bのそれぞれの材料には、アクリル樹脂等が使用可能である。   As shown in FIGS. 2 and 3, a recess 50A is provided on the installation surface of the reservoir 100A having at least a cylindrical portion with respect to the second substrate 32. In addition, as shown in FIG. 8, which is a perspective view seen from above, the reservoir 100A is provided with an injection hole 121A and a discharge hole 122A that reach from the outer wall to the depression 50A on the installation surface. As shown in FIG. 9, which is a perspective view seen from below, the recess 50A makes at least one turn on the installation surface 140A of the cylindrical reservoir 100A. A recess 50B is provided on the installation surface of the reservoir 100B having at least a cylindrical portion shown in FIGS. 2 and 3 with respect to the second substrate 32. Further, the reservoir 100B is provided with an injection hole 121B and a discharge hole 122B that reach the recess 50B from the outer wall. Acrylic resin or the like can be used for each material of the reservoirs 100A and 100B.

さらに電気泳動用チップは、窪み50Aの内部に配置された、第2の基板32及びリザーバ100Aを接着する接着部20Aと、窪み50Bの内部に配置された、第2の基板32及びリザーバ100Bを接着する接着部20Bとを備える。接着部20A, 20Bのそれぞれの材料には、常温硬化(RTV: Room Temperature Vulcanizable)ゴム等が使用可能である。   Furthermore, the electrophoresis chip includes an adhesive portion 20A that bonds the second substrate 32 and the reservoir 100A disposed inside the recess 50A, and a second substrate 32 and the reservoir 100B that are disposed inside the recess 50B. And an adhesive portion 20B to be adhered. Room temperature Vulcanizable (RTV) rubber or the like can be used for each material of the bonding portions 20A and 20B.

次に図1乃至図3を参照して、第1の実施の形態に係る電気泳動用チップの使用方法について説明する。まずリザーバ100Aに泳動分離媒体を注ぎ、穴36、流路35、及び穴37を泳動分離媒体で充填する。次に穴36, 37を充填する泳動分離媒体を除去する。その後、穴36をデオキシリボ核酸(DNA)又はリボ核酸(RNA)等の生体分子検体を含むサンプル溶液で充填し、穴37及びリザーバ100Bをバッファで充填する。その後、流路35の両端の間に電圧を所定の時間印加し、検体を流路35内に導入する。次に穴36内のサンプルを除去、洗浄した後、穴36及びリザーバ100Aにバッファを注ぎ、流路35両端に電圧を印加して、泳動を行う。   Next, with reference to FIGS. 1 to 3, a method of using the electrophoresis chip according to the first embodiment will be described. First, the electrophoresis separation medium is poured into the reservoir 100A, and the hole 36, the channel 35, and the hole 37 are filled with the electrophoresis separation medium. Next, the electrophoresis separation medium filling the holes 36 and 37 is removed. Thereafter, the hole 36 is filled with a sample solution containing a biomolecule specimen such as deoxyribonucleic acid (DNA) or ribonucleic acid (RNA), and the hole 37 and the reservoir 100B are filled with a buffer. Thereafter, a voltage is applied between both ends of the flow path 35 for a predetermined time, and the specimen is introduced into the flow path 35. Next, after removing and washing the sample in the hole 36, a buffer is poured into the hole 36 and the reservoir 100A, and voltage is applied to both ends of the flow path 35 to perform electrophoresis.

以上示した第1の実施の形態に係る電気泳動用チップによれば、リザーバ100A, 100Bが、窪み50A, 50Bの内部に配置された接着部20A, 20Bで第2の基板32に接着されているため、サンプル溶液が液漏れするおそれがない。また第1の実施の形態に係る電気泳動チップを廃棄する際には、例えばケイ酸塩ガラス製の第1及び第2の基板31, 32と、アクリル樹脂製のリザーバ100A, 100Bとを分離すれば、分別して廃棄することが可能となる。さらにリザーバ100A, 100Bに多量のバッファを溜めることができるため、泳動中の乾燥や濃度変化を防止することが可能となる。   According to the electrophoresis chip according to the first embodiment described above, the reservoirs 100A and 100B are bonded to the second substrate 32 by the bonding portions 20A and 20B disposed inside the recesses 50A and 50B. Therefore, there is no possibility that the sample solution leaks. When the electrophoresis chip according to the first embodiment is discarded, for example, the first and second substrates 31 and 32 made of silicate glass and the reservoirs 100A and 100B made of acrylic resin are separated. In this case, it can be separated and discarded. Further, since a large amount of buffer can be stored in the reservoirs 100A and 100B, drying and concentration change during electrophoresis can be prevented.

次に第1の実施の形態に係る電気泳動用チップの製造方法について説明する。   Next, a method for manufacturing an electrophoresis chip according to the first embodiment will be described.

まず図1及び図2に示すように、穴36を囲むようにして第2の基板32上に筒状のリザーバ100Aを配置し、穴37を囲むようにして第2の基板32上に筒状のリザーバ100Bを配置する。次に、リザーバ100Aを第2の基板32に押しつけながら、リザーバ100Aの注入孔121AにRTVゴム等の接着剤を注入する。   First, as shown in FIGS. 1 and 2, a cylindrical reservoir 100A is arranged on the second substrate 32 so as to surround the hole 36, and a cylindrical reservoir 100B is arranged on the second substrate 32 so as to surround the hole 37. Deploy. Next, while pressing the reservoir 100A against the second substrate 32, an adhesive such as RTV rubber is injected into the injection hole 121A of the reservoir 100A.

注入された接着剤は、注入孔121Aから環状に設けられた窪み50Aに進入する際に左右二手に分かれて、窪み50Aの内部の空気を排出孔122Aから押し出しながら、窪み50Aの内部を進行する。窪み50Aの内部が接着剤で充填され、接着剤が排出孔122Aに到達した時点で、接着剤の注入を中止する。この時、第1の基板31の裏面から、窪み50Aの内部に接着剤が充填されているか確認し、不足している場合は、さらに注入してもよい。なお排出孔122Aから接着剤が出てきた場合は、拭き取る。その後、接着剤を硬化させて接着部20Aを形成させ、リザーバ100Aを第2の基板32に固定する。また、リザーバ100Bをリザーバ100Aと同様に第2の基板32上に固定し、第1の実施の形態に係る電気泳動用チップの製造方法を終了する。   The injected adhesive is divided into left and right hands when entering the annular recess 50A from the injection hole 121A, and proceeds inside the recess 50A while pushing out the air inside the recess 50A from the discharge hole 122A. . When the inside of the recess 50A is filled with the adhesive and the adhesive reaches the discharge hole 122A, the injection of the adhesive is stopped. At this time, it is confirmed from the back surface of the first substrate 31 whether the inside of the recess 50A is filled with an adhesive, and if it is insufficient, it may be further injected. If the adhesive comes out from the discharge hole 122A, wipe it off. Thereafter, the adhesive is cured to form an adhesive portion 20A, and the reservoir 100A is fixed to the second substrate 32. Also, the reservoir 100B is fixed on the second substrate 32 in the same manner as the reservoir 100A, and the method for manufacturing the electrophoresis chip according to the first embodiment is completed.

例えばリザーバの設置面が平坦である場合、リザーバの設置面に接着剤を塗布して基板に貼り付けると、はみ出た接着剤が基板に設けられた流路に流入するおそれがある。そのため、基板へのリザーバの貼り付けは、熟練した技術者が細心の注意を払って行う必要が生じる。これに対し、第1の実施の形態に係る電気泳動用チップの製造方法によれば、リザーバ100Aに注入孔121A、窪み50A、及び排出孔122Aが設けられているため、注入孔121Aから接着剤を注入すれば、接着剤が穴36の内部まであふれ出すおそれがない。そのため、大容量のリザーバ100Aを容易に第2の基板32に確実に接着することが可能となる。なお接着剤は1液型、2液型、加熱硬化型、及び紫外線(UV)硬化型等も使用可能である。しかし、加熱装置やUV照射装置を使用しない1液型のRTVゴムが取り扱いが容易であり好ましい。また粘度及び流動性が高いRTVゴムを使用することにより、窪み50A, 50Bからの漏れを防止することが可能となる。   For example, when the reservoir installation surface is flat, if the adhesive is applied to the reservoir installation surface and attached to the substrate, the protruding adhesive may flow into the flow path provided on the substrate. For this reason, it is necessary for a skilled technician to attach the reservoir to the substrate with great care. On the other hand, according to the method for manufacturing an electrophoresis chip according to the first embodiment, since the injection hole 121A, the recess 50A, and the discharge hole 122A are provided in the reservoir 100A, the adhesive is injected from the injection hole 121A. Is injected, there is no possibility that the adhesive will overflow into the hole 36. Therefore, the large-capacity reservoir 100A can be easily and reliably bonded to the second substrate 32. As the adhesive, a one-component type, a two-component type, a heat curing type, an ultraviolet ray (UV) curing type, or the like can be used. However, a one-component RTV rubber that does not use a heating device or UV irradiation device is preferable because it is easy to handle. Further, by using RTV rubber having high viscosity and fluidity, it is possible to prevent leakage from the recesses 50A and 50B.

（第2の実施の形態）
第2の実施の形態に係る電気泳動用チップの上面図は図1と同様である、しかし第2の実施の形態に係る電気泳動用チップにおいては、図10及び図11に示すように、リザーバ200A, 200Bのそれぞれの設置面の窪み250A, 250Bがリザーバ200A, 200Bの内壁まで続いている。窪み250A, 250Bの内部には接着部220A, 220Bがそれぞれ配置されている。その他の構成要素は、第1の実施の形態に係る電気泳動用チップと同様であるので、説明は省略する。 (Second embodiment)
The top view of the electrophoresis chip according to the second embodiment is the same as that of FIG. 1, but in the electrophoresis chip according to the second embodiment, as shown in FIG. 10 and FIG. Recesses 250A and 250B on the respective installation surfaces of 200A and 200B continue to the inner walls of the reservoirs 200A and 200B. Adhesive portions 220A and 220B are disposed in the recesses 250A and 250B, respectively. Since other components are the same as those of the electrophoresis chip according to the first embodiment, the description thereof is omitted.

次に第2の実施の形態に係る電気泳動用チップの製造方法について説明する。まず図12に示すように、内壁まで続く窪み250Aが設けられたリザーバ200Aとリザーバ200Bを、穴36, 37を囲むようにして第2の基板32上にそれぞれ配置する。その後、図13に示すように、筒状のリザーバ200Aの内周の形状と等しい断面形状を有する棒60をリザーバ200Aの中空部に挿入する。   Next, a method for manufacturing an electrophoresis chip according to the second embodiment will be described. First, as shown in FIG. 12, a reservoir 200A and a reservoir 200B provided with a recess 250A extending to the inner wall are arranged on the second substrate 32 so as to surround the holes 36 and 37, respectively. Thereafter, as shown in FIG. 13, a rod 60 having a cross-sectional shape equal to the inner peripheral shape of the cylindrical reservoir 200A is inserted into the hollow portion of the reservoir 200A.

棒60を挿入した後、注入孔121Aを介して窪み250Aに接着剤を注入する。次に接着剤を硬化させて図14に示す接着部220Aを形成させ、リザーバ200Aを第2の基板32に固定する。その後、棒60をリザーバ200Aから抜き出す。同様に、リザーバ200Bも第2の基板32に固定し、第2の実施の形態に係る電気泳動用チップの製造方法を終了する。   After inserting the rod 60, the adhesive is injected into the recess 250A through the injection hole 121A. Next, the adhesive is cured to form an adhesive portion 220A shown in FIG. 14, and the reservoir 200A is fixed to the second substrate 32. Thereafter, the rod 60 is extracted from the reservoir 200A. Similarly, the reservoir 200B is also fixed to the second substrate 32, and the method for manufacturing the electrophoresis chip according to the second embodiment is completed.

以上示した第2の実施の形態に係る電気泳動用チップの製造方法によれば、棒60がリザーバ200Aの中空部に挿入された後、窪み250Aに接着剤が注入されるため、接着剤が穴36を介して流路35に流入するおそれがない。また第1の実施の形態に係る窪み50Aと比較して窪み250Aの体積が大きいため、結果として多量の接着剤でリザーバ200Aを第2の基板32に固定することが可能となる。そのため、より安定した電気泳動用チップの製造が可能となる。なお棒60の材料は、使用される接着剤が接着しない金属あるいはフッ素樹脂等が使用可能である。   According to the method for manufacturing the electrophoresis chip according to the second embodiment shown above, the adhesive is injected into the recess 250A after the rod 60 is inserted into the hollow portion of the reservoir 200A. There is no risk of flowing into the flow path 35 through the hole 36. Further, since the volume of the recess 250A is larger than that of the recess 50A according to the first embodiment, the reservoir 200A can be fixed to the second substrate 32 with a large amount of adhesive as a result. Therefore, it is possible to manufacture a more stable electrophoresis chip. The material of the rod 60 can be a metal or a fluororesin that is not bonded by the adhesive used.

（その他の実施の形態）
上記のように、本発明を実施の形態によって記載したが、この開示の一部をなす論述及び図面はこの発明を限定するものであると理解すべきではない。例えば図15に示すように、窪み50Aの内壁に凸部161, 162を設けてもよい。凸部161は注入孔121Aの側に向いており、凸部162は排出孔122Aの側に向いている。凸部161, 162がない場合、注入孔121Aから注入され、窪み50A内部を進行する接着剤に気泡が生じる場合がある。これに対し、凸部161によって接着剤はスムーズに二方向に分断され、二手に分かれて窪み50Aの内部を進行した接着剤は凸部162によってスムーズに結合する。そのため、接着剤に気泡が生じにくくなる。 (Other embodiments)
As mentioned above, although this invention was described by embodiment, it should not be understood that the description and drawing which form a part of this indication limit this invention. For example, as shown in FIG. 15, convex portions 161 and 162 may be provided on the inner wall of the recess 50A. The convex portion 161 faces the injection hole 121A, and the convex portion 162 faces the discharge hole 122A. When the convex portions 161 and 162 are not provided, bubbles may be generated in the adhesive that is injected from the injection hole 121A and proceeds inside the recess 50A. On the other hand, the adhesive is smoothly divided in two directions by the convex portion 161, and the adhesive that has been divided into two hands and advanced inside the recess 50A is smoothly bonded by the convex portion 162. Therefore, bubbles are less likely to occur in the adhesive.

また図16に示すように、リザーバ100A, 100Bは、第1の基板31及び第2の基板32を覆う保護ケース40に設けられていてもよい。保護ケース40により、取り扱いの際のけがを防止することや、落下による第1及び第2の基板31, 32の破損を防止することが可能となる。さらに保護ケース40の内寸を第1及び第2の基板31, 32の外寸に一致させることにより、リザーバ100A, 100Bと穴36, 37との位置合わせが非常に容易となる。なお保護ケース40とリザーバ100A, 100Bは必ずしも一体である必要はなく、別個に製造されたものでもよい。   As shown in FIG. 16, the reservoirs 100A and 100B may be provided in a protective case 40 that covers the first substrate 31 and the second substrate 32. The protective case 40 makes it possible to prevent injury during handling and to prevent the first and second substrates 31 and 32 from being damaged due to falling. Further, by aligning the inner dimensions of the protective case 40 with the outer dimensions of the first and second substrates 31 and 32, the alignment between the reservoirs 100A and 100B and the holes 36 and 37 becomes very easy. The protective case 40 and the reservoirs 100A and 100B are not necessarily integrated, and may be manufactured separately.

また第1の実施の形態では、図2に示したように、第1の基板31に流路35が設けられた例を示した。これに対し第2の基板32の第1の基板31に向かい合う面に、穴36, 37に通じる流路を設け、第1の基板31の流路35を無くしてもよい。流路を第2の基板に設けることにより、第1の基板と第2の基板の貼り合わせの際に、位置合わせをする必要ななくなる。   Further, in the first embodiment, as shown in FIG. 2, the example in which the flow path 35 is provided in the first substrate 31 is shown. On the other hand, the flow path leading to the holes 36 and 37 may be provided on the surface of the second substrate 32 facing the first substrate 31, and the flow path 35 of the first substrate 31 may be eliminated. By providing the channel on the second substrate, it is not necessary to align the first substrate and the second substrate.

以上示したように、この開示から当業者には様々な代替実施の形態、実施例及び運用技術が明らかとなろう。したがって、本発明の技術的範囲は上記の説明からは妥当な特許請求の範囲に係る発明特定事項によってのみ定められるものである。   As indicated above, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art from this disclosure. Therefore, the technical scope of the present invention is defined only by the invention specifying matters according to the scope of claims reasonable from the above description.

本発明の第１の実施の形態に係る電気泳動用チップの上面図である。1 is a top view of an electrophoresis chip according to a first embodiment of the present invention. 本発明の第１の実施の形態に係る電気泳動用チップの第１の断面図である。1 is a first cross-sectional view of an electrophoresis chip according to a first embodiment of the present invention. 本発明の第１の実施の形態に係る電気泳動用チップの第２の断面図である。It is a 2nd sectional view of the chip for electrophoresis concerning a 1st embodiment of the present invention. 本発明の第１の実施の形態に係る第１の基板の上面図である。It is a top view of the 1st substrate concerning a 1st embodiment of the present invention. 本発明の第１の実施の形態に係る第１の基板の断面図である。It is sectional drawing of the 1st board | substrate which concerns on the 1st Embodiment of this invention. 本発明の第１の実施の形態に係る第２の基板の上面図である。It is a top view of the 2nd substrate concerning a 1st embodiment of the present invention. 本発明の第１の実施の形態に係る第１及び第２の基板の断面図である。It is sectional drawing of the 1st and 2nd board | substrate which concerns on the 1st Embodiment of this invention. 本発明の第１の実施の形態に係るリザーバの上方から見た斜視図である。It is the perspective view seen from the upper direction of the reservoir | reserver which concerns on the 1st Embodiment of this invention. 本発明の第１の実施の形態に係るリザーバの下方から見た斜視図である。It is the perspective view seen from the downward direction of the reservoir | reserver which concerns on the 1st Embodiment of this invention. 本発明の第２の実施の形態に係る電気泳動用チップの第１の断面図である。It is a 1st sectional view of the chip for electrophoresis concerning a 2nd embodiment of the present invention. 本発明の第２の実施の形態に係る電気泳動用チップの第２の断面図である。It is a 2nd sectional view of the chip for electrophoresis concerning a 2nd embodiment of the present invention. 本発明の第２の実施の形態に係るリザーバの下方から見た斜視図である。It is the perspective view seen from the downward direction of the reservoir | reserver which concerns on the 2nd Embodiment of this invention. 本発明の第２の実施の形態に係る電気泳動用チップの第１の工程断面図である。It is a 1st process sectional view of the chip for electrophoresis concerning a 2nd embodiment of the present invention. 本発明の第２の実施の形態に係る電気泳動用チップの第２の工程断面図である。It is 2nd process sectional drawing of the chip | tip for electrophoresis which concerns on the 2nd Embodiment of this invention. 本発明のその他の実施の形態に係るリザーバの下方から見た斜視図である。It is the perspective view seen from the lower part of the reservoir concerning other embodiments of the present invention. 本発明のその他の実施の形態に係る電気泳動用チップの断面図である。It is sectional drawing of the chip | tip for electrophoresis which concerns on other embodiment of this invention.

符号の説明Explanation of symbols

20A, 20B…接着部
31…第1の基板
32…第2の基板
35…流路
36, 37…穴
40…保護ケース
60…棒
100A, 100B, 200A, 200B…リザーバ
121A, 121B…注入孔
122A, 122B…排出孔
140A…設置面
161, 162…凸部
220A, 220B…接着部 20A, 20B… Adhesive part
31 ... First board
32 ... Second board
35 ... Flow path
36, 37… hole
40 ... Protective case
60 ... Bar
100A, 100B, 200A, 200B ... reservoir
121A, 121B… Injection hole
122A, 122B ... Discharge hole
140A ... Installation surface
161, 162… convex
220A, 220B ... Adhesion

Claims (10)

流路につながる穴が設けられた基板と、
前記穴を囲むようにして前記基板上に配置された筒状のリザーバであって、前記基板に対する設置面に窪みが設けられ、外壁から前記設置面の窪みに達する注入孔が設けられた前記リザーバと、
前記窪みの内部に配置された、前記基板及び前記リザーバを接着する接着部
とを備えることを特徴とする電気泳動用チップ。 A substrate with holes connected to the flow path;
A cylindrical reservoir disposed on the substrate so as to surround the hole, the reservoir provided with a depression on the installation surface with respect to the substrate, and provided with an injection hole reaching the depression of the installation surface from an outer wall;
An electrophoresis chip comprising: an adhesive portion that is disposed inside the recess and adheres the substrate and the reservoir. 前記窪みに達する排出孔が前記リザーバに更に設けられていることを特徴とする請求項１に記載の電気泳動用チップ。   The electrophoresis chip according to claim 1, wherein a discharge hole reaching the depression is further provided in the reservoir. 前記窪みが前記設置面を少なくとも一周していることを特徴とする請求項１又は２に記載の電気泳動用チップ。   The electrophoresis chip according to claim 1, wherein the depression makes at least one round of the installation surface. 前記リザーバが、前記基板を覆う保護ケースに設けられていることを特徴とする請求項１乃至３のいずれか１項に記載の電気泳動用チップ。   The electrophoresis chip according to claim 1, wherein the reservoir is provided in a protective case that covers the substrate. 流路につながる穴が設けられた基板と、
前記穴を囲むようにして前記基板上に配置される筒状のリザーバであって、前記基板に対する設置面に窪みが設けられ、外壁から前記設置面の窪みに達する注入孔が設けられた前記リザーバと、
前記窪みの内部に注入される、前記基板及び前記リザーバを接着する接着剤
とを備えることを特徴とする電気泳動用チップのキット。 A substrate with holes connected to the flow path;
A cylindrical reservoir disposed on the substrate so as to surround the hole, the reservoir provided with a depression on the installation surface with respect to the substrate, and provided with an injection hole reaching the depression on the installation surface from an outer wall;
An electrophoresis chip kit comprising: an adhesive that bonds the substrate and the reservoir, and is injected into the depression. 前記接着剤が常温硬化ゴムであることを特徴とする請求項５に記載の電気泳動用チップのキット。   6. The electrophoresis chip kit according to claim 5, wherein the adhesive is a room temperature curing rubber. 流路が設けられた基板上に、筒状のリザーバであって、前記基板に対する設置面に窪みが設けられ、外壁から前記設置面の窪みに達する注入孔が設けられた前記リザーバを配置するステップと、
前記注入孔を介して、前記窪みに接着剤を注入するステップと、
前記接着剤を硬化して、前記基板及び前記リザーバを接着するステップ
とを含むことを特徴とする電気泳動用チップの製造方法。 A step of disposing a reservoir having a cylindrical shape on a substrate provided with a flow path, wherein a recess is provided on an installation surface with respect to the substrate, and an injection hole reaching an indentation of the installation surface from an outer wall is provided. When,
Injecting an adhesive into the recess through the injection hole;
Curing the adhesive and bonding the substrate and the reservoir. A method for manufacturing an electrophoresis chip, comprising: 前記注入される接着剤が常温硬化ゴムであることを特徴とする請求項７に記載の電気泳動用チップの製造方法。   The method for manufacturing an electrophoresis chip according to claim 7, wherein the injected adhesive is a room temperature curing rubber. 前記窪みが前記リザーバの内壁まで続いていることを特徴とする請求項７又は８に記載の電気泳動用チップの製造方法。   9. The method for manufacturing an electrophoresis chip according to claim 7, wherein the depression continues to an inner wall of the reservoir. 前記接着剤を注入するステップの前に、前記筒状のリザーバの内周形状と等しい断面形状を有する棒を、前記リザーバに挿入するステップを更に含むことを特徴とする請求項９に記載の電気泳動用チップの製造方法。   10. The electric device according to claim 9, further comprising a step of inserting a rod having a cross-sectional shape equal to an inner peripheral shape of the cylindrical reservoir into the reservoir before the step of injecting the adhesive. Method for manufacturing electrophoresis chip.
JP2007279359A 2007-10-26 2007-10-26 Electrophoresis chip, electrophoresis chip kit, and method for manufacturing electrophoresis chip Active JP4844533B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007279359A JP4844533B2 (en) 2007-10-26 2007-10-26 Electrophoresis chip, electrophoresis chip kit, and method for manufacturing electrophoresis chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007279359A JP4844533B2 (en) 2007-10-26 2007-10-26 Electrophoresis chip, electrophoresis chip kit, and method for manufacturing electrophoresis chip

Publications (2)

Publication Number Publication Date
JP2009109240A true JP2009109240A (en) 2009-05-21
JP4844533B2 JP4844533B2 (en) 2011-12-28

Family

ID=40777880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007279359A Active JP4844533B2 (en) 2007-10-26 2007-10-26 Electrophoresis chip, electrophoresis chip kit, and method for manufacturing electrophoresis chip

Country Status (1)

Country Link
JP (1) JP4844533B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010014437A (en) * 2008-07-01 2010-01-21 Enplas Corp Fluid handling device
JP2011127919A (en) * 2009-12-15 2011-06-30 Hamamatsu Photonics Kk Specimen handling element
JP2017053726A (en) * 2015-09-09 2017-03-16 株式会社島津製作所 Microchip electrophoresis device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002207031A (en) * 2001-01-11 2002-07-26 Shimadzu Corp Microchannel-type chip
JP2003004700A (en) * 2001-06-22 2003-01-08 Hitachi Chem Co Ltd Chip for cataphoresis
JP2005315758A (en) * 2004-04-30 2005-11-10 Shimadzu Corp Microchip analysis method and apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002207031A (en) * 2001-01-11 2002-07-26 Shimadzu Corp Microchannel-type chip
JP2003004700A (en) * 2001-06-22 2003-01-08 Hitachi Chem Co Ltd Chip for cataphoresis
JP2005315758A (en) * 2004-04-30 2005-11-10 Shimadzu Corp Microchip analysis method and apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010014437A (en) * 2008-07-01 2010-01-21 Enplas Corp Fluid handling device
JP2011127919A (en) * 2009-12-15 2011-06-30 Hamamatsu Photonics Kk Specimen handling element
JP2017053726A (en) * 2015-09-09 2017-03-16 株式会社島津製作所 Microchip electrophoresis device

Also Published As

Publication number Publication date
JP4844533B2 (en) 2011-12-28

Similar Documents

Publication Publication Date Title
Flachsbart et al. Design and fabrication of a multilayered polymer microfluidic chip with nanofluidic interconnects via adhesive contact printing
US7312611B1 (en) Apparatus and method for trapping bead based reagents within microfluidic analysis systems
US6363201B2 (en) Fiber array with wick-stop trench for improved fiber positioning
US20050224352A1 (en) Apparatus and method for trapping bead based reagents within microfluidic analysis systems
JP2007064742A (en) Chemical chip and connection device
US7060227B2 (en) Microfluidic devices with raised walls
JP4851698B2 (en) Method and microfluidic system for joining hollow fibers in a microfluidic network
KR100773552B1 (en) Micro-fluid reaction vessel, method for manufacturing the vessel, and method of micro-fluid reaction using the vessel
KR20090108371A (en) Microfluidic circuit element comprising microfluidic channel with nano interstices and fabrication thereof
WO2006022810A2 (en) Capillary electrophoresis devices
JP4844533B2 (en) Electrophoresis chip, electrophoresis chip kit, and method for manufacturing electrophoresis chip
US20080118205A1 (en) Optical connector and process for connecting optical fibers
US9917148B2 (en) Self-limited, anisotropic wet etching of transverse vias in microfluidic chips
US7796337B2 (en) Optical microstructure plate and fabrication mold thereof
US20150110688A1 (en) Channel device and method for fabricating the same
JP2002310858A (en) Sample introducing method in microchip electrophoresis
JP4383446B2 (en) Method for bonding microstructured substrates
US9987630B2 (en) Fluid handling device and method of using the same
JP2008025841A (en) Fixing kit and method of fixing shaft to holder by bonding
JP2006284440A (en) Manufacturing method of chip for chromatography
EP2251698A1 (en) Microchip and method of manufacturing same
US9636674B2 (en) Microfluidic chips with optically transparent glue coating and a method of manufacturing microfluidic chips with optically transparent glue coating for a microfluidic device
WO2006098370A1 (en) Delay circuit with mechanism for adjusting effective passing time of channel, microchip, and method for fabricating the same
JP2004106508A (en) Bonded part structure of plate
WO2001071331A1 (en) Electrophoresis microchip and system

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100106

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110615

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110621

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110802

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110913

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110926

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20141021

Year of fee payment: 3

R151 Written notification of patent or utility model registration

Ref document number: 4844533

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20141021

Year of fee payment: 3