JP2003001763A - Insulating film and multilayered wiring board using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To satisfy all of the densification of wiring, humidity resistance, insulating properties and high frequency transmission characteristics in an insulating film comprising an organic material and a multilayered wiring board using the same. SOLUTION: The insulating film 3 is constituted by forming coating layers 2 comprising polyphenylene ether type organic matter on the upper and rear surfaces of a polyphenylene ether ketone type organic matter layer. The multilayered wiring board is constituted by laminating a plurality of the insulating films 3 each having a wiring conductor 4 comprising a metal foil on at least one of the upper and rear surfaces thereof and electrically connecting the wiring conductors 4 positioned up and down so as to hold the insulating films 3 through the piercing conductors formed to the insulating films 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insulating film used in various kinds of electronic equipment such as AV equipment, home electric appliances, communication equipment, computers and peripheral equipment thereof, and a multilayer wiring board using the same, and particularly polyether ether. The present invention relates to an insulating film using a ketone-based organic material as a part and a multilayer wiring board using the insulating film.

[0002]

2. Description of the Related Art Conventionally, a multilayer wiring board used for a hybrid integrated circuit in which a large number of active components such as semiconductor elements and passive components such as capacitance elements and resistance elements are mounted to form a predetermined electronic circuit is usually Formed by stacking a number of wiring boards, each having a plurality of wiring conductors formed inside the through hole and on the surface of the insulating layer by forming through holes in the insulating film made of glass cloth impregnated with epoxy resin by a drill. ing.

In general, current electronic devices are required to be small, thin, lightweight, high-performance, high-performance, high-quality and highly reliable, as represented by mobile communication devices. Electronic components such as hybrid integrated circuits mounted on
There is a demand for higher densities, and in order to meet such demands for higher densities, the multilayer wiring boards that compose electronic components are also made finer in wiring conductors and thinner in insulating layers.
The miniaturization of through holes has become necessary. For this reason, in recent years, in order to miniaturize the through holes, laser machining, which enables finer machining than drilling, has come to be used.

However, the insulating film formed by impregnating glass cloth with an epoxy resin has a limit in miniaturizing the through holes because it is difficult to drill the glass cloth with a laser, and the glass cloth of There is a problem that it is difficult to form a through hole having a uniform hole diameter due to the uneven thickness.

In order to solve such a problem, an insulating film obtained by impregnating a non-woven fabric made of aramid resin fiber with an epoxy resin or an insulating film obtained by coating a polyimide film with an epoxy adhesive is used as an insulating layer. Multilayer wiring boards have been proposed.

However, an insulating film using an aramid non-woven fabric or a polyimide film has a high hygroscopic property, and when solder reflow is performed in a moisture-absorbed state, moisture absorbed by the solder reflow is vaporized to generate a gas, and However, there is a problem such as peeling off.

In order to solve such a problem, the use of polyetheretherketone resin as the material of the insulating layer of the multilayer wiring board has been studied. Polyetheretherketone resin is composed of rigid molecules and has a structure in which the molecules are regularly arranged and the intermolecular force is strong, so that high heat resistance, high elastic modulus, high dimensional stability, It has low hygroscopicity, does not require the use of a reinforcing material such as glass cloth, and has excellent fine workability.

Taking advantage of such characteristics of the polyether ether ketone resin, Japanese Patent Laid-Open No. 2000-200976 discloses that after a conductor foil is heat-sealed on the surface of a film-shaped insulator containing the polyether ether ketone resin as a main component. A multilayer printed wiring board has been proposed in which a circuit is formed on this conductor foil to obtain a film-shaped wiring board, and a plurality of these are laminated and heat-sealed to form a multilayer.

[0009]

However, in such a multilayer printed wiring board, when the polyetheretherketone resin films are formed into multiple layers, the polyetheretherketone resin molecules are rigid and the molecules are regularly oriented to some extent. As the intermolecular force becomes strong, the molecules become difficult to move, and because only a small part of the molecules on the surface of the polyetheretherketone resin film can be entangled with each other, the adhesion is poor. However, there is a problem in that the insulation is peeled off and the insulation failure occurs. Further, when the conductor foil and the polyetheretherketone resin film are bonded by heat fusion, the polyetheretherketone resin molecules are difficult to move and therefore cannot enter the fine recesses on the surface of the conductor foil, resulting in sufficient There is also a problem that the anchor effect cannot be exhibited, the adhesion between the conductor foil and the polyetheretherketone resin film deteriorates, and the conductor foil peels off between the two under high temperature and high humidity and the conductor foil is broken. Had.
There is also a method of bonding the conductor foil and the polyetheretherketone resin film using an epoxy adhesive,
In this case, since the dielectric constant of the epoxy adhesive is significantly different from the dielectric constant of the polyetheretherketone resin film, due to a slight thickness variation caused by the pressure when bonding the conductor foil, a high frequency region, particularly 100 MHz or more There is a problem that the transmission characteristic is deteriorated at the frequency.

The present invention has been devised in view of the above problems of the prior art, and an object thereof is to provide an insulating film having high-density wiring and excellent in moisture resistance, insulation, and high-frequency transmission characteristics. It is to provide a multilayer wiring board using.

[0011]

The insulating film of the present invention is characterized in that a coating layer made of a polyphenylene ether organic material is formed on the upper and lower surfaces of the polyether ether ketone organic material layer.

Further, the insulating film of the present invention is characterized in that, in the above constitution, the polyphenylene ether organic substance is a thermosetting polyphenylene ether.

Further, the multilayer wiring board of the present invention is formed by laminating a plurality of the above-mentioned insulating films having wiring conductors made of a metal foil disposed on at least one of the upper and lower surfaces, and sandwiching the insulating films. It is characterized in that the wiring conductors located above and below are electrically connected to each other through a penetrating conductor formed in an insulating film.

Further, in the multilayer wiring board of the present invention, the cross-sectional shape in the width direction of the wiring conductors arranged on the insulating film is a trapezoidal shape in which the length of the bottom side on the insulating film side is shorter than the length of the opposite bottom side. And the angle formed by the base and the side on the side of the insulating film is 95 to 150 °.

According to the insulating film of the present invention, since the coating layer made of polyphenylene ether organic material is formed on the upper and lower surfaces of the polyether ether ketone organic material layer, the polyphenylene ether organic material molecule is polyether. It is not as rigid as the etherketone-based organic molecule, and the molecule is relatively easy to move because it does not show a regular orientation, and as a result, even when the insulating films are multi-layered, the adhesion between the insulating films becomes good, In the high temperature bias test, there is no possibility of peeling between the films and causing insulation failure. Also,
Even when the wiring conductor is arranged on the surface of the insulating film, the polyphenylene ether-based organic compound molecules can enter the fine recesses on the surface of the wiring conductor to exert a sufficient anchoring effect, and the adhesion between the insulating film and the wiring conductor can be improved. The result is good, and as a result, there is no possibility that the wiring conductor is broken due to peeling between the two under high temperature and high humidity. Furthermore, since the frequency behavior of the permittivity of the coating layer made of polyphenylene ether organic material and that of the polyether ether ketone organic material are almost equal, a slight thickness variation occurred in the coating layer due to the pressure applied when bonding the wiring conductor. Even in this case, it is possible to obtain an insulating film having excellent high-frequency transmission characteristics without causing deterioration in transmission characteristics in the high-frequency region.

Further, according to the multilayer wiring board of the present invention, since the multilayer wiring board is formed by using the above-mentioned insulating film, the multilayer wiring board having excellent moisture resistance and high frequency characteristics can be obtained. Furthermore, when multilayering the insulating film,
Since the polyphenylene ether-based organic molecule forming the coating layer is easy to move, the polyphenylene ether-based organic molecule is easily entangled with each other, and the adhesion between the insulating films is increased, and as a result, the insulating films are peeled between the insulating films even under the high temperature bias test. Insulation failure does not occur.

Further, according to the multilayer wiring board of the present invention,
The cross-sectional shape in the width direction of the wiring conductor disposed on the insulating film is a trapezoid whose base length on the insulating film side is shorter than the length of the opposing base, and between the base and the side on the insulating film side. Since the angle formed is 95 to 150 °, the wiring conductor can be easily embedded in the coating layer, and the surface of the coating layer after the wiring conductor is embedded can be made almost flat. Since no air is caught between the insulating layers, a multilayer wiring board having high insulation reliability can be obtained.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Next, the insulating film and the multilayer wiring board of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a sectional view showing an example of an embodiment of an insulating film of the present invention, and FIG. 2 is a multilayer wiring board formed by using the insulating film of FIG. It is sectional drawing which shows an example of embodiment of the hybrid integrated circuit which mounts components. Further, FIG. 3 is an enlarged cross-sectional view of a main part of the multilayer wiring board shown in FIG. In these figures, 1 is a polyether ether ketone-based organic material layer, 2
Is a coating layer, which mainly constitutes the insulating film 3 of the present invention. Further, 4 is a wiring conductor, 5 is a through conductor,
The insulating film 3, the wiring conductor 4, and the penetrating conductor 5 mainly form the multilayer wiring board 6 of the present invention. In addition, the multilayer wiring board 6 of this example is shown as being formed by laminating four layers of the insulating films 3.

The insulating film 3 is composed of a polyetheretherketone-based organic material layer 1 and a coating layer 2 adhered to the surface thereof. When the multilayer wiring board 6 is constructed by using this, wiring is formed. It has a function as a support for the electronic component 7 mounted on the conductor 4 and the multilayer wiring board 6.

The term "polyether ether ketone-based organic material" as used herein means a resin having a structure represented by the following formula, a resin having various functional groups bonded to this structure, or a derivative thereof.
It means a polymer.

[0022]

[Chemical 1]

The term "polyphenylene ether organic material" means a polyphenylene ether resin, a resin in which various functional groups are bonded to polyphenylene ether, or a derivative or polymer thereof.

From the viewpoint of temperature cycle reliability, solder heat resistance, and workability, such polyether ether ketone-based organic matter has a melting point at a temperature of 230 to 430 ° C., particularly 280 to 380 ° C. More preferably, within a range that does not impair the physical properties of the layer, a light stabilizer such as an antioxidant for improving thermal stability or an ultraviolet absorber for improving light resistance, for improving flame retardancy. Halogen-based or phosphoric acid-based flame retardants, antimony compounds, flame-retardant aids such as zinc borate, barium metaborate and zirconium oxide, higher fatty acids and higher fatty acid esters and higher fatty acids for improving lubricity Lubricants such as metal salts / fluorocarbon-based surfactants, aluminum oxide / silicon oxide / titanium oxide for adjusting the thermal expansion coefficient and / or improving the mechanical strength Barium oxide, strontium oxide zirconium oxide calcified Zeolite
Fillers such as silicon nitride, aluminum nitride, silicon carbide, potassium titanate, barium titanate, strontium titanate, calcium titanate, aluminum borate, barium stannate, barium zirconate, and strontium zirconate may be contained. .

The particle shape of the above-mentioned filler and the like may be substantially spherical, needle-like, flake-like, etc. From the viewpoint of filling properties, substantially spherical shape is preferred. The particle diameter is usually about 0.1 to 15 μm, which is smaller than the thickness of the polyether ether ketone-based organic material layer 1.

Further, the surface of the polyetheretherketone-based organic material layer 1 is buffed, blasted, brushed, plasma-treated or corona-treated in order to improve the adhesion to the coating layer 2 made of a polyphenylene ether-based organic material. It is preferable that the center line surface roughness Ra be roughened to a value of 0.05 to 5 μm by using a method such as ultraviolet ray treatment or chemical treatment. The center line surface roughness Ra is preferably 0.05 μm or more from the viewpoint of preventing separation of the polyether ether ketone-based organic material layer 1 and the coating layer 2 during solder reflow, and the coating layer 2 is formed on the surface. The thickness is preferably 5 μm or less from the viewpoint of preventing entrapment of air during formation. Therefore, the surface of the polyether ether ketone-based organic material layer 1 has a center line surface roughness R
It is preferable that a has a rough surface of 0.05 to 5 μm.

Polyetheretherketone-based organic material layer 1
The coating layer 2 formed on the surface has a function as an adhesive when the wiring conductor 4 is adhered and formed, and when the insulating film 3 is used to form the multilayer wiring substrate 6, the insulating films 3 are separated from each other. Serves as an adhesive when laminating.

The coating layer 2 contains 30 to 90% by volume of a polyphenylene ether resin or a derivative thereof, or a polyphenylene ether type organic material such as a polymer alloy of these, and particularly, the thermal cycle reliability and the adhesion of the wiring conductor 4 to each other. From the viewpoint of positional accuracy in this case, it is preferable to contain a thermosetting polyphenylene ether such as allyl-modified polyphenylene ether.

When the content of the polyphenylene ether-based organic matter is less than 30% by volume, the kneading property with the filler, which will be described later, tends to decrease, and when it exceeds 90% by volume, the polyetheretherketone-based organic matter is contained. When the coating layer 2 is formed on the surface of the organic material layer 1, the thickness variation of the coating layer 2 tends to increase. Therefore, the content of the polyphenylene ether organic substance is preferably in the range of 30 to 90% by volume.

From the viewpoint of improving the adhesiveness with the polyetheretherketone-based organic material layer 1 and the adhesiveness with the wiring conductor 4 and the through conductor 5, the coating layer 2 contains a functional group capable of undergoing a polymerization reaction. It is preferable to contain an additive such as a polyfunctional monomer or a polyfunctional polymer having two or more, and for example, it is preferable to contain triallyl cyanurate, triallyl isocyanurate or a polymer thereof.

Further, the coating layer 2 comprises a rubber component for adjusting the elastic modulus and an antioxidant for improving the thermal stability,
Light stabilizers such as UV absorbers to improve light resistance, halogen-based or phosphoric acid-based flame retardants to improve flame retardancy, antimony compounds, zinc borate, barium metaborate, and zirconium oxide. Flame retardant aids such as, lubricants such as higher fatty acids and higher fatty acid esters to improve lubricity, higher fatty acid metal salts and fluorocarbon surfactants,
Aluminum oxide, silicon oxide, titanium oxide, barium oxide, strontium oxide, zirconium oxide, calcium oxide, zeolite, silicon nitride, aluminum nitride, silicon carbide, potassium titanate for adjusting thermal expansion coefficient and improving mechanical strength・ Filling materials such as barium titanate, strontium titanate, calcium titanate, aluminum borate, barium stannate, barium zirconate, strontium zirconate, etc., or improving their bondability and mechanical properties. A coupling agent such as a silane coupling agent or a titanate coupling agent for increasing the mechanical strength may be contained.

In particular, when the insulating film 3 is laminated and pressed, from the viewpoint of suppressing the fluidity of the coating layer 2 and preventing the positional displacement of the through conductor 5 and the variation in the thickness of the coating layer 2, the coating layer 2 is It is preferable to contain 10% by volume or more of inorganic insulating powder as the filler. In addition, the bonding interface with the polyether ether ketone-based organic material layer 1 and the wiring conductor 4
The content of the filler is preferably 70% by volume or less from the viewpoint of preventing peeling during solder reflow at the adhesive interface with. Therefore, it is preferable that the coating layer 2 made of a polyphenylene ether-based organic material contains 10 to 70% by volume of the filler.

The shape of the above-mentioned filling material is substantially spherical.
There are needle-like shapes and flake-like shapes, and a substantially spherical shape is preferable from the viewpoint of filling properties. The particle size is about 0.1 to 15 μm, which is smaller than the thickness of the coating layer 2.

According to the insulating film 3 of the present invention, since the coating layers 2 made of polyphenylene ether organic material are formed on the upper and lower surfaces of the polyether ether ketone organic material layer 1, polyphenylene ether organic material molecules are formed. Is not as rigid as the polyetheretherketone-based organic molecule, and does not show regular orientation, so that the molecule is relatively easy to move, and as a result, the insulating film 3
Even in the case of forming a multi-layered structure, the adhesion between the insulating films 3 becomes good, and there is no possibility that insulation failure occurs due to peeling between the films in the high temperature bias test. Even when the wiring conductor 4 is arranged on the surface of the insulating film 3, the polyphenylene ether-based organic compound molecules can enter the fine recesses on the surface of the wiring conductor 4 and exert a sufficient anchoring effect. Adhesion with the conductor 4 is improved, and as a result, there is no possibility that the wiring conductor 4 is disconnected due to peeling between the two under high temperature and high humidity. Furthermore, since the coating layer 2 made of a polyphenylene ether-based organic material and the polyether ether ketone-based organic material layer have substantially the same frequency behavior of the dielectric constant,
Even if a slight variation in thickness occurs due to the pressure applied when the wiring conductor 4 is bonded, it is possible to obtain the insulating film 3 having excellent high-frequency transmission characteristics that does not cause deterioration of the transmission characteristics in the high-frequency region.

Such an insulating film 3 is obtained by adding a thermosetting polyphenylene ether resin and a solvent, a plasticizer, a dispersant, etc. to an inorganic insulating powder such as silicon oxide having a particle size of about 0.1 to 15 μm. After forming the coating layer 2 on the upper and lower surfaces of the polyetheretherketone-based organic material layer 1 by using a conventionally known sheet molding method such as the doctor blade method, or in the above-mentioned paste, the polyetheretherketone-based organic material layer It is manufactured by forming a coating layer 2 on the surface of the polyetheretherketone-based organic material layer 1 by immersing 1 and pulling it up vertically, and then heating and drying this at a temperature of 60 to 100 ° C. for 5 minutes to 3 hours. It

The thickness of the insulating film 3 is preferably 10 to 200 μm from the viewpoint of ensuring insulation reliability, and from the viewpoint of ensuring high heat resistance, low hygroscopicity and high dimensional stability. Means that the thickness of the polyetheretherketone-based organic material layer 1 is 40 to 90 times that of the insulating film 3.
It is preferable to set it in the range of%.

The multilayer wiring board 6 of the present invention is formed by laminating a plurality of insulating films 3 each having a wiring conductor 4 made of a metal foil disposed on at least one of the upper and lower surfaces thereof.
Wiring conductors 4 located above and below with the insulating film 3 interposed therebetween
It is formed by electrically connecting the gaps through the penetrating conductors 5 formed on the insulating film 3.

Wiring conductor 4 formed on insulating film 3
Is made of a highly conductive metal foil such as copper and gold having a thickness of about 2 to 30 μm, and electrically connects the electronic component 7 mounted on the multilayer wiring board 6 to an external electric circuit (not shown). Have a function.

Such a wiring conductor 4 is composed of the insulating film 3
From the viewpoint of preventing voids from being generated around the wiring conductor 4 when a plurality of wiring conductors are stacked, the wiring conductor 4 is buried so that at least the surface of the wiring conductor 4 and the surface of the coating layer 2 are flat. Is preferred. When the wiring conductor 4 is embedded in the coating layer 2, if the porosity of the coating layer 2 in the dry state is set to 3 to 40% by volume, resin swelling of the coating layer 2 around the wiring conductor 4 does not occur. The air can be flattened and the air trapped between the wiring conductor 4 and the coating layer 2 can be easily discharged to prevent air bubbles from being trapped. When the porosity in the dry state exceeds 40% by volume, pores remain in the coating layer 2 after pressurizing and heating and curing a plurality of laminated insulating films 3, and the pores adsorb moisture in the air. Therefore, it is preferable that the porosity of the coating layer 2 in the dry state is in the range of 3 to 40% by volume because the insulating property may be deteriorated.

The porosity of the coating layer 2 in the dry state is such that when the coating layer 2 is applied onto the surface of the polyether ether ketone-based organic material layer 1 and dried, the drying temperature, the rate of temperature rise, etc. A desired value can be obtained by appropriately adjusting the conditions.

Further, the cross-sectional shape in the width direction of the wiring conductor 4 arranged on the insulating film 3 is a trapezoidal shape in which the length of the bottom side on the insulating film 3 side is shorter than the length of the opposite bottom side, and the insulating film is formed. The angle between the bottom side and the side on the 3 side is
It is preferably set to 95 to 150 °. The cross-sectional shape of the wiring conductor 4 disposed on the insulating film 3 in the width direction is a trapezoid whose base length on the insulating film 3 side is shorter than the length of the opposing base, and By setting the angle formed by the sides with 95 to 150 °, the wiring conductor 4
When the wiring conductor 4 is embedded in the coating layer 2, the wiring conductor 4 can be easily embedded in the coating layer 2 so that the surface of the coating layer 2 after the wiring conductor 4 is embedded can be made substantially flat. It is possible to obtain the multilayer wiring board 6 that does not bite into and deteriorate the insulation. From the viewpoint of embedding air bubbles without biting, it is preferable that the angle formed by the bottom side and the side side of the insulating film 3 side be 95 ° or more.
From the viewpoint of miniaturization, it is preferable that the angle be 150 ° or less.

In addition, the thickness x (μ of the coating layer 2 located between the bottom of the wiring conductor 4 having a short length and the polyether ether ketone-based organic material layer 1 between the insulating film 3 layers.
m) is the distance between the upper and lower polyether ether ketone-based organic material layers 1 is T (μm), and the thickness of the wiring conductor 4 is t (μ).
m), 3 μm ≦ 0.5T−t ≦ x ≦ 0.5T ≦ 35
μm (however, 8 μm ≦ T ≦ 70 μm, 1 μm ≦ t ≦ 32 μ
m) is preferred.

Polyetheretherketone-based organic material layer 1
The distance between them is T (μm), and the thickness of the wiring conductor 4 is t (μm)
Then, the thickness x (μm) of the coating layer 2 made of polyphenylene ether organic material between the bottom of the wiring conductor 4 having a short length and the polyether ether ketone organic material layer 1 is 3
By setting μm ≦ 0.5T−t ≦ x ≦ 0.5T ≦ 35 μm, the bottom of the wiring conductor 4 having a short length and the distance between the polyetheretherketone-based organic material layer 1 and the bottom of the wiring conductor 4 having a long length are set. The difference in distance between adjacent polyether ether ketone-based organic material layers 1 can be made as small as less than t (μm), and the warp of the multilayer wiring board 6 caused by the large difference in the thickness of the coating layer 2 can be prevented. it can. Therefore, the thickness x (μm) of the coating layer 2 located between the upper bottom surface of the wiring conductor 4 and the polyetheretherketone-based organic material layer 1 is set to the distance between the polyetheretherketone-based organic material layers 1. Is T (μm), and the thickness of the wiring conductor 4 is t
(Μm), 3 μm ≦ 0.5T−t ≦ x ≦ 0.5T
It is preferable that the range is ≦ 35 μm.

Such a wiring conductor 4 is composed of the insulating film 3
It is formed by depositing a metal foil made of, for example, copper, which is patterned by a subtractive method using a known photoresist, on the precursor sheet to be formed by a transfer method or the like. First, a metal foil transfer film is prepared by adhering a metal foil made of copper on a film serving as a support through an adhesive, and then a metal foil on the film is subjected to a subtractive method using a known photoresist. Is used to etch in a pattern. At this time, the side surface on the surface side of the pattern is more likely to be etched because the side surface on the surface side is in contact with the etching solution for a longer time than the side surface on the film side, and the cross-sectional shape in the width direction of the pattern can be trapezoidal. In addition,
The trapezoidal shape allows the angle between the short base and the side to be adjusted to 95 ~ by adjusting the concentration of the etching solution and the etching time.
It can be trapezoidal at 150 °. Then, this metal foil transfer film is laminated on a precursor sheet which becomes the insulating film 3, and hot pressed for 10 minutes to 1 hour under the conditions of a temperature of 100 to 200 ° C. and a pressure of 0.5 to 10 MPa, and then becomes a support. By removing the film by peeling and transferring the metal foil onto the surface of the precursor sheet which becomes the insulating film 3, the wiring conductor 4 having the trapezoidal upper bottom side embedded in the coating layer 2 can be formed.

The thickness x (μm) of the coating layer 2 between the polyetheretherketone-based organic material layers 1 facing the short bottom of the wiring conductor 4 controls the pressure of the hot press at the time of transferring the metal foil. Therefore, the desired range can be obtained. Further, in order to improve the adhesion with the coating layer 2, the surface of the wiring conductor 4 is preferably roughened by a treatment such as buffing, blasting, brushing, or chemical treatment.

The insulating film 3 has a diameter of 20 to 15
The through conductor 5 having a thickness of about 0 μm is formed. Through conductor 5
Are the wiring conductors 4 located above and below with the insulating film 3 in between.
Has a function of electrically connecting to each other. After a through hole is formed by performing a drilling process on the insulating film 3 with a laser, a conductive paste made of copper, silver, gold, solder or the like is conventionally provided in the through hole. It is formed by embedding by a known screen printing method.

According to the multilayer wiring board 6 of the present invention, the insulating film 3 is formed by forming the coating layer 2 made of polyphenylene ether organic material on the upper and lower surfaces of the polyether ether ketone organic material layer 1. The polyetheretherketone-based organic material layer 1 has high heat resistance, high elastic modulus, high dimensional stability, and low hygroscopicity, and the insulating film 3 can be formed without using a reinforcing material such as glass cloth. As a result, laser drilling is facilitated, and fine and uniform through holes can be formed.

In such a multilayer wiring board 6, a through conductor 5 is formed at a desired position on a precursor sheet to be the insulating film 3 manufactured by the above-described method, and then a patterned metal foil of copper, for example, is formed. , The temperature is 100-200 ℃ and the pressure is 0.
Transfer by hot pressing for 10 minutes to 1 hour under the condition of 5 to 10 MPa, stacking these, and finally hot pressing under the condition of temperature of 150 to 300 ° C and pressure of 0.5 to 10 MPa for 30 minutes to 24 hours. It is manufactured by being completely cured.

Thus, according to the multilayer wiring board 6 of the present invention, a plurality of insulating films 3 formed by forming the coating layers 2 made of a polyphenylene ether organic substance on the upper and lower surfaces of the polyether ether ketone type organic substance layer 1 are laminated. As a result, the polyphenylene ether-based organic molecule is not as rigid as the polyether ether ketone-based organic molecule, and since it does not show a regular orientation, the molecule is relatively easy to move, so that the surface of the wiring conductor 4 is fine. A sufficient anchoring effect can be exerted in the recesses, and as a result, the adhesion between the insulating film 3 and the wiring conductor 4 is improved, and peeling between the two does not occur under high temperature and high humidity. Further, since the coating layer 2 made of a polyphenylene ether organic material and the polyether ether ketone organic material layer 1 have substantially the same frequency behavior of the dielectric constant,
A multilayer wiring board 6 having excellent high-frequency transmission characteristics, which does not cause deterioration of transmission characteristics in a high-frequency region even if a slight variation in thickness occurs in the coating layer 2 due to pressure applied when the wiring conductor 4 is bonded, can be obtained. it can. Furthermore, when the insulating film 3 is formed into multiple layers, the polyphenylene ether-based organic molecule is easily moved, so that the polyphenylene ether-based organic molecule is easily entangled with each other, and the adhesion between the coating layers 2 is strengthened. As a result, under the high temperature bias test. Also in this case, the insulating films 3 are not separated from each other to cause insulation failure.

The multilayer wiring board 6 of the present invention is not limited to the above-mentioned embodiments, but various modifications can be made without departing from the scope of the present invention. Then, the multilayer wiring board 6 is manufactured by laminating the four layers of the insulating films 3, but the multilayer wiring board 6 may be manufactured by laminating the insulating films 3 of two layers, three layers, or five layers or more. Further, a build-up layer or a solder resist layer formed of an insulating layer containing one or more layers or three or more layers of an organic resin as a main component may be formed on the upper and lower surfaces of the multilayer wiring board 6 of the present invention.

[0051]

EFFECTS OF THE INVENTION According to the insulating film of the present invention, since the coating layers made of polyphenylene ether organic compound are formed on the upper and lower surfaces of the polyether ether ketone organic compound layer, the polyphenylene ether organic compound molecule is It is not as rigid as polyetheretherketone-based organic molecules, and because it does not show a regular orientation, the molecules are relatively mobile, resulting in good adhesion between insulating films even when the insulating films are multilayered. Therefore, in the high temperature bias test, peeling between the films does not cause insulation failure. Further, even when the wiring conductor is arranged on the surface of the insulating film, the polyphenylene ether-based organic compound molecules can enter the minute recesses on the surface of the wiring conductor and exhibit a sufficient anchoring effect, resulting in close contact between the insulating film and the wiring conductor. As a result, the conductor foil will not be peeled off and the conductor foil will not be broken under high temperature and high humidity. Further, since the frequency behavior of the dielectric constant of the coating layer made of polyphenylene ether organic material and that of the polyether ether ketone organic material layer are almost equal, even if a slight thickness variation occurs due to pressure when bonding the wiring conductor, It is possible to obtain an insulating film excellent in high-frequency transmission characteristics without causing deterioration of transmission characteristics in a region.

Further, according to the multilayer wiring board of the present invention, since the above-mentioned insulating film is used, a multilayer wiring board excellent in moisture resistance and high frequency characteristics can be obtained. Furthermore, when the insulating film is multi-layered, the polyphenylene ether-based organic molecules move easily, so that the polyphenylene ether-based organic molecules tend to become entangled with each other and the adhesion between the coating layers becomes strong, resulting in insulation under high temperature bias test. There is no possibility of peeling between the films to cause insulation failure.

Furthermore, according to the multilayer wiring board of the present invention,
The cross-sectional shape in the width direction of the wiring conductor disposed on the insulating film is a trapezoid whose base length on the insulating film side is shorter than the length of the opposing base, and between the base and the side on the insulating film side. Since the angle formed is 95 to 150 °, the wiring conductor can be easily embedded in the coating layer, and the surface of the coating layer after the wiring conductor is embedded can be made almost flat. No air is caught between insulating layers,
A multilayer wiring board having high insulation reliability can be obtained.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an example of an embodiment of an insulating film of the present invention.

FIG. 2 is a sectional view showing an example of an embodiment of a hybrid integrated circuit in which a semiconductor element is mounted on a multilayer wiring board of the present invention.

FIG. 3 is an enlarged cross-sectional view of a main part of the multilayer wiring board shown in FIG.

[Explanation of symbols]

1-Polyether ether ketone-based organic material layer 2 ... coating layer 3 ... Insulation film 4 ... Wiring conductor 5 ... Through conductor 6 ... Multilayer wiring board

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 3/46 H05K 3/46 ZF term (reference) 4F100 AB01D AB01E AB33D AB33E AK54A AK54B AK54C AK56A BA03 BA04 BA05 BA06 BA07 BA10B BA10C BA10D BA10E BA15 GB43 JA04 JB13B JB13C JD04 JG04 5E346 AA12 AA42 BB15 CC08 CC13 CC32 CC38 DD02 DD32 DD48 EE02 EE19 FF18 GG22 HH08

Claims (4)

[Claims] 1. An insulating film, comprising a coating layer made of a polyphenylene ether organic material formed on the upper and lower surfaces of a polyether ether ketone organic material layer. 2. The insulating film according to claim 1, wherein the polyphenylene ether-based organic material is thermosetting polyphenylene ether. 3. A plurality of insulating films according to claim 1 or 2 in which a wiring conductor made of a metal foil is disposed on at least one of the upper and lower surfaces, and the insulating films are sandwiched between the upper and lower surfaces. A multilayer wiring board characterized in that the wiring conductors located at are electrically connected to each other through a through conductor formed in the insulating film. 4. The cross-sectional shape in the width direction of the wiring conductor disposed on the insulating film is a trapezoidal shape in which the length of the base on the side of the insulating film is shorter than the length of the opposite base, and The angle between the bottom side of the film and the side is 9
The multi-layer wiring board according to claim 3, wherein the multi-layer wiring board has an angle of 5 to 150 °.