JP2002536836A5 - - Google Patents

Download PDF

Info

Publication number
JP2002536836A5
JP2002536836A5 JP2000597989A JP2000597989A JP2002536836A5 JP 2002536836 A5 JP2002536836 A5 JP 2002536836A5 JP 2000597989 A JP2000597989 A JP 2000597989A JP 2000597989 A JP2000597989 A JP 2000597989A JP 2002536836 A5 JP2002536836 A5 JP 2002536836A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000597989A
Other versions
JP2002536836A (ja
Filing date
Publication date
Priority claimed from FR9901390A external-priority patent/FR2789541B1/fr
Application filed filed Critical
Publication of JP2002536836A publication Critical patent/JP2002536836A/ja
Publication of JP2002536836A5 publication Critical patent/JP2002536836A5/ja
Pending legal-status Critical Current

Links

JP2000597989A 1999-02-05 2000-01-06 プリント回路上にはんだ付け可能なボールコネクタあるいは一体化プリフォームを有する電子モジュールの製造方法および装置 Pending JP2002536836A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR99/01390 1999-02-05
FR9901390A FR2789541B1 (fr) 1999-02-05 1999-02-05 Procede de realisation de modules electroniques a connecteur a billes ou a preformes integre brasables sur circuit imprime et dispositif de mise en oeuvre
PCT/FR2000/000018 WO2000047027A1 (fr) 1999-02-05 2000-01-06 Procede de realisation de modules electroniques a connecteur a billes ou a preformes integrees brasables sur circuit imprime et dispositif de mise en oeuvre

Publications (2)

Publication Number Publication Date
JP2002536836A JP2002536836A (ja) 2002-10-29
JP2002536836A5 true JP2002536836A5 (ja) 2007-02-22

Family

ID=9541674

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000597989A Pending JP2002536836A (ja) 1999-02-05 2000-01-06 プリント回路上にはんだ付け可能なボールコネクタあるいは一体化プリフォームを有する電子モジュールの製造方法および装置

Country Status (10)

Country Link
US (1) US7032306B1 (ja)
EP (1) EP1155603B1 (ja)
JP (1) JP2002536836A (ja)
KR (1) KR100709613B1 (ja)
AT (1) ATE233986T1 (ja)
AU (1) AU3051000A (ja)
CA (1) CA2352138C (ja)
DE (1) DE60001540T2 (ja)
FR (1) FR2789541B1 (ja)
WO (1) WO2000047027A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003124595A (ja) * 2001-10-11 2003-04-25 Alps Electric Co Ltd 電子回路ユニット
US7316574B2 (en) * 2005-01-04 2008-01-08 Vtech Telecommunications Limited Systems and methods for protecting an electrical component from impact or repeated mechanical stress
US8534533B2 (en) * 2012-01-19 2013-09-17 Raytheon Company Solder paste transfer process
US8770462B2 (en) 2012-03-14 2014-07-08 Raytheon Company Solder paste transfer process
US20140055961A1 (en) * 2012-08-23 2014-02-27 Shayan Malek Printed Circuit Boards with Recesses
WO2015151292A1 (ja) * 2014-04-04 2015-10-08 三菱電機株式会社 プリント配線板ユニット

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3684602D1 (de) * 1986-10-08 1992-04-30 Ibm Verfahren zum herstellen von loetkontakten fuer ein keramisches modul ohne steckerstifte.
US5027191A (en) 1989-05-11 1991-06-25 Westinghouse Electric Corp. Cavity-down chip carrier with pad grid array
US5147084A (en) 1990-07-18 1992-09-15 International Business Machines Corporation Interconnection structure and test method
JPH04300072A (ja) 1991-03-28 1992-10-23 Matsushita Electric Ind Co Ltd クリーム半田吐出装置
JPH06224323A (ja) 1993-01-26 1994-08-12 Matsushita Electric Works Ltd 半導体装置及びその製造方法
DE4326104A1 (de) 1993-08-04 1995-02-09 Blaupunkt Werke Gmbh Elektrische Baugruppe
US5591941A (en) 1993-10-28 1997-01-07 International Business Machines Corporation Solder ball interconnected assembly
JP2541487B2 (ja) 1993-11-29 1996-10-09 日本電気株式会社 半導体装置パッケ―ジ
JP3240804B2 (ja) 1994-02-18 2001-12-25 株式会社村田製作所 回路モジュールの製造方法
US5539153A (en) * 1994-08-08 1996-07-23 Hewlett-Packard Company Method of bumping substrates by contained paste deposition
JP3082579B2 (ja) 1994-08-25 2000-08-28 松下電器産業株式会社 シールドケース
CA2135508C (en) * 1994-11-09 1998-11-03 Robert J. Lyn Method for forming solder balls on a semiconductor substrate
US5675183A (en) 1995-07-12 1997-10-07 Dell Usa Lp Hybrid multichip module and methods of fabricating same
US5730620A (en) * 1995-09-08 1998-03-24 International Business Machines Corporation Method and apparatus for locating electrical circuit members
JPH09130031A (ja) 1995-10-27 1997-05-16 Hitachi Ltd 電子部品の実装方法
JP3120714B2 (ja) * 1995-10-31 2000-12-25 松下電器産業株式会社 導電性ボールの搭載装置
TW338180B (en) 1996-03-29 1998-08-11 Mitsubishi Electric Corp Semiconductor and its manufacturing method
JPH1074887A (ja) * 1996-08-30 1998-03-17 Sony Corp 電子部品及びその製造方法
US5838545A (en) 1996-10-17 1998-11-17 International Business Machines Corporation High performance, low cost multi-chip modle package
DE19644416C1 (de) * 1996-10-25 1997-11-20 Schroff Gmbh Kontaktelement zur elektrischen Kontaktierung von Leiterkarten mit einer vorderen Modulschiene eines Baugruppenträgers
JP2845227B2 (ja) * 1996-11-29 1999-01-13 日本電気株式会社 マルチチップモジュールの実装構造
FR2762715B1 (fr) 1997-04-28 2000-07-21 Novatec Procede de realisation et de brasage de billes de connexion electrique sur des plages d'accueil de raccordement electrique de circuits ou de composants electroniques et dispositif de mise en oeuvre
FR2785140B1 (fr) 1998-10-27 2007-04-20 Novatec Sa Soc Dispositif de mise a disposition de billes ou de preformes pour la fabrication de connexions a billes
US6538898B1 (en) * 2000-05-01 2003-03-25 Micron Technology, Inc. Method and apparatus of die attachment for BOC and F/C surface mount

Similar Documents

Publication Publication Date Title
JP2003512733A5 (ja)
AR028236A3 (ja)
AU2000236813A8 (ja)
JP2001291399A5 (ja)
JP2001103232A5 (ja)
IN191798B (ja)
JP2000357786A5 (ja)
JP2001291896A5 (ja)
JP2002097444A5 (ja)
JP2001349899A5 (ja)
JP2002536836A5 (ja)
JP2002011876A5 (ja)
JP2001215537A5 (ja)
JP2002111749A5 (ja)
JP2002091796A5 (ja)
JP2001174730A5 (ja)
JP2000353348A5 (ja)
JP2001254277A5 (ja)
CN3141398S (ja)
CN3150083S (ja)
CN3148615S (ja)
CN3147473S (ja)
CN3145472S (ja)
CN3144126S (ja)
CN3143879S (ja)