JP2002533926A5 - - Google Patents

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Publication number
JP2002533926A5
JP2002533926A5 JP2000590209A JP2000590209A JP2002533926A5 JP 2002533926 A5 JP2002533926 A5 JP 2002533926A5 JP 2000590209 A JP2000590209 A JP 2000590209A JP 2000590209 A JP2000590209 A JP 2000590209A JP 2002533926 A5 JP2002533926 A5 JP 2002533926A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000590209A
Other languages
Japanese (ja)
Other versions
JP2002533926A (en
Filing date
Publication date
Priority claimed from US09/219,186 external-priority patent/US6072232A/en
Application filed filed Critical
Priority claimed from PCT/US1999/028012 external-priority patent/WO2000038230A1/en
Publication of JP2002533926A publication Critical patent/JP2002533926A/en
Publication of JP2002533926A5 publication Critical patent/JP2002533926A5/ja
Pending legal-status Critical Current

Links

JP2000590209A 1998-12-21 1999-11-23 Non-ceramic package with window with embedded frame Pending JP2002533926A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/219,186 US6072232A (en) 1998-10-13 1998-12-21 Windowed non-ceramic package having embedded frame
US09/219,186 1998-12-21
PCT/US1999/028012 WO2000038230A1 (en) 1998-12-21 1999-11-23 Windowed non-ceramic package having embedded frame

Publications (2)

Publication Number Publication Date
JP2002533926A JP2002533926A (en) 2002-10-08
JP2002533926A5 true JP2002533926A5 (en) 2007-01-11

Family

ID=22818234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000590209A Pending JP2002533926A (en) 1998-12-21 1999-11-23 Non-ceramic package with window with embedded frame

Country Status (8)

Country Link
JP (1) JP2002533926A (en)
KR (1) KR100490692B1 (en)
CN (1) CN1225786C (en)
AU (1) AU1744800A (en)
DE (1) DE19983826T1 (en)
GB (1) GB2359927B (en)
TW (1) TWI249234B (en)
WO (1) WO2000038230A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6825540B2 (en) * 2001-12-05 2004-11-30 Matsushita Electric Industrial Co., Ltd. Miniaturized, resin-sealed solid state imaging apparatus
CN104154995B (en) * 2014-08-21 2016-09-28 中国科学院光电研究院 A kind of EO-1 hyperion detection integration module and manufacture method thereof
CN111551775A (en) * 2020-06-16 2020-08-18 新纳传感系统有限公司 Method for manufacturing current sensor

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4285002A (en) * 1978-01-19 1981-08-18 International Computers Limited Integrated circuit package
JPS60115247A (en) * 1983-11-28 1985-06-21 Fujitsu Ltd Semiconductor device
JPH0724287B2 (en) * 1987-02-12 1995-03-15 三菱電機株式会社 Semiconductor device having light transmitting window and method of manufacturing the same
EP0468379B1 (en) * 1990-07-21 1999-11-17 Mitsui Chemicals, Inc. Semiconductor device having a package
US5324888A (en) * 1992-10-13 1994-06-28 Olin Corporation Metal electronic package with reduced seal width
JP2784126B2 (en) * 1993-02-23 1998-08-06 京セラ株式会社 Manufacturing method of semiconductor device storage package
US6326678B1 (en) * 1993-09-03 2001-12-04 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
US5498900A (en) * 1993-12-22 1996-03-12 Honeywell Inc. Semiconductor package with weldable ceramic lid
US5471011A (en) * 1994-05-26 1995-11-28 Ak Technology, Inc. Homogeneous thermoplastic semi-conductor chip carrier package
US5471001A (en) * 1994-12-15 1995-11-28 E. I. Du Pont De Nemours And Company Crystallization of adipic acid
JP3471111B2 (en) * 1995-03-20 2003-11-25 三菱電機株式会社 Semiconductor device
JPH0992748A (en) * 1995-09-21 1997-04-04 Mitsubishi Materials Corp Package for semiconductor element
JP3292798B2 (en) * 1995-10-04 2002-06-17 三菱電機株式会社 Semiconductor device
JPH09107054A (en) * 1995-10-13 1997-04-22 Sony Corp Semiconductor device
US5821617A (en) * 1996-07-29 1998-10-13 Microsemi Corporation Surface mount package with low coefficient of thermal expansion
JPH10189792A (en) * 1996-12-27 1998-07-21 Sony Corp Semiconductor package
JP2002020358A (en) * 2000-07-07 2002-01-23 Kansai Tlo Kk New water-soluble chiral shift reagent comprising complex of rare earth metal with amino acid derivative ligand and optically resolving agent comprising the complex
JP2002174956A (en) * 2000-12-06 2002-06-21 Ricoh Co Ltd Image forming device
JP2003042150A (en) * 2001-07-31 2003-02-13 Koyo Seiko Co Ltd Rolling bearing unit

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