JP2002518182A5 - - Google Patents
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- Publication number
- JP2002518182A5 JP2002518182A5 JP2000554502A JP2000554502A JP2002518182A5 JP 2002518182 A5 JP2002518182 A5 JP 2002518182A5 JP 2000554502 A JP2000554502 A JP 2000554502A JP 2000554502 A JP2000554502 A JP 2000554502A JP 2002518182 A5 JP2002518182 A5 JP 2002518182A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19826756A DE19826756C2 (de) | 1998-06-15 | 1998-06-15 | Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte Lotmetallpulver |
| DE19826756.8 | 1998-06-15 | ||
| PCT/DE1999/001777 WO1999065640A1 (de) | 1998-06-15 | 1999-06-15 | Verfahren zum verkapseln von lotmetallpulver und danach hergestellte lotmetallpulver |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002518182A JP2002518182A (ja) | 2002-06-25 |
| JP2002518182A5 true JP2002518182A5 (https=) | 2006-01-05 |
| JP3783031B2 JP3783031B2 (ja) | 2006-06-07 |
Family
ID=7871020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000554502A Expired - Fee Related JP3783031B2 (ja) | 1998-06-15 | 1999-06-15 | 軟ろう粉末をカプセル化する方法およびそれによって製造される軟ろう粉末 |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US6416863B1 (https=) |
| EP (1) | EP1094915B1 (https=) |
| JP (1) | JP3783031B2 (https=) |
| KR (1) | KR100549612B1 (https=) |
| CN (1) | CN1106905C (https=) |
| AT (1) | ATE249308T1 (https=) |
| BR (1) | BR9911173A (https=) |
| CA (1) | CA2335002C (https=) |
| DE (2) | DE19826756C2 (https=) |
| DK (1) | DK1094915T3 (https=) |
| ID (1) | ID27425A (https=) |
| IL (2) | IL140053A0 (https=) |
| NZ (1) | NZ508383A (https=) |
| WO (1) | WO1999065640A1 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3888573B2 (ja) * | 2001-06-29 | 2007-03-07 | 富士電機ホールディングス株式会社 | ハンダ組成物 |
| JP2008527119A (ja) | 2005-01-13 | 2008-07-24 | シンベンション アーゲー | 炭素ナノ粒子を含有する複合材料 |
| ES2498718T3 (es) | 2008-11-21 | 2014-09-25 | Henkel US IP LLC | Polvos metálicos recubiertos de polímero térmicamente descomponible |
| US20120183775A1 (en) | 2009-10-15 | 2012-07-19 | Yoichi Shinba | Process for production of core-shell particles, core-shell particles, and paste composition and sheet composition which contain same |
| US9682447B2 (en) | 2010-08-20 | 2017-06-20 | Henkel IP & Holding GmbH | Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes |
| GB2491387A (en) * | 2011-06-02 | 2012-12-05 | Magnequench Ltd | Rare earth material capsule used in making a magnet |
| CN102220550B (zh) * | 2011-06-13 | 2012-07-04 | 苏州国通科技有限公司 | 一种锡熔液保护剂 |
| EP2753442B1 (en) | 2011-09-06 | 2019-10-30 | Henkel IP & Holding GmbH | Di-or poly-functional electron deficient olefins coated metal powders for solder pastes |
| JP5947238B2 (ja) * | 2013-03-25 | 2016-07-06 | 株式会社日立製作所 | ペースト、アルミニウム電線体、アルミニウム電線体の製造方法、モータ及びモータの製造方法 |
| JP6455508B2 (ja) * | 2014-03-25 | 2019-01-23 | 住友金属鉱山株式会社 | 被覆はんだ材料およびその製造方法 |
| US9878039B1 (en) | 2016-09-01 | 2018-01-30 | International Business Machines Corporation | Microcapsule having a microcapsule shell material that is rupturable via a retro-dimerization reaction |
| US10328535B2 (en) | 2016-11-07 | 2019-06-25 | International Business Machines Corporation | Self-heating solder flux material |
| CN108722000B (zh) * | 2018-05-25 | 2020-09-29 | 中国人民解放军63908部队 | 十二烷基三甲基溴化铵在固-液云爆剂组分分离中的应用及方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3736653A (en) * | 1970-05-07 | 1973-06-05 | Ncr Co | Process for soldering using pre-fluxed solder powder |
| JP2564152B2 (ja) | 1987-10-27 | 1996-12-18 | タムラ化研株式会社 | はんだペースト |
| US4944326A (en) * | 1989-09-08 | 1990-07-31 | Su Yueh Hsieh | Inlet valve for water tanks |
| US5272007A (en) * | 1992-02-21 | 1993-12-21 | Union Carbide Chemicals & Plastics Technology Corporation | Solder powder coated with parylene |
| DE4402042A1 (de) * | 1994-01-25 | 1994-06-09 | Kunststoff Maschinen Handelsge | Mikropartikulierte Reflow-Lötmittel und Verfahren zu deren Herstellung |
| US5922403A (en) | 1996-03-12 | 1999-07-13 | Tecle; Berhan | Method for isolating ultrafine and fine particles |
-
1998
- 1998-06-15 DE DE19826756A patent/DE19826756C2/de not_active Expired - Fee Related
-
1999
- 1999-06-15 DE DE59906970T patent/DE59906970D1/de not_active Expired - Fee Related
- 1999-06-15 KR KR1020007013564A patent/KR100549612B1/ko not_active Expired - Fee Related
- 1999-06-15 ID IDW20002606A patent/ID27425A/id unknown
- 1999-06-15 BR BR9911173-0A patent/BR9911173A/pt not_active IP Right Cessation
- 1999-06-15 US US09/719,281 patent/US6416863B1/en not_active Expired - Lifetime
- 1999-06-15 EP EP99939356A patent/EP1094915B1/de not_active Expired - Lifetime
- 1999-06-15 CA CA002335002A patent/CA2335002C/en not_active Expired - Fee Related
- 1999-06-15 CN CN99807440A patent/CN1106905C/zh not_active Expired - Fee Related
- 1999-06-15 NZ NZ508383A patent/NZ508383A/xx unknown
- 1999-06-15 WO PCT/DE1999/001777 patent/WO1999065640A1/de not_active Ceased
- 1999-06-15 AT AT99939356T patent/ATE249308T1/de not_active IP Right Cessation
- 1999-06-15 DK DK99939356T patent/DK1094915T3/da active
- 1999-06-15 IL IL14005399A patent/IL140053A0/xx active IP Right Grant
- 1999-06-15 JP JP2000554502A patent/JP3783031B2/ja not_active Expired - Fee Related
-
2000
- 2000-12-03 IL IL140053A patent/IL140053A/en not_active IP Right Cessation