JP2002517807A - Disposable chip electronic device and manufacturing method - Google Patents

Abstract

An electronic chip device includes an interface support film having a support film and at least one flat conductive interface placed on the support film, as well as a microcircuit connected to the interface. The interface support film possesses such properties that it can be creased or folded on itself without deterioration. The support film possesses a thickness of less than 75 mum, the best results being obtained with a thickness of between 10 mum and 30 mum. Preferably the support film is selected from among polypropylene (PP), polyethylene (PE), polyethylene teraphtalate (PET). In one embodiment, the device includes a compensation film placed on the support film. The compensation film has a recess containing the microcircuit and its connections. The recess can contain a material to encapsulate the microcircuit and its connections.

Description

DETAILED DESCRIPTION OF THE INVENTION

The present invention relates to the field of chip electronic devices including a communication interface and a method of manufacturing the same. The present invention particularly relates to a chip-type electronic device in which an interface is a contact type and / or an antenna type such as a chip card or a micro module label. A particular aim of the present invention is a temporary or disposable antenna type device suitable for communicating over a distance of more than 50 cm at a frequency of several megahertz to several gigahertz.

[0002] International application WO 97/26621, which describes chip and antenna modules, which can be used as labels, is well known. The card is obtained by inserting the antenna module into the cavity of the card body, and some labels are obtained by setting the conditions of the antenna module in an arbitrary substrate such as a coin.

[0003] These modules comprise an interfaced film substrate, commonly called a printed circuit, on which at least one interface in the form of an antenna and / or in the form of a connection area and a chip such as a chip connected to the interface. A coating material is provided to protect the microcircuit and the microcircuit and its connections. The antenna is mounted on one side of the micromodule, especially on the backside,
The other surface can optionally have a connection area.

[0004] Interfaced film substrates must have the minimum mechanical properties required, especially in actual manufacturing methods. In particular, in addition to the flexibility that can be wound around the coil, it must have inflexibility and hardness that can be assumed to be pulled in by a projection that meshes with the perforations on the side surface. The inflexibility of the interface film substrate is also severe enough to break if bent.

[0005] Currently used film substrates are selected from epoxy glass, polyimide and polyethylene terephthalate (PET). Their typical properties and characteristics are as follows: thickness from 75 μm to 125 μm, elongation at break less than 75%, heat resistance strength at least above 160 ° C.

The interface itself is typically made of copper. The interface surface is hard,
Tracks are generally thin (50-200 μm) and have precise accuracy on the order of a few microns. The interface is typically provided with a surface treatment, such as a Ni-Au type, which further increases hardness, further improves weldability and protects against oxidation.

[0007] The device obtained by the above-mentioned application has the disadvantage that it is too expensive for the intended use of the present invention. Further, they have limited uses and do not correspond to the objects of the present invention listed below.

The main object of the present invention is a contact or contactless, active or passive chip electronic device, which is very economical, yet reliable, has as few steps as possible, and The aim is to devise an electronic device that is as easy to use and possibly disposable as it can be manufactured using as standard and economical techniques as possible.

Another object is to devise a device suitable for the above device to communicate more preferably at a distance of more than 50 cm (for passive devices) and more than 1 m (for active devices).

[0010] Another object is to devise and economically manufacture antenna-type and / or contact-type modules, in particular for the user to be able to print easily and directly.

[0011] Another object is to devise a device that allows the above device to be used on a large number of substrates with full reliability under a wide variety of conditions.

[0012] Another object is to devise and economically produce a contact or contactless chip card or ticket.

[0013] Some objects are also achieved by using a film substrate with an interface of entirely different characteristics, contrary to the characteristics required for the interfaced film substrate in the field of chip cards shown above. However, it is also possible to adopt a method of manufacturing rollers and then to adapt the method, in particular to the level of connection of the chips, to take into account the new properties of the film. Other objects are achieved with the particular arrangement of the device described below.

[0014] To this end, an object of the present invention is to provide a chip-type electronic device comprising: an interface-type film substrate including a film substrate and at least one planar conductive interface disposed on the film substrate; Having a microcircuit connected to it. The feature is that the interface type film substrate,
It has properties suitable for being wrinkled and bent without deterioration.

Good results have been obtained with a film substrate or interface suitable for wrinkling or folding the whole, when the radius of curvature is less than 2.5 mm, preferably less than 1 mm.

This provision provides for interfaces whose intrinsic properties are similarly degraded as compared to state-of-the-art and / or thin interfaces, as well as those whose properties are inherently similar when compared to state-of-the-art and / or thin film substrates. This also applies to the combination of film substrates that deteriorate. In the present invention, the characteristics of each (film substrate and / or interface) should be considered in combination. Both of these properties can be significantly degraded, or one property can be significantly degraded while the other is not. Each thickness can also be made more or less thin depending on the degree of degradation of the material of the film substrate and interface.

With such a combination and combination, an inexpensive and highly reliable apparatus can be freely used, and the apparatus can withstand various operations.

It must be clearly stated that in some cases, for example, degradation with respect to inflexibility can cause other qualities of the final product, such as with respect to elasticity, to accompany it, which may lead to manufacturing difficulties. It can be the cause of The deterioration referred to in the present invention is
This is in comparison with the characteristics currently being sought in the field of chip cards.

According to one characteristic, the thickness of the film substrate is less than 75 μm, the best result being 1
It is obtained with a thickness of 0 μm to 30 μm.

With such a thin film substrate, the present invention not only can be obtained with material savings, with potential cost reduction effects, but also in particular with the elaboration of the final equipment, the potential of the new applications described below. Can be provided.

According to another characteristic of the invention, the material of the film substrate is preferably made of a polymer and has a breaking elongation of more than 80% and / or a Shore hardness of less than 80 and / or a glass transition temperature Tg of less than 0 ° C. and / or Alternatively, it may have a melting temperature of less than 130 ° C.

Preferably, the film substrate is polypropylene (PP), polyethylene (PE)
And polyethylene terephthalate (PET). In other cases, it may include a fibrous material such as, for example, cellulose or fiber.

The metal of the interface is preferably not subjected to a surface treatment for curing such as a Ni—Au type. The thickness is preferably less than 50 μm. Aluminum and its alloys are preferred as materials.

Materials such as PE, PP, etc. are very economical, since they are advantageously manufactured in a different field than chip cards, ie with long rollers for packaging. PE / aluminum or PP / aluminum composites which the present invention proposes to use as a basis for refining interfaced film substrates are also used for foodstuffs, especially for yogurt lids, champagne stoppers and the like. Widely used in the field of packaging.

According to another feature, the device comprises a microcircuit arranged especially at the corner of the film substrate, preferably outside the winding. More preferably, it is desirable to dispose the microcircuit directly on the film substrate.

The device also preferably comprises an interface element on another side, called a "strap", for guiding at least one end of the antenna (6) close to the chip.

Thus, leaving as large a portion of the print surface as possible free, with the chip in contact with the film substrate, it is possible to have a very sophisticated device aimed at the applications described below. The use of "straps" is an interesting solution that will be described in detail later.

According to still further features and / or other aspects and embodiments of the present invention, the device comprises:
A compensation film is provided on a film substrate, and the compensation film has a concave portion that accommodates the microcircuit and a connection portion thereof.

The recess can include a coating material for the microcircuit and its connection. The coating material is preferably at least partially fitted to the form by the inner wall of the recess.

Although the compensating film can be used in connection with all other film substrates existing in the prior art, a further advantage in using in connection with interfacing film substrates suitable for folding according to the invention is Can be found.

The compensation film has the advantage of compensating for the height of the microcircuit, in addition to the advantages in the manufacture of the device, which will become apparent hereinafter, and in particular allows printing on the entire surface of the device without degrading the microcircuit. It has the advantage of protecting it for good.

Its function is to flatten the surface of the device to allow use of the device without bumps, and in some cases to receive other decorative films and / or adhesive tapes on the microcircuit. is there.

[0033] It also protects the microcircuit from the pressure applied when fixing it on some substrate, in particular with an adhesive placed on the compensation film.

It also highlights the weak mechanical stability, especially of the interface film substrate,
Allows for a wide variety of uses to compensate.

It can be selected from the widest variety of materials, can be adapted to any application, and can still be used without changing the method described below.

The present invention is also directed to a chip-type ticket or card provided with the present device. Preferably, they include a card or ticket body made of the compensation film. That is, they have recesses in which the microcircuits are located, and the film substrate and interface extend over the surface of the compensation film outside the recesses.

In this way, a chip card or a ticket protected by a microcircuit is obtained in some cases.

According to an embodiment variant, the recess is a cavity that is impervious or closed with an additional film.

The present invention is also directed to a method of manufacturing a chip-type electronic device, the chip-type electronic device including a film substrate, at least one planar interface, and a microcircuit connected to the interface. Having an interface film substrate, wherein the steps of the manufacturing method comprise providing at least one interface film substrate, fixing at least one microcircuit on the interface film substrate, and connecting it to the interface. Become. A feature of this method is to provide an interface film substrate that has properties suitable for wrinkling and bending without degradation.

The interface is preferably realized by an economical technique of plate making of a printed or lithographic pattern on one or more conductive surfaces previously fixed on a film substrate.

Since such a film substrate and an interface can be selected and an interface realizing technique can be selected as well, the cost of the entire apparatus can be reduced by using an inexpensive interface type film substrate.

The method of the present invention is characterized in that the method comprises fixing a compensation film on the interface type film substrate, wherein the compensation film has at least one concave portion corresponding to a microcircuit installation. , May be characterized by yet another feature and / or other aspects and embodiments.

This process can be used in connection with all other film substrates existing in the prior art, but is particularly advantageous for use in connection with interfacing film substrates suitable for folding according to the present invention. Can be found.

The compensating film reinforces the interface type film substrate, which may be subject to further mechanical resistance, especially during the traction movement in the process of the method.

It also allows the film substrate to be wound flat, possibly between each step or for delivery to the customer. In that way, wasteful use of plug-in films commonly used as protectors during the various steps of manufacturing described below is avoided.

The printing process can be performed on both sides of the device without damaging the microcircuit.

When covering the microcircuit and its connection, the recess of the compensation film can function as a mold.

The compensating film may, in some cases, serve to accommodate side perforations for traction and positioning protrusions, allowing the coil to be conditioned when using current traction means.

The compensation film allows for the combination of various materials in the device. In particular, it can be based on cellulose or any other polymeric material, fiber or any other material in sheet form.

In another embodiment without a compensating film, the strip-shaped interfacing film substrate is fed onto a roller and at least one of the steps corresponding to the steps of the method is carried out by means of a transfer means according to the tension of the film substrate. It is transported towards a working position, in particular the transfer of the microcircuit and / or possibly its coating.

Thanks to this arrangement, in the worst case, the ultra-flexible and elastic interface-type film substrate can be positioned without damage, without relying on compensation films, without the need for perforated side perforations. It can be transported without obstruction and / or without indication before the various operating positions of the method.

According to yet another feature, the microcircuit can be connected by ultrasonic welding of the conductor. In particular, welding using an aluminum wire for an embedded terminal electrode or an aluminum interface is used.

The use of this connection technique is particularly preferred because it is reliable, widely used and economical. As will be described later, this method of treatment has a difficult problem, which forbids its use on an interface film substrate having the characteristics according to the present invention.

According to yet another feature, an interface film substrate with interface elements on both sides is used. In particular, a capacitor armature can be implemented on each side and / or a "strap" can be implemented simultaneously with the interface.

Therefore, since these interface elements can be made simultaneously with the same technology as already shown above, the implementation cost of the interface elements can be reduced. Other alternatives are more expensive economically, but are bridged over the coil in a unique operation, or by adding an inconspicuous capacitor.

According to yet another feature, the interface elements on both sides of the film substrate can be connected through the film substrate by mechanical tearing or mechanical contact. In some cases, these connections can be fixed ultrasonically.

The selection of the thickness of the interface type film substrate and the selection of the material according to the present invention make it possible to use such a connection method. This is particularly suitable and economical, since it takes place without the supply of material and can be carried out in one step which can be concealed in the method of manufacturing the device.

[0058] Other features and advantages of the present invention will appear from the following description made with reference to the accompanying drawings, which are given solely by way of reference. FIG. 1 shows a label which is simplified according to the invention and which can be remotely identified by means of a radio frequency signal. 2 shows a sectional view of the label of FIG. 1 at the location of the micromodule. FIG. 3 shows a variant of FIG. FIG. 4 shows a variant of FIG. FIG. 5 shows the underside of the label of FIG. FIG. 6 shows a top view of a label with a connection area. FIG. 7 shows the structure of a card according to the invention. FIG. 8 shows a cross-sectional view of another variant of the structure of the card. FIG. 9 shows another structure of the inventive device according to the invention. FIG. 10 shows a general view of the implementation of the method of the invention. FIG. 11 shows an overall view of an embodiment variant of the method of the invention for the production of chip and antenna cards. FIG. 11A shows the structure of the card obtained by the method shown in the previous figure. FIG. 12 shows a bending test for characterizing the device of the invention.

FIG. 1 shows a simplified embodiment of a chip-type electronic device according to the invention in the form of chip-type and antenna-type electronic labels (self-inductance and capacitors). It comprises a planar conductive interface comprising a film substrate 1, in this example a winding 2 of a planar antenna 3 spirally arranged inward from the edge on said film substrate, and an integrated circuit connected to said interface. It includes a microcircuit 4 such as a chip. The antenna has both ends reaching inside and outside, respectively, and each forms buried terminal poles 5 and 6 of contacts. The connection is realized by connecting lines 7 and 8 in this example.

The device also comprises a matching capacitor, which in this example is realized with conductive surfaces 9, 10 arranged opposite sides of the film substrate. In some cases, the capacitor may have seams, such as perforations or other methods of removing surface portions, as can be done with a laser. In other cases, a discreet capacitor may be placed on the film or incorporated into a microcircuit.

To bring the contact 6 at one end of the armature of the antenna or capacitor located inside the winding close to the other end 5 located outside the winding, or vice versa, There is also a method of disposing the (strap) on the back side of the film substrate (FIG. 5). Indeed, the "strap" 11 allows at least one end of the antenna to be brought close to the location of the chip, in this case on the edge of the label, outside the antenna. In the case of the compensation film described below, the position of the chip is not important. In particular, this is possible inside the winding.

According to one feature of the invention, the coating material 13 comprises at least a microcircuit and / or
Alternatively, the connecting wires are covered at least mechanically to protect them. In the example (of FIGS. 1 and 2), the material covers only the installation area (zp) of the microcircuit, including the connection lines,
The rest of the device is left bare.

In this example, the microcircuit area occupies a surface area equivalent to about 4 mm × 5 mm, while the label has a total surface area of 40 mm × 40 mm.

According to the present invention, the interface type film substrate has characteristics suitable for wrinkling and bending without deterioration.

FIG. 12 shows a bending test to characterize the device of the present invention. According to this test, the interfaced film substrate must be folded out of the chip area, e.g. in two or four, so that the opposing edges 14, 15 lie flat against each other and form a fold with a small radius of curvature R. No. In other cases, it must be possible to make an irregular crease with at least the aforementioned radius of curvature, which can be rounded or crumpled.

Here, the term “deterioration” means, of course, that the film substrate is broken or cut and becomes unsuitable for supporting the winding. It further states that the ability to deform, such as plastic deformation, is severely lost, and subsequent folds can result in tearing. With respect to the interface, the interface has been degraded, especially if the conductive properties are lost due to a reduction in cross-section, or a loss of elasticity that would result in tearing or breaking (eg, ten or so) bending.

A desired product can be obtained if it can withstand a bending radius of curvature R of less than 1 mm, especially less than 0.2 mm.

To achieve such performance, the elongation at break is greater than 80% and / or the Shore hardness is less than 80 and / or the Tg is less than 0 ° C. and / or the melting temperature is less than 130 ° C. and the thickness is 75 μm. Use a film substrate of less material.

The best results were obtained with a film substrate having a thickness of 10 μm to 30 μm.

The film substrate in the embodiment is preferably made of PP, PE, or the like as compared with epoxy glass or polyimide commonly used in a card or antenna module.
PET film with very degraded (lower, lower performance) properties, such as PET.

According to the invention, the interface is also suitable for the dimensions and / or the mechanical properties such as, in particular, ductility / elasticity / hardness, to match those of the film substrate and satisfy the bending test of the invention. Must only be.

In the embodiment, the interface is made of aluminum and is not particularly surface-treated with nickel / gold or the like. The thickness is 50 μm or less, preferably 7
To 30 μm.

In some cases, as an alternative, the film substrate may include a fibrous material, such as cellulose or textiles, among others. For example, it may be simply made of paper having a very small thickness as described above. The fibrous material of the woven fabric has characteristics such that it can be rounded without tearing and can wrinkle reversibly.

In FIG. 3, a protective material 13 having a layer as thin as possible to cover the entire surface of the label is used.
The thickness obtained from the tip area (zp) can be less than 400 μm, especially less than 300 μm for chips with a thickness on the order of 150 μm. The thickness obtained from the outer zone (zhp) of the chip is less than 150 μm, in particular less than 100 μm.

In the case of FIG. 3, a protective material having a certain degree of elasticity and flexibility that satisfies the above-described criteria of the present invention is preferred. Some epoxy and acrylic resins can also be compatible.

In the example shown in FIG. 2, an experiment was conducted in which the antenna was repeatedly bent at least one hundred times at a radius of curvature of 0.5 mm, and there was no problem with the label having no coating on the antenna.
In the example of FIG. 3, another bending experiment was performed with a radius of 2 mm, but this did not affect the function of the label.

Such an operation is not possible and / or not feasible with prior art chips and interface devices.

The labels of the present invention can be incorporated into very thin and / or very flexible products, the mechanical characteristics of which can be close to or less than the mechanical characteristics of the product. Therefore, it has the advantage that it cannot be sensed visually or tactilely. The resulting product can be given a thin film and even a tobacco leaf-like feel. Such devices are especially discreet electronic devices that can be inserted or stacked in thin products such as textile or leather linings, sheets, layered film products, cardboard products and packaging. As a use case,
Above all, a complete replacement for labels. The device of the invention in the form of a label can also make the antenna, for example, on a woven fabric or on the packaging film itself, forming part of the film that makes up the product or package.

To the extent that the substrate itself can be thinned and repeatedly bent, the device of the present invention can adapt to the resulting deformation without degradation. From this fact, under such conditions of use, with higher reliability than prior art devices,
An identification function can be secured.

In FIG. 4, an interface has been created on a continuous strip 24 of the film substrate 1. The microcircuit is preferably located at the corner of the film substrate, and directly thereon. It is desirable to select the chip positioning at the corners of the label, in order to reduce the mechanical stresses associated with the operation and to keep the surface as wide as possible for printing.

Band 24 includes a conductive frame (C) continuous around the interface and an aiming point (p) for interface position measurement and index / positioning during various operations of the method described below. In. The conductive frame can cure the band of the film substrate, possibly reducing the cost and time of plate making. An imaginary line drawn by a dotted line above the band indicates a cutting line indicating a boundary of the present apparatus.

The antenna diagram is designed to optimize the reach (in the case of non-contact) according to the operating frequency chosen.

In the example, the antenna 2 is mounted on the film substrate at a distance of more than 8 cm (passive, ie without batteries), preferably at a distance of more than 50 cm (active or battery-powered). It is designed to be able to communicate over a distance of more than 2 m from The size of the windings is chosen to be maximal and the number is optimized to achieve the expected distance (typically for frequencies of about 13 MHz, 4 to 6
Winding is required).

The spacing between the windings depends on the method of manufacturing the antenna. In the example, the pitch of the winding is 1 mm,
On the other hand, in the currently used apparatus, a pitch of 0.05 mm to 0.4 mm is achieved.

In order to connect both ends of the antenna to the microcircuit, the present invention preferably utilizes a configuration with a “strap” as seen in FIG.

In another variant, not shown, the device preferably comprises a capacitor, which is built into the chip rather than in the form of an armature on both sides of the film. This relieves the change in capacitor value, especially associated with the change in film thickness, and often the tedious antenna adjustment procedure. This is also desirable where the film substrate is not a good dielectric.

According to a feature not shown for the purpose of simplifying the device, the film substrate is provided with an interface element on only one side, and the capacitor can be mounted on the film substrate, or furthermore, as described above. Like, it can be placed inside a chip.

When the antenna has a plurality of windings and has a relatively large pitch, in order to avoid having a long connection line, only the microcircuit and its connection portion are locally thinner than the others. The winding can be designed to have a width.

More desirably, in order to reduce the length of the connection line while maintaining the minimum thickness of the device,
The microcircuit can be placed directly on the film substrate and between the windings running around it. The cost can be further reduced by combining the features of this variant described above.

Microcircuits can also be placed above windings at the expense of device height and microcircuit stability.

In other cases, the microcircuit can be positioned over the interface area to increase stability and better adhere with an adhesive.

In FIG. 6, it can be seen that the interface of the device D includes at least a connection area 16 on the surface visible in the drawing. The microcircuit is located on another side and can be reached in a known manner at the connection area by perforations made in the film. In some cases, a chip may be incorporated in a concave portion of a compensation film described later.

In an embodiment, it also comprises a print, such as a bar code 17, arranged over a large part, with the connections and the chips in the edge of the film substrate.

In a variant, the interface can at the same time be equipped with contacts and an antenna (not shown). The antenna can be placed on another surface that is not visible on the drawing, for example, and the capacitor can be placed in the chip.

In FIG. 7, a chip card 18 that is not the current ISO standard can be seen. It is a film substrate 2 type device (D) placed on the main body of the card substrate 19
The dimensions of the main body can be larger than the film, for example, twice or more the size of the film substrate 2. The side of the device to which the chip is not attached is preferably in contact with the main body of the card 19. The microcircuit is directed upwards, opposite to the body of the card 19.

The card may also have a second sheet 20 placed on the film substrate, the dimensions of which may be the same as the card 19 or may cover only the device.

According to a preferred variant (of FIG. 8), the card 19 constitutes a compensation film.
It comprises a closed recess 21 in which the coated microcircuit 4 is inserted and the interfaced film substrate (1, 2) extends out of the cavity above the surface of the card body. The fact that the device extends outside the cavity is not bothersome or visually bothersome due to the thinness of the interface film substrate. The card obtained in this way is almost flat and the microcircuit is protected by a cavity.

According to another feature, the device further comprises an attached miniature resonant circuit in which the emergency antenna and / or the built-in capacitor is arranged in the microcircuit, and which is arranged on an interfaced film substrate. Compensation is provided when a failed antenna or capacitor fails. In this way, it is possible to retrieve the information stored in the chip using a special reader from the vicinity without contact,
This further increases the reliability of the device.

For this purpose, the microcircuit is suitable for receiving power and communicating via the emergency antenna in the vicinity in case of a failure of the antenna circuit of the film substrate.

In FIG. 9, it can be seen that the device has a compensation film 22 arranged on an interface type film substrate. The compensation film, as is well known in the prior art,
Although it can be placed on any type of interfacing film substrate, it is more convincing to use one suitable for folding and rolling according to the present invention (as shown above). It's a good thing and a good one.

The compensation film has a concave portion 23 in which the microcircuit 4 and its connection portion 7 are provided.
, 8 and the covering material 13. The inner wall of the recess is in contact with the coating material, and forms a mold at least for a part of the coating material. Its thickness is preferably such that the recess 23 just exceeds the microcircuit and its covering.

The material of the compensation film may be any material, but it is desirable that the material be flexible for the intended use. In the example, a 150 μm chip and line connection
A polymer material PE having a thickness of 00 μm was used. Where indicated, 50
For connection with a μm chip and a flip chip type or a “silver glue” type conductive adhesive (Patent Application Nos. 9704093 or 9704094), compensation films of less than 50 μm may be available. Do you get it. This means that in this case chip-type devices of up to 110 μm are available. Layer 22 is itself printable.

The device can further comprise at least one protective / individualization layer 20 and / or adhesive layer 21 on at least one side of the film substrate or the compensation film.

The label realized in this way can have all the functions and finishes of a normal label, in addition to the function of an electronic identification device with maximum strict confidentiality that emphasizes thinness and flexibility. . In some cases, a self-adhesive adhesive film can be placed over the compensation film and the recesses can be directed toward the object to be labeled, thus masking the presence of the chip.

In a variant, the compensation film is any kind of adhesive mass known per se, preferably thicker, with or without a removable protective film. In this case, the adhesive mass itself at least partially compensates for the height of the microcircuit.

The label can be identified in particular by a bar code printed on the sheet 20 (of FIGS. 9 and 6) and a digital code corresponding to that stored in the memory of the integrated circuit.

The method of manufacturing the device of the present invention will now be described with reference to FIGS. 10, 11 and 11A. In the first step, an insulating film substrate 1 having at least one conductive planar interface 2, 9 is provided. It is referred to herein as an interfaced film substrate.

It can be used in a wide variety of well-known methods, such as plate making, conductive ink silk screen, selective bonding of conductive materials, cutting of rolled metal and rolling on film substrates,
It is available by printed circuit technology, insertion of conductors on insulating substrates, and the like.

In an embodiment, and in accordance with a feature of the present invention, a method of making a pattern printed or lithographically printed on at least one conductive film previously fixed on a film substrate, particularly by rolling or extrusion. It is preferred to use. In this way, in some cases, an interface can be created on each side of the film substrate.

The film substrate and interface are selected according to the above instructions for their mechanical properties and thickness. As the material of the metal film, aluminum is preferred over copper in the example, because the electrical performance is inferior to copper, but the price and ductility are excellent.

The choice of plate making method presupposes the use of truck dodging ink, which is expensive in the removal process that occurs after plate making. The location of the buried terminal pole in the connection to the microcircuit is locally removed to enable welding, but it is desirable to leave this ink on the interface to protect aluminum from oxidation and for aesthetic reasons . Local removal can be performed, in particular, by mechanical polishing and laser.

In a variant, the interface can be formed of a conductive material based on an elastic polymer and filled with metal particles such as conductive ink. The elasticity of the polymer base can satisfy the folding criteria of the present invention. Fixing can be performed, for example, by silk screen.

Next, the at least one microcircuit is fixed on the interface type film substrate, and it is connected to the interface.

Preferably, the entire operation is first performed from a strip of interfaced film substrate provided with a plurality of interfaces (eg, antenna motifs) and supplied over rollers or reels 24. The strip is transferred to various existing working positions of the fixing 25, the connection 26 and possibly the coating 27 of the microcircuit 4.

According to the present invention, since the film substrate is particularly thin, fragile or easily stretched, it is not possible to use a means for pulling with a projection that meshes with a perforation on the side of the film. In the present invention, a transport means adapted to the characteristics of the film is used. In particular, transport means which depend on the tension of the film substrate and include means for measuring and / or adjusting the tension of the film substrate are used to avoid stretching damage. The traction can be performed, for example, by traction rollers 28 or pliers.

In the embodiment, two motifs of the interface are shown according to the width, but it is preferable to use a motif having a width of more than 80 mm with more motifs, particularly in terms of mechanical resistance and productivity.

Fixation and connection of the microcircuit The fixation of the microcircuit can be effected by any means, in particular a two-component adhesive, a thermal adhesive, a photoactivator and the like. In the examples, it is preferred to use UV-activatable adhesives, especially because of the speed of fixing, the low temperature levels required, and the need for energy savings.

Various types of connections that have been confirmed to some extent, such as welding with gold or aluminum wires, fixing of a conductive adhesive, or a “flip chip” type that uses a microcircuit upside down, are used for connection. Well-known methods exist. In the latter two cases, the coating can be eliminated and the connection height can be reduced.

According to one feature of the invention, the connection of the microcircuits is made by ultrasonic welding, preferably choosing aluminum conductors.

This technique has been a priori forbidden for interface film substrates of the present invention (very flexible and / or flexible). Indeed, in the field of chip cards, ultrasonic welding of conductors is used for hard and rigid interfacing sheet substrates based on epoxy glass, polyimide, and Ni-Au type surface treated copper interfaces. It is assumed.

The current state of the art of ultrasonic welding utilizes a pointed welding tool with a welding line. During welding, the tip is pressed against the metal terminal of the interface or the metal terminal of the silicon chip placed on the sheet substrate.

The present inventors have confirmed that, instead of those usually used, the main component is a flexible material such as PE or PP (depending on the quality), and furthermore, PET or the like. When ultrasonic welding was attempted on an interface-type substrate having a thickness of 100 μm, the welding was naturally unsuccessful, and the welding did not work, the quality did not reach the industrial level, or the reproducibility was poor.

However, the present inventors have succeeded in performing welding with industrial quality and reproducibility under the condition that the welding is stopped before reaching a certain thickness threshold value. In fact, below this threshold, the present inventors have found that the thinner the material, the better the welding. This was true even with aluminum wires, which are very difficult to weld.

This threshold value differs depending on the material, but is set to about 75 μm for PE and PP.

The improvement of the reproducibility of the welding was realized by sticking at least the area of the film substrate (welding area) and then performing the welding flat on a hard fixed reference plane.

The film substrate is preferably applied by mechanical means or preferably by suction. In this latter case, the suction circuit is arranged in a fixed plane around the welding area.

The particularly economical usual connection techniques can be adapted to be reliable in the case of the present invention.

Immediately after fixing the microcircuit, an insert film (not shown) is placed on the interfacing film substrate so that the microcircuit can be wound accurately without damage.

Coupling of interface elements The interface elements are optionally arranged on both sides of the film substrate,
The connection is made through the film substrate by various well-known methods of the state of the art,
In particular, it is performed by producing a metallic hole by filling the hole with a conductive material, or by discharging.

However, because the film substrate and the interface of the present invention are thin and have the features already mentioned, these connections are preferably made by mechanical action by perforation or local tearing, die punching, and furthermore Preferably, a very special form of tool can also be used to rive or ultrasonically.

This method of implementation can be performed without the supply of materials, can be easily incorporated into the process, and can generally be performed in a hidden time in an interface type device or a method of manufacturing a film substrate. Is particularly economical.

Coating Step For the coating step, the coating material is positioned just above the installation area of the microcircuit,
Alternatively, it can be spread over the entire surface of the film substrate. In the first case, the material,
For example, drop a drop of resin. In the second case, the material can be fixed by coating or silk-screen printing. Preferably, fixing is performed by spraying.

The polymerization of adhesives and resins, conductors or non-conductors, varnishes can be carried out with a supply of heat (of temperature), which may or may not be localized, and It may not involve warm-up due to radiation of certain wavelengths such as, for example, ultraviolet light, or mixing of the two reactants.

We have chosen to realize all steps of polymerization of the adhesive and / or resin, including for purposes other than coating, with rapid polymerization times at low temperatures, especially temperatures below 80 ° C. These steps may be performed under ultraviolet irradiation. Preferably, these steps are performed at room temperature.

Fixing Step of Compensation Film According to another aspect and practical variant of the present invention, as shown in FIG. 10, the method includes fixing the compensation film 22 on the interface type film substrate (1, 2). There is. This compensation film has at least one perforation 23 corresponding to the installation of the microcircuit. In the embodiment shown in FIG. 10, a roller 2 having a plurality of perforations is provided.
The strip 22 coming out of 9 is rolled together. For this purpose, it is preferable to use a pressure-sensitive adhesive and / or a non-polymerizable adhesive.

This step is preferably performed before fixing the microcircuit. Rolling together after fixing or connecting or coating microcircuits,
Alternatively, it is possible to fix the compensation film, but more care is required.

As already mentioned above, this step can be performed in connection with any interfacing film substrate, but it is more advantageous to use an interfacing film substrate suitable for folding according to the invention. It is also meaningful.

The recesses advantageously serve to define a space for protecting the microcircuit in subsequent steps such as winding and storage, but also serve as a formwork for the coating material poured in operation 27.

Supplementary Steps The method can also include an additional step consisting of joining a decorative or protective or adhesive additional layer 30 on at least one of the two sides of the label. In the embodiment, after the transfer of the microcircuit, the adhesive layer 30 with the protective film is fixed.

As an alternative, it is possible to supply a film substrate which already has at least one additional layer, for example of adhesive nature, protected by a removable membrane.

Cutting, Unnecessary Material Removal, and Vertical Cutting Steps Since there is an advantage of reinforcing the film substrate in each step of the present method, a continuous frame (frame c in FIG. 4) around the apparatus is left after the plate making operation. You may keep it. This frame will be removed later by cutting. The cutting of the device, for example, using a punching tool,
This can be performed by randomly extracting from the belt 24 of the interface type film substrate.

In other cases, it may be desirable to leave the device maintained on the band or roller. For this purpose, it is desirable to fix a double-sided adhesive tape with a removable protective film below the belt 24 in FIG. 4 in advance. Cutting is performed so as not to cut the protective film. At this time, the unnecessary substance removing step follows the cutting step, and the adhesive device remains on the protective film.

The strip is also cut in the longitudinal direction at the desired width (vertical cutting).

In this way, the rollers having the adhesive labels of any size arranged at equal intervals are arranged on the adhesive protection roller. The label can be applied on any product. In other cases, a temporary tacky adhesive or a non-restickable adhesive is used, so that all of the method can be performed on rollers, and the rollers, the device, Cards, tickets, non-adhesive labels, etc. can be provided.

Realization of a large surface area product to house the device In FIG. 11, for example, a chip card of the present invention is made. Processes and reference symbols are shown in FIG.
The roller 24 has only one row of interface 2 motifs. Compensation film is a sheet with dimensions larger than the film substrate,
There is only one row of perforations. The film 30 is always a protective and / or decorative or optional adhesive film.

It should be noted that, in the same way as for tickets and labels obtained as described above, this method ensures that the card can be processed on the reel. Roller processing can also be extended to setting conditions and handing over to end users.

The compensation film may be of any nature, but is in particular paper, leather, woven or non-woven fibers, polymers and the like. In the embodiment, the compensation film has a thickness of 200 μm.
m PE, the surface area is twice the surface area of the device.

After cutting, the chip card of FIG. 11A is obtained. In some cases, a film 20 equivalent to film 30 can be placed on the card so as to hide perforations 23.

The card of FIG. 8 is obtained in the same way as shown in FIG. 11, with the difference that in some cases the compensating film is rolled together after the steps of fixing and connecting with the coating. That is. In that case, the recess 23 is not a penetrating one, but forms a cavity 21, and the compensating film becomes the main body of the card 19 after the cutting.

It is clear that what has been said with respect to FIG. 10 also applies to FIG.

Although the reverse is not shown, a compensation film 29 that is narrower than the interface film substrate can be used, especially at the edge of the latter.

The following is a supplement to some of the problems we have overcome. The wide variety of objectives is problematic because they are incompatible with cost reduction objectives.

A wide variety of purposes include having a good conductor as an interface (a rounded wire is a better conductor than a rectangular cut or engraved sheet of copper. Copper Is a conductor of better quality than aluminum and is significantly better than conductive inks and pastes).

[0154] This also leads to an increase in the number of windings and an increase in the surface area of the antenna, and consequently, an increase in the surface area of the circuit, which results in a bulky circuit.

[0155] It also leads to optimizing the dimensions and accuracy of the tracks (the narrower the tracks, the closer each antenna becomes, the larger the size of each one and therefore the flux Becomes larger).

Resolving the cost problem in such a way as to degrade the characteristics of the interface type film substrate goes against the above.

Furthermore, solutions that lead to keeping the interfaced film substrate (especially made of PE or PP and aluminum) very flexible cause the following problems in particular:

The actual method is of course not suitable, and such a film substrate has never been used in the manufacture of semiconductor modules.

The flexibility of the film substrate is, of course, incompatible with the hardness of the silicon chip and the brittleness of the chip and its connection.

The flexibility and thinness of the film substrate make it inconvenient for processing collectively in the form of rollers. For example, collective processing involves the need for very good positioning in the chip transfer and protection process, and more particularly for wire welding. Because such film substrates cannot be towed, there is no mechanical guiding means as was possible with 35 mm film.

The use of low-grade conductive materials (for example, of aluminum or copper, especially without the specific surface layer of the Ni-Au type) causes problems of weldability which are further increased by oxidation problems.

[0162] The PP or PE / aluminum composites developed by the inventors as the basis of the interfaced film substrate have a printing ink that remains on the surface of the metal, which cannot be welded. Removing them is expensive and causes the formation of an insulating oxide layer.

The use of low-grade interfacing film substrates, especially with a hardness (without Ni), leads to keeping the material flexible, which causes the welding problems already mentioned above. In addition, very flexible materials generally melt at the temperatures used in prior art methods.

An ideal solution is obtained by employing current methods using a reel with a large width of more than 80 mm from a reel of 35 mm.

[Brief description of the drawings]

FIG. 1 shows a label which is simplified according to the invention and which can be remotely identified by means of a radio frequency signal.

FIG. 2 shows a cross-sectional view of the label of FIG. 1 at the location of the micromodule.

FIG. 3 shows a variant of FIG.

FIG. 4 shows a variant of FIG.

FIG. 5 shows the underside of the label of FIG.

FIG. 6 shows a top view of a label with a connection area.

FIG. 7 shows the structure of a card according to the present invention.

FIG. 8 shows a cross-sectional view of another variation of the structure of the card.

FIG. 9 shows another structure of the inventive device according to the invention.

FIG. 10 shows an overall view of an implementation of the method of the invention.

FIG. 11 shows a general view of an embodiment variant of the method of the invention for the production of chip and antenna cards. FIG. 11A shows the structure of the card obtained by the method shown in the previous figure.

FIG. 12 shows a bending test to characterize the device of the present invention.

──────────────────────────────────────────────────続 き Continuation of front page (81) Designated country EP (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE ), AU, BR, CA, CN, JP, KR, MX, RU, SG, US (72) Inventor Deste, Isabel France, F-13600 La Ciotat, Cheman du Puget Terran, Saint-Ambroise, Batimon 4. (72) Inventor Garnier, Pierre, France, F-83500 La Seyne-sur-Mer, Ljuyur-Murell, 76, Rotissmann-les-Plennes (72) Inventor Martin, Philippe, F-21200 Bonne, Rue du Droir , 23 F term (reference) 2C005 N A09 NB34 PA03 PA04 PA14 PA29 RA06 RA08 RA09 5B035 AA07 BA05 BB09 CA23

Claims (43)

[Claims] 1. An interface type film substrate having a film substrate, at least one conductive planar interface disposed on the film substrate, and a microcircuit connected to the interface. ), Wherein the interface type film substrate has characteristics suitable for being rounded or bent without deterioration. 2. An interface-type film substrate having a film substrate (1), at least one conductive planar interface (2, 16) disposed on the film substrate, and a microcircuit connected to the interface (2). 4)
And a compensating film (22) disposed on a film substrate, the compensating film including recesses (21, 23),
A chip-type electronic device, wherein the microcircuit (4), the connection portions (7, 8) and the coating material (13) are accommodated in the recess. 3. A compensating film (22) disposed on an interface type film substrate, said compensating film having recesses (21, 23),
Device according to claim 1, characterized in that the microcircuit (4), its connections (7, 8) and the covering material (13) are contained in the recess. 4. The method according to claim 1, wherein the film substrate and the interface have a radius of curvature of less than 2.5 mm, preferably less than 1 mm, and are suitable for being rounded or folded together without deterioration. Or the apparatus according to 2. 5. The device according to claim 2, wherein a coating material is at least partially framed in the recess. 6. Apparatus according to claim 1, wherein the thickness of the film substrate is less than 75 μm, preferably between 10 μm and 30 μm. 7. The film substrate has a breaking elongation of more than 80% and / or a Shore hardness of less than 80 and / or a glass transition temperature Tg of less than 0 ° C. and / or 130 ° C.
Apparatus according to any of the preceding claims, having a melting temperature of less than. 8. The device according to claim 1, wherein the film substrate can be selected from among PP, PE and PET. 9. The interface is made of aluminum,
Apparatus according to any one of the preceding claims. 10. The device according to claim 1, wherein the microcircuit is arranged outside the winding. 11. The film substrate is provided with an interface element on another side called a "strap" (11) for guiding at least one end of the antenna (6) close to the chip. Apparatus according to any one of the preceding claims. 12. The width of the windings at the microcircuit is narrower than the other parts so that the microcircuit can be connected directly to both ends with a small length of connecting wire. Apparatus according to any one of the preceding claims, wherein: 13. The device according to claim 1, wherein the microcircuit is arranged directly on the film substrate between the windings. 14. The device according to claim 1, wherein the microcircuit is arranged on a corner of the film substrate and directly thereon. 15. The interface is at a distance of more than 8 cm, preferably 5 cm.
Apparatus according to any of the preceding claims, characterized in that it comprises at least one winding (2) of an antenna suitable for communicating over a distance of more than 0 cm. 16. The device according to claim 1, wherein the interface comprises a connection area. 17. The device according to claim 1, wherein the covering material is provided at least on the microcircuit and on its connecting lines, and at least on the interface part. Equipment. 18. The method according to claim 1, wherein at least one protective / individualizing layer and / or an adhesive layer are provided on at least one surface. Device according to one. 19. A device comprising a resonance capacitor (16a, 17b) comprising two conductive surfaces disposed on both sides of a film substrate (10).
Apparatus according to any one of the preceding claims. 20. Apparatus according to claim 19, wherein the capacitors (16a, 17b) comprise a mating. 21. The device according to claim 1, further comprising an emergency antenna contained in a built-in capacitor and / or a microcircuit. 22. The microcircuit according to claim 20, wherein the microcircuit is adapted to supply power in case of a failure of the antenna circuit of the film substrate and to communicate nearby via an emergency antenna. Equipment. 23. The device (D) according to any one of claims 1 to 22, wherein the device (D) is fixed on a card body (19, 22). A chip card (18) having at least twice the surface area. 24. It has two outer sheets (18, 19, 20, 30), between which the device according to claim 1 is arranged. Characterized chip card (18). 25. A card (18) comprising a card body with a cavity, comprising a device according to any one of claims 1 to 22, comprising a microcircuit (4).
A card arranged in a cavity, wherein the film substrate and the interface extend on the surface of the card body outside the cavity. 26. A method for implementing a chip-type electronic device that includes an interface-type film substrate having a film substrate, at least one planar interface, and at least one microcircuit connected to the interface, The method comprises providing at least one interfacing film substrate, fixing at least one microcircuit on the interfacing film substrate, and connecting it to an interface, the method comprising: A method wherein the interface-type film substrate has characteristics suitable for being rolled or bent without deterioration. 27. A method for implementing a chip-type electronic device comprising a film substrate, at least one planar interface, and an interface-type film substrate comprising at least one microcircuit connected to said interface, said method comprising: The method steps comprise providing at least one interfaced film substrate, fixing at least one microcircuit on the interfaced film substrate, and connecting it to an interface, wherein the compensation film is provided. Fixing to a film substrate, wherein the compensation film has at least one recess (21, 23) corresponding to a microcircuit installation. 28. The method according to claim 28, further comprising the step of fixing a compensation film on the film substrate, wherein the compensation film has at least one concave portion (21, 23) corresponding to a microcircuit. 27. The method of claim 26, wherein 29. The method according to claim 27, wherein the compensation film is applied before fixing the microcircuit. 30. The method according to claim 27, wherein the coating material is poured only into the recesses of the compensation film. 31. The method according to claim 27, wherein the compensation film is applied after fixing or coating of the microcircuit. 32. An interface-type film substrate is fed in a strip on a roller (24) and is directed to at least one working position (25, 26, 27) by means of a transfer means according to the tension of the film substrate. 3. The method according to claim 2, wherein the transfer is performed.
32. The method according to any one of 6 to 31. 33. The method according to claim 26, wherein the connection of the microcircuit is performed by ultrasonic welding of the conductor. 34. The method according to claim 33, wherein a conductor made of aluminum is used.
The method described in. 35. The method according to claim 33, wherein the welding covers at least the installation position (zp) of the microcircuit on the film substrate on the fixed reference plane. 36. The method according to claim 35, wherein the film substrate is strongly adhered by suction. 37. The method according to claim 26, wherein the interface is realized on a film substrate by means of an aluminum plate making technique. 38. The method according to claim 26, wherein the interface element and the buried terminal are connected through the film substrate by perforation / mechanical tearing. 39. The method according to claim 26, further comprising the step of applying a coating material (13) on at least the microcircuits and their connections.
The method according to any one of the above. 40. The method according to claim 27, wherein the coating material is poured into the recesses (23) formed by perforations in the compensation film. 41. The method according to claim 26, characterized in that it comprises at least one additional step consisting of firmly binding one adhesive layer (30) with a removable protective film on at least one side of the label. The method according to any one of the above. 42. The method according to claim 32, wherein the band has a plurality of interfaces and includes the step of cutting each device. 43. A method according to claim 43, wherein said adhesive layer comprises a protective film, is supplied in a continuous band, and is cut while the device stays on the protective film to remove unnecessary materials between the devices. 43. The method according to claim 41.