JP2002510879A - 静電チャック電源 - Google Patents

静電チャック電源

Info

Publication number
JP2002510879A
JP2002510879A JP2000542796A JP2000542796A JP2002510879A JP 2002510879 A JP2002510879 A JP 2002510879A JP 2000542796 A JP2000542796 A JP 2000542796A JP 2000542796 A JP2000542796 A JP 2000542796A JP 2002510879 A JP2002510879 A JP 2002510879A
Authority
JP
Japan
Prior art keywords
voltage
power supply
current
chucking
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000542796A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002510879A5 (enExample
Inventor
マーモード ダヒメン，
リチャード， アール． メット，
シアマック サリミアン，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2002510879A publication Critical patent/JP2002510879A/ja
Publication of JP2002510879A5 publication Critical patent/JP2002510879A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Jigs For Machine Tools (AREA)
JP2000542796A 1998-04-03 1999-03-31 静電チャック電源 Pending JP2002510879A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/054,575 1998-04-03
US09/054,575 US6198616B1 (en) 1998-04-03 1998-04-03 Method and apparatus for supplying a chucking voltage to an electrostatic chuck within a semiconductor wafer processing system
PCT/US1999/007192 WO1999052144A1 (en) 1998-04-03 1999-03-31 Electrostatic chuck power supply

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011109948A Division JP5583633B2 (ja) 1998-04-03 2011-05-16 静電チャック電源

Publications (2)

Publication Number Publication Date
JP2002510879A true JP2002510879A (ja) 2002-04-09
JP2002510879A5 JP2002510879A5 (enExample) 2009-04-16

Family

ID=21992049

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2000542796A Pending JP2002510879A (ja) 1998-04-03 1999-03-31 静電チャック電源
JP2011109948A Expired - Lifetime JP5583633B2 (ja) 1998-04-03 2011-05-16 静電チャック電源

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2011109948A Expired - Lifetime JP5583633B2 (ja) 1998-04-03 2011-05-16 静電チャック電源

Country Status (3)

Country Link
US (1) US6198616B1 (enExample)
JP (2) JP2002510879A (enExample)
WO (1) WO1999052144A1 (enExample)

Cited By (7)

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JP2004535039A (ja) * 2001-06-07 2004-11-18 ラム　リサーチ　コーポレーション プラズマ処理装置方法および装置
JP2008156746A (ja) * 2006-11-30 2008-07-10 Canon Anelva Corp 電力導入装置及び成膜方法
JP2010010236A (ja) * 2008-06-25 2010-01-14 Hitachi High-Technologies Corp プラズマ処理装置及びプラズマ処理方法
JP2013511814A (ja) * 2009-11-19 2013-04-04 ラム リサーチ コーポレーション プラズマ処理システムを制御するための方法および装置
JP2014533436A (ja) * 2011-11-04 2014-12-11 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 基板クランプシステム及び該システムを動作させるための方法
US9799546B2 (en) 2015-08-28 2017-10-24 Toshiba Memory Corporation Semiconductor manufacturing apparatus and method of operating the same
JP2021185600A (ja) * 2016-08-05 2021-12-09 アプライド マテリアルズ インコーポレイテッドApplied Materials, Incorporated グリーンシートセラミック上へのメタライゼーション材料の、サブミクロン均一性を有する高精度スクリーン印刷

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