JP2002369550A - Power converter and movable body therewith - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make a power converter compact in size by improving the cooling performance of a power converter. SOLUTION: A resin 22, having thermal conductivity, is embedded with a plurality of electronic components, which are mounted on a control substrate 15 disposed in an inverter case 10 and which of at least two types of electronic parts with the different heating values has a large type, or radiating devices 23 fitted thereon, under a physically no-contact condition with the electronic parts with a small heating value and the control substrate 15, thus thermally transmitting to the inverter case 10 the generated heat of the electronic components with high heating values and thermally transmitted to the resin 22.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power converter for controlling electric power supplied to an electric motor, and a mobile unit having the same.

[0002]

2. Description of the Related Art In recent years, in a moving body driven by a motor, for example, an electric vehicle such as an electric vehicle or a hybrid vehicle, a power conversion device for converting DC power supplied from a battery to the motor into AC power has been downsized. Examination is underway. This is because the price of the electric power conversion device is reduced and the price of the electric vehicle is reduced.
This is for reducing the mounting space of the power conversion device in the electric vehicle.

[0003] A power conversion device is configured by mounting electronic components such as semiconductor elements on a substrate provided in a closed container. Further, the power conversion device is configured to be able to cool the heat generated by the electronic component because a part of the electronic component generates heat by its own operation and exceeds the surface limit temperature of the electronic component. For example, there are a type in which cooling air from a blower is circulated in a closed container to cool heat generated in electronic components, and a type in which a cooling fluid is dispersed and convected in each electronic component to cool heat generated in electronic components.

The following method has conventionally been known for cooling electronic components. For example, JP-A-8-12536
No. 4, JP-A-2000-59058, a heat radiating member is provided on the surface of an electronic component via a member having thermal conductivity, and heat generated by the electronic component is radiated into the air. In JP-A-11-238985, a single heat radiating member is provided on the surface of a plurality of electronic components to radiate heat generated by the plurality of electronic components into the air.
In the device described in JP-A-10-209358, a cooling plate is provided on a surface of a substrate on which electronic components are mounted via a member having thermal conductivity, on a side opposite to the electronic component mounting side, and a cooling plate is provided. Heat is transmitted to the cooling plate to cool it.

[0005]

In the miniaturization of the power converter, the heat generation of the electronic components does not change, so that the thermal conditions become severe and the electronic components having a high heat generation are changed from the electronic components having a small heat generation to the electronic components having a small heat generation. Concerns about heat effects. If the heat generation of the small heat value on the electronic component is large, there is a possibility that a malfunction or a shortened life may be caused. Therefore, improvement of the cooling performance of the power converter is desired. In addition, from the viewpoint of miniaturization of the power converter, it is desirable that the power converter can be realized without increasing the size or complexity.

However, in the prior art of circulating cooling air from a blower in a closed container or dispersing and convection a cooling fluid to each electronic component, a mechanism for guiding a cooling medium into the closed container is provided in the closed container. Power conversion device, which increases the size or complexity of the power conversion device. In the case of using a cooling fluid, a mechanism for preventing leakage of the fluid must be provided in the closed container, which further increases the size or complexity of the power conversion device.

In the prior art in which a heat radiating member is provided on an electronic component, the heat generated by the electronic component is transferred to the internal space of the closed container to increase the temperature of the internal space of the closed container, thereby affecting the electronic component having a small calorific value. Effect. Further, the conventional technique of providing a heat radiating member in a closed container causes an increase in the size or complexity of the power conversion device. Furthermore, the conventional technique of providing a heat radiation member for each of a plurality of electronic components having a high calorific value causes a further increase in the size or complexity of the power converter.

Further, since the electronic components are distributed and mounted on the substrate in the sealed container regardless of the amount of generated heat, the conventional technology of providing a single heat radiating member for a plurality of electronic components does not provide a large amount of generated heat. The heat generated by the electronic component is easily transmitted to the electronic component having a small heat value or the non-heat-generating electronic component, and it is inevitable that the electronic component having a large heat value affects the electronic component having a small heat value or the non-heat-generating electronic component. . In addition, similarly to the above-described conventional technology, it is inevitable that the power conversion device using the heat dissipating member becomes larger or more complicated.

Further, since the electronic components are mounted on the same substrate in a closed container regardless of the amount of heat generated, the conventional technology of providing a cooling plate on the surface of the substrate opposite to the electronic component mounting side is as follows. Since the heat generated by the electronic component having a high calorific value is transmitted to the electronic component having a small calorific value or a non-heat-generating electronic component via the substrate, the electronic component having a small calorific value or the electronic component having a low calorific value is not required. Inevitably affect the heat.

[0010] A typical object of the present invention is to provide a power converter that is reduced in size and a mobile body provided with the power converter.

[0011]

A basic feature of the present invention is that a plurality of insulating resins having thermal conductivity are mounted on a substrate provided in a closed container and at least two types of resins having different heating values are provided. Of electronic components whose temperature rises to a temperature lower than the surface limit temperature of the electronic component due to their own heat, in a physical non-contact state with the electronic component and the substrate, and a temperature higher than the surface limit temperature of the electronic component due to its own heat generation A part of the electronic component which rises or a heat radiating means provided in the electronic part is embedded, and the heat generated by the electronic component or the heat transferred to the heat radiating means which rises to a temperature higher than the surface limit temperature of the electronic component due to its own heat generation. Is transferred to an insulating member that transfers heat to the closed container.

[0012] The insulating resin is mixed with a filler having thermal conductivity, and has a higher thermal conductivity than air. Specifically, a silica or ceramic particle-like or foil-like inorganic filler is mixed into a urethane-based resin or a silicon-based resin.
at a distance of at least mm,
It is filled between the closed container and the substrate. The electronic component itself, which rises to a temperature higher than the surface limit temperature of the electronic component due to its own heat generation, or the heat radiating means provided on the electronic component has a height of 1 mm or more from the substrate surface. Therefore, by filling the insulating resin as described above, the electronic component that rises to a temperature lower than the surface limit temperature of the electronic component due to its own heat and the electronic component due to its own heat in a physical non-contact state with the substrate. A part of the electronic component that rises to a temperature higher than the surface limit temperature of the above or the heat radiation means provided on the electronic component can be embedded in the insulating resin.

The electronic component whose temperature rises to a temperature higher than the surface limit temperature of the electronic component due to its own heat generation includes, for example, a capacitance element represented by a capacitor and the like and a regulator I.
There are a voltage control element represented by C and a transformer, and an arithmetic processing element represented by a microcomputer chip.

The closed container is made of a metal having a heat radiation property, or has a cooling means integrally formed on a wall in contact with the insulating resin, or has a cooling means attached to a wall in contact with the insulating resin. The cooling means is constituted by a flow path for circulating a cooling medium or a member having a heat radiation property.

According to the present invention, most of the heat generated by an electronic component (an electronic component having a large calorific value) that rises to a temperature higher than the surface limit temperature of the electronic component due to its own heat is generated by its own heat. Heat is hardly transmitted to the electronic components (electronic components having a small calorific value) that rise to a temperature lower than the limit temperature, the substrate and the internal space of the closed container, and is efficiently transferred to the closed container via the insulating resin. The heat is radiated from the outside or through the cooling means. Therefore, the cooling performance of the power converter can be improved.

[0016]

Embodiments of the present invention will be described below with reference to the drawings. The power converter controls, for example, the power supplied to the electric motor, and includes, for example, a rectifier for converting AC power to DC power, an inverter for converting DC power to AC power, and a combination of the rectifier and the inverter. There is a DC-DC converter device that converts input DC power into desired DC power.

In an embodiment of the present invention, in an electric vehicle having an electric motor as a sole driving source, a hybrid vehicle having an electric motor and an internal combustion engine as a driving source, the DC power output from the power storage means is converted into AC power to convert the electric motor into AC power. An example of an inverter device to be supplied to the vehicle will be described. The configuration of the embodiment of the present invention described below can be applied not only to an inverter device but also to a rectifier device and a DC-DC converter device.

FIGS. 10 to 12 show examples of the configuration of an automobile to which the inverter device according to the embodiment of the present invention is applied.
FIG. 10 shows a configuration of an electric vehicle using an electric motor as a sole drive source. 39 is a vehicle body. An axle 42 provided with wheels 40a and 40b at both ends is rotatably attached to a front portion of the vehicle body 39. That is, the front wheels are attached. An axle 43 having wheels 41a and 41b provided at both ends is rotatably attached to a rear portion of the vehicle body 39. That is, the rear wheel is attached. The axle 42 has a gear 44
The electric motor 1 is mechanically connected via. Electric motor 1
Is electrically connected to the inverter device 100,
The DC power supplied from the battery 20 is converted into three-phase AC power and supplied. The host device 21 is electrically connected to the inverter device 10, and receives a command signal or the like corresponding to depression of an accelerator.

FIG. 11 shows the configuration of a hybrid vehicle that uses an electric motor and an internal combustion engine as driving sources. A hybrid vehicle switches between an internal combustion engine and an electric motor to drive one wheel. The internal combustion engine 38 is mechanically connected to the axle 42 via a gear 44. The electric motor 1 is mechanically connected to the internal combustion engine 38. Other configurations are the same as those of the previous example, and the description thereof is omitted.

FIG. 12 shows a configuration of an electric four-wheel drive type automobile using an internal combustion engine as a main drive source and an electric motor as a sub drive source (for assisting). In an electric four-wheel drive automobile, one wheel is driven by an internal combustion engine and the other wheel is driven by an electric motor. The internal combustion engine 38 is mechanically connected to the axle 42 via a gear 44. The electric motor 1 is mechanically connected to the axle 43 via a gear 45. Other configurations are the same as those of the previous example, and the description thereof is omitted.

FIG. 9 shows a circuit configuration of the inverter device mounted on the automobile described above. Inverter device 1 of this example
00 is PWM (pulse wide modulation)
The switching operation of the semiconductor element (ON
This is of a pulse width modulation type that controls DC power output from the battery 20 into AC power by controlling the DC power output from the battery 20, and supplies the AC power to the motor 1, and includes a power module unit 110 and a control unit 120.

The power module 110 includes:
A portion for converting DC power output from the battery 20 into AC power, and a power semiconductor element, for example, an IGBT
(Insulated Gate Bipolar Transistor) and a capacitor 13 which is a capacitive element for temporarily storing DC power.

The DC power output from the battery 20 is
The power is input to the power module 3 via the DC terminal block 12A and the DC bus bar 11A. In the power module 3, the switching operation of the power semiconductor element (ON
(OFF operation) to convert the input DC power into three-phase AC power. The converted three-phase AC power is supplied to the motor 1 via an AC bus bar 11B and an AC terminal block 12B.
Supplied to Thereby, the electric motor 1 is driven.

The control section 120 performs a switching operation (ON / OF) of the power semiconductor element in the power module 3.
F), and comprises a drive circuit 14, a sensor circuit 16, a computer 17, a control power supply 18, and an interface circuit 19.

The interface circuit 19 receives a command signal output from the host controller 21 such as a command signal corresponding to depression of an accelerator, and receives a command signal input from the host controller 21 via the input port 46. And a photocoupler 19B that insulates a signal output from the communication receiver IC 19A. The sensor circuit 16 detects, for example, a DC power value supplied from the battery 20 to the inverter device 100, a three-phase AC power value supplied from the inverter device 100 to the electric motor 1, a temperature value in the inverter device 100, and the like. .

The computer 17 is composed of arithmetic processing elements represented by a microcomputer chip, and performs arithmetic processing based on a signal output from the interface circuit 19, a detection signal value output from the sensor circuit 16, and the like. And outputs a PWM control signal. The drive circuit 14 steps up or down the PWM control signal output from the computer 17 and performs a switching operation (ON / OFF operation) of the power semiconductor element in the power module 3.
Is output as a drive signal so that

The control power supply 18 includes a drive circuit 14, a sensor circuit 16, a computer 17, and an interface circuit 19.
And a capacitor for stabilizing the output of the regulator IC. The regulator IC is a voltage control element for increasing or decreasing the voltage value of the DC power supplied from the battery 20. And a voltage control element for creating a power supply insulated from the battery 20, a transformer having a primary winding and a secondary winding, and the voltage of the primary winding of the transformer to the voltage of the secondary winding. And a diode and a capacitor, which are rectifying elements and capacitive elements for smoothing the output of the secondary winding of the transformer.

Next, the configuration of an actual inverter 100 to which the above-described circuit configuration of the inverter 100 is applied will be described.

FIGS. 1 and 2 show the configuration of an inverter device according to a first embodiment of the present invention. In the inverter device 100 of the present embodiment, a power module unit and a control unit are configured in the same internal space of an inverter case 10 that is a closed container. The bottom wall of the inverter case 10 is formed thicker than other portions, and coolers 9 and 24 are formed in that portion. The cooler 9 corresponds to the power module unit, and the cooler 24 corresponds to the control unit, and is a flow path for flowing a cooling medium, for example, cooling water and cooling air.

On one side of the internal space of the inverter case 10, the power module 3, the capacitor 13, the DC terminal block 12A, the power module 3, and the capacitor 13
A bus bar 11A for DC for electrically connecting the power module 3 and a terminal block 11B for AC for electrically connecting the power module 3 to the terminal block 12B for AC are provided. The power module 3 has a ceramic case 4 on which laminated copper foils are fixed on both sides, a plurality of power semiconductor elements 2 are soldered on one side, and a metal substrate 5 is soldered on the other side. Things.

The module case 7 is provided with terminals electrically connected to the power semiconductor element 2 and protrudes into the inverter case 10 and has bus bars 11A, 11B.
Is electrically connected to For electrically connecting the terminals electrically connected to the bus bars 11A and 11B to the power semiconductor element 2 and the power semiconductor elements 2, a wire bonding method using a metal wire 6 as a connecting member is used. The power semiconductor element 2 side of the ceramic substrate 4 in the module case 7 is sealed with an insulating resin 8 having a low heat transfer coefficient such as silicon gel.
The metal substrate 5 seals the bottom of the module case 7 and the inverter case 1 corresponding to the position where the cooler 9 is formed.
0 is fixed to the bottom wall. Thus, heat generated by the power semiconductor element 2 is transferred to the cooler 9 of the inverter case 10 via the ceramic substrate 4 and the metal substrate 5 and is cooled by the cooling water flowing through the cooler 9.

On the other side of the internal space of the inverter case 10, a drive circuit 14, an interface circuit 15,
A control board 15 on which electronic components constituting the sensor circuit 16, the computer 17, and the control power supply 18 are mounted is provided. Specifically, the radiator 2 is provided on the side of the cooler 24 of the control board 15.
3, a regulator IC 18A constituting a control power supply 18, a capacitor 18B, a transformer 18C
In this embodiment, the electronic component having a large heat value is mounted on the side of the cooler 24 of the control board 15 and the cooler 24 is mounted.
On the surface opposite to the side, a semiconductor chip forming the drive circuit 14, a semiconductor chip forming the sensor circuit 16,
Communication receiver I constituting interface circuit 19
C19A and a photocoupler 19B are mounted. The mounting surface may be the same.

The electronic components constituting the drive circuit 14, the sensor circuit 16, the computer 17, the control power supply 18, and the interface circuit 19 can be classified into two types according to the magnitude of their own heat generation. That is, the semiconductor chip constituting the computer 17 and the regulator I constituting the control power supply 18
The drive circuit 14 and the sensor circuit 16 include a C18A, a capacitor 18B, a transformer 18C, and other electronic components that generate a large amount of heat and rise to a temperature higher than a surface limit temperature (for example, 85 ° C.) of the electronic components due to their own heat generation. Electronic components that generate only a temperature lower than the surface limit temperature of the electronic components due to their own heat generation, such as a semiconductor chip, a communication receiver IC 19A, and a photocoupler 19B that constitute the interface circuit 19. Can be.

In the space between the side of the cooler 24 of the control board 15 and the inverter case 10, a resin 22 having flexibility, high thermal conductivity and insulating property is provided at a distance of 1 mm or more from the surface of the control board 15. Is the bottom wall of the inverter case 10
(The wall on which the cooler 24 is formed) in a state of being in physical contact with it. The resin 22 cools the control board 15 in a physical non-contact state with the semiconductor chip constituting the sensor circuit 16 and the drive circuit 14, the communication receiver IC 19A and the photocoupler 19B constituting the interface circuit 19, and the control board 15. Regulator IC 18A of control power supply 18 and capacitor 18 mounted on the side of the heater 24
B, a part of the radiator 23 provided in the transformer 18C and the computer 17 are embedded.

The resin 22 is a mixture of a urethane-based resin or a silicon-based resin mixed with a silica or ceramics particulate or foil-shaped inorganic filler, and has a higher thermal conductivity than air. The use of the insulating resin 22 is the same as the short circuit between the electronic components embedded in the resin 22, the electronic component embedded in the resin 22 and operating at several volts to several hundred volts, and the same as the case of the automobile. This is to prevent a short circuit between the potential and the inverter case 10.

According to this embodiment, of the various electronic components mounted on the control board 15, a part of the electronic component generating a large amount of heat and the heat radiating means provided on the electronic component are made of the resin 2.
2 and electronic component and control board 1 that generate a small amount of heat
5 and the resin 22 are not physically in contact with each other, so that heat generated by the electronic component having a large heat value is hardly transferred to the electronic component having a small heat value and the control board 15, and The heat is mostly transferred to 24. Therefore, the heat generated by the electronic component having a large heat value can be efficiently cooled, so that the cooling performance of the inverter device can be improved. Accordingly, the influence of heat on the electronic component having a small heat value can be suppressed, so that the inverter device can be downsized. The downsizing of the inverter device has also led to a reduction in the price and weight of the inverter device, a reduction in the price of electric and hybrid vehicles, an improvement in fuel efficiency or an increase in the mileage per charge, and a reduction in the mounting space for the inverter device. Also leads to

Further, according to the present embodiment, the influence of heat on the electronic components having a small heat value can be suppressed, so that the performance and the life of the inverter device are reduced due to the malfunction and the short life of the electronic components having a small heat value. The decrease can be suppressed. Therefore, reliability can be ensured even when the inverter device is downsized.

Further, according to this embodiment, the shape and size of the electronic component and the inverter case 1 are used as the heat transfer member for transferring the heat generated by the electronic component having a large heat value to the cooler 24.
The shape and size of the self can be easily changed without being affected by the size of the internal space of zero.
Since the resin 22 having flexibility is used, the inverter device is not enlarged or complicated, and even if electronic components generating a large amount of heat are distributed and mounted on the control board 15, it is possible to correspond to each electronic component. Therefore, it is not necessary to provide the heat transfer means, and the heat transfer means can be easily provided by collecting the electronic components having a large calorific value. Note that the heat transfer member of the present embodiment is a particularly effective means for those requiring hermeticity.

Further, according to the present embodiment, as the heat transfer member for transferring the heat generated by the electronic component generating a large amount of heat to the cooler 24, the resin 22 having a higher thermal conductivity than air, specifically, a resin 22 Alternatively, the resin 22 mixed with a ceramic particle-shaped or foil-shaped inorganic filler is used.
The heat transferred to the second case 2 is hardly transferred to the internal space of the inverter case 10. Therefore, the cooling performance of the inverter device can be further improved. In addition, since the heat influence from the internal space of the inverter case 10 to the electronic component having a small heat generation amount can be suppressed, it is possible to further suppress the deterioration of the performance and the life of the inverter device.

Further, according to the present embodiment, the electronic component having a high heat value is mounted on the cooler 24 side of the control board 15 and the electronic component having a small heat value is mounted on the opposite side, so that the heat transfer structure is reduced. It can be easily configured. In addition, since electronic components having a high calorific value can be kept away from electronic components having a small calorific value, the influence of heat on electronic components having a low calorific value can be further suppressed from electronic components having a high calorific value. A decrease in performance and a decrease in life can be further suppressed. Further, since the heat transfer path from the electronic component having a high calorific value to the cooler 24 can be shortened, the escape of the heat generated by the electronic component having a high calorific value is suppressed, and the generated heat is reliably transferred to the cooler 24. The cooling performance of the inverter device can be further improved.

In this embodiment, the module case 7
And the capacitor 13 is brought into physical contact with the resin 22, so that the heat generated in the power module portion is
The heat is radiated to the cooler 24 via the resin 22 without being transferred to the internal space. Therefore, it is possible to suppress the thermal influence from the power module unit to the control unit. Thereby, the power module unit and the control unit can be configured in the same space inside the inverter case 10, and
The power module unit and the control unit can be brought into close contact, and the inverter device can be downsized.

FIG. 3 shows a configuration of an inverter device according to a second embodiment of the present invention. The same parts as those in the previous example are denoted by the same reference numerals, and description thereof will be omitted. In the first embodiment described above,
The example in which the power module unit and the control unit are provided in the same internal space of the inverter case has been described. On the other hand, in the present embodiment, the internal space of the inverter case 10 is divided into two parts in the horizontal direction, and a power module part is provided on one side and a control part is provided on the other side. Note that the capacitor 13 of the power module unit is provided in the same internal space as the control unit. For this reason, the inverter case 10 is not one closed container, but is formed by combining a plurality of members.

The inverter case 10 includes the coolers 9 and 24
And a module case 7 whose bottom is sealed with a metal substrate 5 and whose top is open and provided at a position corresponding to the cooler 9 on the bottom wall 10a.
And a side wall 10b provided on the bottom wall 10a so as to surround a portion of the bottom wall 10a other than the module case 7, and an upper wall 10c which covers an upper portion of the module case 7 and an upper portion of the portion surrounded by the side wall 10b. I have. The side wall of the module case 7 facing the control unit also serves as a threshold 34 for dividing the internal space of the inverter case 10 into two in the horizontal direction. The side wall of the module case 7 excluding the side wall facing the control unit is the inverter case 1 together with the side wall 10b.
0 side walls are formed.

The DC bus bar 11A electrically connected to the DC terminal block 12A penetrates the side wall of the module case 7, protrudes into the internal space on the control unit side of the inverter case 10, and electrically connects with the capacitor 13. In addition to being connected, it is electrically connected to terminals embedded in the side wall of the module case 7. The lower portion of the threshold 34 extends below the capacitor 13 toward the control unit. A wiring 37 that electrically connects the control unit and the power module unit is buried in a portion that extends toward the control unit below the threshold 34. The wiring 37 extends from the front end of the portion of the lower part of the sill 34 extending toward the control unit to the control board 15 through the resin 22 and is electrically connected to the control board 15.

According to the present embodiment, the inverter case 10
Is constructed using the module case 7, the number of components can be reduced. Further, since the electrical connection between the control unit and the power module unit is performed using the wiring 37 buried in a portion extending to the control unit side below the threshold 34, the connection between the control unit and the power module unit has been performed so far. Parts such as connectors used for electrical connection can be reduced. Therefore, the price of the inverter device can be reduced.

Further, according to the present embodiment, since a part of the inverter case 10 is constituted by using the module case 7, the insulating resin 8 and the resin 2 for sealing the power semiconductor element 2 are formed.
2 can be cured in the same manufacturing process. Therefore, the manufacturing process of the inverter device can be reduced. Thereby, the price of the inverter device can be reduced.

FIG. 4 shows a configuration of an inverter device according to a third embodiment of the present invention. In the first and second embodiments described above, an example has been described in which the power module unit and the control unit are configured by the same inverter case. On the other hand, in the present embodiment, the power module unit and the control unit are configured in different cases. That is, in the present embodiment, the power module unit is configured by the inverter case 10, and the control unit is configured by the control board case 25.

A cooler is formed on the bottom wall of the inverter case 10. The cooler has the same configuration as that described in the first embodiment. A power module, a capacitor, and a bus bar are housed in the internal space of the inverter case 10. The power module, the capacitor, and the busbar have the same configuration as that described in the first embodiment.

The cooler 2 is provided on the bottom wall of the control board case 25.
4 are formed. The cooler 24 of the present embodiment is a plate-shaped heat radiating member and is provided on the outer peripheral surface of the bottom wall of the control board case 25 so as to project downward from the outer peripheral surface of the bottom wall of the control board case 25. A plurality of radiating fins are juxtaposed. The control board 1 is provided in the internal space of the control board case 25.
5 are provided. Various electronic components constituting the drive circuit 14, the interface circuit 19, the sensor circuit 16, the computer 17, and the control power supply 18 are mounted on the control board 15. Various electronic components mounted on the control board 15 are arranged in the same manner as described in the first embodiment.

The space between the control board 15 and the bottom wall of the control board case 25 is filled with a resin 22. Resin 2
2 is the same as that described in the first embodiment,
It is filled in a state of being in physical contact with the bottom wall (the wall on which the cooler 24 is formed) of the control board case 25. Resin 2
Reference numeral 2 denotes a semiconductor chip constituting the sensor circuit 16 and the drive circuit 14, a communication receiver IC 19A constituting the interface circuit 19, a photocoupler 19B, and a cooler for the control board 15 in a physical non-contact state with the control board 15. Regulator I of control power supply 18 mounted on 24 sides
C18A, a capacitor 18B, a transformer 18C, and a part of a radiator 23 provided in the computer 17 are embedded. The control section and the power module section are electrically connected by a wiring 37.

According to the present embodiment, the power module section and the control section are constituted by separate cases, that is, the power module section is constituted by the inverter case 10, and the control section is constituted by the control board case 25. In addition, it is possible to suppress the thermal influence from the power module unit to the control unit, and to improve the cooling performance of the inverter device.

Further, according to the present embodiment, since the power module section and the control section are formed in separate cases, the control section can be downsized, and the control section in an electric vehicle or a hybrid vehicle can be reduced. The arrangement can be improved. For example, it can be attached to the inside of the front grill at the front of the vehicle body, under the seats in the passenger compartment, in the dashboard, in the trunk room, or the like.

FIG. 5 shows a configuration of an inverter device according to a fourth embodiment of the present invention. This embodiment is an improvement of the above-described third embodiment, in which a duct 26 for guiding outside air as a cooling medium to a cooler 24 is provided on the bottom wall of a case 25 for a control board. The duct 26 is configured to be attachable to the bottom wall of the control board case 25. For this reason, on the bottom wall of the control board case 25, there is provided a metal fitting 27 for holding and fixing the duct 26 from both ends in the horizontal direction. Further, on the bottom wall of the control board case 25, an airtightness at the time of being combined with the duct 26 is improved, and an annular uneven portion that matches the annular uneven portion provided on the duct 26 is formed.

Opposite annular concave portions are formed in the annular uneven portion formed on the bottom wall of the control board case 25 and the annular uneven portion formed on the duct 26. Between the annular recess formed in the bottom wall of the control board case 25 and the annular recess formed in the duct 26, the airtightness between the bottom wall of the control board case 25 and the tagged 26 is further improved. For improvement, an annular O-ring 28 made of rubber is provided along the annular recess.

According to this embodiment, the cooling medium is supplied to the cooler 24.
Is provided, the cooling medium such as the outside air can be sucked in and the cooling medium can be guided to the cooler 24 regardless of the atmosphere at the installation location of the control unit. Therefore, the control unit can always be cooled without being affected by the condition of the installation location of the control unit, and the arrangement of the control unit and the cooling performance can be further improved.

FIG. 6 shows a configuration of an inverter device according to a fifth embodiment of the present invention. This embodiment is an improved example of the first embodiment. In the present embodiment, the resin 22 that is in thermal contact with the electronic component having a large calorific value is formed by a plate-shaped heat insulating block 31 made of a resin having a lower thermal conductivity than the resin 22.
The electronic components that generate a large amount of heat are separated according to the magnitude of the amount of heat generated. Specifically, the resin 22 existing around the electronic component that generates the largest amount of heat (for example, the radiator 23 of the computer 17) and the resin 22 existing around the other electronic components among the electronic components that generate the largest amount of heat. Are separated by a heat insulating block 31 having a lower thermal conductivity than the resin 22.

According to this embodiment, the heat insulating block 31 controls the resin 2 according to the magnitude of the heat value of the electronic component having a large heat value.
2 is separated, so that the heat generation of the electronic component having a large calorific value among the electronic components having a large calorific value is cut off by the heat insulating block 31, and the electronic component having a small calorific value among the electronic components having a large power generation amount via the resin 22. Heat transfer becomes difficult, and most of the heat is transferred to the cooler 24 via the resin 22. Therefore, the heat generated by the electronic component having a large heat value can be more efficiently transferred to the cooler 24, so that the cooling performance of the inverter device can be further improved.

FIG. 7 shows a configuration of an inverter device according to a sixth embodiment of the present invention. In this embodiment, a module case 7 having a cooler 9 at a lower portion and a control board case 25 having a cooler 24 at an upper portion are provided with a gap 32 therebetween.
To form a laminated integrated structure. The configuration inside the module case 7 is the same as that described in the previous example. The control board case is the one described in the third embodiment turned 180 degrees, that is, upside down, and the internal configuration is the same as that of the third embodiment upside down. The gap 32 can be formed by providing a projection on either the module case 7 or the control board case 25. In this embodiment, a projection 33 is provided below the control board case 25.

The cooler 9 is a flow path for circulating a cooling medium, is formed in a thick wall material, and is fixed to the metal substrate 5 that seals the lower part of the module case 7.
The plurality of coolers 24 are plate-shaped heat dissipating members and are arranged in parallel on the outer peripheral surface of the upper wall of the control board case 25 so as to protrude upward from the outer peripheral surface of the upper wall of the control board case 25. Radiating fins having the same configuration as that described in the third embodiment.

The gap 32 is provided with a terminal projecting from the module case 7 into the gap 32 and a power wiring board 36 electrically connected to a connector 35 projecting from the control board case 25 into the gap 32. The connector 35 is
This is for electrically connecting the module case 3 side to the control board case 25 side.
It is a connection member provided on the fifth side.

According to this embodiment, the control board case 25
Is provided at the lower part of the module, and the module case 7 and the control board case 25 are laminated via the protrusion 33, so that a gap 32 is formed between the module case 7 and the control board case 25. In addition, the contact area between the module case 7 and the control board case 25 can be minimized. Therefore, even when the module case 7 and the control board case 25 have a laminated structure, it is possible to suppress the heat transfer from the power module unit, which generates a large amount of heat, to the control unit.

Further, according to the present embodiment, the module case 7 and the control board case 25 are laminated and integrated, so that a drive device for an electric vehicle, a hybrid vehicle or the like can be downsized. Therefore, the price of an electric vehicle, a hybrid vehicle, and the like can be reduced.

Further, according to the present embodiment, the power for electrically connecting the module case 7 side and the control board case 25 side to the gap 32 between the module case 7 and the control board case 25 is provided. Since the wiring board 36 is disposed, electrical wiring between the module case 7 and the control board case 25 is shortened, so that the inverter device can be downsized and the price can be reduced.

FIG. 8 shows an example in which the inverter device described in any of the first to sixth embodiments is mounted on an automobile. Here, an air-cooled cooler 29, that is, a plurality of plate-shaped heat dissipating fins 30 as a heat dissipating member are provided on the wall surface of the control board case 25 perpendicularly to the wall surface of the control board case 25. An example of mounting the inverter device will be described.

In this embodiment, the radiating fins 30 as radiating members provided on the wall surface of the control board case 25 are perpendicular to the moving surface (ground) of the vehicle and opposed to the outside air inflow direction. In other words, the control board case 25 is attached to the vehicle so as to face the moving direction of the vehicle. The mounting location is preferably a location into which outside air can flow, for example, an engine room, but it may be mounted on a driver's seat, a cargo bed, or a vehicle body portion that covers a part of wheels.

According to the present embodiment, the control board case 25
The control board case 25 is disposed such that the plate-shaped heat radiation fins 30 as heat radiation members provided on the wall surface of the control board are perpendicular to the moving surface (ground) of the automobile and opposed to the inflow direction of the outside air. Since it is attached to the vehicle, the inflowing outside air can smoothly flow upward from the moving surface (ground) side of the vehicle to the plate-shaped radiation fins 30 as a heat radiation member, thereby improving the efficiency of heat exchange with the outside air. be able to. Therefore, the cooling performance of the inverter device can be improved.

[0067]

According to the present invention, since the cooling performance of the power converter can be improved, the power converter can be downsized. Therefore, it is possible to provide a miniaturized power conversion device and a mobile body including the same.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a configuration of an inverter device according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along the line II-II of FIG.

FIG. 3 is a sectional view showing a configuration of an inverter device according to a second embodiment of the present invention.

FIG. 4 is a sectional view showing a configuration of an inverter device according to a third embodiment of the present invention.

FIG. 5 is a sectional view showing a configuration of an inverter device according to a fourth embodiment of the present invention.

FIG. 6 is a sectional view showing a configuration of an inverter device according to a fifth embodiment of the present invention.

FIG. 7 is a sectional view showing a configuration of an inverter device according to a sixth embodiment of the present invention.

FIG. 8 is a three-dimensional plane showing an example of mounting the inverter device on an automobile.

FIG. 9 is a block diagram showing a circuit configuration of the inverter device.

FIG. 10 is a plan view showing a configuration of an electric vehicle.

FIG. 11 is a plan view showing a configuration of a hybrid vehicle.

FIG. 12 is a plan view showing a configuration of an electric four-wheeled motor vehicle.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electric motor, 2 ... Power semiconductor element, 3 ... Power module, 4 ... Ceramic substrate, 5 ... Metal substrate, 6 ... Metal wire, 7 ... Module case, 8 ... Insulating resin, 9,
24, 29 ... cooler, 10 ... inverter case, 11 ...
Busbar, 12: terminal block, 13: capacitor, 14: drive circuit, 15: control board, 16: sensor circuit, 17
... Computer, 18 ... Control power supply, 19 ... Interface circuit, 20 ... Battery, 21 ... Host controller, 22 ... Resin, 23 ... Heat radiator, 25 ... Control board case, 26 ... Duct, 27 ... Hardware, 28 ... O Ring, 30 radiation fins, 31 heat insulation block, 32 voids, 33 projections,
34 ... threshold, 35 ... connector, 36 ... wiring board, 37 ...
wiring.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Akihiro Tanba 7-1-1, Omika-cho, Hitachi City, Ibaraki Prefecture Inside the Hitachi Research Laboratory, Hitachi, Ltd. (72) Inventor Takuyoshi Nakamura 7-chome, Omika-cho, Hitachi City, Ibaraki Prefecture No. 1-1 Inside Hitachi, Ltd. Hitachi Research Laboratory (72) Inventor Ryuichi Saito 7-1-1, Omika-cho, Hitachi City, Ibaraki Prefecture F-term in Hitachi, Ltd. Hitachi Research Laboratory F-term (reference) 5H007 AA06 BB06 CA01 CB02 CB04 CB05 CC07 DA01 EA02 HA05 5H115 PA11 PG04 PI16 PU01 PU08 PU25 PU27 PV09 PV22 RB22 SE10 TR02 TU12 UI27 5H740 BA11 BB05 BB09 MM08 PP02 PP05

Claims (20)

[Claims] 1. A power module unit having a semiconductor element for power control, and a control unit for controlling the operation of the semiconductor element, wherein the control unit is provided in a closed container and in the closed container. A substrate, at least two types of electronic components mounted on the substrate and having different heat values, and at least two types of electronic components having heat conductivity and different heat values, the electronic components being generated by own heat. The electronic component which rises to a temperature lower than the surface limit temperature of the component and the at least two types of electronic components having different heating values in the physical non-contact state with the substrate, the surface limit temperature of the electronic component due to its own heat generation A part of the electronic component which rises to a higher temperature or a heat radiating means provided in the electronic component is embedded, and the heat generated by the electronic component is higher than the surface limit temperature of the electronic component. Power conversion apparatus characterized by and an insulating resin heat generation or the thermally transferred to the heat dissipating means heating of the electronic component to the heat transfer in the sealed container to rise to the temperature. 2. A power module unit having a semiconductor element for power control, and a control unit for controlling the operation of the semiconductor element, wherein the control unit is disposed in the closed container and in the closed container. A substrate; a plurality of electronic components mounted on the substrate;
having an insulating resin filled between the hermetically sealed container and the substrate so as to be in contact with the inner surface of the hermetically sealed container at intervals of at least mm, wherein the resin is one of the plurality of electronic components.
A part of an electronic component having a height of 1 mm or more from the substrate surface or a heat radiation means provided on the electronic component is embedded, and heat is generated from the electronic component having a height of 1 mm or more from the substrate surface or heat is applied to the heat radiation means. A power converter, wherein the transmitted heat is transferred to the closed container. 3. A power module unit having a semiconductor element for power control, and a control unit for controlling an operation of the semiconductor element, wherein the control unit is disposed in the closed container and in the closed container. A substrate, a plurality of electronic components mounted on the substrate and including a capacitance element, a voltage control element, and an arithmetic processing element; and having thermal conductivity and excluding at least the capacitance element and the voltage variable element. At least a part of the capacitive element, the voltage control element and the heat radiating means provided in the arithmetic processing element are embedded in a physical non-contact state with the plurality of electronic components and the substrate, and at least the capacitive element An insulating resin that transfers heat generated by the voltage control element and heat generated by the arithmetic processing element transferred to the heat radiating means to the closed container. Apparatus. 4. The power conversion device according to claim 1, wherein the power module unit is configured in the closed container that forms the control unit. . 5. The power conversion device according to claim 4, wherein the power module section has a container for accommodating the semiconductor element and a capacitance element, and the container and the capacitance element are in physical contact with the insulating resin. A power conversion device characterized by being in contact with each other. 6. The power converter according to claim 4, wherein the sealed container is partitioned in a horizontal direction or a vertical direction, and the element portion is disposed on one side thereof.
A power converter, wherein the control unit is arranged on the other side. 7. The power converter according to claim 1, wherein the power module section is formed by a sealed container different from the sealed container forming the control section. Conversion device. 8. The power converter according to claim 7, wherein the closed container forming the power module and the closed container forming the control section are arranged close to or adjacent to each other in a horizontal direction or a vertical direction. A power converter. 9. A power converter according to claim 1, wherein said insulating resin has a higher thermal conductivity than air. 10. The power conversion device according to claim 1, wherein the insulating resin is mixed with a filler having thermal conductivity. 11. The power converter according to claim 1, wherein the insulating resin is a silica-based or ceramic-based inorganic filler in a urethane-based resin or a silicon-based resin. A power conversion device characterized by being mixed into a power converter. 12. The power converter according to claim 1, wherein said insulating resin is made of said insulating resin in accordance with the amount of heat generated by an electronic component embedded in said insulating resin. A power conversion device, wherein the power conversion device is also separated by a member having low thermal conductivity. 13. The power converter according to claim 1, wherein, among the electronic components embedded in the insulating resin, the insulating resin present around the electronic component having the largest heat value. The power conversion device, wherein the insulating resin present around the other electronic components is separated by a separating member having a lower thermal conductivity than the insulating resin. 14. A power converter according to claim 1, wherein said closed container is made of a metal having a heat radiating property or cooling means is integrally formed on a wall contacting said insulating resin. Or a cooling means attached to a wall in contact with the insulating resin, wherein the cooling means is constituted by a flow path for circulating a cooling medium or a member having a heat radiation property. A power converter characterized by the above-mentioned. 15. A body, a rotating body rotatably attached to the body, and an electric motor driving the rotating body and driven by power supplied from an external power supply or an internal power supply attached to the body. And a power converter for controlling power supplied from the power supply to the motor, wherein the power converter is the power converter according to any one of claims 1 to 14. body. 16. A vehicle, a front and rear wheel rotatably mounted on the vehicle body, a motor driving one of the front and rear wheels, and a power storage device for storing driving power supplied to the motor. A power converter that converts DC power supplied from the power storage device to the motor to AC power, wherein the power converter is the power converter according to any one of claims 1 to 14. A moving object that is characteristic. 17. A vehicle body, a front and rear wheel rotatably mounted on the vehicle body, an internal combustion engine driving one of the front and rear wheels, and driving one of the front and rear wheels in place of the internal combustion engine An electric motor, a power storage device that stores driving power supplied to the motor, and a power conversion device that converts DC power supplied from the power storage device to the motor into AC power, wherein the power conversion device is a power conversion device. A moving object, which is the power conversion device according to any one of 1 to 14. 18. A vehicle body, a front and rear wheel rotatably mounted on the vehicle body, an internal combustion engine for driving one of the front and rear wheels, an electric motor for driving the other of the front and rear wheels, and a supply to the electric motor. A power storage device that stores driving power, and a power conversion device that converts DC power supplied from the power storage device to the motor into AC power, wherein the power conversion device is described in any one of claims 1 to 14. A mobile object characterized in that it is a power converter. 19. The moving body according to claim 16, wherein the vehicle body is capable of mounting a driving room in which a driving device is stored, an engine room in which the internal combustion engine is stored, and articles. The power converter has a portion that covers at least a part of a periphery of the front and rear wheels.
A moving body attached to any one of the engine room, the loading platform, and the cover portion. 20. The mobile object according to claim 16, wherein the power converter is provided substantially perpendicular to one surface of an outer surface, and a plurality of plate-shaped heat radiation devices are arranged side by side. Having a member, wherein the heat radiating member is attached to the vehicle body such that the heat radiating member faces the moving direction of the vehicle body, and external air flows upward between the heat radiating members from the moving surface side of the vehicle body. Moving body to do.