JP2002368061A - Device for opening/closing storage container and storage container - Google Patents

Device for opening/closing storage container and storage container

Info

Publication number
JP2002368061A
JP2002368061A JP2001177138A JP2001177138A JP2002368061A JP 2002368061 A JP2002368061 A JP 2002368061A JP 2001177138 A JP2001177138 A JP 2001177138A JP 2001177138 A JP2001177138 A JP 2001177138A JP 2002368061 A JP2002368061 A JP 2002368061A
Authority
JP
Japan
Prior art keywords
opening
storage container
housing
closing
space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001177138A
Other languages
Japanese (ja)
Inventor
Makoto Hashida
誠 橋田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2001177138A priority Critical patent/JP2002368061A/en
Publication of JP2002368061A publication Critical patent/JP2002368061A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To prevent contaminants from intruding into a storage container and a local cleaned environmental space when the cover of the storage container is opened. SOLUTION: A buffer space 40 for preventing the intrusion of contaminants is provided between an outer peripheral region on the opening 221 side of a box 22 of a storage container 20 facing to the opening 32, of a closing member 31 covering the surface opposite to the storage container 20 of the local cleaned environmental space 10, through which a semiconductor is loaded or unloaded and the closing member 31 and an end surface on the opening 221 side of the box 22 opposite thereto. This buffer space 40 is maintained, by cleaned gas introduced from the local cleaned environmental space 10, in the same atmosphere as the local cleaned environmental space 10 and a cover 24 of the storage container 20 is opened or closed in synchronization with an opening/closing door 33 on the local cleaned environmental space 10 side with the opening portion of the box 22 of the storage container 20 faced to the buffer space 40.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、半導体ウェーハを
収容する保管容器の開閉装置及び保管容器に関し、さら
に詳しくは、半導体製造装置の処理部と保管容器との間
に局所清浄環境(ミニエンバイロメント)の空間を設
け、この局所清浄環境空間を通して保管容器内の半導体
ウェーハを出し入れするに際し、保管容器の蓋体を開い
た時、保管容器内及び局所清浄環境空間内への汚染物質
の侵入を未然に防止できるようにした保管容器の開閉装
置及び保管容器に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a storage container opening and closing device for storing semiconductor wafers and a storage container, and more particularly, to a local cleaning environment (mini environment) between a processing section of a semiconductor manufacturing apparatus and the storage container. When a semiconductor wafer in the storage container is taken in and out of the storage container through the local clean environment space, when the lid of the storage container is opened, contaminants are prevented from entering the storage container and the local clean environment space. The present invention relates to a storage container opening / closing device and a storage container which can be prevented in a short time.

【0002】[0002]

【従来の技術】半導体製造装置においては、各処理部と
の間で半導体ウェーハ(半導体製品材料)を運搬し、ま
た、保管するために保管容器が用いられ、半導体ウェー
ハを汚染源から隔離している。この種の保管容器には、
一般に、FOUP(Front Opening Unified Pod)と称
される容器が使用されている。そして、半導体製造装置
の各種処理部処理部に近接して局所的に高清浄度の空間
が設けられており、この局所清浄環境空間に自動開閉装
置が配設され、この自動開閉装置により保管容器の蓋体
が開けられ、前記局所清浄環境空間を通して保管容器内
の半導体ウェーハを処理部との間で出し入れできるよう
に構成されている。
2. Description of the Related Art In a semiconductor manufacturing apparatus, a storage container is used for transporting and storing a semiconductor wafer (semiconductor product material) with each processing section, thereby isolating the semiconductor wafer from a contamination source. . This type of storage container includes:
Generally, a container called a FOUP (Front Opening Unified Pod) is used. Various processing sections of the semiconductor manufacturing apparatus A high-cleanliness space is provided locally in close proximity to the processing section, and an automatic opening / closing device is provided in this local clean environment space, and the storage container is provided by the automatic opening / closing device. Is opened so that the semiconductor wafer in the storage container can be taken in and out of the processing unit through the local clean environment space.

【0003】図11及び図12により従来における保管
容器の開閉装置について説明する。図11において、1
00は局所清浄環境空間であり、この局所清浄環境空間
100は半導体製造装置における処理部(図示せず)の
半導体ウェーハ出し入れ部分に対向して形成される。ま
た、局所清浄環境空間100の保管容器200と対向す
る面には開閉装置300が配設されている。
A conventional storage container opening / closing device will be described with reference to FIGS. 11 and 12. FIG. In FIG. 11, 1
Reference numeral 00 denotes a local clean environment space. The local clean environment space 100 is formed to face a semiconductor wafer loading / unloading part of a processing unit (not shown) in a semiconductor manufacturing apparatus. An opening / closing device 300 is provided on a surface of the local clean environment space 100 facing the storage container 200.

【0004】前記開閉装置300は、局所清浄環境空間
100の保管容器200と対向する面を覆う閉塞部材3
01と、この閉塞部材301に形成した半導体ウェーハ
出し入れ開口302を微小の間隙dを置いて開閉する開
閉扉303と、この開閉扉303を開閉駆動する駆動部
304と、閉塞部材301の外側面に開口302から水
平に突設した保管容器載置部305とを備えている。前
記保管容器200は、半導体ウェーハを収容する筐体2
01と、この筐体201の前面開口を開閉する蓋体20
2とを備え、この蓋体202は、開閉装置300の開閉
扉303に設けた図示省略の吸着手段により吸着できる
構成になっており、そして、この蓋体202は開閉扉3
03に吸着された状態で、開閉装置300の駆動部30
4による開閉扉303の開閉動作に連動して開閉される
ようになっている。
The opening / closing device 300 includes a closing member 3 for covering a surface of the local clean environment space 100 facing the storage container 200.
01, an opening / closing door 303 for opening / closing a semiconductor wafer opening / closing opening 302 formed in the closing member 301 with a small gap d therebetween, a driving unit 304 for opening / closing the opening / closing door 303, and an outer surface of the closing member 301. A storage container mounting portion 305 protruding horizontally from the opening 302 is provided. The storage container 200 includes a housing 2 for housing a semiconductor wafer.
01 and a lid 20 for opening and closing the front opening of the housing 201
The lid 202 is configured to be able to be sucked by a suction means (not shown) provided on the opening / closing door 303 of the opening / closing device 300.
03, the drive unit 30 of the opening / closing device 300
4, the door is opened and closed in conjunction with the opening and closing operation of the opening and closing door 303.

【0005】このような従来の保管容器の開閉装置にお
いて、保管容器200の蓋体202を開ける場合は、図
12(A)に示すように、保管容器200を台座306
を介して載置部305上に載せた後、保管容器200全
体をその蓋体202が開閉装置300の開閉扉303に
当接するまで移動する。この状態で、駆動部304を動
作することにより開閉扉303を蓋体202に吸着さ
せ、かつ開閉扉303を図12(B)に示す矢印X方向
に後退させることで蓋体202を筐体201から離脱さ
せ、しかる後、駆動部304で開閉扉303を図12
(B)に示す矢印Y方向に下降させる。これにより、保
管容器200の前面開口は局所清浄環境空間100の開
口302に臨む状態に開放される。この時、局所清浄環
境空間100内は陽圧になっているため、局所清浄環境
空間100内の清浄空気は開口302と筐体201の外
周面間に形成される隙間dを通して図12(C)の矢印
に示すように外部に流出され、これにより、外気が局所
清浄環境空間100内に侵入されるのを抑制する。
In such a conventional storage container opening / closing device, when the lid 202 of the storage container 200 is opened, as shown in FIG.
Then, the entire storage container 200 is moved until the lid 202 of the storage container 200 comes into contact with the opening / closing door 303 of the opening / closing device 300. In this state, the drive unit 304 is operated to cause the opening / closing door 303 to be attracted to the lid 202, and the opening / closing door 303 is retracted in the arrow X direction shown in FIG. After that, the opening / closing door 303 is moved by the driving unit 304 as shown in FIG.
It is lowered in the direction of arrow Y shown in FIG. Thereby, the front opening of the storage container 200 is opened so as to face the opening 302 of the local clean environment space 100. At this time, since the inside of the local clean environment space 100 is at a positive pressure, the clean air in the local clean environment space 100 passes through the gap d formed between the opening 302 and the outer peripheral surface of the housing 201 as shown in FIG. As shown by the arrow, the air flows out, thereby suppressing the outside air from entering the local clean environment space 100.

【0006】[0006]

【発明が解決しようとする課題】ところで、保管容器2
00は比較的汚染物質の多い場所で保管されるため、密
閉性の良い構造にすることよって内部の半導体ウェーハ
を汚染物質から保護することができるが、筐体201の
表面及び蓋体202の表面には汚染物質が堆積または付
着している。したがって、保管容器200の蓋体202
が開閉装置300により開かれることにより、陽圧状態
にある局所清浄環境空間100内の清浄空気が開口30
2から流出すると、筐体201の表面及び蓋体202の
表面に堆積または付着していた汚染物質が飛散し、その
一部が局所清浄環境空間100内または保管容器200
内に侵入し、局所清浄環境空間100内を汚染して半導
体ウェーハに悪影響を与えるほか、保管容器200内に
侵入した汚染物質は半導体ウェーハに悪影響を与えると
いう問題があった。また、従来の保管容器200では、
蓋体202を開いて筐体201内部が減圧された時に汚
染物質を含む外気が侵入される問題がある。
By the way, the storage container 2
00 is stored in a place with a relatively large amount of contaminants, so that the semiconductor wafer inside can be protected from contaminants by adopting a structure with good sealing properties. However, the surface of the housing 201 and the surface of the lid 202 can be protected. Have deposited or attached contaminants. Therefore, the lid 202 of the storage container 200
Is opened by the opening and closing device 300 so that the clean air in the local clean environment space 100 in the positive pressure state is
2, the contaminants deposited or adhered to the surface of the housing 201 and the surface of the lid 202 are scattered, and a part of the contaminants is in the local clean environment space 100 or the storage container 200.
In addition, there is a problem that contaminants entering the storage container 200 adversely affect the semiconductor wafer in addition to contaminating the local clean environment space 100 and affecting the semiconductor wafer. In the conventional storage container 200,
There is a problem that when the lid 202 is opened and the inside of the housing 201 is decompressed, outside air containing contaminants enters.

【0007】本発明は、上述のような従来の問題を解決
するためになされたもので、保管容器の蓋体を開動作し
た時に保管容器内及び局所清浄環境空間内への汚染物質
の侵入を未然に防止できるようにした保管容器の開閉装
置を提供することを目的とする。
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems. When the lid of the storage container is opened, the intrusion of contaminants into the storage container and the local clean environment space is prevented. It is an object of the present invention to provide a storage container opening / closing device that can prevent such a problem from occurring.

【0008】[0008]

【課題を解決するための手段】上記目的を達成するため
に本発明は、半導体ウェーハを収容する筐体の開口を閉
塞する蓋体を開く保管容器の開閉装置であって、前記保
管容器が載置される載置部と、前記載置部に載置された
保管容器の筐体の開口と対向する所定領域を包囲して高
清浄度の雰囲気を形成する局所清浄環境空間と、前記局
所清浄環境空間の前記筐体の開口と対向する面を覆うよ
うに設けられた閉塞部材と、前記筐体の開口が臨む前記
閉塞部材の箇所に形成された半導体ウェーハ出し入れ用
開口を開閉する開閉扉と、前記開閉扉を開閉駆動すると
共に前記開閉扉の開閉に連動して前記蓋体を開閉する駆
動手段と、前記保管容器を載置部に載せ前記蓋体を前記
半導体ウェーハ出し入れ用開口に対向させた時に前記蓋
体と前記閉塞部材との間及び前記筐体の開口側外周囲に
前記局所清浄環境空間から導入される清浄気体により該
局所清浄環境空間と同一の雰囲気に保持する汚染物質侵
入防止用のバッファ空間が設けられていることを特徴と
する。
According to the present invention, there is provided a storage container opening / closing apparatus for opening a cover for closing an opening of a housing for accommodating a semiconductor wafer. A placing section to be placed, a local clean environment space surrounding a predetermined area facing the opening of the housing of the storage container placed on the placing section to form an atmosphere of high cleanliness, and the local cleaning A closing member provided to cover a surface of the environmental space opposite to the opening of the housing, and an opening / closing door for opening and closing a semiconductor wafer access opening / closing opening formed at a location of the closing member facing the opening of the housing. Driving means for opening and closing the opening / closing door and opening and closing the lid in conjunction with opening and closing of the opening / closing door; and placing the storage container on a mounting portion so that the lid faces the semiconductor wafer loading / unloading opening. The lid and the closing member And a buffer space for preventing intrusion of contaminants, which is kept in the same atmosphere as the local clean environment space by a clean gas introduced from the local clean environment space, around the opening side outer periphery of the housing. It is characterized by.

【0009】また、本発明は、半導体ウェーハを収容す
る筐体と、前記筐体の前部に設けた開口と、前記開口に
僅かな隙間をあけて嵌合可能に設けられ、前記開口に嵌
合した状態で前記開口を閉塞する蓋体とを備える保管容
器であって、前記蓋体で前記開口を閉塞した状態で、前
記隙間と前記筐体の外面とを連通する排気口が設けられ
ていることを特徴とする。
Further, the present invention provides a housing for accommodating a semiconductor wafer, an opening provided at a front portion of the housing, and an opening provided with a slight gap between the housing and the opening. A lid that closes the opening in a combined state, wherein an exhaust port communicating the gap and the outer surface of the housing is provided in a state where the opening is closed by the lid. It is characterized by being.

【0010】本発明の保管容器及びその開閉装置におい
ては、保管容器の筐体開口部分を汚染物質侵入防止用の
バッファ空間に臨ませ、このバッファ空間内を局所清浄
環境空間から導入される清浄気体により局所清浄環境空
間と同一の雰囲気に保持することができるから、保管容
器内及び局所清浄環境空間内への汚染物質の侵入を未然
に防止することができる。
In the storage container and the opening / closing device of the present invention, the opening of the housing of the storage container faces a buffer space for preventing intrusion of contaminants, and a clean gas introduced from a local clean environment space in the buffer space. Accordingly, the same atmosphere as that of the local clean environment space can be maintained, so that intrusion of contaminants into the storage container and the local clean environment space can be prevented.

【0011】[0011]

【発明の実施の形態】以下、本発明の実施の形態につい
て図面を参照して詳細に説明する。図1は本発明かかる
保管容器開閉装置の実施の形態を示すもので、(A)は
保管容器開閉装置の全体の構成を示す側面図、(B)は
その正面図である。図2は本発明の実施の形態における
保管容器開閉装置の汚染物質侵入防止用バッファ空間部
分を拡大して示すもので、(A)はその縦断側面図、
(B)はその正面図である。また、図3は本発明の実施
の形態における保管容器開閉装置のバッファ空間と保管
容器との配置関係を示す側面図、図4は本発明の実施の
形態における保管容器開閉装置のバッファ空間に対する
加圧気体の吹き付け機構の構成説明図、図5は本発明の
実施の形態における保管容器の側面図、図6(A)は図
5のA部分の拡大断面図、図6(B)は図6(A)を矢
印B方向から見た正面図である。
Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows an embodiment of a storage container opening / closing device according to the present invention. FIG. 1 (A) is a side view showing the overall configuration of the storage container opening / closing device, and FIG. 1 (B) is a front view thereof. FIG. 2 is an enlarged view of a buffer space portion for preventing contaminant intrusion of the storage container opening / closing device according to the embodiment of the present invention.
(B) is a front view thereof. FIG. 3 is a side view showing an arrangement relationship between a buffer space and a storage container of the storage container opening / closing device according to the embodiment of the present invention. FIG. FIG. 5 is a side view of a storage container according to an embodiment of the present invention, FIG. 6 (A) is an enlarged sectional view of a portion A in FIG. 5, and FIG. 6 (B) is FIG. FIG. 3A is a front view as viewed from an arrow B direction.

【0012】図1において、10は製品である半導体ウ
ェーハを汚染物質から隔離して高清浄度の雰囲気空間を
形成する局所清浄環境空間であり、この局所清浄環境空
間10は半導体製造装置における処理部(図示せず)の
半導体ウェーハ出し入れ部分に対向して形成される。ま
た、局所清浄環境空間10の保管容器20と対向する面
には開閉装置30が配設されている。
In FIG. 1, reference numeral 10 denotes a local clean environment space for isolating a semiconductor wafer as a product from contaminants to form an atmosphere space of high cleanliness. This local clean environment space 10 is a processing unit in a semiconductor manufacturing apparatus. It is formed to face a semiconductor wafer loading / unloading portion (not shown). An opening / closing device 30 is provided on a surface of the local clean environment space 10 facing the storage container 20.

【0013】前記保管容器20は、図1(A)及び図
5、図6に示すように、半導体ウェーハを収容する筐体
22と、この筐体22の前部に設けた開口221と、こ
の開口221に僅かな隙間22Aをあけて嵌合可能に設
けられ、開口221に嵌合した状態で開口221を閉塞
する蓋体24とを備えている。また、前記蓋体24は、
図6(A)に示すように、筐体22の開口221にシー
ル部材26を介して気密に係合される構成になってお
り、この筐体22には、図6に示すように、蓋体22で
開口221を閉塞した状態で、隙間22Aと筐体22の
外面とを連通する複数の排気口222が筐体22の全周
囲に亘り所定の間隔を置いて設けられている。
As shown in FIGS. 1A, 5 and 6, the storage container 20 includes a housing 22 for housing a semiconductor wafer, an opening 221 provided at a front portion of the housing 22, and A lid 24 is provided in the opening 221 so as to be fitted with a slight gap 22A therebetween, and closes the opening 221 in a state fitted in the opening 221. The lid 24 is
As shown in FIG. 6A, the housing 22 is hermetically engaged with an opening 221 via a seal member 26. As shown in FIG. In a state where the opening 221 is closed by the body 22, a plurality of exhaust ports 222 communicating the gap 22 </ b> A and the outer surface of the housing 22 are provided at predetermined intervals over the entire periphery of the housing 22.

【0014】なお、排気口222においては、筐体22
の蓋体24の開動作時の減圧による外部からの汚染物質
の侵入を防止するため、排気口222の流路をできるだ
け長く取ると共に排気口222の開口断面面積を入り口
から出口に行くに従い小さくくなるようにする。
In the exhaust port 222, the casing 22
In order to prevent intrusion of contaminants from the outside due to reduced pressure during the opening operation of the lid 24, the flow path of the exhaust port 222 is made as long as possible, and the cross-sectional area of the exhaust port 222 is made smaller from the entrance to the exit. To be.

【0015】前記開閉装置30は、図1〜図4に示すよ
うに、局所清浄環境空間10の保管容器20と対向する
面を覆うように設けられた平板状の閉塞部材31と、こ
の閉塞部材31に筐体22の開口221側の外形形状に
対応して形成された半導体ウェーハ出し入れ開口32を
微小の間隙dを置いて開閉する開閉扉33と、この開閉
扉33に連結部材34を介して連結され、開閉扉33を
開閉駆動する駆動部35と、閉塞部材31の外側面に半
導体ウェーハ出し入れ開口32から水平に突設した保管
容器載置部36とを備えている。また、前記開閉扉33
の保管容器20との対向面には、図示省略した公知の吸
着手段が設けられており、この吸着手段で保管容器20
の蓋体24を吸着し、開閉扉33を駆動部35により開
閉駆動する時に、開閉扉33の開閉に連動して蓋体24
を開閉できるように構成されている。
As shown in FIGS. 1 to 4, the opening / closing device 30 includes a plate-shaped closing member 31 provided so as to cover the surface of the local clean environment space 10 facing the storage container 20; An opening / closing door 33 that opens and closes a semiconductor wafer access opening 32 formed at 31 with a small gap d corresponding to the outer shape of the housing 221 on the side of the opening 221 side, and a connecting member 34 connected to the opening / closing door 33. It is provided with a driving unit 35 connected to open and close the opening / closing door 33 and a storage container mounting unit 36 protruding horizontally from the semiconductor wafer loading / unloading opening 32 on the outer surface of the closing member 31. In addition, the door 33
A known suction means (not shown) is provided on a surface of the storage container 20 facing the storage container 20.
When the opening / closing door 33 is adsorbed and the opening / closing door 33 is driven to open / close by the drive unit 35, the lid 24
It can be opened and closed.

【0016】前記載置部36に載せられて保管容器20
の蓋体24側が臨む閉塞部材31の外側面には、図1〜
図4に示すように、保管容器20の蓋体24側の面と閉
塞部材31との間及び筐体22の開口221側外周囲を
囲う汚染物質侵入防止用のバッファ空間40が設けら
れ、このバッファ空間40内は局所清浄環境空間10か
ら導入される清浄気体により局所清浄環境空間10と同
一の雰囲気に保持されるようになっている。
The storage container 20 placed on the mounting portion 36
The outer surface of the closing member 31 facing the lid 24 side of FIG.
As shown in FIG. 4, a buffer space 40 for preventing intrusion of contaminants is provided between the surface of the storage container 20 on the lid 24 side and the closing member 31 and the outer periphery of the housing 22 on the side of the opening 221. The inside of the buffer space 40 is maintained in the same atmosphere as the local clean environment space 10 by the clean gas introduced from the local clean environment space 10.

【0017】このバッファ空間40は、図2に示すよう
に、筐体22の開口221側外周囲を取り囲むように閉
塞部材31に直角に突設した側周壁42と、この側周壁
42の先端縁に、側周壁42の全長に亘り先端縁から内
方へ直角に連接した額縁状の前面壁44とにより構成さ
れ、この額縁状前面壁44は、筐体22の開口221側
外周形状に対応する開口46を有し、この開口46とこ
れに対向する筐体22の開口221側外周面との間に
は、バッファ空間40内の清浄気体を筐体22の開口2
21側外周囲の表面に沿って排出する隙間d1が形成さ
れている。
As shown in FIG. 2, the buffer space 40 has a side peripheral wall 42 projecting at right angles to the closing member 31 so as to surround the outer periphery of the opening 221 side of the housing 22, and a leading edge of the side peripheral wall 42. And a frame-shaped front wall 44 connected inward at a right angle from the leading edge to the entire length of the side peripheral wall 42. The frame-shaped front wall 44 corresponds to the outer peripheral shape of the housing 22 on the side of the opening 221. An opening 46 is provided, and between the opening 46 and the outer peripheral surface on the side of the opening 221 of the housing 22 facing the opening 46, the clean gas in the buffer space 40 is passed through the opening 2 of the housing 22.
A gap d1 for discharging along the outer peripheral surface on the 21 side is formed.

【0018】なお、前記隙間d1の寸法が、筐体22の
開口221側がバッファ空間40に臨む位置から開閉扉
33に接する位置まで一定に保たれるように、図3、図
5及び図6に示すごとく、筐体22の開口221側外周
囲221Aは平坦面で形成されている。この平坦面は、
保管容器20が開閉装置30の開閉扉33に向かって移
動される方向に対して平行であり、また、本実施の形態
では、蓋体24を開口221から取り外す方向に対して
も平行に延在している。
FIGS. 3, 5, and 6 show that the dimension of the gap d1 is kept constant from the position where the opening 221 side of the housing 22 faces the buffer space 40 to the position where it contacts the opening / closing door 33. As shown, the outer periphery 221A of the housing 22 on the opening 221 side is formed of a flat surface. This flat surface
The storage container 20 is parallel to the direction in which the storage container 20 is moved toward the opening / closing door 33 of the opening / closing device 30, and in the present embodiment, also extends parallel to the direction in which the lid 24 is removed from the opening 221. are doing.

【0019】また、前記閉塞部材31には、図2(A)
に示すように、局所清浄環境空間10とバッファ空間4
0との間を連通する複数の清浄気体導入口311が半導
体ウェーハ出し入れ開口32の周囲に沿って形成されて
いる。また、前記額縁状前面壁44には、図2(B)に
示すように、バッファ空間40内を外部へ連通する複数
の排気口441が前面壁44の全長に亘り所定の間隔を
置いて形成されている。なお、隙間d1と排気口441
から流出される流量よりも、導入口311から導入され
る清浄気体の流量の方が多くなるように、導入口311
全体の開口面積を隙間d1と排気口441開口面積より
も大きくなっている。
FIG. 2A shows the closing member 31.
As shown in FIG. 3, the local clean environment space 10 and the buffer space 4
A plurality of clean gas inlets 311 communicating between the inlet and outlet are formed along the periphery of the semiconductor wafer access opening 32. As shown in FIG. 2B, the frame-shaped front wall 44 has a plurality of exhaust ports 441 communicating with the outside in the buffer space 40 at predetermined intervals over the entire length of the front wall 44. Have been. The gap d1 and the exhaust port 441
So that the flow rate of the clean gas introduced from the introduction port 311 is larger than the flow rate flowing out from the introduction port 311.
The entire opening area is larger than the gap d1 and the opening area of the exhaust port 441.

【0020】前記開閉扉33には、図4に示すように、
加圧気体吹き出し口331が形成されており、この吹き
出し口331には、バッファ空間40内に臨ませた筐体
22の蓋体24及び筐体22の開口221側端面に付着
する汚染物質を除去するための加圧気体供給源50が接
続されている。前記加圧気体供給源50は、エア供給ポ
ンプ52と、このエア供給ポンプ52の吐出側に接続さ
れた切換弁54と、この切換弁54と吹き出し口331
との間に介在されたフィルタ56とから構成されてい
る。
As shown in FIG. 4, the door 33 has
A pressurized gas outlet 331 is formed. The outlet 331 removes contaminants adhering to the lid 24 of the housing 22 and the end face of the housing 22 on the side of the opening 221 facing the buffer space 40. Pressurized gas supply source 50 is connected. The pressurized gas supply source 50 includes an air supply pump 52, a switching valve 54 connected to the discharge side of the air supply pump 52, the switching valve 54 and the outlet 331.
And a filter 56 interposed therebetween.

【0021】次に、上記のように構成された本実施の形
態における保管容器開閉装置の動作について図面を参照
して説明する。保管容器20の蓋体24を開く場合は、
まず、図7に示すように、保管容器20を載置部36上
に台座60を介して載せ、その蓋体24側をバッファ空
間40の開口46に対向させる。この状態で、保管容器
20をバッファ空間40側へ移動し、筐体22の開口2
21側をバッファ空間40の開口46に挿入して、図8
に示すように、筐体22の蓋体24を開閉扉33に近づ
ける。かかる状態において、図4に示す加圧気体供給源
50の切換弁54を操作することにより、加圧気体供給
源50からの清浄な加圧気体を吹き出し口331を通し
てバッファ空間40内に噴出させる。これに伴い、吹き
出し口331からの加圧気体は、図8に示すように、筐
体22の蓋体24側端面と開閉扉33との間に形成され
た隙間内を矢印方向に流動し、筐体22の排気口222
及び隙間d1、バッファ空間40の排気口441を通し
てバッファ空間40外に排出される。これにより、蓋体
24の表面及び筐体22の開口221側端面に付着して
いる汚染物質(パーティクル)を除去する。
Next, the operation of the storage container opening / closing device according to the present embodiment configured as described above will be described with reference to the drawings. When opening the lid 24 of the storage container 20,
First, as shown in FIG. 7, the storage container 20 is mounted on the mounting portion 36 via the pedestal 60, and the lid 24 side thereof faces the opening 46 of the buffer space 40. In this state, the storage container 20 is moved to the buffer space 40 side, and the opening 2 of the housing 22 is opened.
8 is inserted into the opening 46 of the buffer space 40, and FIG.
As shown in (2), the lid 24 of the housing 22 is moved closer to the opening / closing door 33. In this state, by operating the switching valve 54 of the pressurized gas supply source 50 shown in FIG. 4, clean pressurized gas from the pressurized gas supply source 50 is ejected into the buffer space 40 through the outlet 331. Along with this, the pressurized gas from the outlet 331 flows in the direction shown by the arrow in the gap formed between the end face of the housing 22 on the lid 24 side and the door 33 as shown in FIG. Exhaust port 222 of housing 22
The gas is discharged out of the buffer space 40 through the gap d1 and the exhaust port 441 of the buffer space 40. Thus, contaminants (particles) adhering to the surface of the lid 24 and the end surface of the housing 22 on the side of the opening 221 are removed.

【0022】この場合、局所清浄環境空間10内は陽圧
になっているため、局所清浄環境空間10内の清浄気体
は半導体ウェーハ出し入れ開口32と開閉扉33間の微
小の間隙d及び導入口311を通してバッファ空間40
内に流出される。このため、バッファ空間40内に吹き
出し口331から吹き出された加圧気体が局所清浄環境
空間10内へ逆流することがない。
In this case, since the inside of the local clean environment space 10 is at a positive pressure, the clean gas in the local clean environment space 10 is supplied with the minute gap d between the semiconductor wafer access opening 32 and the opening / closing door 33 and the inlet 311. Through buffer space 40
Spilled into. Therefore, the pressurized gas blown out from the outlet 331 into the buffer space 40 does not flow back into the local clean environment space 10.

【0023】上記図8に示す加圧気体吹き出し処理が所
定時間経過することにより終了されたならば、加圧気体
供給源50からの加圧気体の供給を停止し、図9に示す
ように、保管容器20をその筐体22の蓋体24側がバ
ッファ空間40の開口46に僅かに臨む位置まで後退さ
せ、この位置に所定時間待機させる。これにより、バッ
ファ空間40内は局所清浄環境空間10から導入口31
1及び半導体ウェーハ出し入れ開口32と開閉扉33間
の微小の間隙dを通して流出される清浄気体によって充
満され、バッファ空間40内を局所清浄環境空間10と
同一の雰囲気に移行させる。この場合、バッファ空間4
0内の気体は、図9の矢印に示すように、排気口44
1、隙間d1及び筐体22の排気口222を通して外部
は排出される。これにより、バッファ空間40内を局所
清浄環境空間と同一の雰囲気に速やかに置換する。
When the pressurized gas blowing process shown in FIG. 8 is completed after a predetermined time has elapsed, the supply of the pressurized gas from the pressurized gas supply source 50 is stopped, and as shown in FIG. The storage container 20 is retracted to a position where the lid 24 side of the housing 22 slightly faces the opening 46 of the buffer space 40, and waits at this position for a predetermined time. Thereby, the inside of the buffer space 40 is separated from the local clean environment space 10 by the inlet 31.
1 and filled with a clean gas flowing out through a minute gap d between the semiconductor wafer loading / unloading opening 32 and the opening / closing door 33, and the inside of the buffer space 40 is shifted to the same atmosphere as the local clean environment space 10. In this case, buffer space 4
As shown by the arrow in FIG.
1. The outside is discharged through the gap d1 and the exhaust port 222 of the housing 22. Thereby, the inside of the buffer space 40 is promptly replaced with the same atmosphere as the local clean environment space.

【0024】バッファ空間40内が局所清浄環境空間1
0と同一の雰囲気に移行されたならば、図10に示すよ
うに、保管容器20をその蓋体24が開閉扉33に当接
し、かつ筐体22の開口側端面が閉塞部材31に当接す
る位置まで移動させる。しかる後、開閉扉33に内蔵さ
せた公知の吸着手段を動作させて保管容器20の蓋体2
4を吸着する。この状態で、図1に示す開閉装置30の
駆動部35を作動させることにより、開閉扉33を開け
るとともに保管容器20の蓋体24を開ける。この時、
筐体22の開口側外周面と閉塞部材31と側周壁42及
び額縁状前面壁44で囲まれた空間は局所清浄環境空間
10と同一の雰囲気に保持され、しかも、この空間の清
浄気体は排気口441及び筐体22の外周側隙間d1を
通して外部へ流出されるため、この空間内に汚染物質を
含む外気が侵入されることがない。
The buffer space 40 has a locally clean environment space 1
When the atmosphere is shifted to the same atmosphere as 0, the lid 24 of the storage container 20 contacts the opening / closing door 33 and the opening-side end surface of the housing 22 contacts the closing member 31, as shown in FIG. Move to the position. Thereafter, the known suction means incorporated in the opening / closing door 33 is operated to operate the lid 2 of the storage container 20.
Adsorb 4. In this state, by operating the drive unit 35 of the opening and closing device 30 shown in FIG. 1, the opening and closing door 33 is opened and the lid 24 of the storage container 20 is opened. At this time,
The space surrounded by the outer peripheral surface on the opening side of the housing 22, the closing member 31, the side peripheral wall 42, and the frame-shaped front wall 44 is maintained in the same atmosphere as the local clean environment space 10, and the clean gas in this space is exhausted. Since the air flows out to the outside through the opening 441 and the outer circumferential side gap d1 of the housing 22, external air containing pollutants does not enter the space.

【0025】このような本実施の形態によれば、局所清
浄環境空間10の保管容器20との対向面を覆う閉塞部
材31の半導体ウェーハ出し入れ開口32に臨む保管容
器20の筐体22の開口221側外周囲及び閉塞部材3
1とこれに対向する筐体22の開口221側端面間に汚
染物質の侵入を防止するバッファ空間40を設け、この
バッファ空間40内を局所清浄環境空間10から導入さ
れる清浄気体により局所清浄環境空間10と同一の雰囲
気に保持し、このバッファ空間40内に保管容器20の
筐体開口部分を臨ませた状態で保管容器20の蓋体24
を局所清浄環境空間10側の開閉扉33に連動して開閉
できるように構成したので、保管容器20内及び局所清
浄環境空間10内への汚染物質の侵入を未然に防止する
ことができる。
According to the present embodiment, the opening 221 of the housing 22 of the storage container 20 facing the semiconductor wafer loading / unloading opening 32 of the closing member 31 that covers the surface of the local clean environment space 10 facing the storage container 20. Outer perimeter and closing member 3
1 and a buffer space 40 for preventing intrusion of contaminants between the end face of the housing 221 and the opening 221 facing the housing 22, and the inside of the buffer space 40 is cleaned by a clean gas introduced from the local clean environment space 10. The lid 24 of the storage container 20 is maintained in the same atmosphere as the space 10, with the housing opening of the storage container 20 facing the buffer space 40.
Can be opened and closed in conjunction with the opening / closing door 33 of the local clean environment space 10, so that intrusion of contaminants into the storage container 20 and the local clean environment space 10 can be prevented.

【0026】また、本実施の形態によれば、筐体22の
開口221側の外周囲と対向する閉塞部材31の箇所に
局所清浄環境空間10からバッファ空間へ清浄空気を導
入するための導入口311が設けられているため、バッ
ファ空間40内を局所清浄環境空間10と同一の雰囲気
に速やかに移行でき、バッファ空間40内の雰囲気導入
時間を短縮することができる。また、本実施の形態によ
れば、バッファ空間40を構成する額縁状前面壁44に
は外部に連通する排気口441が設けられているため、
バッファ空間40内を局所清浄環境空間10と同一の雰
囲気に速やかに置換でき、バッファ空間40内の雰囲気
置換時間を短縮することができる。
Further, according to the present embodiment, the inlet for introducing clean air from the local clean environment space 10 to the buffer space at the location of the closing member 31 facing the outer periphery on the opening 221 side of the housing 22. Since the buffer space 311 is provided, the inside of the buffer space 40 can be promptly shifted to the same atmosphere as the local clean environment space 10, and the time for introducing the atmosphere into the buffer space 40 can be reduced. Further, according to the present embodiment, since the frame-shaped front wall 44 constituting the buffer space 40 is provided with the exhaust port 441 communicating with the outside,
The atmosphere inside the buffer space 40 can be quickly replaced with the same atmosphere as the local clean environment space 10, and the atmosphere replacement time in the buffer space 40 can be shortened.

【0027】また、本実施の形態によれば、バッファ空
間40を構成する額縁状前面壁44の開口46とこれに
対向する筐体22の開口221側外周面との間に隙間d
1が形成され、この隙間d1は筐体22の開口221側
がバッファ空間40に臨む位置から開閉扉33に接する
位置まで一定に保たれるように構成されているため、バ
ッファ空間40内の清浄気体を隙間d1から筐体22の
開口221側外周囲の表面に沿って外部へ排出される気
体の流れを生じさせることにより、筐体22の表面に付
着または堆積している汚染物質を気体の流れと共にバッ
ファ空間40外へ排出することができ、バッファ空間4
0内を清浄雰囲気に保持できる。
Further, according to the present embodiment, the gap d is formed between the opening 46 of the frame-shaped front wall 44 constituting the buffer space 40 and the outer peripheral surface of the housing 22 facing the opening 221.
1 is formed, and the gap d1 is configured to be kept constant from a position where the opening 221 side of the housing 22 faces the buffer space 40 to a position where it contacts the opening / closing door 33, so that the clean gas in the buffer space 40 is Is generated from the gap d1 to the outside along the outer peripheral surface of the housing 22 on the side of the opening 221 so that the contaminants adhering or accumulating on the surface of the housing 22 can be removed by the gas flow. Can be discharged out of the buffer space 40 together with the buffer space 4.
0 can be kept in a clean atmosphere.

【0028】また、本実施の形態によれば、蓋体24を
筐体22の開口221にシール部材26を介して嵌合で
きる構成にし、かつ、筐体22に筐体22の開口221
側端面から筐体22の外周面に向けて貫通する排気口2
22が設けられているため、筐体22と蓋体24との隙
間に付着または堆積している汚染物質をバッファ空間4
0から排気口222を通して流出する清浄気体によりバ
ッファ空間40外へ排出することができ、バッファ空間
40内を清浄雰囲気に保持できる。
According to the present embodiment, the lid 24 is configured to be fitted into the opening 221 of the housing 22 via the seal member 26, and the housing 22 is connected to the opening 221 of the housing 22.
Exhaust port 2 penetrating from the side end surface toward the outer peripheral surface of housing 22
22 is provided, contaminants adhering or accumulating in the gap between the housing 22 and the lid 24 are removed from the buffer space 4.
The clean gas flowing out from the exhaust port 222 through the exhaust port 222 can be discharged to the outside of the buffer space 40, and the inside of the buffer space 40 can be maintained in a clean atmosphere.

【0029】また、本実施の形態によれば、開閉扉33
に加圧気体吹き出し口331を形成し、この吹き出し口
331を通して加圧気体供給源50から加圧気体をバッ
ファ空間40内に臨ませた筐体22の蓋体24の表面に
吹き付ける構成にしたので、蓋体24の表面及び筐体2
2の開口221側端面に付着する汚染物質を吹き飛ばす
ことにより除去し、筐体22の排気口222及びバッフ
ァ空間40の排気口441を通してバッファ空間40外
へ排出することができる。
Further, according to the present embodiment, the opening / closing door 33
A pressurized gas blowout port 331 is formed on the surface of the lid 22 of the housing 22 through which the pressurized gas supply source 50 presses the pressurized gas through the blowout port 331 into the buffer space 40. , Surface of lid 24 and housing 2
The contaminants adhering to the end face of the second opening 221 side can be removed by blowing off, and can be discharged out of the buffer space 40 through the exhaust port 222 of the housing 22 and the exhaust port 441 of the buffer space 40.

【0030】なお、バッファ空間40の清浄気体導入口
311の開口面積を大きくした場合、局所清浄環境空間
10の圧力が低下することがある。このため、本発明に
おいては、清浄気体導入口311に、蓋体24の開動作
時のみに開くようにしたシャッタを設けるか、または清
浄気体導入口311に別途ファンフィルタユニットを追
加する構成にする。
When the opening area of the clean gas inlet 311 in the buffer space 40 is increased, the pressure in the local clean environment space 10 may decrease. Therefore, in the present invention, a shutter is provided in the clean gas inlet 311 so as to be opened only when the lid 24 is opened, or a separate fan filter unit is added to the clean gas inlet 311. .

【0031】[0031]

【発明の効果】以上のように、本発明にかかる保管容器
及びその開閉装置によれば、局所清浄環境空間の半導体
ウェーハ出し入れ開口に臨む保管容器の領域に汚染物質
の侵入を遮断するバッファ空間を設け、このバッファ空
間内を局所清浄環境空間から導入される清浄気体により
局所清浄環境空間と同一の雰囲気に保持できる構成にし
たので、保管容器内及び局所清浄環境空間内への汚染物
質の侵入を未然に防止することができる。
As described above, according to the storage container and the opening / closing device for the same according to the present invention, the buffer space for blocking the intrusion of contaminants into the region of the storage container facing the semiconductor wafer loading / unloading opening of the local clean environment space is provided. The buffer space is configured to be able to maintain the same atmosphere as the local clean environment space by the clean gas introduced from the local clean environment space, so that intrusion of contaminants into the storage container and the local clean environment space is prevented. It can be prevented beforehand.

【0032】また、本発明によれば、保管容器の開口側
外周囲と対向する閉塞部材の箇所に局所清浄環境空間か
らバッファ空間へ清浄空気を導入するための導入口が設
けられているため、バッファ空間内を局所清浄環境空間
と同一の雰囲気に速やかに移行でき、バッファ空間内の
雰囲気導入時間を短縮することができる。また、本発明
によれば、バッファ空間に外部に連通する排気口が設け
られているため、バッファ空間内を局所清浄環境空間と
同一の雰囲気に速やかに置換でき、バッファ空間内の雰
囲気置換時間を短縮することができる。
Further, according to the present invention, since the inlet for introducing clean air from the local clean environment space to the buffer space is provided at the position of the closing member facing the outer periphery of the opening side of the storage container, The atmosphere in the buffer space can be quickly shifted to the same atmosphere as the local clean environment space, and the time for introducing the atmosphere in the buffer space can be reduced. Further, according to the present invention, since the exhaust space communicating with the outside is provided in the buffer space, the buffer space can be quickly replaced with the same atmosphere as the local clean environment space, and the atmosphere replacement time in the buffer space can be reduced. Can be shortened.

【0033】また、本発明によれば、バッファ空間内に
臨む保管容器の開口側外周囲に隙間が形成され、この隙
間は筐体の開口側がバッファ空間に臨む位置から開閉扉
に接する位置まで一定に保たれるように構成されている
ため、バッファ空間内の清浄気体を隙間から保管容器の
開口側外周囲の表面に沿って外部へ排出される気体の流
れを生じさせることにより、保管容器の表面に付着また
は堆積している汚染物質を気体の流れと共にバッファ空
間外へ排出することができ、バッファ空間内を清浄雰囲
気に保持できる。さらに、本発明によれば、保管容器の
蓋体を保管容器の開口にシール部材を介して嵌合できる
構成にし、かつ、保管容器にその開口側端面から保管容
器の外面に向けて貫通する排気口が設けられているた
め、保管容器及び蓋体との隙間に付着または堆積してい
る汚染物質をバッファ空間から排気口を通して流出する
清浄気体によりバッファ空間外へ排出することができ、
バッファ空間内を清浄雰囲気に保持できる。
According to the present invention, a gap is formed around the opening side of the storage container facing the buffer space, and the gap is constant from a position where the opening side of the housing faces the buffer space to a position where it contacts the opening / closing door. It is configured so that the clean gas in the buffer space is caused to flow to the outside along the surface around the opening side of the storage container through the gap to thereby keep the storage space in the storage space. Contaminants adhering or accumulating on the surface can be discharged out of the buffer space together with the gas flow, and the inside of the buffer space can be maintained in a clean atmosphere. Further, according to the present invention, the lid of the storage container is configured to be fitted to the opening of the storage container via the sealing member, and the exhaust gas penetrates the storage container from the opening side end surface toward the outer surface of the storage container. Since the opening is provided, the contaminants attached or deposited in the gap between the storage container and the lid can be discharged out of the buffer space by the clean gas flowing out from the buffer space through the exhaust port,
The buffer space can be kept in a clean atmosphere.

【0034】また、本発明によれば、開閉扉に加圧気体
吹き出し口を形成し、この吹き出し口を通して加圧気体
供給源から加圧気体をバッファ空間内に臨ませた保管容
器の蓋体の表面に吹き付ける構成にしたので、蓋体の表
面及び保管容器の開口側端面に付着する汚染物質を吹き
飛ばすことにより除去し、保管容器の排気口及びバッフ
ァ空間の排気口を通してバッファ空間外へ排出すること
ができる。
Further, according to the present invention, a pressurized gas outlet is formed in the opening / closing door, and the lid of the storage container lid through which the pressurized gas is supplied from the pressurized gas supply source into the buffer space through the outlet. Since it is configured to spray on the surface, the contaminants adhering to the surface of the lid body and the opening side end face of the storage container are removed by blowing off, and discharged to the outside of the buffer space through the storage container exhaust port and the buffer space exhaust port. Can be.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明かかる保管容器開閉装置の実施の形態を
示すもので、(A)は保管容器開閉装置の全体の構成を
示す側面図、(B)はその正面図である。
FIG. 1 shows an embodiment of a storage container opening / closing device according to the present invention, in which (A) is a side view showing the entire configuration of the storage container opening / closing device, and (B) is a front view thereof.

【図2】本発明の実施の形態における保管容器開閉装置
の汚染物質侵入防止用バッファ空間部分を拡大して示す
もので、(A)はその縦断側面図、(B)はその正面図
である。
FIG. 2 is an enlarged view showing a buffer space portion for preventing intrusion of contaminants of the storage container opening / closing device according to the embodiment of the present invention, where (A) is a longitudinal side view and (B) is a front view thereof. .

【図3】本発明の実施の形態における保管容器開閉装置
のバッファ空間と保管容器との配置関係を示す側面図で
ある。
FIG. 3 is a side view showing an arrangement relationship between a buffer space and a storage container of the storage container opening / closing device according to the embodiment of the present invention.

【図4】本発明の実施の形態における保管容器開閉装置
のバッファ空間に対する加圧気体の吹き付け機構の構成
説明図である。
FIG. 4 is a configuration explanatory view of a mechanism for blowing a pressurized gas to a buffer space of the storage container opening / closing device according to the embodiment of the present invention.

【図5】本発明の実施の形態における保管容器の側面図
である。
FIG. 5 is a side view of the storage container according to the embodiment of the present invention.

【図6】(A)は図5のA部分の拡大断面図、(B)は
(A)を矢印B方向から見た正面図である。
6A is an enlarged cross-sectional view of a portion A in FIG. 5, and FIG. 6B is a front view of FIG.

【図7】本発明の実施の形態における保管容器の蓋を開
らく時の動作過程を示す説明図である。
FIG. 7 is an explanatory diagram showing an operation process when opening the lid of the storage container in the embodiment of the present invention.

【図8】本発明の実施の形態における保管容器の蓋を開
らく時の動作過程を示す説明図である。
FIG. 8 is an explanatory diagram showing an operation process when the lid of the storage container is opened according to the embodiment of the present invention.

【図9】本発明の実施の形態における保管容器の蓋を開
らく時の動作過程を示す説明図である。
FIG. 9 is an explanatory diagram showing an operation process when opening the lid of the storage container according to the embodiment of the present invention.

【図10】本発明の実施の形態における保管容器の蓋を
開らく時の動作過程を示す説明図である。
FIG. 10 is an explanatory diagram showing an operation process when opening the lid of the storage container in the embodiment of the present invention.

【図11】従来における保管容器開閉装置の全体の構成
を示す側面図である。
FIG. 11 is a side view showing the overall configuration of a conventional storage container opening / closing device.

【図12】従来における保管容器の蓋を開らく時の動作
過程を示す説明図である。
FIG. 12 is an explanatory view showing an operation process when the cover of the storage container is opened in the related art.

【符号の説明】[Explanation of symbols]

10……局所清浄環境空間、20……保管容器、22…
…筐体、22A……隙間、221……開口、222……
排気口、24……蓋体、26……シール部材、30……
開閉装置、31……閉塞部材、32……半導体ウェーハ
出し入れ開口、33……開閉扉、35……駆動部、36
……保管容器載置部、311……導入口、331……吹
き出し口、40……バッファ空間、46……開口、44
1……排気口、50……加圧気体供給源。
10 ... local clean environment space, 20 ... storage container, 22 ...
... housing, 22A ... gap, 221 ... opening, 222 ...
Exhaust port, 24 ... lid, 26 ... seal member, 30 ...
Opening / closing device, 31 Closing member, 32 Semiconductor wafer loading / unloading opening, 33 Opening / closing door, 35 Drive unit, 36
... Storage container mounting portion, 311... Introduction port, 331... Blowout port, 40... Buffer space, 46.
1 ... exhaust port, 50 ... pressurized gas supply source.

フロントページの続き Fターム(参考) 3E067 AA13 AB40 AC01 AC14 BA07A CA04 CA17 EA17 EB27 FA01 FB11 FC01 5F031 CA02 DA08 DA20 EA12 EA14 FA01 FA12 NA02 NA04 NA09 NA10 NA15 NA20 PA26 Continued on front page F term (reference) 3E067 AA13 AB40 AC01 AC14 BA07A CA04 CA17 EA17 EB27 FA01 FB11 FC01 5F031 CA02 DA08 DA20 EA12 EA14 FA01 FA12 NA02 NA04 NA09 NA10 NA15 NA20 PA26

Claims (12)

【特許請求の範囲】[Claims] 【請求項1】 半導体ウェーハを収容する筐体の開口を
閉塞する蓋体を開く保管容器の開閉装置であって、 前記保管容器が載置される載置部と 前記載置部に載置された保管容器の筐体の開口と対向す
る所定領域を包囲して高清浄度の雰囲気を形成する局所
清浄環境空間と、 前記局所清浄環境空間の前記筐体の開口と対向する面を
覆うように設けられた閉塞部材と、 前記筐体の開口が臨む前記閉塞部材の箇所に形成された
半導体ウェーハ出し入れ用開口を開閉する開閉扉と、 前記開閉扉を開閉駆動すると共に前記開閉扉の開閉に連
動して前記蓋体を開閉する駆動手段と、 前記保管容器を載置部に載せ前記蓋体を前記半導体ウェ
ーハ出し入れ用開口に対向させた時に前記蓋体と前記閉
塞部材との間及び前記筐体の開口側外周囲に前記局所清
浄環境空間から導入される清浄気体により該局所清浄環
境空間と同一の雰囲気に保持する汚染物質侵入防止用の
バッファ空間が設けられている、 ことを特徴とする保管容器の開閉装置。
1. A storage container opening / closing device for opening a lid for closing an opening of a housing for accommodating a semiconductor wafer, wherein the storage container is mounted on a mounting portion on which the storage container is mounted and on a mounting portion. A local clean environment space surrounding a predetermined area facing the opening of the housing of the storage container and forming an atmosphere of high cleanliness; and covering a surface of the local clean environment space facing the opening of the housing. A closing member provided, an opening / closing door for opening / closing a semiconductor wafer access opening / closing opening formed at a position of the closing member facing the opening of the housing; A drive unit for opening and closing the lid, and a space between the lid and the closing member and the housing when the storage container is placed on a mounting portion and the lid is opposed to the semiconductor wafer loading / unloading opening. The local cleaning ring around the outside of the opening side of the A buffer space for preventing intrusion of contaminants which is maintained in the same atmosphere as the local clean environment space by a clean gas introduced from the boundary space.
【請求項2】 前記バッファ空間内が前記局所清浄環境
空間と同一の雰囲気に速やかに移行されるように前記筐
体の開口側外周囲と対向する前記閉塞部材の箇所に前記
局所清浄環境空間からバッファ空間へ清浄空気が導入さ
れる導入口が設けられていることを特徴とする請求項1
記載の保管容器の開閉装置。
2. The location of the closing member facing the outer periphery of the opening side of the housing so that the inside of the buffer space is promptly shifted to the same atmosphere as the local cleaning environment space. 2. An inlet for introducing clean air into the buffer space is provided.
An opening and closing device for a storage container as described in the above.
【請求項3】 前記導入口はシャッタにより開閉できる
ように構成されていることを特徴とする請求項2記載の
保管容器の開閉装置。
3. The storage container opening and closing device according to claim 2, wherein the inlet is configured to be opened and closed by a shutter.
【請求項4】 前記導入口にファンフィルタユニットが
設けられていることを特徴とする請求項2記載の保管容
器の開閉装置。
4. The storage container opening / closing device according to claim 2, wherein a fan filter unit is provided at the inlet.
【請求項5】 前記バッファ空間が前記局所清浄環境空
間と同一の雰囲気に速やかに置換されるように前記バッ
ファ空間は該バッファ空間に導入された清浄気体を該バ
ッファ空間外に排出する排気口を備えることを特徴とす
る請求項1記載の保管容器の開閉装置。
5. An exhaust port for discharging a clean gas introduced into the buffer space out of the buffer space so that the buffer space is promptly replaced with the same atmosphere as the local clean environment space. The storage container opening / closing device according to claim 1, further comprising:
【請求項6】 前記バッファ空間内に臨む前記筐体の開
口側外周囲に前記バッファ空間に導入された清浄気体が
前記開口側外周囲の表面に沿って排出される隙間が形成
されていることを特徴とする請求項1記載の保管容器の
開閉装置。
6. A gap is formed around the opening side of the housing facing the buffer space so that the clean gas introduced into the buffer space is discharged along the surface around the opening side. The storage container opening / closing device according to claim 1, characterized in that:
【請求項7】 前記隙間の寸法が、前記筐体の開口側が
前記バッファ空間に臨む位置から前記開閉扉に接する位
置まで一定に保たれるように、前記筐体の開口側外周囲
は平坦面で形成されていることを特徴とする請求項6記
載の保管容器の開閉装置。
7. The outer periphery of the housing on the opening side is flat so that the size of the gap is kept constant from a position where the opening side of the housing faces the buffer space to a position where the opening contacts the opening / closing door. 7. The opening and closing device for a storage container according to claim 6, wherein the opening and closing device is formed of:
【請求項8】 前記蓋体は前記筐体の開口にシール部材
を介して嵌合され、前記筐体に該筐体の開口側端面から
筐体の外面に向けて貫通する排気口が設けられているこ
とを特徴とする請求項1記載の保管容器の開閉装置。
8. The lid is fitted into an opening of the housing via a seal member, and the housing is provided with an exhaust port penetrating from an opening-side end surface of the housing toward an outer surface of the housing. The opening / closing device for a storage container according to claim 1, wherein:
【請求項9】 前記開閉扉に加圧気体吹き出し口が形成
され、前記吹き出し口に加圧気体供給源が接続され、前
記加圧気体供給源からの加圧気体を前記吹き出し口を通
して前記バッファ空間内に臨ませた前記筐体の蓋体の表
面に吹き付けることにより該蓋体及び筐体の開口側端面
に付着する汚染物質を除去するように構成されているこ
とを特徴とする請求項1記載の保管容器の開閉装置。
9. A pressurized gas outlet is formed in the opening / closing door, a pressurized gas supply source is connected to the outlet, and pressurized gas from the pressurized gas supply source is passed through the outlet through the buffer space. 2. The apparatus according to claim 1, wherein a contaminant adhered to an opening-side end surface of the lid and the housing is removed by spraying the surface of the lid of the housing facing the inside. Storage container opening and closing device.
【請求項10】 半導体ウェーハを収容する筐体と、 前記筐体の前部に設けた開口と、 前記開口に僅かな隙間をあけて嵌合可能に設けられ、前
記開口に嵌合した状態で前記開口を閉塞する蓋体とを備
える保管容器であって、 前記蓋体で前記開口を閉塞した状態で、前記隙間と前記
筐体の外面とを連通する排気口が設けられていることを
特徴とする保管容器。
10. A housing for accommodating a semiconductor wafer, an opening provided in a front portion of the housing, and provided so as to be fitted with a slight gap in the opening, and in a state fitted in the opening. A storage container provided with a lid closing the opening, wherein an exhaust port communicating the gap and an outer surface of the housing is provided in a state where the opening is closed by the lid. And storage container.
【請求項11】 前記蓋体は前記筐体の開口にシール部
材を介して嵌合されるように構成されていることを特徴
とする請求項10記載の保管容器。
11. The storage container according to claim 10, wherein the lid is configured to be fitted into an opening of the housing via a seal member.
【請求項12】 前記筐体の開口側外周囲は平坦面で形
成されていることを特徴とする請求項10記載の保管容
器。
12. The storage container according to claim 10, wherein the outer periphery of the housing on the opening side is formed as a flat surface.
JP2001177138A 2001-06-12 2001-06-12 Device for opening/closing storage container and storage container Pending JP2002368061A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001177138A JP2002368061A (en) 2001-06-12 2001-06-12 Device for opening/closing storage container and storage container

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001177138A JP2002368061A (en) 2001-06-12 2001-06-12 Device for opening/closing storage container and storage container

Publications (1)

Publication Number Publication Date
JP2002368061A true JP2002368061A (en) 2002-12-20

Family

ID=19018030

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP2002368061A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005033118A (en) * 2003-07-11 2005-02-03 Tdk Corp System and method for purging
JP2005310809A (en) * 2004-04-16 2005-11-04 Kondo Kogyo Kk Mini-environmental semiconductor manufacturing apparatus
JP2007220773A (en) * 2006-02-15 2007-08-30 Hitachi High-Tech Control Systems Corp Mini environment device, and clean room equipment using same
US7654291B2 (en) 2003-04-28 2010-02-02 Tdk Corporation Purging apparatus and purging method
JP2010056296A (en) * 2008-08-28 2010-03-11 Tdk Corp System and method for opening/closing lid of sealed vessel
CN102693926A (en) * 2011-03-25 2012-09-26 东京毅力科创株式会社 Lid opening and closing device
JP2014220515A (en) * 2014-07-14 2014-11-20 東京エレクトロン株式会社 Lid opening/closing device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7654291B2 (en) 2003-04-28 2010-02-02 Tdk Corporation Purging apparatus and purging method
JP2005033118A (en) * 2003-07-11 2005-02-03 Tdk Corp System and method for purging
JP2005310809A (en) * 2004-04-16 2005-11-04 Kondo Kogyo Kk Mini-environmental semiconductor manufacturing apparatus
JP4523792B2 (en) * 2004-04-16 2010-08-11 近藤工業株式会社 Mini-environment semiconductor manufacturing equipment
JP2007220773A (en) * 2006-02-15 2007-08-30 Hitachi High-Tech Control Systems Corp Mini environment device, and clean room equipment using same
JP2010056296A (en) * 2008-08-28 2010-03-11 Tdk Corp System and method for opening/closing lid of sealed vessel
CN102693926A (en) * 2011-03-25 2012-09-26 东京毅力科创株式会社 Lid opening and closing device
JP2012204645A (en) * 2011-03-25 2012-10-22 Tokyo Electron Ltd Lid opening/closing device
US9082807B2 (en) 2011-03-25 2015-07-14 Tokyo Electron Limited Lid opening and closing device
JP2014220515A (en) * 2014-07-14 2014-11-20 東京エレクトロン株式会社 Lid opening/closing device

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