JP2002359491A - Electromagnetic wave shielding adhesive film, and electromagnetic wave shield structural body and display using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electromagnetic wave shielding adhesive film that has electromagnetic shielding property and infrared-ray blocking property, transparency, non-visibility, and superior adhesivity, and an electromagnetic wave shielding structural body and a display using the same. SOLUTION: This electromagnetic wave shielding adhesive film is formed, by emitting an active energy ray to harden a plastic film, having an adhesive agent layer with a conductive metal and drawing a geometric figure made of a conductive metal through microlithography, so that its opening ratio becomes 50% or larger. The electromagnetic wave shielding adhesive film is constituted into a plastic plate and is set as an electromagnetic wave shielding component. Then, the electromagnetic wave shielding adhesive film or electromagnetic wave shielding component is used on the front surface of a display, such as CRTs, PDPs, liquid crystals, ELs.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic wave shielding adhesive film having a shielding property of an electromagnetic wave generated from the front surface of a display such as a CRT, a PDP (plasma), a liquid crystal, an EL and the like, and an electromagnetic wave using the film. It relates to a shield and a display.

[0002]

2. Description of the Related Art In recent years, with the increase in the use of various types of electrical equipment and electronic equipment, electromagnetic noise interference has been increasing steadily. Noise can be broadly divided into conducted noise and radiated noise.
There is a method using a noise filter or the like. On the other hand, as a countermeasure against radiation noise, it is necessary to electromagnetically insulate the space, so make the housing a metal body or a highly conductive body, insert a metal plate between circuit boards, Is wrapped with metal foil. With these methods, an electromagnetic wave shielding effect of a circuit or a power supply block can be expected, but it cannot be applied to an electromagnetic wave shielding generated from the front of a display such as a CRT or PDP because it is opaque.

As a method for achieving both the electromagnetic wave shielding property and the transparency, a method of forming a thin film conductive layer by depositing a metal or metal oxide on a transparent substrate (Japanese Patent Laid-Open No. 27880/1990).
No. 0, JP-A-5-323101). On the other hand, an electromagnetic wave shielding material in which a good conductive fiber is embedded in a transparent substrate (JP-A-5-327274,
JP-A-5-269912) or an electromagnetic wave shielding material in which a conductive resin containing metal powder or the like is directly printed on a transparent substrate (JP-A-62-57297, JP-A-2-5-5).
Further, an electromagnetic wave shielding material in which a transparent resin layer is formed on a transparent substrate such as polycarbonate having a thickness of about 2 mm and a copper mesh pattern is formed thereon by an electroless plating method (see Japanese Patent Application Laid-Open No. 5-2838
No. 89) has been proposed.

[0004]

As a method for achieving both the electromagnetic wave shielding property and the transparency, Japanese Patent Application Laid-Open No. 1-278800 has been disclosed.
In the method of forming a thin film conductive layer by depositing a metal or metal oxide on a transparent substrate disclosed in Japanese Patent Application Laid-Open No. 100 ° to 2,000 °), the surface resistance of the conductive layer becomes too large, so that the shielding effect of 30 dB or more required at 30 MHz to 1 GHz exceeds 20 dB.
The following were insufficient. In an electromagnetic wave shielding material in which a good conductive fiber is embedded in a transparent base material (JP-A-5-327274 and JP-A-5-269912), 30 MHz is used.
Although the shielding effect of the electromagnetic wave of 1 GHz to 1 GHz is sufficiently large as 40 to 50 dB, the fiber diameter required for regularly arranging the conductive fibers so as to prevent the leakage of the electromagnetic wave is too large at 35 μm. It was not suitable for display applications. In addition, Japanese Unexamined Patent Publication
Similarly, in the case of an electromagnetic wave shielding material in which a conductive resin containing a metal powder or the like disclosed in JP-A-2-57297 and JP-A-2-52499 is directly printed on a transparent substrate, the line width is about 100 μm due to the limit of printing accuracy. This was not suitable because visibility was developed. Further, JP-A-5-28
No. 3889 discloses a shield material in which a transparent resin layer is formed on a transparent substrate such as polycarbonate having a thickness of about 2 mm and a copper mesh pattern is formed thereon by an electroless plating method. In order to secure the force, it is necessary to roughen the surface of the transparent substrate. Generally, a highly toxic oxidizing agent such as chromic acid or permanganic acid must be used as the roughening means.
With resins other than BS, it is difficult to achieve satisfactory roughening. Even if electromagnetic wave shielding properties and transparency can be achieved by this method, it is difficult to reduce the thickness of the transparent substrate, and it is not suitable as a method for forming a film. Furthermore, if the transparent substrate is thick, it cannot be brought into close contact with the display, so that leakage of electromagnetic waves therefrom increases. In addition, in terms of manufacturing, there is also a drawback that the shield material cannot be made into a scroll or the like, so that it becomes bulky, and is not suitable for automation, so that the manufacturing cost increases. Regarding the shielding property of the electromagnetic wave generated from the front of the display, in addition to the electromagnetic wave shielding function of 30 dB or more at 30 MHz to 1 GHz, the infrared of 900 to 1,100 nm generated from the front of the display is used for other VTR devices operated by remote control. It has to be shielded because it has an adverse effect. In addition to this, not only good visible light transmittance and high visible light transmittance, but also the adhesiveness that can be stuck to the display surface to prevent leakage of electromagnetic waves, and the presence of shielding material should be checked with the naked eye. Invisibility, a characteristic that cannot be achieved, is also required. As for the adhesiveness, it is necessary to easily adhere to glass or a general-purpose polymer plate at a relatively low temperature and have good adhesiveness over a long period of time. However, no satisfactory adhesive film has been obtained so far that simultaneously satisfies such characteristics as electromagnetic wave shielding, infrared shielding, transparency / invisibility, and adhesiveness. In view of the above, the present invention provides an electromagnetic wave shielding adhesive film having electromagnetic wave shielding properties and infrared ray shielding properties, transparency and invisibility, and good adhesive properties, an electromagnetic wave shielding body using the film, and a display. Make it an issue.

[0005]

According to the first aspect of the present invention, an active energy ray is irradiated to provide an electromagnetic wave shielding adhesive film having electromagnetic wave shielding property, transparency and simple adhesiveness. The conductive metal-coated film having the adhesive layer cured by the above method has a geometrical figure drawn with a conductive metal by a microlithography method and has an aperture ratio of 50% or more.
The invention according to claim 2 of the present invention is directed to the microlithographic method according to claim 1 in order to provide an electromagnetic wave shielding adhesive film that is inexpensive and excellent in mass productivity, and has transparency and simple adhesiveness. A photolithography method is used for a fine circuit processing method. Claim 3 of the present invention
The invention described in the above, in order to provide an electromagnetic wave shielding adhesive film having electromagnetic wave shielding properties and transparency and simple adhesiveness, the active energy rays in the adhesive layer which is cured by irradiating the active energy rays with ultraviolet rays or electrons It is a line. The invention according to claim 4 of the present invention is to provide an electromagnetic wave shielding adhesive film having electromagnetic wave shielding property, transparency and simple adhesiveness,
The adhesive layer cured by irradiation with active energy rays has a cured refractive index of 1.45 to 1.70. The invention according to claim 5 of the present invention provides an electromagnetic wave shielding adhesive film having an electromagnetic wave shielding property, transparency and excellent adhesiveness, so that the thickness of the adhesive layer which is cured by irradiating active energy rays is increased. The thickness is set to be equal to or more than the thickness of the conductive metal. The invention according to claim 6 of the present invention provides an electromagnetic wave shielding adhesive film having electromagnetic wave shielding property, transparency and excellent infrared ray shielding property, in which an adhesive layer which is cured by irradiating active energy rays is provided. Further comprising an infrared absorber. According to the invention of claim 7 of the present invention, in order to provide an electromagnetic wave shielding adhesive film excellent in electromagnetic wave shielding property and invisibility, the line width of a geometric figure drawn with a conductive metal on a plastic film is set to 4 mm.
0 μm or less, the line interval is 100 μm or more, and the line thickness is 40 μm or less. The invention according to claim 8 of the present invention has excellent workability and adhesion, and provides an inexpensive electromagnetic wave shielding adhesive film having electromagnetic wave shielding properties and invisibility. ~ 40
μm of copper, aluminum or nickel is used. The invention according to claim 9 of the present invention utilizes a chemical etching method among photolithographic methods in order to provide an inexpensive electromagnetic wave shielding adhesive film having excellent electromagnetic wave shielding properties and transparency. The invention according to claim 10 of the present invention is to make the plastic film a polyethylene terephthalate film or a polycarbonate film in order to provide an electromagnetic wave shielding adhesive film excellent in transparency, inexpensiveness, good heat resistance and excellent handleability. . The invention according to claim 11 of the present invention is characterized in that the conductive metal is copper and at least the surface thereof is blackened in order to provide an electromagnetic wave shielding adhesive film having low fading and high contrast. It is assumed that. The invention according to claim 12 of the present invention uses a paramagnetic metal as the conductive metal in order to provide an electromagnetic wave shielding adhesive film having excellent magnetic field shielding properties.

According to a thirteenth aspect of the present invention, in order to provide an electromagnetic wave shielding substrate having electromagnetic wave shielding properties and transparency, an electromagnetic wave shielding structure comprising the above-mentioned electromagnetic wave shielding adhesive film and a plastic plate is provided. It is assumed that. The invention according to claim 14 of the present invention provides an electromagnetic wave shielding structure in which the electromagnetic wave shielding adhesive film is attached to at least one surface of a plastic plate to provide an electromagnetic wave shielding substrate having electromagnetic wave shielding properties and transparency. It is assumed that. The invention according to claim 15 of the present invention is to bond the above-mentioned electromagnetic wave shielding adhesive film to one side of a plastic plate in order to provide an electromagnetic wave shielding substrate having the above-mentioned electromagnetic wave shielding property, transparency and infrared ray shielding property. And an electromagnetic wave shielding structure in which an adhesive or an adhesive film having infrared shielding properties is attached to the other surface. The invention according to claim 16 of the present invention uses an electromagnetic wave shielding adhesive film having electromagnetic wave shielding properties and transparency for a display.
According to a seventeenth aspect of the present invention, an electromagnetic wave shielding structure composed of a plastic plate and an electromagnetic wave shielding adhesive film having electromagnetic wave shielding properties and transparency is used for a display.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.
The adhesive layer that is cured by irradiating active energy rays used in the present invention is an adhesive composition that is cured by irradiating active energy rays such as ultraviolet rays or electron beams, and is preferably made of a conductive metal. Drawn geometric shapes,
It is preferable that an electromagnetic wave shielding adhesive film having an adhesive layer and a plastic film as a basic component is adhered to a display or a plastic plate as an adherend, and then cured by irradiation with active energy rays. It is also possible to irradiate the active energy ray before bonding to the adherend to advance the degree of curing in advance. In this case, the melt viscosity of the adhesive layer after advancing the degree of curing is preferably 10,000 poise or less as a value measured by a rotational viscometer at 200 ° C. This is to ensure the fluidity of the adhesive layer in order to enable processing such as bonding by pasting even after the degree of curing of the adhesive layer is advanced. Even if the curing is completed, the adhesive layer may be any as long as it can exhibit fluidity and adhesiveness.

[0008] As the material of the adhesive layer used in the present invention, which is cured by an active energy ray such as ultraviolet ray, electron beam, etc., acrylic resin, epoxy resin, polyester resin,
A material in which a urethane resin or the like is used as a base polymer and a radically polymerizable or cationically polymerizable functional group is imparted to each of them can be exemplified. As the radical polymerizable functional group, there is a carbon-carbon double bond such as an acryl group (acryloyl group), a methacryl group (methacryloyl group), a vinyl group, an allyl group, and an acrylic group (acryloyl group) having good reactivity is preferable. Used for As the cationic polymerizable functional group, an epoxy group (glycidyl ether group, glycidylamine group) is typical, and a highly reactive alicyclic epoxy group is suitably used. Specific materials include acrylic urethane, epoxy (meth) acrylate, epoxy-modified polybutadiene, epoxy-modified polyester, polybutadiene (meth) acrylate, and acrylic-modified polyester.

When the active energy ray is ultraviolet light, the photosensitizer or photoinitiator added at the time of ultraviolet curing includes benzophenone, anthraquinone, benzoin, sulfonium salts, diazonium salts, onium salts, halonium salts and the like. Known materials can be used. A general-purpose thermoplastic resin may be blended in addition to the above materials. General-purpose thermoplastic resins include, for example, natural rubber (refractive index n = 1.52), polyisoprene (n = 1.521), poly-1,2-butadiene (n = 1.50), polyisobutene (n = 1.5
05 to 1.51), polybutene (n = 1.513), poly-2-heptyl-1,3-butadiene (n = 1.50), poly-2-t-butyl-1,3-butadiene (n = 1.506), poly- (Di) enes such as 1,3-butadiene (n = 1.515), polyoxyethylene (n = 1.456), polyoxypropylene (n = 1.450), polyvinyl ethyl ether (n = 1.454), polyvinylhexyl ether (n = 1.459), polyvinyl butyl ether (n = 1.45
6), such as polyethers, polyvinyl acetate (n = 1.4
67), polyesters such as polyvinyl propionate (n = 1.467), polyurethane (n = 1.5 to 1.6), ethyl cellulose (n = 1.479), polyvinyl chloride (n = 1.54 to 1.55), polyacrylonitrile (n = 1.52) ), Polymethacrylonitrile (n =
1.52), polysulfone (n = 1.633), polysulfide (n = 1.63)
6), phenoxy resin (n = 1.5 to 1.6), polyethyl acrylate (n = 1.469), polybutyl acrylate (n = 1.466), poly-2-ethylhexyl acrylate (n = 1.463), poly-t-butyl acrylate ( n = 1.464), poly-3-ethoxypropyl acrylate (n = 1.465), polyoxycarbonyltetramethacrylate (n = 1.465), polymethyl acrylate (n = 1.472 to 1.480), polyisopropyl methacrylate (n = 1.473), poly Dodecyl methacrylate (n = 1.
474), polytetradecyl methacrylate (n = 1.475), poly-n-propyl methacrylate (n = 1.484), poly-
3,3,5-trimethylcyclohexyl methacrylate
(n = 1.484), polyethyl methacrylate (n = 1.485), poly-2-nitro-2-methylpropyl methacrylate (n =
1.487), poly-1,1-diethylpropyl methacrylate (n = 1.489), poly (meth) acrylate such as polymethyl methacrylate (n = 1.489) can be used.
If necessary, two or more of these acrylic polymers may be copolymerized, or two or more of them may be used as a blend.

Further, epoxy acrylate (n = 1.48 to 1.6) may be used as a copolymer resin of acrylic resin and non-acrylic resin.
0), urethane acrylate (n = 1.5 to 1.6), polyether acrylate (n = 1.48 to 1.49), polyester acrylate (n = 1.48 to 1.54) and the like can also be used. In particular, urethane acrylate, epoxy acrylate, and polyether acrylate are excellent in terms of adhesiveness. Examples of epoxy acrylate include 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, allyl alcohol diglycidyl ether,
(Meta) such as resorcinol diglycidyl ether, diglycidyl adipic ester, diglycidyl phthalate, polyethylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, glycerin triglycidyl ether, pentaerythritol tetraglycidyl ether, sorbitol tetraglycidyl ether, etc. Acrylic acid adducts are mentioned. A polymer having a hydroxyl group in the molecule, such as epoxy acrylate, is effective for improving the adhesiveness. These copolymer resins can be used in combination of two or more as necessary. The softening temperature of the polymer serving as the adhesive is preferably 200 ° C. or less, more preferably 150 ° C. or less, from the viewpoint of handleability. Since the environment in which the electromagnetic wave shielding adhesive film is used is usually 80 ° C. or less, the softening temperature of the adhesive layer is most preferably 80 to 120 ° C. from the viewpoint of workability. On the other hand, it is preferable to use a polymer having a weight average molecular weight of 500 or more. When the molecular weight is 500 or less, the cohesive force of the adhesive composition is too low, and there is a possibility that the adhesiveness to the adherend is reduced. The adhesive resin composition used in the present invention, if necessary, a diluent, a plasticizer, an antioxidant,
Additives such as fillers, colorants, ultraviolet absorbers and tackifiers may be added.

It is preferable to use an adhesive layer which is cured by irradiation with an active energy ray for use in the present invention and has a refractive index in the range of 1.45 to 1.70 after curing. This is the refractive index between the plastic film used in the present invention and the cured adhesive layer, or the adhesive used to bond the conductive metal to the plastic film with conductive metal and the cured adhesive used in the present invention. When the refractive index of the agent layer is different, the visible light transmittance is reduced. When the refractive index is 1.45 to 1.70, the decrease in the visible light transmittance is small and good, and the refractive index of the above-described polymer is the same. In range.

As the conductive metal of the present invention, a metal such as copper, aluminum, nickel, iron, gold, silver, stainless steel, tungsten, chromium, titanium, or an alloy combining two or more of these metals is used. Can be. Copper, aluminum or nickel is suitable from the viewpoint of conductivity, circuit processing easiness, and price.
A metal formed under vacuum such as a 40 μm metal foil, a plating metal, or a vapor deposition is used. When the thickness exceeds 40 μm,
It is difficult to form a fine line width, and the viewing angle becomes narrow. If the thickness is less than 0.5 μm, the surface resistance tends to be large, and the electromagnetic wave shielding effect tends to be poor.

It is preferable that the conductive metal is copper and at least the surface thereof has been subjected to a blackening treatment because the contrast is high. Further, it is possible to prevent the conductive metal from being oxidized with time and discolored. The blackening process may be performed before and after the formation of the geometrical figure. However, after the formation, the blackening process can be performed by using a method used in the field of printed wiring boards. For example, sodium chlorite (31 g / l), sodium hydroxide (15 g / l), trisodium phosphate (12 g / l)
g / l) in an aqueous solution at 95 ° C for 2 minutes. In addition, it is preferable that the conductive metal is a paramagnetic metal because of excellent magnetic field shielding properties. The simplest method of bringing the conductive metal into close contact with the plastic film is to attach the conductive metal through an adhesive which is cured by irradiating the active energy ray containing acrylic or epoxy resin as a main component. . When it is necessary to reduce the thickness of the conductive layer of the conductive metal, one or more of thin film forming techniques such as a vacuum deposition method, a sputtering method, an ion plate method, a chemical vapor deposition method, and an electroless / electroplating method are used. This can be achieved by a combination of methods. The thickness of the conductive metal is preferably 40 μm or less, and the thinner the thickness, the wider the viewing angle of the display is, which is preferable as an electromagnetic wave shielding material.

Examples of the plastic film used in the present invention include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate; polyolefins such as polyethylene, polypropylene, polystyrene and EVA; and vinyl based materials such as polyvinyl chloride and polyvinylidene chloride. It is preferable to use a film made of a plastic such as resin, polysulfone, polyethersulfone, polycarbonate, polyamide, polyimide, or acrylic resin and having a total visible light transmittance of 70% or more and a thickness of 1 mm or less. These can be used as a single layer, or may be used as a multilayer film combining two or more layers. Among the plastic films, a polyethylene terephthalate film or a polycarbonate film is preferable in terms of transparency, heat resistance, ease of handling, and price. The thickness of the plastic film is preferably from 5 to 500 μm. If it is less than 5 μm, the handleability becomes poor, and 500 μm
If it exceeds, the transmittance of visible light decreases. 10-20
More preferably, it is 0 μm.

The geometric figures drawn with the conductive metal of the present invention include triangles such as equilateral triangles, isosceles triangles, right triangles, etc., squares, rectangles, rhombuses, parallelograms, trapezoids, etc., and (positive) hexagons. It is a pattern combining (positive) n-gons (n is a positive integer) such as square, (positive) octagon, (positive) dodecagon, (positive) octagon, etc., circle, ellipse, star, etc. ,
These units can be used alone or in combination of two or more. From the viewpoint of electromagnetic wave shielding, a triangle is most effective, but from the viewpoint of visible light transmission, if the number of (positive) n-gons is larger, the numerical aperture increases as the number of n increases. From the viewpoint, the aperture ratio is required to be 50% or more. The aperture ratio is more preferably 60% or more. The aperture ratio is a percentage of the ratio of the area obtained by subtracting the area of the conductive metal of the geometric figure drawn with the conductive metal from the effective area to the effective area of the electromagnetic wave shielding adhesive film. When the area of the display screen is defined as the effective area of the electromagnetic wave shielding adhesive film, the display screen is a visible ratio.

As a method of forming such a geometric figure, it is effective to produce the plastic film with a conductive metal by a microlithography method in terms of circuit processing accuracy and circuit processing efficiency. The microlithography includes a photolithography, an X-ray lithography, an electron beam lithography, an ion beam lithography, and the like, and also includes a screen printing method and the like. Among these, the photolithographic method is the most efficient in terms of its simplicity and mass productivity. Above all, a photolithography method using a chemical etching method is most preferable in terms of its simplicity, economy, circuit processing accuracy, and the like. Among the photolithographic methods, in addition to the chemical etching method, it is also possible to form a geometric figure by a method using electroless plating or electroplating, or a combination of electroless plating or electroplating and chemical etching.

The line width of such a geometric figure is 40 μm.
m or less, line spacing is 100 μm or more, line thickness is 4
It is preferable that the thickness be in the range of 0 μm or less. Further, from the viewpoint of invisibility of the geometric figure, the line width is more preferably 25 μm or less, and the line interval is more preferably 120 μm or more and the line thickness is 18 μm or less from the viewpoint of visible light transmittance. Line width is 40μ
m or less, preferably 25 μm or less, and if it is too small and thin, the surface resistance becomes too large and the shielding effect is inferior. Line thickness is 4
0 μm or less is preferable. If the thickness is too small, the surface resistance becomes too large and the shielding effect is inferior.
The thickness is preferably at least 1 μm. The aperture ratio increases as the line interval increases, and the visible light transmittance increases. When used on the front surface of the display as described above, the aperture ratio needs to be 50% or more, but is more preferably 60% or more. If the line spacing is too large, the electromagnetic wave shielding property is reduced, so that the line width is 1000 μm.
m (1 mm) or less. When the line interval is complicated by a combination of geometric figures and the like, the area is converted into a square area on the basis of a repeating unit, and the length of one side is set as the line interval.

As the infrared absorber used in the present invention, metal oxides such as iron oxide, cerium oxide, tin oxide and antimony oxide, or indium-tin oxide (hereinafter referred to as IT)
O), tungsten hexachloride, tin chloride, cupric sulfide, chromium-cobalt complex, thiol-nickel complex or aminium compound, diimonium compound (trade name of Nippon Kayaku Co., Ltd.) or anthraquinone (SIR-11)
4), metal complex systems (SIR-128, SIR-130,
SIR-132, SIR-159, SIR-152, S
IR-162), phthalocyanine (SIR-103)
(Above, trade names of Mitsui Toatsu Chemical Co., Ltd.), and the like, and it is preferable to include these in the adhesive layer. In addition, the composition dispersed in a binder resin may be applied to the surface of an adhesive layer that is cured by irradiating active energy rays formed on a plastic film as an adhesive, or may be directly applied to the plastic surface. An adhesive layer which is cured by irradiating an active energy ray thereon may be formed thereon, or may be applied to the back surface of the film opposite to the surface of the adhesive layer formed on the plastic film. Further, a plastic film in which an infrared absorbing agent is previously contained in the plastic film can also be used. Among these infrared absorbing compounds, those having the effect of absorbing infrared rays most effectively are cupric sulfide, ITO, aminium compound,
It is an infrared absorber such as a diimmonium compound or a metal complex. In the case of infrared absorbers other than organic infrared absorbers,
Care must be taken in the primary particle size of these compounds. If the particle size is too large than the wavelength of infrared rays, the shielding efficiency is improved, but irregular reflection occurs on the particle surface and haze is increased, so that transparency is reduced. On the other hand, if the particle size is too short compared to the wavelength of infrared rays, the shielding effect will be reduced. The preferred particle size is 0.01 to 5 μm, more preferably 0.1 to 3 μm.

The infrared absorbing agent which is an infrared absorbing material is, for example, bisphenol A as a binder resin.
Resins such as epoxy resin, bisphenol F epoxy resin, and novolak epoxy resin, diene resins such as polyisoprene, poly-1,2-butadiene, polyisobutene, and polybutene, ethyl acrylate, butyl acrylate, and 2-ethylhexyl acrylate , T-butyl acrylate and other polyacrylic acid ester copolymers, polyvinyl acetate, polyvinyl propionate and other polyester resins, and polyethylene, polypropylene, polystyrene, and polyolefin resins such as EVA. Is done. The optimal amount of the compound is 10
The amount of the infrared absorbent is 0.01 to 10 parts by weight, preferably 0.1 to 5 parts by weight, based on 0 parts by weight. 0.0
If it is less than 1 part by weight, the infrared ray shielding effect is small, and if it exceeds 10 parts by weight, transparency is impaired.

The adhesive layer containing the above-mentioned infrared absorber in the adhesive layer is preferably formed on one surface of a plastic film, and the surface of the adhesive layer is preferably coated with a conductive metal. Further, as described above, an adhesive layer containing an infrared absorbent is formed on a plastic film surface and cured by irradiating an active energy ray thereon (with or without an infrared absorbent. May be formed) or a plastic film surface may be irradiated with active energy rays to form an adhesive layer that is cured, and a composition containing an infrared absorber may be formed thereon. . Further, it may be formed on the surface of the electromagnetic wave shielding adhesive film opposite to the conductive metal. Further, it may be formed on any layer of the electromagnetic wave shielding structure composed of the electromagnetic wave shielding adhesive film and the plastic plate. For example, one electromagnetic wave shielding adhesive film and one
If the electromagnetic wave shielding structure composed of two plastic plates, the surface A of the electromagnetic wave shielding adhesive film, the surface B between the electromagnetic wave shielding adhesive film and the plastic plate,
It may be formed on any of the surfaces C of the plastic plate.
In this case, the composition containing the infrared absorbent may be formed directly on at least one of the above-mentioned A, B and C surfaces. At least one layer containing the infrared absorbent is required, and the other layers may not contain the infrared absorbent. It is preferable that the layer containing the infrared absorbing agent has adhesiveness, because workability and workability are easy. Specifically, it is applied to the adhesive layer surface or the back surface of the electromagnetic wave shielding adhesive film in a thickness of 0.1 to 10 μm. The applied composition containing the infrared absorbing compound may be cured using heat or ultraviolet light. On the other hand, the infrared absorbing agent can be used by directly mixing with the adhesive composition of the adhesive layer which is cured by irradiation with the above-mentioned active energy ray. In this case, the addition amount is optimally 0.01 to 5 parts by weight from the viewpoint of effect and transparency with respect to 100 parts by weight of the polymer which is a main component of the adhesive.

The plastic plate used in the present invention is a plate made of plastic, specifically, a polystyrene resin (n = 1.59), an acrylic resin (n = 1.49), a polymethyl methacrylate resin (n = 1.49), Polycarbonate resin (n = 1.5
8), polyvinyl chloride resin (n = 1.54), polyvinylidene chloride resin (n = 1.6 to 1.63), polyethylene resin (n = 1.51), polypropylene resin (n = 1.50), polyamide resin (n = 1.52), polyamide Imide resin (n = 1.5), polyetherimide resin
(n = 1.5), polyetherketone resin (n = 1.45), polyarylate resin (n = 1.5-1.6), polyacetal resin (n = 1.5-
1.6), polybutylene terephthalate resin (n = 1.57), thermoplastic polyester resin such as polyethylene terephthalate resin (n = 1.58), cellulose acetate resin (n = 1.49), fluororesin (n = 1.4 to 1.5), polysulfone resin ( n = 1.63), polyether sulfone resin (n = 1.45-1.6), polymethylpentene resin (n = 1.45-1.6), polyurethane resin (n = 1.45-1.
6), and thermoplastic resins and thermosetting resins such as diallyl phthalate resin (n = 1.45 to 1.6). Among these, a polystyrene resin, an acrylic resin, a polymethyl methacrylate resin, a polycarbonate resin, a polyvinyl chloride resin, a polyethylene terephthalate resin, and a polymethyl pentene resin having excellent transparency are preferably used. The thickness of the plastic plate used in the present invention is preferably 0.5 mm to 5 mm from the viewpoint of protection of the display, strength and handling.

The electromagnetic wave shielding structure of the present invention comprises an electromagnetic wave shielding adhesive film and a plastic plate, and there are many combinations thereof. FIG. 1 is a perspective view (a) and a sectional view (b) of an electromagnetic wave shielding adhesive film of the present invention. The adhesive layer 1 flows by heating or pressurization, and a geometrical figure 2 drawn by a conductive metal. The electromagnetic wave shielding adhesive film 4 is composed of the plastic film 3. This electromagnetic wave shielding adhesive film 4 may be formed directly on the screen 5 of the display as shown in FIG.
As shown in (b), one side of the plastic plate 6 is formed, and either side is provided on the display screen via an adhesive or a mounting jig. FIG. 2C shows an example of the electromagnetic wave shielding structure 8 in which the adhesive composition 7 containing the above-mentioned infrared absorbent is formed on one surface of the plastic plate 6 and the electromagnetic wave shielding adhesive film 4 on the other surface. It is. FIG. 2 (d) shows an adhesive composition 7 containing an infrared absorbing agent formed on one side of the plastic film 3, the adhesive side is adhered to the plastic plate 6, and the electromagnetic wave shielding adhesive film 4 is adhered to the other side. It is an example of the formed electromagnetic wave shielding structure 8. FIG. 2 (e) is composed of an electromagnetic wave shielding adhesive film 4 and a plastic plate 6, an adhesive layer 9 is formed on the upper surface of the electromagnetic wave shielding adhesive film 4, and this adhesive layer 9 is attached to the display screen 5. It is an electromagnetic wave shielding structure 8. FIG. 2 (f) is a geometric drawing in which the adhesive layer 9 is formed on the plastic film surface side of the electromagnetic wave shielding adhesive film 4, the plastic plate 6 is provided on the surface, and the conductive metal of the electromagnetic wave shielding adhesive film 4 is drawn. An electromagnetic wave shielding structure 8 in which a plastic plate 6 is formed on a surface on which a geometrical figure is formed. On either side of the electromagnetic wave shielding adhesive film or the electromagnetic wave shielding structure, a layer having an infrared shielding property, a layer having an antireflection treatment, a layer having an antiglare treatment, and a layer having a high surface hardness and abrasion resistance are provided. Can be formed. These are examples and can be used in other forms. An electromagnetic wave shielding adhesive film may be adhered to one surface of the glass plate, and this glass plate may be attached to the front surface of the display so that the glass surface is outside the display device.

The electromagnetic wave shielding adhesive film of the present invention is basically composed of an adhesive layer which is cured by irradiating an active energy ray, a conductive metal having a geometric pattern, and a plastic film. It is preferable to use a metal foil for the conductive metal.In this case, the surface of the metal foil is often roughened in order to improve the adhesiveness.When a geometrical figure is formed, the removed metal portion is added to the adhesive layer. The roughened shape is transferred to the portion of the adhesive layer that is in contact with the metal by transferring the roughened shape, and the visible light is scattered there, so that the light transmittance is reduced and the transparency is impaired. In addition, even in plastic films, a small amount of filler is added to improve the film forming processability, imparting irregularities to the film surface, improving the slip between the films when winding the film, and improving the winding property, The surface may be subjected to a roughening treatment such as matting to improve the adhesiveness with the adhesive. As described above, the portion of the adhesive layer from which the conductive metal has been removed or the plastic film itself has irregularities intentionally for the purpose of improving adhesion, or the back shape of the conductive metal is transferred. Although the light is scattered on the surface and transparency is impaired, the adhesive layer which is cured by irradiating with the active energy ray of the present invention basically has no cross-linked / cured structure and thus has a fluidity. Filling the uneven surface of the plastic film, the resin with a refractive index close to that of the plastic film is smoothly applied on the uneven surface to minimize irregular reflection and transfer of the roughened conductive metal It is considered that the layer is dissolved by flowing, and flows along the surface shape of the adherend, so that transparency is developed. And since it is made to crosslink and harden after flowing by an active energy ray, it becomes an adhesive layer excellent in heat resistance. Further, a geometric figure formed of a conductive material on a plastic film is not visually recognized due to a very small line width. In addition, it is considered that the line spacing is sufficiently large so that apparent transparency is exhibited.
On the other hand, compared to the wavelength of the electromagnetic wave to be shielded, the line spacing of the geometrical figure is sufficiently small, and it is considered that excellent shielding properties are exhibited.

[0024]

EXAMPLES Next, the present invention will be described specifically with reference to Examples, but the present invention is not limited thereto. (Example 1) <Example of preparing electromagnetic wave shielding adhesive film 1 and electromagnetic wave shielding structure 1> 50 μm thick plastic film
Polyethylene terephthalate (PET) film (manufactured by Toyobo Co., Ltd., trade name A-4100, refractive index n =
1.575), an adhesive layer 1 containing the following infrared absorbing agent was applied to one surface thereof at room temperature using an applicator to a predetermined dry coating thickness, and dried by heating at 90 ° C. for 20 minutes. . An electrolytic copper foil having a thickness of 12 μm, which is a conductive metal, is laminated through the adhesive layer 1 under the conditions of 180 ° C. and 30 kgf / cm ^{2 with} the roughened surface facing the adhesive layer. Thus, a PET film with a copper foil as a plastic film with a conductive metal was obtained. Photolithographic process using a chemical etching method (resist film sticking-exposure-
Through development-chemical etching-resist film peeling), a copper grid pattern having a line width of 25 μm and a line interval of 250 μm was formed on the PET film to obtain an electromagnetic wave shielding adhesive film 1. The visible light transmittance of the adhesive film 1 was 20% or less. Using a heat press, this electromagnetic wave shielding adhesive film 1 is brought into contact with a commercially available acrylic plate (como glass; trade name, manufactured by Kuraray Co., Ltd., thickness: 3 mm, n = 1.49) so that the surface on which the adhesive layer is formed is in contact. 110 ° C, 20Kg / cm
^{2. The} adhesive layer was cured by heating and pressing under the conditions of ² and 15 minutes, and the ultraviolet ray of 3 J / cm ² was used to cure the adhesive layer from the PET film side by an ultraviolet irradiation device to obtain an electromagnetic wave shielding component 1. Adhesive layer 1
And the thickness of the adhesive layer 1 after drying is 20 μm.
m, the electromagnetic wave shielding adhesive film 1 and the electromagnetic wave shielding structure 1 obtained from the plastic plate were used as Example 1.

<Composition of Adhesive Layer 1> 100 parts by weight of Byron BK-4103 (trade name, manufactured by Toyobo Co., Ltd .; acrylic-modified polyester resin, Mn = 40,000) SIR-159 (infrared absorbent 1: Mitsui Higashi) 0.5 parts by weight Benzophenone (manufactured by Wako Pure Chemical Industries, Ltd.) 5 parts by weight Toluene 450 parts by weight 10 parts by weight ethyl acetate 10 parts by weight Refractive index of the composition of the above adhesive layer 1 after solvent drying. Is 1.
The melt viscosity at 52.degree. C. was 1500 poise.

(Example 2) <Electromagnetic wave shielding adhesive film 2 and electromagnetic wave shielding structure
Example of preparing body 2> One side of PET film 25 μm thick
Apply the adhesive layer 2 containing the infrared absorbent described above at room temperature.
The coating was performed using a heater and dried by heating at 90 ° C. for 20 minutes.
Heat the aluminum foil of 25 μm thickness through the adhesive layer 2
Laminate (130 ° C, 20Kg / cm²) Then aluminum
A PET film with a foil was obtained. This PET with aluminum foil
The electromagnetic wave shielding adhesive film 1 of Example 1 was applied to the film.
And the same photolithography as in the production example of the electromagnetic wave shielding structure 1
Line width 15μm, line interval 125μ
m aluminum grid pattern formed on PET film
Was. Visible light transmission of this electromagnetic wave shielding adhesive film 2
The rate was less than 20%. This electromagnetic wave shielding adhesive
Film 2 is a commercially available acrylic plate (Como Glass;
(Lare product name, thickness 3mm) has an adhesive layer
120 ° C, 30Kgf / cm so that the surfaces contact ², 3
Using a hot press machine under the condition of 0 min.
3J / cm from PET film side²Ultraviolet
Irradiate the adhesive layer to cure the electromagnetic wave shielding structure 2
Obtained. Adhesive layer after drying using the composition of adhesive layer 2
2 is 40 μm in thickness.
Electrode obtained from the adhesive film 2 and the plastic plate
The wave shielding structure 2 was Example 2.

<Composition of Adhesive Layer 2> 100 parts by weight of Byron EP-2940 (trade name, manufactured by Toyobo Co., Ltd .; epoxy-modified polyester resin, Mn = 40,000) UFP-HX (infrared absorbent 2: Sumitomo Metal) Mine Co., Ltd .; ITO, average particle size 0.1 μm) 0.4 parts by weight Thylacure UVI-6970 (trade name of Union Carbide Japan Co., Ltd., aromatic sulfonium salt compound) 5 parts by weight MEK 330 parts by weight Cyclohexanone 15 parts by weight Part The refractive index of the above-mentioned adhesive layer 2 composition after drying the solvent is 1.5.
4. The melt viscosity at 200 ° C. was 1200 poise.

Example 3 <Example of Producing Electromagnetic Shielding Adhesive Film 3 and Electromagnetic Shielding Construct 3> The following adhesive layer 3 was applied on one side of a 50 μm thick PET film at room temperature using an applicator.
It was dried by heating at 90 ° C. for 20 minutes. A line width of 10 μm and a line interval of 100 μm were formed on the adhesive layer by forming an electroless nickel plating in a lattice pattern using a mask layer.
An electromagnetic shielding adhesive film 3 having a nickel lattice pattern having a thickness of 1 μm and a thickness of 1 μm was formed on a PET film. The visible light transmittance of the adhesive film 3 was 20% or less. A commercially available acrylic plate (como glass; trade name, manufactured by Kuraray Co., Ltd .;
m), and heat-pressed at 110 ° C. and 20 kgf / cm ² so that the surface on which the adhesive layer is formed is in contact with the surface, and 3 J / cm ² from the PET film side by an ultraviolet irradiation device.
The ultraviolet ray was applied to cure the adhesive layer to obtain an electromagnetic wave shielding structure 3. Example 3 An electromagnetic wave shielding adhesive film 3 produced using the composition of the adhesive layer 3 and having a thickness of the adhesive layer 3 after drying of 5 μm and an electromagnetic wave shielding structure 3 obtained from a plastic plate were used in Example 3. And

<Composition of Adhesive Layer 3> Polybeck R-45ACR-LC (trade name, manufactured by Idemitsu Petrochemical Co., Ltd .; acrylol-modified polybutadiene resin) 100 parts by weight IRG-002 (infrared absorbent 3: Nippon Kayaku Co. 1.2 parts by weight Benzophenone (manufactured by Wako Pure Chemical Industries, Ltd.) 5 parts by weight MEK 285 parts by weight Cyclohexanone 5 parts by weight Solvent for the composition of the above adhesive layer 3 after solvent drying The refractive index is 1.
The melt viscosity at 50 and 200 ° C. was 70 poise.

Example 4 <Example of Producing Electromagnetic Wave Shielding Adhesive Film 4 and Electromagnetic Wave Shielding Structure 4> In the example of producing the electromagnetic wave shielding adhesive film 1 and the electromagnetic wave shielding structure 1 of Example 1, the adhesive layer 1 was used.
The following adhesive layer 4 was prepared by removing benzophenone from the composition of
Using an electron beam irradiator instead of an ultraviolet irradiator, the adhesive layer 4 was cured by irradiating 5 Mrad from the PET film side to obtain an electromagnetic wave shielding member 4. The composition of the adhesive layer 4 is used, and the thickness of the adhesive layer 4 after drying is 2
Example 4 used an electromagnetic wave shielding adhesive film 4 produced in the same manner as the electromagnetic wave shielding adhesive film 1 and the electromagnetic wave shielding structure 1 and an electromagnetic wave shielding structure 4 obtained from a plastic plate.

<Composition of Adhesive Layer 4> 100 parts by weight of Byron BK-4103 (trade name, manufactured by Toyobo Co., Ltd .; acrylic-modified polyester resin, Mn = 40,000) SIR-159 (infrared absorbent 1: Mitsui Higashi) 0.5 parts by weight Toluene 450 parts by weight Ethyl acetate 10 parts by weight The refractive index of the composition of the adhesive layer 4 after solvent drying is 1.
The melt viscosity at 52.degree. C. was 1500 poise.

Example 5 The following composition for the adhesive layer 5 was used so that the thickness of the adhesive layer after drying was 20 μm, and the other components were the electromagnetic wave shielding adhesive film 1 of Example 1 and the electromagnetic wave. Example 5 An electromagnetic wave shielding structure 5 obtained from a plastic plate and an electromagnetic wave shielding adhesive film 5 produced in the same manner as the shielding structure 1 was used as Example 5.

<Composition of Adhesive Layer 5> BAC45 (trade name, manufactured by Idemitsu Petrochemical Co., Ltd .; direct acryloyl-modified polybutadiene resin) 100 parts by weight IRG-002 (infrared absorbent 3: trade name, manufactured by Nippon Kayaku Co., Ltd.) An aminium compound) 1.2 parts by weight MEK 285 parts by weight Cyclohexanone 5 parts by weight The refractive index of the composition of the adhesive layer 5 after drying with a solvent is 1.5.
1. The melt viscosity at 200 ° C. was 60 poise.

Example 6 A plastic film was made of PE
T (50 μm) film to polycarbonate (50 μm)
m, n = 1.58) When the thickness of the adhesive layer is
An electromagnetic wave shielding component 6 obtained in the same manner as in Example 2 except that the thickness was changed from μm to 30 μm was used as Example 6.

(Embodiment 7) The line width is changed from 10 μm to 30
Example 7 was an electromagnetic wave shielding structure obtained in the same manner as in Example 3 except that the line spacing was changed from 100 μm to 500 μm, and the thickness of the adhesive layer was changed from 5 μm to 10 μm.

(Example 8) An electromagnetic wave shielding structure 8 obtained in the same manner as in Example 1 except that the copper grid pattern formed on the PET film through the photolithography process was subjected to a blackening treatment was used. And

(Comparative Example 1) The composition of the adhesive layer 1 was used as a comparative example 1 and an electromagnetic wave shielding structure produced therefrom was used. No irradiation with active energy rays was carried out.
Same as.

Comparative Example 2 A phenol-formaldehyde resin (Mw = 50,000) was used in place of Polybeck R-45ACR-LC of the composition of the adhesive layer 3 used in Example 3.
Was used as the composition of the adhesive layer 7. An electromagnetic wave shielding component obtained in the same manner as in Example 3 except that irradiation with active energy rays was not performed was used as Comparative Example 2. The refractive index of the composition of the adhesive layer 7 after the solvent was dried was 1.73, 200.
The melt viscosity at 300C was 300 poise.

Comparative Example 3 An electromagnetic wave shielding structure was produced in the same manner as in Example 1 except that the thickness of the adhesive layer was changed from 20 μm to 5 μm, and irradiation with active energy rays was not performed. .

Comparative Example 4 An electromagnetic wave shielding structure was produced in the same manner as in Example 1 except that the line interval was changed from 250 μm to 50 μm, and irradiation with active energy rays was not performed.

(Comparative Example 5) The line width was changed from 25 μm to 50
The line spacing was set to 250 μm to 150 μm, and irradiation with active energy rays was not performed.

(Comparative Example 6) An electromagnetic wave shielding structure was prepared in the same manner as in Example 2 except that the infrared absorbing agent was removed from the composition of the adhesive layer 2 and irradiation with active energy rays was not performed. 6.

Comparative Example 7 0.1 μm as Conductive Material
(1,000Å) Using ITO vapor-deposited PET deposited on the entire surface, apply a composition excluding the infrared absorbent from the composition of the adhesive layer 1 directly without forming a pattern, and irradiate with active energy rays. Other than that, an electromagnetic wave shielding component obtained in the same manner as in Example 1 was used as Comparative Example 7.

Comparative Example 8 A composition for the adhesive layer 8 was prepared by using polydimethylsiloxane (Mw = 45,000, n = 1.43) as an adhesive. The electromagnetic wave shielding component obtained in the same manner as in Example 3 except that the active energy ray was not irradiated was used as Comparative Example 8.

The aperture ratio, electromagnetic wave shielding property, visible light transmittance, non-visibility, infrared ray shielding rate, and heating of the geometric figure drawn with the conductive metal material of the electromagnetic wave shielding adhesive film obtained as described above. The adhesive properties before and after the treatment were measured. The results are shown in Tables 1 and 2.

The refractive index of the composition in the adhesive layer was measured with a refractometer (Abago Refractometer, manufactured by Atago Optical Machine Works). The aperture ratio of a geometric figure drawn with a conductive metal was measured based on a micrograph. The electromagnetic wave shielding property is measured by using a coaxial waveguide converter (TWC-S-
024), the sample was inserted between the flanges, and a frequency of 30 MHz to 1 GHz was used using a spectrum analyzer (8510B vector network analyzer manufactured by YHP).
Was measured. The visible light transmittance was measured using a double beam spectrophotometer (manufactured by Hitachi, Ltd., Model 200-10), and the average value of the transmittance at 400 to 700 nm was used.
The non-visibility is evaluated by observing the electromagnetic wave shielding structure in which the electromagnetic wave shielding adhesive film is attached to the acrylic plate from a place 0.5 m away, and by recognizing the geometric figure formed of the conductive metal. Those that could not be recognized were evaluated as good, and those that could be recognized were evaluated as NG. The average value of the infrared absorptance in the region of 900 to 1,100 nm was used as the infrared shielding factor using a spectrophotometer (U-3410, manufactured by Hitachi, Ltd.). Adhesive strength is measured by a tensile tester (Tensilon UTM-4-100 manufactured by Toyo Baldwin Co., Ltd.)
Using, width 10mm, 90 ° direction, peeling speed 50mm
/ Min.

[0047]

[Table 1]

[0048]

[Table 2]

Comparative Example 1 was inferior in adhesive strength at a high temperature of 80 ° C. because the adhesive layer was not crosslinked. In Comparative Example 2, the refractive index of the adhesive layer 7 was as high as 1.73, the scattering at the interface between the adhesive layer and the plastic plate was large, and the visible light transmittance was inferior. In Comparative Example 3, since the thickness of the adhesive layer 1 was 5 μm less than the thickness of the conductive metal copper foil of 12 μm, the adhesive layer 1 flowed and had good adhesion to the plastic plate. And the visible light transmittance was inferior.
In Comparative Example 4, the line spacing was 50 μm, the electromagnetic wave shielding property was good, and the line width was 25 μm, which was excellent in non-visibility, but the line spacing was narrow and the aperture ratio was 50% or less.
Since it was 5%, the visible light transmittance was inferior. In Comparative Example 5, the line width was 50 μm, and the invisibility was poor. In Comparative Example 6, an adhesive layer containing no infrared absorbing agent was used, and the infrared shielding property was poor. Comparative Example 7 is PET
Although ITO (indium-tin oxide) was vapor-deposited on the film, it was inferior in electromagnetic wave shielding. Comparative Example 8
Uses an adhesive layer 8 having a refractive index of 1.43 for the adhesive layer. However, similar to Comparative Example 3, scattering at the interface between the adhesive layer and the plastic plate is large, and visible light transmittance is increased. inferior. The comparative example has a geometrical figure drawn by a conductive metal as shown in the examples of the present invention, has an aperture ratio of 50% or more, and irradiates the adhesive layer with active energy rays. The adhesive layer has a refractive index of 1.
An adhesive layer which is in the range of 45 to 1.70, the thickness of the adhesive layer is equal to or more than the thickness of the conductive metal, and the infrared ray absorbing agent is contained is preferable. In addition, a conductive metal having a line width drawn with a conductive metal of 40 μm or less, a line interval of 100 μm or more, and a line thickness of 40 μm or less showed preferable values. Although not shown in the table, since the adhesive layer has good fluidity, the production of the electromagnetic wave shielding structure from the electromagnetic wave shielding film and the plastic plate reduces the entrapment of air bubbles and is good, and then irradiation with active energy rays It was excellent in heat resistance because it was cured and crosslinked. In addition, the electromagnetic wave shielding component obtained by blackening copper as described in Example 8 was able to comfortably appreciate a clear image with a large contrast.

[0050]

As is clear from the examples, the electromagnetic wave shielding adhesive film obtained by the present invention can be easily adhered to an adherend and used, and since it has excellent adhesion, there is no electromagnetic wave leakage and the shielding function. Is particularly good. Further, optical properties such as visible light transmittance and invisibility are good, and the adhesive properties at high temperature are not changed over a long period of time, so that an excellent adhesive film can be provided. By using the microlithographic method according to claim 2 as a photolithographic method, it is possible to provide an electromagnetic wave shielding adhesive film having inexpensive electromagnetic shielding properties and transparency excellent in mass productivity, and simple adhesiveness. . The adhesive layer according to claim 3 is cured by irradiating the adhesive layer with an active energy ray, so that the adherend is kept at a low temperature.
An electromagnetic wave shielding adhesive film that can be easily attached in a short time and has excellent handleability can be provided. The refractive index of the adhesive layer according to claim 4 is 1.45 to 1.45.
By setting it to 1.70, it is possible to provide an electromagnetic wave shielding adhesive film excellent in transparency and image clarity. By making the thickness of the adhesive layer according to claim 5 equal to or greater than the thickness of the conductor, it is possible to provide an electromagnetic wave shielding adhesive film having excellent transparency and adhesiveness. An electromagnetic wave shielding adhesive film having excellent infrared shielding properties and transparency by including an infrared absorbing agent in an adhesive layer which is cured by irradiating the active energy ray according to claim 6. Can be. The geometric figure drawn with the conductive metal according to claim 7 has a line width of 40.
When the thickness is not more than μm, the line interval is not less than 100 μm, and the line thickness is not more than 40 μm, it is possible to obtain an electromagnetic wave shielding adhesive film having an electromagnetic shielding property, transparency and a wide viewing angle. An electromagnetic wave shielding property, workability, and an inexpensive electromagnetic wave shielding adhesive film are provided by making the metal of the film with a conductive metal according to claim 8 copper, aluminum or nickel having a thickness of 0.5 to 40 μm. can do. By drawing a conductive metal by the chemical etching method according to the ninth aspect, it is possible to provide an inexpensive electromagnetic wave shielding adhesive film having excellent visible light transmittance. By making the plastic film of the plastic film with a conductive metal according to claim 10 a polyethylene terephthalate film or polycarbonate, it is possible to provide an electromagnetic wave shielding adhesive film which is inexpensive and excellent in transparency and heat resistance. Since the conductive metal according to claim 11 is copper and at least the surface thereof is blackened, it is possible to provide an electromagnetic wave shielding adhesive film excellent in contrast and electromagnetic wave shielding. By making the conductive metal according to claim 12 a paramagnetic metal, it is possible to provide an electromagnetic wave shielding adhesive film having excellent magnetic field shielding properties.

By providing the electromagnetic wave shielding structure comprising the electromagnetic wave shielding adhesive film and the plastic plate according to the thirteenth aspect, it is possible to provide a transparent substrate having excellent electromagnetic wave shielding properties and to provide a display. can do. By laminating the electromagnetic wave shielding adhesive film according to claim 14 on at least one side of a plastic plate to form an electromagnetic wave shielding structure, a transparent electromagnetic wave shielding excellent substrate can be obtained, and handling is easy. , Can be provided on the display. By bonding the electromagnetic wave shielding adhesive film according to claim 15 to one side of a plastic plate and bonding an adhesive or an adhesive film having an infrared ray shielding property to the other side, an infrared ray shielding structure,
An electromagnetic wave shielding substrate having transparency can be provided. By using the electromagnetic wave shielding adhesive film having the electromagnetic wave shielding property and transparency described in claim 16 for a display, a display that is lightweight, compact, has excellent transparency, and has little electromagnetic wave leakage can be provided. By using the electromagnetic wave shielding structure having the electromagnetic wave shielding property and the transparency described in claim 17 for a display, a display which is lightweight, compact, has a small electromagnetic wave leakage, and also serves as a display protection plate can be provided. When used for a display, it has a large visible light transmittance and good invisibility, so that a clear image can be comfortably viewed under almost the same conditions as in a normal state without increasing the luminance of the display. Since the electromagnetic wave shielding adhesive film and the electromagnetic wave shielding structure of the present invention are excellent in electromagnetic wave shielding properties and transparency, in addition to a display, a measuring device, a measuring device, and a manufacturing device for generating or protecting from electromagnetic waves Windows and housing, looking inside the
In particular, it can be used by being provided at a site such as a window where transparency is required.

[Brief description of the drawings]

FIG. 1A is a perspective view of an electromagnetic wave shielding adhesive film of the present invention, and FIG.

FIG. 2 shows an example (a) of a display using the electromagnetic wave shielding adhesive film of the present invention and an example of an electromagnetic wave shielding structure ((b) to (f)) composed of the electromagnetic wave shielding adhesive film and a plastic plate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Adhesive layer 2 Geometric figure drawn with conductive metal 3 Plastic film 4 Electromagnetic wave shielding adhesive film 5 Display screen 6 Plastic plate 8 Electromagnetic wave shielding structure 9 Adhesive layer

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Minoru Tosaka 1500 Oji Ogawa, Shimodate City, Ibaraki Pref.Hitachi Kasei Kogyo Co., Ltd. Shimodate Research Laboratory F-term (reference) AB16A AB17A AK01B AK01G AK25G AK42B AK45B AL06G BA02 BA10A BA10B CA30 CB04 EJ64A GB41 HB00A JA04G JD08 JG01A JG06A JN18G YY00A YY00G 5E321 AA23 BB25 BB32 GG05 AGG11 AH23A

Claims (17)

[Claims] 1. A plastic film with a conductive metal having an adhesive layer which is cured by irradiation with an active energy ray, has a geometric pattern drawn by a conductive metal by a microlithographic method, and has an aperture ratio of 50%
The above-mentioned electromagnetic wave shielding adhesive film. 2. The electromagnetic wave shielding adhesive film according to claim 1, wherein the microlithographic method is a photolithographic method. 3. The electromagnetic wave shielding adhesive film according to claim 1, wherein the active energy ray is an ultraviolet ray or an electron beam. 4. The cured adhesive layer having a refractive index of 1.45 to 1.7 after being irradiated with active energy rays.
The electromagnetic wave shielding adhesive film according to any one of claims 1 to 3, wherein the value is in the range of 0. 5. The electromagnetic wave according to claim 1, wherein the thickness of the adhesive layer cured by irradiation with the active energy ray is not less than the thickness of the conductive metal. Shielding adhesive film. 6. The electromagnetic wave shielding adhesive according to claim 1, wherein an infrared absorbing agent is contained in the adhesive layer which is cured by irradiating with an active energy ray. the film. 7. The geometric figure drawn with a conductive metal has a line width of 40 μm or less, a line interval of 100 μm or more, and a line thickness of 40 μm or less.
The electromagnetic wave shielding adhesive film according to any one of the above. 8. The electromagnetic wave shielding adhesive film according to claim 1, wherein the conductive metal of the plastic film with a conductive metal is copper, aluminum or nickel having a thickness of 0.5 to 40 μm. . 9. The electromagnetic wave shielding adhesive film according to claim 1, wherein the photolithographic method is a chemical etching method. 10. The electromagnetic wave shielding adhesive film according to claim 1, wherein the plastic film of the plastic film with a conductive metal is a polyethylene terephthalate film or a polycarbonate film. 11. The method according to claim 1, wherein the conductive metal is copper, and at least its surface is blackened.
The adhesive film for shielding electromagnetic waves according to claim 10. 12. The electromagnetic wave shielding adhesive film according to claim 1, wherein the conductive metal is a paramagnetic metal. 13. An electromagnetic wave shielding structure comprising the electromagnetic wave shielding adhesive film according to any one of claims 1 to 11 and a plastic plate. 14. An electromagnetic wave shielding structure in which the electromagnetic wave shielding adhesive film according to claim 1 is bonded to at least one surface of a plastic plate. 15. An electromagnetic wave obtained by laminating the electromagnetic wave shielding adhesive film according to claim 1 on one surface of a plastic plate, and laminating an adhesive or an adhesive film having infrared shielding properties on the other surface. Shielding structure. A display using the electromagnetic wave shielding adhesive film according to any one of claims 1 to 12. 17. A display using the electromagnetic wave shielding component according to any one of claims 13 to 15.