JP2002359311A - Seam weld method and device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To miniaturize a vacuum seam-weld chamber, to lessen the amount of gas within packages in after lids and cases are completely sealed in the packages without reducing the productivity of the chamber as little as possible and to provide the high-quality packages. SOLUTION: A seam welding method is a method for seam-welding square- shaped cases C and square-shaped lids L in square-shaped packages to each other and the seam welding method is provided with a baking process for heat- treating the square-shaped cases C and the square-shaped lids L, a first process for seam-welding the two sides opposing to each other of each square-shaped case C and each square-shaped lid L and a second process for seam-welding the another two sides opposing to each other of each square-shaped case C and each square-shaped lid L. in the seam welding method, the first process is performed in the atmosphere or a nitrogen atmosphere, then the baking process is performed in a vacuum and after that, the second process is performed in a vacuum.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a seam joining method and apparatus for accommodating a quartz oscillator, electronic components, and the like in a package case and seam joining the case and a lid (lid).

[0002]

2. Description of the Related Art Quartz oscillators and semiconductor elements are susceptible to external influences, and are often hermetically sealed in packages. It is widely known that, among such packages, sealing of the rectangular case is performed by parallel seam welding in which roll-shaped electrodes arranged in parallel reciprocate on a rectangular case to which a lid is temporarily attached. As a facility for performing such sealing, there is one disclosed in Japanese Patent No. 2561595. As shown in FIG. 2, roughly divided, a square case is heated to emit gas and the like from the square case and circuit elements. Furnace 11 for removing by heating, a baked square case and a cassette supply unit 12 filled with nitrogen gas to prevent oxidation of circuit elements, a combination of a square case and a square lid, temporary attachment, and sealing by seam welding Part 13,
And a discharge unit 14 for discharging the package.

The baking furnace 11 heats a large number of square cases housed in regularly arranged small recesses of each tray to a predetermined temperature for each of a plurality of trays loaded in the magazine 15, that is, baking to form a square case. This is for diverging and removing gas and the like from the case and the circuit element to secure desired characteristics for a long period of time. The baking furnace 11 is maintained in a vacuum or a nitrogen gas atmosphere.

A plurality of trays 16 loaded on a magazine 15 are temporarily put into a cassette supply unit 12 from a baking furnace 11. The square case or circuit element just taken out of the baking furnace 11 is heated to a little over 200 ° C. and thus has a high temperature, and the cassette supply section 12 is filled with nitrogen gas to prevent oxidation thereof. In the cassette supply unit 12, the tray 1 is moved by the feeding mechanism 12A.
6 are sent out one by one to the transporting means 17 of the sealing section 3.
The sealing portion 13 is filled with a nitrogen gas, and a mechanism 18 for transferring and positioning the rectangular lid to the rectangular case along with the transporting means 17 along with the transporting means 17 and performing temporary mounting, And a Y-axis joining mechanism 19 for seam joining two sides of the rectangular lid in the X-axis direction, and an X-axis joining mechanism 20 for seam joining two sides of the rectangular case and the rectangular lid in the Y-axis direction. Then, the package seam-joined by the sealing portion 13 is discharged to the discharge portion 14.

[0005]

However, in the conventional seam bonding apparatus as described above, after baking the case containing the circuit elements and the like, the lid is combined with the case at the sealing portion 13. The lid is not baked to provide a seam joint. Further, the baking temperature of the case has to be limited to a little over 200 ° C. due to factors such as elements fixed in the case and solder. According to experiments, when the case and the lid are seam-joined, the lid or the lid has a welding current flowing through the lid between the pair of electrodes,
It was found that the temperature of the joint between the case and the lid rose to 300 ° C. or higher, and at this time, gas was generated from the plating film applied to the case and the lid, the internal solder, and the like. FIG. 3 shows the results of this experiment, and shows the change in the amount of each released gas with respect to the temperature of the package. In this figure, water, carbon dioxide, nitrogen gas and carbon monoxide, which release a large amount of gas, are shown.
It can be seen that there is a peak in the range. It is also known that the temperature of the lid and the junction between the case and the lid rises above the peak value during seam bonding. Therefore, this figure clearly shows that the lid or the case and the lid emit gases that adversely affect the characteristics during seam joining.

In addition to the above, there is a conventional example in which seam bonding is performed in a vacuum. However, in this case, the vacuum pressure of the seam bonding work atmosphere is increased, that is, the degree of vacuum is deteriorated. There is also a problem that the vacuum characteristics in the interior are deteriorated and the quality is reduced. In order to prevent this, the vacuum suction capacity must be greatly increased or the vacuum suction time must be significantly lengthened.In the former case, the cost and the size of the apparatus are increased, and in the latter case, Has to wait for the seam joining operation until the vacuum pressure reaches a predetermined low value, which causes a problem that productivity is considerably reduced.

Therefore, although the present invention cannot suppress the amount of generated gas to a low level, it is a relatively small and inexpensive facility, and the package inside the package after the lid and the case are completely sealed without lowering the productivity. It is an object of the present invention to provide a seam joining method and apparatus capable of minimizing the amount of gas existing in a seam.

[0008]

Means for Solving the Problems To solve this problem, the invention of claim 1 is a method of seam joining a rectangular case and a rectangular lid of a rectangular package, wherein the rectangular case and the rectangular lid are heated. A baking step for processing, a first seam joining step for seam joining two opposing sides of the square case and the square lid, and a second seam joining for opposing another two sides of the square case and the square lid. The first seam bonding step is performed in the air or in a nitrogen atmosphere, then the baking step is performed in a vacuum, and then the second seam bonding step is performed. We propose a seam joining method for performing the bonding in a vacuum.

According to a second aspect of the present invention, there is provided a method for seam-joining a rectangular case and a rectangular lid of a rectangular package, wherein the baking step heat-treats the rectangular case and the rectangular lid. A first seam joining step of seam joining two opposing sides of the rectangular case and the square lid, and a second seam joining step of seam joining another two opposite sides of the square case and the square lid. In the seam bonding method provided, after performing the first seam bonding step and the second seam bonding step halfway in the air or in a nitrogen atmosphere, the baking step is performed in a vacuum, and then the The present invention proposes a seam joining method for seam joining the remaining two unjoined portions in a vacuum.

According to a third aspect of the present invention, in order to solve the above-mentioned problem, in the first or second aspect, two sides on which the seam joining is performed in the second seam joining step are performed in the first seam joining step. The present invention proposes a seam joining method that is equal to or shorter than the length of two sides to be seam joined.

According to a fourth aspect of the present invention, there is provided a method for seam-joining a round case and a round lid of a round package, wherein a part of the circumference of the round case and the round lid is formed. A first seam joining step in which seam joining is performed in the air or in a nitrogen atmosphere while leaving, a baking step of heating the round case and the round lid after the first seam joining step; and a baking step After the second step, a part of the circumference of the round case and the round lid, which is not seam-joined, is seam-welded in a vacuum.
And a seam bonding method including the following seam bonding process.

According to a fifth aspect of the present invention, there is provided a method for seam-joining a case and a lid of a square or round package, wherein the case and the lid are first temporarily attached, and then the case and the lid are temporarily attached in a nitrogen atmosphere. A baking process is performed, and then a seam bonding method is performed in which a seam bonding is performed while leaving a part of the periphery of the case and the lid in a nitrogen atmosphere, and thereafter, the remaining peripheral part is seam bonded in a vacuum. It is.

According to a sixth aspect of the present invention, there is provided an apparatus for seam-joining a rectangular case and a rectangular lid of a rectangular package, wherein the first case is rotated by rotating a first pair of welding electrodes. An X-direction joining mechanism for seam-joining two opposing sides of the square lid and a rectangular lid, and a Y for seam-joining another opposite side of the square case and the square lid by rotating a second pair of welding electrodes. In a seam joining apparatus provided with a directional joining mechanism, the present invention proposes a seam joining apparatus in which the X-directional joining mechanism is arranged in the atmosphere or a nitrogen atmosphere, and the Y-directional joining mechanism is arranged in a vacuum.

According to a seventh aspect of the present invention, in order to solve the above-mentioned problem, in the sixth aspect, a distance in which the first pair of welding electrodes rotates is a distance in which the second pair of welding electrodes rotates. The present invention proposes a longer seam joining apparatus.

An invention according to claim 8 is an apparatus for seam joining a rectangular case and a rectangular lid of a rectangular package to solve the above-mentioned problem, wherein the rectangular case is formed by rotating a first pair of welding electrodes. An X-direction joining mechanism for seam joining two opposing sides of the rectangular lid and the square lid, and seam the other two opposite sides of the rectangular case and the rectangular lid by rotating a pair of second and third welding electrodes. A seam joining apparatus having a Y-direction joining mechanism for joining, wherein the X-direction joining mechanism is disposed in the atmosphere or a nitrogen atmosphere, and the second pair of welding electrodes of the Y-direction joining mechanism are in the atmosphere. Alternatively, the present invention proposes a seam joining apparatus which is arranged in a nitrogen atmosphere and the third pair of welding electrodes is arranged in a vacuum.

According to a ninth aspect of the present invention, in order to solve the above-mentioned problem, in the eighth aspect, the distance that the first pair of welding electrodes rotates is limited by the second or third pair of welding electrodes. It proposes a seam joining device longer than the moving distance.

According to a tenth aspect of the present invention, there is provided an apparatus for seam-joining a square or round case and a round lid of a square or round package, wherein the first pair of welding electrodes are provided. A first seam bonding mechanism for performing seam bonding in air or nitrogen atmosphere while leaving a part of the periphery of the square or round case and the lid provided therein;
And a second seam joining mechanism for seam joining the square or round case and the part of the lid that is not seam joined to the lid in a vacuum. It is.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Before describing the embodiments of the present invention, the basic technical idea of the present invention will be described. Seam bonding is performed halfway around the package case and the lid, preferably half or more. Baking in a vacuum to release gas sufficiently from the case and lid, and then complete seam bonding of the short peripheral part left in the vacuum, thereby increasing the size of the entire equipment It is possible to obtain a high-quality package in which the vacuum pressure is maintained at a sufficiently low level without increasing the cost or increasing the vacuum suction capacity.

An embodiment of the present invention will be described with reference to FIG. 1 is a mechanism 18 for performing the combination and temporary attachment of the case and the lid shown in FIG. 2 and a Y-axis direction joining mechanism 19 for seam-joining two sides of the case and the lid in the Y-axis direction.
A first seam bonding chamber provided with a mechanism corresponding to The first seam bonding chamber 1 is in a nitrogen gas atmosphere or the atmosphere, where the lid L is mounted and aligned with the case C as in the conventional case. Here, in FIG. 1, the cases C are merely arranged in a single row for simplicity, but a large number of cases C are actually stored in the tray T in a matrix in the X-Y direction as in the conventional case. The case C and the lid L are long in the Y-axis direction and short in the X-axis direction perpendicular to the Y-axis direction. In the case C and the lid L mounted on the tray T, the first pair of tapered roller-like welding electrodes E1 and E2 are stopped, and a current is applied between them to perform a temporary attachment, and then a temporary attachment is performed. The first pair of welding electrodes E1 and E2 are rotated along the long side in the Y-axis direction to seam-join the case C and the long side of the lid L. In this case C and the seam joining of the long side of the lid L, as shown in FIG. 3, various kinds of gases such as moisture, carbon dioxide, nitrogen and carbon monoxide, and hydrogen are released.

The case C and the lid L, whose long sides are seam-joined, are placed on a tray T and transferred to a baking furnace 2 having a normal heater H connected to a vacuum pump device VP1 through a gas amount adjusting valve V1. Although not shown, small chambers are provided on the entrance side and the exit side of the baking furnace 2, and the tray T on which the case C and the lid L are placed is transported to the small chamber on the entrance side. At this time, since the small chamber is filled with the atmosphere, the vacuum pressure is reduced to the set value of the small chamber, and then the door between the baking furnace 2 held in vacuum and the small chamber is opened, and the Y-axis direction is changed. The tray T on which the case C and the lid L, which are seam-bonded only on the long sides, are carried to the vacuum baking furnace 2. Then, the case C and the lid L are heated for a predetermined time at a temperature that does not adversely affect the characteristics of the circuit element, for example, at a temperature of about 230 ° C. to 250 ° C. , Carbon monoxide, hydrogen gas and the like are released. In the previous stage of seam bonding, only the long sides of the case C and the lid L are seam-bonded, but the short sides thereof are not bonded. Together, the vacuum is sucked into the vacuum baking furnace 2 through the small gap on the short side between the case C and the lid L, so that the released gas does not remain in the case C and the lid L.

When the baking process is completed in this manner, the tray T is isolated from the baking furnace 2 but is connected to the vacuum seam bonding chamber 3 in a vacuum atmosphere.
Transported to In this embodiment, the high-temperature case C and the lid L just taken out of the baking furnace 2 are put into the vacuum second seam bonding chamber 3 without any special cooling. Similarly to the baking furnace 2, the seam bonding chamber 3 also has a vacuum pump device V through a gas amount adjusting valve V2.
It is connected to P2 so as to maintain a predetermined degree of vacuum. The seam joining chamber 3 includes a second pair of tapered roller-shaped welding electrodes E3 and E4. The second pair of tapered roller electrodes E3 and E4 are arranged along the short side in the X-axis direction. The case C and the short side of the lid L are seam-joined on the tray T by rotating the electrodes and passing a welding current between the electrodes.

At this time, there is no gas generated from the case C and the lid L, but the gas is released when the bonding distance is short and the long side is seam-bonded in the mechanism 1, and further, the gas is released in the baking furnace 2. Since gas is released during baking, the amount of gas generated when the short sides of the case C and the lid L in the X-axis direction are seam-bonded is significantly smaller than in the conventional case. Therefore, the degree of vacuum inside the completely sealed package is higher than that of the conventional package,
Also, since the release of gas into the seam bonding chamber 3 is extremely small, this improves the vacuum characteristics inside the package without increasing the vacuum capacity, and greatly improves the quality of the package. I have. Then, when the seam bonding of all the short sides of the case C and the lid L on the tray T is completed and a package is formed, the tray T is placed in the seam bonding chamber 3 with the package mounted thereon.
Is taken out through a small chamber (not shown) provided on the outlet side so that the vacuum pressure of the seam bonding chamber 3 does not increase.

Next, an embodiment in which a square case and a lid are seam-joined will be described with reference to FIG. Temporary attachment of the square case and lid is performed as described above,
Opposite sides of the square case and the lid in the Y-axis direction are seam-joined by a first pair of welding electrodes E1 and E2,
Once that's done, the square case and lid are 9 per tray
It rotates 0 degrees, and seams the other two sides halfway, for example, about half or about ／. When the partial seam joining between the square case and the lid is performed, two sides of the next square case and the lid in the Y-axis direction are fitted to the pair of welding electrodes E3 and E4, and the seam is formed in the same manner as described above. Joining is performed.

As described above, when all the cases and the lids on the tray T are partially joined by seam joining one after another, the tray T is sent to the baking furnace 2 and baked as described above. Is transferred to the seam bonding chamber 3 in the same manner as described above. Second in seam bonding chamber 3
A pair of welding electrodes E3 and E4 seam-join the short, unjoined portions of the square case and the lid. In this seam bonding, the electrodes E3 and E4 move so as to be slightly seam-bonded to both sides of the part that has not been seam-bonded by the mechanism 1, that is, to be seam-bonded twice on both sides, thereby ensuring sealing. To

Next, an embodiment in which a round case and a lid are seam-joined will be described with reference to FIG. Temporary attachment of the round case and lid is performed in the same manner as above, and in the case of the round case and lid, the round case and lid are rotated around the center point from the beginning, More than half of the periphery is seam bonded. Preferably, 30
It is rotated about 0 degrees, and in this step, about 5/6 of the entire circumference is seam-joined. Thereafter, the tray T is rotated back by the rotated angle to return to the original position, the tray T is moved, and the next round case and lid to be joined next are paired with a pair of welding electrodes E.
1 and E2, and seam joining is performed in the same manner as described above. This seam joining is performed in the air or in a nitrogen gas atmosphere.

When all the cases and the lid are joined, the tray T is sent to the vacuum baking furnace 2 and baked as described above, and then transferred to the seam joining chamber 3 in the same manner as described above. In the seam joining chamber 3, the second welding electrodes E3 and E4 seam join the unjoined portions of the round case and the lid. In this seam joining, the round case and the lid are rotated so that the seam joining is performed twice on both sides of the part that has not been seamed by the mechanism 1 so as to be seamed twice on both sides. To ensure.

In another embodiment of the present invention, a case and a lid are temporarily attached, and after baking is performed in a vacuum, seam bonding is performed in a nitrogen atmosphere while leaving a part around the case and the lid. A first seam joining step, and after the first seam joining step, a second seam joining step of transporting from nitrogen gas to a vacuum and seam joining the remaining peripheral portion in the vacuum. And In this method, there is no need to connect in a vacuum atmosphere between the baking furnace and the seam bonding chamber for performing the second bonding step.
This part is advantageous in cost. Although the case and the seam are rotated in the above embodiment, the welding electrodes E1 and E2 may be rotated without rotating the case and the seam.

[0028]

As described above, the present invention makes it possible to reduce the size of the vacuum seam bonding chamber, and to reduce the gas in the package after the lid and the case are completely sealed without lowering the productivity. Provided is a seam bonding method and apparatus capable of providing a high quality package while minimizing the amount.

[Brief description of the drawings]

FIG. 1 is a view for explaining a seam joining method and a joining apparatus according to the present invention.

FIG. 2 is a view for explaining a conventional seam joining method and a conventional joining apparatus.

FIG. 3 is a diagram showing a relationship between an amount of gas released from a package lid and a processing temperature.

[Explanation of symbols]

 1-First seam joining chamber 2-Baking furnace 3-Second seam joining chamber C-Package case L-Package lid T-Tray E1, E2-First welding electrode E3, E4-Second welding Electrodes VP1, VP2-first and second vacuum pumps V1, V2-gas amount adjusting valve

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) (72) Inventor Masahiro Kimura 1-18-1 Takada, Toshima-ku, Tokyo Origin Electric Co., Ltd.

Claims (10)

[Claims] 1. A method for seam-joining a rectangular case and a rectangular lid of a rectangular package, comprising: a baking step of heating the rectangular case and the rectangular lid; and two opposite sides of the rectangular case and the rectangular lid. A first seam joining step of seam joining the first case and a second seam joining step of seam joining another two opposite sides of the rectangular case and the rectangular lid, wherein the first seam is provided. A seam bonding method, wherein the bonding step is performed in air or a nitrogen atmosphere, the baking step is performed in a vacuum, and then the second seam bonding step is performed in a vacuum. 2. A method for seam-joining a rectangular case and a rectangular lid of a rectangular package, wherein a baking step of heat-treating the rectangular case and the rectangular lid, and two sides of the rectangular case and the rectangular lid facing each other. A first seam joining step of seam joining the first case and a second seam joining step of seam joining another two opposite sides of the rectangular case and the rectangular lid, wherein the first seam is provided. After the joining process and the second seam joining process are performed in the air or in a nitrogen atmosphere, the baking process is performed in a vacuum, and then the remaining unjoined portions of the other two sides are applied. Seam bonding in a vacuum. 3. The two sides for performing seam joining in the second seam joining step according to claim 1 or 2,
A seam joining method, wherein the length is equal to or shorter than the length of two sides to be seam joined in the first seam joining step. 4. A method of seam-joining a round case and a round lid of a round package, wherein seam joining is performed in the air or in a nitrogen atmosphere while leaving a part of the circumference of the round case and the round lid. A first seam joining step to be performed, a baking step of heat-treating the round case and the round lid after the first seam joining step, and, after the baking step, the round case and the round lid A second seam joining step of seam-welding a part of the circumference not seam-joined in vacuum in a vacuum. 5. A method for seam bonding a case and a lid of a square or round package, wherein the case and the lid are temporarily attached to each other, and then the baking step is performed in a nitrogen atmosphere. A seam joining method comprising: performing seam joining while leaving a part of the periphery of a case and a lid; and then seam joining the remaining peripheral part in a vacuum. 6. An apparatus for seam-joining a square case and a square lid of a square package, wherein two opposing sides of the square case and the square lid are seam-joined by rotating a first pair of welding electrodes. A seam joining apparatus, comprising: an X-direction joining mechanism that performs a second pair of welding electrodes; and a Y-direction joining mechanism that seams and joins two other sides of the rectangular case and the rectangular lid that face each other by rotating. A seam joining apparatus, wherein the X-direction joining mechanism is arranged in the atmosphere or a nitrogen atmosphere, and the Y-direction joining mechanism is arranged in a vacuum. 7. The device according to claim 6, wherein a distance over which the first pair of welding electrodes rotates is equal to the second distance.
Wherein the pair of welding electrodes is longer than a turning distance of the pair of welding electrodes. 8. An apparatus for seam-joining a square case and a square lid of a square package, wherein two opposing sides of the square case and the square lid are seam-joined by rotating a first pair of welding electrodes. Seam joining mechanism comprising: an X-direction joining mechanism that performs a seam joining operation by rotating a pair of second and third welding electrodes to seam join another opposite side of the rectangular case and the rectangular lid. The apparatus, wherein the X-direction joining mechanism is arranged in the atmosphere or a nitrogen atmosphere, the second pair of welding electrodes of the Y-direction joining mechanism is arranged in the atmosphere or a nitrogen atmosphere, A seam joining apparatus, wherein a pair of welding electrodes are arranged in a vacuum. 9. The device according to claim 8, wherein the distance over which the first pair of welding electrodes rotates is equal to the second distance.
Alternatively, the seam joining device is longer than a distance in which the third pair of welding electrodes rotate. 10. An apparatus for seam joining a square or round case and a round lid of a square or round package, comprising a first pair of welding electrodes. A first seam bonding mechanism for performing seam bonding in air or nitrogen atmosphere while leaving a part of the periphery, and a square or round case and a lid which are not seam bonded to each other, including a second pair of welding electrodes. A second seam joining mechanism for seam joining a part of the periphery in a vacuum.