JP2586411Y2 - Shutter device for automatic soldering equipment - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shutter device used for a board entrance and a board exit of an automatic soldering apparatus, and in particular, to solder an opening of a board entrance and a board exit of an automatic soldering apparatus. The present invention relates to a shutter device of an automatic soldering device that opens and closes according to the size of a substrate to be mounted, minimizes the flow of gas to the outside of the automatic soldering device, and enables the automatic soldering device to be used efficiently.

[0002]

2. Description of the Related Art In many conventional automatic soldering apparatuses, a soldering flux is applied to a substrate to remove oxides at a soldered portion, and the substrate and the solder are removed in an atmosphere containing a large amount of oxygen. The electronic components were soldered at high temperatures.

[0003] However, according to the conventional automatic soldering apparatus, the application of flux alone is not sufficient for preventing the oxidation of the solder, the soldered portion and the electronic component. Since the wires are also very thin, even slight oxidation of the soldered part can cause serious soldering failures and reduce the reliability of electronic products. These measures have become an urgent issue.

Further, when the soldering portion and the molten solder are oxidized, not only the sufficient soldering performance cannot be ensured as described above, but also a troublesome work of removing the oxidized solder must be performed. there were.

[0005] In order to solve such a drawback, an automatic soldering apparatus is filled with an inert gas such as nitrogen gas and soldered, so that the electronic parts, the substrate and the solder are cut off in a state where oxygen is cut off. There has been proposed an automatic soldering apparatus for performing soldering while preventing oxidation of a soldering portion or molten solder which is heated to a high temperature.

However, since an inert gas such as nitrogen gas used in this type of automatic soldering apparatus is expensive, the degree of sealing of the automatic soldering apparatus is increased to prevent leakage of the inert gas from the automatic soldering apparatus. Various measures have been taken to minimize the cost of soldering.

As a result of a detailed investigation of the cause of the outflow of the inert gas from the automatic soldering apparatus, an opening for loading a substrate to be soldered from outside of the apparatus and unloading the substrate from the apparatus to the outside. That is, it has been found that the outflow of the substrate from the entrance and the exit accounts for the majority of the inert gas outflow.

That is, for example, in a reflow soldering apparatus, the temperature is controlled so that the temperature gradually increases from the preheating chamber to the reflow soldering chamber, so that the gas density is low in the high temperature section and low in the low temperature section. The gas density is increased, and a flow of the inert gas is generated from a low-temperature portion having a high gas density to a high-temperature portion having a low gas density.

As a result, due to the flow of the inert gas caused by the temperature difference, the inert gas flows out of the carry-out port and consumes expensive inert gas. No countermeasures are taken against outflow from the carry-out port, and a large amount of inert gas leaks out of the apparatus, which is very uneconomical.

[0010] With the outflow of the inert gas from the outlet, air flows into the automatic soldering apparatus from the inlet, and
There is a disadvantage that the inert gas density in the preheating chamber is reduced and the effect of preventing oxidation is reduced.

[0011] As a method for preventing the inflow of air from the carry-in port and the carry-out port, a large amount of inert gas that flows out of the automatic soldering apparatus is supplied into the apparatus to increase the internal pressure in the apparatus. However, according to this method, it is necessary to supply an extremely large amount of inert gas, which is not economical.

[0012]

SUMMARY OF THE INVENTION The present invention has been made to eliminate the above-mentioned drawbacks of the prior art, and has as its object to provide a board loading port and a board loading port of an automatic soldering apparatus. By providing a shielding plate for closing the board entrance and the board exit, the outflow of the inert gas from the automatic soldering apparatus is prevented, the consumption of the inert gas is extremely reduced, and the soldering cost is greatly reduced. It is to reduce.

Another object of the present invention is to form a shielding plate for closing the substrate entrance and the substrate exit by a plurality of shielding plates, and to open and close the shielding plate to an optimum size according to the size of the substrate. It is to reduce the consumption of the inert gas without obstructing the loading and unloading of the substrate, and by minimizing the outflow of the inert gas.

Still another object of the present invention is to form the above-mentioned shielding plate so as to be opened and closed in conjunction with the movable chain support of the chain for transporting the substrate, so that the chain for transporting the substrate simply in accordance with the size of the substrate can be obtained. An object of the present invention is to make it possible to automatically set the openings of the substrate carrying-in port and the substrate carrying-out port to optimum sizes only by adjusting the intervals.

[0015]

SUMMARY OF THE INVENTION In short, the present invention provides a substrate transport chain, a movable chain support that supports the chain and is movable in the width direction of the substrate, a substrate loading port of an automatic soldering apparatus, A plurality of shielding plates rotatably mounted on pins implanted at predetermined intervals above the substrate outlet and closing the substrate inlet and the substrate outlet, and engagements respectively implanted in the shielding plates A cam surface for engaging the pin and rotating the shielding plate sequentially about the pin to open the substrate entrance and the substrate exit is formed, and the cam surface is fixed to the movable chain support and is fixed to the movable chain support. And a shielding plate opening / closing member that moves with the body.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on an embodiment shown in the drawings. 1 to 3, the shutter device 2 of the automatic soldering device 1 according to the present invention includes a substrate transport chain 8.
, A movable chain support 21, a shielding plate 3, and a shielding plate opening / closing member 4.

First, the basic configuration of the automatic soldering apparatus 1 will be described. In the automatic soldering apparatus 1 (the illustrated one is a reflow automatic soldering apparatus), a heating chamber 6 is provided in a housing 5, and the heating chamber 6 has two or three preheating chambers (not shown). , A reflow soldering chamber and a slow cooling chamber, each of which is provided with a heating device or a cooling device.

In the preheating chamber, the reflow soldering chamber, and the annealing chamber, a pair of known chains 8 (8A, 8B) for transferring a substrate, which is an example of a transfer device, penetrate the sprocket 9 and drive. It is arranged to be wound around a sprocket 10, and is configured to load a substrate 18 on the pair of chains 8 and transport the substrate.

A chain 15 is wound around a sprocket 12 fixed to a rotating shaft 11 of the driving sprocket 10 and a motor sprocket 14 of a motor 13. The rotating shaft 11 is driven by the motor 13 to rotate, and a pair of The chain 8 is configured to run.

Then, soldering is performed while sequentially transferring the substrate 18 loaded from the substrate transfer port 16 to the preheating chamber, the reflow soldering chamber, and the annealing chamber. (Not shown).

Referring also to FIG. 4, the chain 8A on the left side in FIG.
Is wound around a sprocket 9 and a driving sprocket 10 mounted on a fixed chain support 20 fixed to a base 19, so that the chain 8A cannot move in the width direction of the substrate 18.

The other chain 8B is wound around a sprocket 9 and a driving sprocket 10 mounted on a movable chain support 21 which is movable in the directions of arrows A and B (the width direction of the substrate 18). A pair of chains 8A and 8B is moved in the directions of arrows A and B together with the movable chain support 21 in accordance with the size of the substrate 18 to be moved.
The interval between them can be adjusted.

The movable chain support 21 has a male screw 22
A chain 28 is wound around a sprocket 24 fixed to the male screw 22 and a sprocket 26 fixed to the rotating shaft of a motor 25. Is rotated, and the female screw 23 screwed thereto, that is, the movable chain support 21 is moved in the directions of arrows A and B, and the substrate 1 to be carried in is moved.
The spacing of the pair of chains 8A and 8B in accordance with the size of 8 from L ₁ to L _2, for example, 350m of about 30mm
m can be adjusted steplessly.

The shielding plate 3 is for shielding the substrate carrying-in port 16 and is composed of a plurality of substantially parallelogram-shaped thin plates. The upper left end of each shielding plate 3 is fitted to a pin 29 fixed to the housing 5 so as to shield the carry-in entrance 16, and each shielding plate 3 is independently rotatable in the directions of arrows C and D. It is arranged.

At the lower left end of each shielding plate 3 in the figure,
An engagement pin 30 is implanted, and engages with a shield plate opening / closing member 4 described later to shield or open the substrate carrying-in port 16.

The shield plate opening / closing member 4 is used to open and close the shield plate 3 and engages with the engaging pin 30 to cover the shield plate 3.
Is formed as a plate cam 4 having a cam surface 4a which is opened by rotating the cam surface in the direction of arrow C and a shielding plate holding portion 4b formed continuously with the cam surface 4a. It is fixed to the body 21 and can move in the directions of arrows A and B together with the movable chain support 21.

A large notch 4c is provided below the shielding plate holding portion 4b. When the shielding plate opening / closing member 4 rotates the shielding plate 3 in the direction of arrow C to open the substrate carry-in port 16. The board 18 can be carried into the automatic soldering apparatus 1 from the notch 4c.

The present invention is configured as described above,
Hereinafter, the operation will be described. 2 to 5, when soldering a narrow board 18, the motor 25 is rotated to rotate the male screw 22, and the movable chain support 21 is moved in the direction of arrow A according to the width of the board 18. The distance between the pair of chains 8 is adjusted to, for example, 30 mm.

As the movable chain support 21 moves in the direction of the arrow A, the shielding plate opening / closing member 4 fixed thereto is moved.
When the shield plate 3 also moves in the direction of arrow A, each shield plate 3 rotates in the direction of arrow D by its own weight to close the unnecessary portion on the right side of the substrate carrying-in port 16 and to cover the minimum necessary portion facing the pair of chains 8. Only the openings are opened to prevent useless outflow of the inert gas from the substrate carry-in port 16.

When soldering the wide substrate 18, referring to FIG. 6, the motor 25 is rotated in the opposite direction to rotate the male screw 22, and the movable chain support 21 is moved in the direction of arrow B. Move.

When the shield plate opening / closing member 4 fixed to the movable chain support 21 moves in the direction of arrow B, the cam surface 4a first engages with the engaging pin 30 of the shield plate 3 at the left end in the figure. Then, the shield plate 3 is rotated in the direction of arrow C, and subsequently the shield plate 3 is sequentially rotated in the direction of arrow C from the left shield plate 3, and then the engaging pin 30 is engaged with the shield plate holding portion 4b. Then, the cover plate 3 is opened, and the substrate carrying-in port 16 is opened.

Then, for example, the substrate 18 having a maximum width of 350 mm is carried into the automatic soldering apparatus 1 from the notch 4c and soldered.

In the above embodiment, the automatic soldering apparatus 1 has been described as a reflow automatic soldering apparatus. However, the automatic soldering apparatus is not limited to the reflow soldering apparatus. A dip-type or jet-type automatic soldering apparatus for soldering the substrate by contacting the substrate with the stored molten solder may be used.

[0034]

According to the present invention, as described above, since the board carrying port and the board carrying port of the automatic soldering apparatus are provided with the shielding plates for closing the board carrying port and the board carrying port, the automatic soldering apparatus is provided with a shielding plate. There is an effect that the outflow of the inert gas can be prevented, the consumption of the inert gas can be extremely reduced, and the soldering cost can be significantly reduced.

Further, since the shielding plate for closing the substrate entrance and the substrate exit is constituted by a plurality of shielding plates, and the shielding plate is opened and closed so as to have an optimal size according to the size of the substrate. This is extremely advantageous in that the flow of the inert gas can be reduced and the consumption of the inert gas can be reduced without obstructing the loading and unloading of the substrate.

Further, since the shield plate is configured to be opened and closed in conjunction with the movable chain support of the chain for transporting the substrate, the distance between the chains for transporting the substrate is simply adjusted according to the size of the substrate. The effect that the opening of the substrate carrying-in port and the substrate carrying-out port can be automatically set to the optimum size is obtained.

[Brief description of the drawings]

FIGS. 1 to 6 relate to an embodiment of the present invention, and FIG. 1 is an overall perspective view of an automatic soldering apparatus.

FIG. 2 is a left side view of the automatic soldering apparatus.

FIG. 3 is a perspective view of a shutter device of the automatic soldering device.

FIG. 4 is a plan view of a main part of a shutter device of the automatic soldering device.

FIG. 5 is a side view showing a state where the shutter device is shielded.

FIG. 6 is a side view showing a state where the shutter device is fully opened.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Automatic soldering apparatus 2 Shutter device 3 Shielding plate 4 Shielding plate opening / closing member 4a Cam surface 8 Chain for substrate conveyance 8A Chain for substrate conveyance 8B Chain for substrate conveyance 16 Substrate entrance 18 Substrate 21 Movable chain support 29 Pin 30 Engagement pin

──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int. Cl. ⁶ , DB name) B23K 1/008 B23K 1/08 B23K 31/02 310 H05K 3/34 506 H05K 3/34 507

Claims (1)

(57) [Scope of request for utility model registration] A chain for transporting a substrate, a movable chain support that supports the chain and is movable in the width direction of the substrate, and a predetermined interval above the substrate entrance and the substrate exit of the automatic soldering apparatus. A plurality of shielding plates rotatably mounted on the implanted pins and closing the substrate carrying-in port and the substrate carrying-out opening, and engaging the engaging pins respectively implanted in the shielding plates with the shielding plates. A cam surface for sequentially rotating around the pin to open the substrate carry-in port and the substrate carry-out port is formed, and a shielding plate opening / closing member fixed to the movable chain support and moving together with the movable chain support; A shutter device for an automatic soldering device, comprising: