JP2002359277A - Notch-adjusting device for wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a notch-adjusting device of a wafer, which can clamp the water with simple structure, without having to use vacuum suction force. SOLUTION: A wafer holding tool 5 having wafer support parts 7A, 7A, and so on is fitted at the upper end of a main shaft 14. The main shaft is rotated and driven, and the wafer holding tool 5 holding the wafer 2 is rotated. A notch formed at the outer periphery of the wafer 2 is detected by a notch sensor, in a process with the wafer 2 being rotated, and the detected position of the notch is adjusted to a reference position; a clamping tool 703 is arranged in one wafer support part 7A disposed in the wafer-holding tool 5; the change of the output shaft 70a of an electromagnetic solenoid 70 is transmitted to the clamping tool 703 through a clamp drive shaft 52, through which the main shaft 14 passes, a link mechanism 61 and a sliding board 50; and the clamping tool 703 is changed to a clamping position and an unclamping position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a notch aligning apparatus used to adjust the position of a notch formed on the outer periphery of a wafer such as a semiconductor wafer to a reference position.

[0002]

2. Description of the Related Art In the process of manufacturing semiconductor devices such as ICs, a large number of semiconductor wafers are stacked and stored in a cassette, the cassette is loaded into a processing device or the like, and the wafer is removed from the cassette inside the processing device or the like. The sheets are taken out one by one and transferred onto a predetermined holding means. The wafer that has been processed by the process device or the like is returned to the original cassette or stored in another cassette and carried out of the device.

When a wafer is loaded from a cassette into a processing apparatus or the like, it is necessary to keep the direction of the wafer constant at all times. Therefore, a notch such as a U-shaped or V-shaped notch is formed on the outer peripheral portion of the wafer as an index (mark) for identifying the orientation. When a wafer is loaded from a cassette into a process device or the like, the position of a notch on the outer periphery of the wafer must be adjusted to a reference position.

In this specification, adjusting the position of the notch of the wafer to the reference position is called "notch alignment".

[0005] A flat notch called an orientation flat (orientation flat) is provided on the outer periphery of the wafer, and the orientation flat is used as an index for alignment of the wafer. The case where a notch is used as an index of alignment is targeted.

Normally, a cassette for accommodating a wafer or a process apparatus for performing various processes on the wafer does not have a function of aligning the notch of the wafer. An aligning device is arranged, and the notch position of the wafer is adjusted to the reference position by the notch aligning device.

A notch aligning apparatus for a wafer has a plurality of wafer supporting portions for receiving and supporting the outer peripheral portion of a disk-shaped wafer from below at a plurality of positions spaced circumferentially from each other and vertically extending a main shaft. A wafer holder having a central portion attached to an upper end of the wafer holder, a rotation driving mechanism for rotating a main shaft to rotate the wafer holder, and a wafer held by the wafer holder in a process of rotating together with the wafer holder. And a notch sensor for detecting a notch formed on the outer periphery of the wafer. After the notch sensor detects a notch on the wafer, an operation of adjusting the position of the notch to a reference position is performed.

In this type of notch alignment device,
When the wafer is held by the wafer holder, the wafer is mechanically positioned so that the center position of the wafer coincides with the reference position.

[0009]

In the above notch alignment apparatus, there is provided an apparatus for clamping a wafer to a wafer holder so that the position of the wafer is not shifted while the wafer is held by the wafer holder. Must be provided.

In the conventional notch aligning apparatus, a clamping device using a vacuum suction force is used to clamp a wafer. However, a vacuum pump is required to operate the clamping device using the vacuum suction force. In addition to the above, it is necessary to provide piping and valves for connecting the clamp device and the vacuum pump, so that the structure of the device becomes complicated and large, and the cost increases. was there.

Conventionally, a region having a constant width near the outer periphery of both the front and back surfaces of a wafer is an unprocessed region, and a holding tool or a clamp tool may be brought into contact with the unprocessed region. However, recently, there is a tendency that it is not allowed to apply an object to a portion near the outer periphery of both front and back surfaces of a wafer. For example, in the case of a wafer having a diameter of 300 [mm], when the wafer is held or clamped, the holder and the clamp are allowed to come into contact with the chamfered portion on the lower surface side of the outer periphery of the wafer. Only the outer peripheral edge forming the boundary between the lower surface of the wafer and the outer peripheral surface of the wafer is not allowed to hit the chamfered portion of the outer peripheral. As described above, it is not easy to clamp a wafer having a limited portion to which the holder and the clamp are allowed to apply by the vacuum suction force.

In this specification, the outer peripheral edge forming the boundary between the chamfered portion on the lower surface side of the outer periphery of the wafer and the lower surface of the wafer is referred to as the outer peripheral edge on the lower surface side of the wafer. Further, an outer peripheral portion forming a boundary between a chamfered portion on the upper surface side of the outer periphery of the wafer and the upper surface of the wafer is referred to as an outer peripheral portion on the upper surface side of the wafer.

An object of the present invention is to provide a wafer notch aligning apparatus which can realize a wafer clamping mechanism with a simple and compact structure using an electromagnetic solenoid as a driving source without using a vacuum suction force. It is in.

[0014]

SUMMARY OF THE INVENTION The present invention has a plurality of wafer supports for receiving and supporting an outer peripheral portion of a disk-shaped wafer from below at a plurality of positions spaced circumferentially from each other. A wafer holder having a central portion attached to the upper end of a main shaft extending in the direction of rotation, a rotation drive mechanism for rotating the main shaft to rotate the wafer holder, and a wafer held by the wafer holder rotating together with the wafer holder A notch sensor for detecting a notch formed on the outer periphery of the wafer in the process, and a notch alignment device for a wafer that performs an operation of adjusting the position of the notch of the wafer detected by the notch sensor to a reference position. .

Each of the wafer supporting portions provided on the wafer holder has a wafer receiving portion for receiving an outer peripheral edge of a lower surface of the wafer from below and an outer peripheral surface of the wafer received by the wafer receiving portion to contact the wafer. A radial positioning portion for positioning the wafer in the radial direction, for positioning and holding the wafer in contact with only the lower peripheral edge and the outer peripheral surface thereof.

According to the present invention, the radial positioning portion provided on at least one of the plurality of wafer supporting portions is provided with a clamping position at which the wafer is to be clamped by contacting the outer peripheral surface of the wafer to be supported. It is constituted by a clamp tool provided so as to be displaceable along the radial direction of a wafer to be supported between the unclamped position where the clamp is released.

Further, a clamp driving device for transmitting the displacement of the output shaft of the electromagnetic solenoid to the clamp through a clamp drive member penetrating the shaft of the main shaft, and displacing the clamp to a clamp position and an unclamping position. Is established,
The clamp device driving device and the clamp device constitute a clamp device for clamping a wafer.

As described above, at least one of the radial positioning portions of the wafer support portion is constituted by the clamp, and the electromagnetic solenoid is passed through the clamp driving member which passes through the axis of the main shaft for rotating the wafer holder. With the structure for transmitting the displacement of the output shaft to the clamp, the wafer can be clamped or unclamped with a simple and compact structure without using a vacuum suction force.

In this specification, "displacement of the output shaft of the electromagnetic solenoid" means not only the displacement generated on the output shaft when the electromagnetic solenoid is excited, but also the urging force of the return spring when the electromagnetic solenoid is deenergized. And the like, the displacement occurring on the output shaft.

When the electromagnetic solenoid is used as a driving source of the clamp device as described above, it is not necessary to provide a vacuum pump and piping and valves for supplying a vacuum, thereby simplifying the structure of the device and reducing the size of the device. Can be achieved.

Further, with the above configuration, since the outer peripheral portion of the wafer is clamped by the clamp, a wafer which is not allowed to be brought into contact with the outer peripheral portion on both the front and back surfaces can be clamped without any problem. .

In order to stably hold the wafer, it is desirable to provide at least three (preferably three) of the above-mentioned wafer supporting portions.

Further, the clamp device driving device is provided so as to slidably penetrate the axis of the main shaft and is supported so as to be rotatable together with the main shaft, and the displacement of the clamp driving shaft in the axial direction. A displacement transmission mechanism that converts the displacement into the radial displacement and transmits the displacement to the clamp tool, an electromagnetic solenoid having an output shaft that generates linear displacement, and an electromagnetic solenoid for displacing the clamp tool between a clamp position and an unclamping position. And a clamp drive mechanism for transmitting the linear displacement of the output shaft to the clamp drive shaft.

In order to stably hold the wafer, it is preferable to support the wafer at three points. 3 wafers
In the case of supporting at a point, a holder main body having three arms provided radially at equal angular intervals, and a disk-shaped wafer provided at the tip of each of the three arms of the holder main body. A wafer holder having three wafer supports for receiving and supporting the outer peripheral portion from below is provided, and the center of the holder main body of the wafer holder is attached to the upper end of a vertically extending main shaft.

In this case, the radial positioning portion provided on one wafer supporting portion of the wafer holder is brought into contact with the outer peripheral surface of the wafer to be supported and a clamping position for clamping the wafer and an anchor for releasing the clamping. It is constituted by a clamp tool which can be displaced in the radial direction between the clamp position.

[0026] Further, the clamp driving device is provided so as to slidably penetrate the axis of the main shaft, and is supported so as to rotate with the main shaft.
A displacement transmission mechanism for converting a linear displacement of a clamp drive shaft along the axial direction of a main shaft into a radial displacement of a wafer to be supported and transmitting the displacement to a clamp tool, an electromagnetic solenoid having an output shaft for producing a linear displacement, and a clamp; And a clamp drive mechanism for transmitting the displacement of the output shaft of the electromagnetic solenoid to the clamp drive shaft in order to displace the tool between the clamp position and the unclamped position.

The displacement transmission mechanism includes a slide plate supported by the wafer holder so as to be slidable in the radial direction of the wafer held by the wafer holder, and one end of which is connected to the clamp, and a projection protruding from the upper end of the main shaft. And a link mechanism provided between the upper end of the clamp drive shaft and the other end of the slide plate for converting the linear displacement of the clamp drive shaft into a radial displacement and transmitting the displacement to the slide plate.

In the above-described clamp tool driving device, it is necessary to displace the clamp drive shaft in the axial direction while rotating the clamp drive shaft together with the main shaft. For this purpose, a slide shaft slidably supported by a frame supporting the main shaft and a movable plate arranged at the lower end side of the main shaft and connected to the slide shaft so as to be displaced along the axial direction of the main shaft. The lower end of the clamp drive shaft is rotatably supported on the movable plate via a bearing, and the clamp drive shaft is driven in a direction to displace the clamp tool toward the unclamping position when the electromagnetic solenoid is excited. To provide a connecting member for connecting the output shaft of the electromagnetic solenoid and the slide shaft, and a spring for biasing the movable plate so as to displace the clamp tool toward the clamp position when the electromagnetic solenoid is deenergized,
It is preferable that the clamp drive mechanism is constituted by a slide shaft, a movable plate and a bearing, a connecting member, and a spring.

In a preferred aspect of the present invention, the rotating body rotatably supported by the fixed frame with the axis thereof oriented in the vertical direction, and the rotating body provided so as to pass through the axis of the rotating body. A main shaft rotatably supported via bearings on a movable frame provided so as to be capable of being displaced in the vertical direction while being freely rotatable through splines, and three main shafts provided radially at equal angular intervals. A holder body having an arm portion and a central portion attached to the upper end of the main shaft,
A wafer support portion provided at each of the distal ends of the three arm portions of the holder main body, wherein each wafer support portion receives the lower peripheral edge of the lower surface of the disk-shaped wafer from below; A wafer holder having a radial positioning portion that contacts the outer peripheral surface of the wafer and radially positions the wafer, a rotation driving mechanism that rotationally drives a rotating body to rotate the wafer holder together with the main shaft, An elevating mechanism for driving the movable frame in the vertical direction together with the main shaft, and at least three units for receiving the wafer held by the wafer holder when the wafer holder is lowered together with the main shaft and temporarily holding the outer peripheral portion of the wafer A temporary wafer holder and a notch sensor for detecting a notch formed on the outer peripheral portion of the wafer while the wafer held by the wafer holder rotates together with the wafer holder. Eclipsed.

In this case, the radial positioning portion provided on one wafer support portion of the wafer holder is brought into contact with the outer peripheral surface of the wafer to be supported and a clamp position for clamping the wafer, and an unclamping position for releasing the clamp. It is constituted by a clamp tool supported by the holder main body so as to be displaceable in the radial direction between the position and the position.

The clamp device driving device is provided so as to slidably penetrate the axis of the main shaft, and has a clamp driving shaft coupled to the main shaft via a spline, and a straight line in the thrust direction of the clamp driving shaft. A displacement transmitting mechanism for converting the displacement into a radial displacement and transmitting the displacement to the clamp tool, an electromagnetic solenoid having an output shaft for generating a linear displacement, and an output of the electromagnetic solenoid for displacing the clamp tool between the clamp position and the unclamping position; And a clamp drive mechanism for transmitting shaft displacement to the clamp drive shaft.

Also in this case, the displacement transmitting mechanism comprises a slide plate supported by the holder main body so as to be slidable in the radial direction of the wafer held by the wafer holder, and one end of which is connected to the clamp, and a main shaft. A link mechanism that is provided between the upper end of the clamp drive shaft protruding from the upper end and the other end of the slide plate and that converts linear displacement of the clamp drive member into radial displacement and transmits the displacement to the slide plate. it can.

Also, in the case of the above construction, the slide shaft slidably supported by the movable frame so as to slide along the axial direction of the main shaft, and the slide shaft disposed at the lower end of the main shaft and provided on the slide shaft. It is preferable to provide a connected movable plate and to support the lower end of the clamp drive shaft rotatably on the movable plate via a bearing.

In this case, a connecting member for connecting the output shaft of the electromagnetic solenoid and the slide shaft to drive the clamp drive shaft in a direction to displace the clamp tool toward the unclamping position when the electromagnetic solenoid is excited; A spring for urging the movable plate so as to displace the clamp tool toward the clamp position when the solenoid is deenergized is provided, and the slide shaft, the movable plate and the bearing, the connecting member, and the spring are used to clamp the movable plate. Preferably, a drive mechanism is provided.

[0035]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 16 show an embodiment of a notch aligning apparatus according to the present invention. FIG. 1 is a perspective view showing an appearance of an embodiment of the present invention, and FIG. It is a perspective view showing the state where it was held.

FIG. 3 is a perspective view showing one process when the robot hand moves toward the notch aligning device to receive the wafer held by the notch aligning device of FIG. 1, and FIG. FIG. 4 is a perspective view showing a state where the hand is inserted under a wafer held by a notch aligning device.

FIGS. 5A and 5B are sectional views showing the structure of a wafer supporting portion provided in the notch aligning apparatus.
FIGS. 6A and 6B are a cross-sectional view and a top view showing the structure of the wafer support shown in FIG. FIG. 7 is a longitudinal sectional view showing a state in which the main shaft is raised in one embodiment of the notch aligning device according to the present invention, and FIG. 8 is a longitudinal sectional view showing a state in which the main shaft is lowered in the embodiment.

FIG. 9 is a longitudinal sectional view showing a state in which the wafer is unclamped in the embodiment of the present invention by a plane different from that of FIGS. 7 and 8 by 90 degrees.
0 indicates a state in which the wafer is clamped in the same embodiment,
FIGS. 11 and 12 are enlarged cross-sectional views of main parts of FIGS. 9 and 10, respectively.

FIGS. 13A and 13B are a front view and a side view of a displacement conversion mechanism provided between a slide plate connected to a clamp and a clamp drive shaft in this embodiment, and FIGS. Is a sectional view of a clamp driving mechanism used in the embodiment of the present invention, and FIG. 15A is a front view showing a configuration of a detecting device used for detecting the upper limit position and the lower limit position of the spindle in the embodiment of the present invention. FIG. 15B is a front view of a main part showing a configuration of a detection device used for detecting the upper limit position and the lower limit position of the movable plate provided in the clamp driving device in the embodiment of the present invention, and FIG. 7A and 7B are a longitudinal sectional view and a transverse sectional view, respectively, showing a modified example of the displacement conversion mechanism provided between the clamp drive shaft and the slide plate in the embodiment of the present invention.

1 to 4, reference numeral 1 denotes a notch alignment apparatus according to the present invention, reference numeral 2 denotes a wafer, and reference numeral 3 denotes a hand of a wafer transfer robot.

The notch aligning device 1 includes a box-shaped housing 4
And a wafer holder 5 that is driven by a rotation drive mechanism and an elevating mechanism to perform a rotational motion and an elevating motion is disposed above the housing 4.

The illustrated wafer holder 5 is equiangularly spaced (1
Holder main body 6 having three arms 6A to 6C radially provided at intervals of 20 degrees) and wafer support parts 7A to 7A to 7A to 6A to 6C attached to tips of three arms 6A to 6C of holder main body 6, respectively. 7C.

In the upper part of one end of the housing 4, a recess 8a through which the wafer 2 held by the wafer holder 5 passes is provided.
Is attached. A notch sensor (not shown) composed of a laser light emitting element and a light receiving element which are vertically opposed to each other with the wafer 2 passing through the concave portion 8a therebetween is attached to the sensor holder 8.

The temporary holders 9A to 9C are mounted on the upper part of the housing 4. In these temporary holders, the notch 2n of the wafer 2 held by the wafer holder 5 happens to coincide with any position of the wafer support portions 7A to 7C, or is close to any one of the wafer support portions. When the notch 2n fails to be detected, or when the wafer holder 5 is in a direction in which the wafer holder 5 interferes with the robot hand 3 in a state where the position of the notch 2n is adjusted to the reference position and the wafer is stopped. In order to change the direction of the wafer holder 5, the wafer 2 is used to receive and temporarily hold the wafer 2 from the wafer holder 5.

The temporary wafer holders 9A to 9C are at 120 °
A pair of arms 10A and 10B which are arranged at intervals and are provided so as to protrude from both sides from a symmetrical position on the upper portion of the housing 4, and another temporary holding tool 9C is a concave portion of the sensor holding tool 8. 8a.

As shown in FIGS. 7 to 10,
A circular through hole 4b is formed at the center of the upper surface plate 4a of the housing 4.
Are formed. A fixed frame 11 fixed to the housing is disposed in the housing 4, and the fixed frame 11 has a hole 1 having a central axis oriented vertically.
1a is formed. The hole 11a is provided with its central axis aligned with the through hole 4b of the top plate of the housing. In the hole 11a, a substantially cylindrical rotating body 12 having a central axis oriented vertically is provided. Are rotatably supported via bearings 13.

The main shaft 14 is provided so as to penetrate the center of the rotating body 12 slidably in the axial direction. The main shaft 14 is coupled to the rotating body 12 via a ball spline so as to rotate integrally with the rotating body 12 while being freely displaceable in the axial direction. A toothed pulley 15 is fixed to the upper end of the rotating body 12 with a screw 16, and the fixed frame 11
A toothed belt 18 is stretched over a toothed pulley 17 and a pulley 15 attached to the upper end of a rotation shaft of a rotary drive motor 16 attached to the motor. The rotating body 12 and the main shaft 14 are rotationally driven by the rotation driving motor 16 via the pulleys 17 and 15 and the belt 18.

At the upper end of the main shaft 14 is attached a substantially cup-shaped coupling member 19 which is disposed with the opening thereof facing upward and the center axis is aligned with the center axis of the main shaft 14. The coupling member 19 has a boss 19a at the center thereof. The boss 19a is connected to the upper end of the main shaft 14, and the holder main body 6 is attached to the upper end of the coupling member 19. Holder body 6
Are arranged with their central axes aligned with the central axis of the main shaft 14, and the coupling member 19 is
Has been concluded.

A hole 6a (see FIGS. 9 and 10) is formed in the center of the holder main body 6 so that the components disposed in the coupling member 19 can be assembled and inspected. I have. The hole 6a is closed by a lid plate 21 fastened to the holder main body 6 by a screw 20 '.

The motor 16, the pulleys 15 and 17, and the belt 18 constitute a rotation drive mechanism 25 (see FIGS. 7 and 8) for rotating the rotating body 12 to rotate the wafer holder 5 together with the main shaft 14. Have been.

A movable frame 30 which is vertically displaced is disposed in the housing 4.
0 is connected to the main shaft 14 via a bearing 31.

In order to drive the movable frame 30, a screw rod 35 having a screw 35a in the lower half is disposed with its axis oriented vertically, and the screw rod 35 has a bearing 36A.
To 36C so as to be rotatably supported by the fixed frame 11. The screw portion 35 a of the screw rod 35 is screwed to a ball nut 38 attached to the movable frame 30.

An electric motor 40 for driving up and down is mounted on the fixed frame 11, and a pulley 41 with teeth is mounted on a rotating shaft of the electric motor 40. A toothed belt 43 is wound around a toothed pulley 41 and a toothed pulley 42 attached to the upper end of the screw rod 35, and the electric motor 40, the pulleys 41 and 42, the belt 43, the screw rod 35, and the nut 3
8 constitutes an elevating mechanism 45 that drives the movable frame 30 in the vertical direction together with the main shaft 14.

In this elevating mechanism, the motor 40 drives the screw rod 35 to rotate via the pulley 41, the belt 43 and the pulley 42. With the rotation of the screw rod, the movable frame 30 is moved up and down, the main shaft 14 is moved up and down together with the movable frame 30, and the wafer holder 5 is moved up and down. FIG. 7 shows a state in which the spindle 14 has been raised to the upper limit position, and FIG. 8 shows a state in which the spindle 14 has been lowered to the lower limit position.

The wafer 2 is held in a state of being received from below by the wafer supporting portions 7A to 7C of the wafer holder 5. The illustrated wafer 2 is a disc-shaped semiconductor wafer having a diameter of 300 [mm], and has a V-shaped notch (notch) 2n formed on the outer periphery thereof. It is chamfered around the circumference.

FIGS. 5A and 5B show the wafer support 7A.
7C shows the cross section of the wafer supported by 7C,
In the figure, 2a and 2b are the lower and upper surfaces of the wafer, 2c is the outer peripheral surface of the wafer, 2d and 2e are the lower and upper chamfered portions formed on the outer peripheral portion of the wafer, and 2f is the lower surface 2a of the wafer. An outer peripheral edge (a lower peripheral edge) forming a boundary between the chamfered portion 2d and an outer peripheral edge (an upper peripheral edge) forming a boundary between the upper surface 2b and the chamfered portion 2e of the wafer. It is.

When the wafer 2 is supported, only two parts are allowed to come into contact with each other: the outer peripheral surface 2c and the lower peripheral edge 2f. It is forbidden to bring a positioning member, a holding member, etc. into contact with 2d.

For this reason, each wafer supporting portion is provided with a wafer receiving portion R for receiving the lower peripheral edge 2f of the disc-shaped wafer 2 from below, and a radial position of the wafer 2 in contact with the outer peripheral surface 2c of the wafer 2. And a radial positioning portion D.

The wafer receiving portion R holds the wafer 2 with respect to the horizontal plane.
The wafer 2 is received from below by making the lower surface side outer peripheral edge portion 2f of the wafer 2 linearly contact the inclined positioning surface Ra at a portion having an annular inclined positioning surface Ra inclined with a smaller inclination angle than the chamfered portion 2d. .

The radial positioning portion D is provided with a wafer receiving portion R
Outer peripheral surface 2c of wafer 2 received and supported on
Is positioned along the cylindrical surface, and the wafer 2 is positioned in the radial direction by bringing the positioning surface Da into contact with the outer peripheral surface 2c of the wafer 2.

As shown in FIG. 5A, the wafer supporting portions 7B and 7C are composed of a member 701 integrally having a wafer receiving portion R and a radial positioning portion D.
Are fixed to the tips of the arms 6B and 6C. These two
By bringing the outer peripheral surface 2c of the wafer 2 into contact with the positioning surface Da of the radial positioning portion D of the two wafer support portions 7B and 7C, the center of the wafer 2 can be matched with the reference center position. I have.

As shown in FIG. 5 (B), the wafer receiving portion R of the other one of the wafer supporting portions 7A has an inclined positioning surface Ra at the upper end and has a tip of the arm portion 6A of the holder main body 6. And a support member 702 fixed to the support member 702. Further, the radial positioning portion D of the wafer support portion 7A moves in the radial direction of the wafer between a clamp position where the wafer 2 to be supported is in contact with the outer peripheral surface of the wafer 2 to clamp the wafer and an unclamping position where the clamp is released. It is composed of a clamp 703 supported by the holder main body so as to be displaceable along. The clamp member 703 is a solid member having a positioning surface Da on the front surface that abuts against the outer peripheral surface 2c of the wafer 2 to be supported, and is a U-shaped frame member 601 attached to the tip of the arm 6A. Are arranged in a state capable of being displaced by a predetermined distance in the radial direction of the wafer 2 to be supported.

In this embodiment, FIGS. 5B and 6
As shown in (A), a guide groove 602 extending in the radial direction is formed at a lower portion of the arm portion 6A of the holder body 6, and
The slide plate 50 is slidably fitted in the guide groove 602, and a clamp 703 is attached to the tip of the slide plate 50.
Has been fixed. In order to hold the slide plate 50 in the guide groove 602, a holding plate 51 is screwed to the lower surface of the arm 6A. The slide plate 50 slides on the holding plate 51 and reciprocates in the radial direction of the wafer 2 to be supported.

In the illustrated example, the end wall 60 of the frame member 601 is
1a is a stopper of the clamp tool 703. As shown in FIG. 5B, the clamping tool 703 has its positioning surface Da in contact with the outer peripheral surface 2c of the wafer 2 and the outer peripheral surface 2c.
c and the positioning position D
a is displaced between an unclamping position in which a is separated from the outer peripheral surface 2 c of the wafer 2.

As shown in FIG. 9 to FIG.
The clamp drive shaft 52 is provided so as to slidably penetrate the shaft center portion of No. 4. The clamp drive shaft 52 is
It is coupled to the main shaft 14 via a spline so that it can be displaced in the axial direction while rotating integrally with the shaft 4.
The lower end of the clamp drive shaft 52 is coupled to a movable plate 53 disposed below the movable frame 30 via a bearing 54,
The upper end of the clamp drive shaft 52 is introduced into the coupling member 19.

The displacement of the clamp drive shaft 52 in the axial direction is
A displacement conversion mechanism shown in FIG. 13 is provided in the coupling member 19 in order to convert the wafer into a radial displacement of the wafer to be supported and transmit the same to the slide shaft 50. In the illustrated example, a bracket 55 is fixed in the coupling member 19, an intermediate portion of an L-shaped link 56 is supported by the bracket 55 via a pin 57, and one end of the link 56 is connected to the clamp drive shaft 52. The upper end is connected via a pin 58. The other end of the link 56 is connected via a pin 60 to a connecting member 59 fixed to the rear end of the slide plate 50. A displacement converting mechanism (which converts the upper-limit displacement of the clamp drive shaft 52 into a radial displacement of the wafer 2 to be supported and transmits the displacement to the slide plate 50 by the link 56, the pins 57, 58 and 60, and the connecting member 59. In this example, a link mechanism 61 is configured. The displacement converting mechanism 61 and the slide plate 50 convert the linear displacement of the clamp drive shaft 52 along the axial direction of the main shaft 14 into a radial displacement of the wafer 2 to be supported and transmit the displacement to the clamp fixture 703. A transmission mechanism is configured.

In the present invention, an electromagnetic solenoid 70 as shown in FIG. 14 is used to drive the clamp 703. The electromagnetic solenoid 70 includes an exciting coil (not shown) and a movable core that generates displacement when the exciting coil is excited. The output shaft 70 is connected to the movable core.
It is attached to the movable frame 30 with a facing upward.

A slide shaft 71 whose axis is oriented vertically is slidably supported on the movable frame 30 in the vertical direction. The slide shaft 71 and the output shaft 7 of the electromagnetic solenoid 70 are also supported.
0a is connected via a connecting member 72. The lower end of the slide shaft 71 is connected to the movable plate 53, and the slide shaft 7
The movable frame 30 and the movable plate 5
3 in a compressed state. Spring 73
As a result, the movable plate 53 is constantly urged downward.

The illustrated electromagnetic solenoid 70 is configured to displace its output shaft 70a upward when excited. When the electromagnetic solenoid 70 is excited and its output shaft 70a is displaced upward, the slide shaft 71
3, the clamp drive shaft 52 is displaced upward together with the movable plate 53. Since the displacement of the clamp drive shaft 52 is transmitted to the slide plate 50 via the conversion mechanism 61, the slide plate 50 is displaced to the outer diameter side of the wafer 2 to displace the clamp tool 703 to the unclamping position side. FIGS. 10 and 12 show a state in which the movable plate 53 and the clamp drive shaft 52 are driven to the upper limit position by the excitation of the electromagnetic solenoid 70, and the clamp 703 is displaced to the extreme position on the unclamping position side. ing.

When the electromagnetic solenoid 70 is deenergized, the clamp drive shaft 52 is displaced downward by the urging force of the spring 73. When the clamp drive shaft 52 is displaced downward, the slide plate 50 to which the displacement of the clamp drive shaft 52 is transmitted via the displacement transmission mechanism 61 is displaced radially inward of the wafer 2. As a result, the clamp tool 703 is displaced to a clamp position where the clamp tool 703 comes into contact with the outer peripheral surface 2c of the wafer 2, and the wafer 2 is clamped. 9 and 1
1 shows a state where the electromagnetic solenoid 70 is deenergized and the clamp drive shaft 52 and the movable plate 53 are displaced to the lower limit position. The clamping force of the clamp member 703 is given only by the urging force of the spring 73.

As described above, in the present embodiment, the driving force of the electromagnetic solenoid 55 is used to displace the clamp member 703 to the unclamping position, and the urging force of the spring 73 is used to displace the clamp member 703 to the clamp position. Used for

In the illustrated example, the electromagnetic solenoid 70 is used to displace the clamp tool between the clamp position and the unclamping position by the connecting member 72, the slide shaft 71, the movable plate 53, the bearing 54, and the spring 73. Drive mechanism 7 for transmitting the linear displacement of the output shaft to the clamp drive shaft 52
5 are configured.

The electromagnetic solenoid 70, the clamp drive mechanism 75, the clamp drive shaft 52, and the axial displacement of the clamp drive shaft are converted into the radial displacement of the wafer and transmitted to the clamp 703. The displacement transmitting mechanism transmits the displacement of the output shaft of the electromagnetic solenoid 70 to the clamp 703 through the clamp drive shaft (clamp drive member) 52 penetrating the shaft of the main shaft, and moves the clamp to the clamp position and unclamps. A clamp tool driving device for displacing the position is formed.

A position detecting device shown in FIG. 15A is provided to detect the upper limit position and the lower limit position of the movable frame 30 and to control the energization of the lifting motor 40. The position detecting device detects dogs 80 and 81 attached to the movable frame 30 and a detection signal indicating that the movable frame 30 has reached the upper limit position by detecting the dog 80 when the movable frame 30 reaches the upper limit position. The position sensor 82 generates a position sensor 83 that detects the dog 81 when the movable frame reaches the lower limit position and generates a detection signal indicating that the movable frame has reached the lower limit position. The position sensors 82 and 83 are attached to the fixed frame 11 by appropriate means.

In order to detect whether the clamp member 703 is in the clamp position or the unclamping position, FIG.
A position detecting device as shown in FIG. This position detecting device includes a dog 8 attached to the movable plate 53.
5 and 86, and a position sensor that detects a dog 85 when the movable plate 53 reaches the upper limit position and the clamp device reaches the unclamping position and generates a detection signal indicating that the clamp device has reached the unclamping position. 87, and a position sensor 88 which detects a dog 86 when the movable plate 53 reaches the lower limit position and the clamp reaches the clamp position, and generates a detection signal indicating that the clamp has reached the clamp position. ing. The position sensor 87 is attached to the movable frame 30, and the position sensor 88 is attached to a lower end of a fixture 89 having an upper end fixed to the movable frame 30.

In the above notch aligning apparatus 1, the elevating mechanism 45 moves the wafer holder 5 to the temporary holders 9A to 9A.
C can be raised to a position that does not interfere with C.

When performing notch alignment of the wafer, the electromagnetic solenoid 70 is excited to displace the clamp 703 to the unclamping position, and the wafer holder 5 is moved to the temporary holders 9A to 9A.
The wafer 2 held on the hand 3 (see FIGS. 3 and 4) of the wafer transfer robot is transferred above the wafer supporters 7A to 7C in a state where the wafer 2 is raised to a position where it does not interfere with C. When the wafer 2 reaches a position where the wafer 2 is aligned with the wafer supports 7A to 7C, the hand 3 is lowered to release the clamp of the hand 3, and the wafer 2 is moved to the wafer supports 7A to 7C.
Pass to. At this time, the outer peripheral surface 2c of the wafer 2 is dropped inside the radial positioning portion D, and the lower peripheral edge 2f of the lower surface of the wafer 2 is placed on the receiving portion R of the wafer support portions 7A to 7C. Next, the electromagnetic solenoid 70 is deenergized, and the clamp 703 is displaced toward the clamp position by the urging force of the spring 73. Thus, the clamping tool 703 is brought into contact with the outer peripheral surface 2c of the wafer 2 to clamp the wafer 2. At this time, since the wafer 2 is brought into contact with the radial positioning portions D of the two wafer supporting portions 7B and 7C whose mounting positions have been accurately adjusted in advance, the wafer 2 is automatically automatically adjusted so that the center of the wafer 2 matches the reference position. Positioned.

After the wafer 2 is held by the wafer holder 5 so that the center thereof coincides with the reference position as described above, the electric motor 16 is driven to rotate the main shaft 14 to rotate the wafer 2. In the process of rotating the wafer 2, a notch sensor detects a notch 2n formed on the outer periphery of the wafer 2.
When the position of the notch 2n is detected, the wafer holder 5 is rotated and stopped so that the detected position of the notch 2n matches the reference position.

When the position of the notch 2n happens to coincide with any position of the wafer supporting portions 7A to 7C,
When the position of n cannot be detected, the elevator motor 40 is driven to lower the main shaft 14, the electromagnetic solenoid 70 is excited, and the wafer 2 is unclamped.
The wafer 2 is temporarily held by the temporary holders 9A to 9C. The temporary holding units 9A to 9C are provided on the wafer supporting units 7B and 7C.
Similarly, the outer peripheral surface 2c of the wafer 2 and the lower peripheral edge 2f
And a structure for holding the wafer in contact with only two places.

After holding the wafer 2 on the temporary holders 9A to 9C, the main shaft 14 is further lowered to lower the wafer holder 5 to a position where the wafer 2 is not interfered with the wafer 2 held on the temporary holder. The motor 16 is rotated to rotate the wafer holder 5 by a predetermined fixed angle. As a result, the wafer supports 7A to 7C are shifted from the position of the notch 2n, and the notch position can be detected. Thereafter, the main shaft 14 is raised to raise the wafer support 5, and the temporary holders 9A to 9A are moved.
C, the wafers temporarily held on the wafer supporting portions 7A to 7C
, And deenergize the electromagnetic solenoid 70 to clamp the wafer 2. Thereafter, the spindle 14 is further raised to raise the wafer holder 5 to a position where it does not interfere with the temporary holders 9A to 9C, and the wafer holder 5 is rotated at that position to detect the notch 2n.

After the position of the notch 2n is detected, the motor 16 is stopped and the wafer holder 5 is stopped with the detected position of the notch coincident with the reference position. When the position of the wafer holder 5 is at a position where it interferes with the hand 3 of the robot that receives the wafer 2 while the wafer holder is stopped in this way, the case where the position of the notch is not detected is as follows. Similarly, after the main shaft 14 is lowered to temporarily hold the wafer 2 on the temporary holders 9A to 9C, the wafer holder 5 is rotated by a predetermined angle so that the wafer holder 5 does not interfere with the robot hand 3 (for example, (Direction shown in FIG. 4). Thereafter, the spindle 14 is raised to hold the wafer 2 on the wafer holder 5, and the electromagnetic solenoid 70
Is deenergized and the clamp 703 is displaced to the clamp position, and then the spindle 14 is further raised to stop the wafer 2 at a position where it does not interfere with the robot hand. In this state,
The wafer is unclamped by exciting the electromagnetic solenoid 70, and the robot hand 3 is inserted below the wafer 2 as shown in FIG. After the hand 3 is lifted to transfer the wafer 2 to the hand 3, the hand 3 is retracted and the wafer is transferred to the next step.

As described above, the radial positioning portion D of one wafer support portion 7A is constituted by the clamp 703, and the clamp drive shaft (which is formed by penetrating the axis of the main shaft 14 for rotating the wafer holder 5). If the structure is such that the driving force of the electromagnetic solenoid 70 is transmitted to the clamp member 703 through the (clamp drive member) 52, without using a vacuum suction force,
The wafer 2 can be clamped or unclamped with a simple structure.

When the electromagnetic solenoid 70 is used as a drive source of the clamp device as described above, it is not necessary to provide a vacuum pump and piping and valves for supplying a vacuum. The size can be reduced.

Further, as described above, if the outer peripheral surface of the wafer 2 is clamped by the clamp, the wafer which is not allowed to be brought into contact with the outer peripheral portion on both the front and back surfaces can be clamped without any problem. it can.

In the above example, the mechanism for converting the displacement of the clamp drive shaft 52 into the radial displacement of the wafer is shown in FIG.
Although the link mechanism shown in FIG. 1 is used, another displacement conversion mechanism can be used. For example, as shown in FIG. 16, a rack 52 a is formed at the upper end of the clamp drive shaft 52, this rack is engaged with a pinion 90 rotatably supported by the coupling member 19, and formed at the rear end of the slide plate 50. The racks 50a1 and 50a1 formed on the lower surface of the forked portion 50a may be engaged with the pinion 90.

As shown in FIG. 16, when a displacement conversion mechanism is constituted by a rack and a pinion, the clamp drive shaft 52 is moved upward by exciting the electromagnetic solenoid 70 and displacing its output shaft upward. When displaced,
The slide plate 50 is displaced to the outer diameter side of the wafer, and the clamp 703 is displaced to the unclamping position. When the electromagnetic solenoid 70 is deenergized and the clamp drive shaft 52 is displaced downward by the urging force of the spring 73, the slide plate 50 is displaced toward the inner diameter side of the wafer, and the clamp fixture 703 is displaced toward the clamp position. .

In the above example, the clamp 703 is displaced to the unclamping position when the electromagnetic solenoid 70 is excited. However, the electromagnetic solenoid 70 is of a type in which the output shaft 70a is retracted when excited. A spring for returning the output shaft 70a of the electromagnetic solenoid to the forward position is provided, and the clamp 703 is displaced to the clamp position when the electromagnetic solenoid 70 is excited, and is clamped when the electromagnetic solenoid 70 is deenergized. The tool 703 may be displaced to the unclamping position. In this case, in order to prevent excessive force from being applied to the wafer 2, the slide shaft 71 is slidably coupled to the movable plate 53, and the movable shaft is moved via the spring 73 when the output shaft of the electromagnetic solenoid 70 is retracted. Preferably, 53 is driven downward.

In order to stably support a wafer, as shown in the above example, three wafer support portions 7A
7C is preferably provided to support the wafer at three points, but the present invention does not prevent the provision of more wafer support portions on the wafer holder.

In the above example, the clamp is provided on one of the plurality of wafer supports, but the clamp may be provided on each of the plurality of wafer supports.

[0090]

As described above, according to the present invention, at least one of the radial positioning portions of the wafer support portion is constituted by the clamp tool, and the axial center portion of the main shaft for rotating the wafer holder is penetrated. The structure is such that the driving force of the electromagnetic solenoid is transmitted to the clamping device through the clamp driving member, which allows the wafer to be clamped and unclamped with a simple structure without using vacuum suction force. Is obtained.

Further, according to the present invention, since the electromagnetic solenoid is used as a driving source of the clamp device, the necessity of providing a vacuum pump, piping and valves for supplying vacuum is eliminated, and the configuration of the device is simplified. In addition, the size of the device can be reduced.

Further, in the present invention, since the outer peripheral surface of the wafer is clamped by the clamp, a wafer for which the clamp is not allowed to contact the outer peripheral portion on both the front and back surfaces can be clamped without any problem.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an appearance of an embodiment of a notch alignment device according to the present invention.

FIG. 2 is a perspective view showing a state where a wafer is held by the notch aligning device of FIG. 1;

FIG. 3 is a perspective view showing one process when a robot hand moves toward the notch aligning device to receive a wafer held by the notch aligning device of FIG. 1;

4 is a perspective view showing a state where a hand of the robot is inserted under a wafer held by the notch aligning device of FIG. 1;

FIGS. 5A and 5B are cross-sectional views showing the structure of a wafer support used in the embodiment of the present invention.

6 (A) and (B) are a front view and a plan view, respectively, showing the structure of the wafer support section of FIG. 5 (B).

FIG. 7 is a longitudinal sectional view showing a state where a main shaft is raised in one embodiment of the present invention.

FIG. 8 is a longitudinal sectional view showing a state where a main shaft is lowered in one embodiment of the present invention.

FIG. 9 is a vertical cross-sectional view showing a state where the wafer is unclamped in the embodiment of the present invention by a plane which is different from the cross sections of FIGS. 6 and 7 by 90 degrees.

FIG. 10 is a longitudinal sectional view showing a state in which the wafer is clamped in the embodiment of the present invention by a plane different from that of FIGS. 7 and 8 by 90 degrees.

FIG. 11 is an enlarged view of a main part of FIG. 9;

FIG. 12 is an enlarged view of a main part of FIG. 10;

FIGS. 13A and 13B are a front view and a side view of a displacement conversion mechanism provided between a slide plate connected to a clamp and a clamp drive shaft in the present embodiment, respectively.

FIG. 14 is a sectional view of a clamp drive mechanism used in the embodiment of the present invention.

FIG. 15A is a front view showing a configuration of a detecting device used to detect an upper limit position and a lower limit position of a spindle in the embodiment of the present invention, and FIG. It is the front view of the principal part which showed the structure of the detection apparatus used for detecting the upper limit position and the lower limit position of the movable plate provided in an apparatus.

16A and 16B are a longitudinal sectional view and a cross-sectional view, respectively, showing a modification of a displacement conversion mechanism provided between a slide plate connected to a clamp and a clamp drive shaft in the embodiment of the present invention. FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Wafer notch alignment apparatus, 2 ... Wafer, 3 ... Robot hand, 4 ... Housing, 5 ... Wafer holder, 6 ...
Main body of holder, 6A to 6C: arm portion of main body of holder, 7A to 7
C: Wafer support, R: Wafer receiving part, D: Radial positioning part, 703: Clamping tool, 9A to 9C: Wafer temporary holding tool, 11: Fixed frame, 30: Movable frame, 14 ...
Main shaft, 19: coupling member, 25: rotary drive mechanism,
31 ... bearing, 45 ... elevating mechanism, 50 ... slide plate, 52
... Clamp drive shaft, 53 ... Movable plate, 54 ... Bearing, 61 ...
Displacement conversion mechanism, 70: electromagnetic solenoid, 71: slide shaft, 73: spring.

 ────────────────────────────────────────────────── ─── Continued on the front page F term (reference) 5F031 CA02 FA12 HA05 HA24 HA27 HA29 HA58 HA59 JA01 JA02 JA05 JA14 JA15 JA28 JA32 JA35 KA02 KA11 KA14 LA06 LA12 LA13 LA14 LA16

Claims (8)

[Claims] 1. A center portion at an upper end of a vertically extending main shaft having a plurality of wafer supporting portions for receiving and supporting the outer peripheral portion of a disk-shaped wafer from below at a plurality of positions spaced apart in the circumferential direction. Is mounted, a rotation drive mechanism that rotates the main shaft to rotate the wafer holder, and a process of rotating the wafer held by the wafer holder together with the wafer holder. A notch sensor for detecting a notch formed on the outer periphery, the notch alignment device for a wafer performing an operation of aligning the position of the notch of the wafer detected by the notch sensor with a reference position, provided on the wafer holder Each of the wafer support portions is provided with a wafer receiving portion for receiving the outer peripheral edge of the lower surface of the wafer from below and an outer peripheral surface of the wafer received by the wafer receiving portion. A radial positioning portion for radially positioning the wafer, wherein the radial positioning portion provided on at least one of the plurality of wafer support portions contacts an outer peripheral surface of a wafer to be supported. An electromagnetic solenoid which is provided so as to be displaceable along a radial direction of the wafer between a clamp position where the wafer comes into contact with and clamps the wafer and an unclamping position where the clamp is released. A clamp tool driving device for transmitting the displacement of the output shaft to the clamp tool through a clamp drive member penetrating the shaft center of the main shaft, and displacing the clamp tool to the clamp position and the unclamping position. A notch aligning device for a wafer. 2. A wafer holding device having a central portion attached to an upper end of a vertically extending main shaft having at least three wafer supporting portions for receiving and supporting an outer peripheral portion of a disk-shaped wafer from below at equal angular intervals. Tool, a rotation drive mechanism for rotating the main shaft to rotate the wafer holder, and a notch formed on the outer periphery of the wafer in the process of rotating the wafer held by the wafer holder together with the wafer holder. A notch sensor for detecting a position of the notch of the wafer, the notch aligning device for performing an operation of aligning the position of the notch of the wafer detected by the notch sensor with a reference position, wherein each wafer supporting portion provided on the wafer holder A wafer receiving portion for receiving the lower peripheral edge of the lower surface of the wafer from below, and the wafer contacting the outer peripheral surface of the wafer received by the wafer receiving portion. A radial positioning portion for radially positioning c, wherein the radial positioning portion provided on at least one wafer support portion of the wafer holder abuts against an outer peripheral surface of a wafer to be supported, and And a clamp tool supported by the wafer holder in a state where the clamp tool can be displaced along the radial direction of the wafer between a clamp position where the clamp state is clamped and an unclamped position where the clamp is released. A clamp drive shaft provided so as to be slidably penetrating the axis of the main shaft, and supported so as to be able to rotate together with the main shaft; and converting the axial displacement of the clamp drive shaft into the radial displacement. A transmission mechanism for transmitting the clamp tool to the clamp tool, an electromagnetic solenoid having an output shaft for generating a linear displacement, and moving the clamp tool to the clamp position and the unclamping position. The purpose of displacing the bets, the clamp member driving device including a clamp drive mechanism for transmitting the linear displacement of the output shaft of the electromagnetic solenoid in the clamp drive shaft is provided, notch alignment device wafer according to claim. 3. A holder main body having three arms provided radially at equal angular intervals, and an outer peripheral portion of a disk-shaped wafer provided at each end of the three arms of the holder main body. A wafer holder having three wafer supporting portions for receiving and supporting the holder from below, and a central portion of the holder main body attached to an upper end of a main shaft extending in a vertical direction; and a wafer holder for rotating the wafer holder. A rotating drive mechanism that rotationally drives a main shaft; and a notch sensor that detects a notch formed on the outer periphery of the wafer while the wafer held by the wafer holder rotates together with the wafer holder. In a wafer notch aligning device that performs an operation of aligning a position of a notch of the wafer detected by a sensor with a reference position, each wafer supporting portion provided on the wafer holder may include: A wafer receiving portion for receiving the outer peripheral edge of the lower surface side of the lower surface from below, and a radial positioning portion for radially positioning the wafer in contact with the outer peripheral surface of the wafer received by the wafer receiving portion; The radial positioning portion provided on one of the wafer support portions of the tool radially moves between a clamp position for abutting the outer peripheral surface of the wafer to be supported and clamping the wafer and an unclamping position for releasing the clamp. A clamp drive shaft, which is provided so as to be slidably penetrated through the axis of the main shaft and is supported so as to rotate with the main shaft, in the axial direction of the main shaft. An electromagnetic solenoid having a displacement transmission mechanism for converting a linear displacement of the clamp drive shaft along the same into the radial displacement and transmitting the displacement to the clamp tool, and an output shaft for producing a linear displacement And a clamp drive mechanism for transmitting a linear displacement of an output shaft of the electromagnetic solenoid to the clamp drive shaft so as to displace the clamp tool between the clamp position and the unclamping position. A notch aligning device for a wafer. 4. A slide plate supported by the wafer holder so as to be slidable in a radial direction of a wafer held by the wafer holder and having one end connected to the clamp, wherein the displacement transmitting mechanism includes: The clamp drive shaft is provided between an upper end of the clamp drive shaft protruding from an upper end of the main shaft and the other end of the slide plate, and converts a linear displacement of the clamp drive shaft into a radial displacement and transmits the displacement to the slide plate. The wafer notch aligning device according to claim 2 or 3, comprising a link mechanism. 5. A slide shaft slidably supported by the movable frame so as to be displaced along an axial direction of the main shaft, and a movable plate disposed at a lower end of the main shaft and connected to the slide shaft. Is provided, the lower end of the clamp drive shaft is rotatably supported on the movable plate via a bearing, and the clamp tool is displaced toward the unclamping position when the electromagnetic solenoid is excited. A connecting member that connects the output shaft of the electromagnetic solenoid and the slide shaft to drive the clamp drive shaft;
A spring for urging the movable plate so as to displace the clamp tool toward the clamp position when the electromagnetic solenoid is deenergized; provided with the slide shaft, the movable plate and the bearing, The wafer notch aligning device according to claim 4, wherein the member and the spring constitute the clamp drive mechanism. 6. A rotating body rotatably supported by a fixed frame with its axis oriented in a vertical direction; and a rotating body provided through a shaft of the rotating body through a spline. It has a main shaft rotatably supported via bearings on a movable frame provided so as to be freely displaceable in the thrust and capable of being displaced in the vertical direction, and has three arms provided radially at equal angular intervals. A holder body having a central portion attached to the upper end of the main shaft,
A wafer support provided at each of the distal ends of the three arms of the holder main body, wherein each wafer support is
A wafer holder having a wafer receiving portion that receives the lower peripheral edge of the lower surface of the disc-shaped wafer from below, and a radial positioning portion that contacts the outer peripheral surface of the wafer and radially positions the wafer; A rotation drive mechanism for rotating the rotating body to rotate the wafer holder together with the main shaft, an elevating mechanism for driving the movable frame in the vertical direction together with the main shaft, and when the wafer holder is lowered together with the main shaft. And at least three temporary wafer holders for receiving the wafer held by the wafer holder and temporarily holding the outer periphery of the wafer, and the wafer held by the wafer holder rotating together with the wafer holder. A notch sensor for detecting a notch formed on the outer peripheral portion of the wafer in the process, and provided on one of the wafer holders of the wafer holder. The radial positioning portion is configured to be capable of displacing along the radial direction between a clamp position for abutting an outer peripheral surface of a wafer to be supported and clamping the wafer and an unclamping position for releasing the clamp, and A clamp tool supported by a main body, provided in a state where the shaft portion of the main shaft is slidably penetrated, and a clamp drive shaft coupled to the main shaft via a spline; and a thrust direction of the clamp drive shaft. A displacement transmission mechanism that converts the linear displacement of the clamp into the radial displacement and transmits the displacement to the clamp tool, an electromagnetic solenoid having an output shaft that generates a linear displacement, and moving the clamp tool to the clamp position and the unclamping position. And a clamp drive mechanism for transmitting a linear displacement of the output shaft of the electromagnetic solenoid to the clamp drive shaft for displacement. It is provided, notch alignment device wafer according to claim. 7. A slide plate supported by the holder main body so as to be slidable in a radial direction of a wafer held by the wafer holder and one end of which is connected to the clamp, wherein the displacement transmitting mechanism includes: A linear displacement of the clamp driving member, which is provided between an upper end of the clamp drive shaft protruding from an upper end of the main shaft and the other end of the slide plate, is converted into the radial displacement and transmitted to the slide plate. The wafer notch aligning apparatus according to claim 6, comprising a link mechanism. 8. A slide shaft slidably supported by the movable frame so as to be displaced along an axial direction of the main shaft, and a movable plate disposed at a lower end of the main shaft and connected to the slide shaft. Is provided, the lower end of the clamp drive shaft is rotatably supported on the movable plate via a bearing, and the clamp tool is displaced toward the unclamping position when the electromagnetic solenoid is excited. A connecting member that connects the output shaft of the electromagnetic solenoid and the slide shaft to drive the clamp drive shaft;
A spring for urging the movable plate so as to displace the clamp tool toward the clamp position when the electromagnetic solenoid is deenergized; wherein the slide shaft, the movable plate and the bearing, 8. The wafer notch aligning apparatus according to claim 6, wherein the clamp driving mechanism is configured by a member and the spring.