JP2000252253A - Centrifugal processing equipment for semiconductor material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a centrifugal processing equipment wherein a semiconductor material is surely pressed and held from the time when a material receiver is rotated till it is entirely stopped, while the position of semiconductor material is specifically regulated when the rotation stops for improved reliability during delivery. SOLUTION: A material receiver 1 which is fitted to a rotative main axis 3 and in which a semiconductor material X is carried and born, and a holding mechanism 2 which presses and holds the semiconductor material X born with the material receiver 1 for allowed association/dissociation, are provided. A rising/falling axis 12 is penetrated at the internal axial core of the rotative main axis 3 while a holding mechanism 2 is connected to the upper end of the rising/falling axis 12. The holding mechanism 2 comprises a chuck member 2-1 which, pivotally attached to the material receiver 1, presses and holds the edge part of the semiconductor material X and changes attitude to almost vertical one and diagonally upward one with a pivot part P for releasing the holding state, and a connecting means 2-2 which is fitted to the upper end side of the rising/falling access 12 and operates the chuck member 2-1 toward the attitudes while interlocked with vertical movement of the rising/falling axis 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to cleaning, etching, and chemical treatment of semiconductor materials such as semiconductor silicon wafers, glass substrates, and electronic components such as ICs and transistors using a processing solution such as a chemical solution. Surface treatment, etc., or after washing with water through a washing process to wash off dust, organic or inorganic residues, etc. adhered to the surface in the manufacturing process of these various semiconductor materials, and then adhere to the surface of the semiconductor material. The present invention relates to a centrifugal processing apparatus for semiconductor material that removes water droplets that have been shaken off by using centrifugal force. In particular, a single semiconductor material is horizontally mounted and held so as not to rattle or move due to centrifugal force. The present invention relates to an improvement in a so-called single-wafer processing apparatus that performs processing one by one in a state.

[0002]

2. Description of the Related Art Conventionally, various types of structures have been invented and proposed as a holding structure for holding a semiconductor material in such a centrifugal processing apparatus so that the semiconductor material does not rattle or move due to centrifugal force. For example, in a processing container, a material receiver configured to receive and load the semiconductor material horizontally is fixed to a rotating spindle and rotatably installed. The material receiver has an edge of the semiconductor material by centrifugal force. 2. Description of the Related Art A centrifugal processing device having a holding mechanism in which chuck members for holding and holding a portion are provided at several locations around the device is known.

[0003]

However, in the above-described centrifugal processing apparatus in which the semiconductor material conveyed and loaded onto the material receiver is processed while being held down by centrifugal force, the rotation of the material receiver starts to rotate. To the required speed (rp
Otherwise, the holding force of the chuck member does not act on the semiconductor material. That is, during the period from the start of rotation to the required number of rotations at which the holding force of the chuck member acts, the semiconductor material rattles or moves on the material receiver. There is a problem that dust is generated from a sliding contact portion with the receiver. Further, when the processing operation is completed and the rotation of the material receiver is reduced to the number of rotations at which the holding force of the chuck member does not act on the semiconductor material, the holding force of the semiconductor material is released at that point. As described above, the semiconductor material rattles or moves on the material receiver from the time when the material is released until the rotation of the material receiver stops, and dust is generated from the sliding contact portion with the material receiver. I do.

Therefore, as a solution to such a problem, the material receiver is conventionally provided with a holding mechanism which presses and holds the semiconductor material loaded and received on the material receiver before the material receiver starts rotating. In such a conventional processing apparatus, for example, the chuck member is moved from an upright posture in which the above-mentioned chuck member presses and holds the semiconductor material to an upwardly inclined position to release the holding state. Since the drive mechanism for mechanically operating the material receiver is directly provided on the lower surface of the material receiver, not only the structure around the material receiver is complicated and larger, but also the center of gravity is located on the upper side of the rotating spindle to which the material receiver is fixed. Skew, and as a result, the rotation balance of the material receiver including the rotating spindle is affected, and satisfactory processing cannot be expected. In addition, there has been a demand for improvement over many years, such as a decrease in production yield.

[0005] The present invention has been made in view of such a conventional situation, and its object is to prevent the rotation balance of the material receiver from being disrupted, from the time when the rotation starts, and to completely stop the rotation. The semiconductor material can be securely held and held until the time when it is rotated, and the position of the semiconductor material is uniquely regulated when the rotation stops due to the end of the processing work in the semiconductor material manufacturing process, thereby improving the reliability at the time of unloading. It is an object of the present invention to provide a semiconductor material centrifugal processing apparatus which can be expected.

[0006]

In order to achieve the object, the present invention is directed to a rotating spindle which is fixed to the upper end side of a rotating spindle so as to be horizontally rotatable.
A material receiver on which the semiconductor material is horizontally loaded and received, and a holding mechanism that presses and holds an edge of the semiconductor material mounted on the material receiver around the material receiver so as to be able to come and go,
An elevating shaft is inserted through the inner shaft of the rotating main shaft in a penetrating manner, and the holding mechanism is connected to a projecting upper end of the elevating shaft, and the holding mechanism is mounted on a material receiver, and the material A chuck member that presses and holds the edge of the semiconductor material at several places around the receiver, and changes the attitude to a substantially vertical posture and a substantially upward oblique posture with a shaft attachment portion with the material receiver as a fulcrum to release the held state, Connecting means fixed to the upper end side of the elevating shaft protruding through the material receiver and operating the chuck members to the respective postures in conjunction with the up and down movement of the elevating shaft. Is the gist. Further, the material receiver is fixed to an upper end of a rotating main shaft protruding from a bottom portion of the processing container, and is horizontally rotatably installed in the processing container. According to such a technical means, the vertical movement in conjunction with the vertical movement of the elevating shaft, and the movement about the shaft attachment portion of the chuck member that changes the posture to a substantially upward oblique posture, on the material receiver, After the loaded semiconductor material is held down, the rotation of the material receiver can be activated. Further, the holding state by the chuck member can be continuously maintained until the processing operation in the manufacturing process of the semiconductor material is completed and the rotation of the material receiver is completely stopped.

The gist of the invention is that the lower end of the elevating shaft is connected via a rotary union to an elevating machine installed in an apparatus frame supporting the processing vessel. According to such a technical means, the connection of the elevating shaft to the elevator is kept free by the connection with the elevator by the rotary union.

The gist is that a part of the connecting means fixedly supported on the upper end side of the elevating shaft is penetratingly connected to the material receiver so as to be vertically movable. According to such technical means, as described above, in addition to the free connection relationship with the elevator, the lifting shaft is partially connected to the upper end side,
It is linked to a material receiver fixedly supported on the rotating spindle. That is, since the elevating shaft and the rotating main shaft are connected to each other via the material receiver and the connecting means, the elevating shaft is rotated together with the rotating main shaft.

[0009]

Embodiments of the present invention will be described with reference to the drawings. 1 to 5 show an embodiment of a centrifugal processing apparatus according to the present invention. Reference numeral 1 denotes a material receiver which is fixed to the upper end side of a rotary spindle 3 so as to be horizontally rotatable, and on which a semiconductor material X is horizontally loaded and received. Is a holding mechanism that presses and holds the edge of the semiconductor material X placed on the material receiver 1 around the material receiver 1. As is well known, the material receiver 1 is moved by a loading / unloading device (robot) (not shown). The edge of the semiconductor material X loaded and loaded thereon is previously held down by the holding mechanism 2 so that the semiconductor material X does not rattle or move due to the centrifugal force of the rotating material receiver 1. The semiconductor material X is rotated at a rotation speed (for example, from 2000 to 3000 rpm) to perform various surface treatments in a manufacturing process of the semiconductor material X.

The material receiver 1 includes several (four, five, six, etc., four in FIG. 4) arm rods 1-2 from a center disk part 1-1 integrally fixed to the rotating spindle 3. The semiconductor material X is provided in a plane cross shape with a length corresponding to the size of the semiconductor material X (for example, the size of the diameter or the like), and the edge of the semiconductor material X is provided on the back end of the open end of each arm 1-2. A support pin 1-3 having an appropriate height for mounting and supporting is provided upright, and a chuck member 2-1 described later of the holding mechanism 2 is axially mounted adjacent to each of the support pins 1-3. The rotating spindle 3 protruding from the bottom of the processing container 4
Is fixed to an upper end of the processing container 4 with a nut or a bolt, and is installed in the processing container 4 so as to be horizontally rotatable. The support pins 1-3 are
Extension part 1 extended at the open end side of each arm rod 1-2 at an obtuse angle
-20, and a guide portion 1-30 is formed on an upper end surface thereof, which is gradually tapered upwardly in a frusto-conical shape or the like. 1
At the time of loading, even if there is a slight shift in the mounting state with respect to each support pin 1-3, the shift is corrected by the inclined surface of the guide section 1-31, and the semiconductor chip is attached to the upper end face of each support pin 1-3. The semiconductor material X is formed so as to be placed and set on the material receiver 1 with the edge of the material X securely placed.

A rotating spindle 3 for fixing and supporting the material receiver 1 so as to be rotatable in a horizontal direction is a bearing which also serves as a column fixed on an apparatus frame 5 so as to mount and fix the bottom rear surface of the processing container 4. The processing container 4 is supported by a member 6 so as to be vertically immovable and penetrates the upper end from the bottom of the processing container 4 into the container 4, and a sprocket or pulley 7 is attached to the lower end of the processing container 4. A chain or a belt (such as a timing belt) 10 is wound around a sprocket or pulley 9 of a driving machine 8 composed of a motor or the like, and rotated by the power from the driving machine 8 to drive and rotate the material receiver 1. It has become. The drive unit 8 is provided with a transmission capable of appropriately adjusting the rotation speed, so that the rotation speed (rotation speed) of the material receiver 1 can be arbitrarily adjusted and selected according to the processing content of the semiconductor material X. ing. In the figure
Reference numeral 11 denotes a seal member provided inside the bearing member 6, which prevents transmission of liquid from the processing container 4 into the bearing member 6 along the rotating main shaft 3 and leakage of water through the member 5. .

An elevating shaft 12 is slidably inserted into the inner shaft core of the rotating main shaft 3 in a vertically penetrating manner, from the upper end of the rotating main shaft 3 via the center disk portion 1-1 of the material receiver 1. Connecting means (described later) of the holding mechanism 2 on the upper end of the raised shaft 12
2-1 is fixedly supported, and a rotary union 13 for rotatably supporting is provided at a lower end thereof, and a motor installed under the apparatus frame 5 via the rotary union 13 is provided. Alternatively, it is connected to and supported by an elevator 14 composed of an air or hydraulic cylinder, so that the elevator 14 is moved up and down by the elevator 14. That is, the chuck member 2-1 of the holding mechanism 2 holds down the edge of the semiconductor material X mounted on each support pin 1-3 of the material receiver 1 and holds the edge, and releases the held state. The movement of the chuck member 2-1 that changes the shaft mounting posture of the arm member 1-2 with respect to the arm rod 1-2 is performed by the movement of an elevating shaft 12 that moves up and down by an elevating machine 14, and the elevating shaft 12 is moved through a rotary union 13. By being connected to and supported by the rotary shaft 14, not only the vertical movement but also the rotation with the rotary main shaft 3 is possible.

The holding mechanism 2 serves to hold and hold the edge X-1 so that the semiconductor material X carried in and received by the material receiver 1 does not rattle or move due to the centrifugal force of the rotating material receiver 1. The semiconductor material X is positioned with respect to the axis of the material receiver 1 and serves to perform so-called centering. The semiconductor material X is axially mounted on the material receiver 1, and the edge of the semiconductor material X is surrounded around the material receiver 1. A chuck member 2-1 that changes its posture with the shaft attachment portion P as a fulcrum in order to hold and hold or release the holding state, and the chuck member 2- moves to each of the postures in conjunction with the vertical movement of the elevating shaft 12. Connecting means 2 to operate 1 respectively
-2.

The chuck member 2-1 comprises an elevating shaft 12, a connecting means 2
Of elevator 14 and elevator shaft 1 transmitted via
The semiconductor material X loaded on the material receiver 1 in conjunction with the movement of 2 is pressed and held at several places around the circumference.
A rod-shaped holding portion 2-10 formed on the upper half side and a substantially rectangular connecting portion 2-11 formed on the lower half side are formed.
The 2-20 is pivotally mounted on a substantially U-shaped mounting portion 15 formed at the open end of each arm rod 1-2 of the material receiver 1 with a pin 16 or the like, so that the shaft mounting portion P is supported as a fulcrum. The vertical shaft 12 (in the state shown in FIG. 5A) or the substantially upwardly inclined state (in the state shown in FIG. 5B). The mounting part 1-21 is provided so that the posture can be changed in conjunction with the vertical movement. In addition, a guide slot 17 for converting the vertical movement of the elevating shaft 12 into each of the posture directions of the chuck member 2-1 is disengaged from the shaft attaching portion P in the connecting portion 2-20 of the chuck member 2-1. It is opened diagonally below.

The connecting means 2-2 connects the chuck member 2-1 and the elevating shaft 12 so as to operate the respective chuck members 2-1 in conjunction with the vertical movement of the elevating shaft 12 and the chuck member 2-1. The elevating shaft 12 is connected by connecting the member 2-1 with the guide slot 17.
And serves to convert the up-down movement of the vertical direction into the above-described movement in each of the posture directions with the pivot point P as a fulcrum. The connecting arm rods 2-21 are provided in a plane cross shape above the arm rods 1-2 of the material receiver 1 toward the chuck members 2-1. on the other hand,
On each chuck member 2-1 side, a rod 2-22 having a substantially U-shaped connecting portion 19 in a plane for connecting with the chuck member 2-1 by inserting a connecting pin 18 into the guide elongated hole 17 is provided on each arm. Provided below the rod 1-2, each lower rod 2-22 and each upper connecting arm rod 2-21
Is connected by a connecting rod 2-23 penetrated vertically through a hole 20 formed in each arm rod 1-2, so that each chuck member 2 is linked with the vertical movement of the elevating shaft 12. -1 is the shaft attachment part P
The fulcrum is used as a fulcrum to change the posture to a substantially vertical posture for holding and holding the edge of the semiconductor material X, and a substantially upward and oblique posture for releasing the holding state (see FIGS. 3 to 5).

Further, a connecting means fixed to the upper end of the elevating shaft 12 and moved up and down by penetrating connection of the connecting rod 2-23 to the hole 20 formed in the arm rod 1-2 of the material receiver 1 so as to be vertically movable. 2-
The connection between the connecting arm rod 2-21 and the rotating material receiver 1 fixed to the upper end of the rotating main shaft 3 is achieved.
Numeral 12 moves up and down while rotating with the rotating spindle 3.

A driving device 1 for transmitting rotation to the rotating main shaft 3
4. The elevator 8 for transmitting the up and down movement to the elevating shaft 12 is electrically connected, and the operation timing and the operation start and end of the both are controlled by the control unit of the centrifugal processing device. . The elevator 8 stops operating and keeps the stopped state when the elevating shaft 12 is moved up and down to the ascending and descending limits, respectively. In other words, the controller is controlled so as to maintain a substantially upward oblique posture and a substantially vertical posture with the shaft attachment portion P of the chuck member 2-1 as a fulcrum.

Next, the operation of the centrifugal processing apparatus of the present embodiment configured as described above will be described below. As shown in FIGS. 1 to 3, in a state where each chuck member 2-1 of the holding mechanism 2 is held in a substantially upward and oblique posture, the semiconductor material X is transferred to each support pin of the material receiver 1 by the loading / unloading device. When loaded on 1-3 and accommodated in the processing container 4, the elevator 14 starts operating to lower the elevator shaft 12. Then, each of the chuck members 2-1 changes the posture with the shaft attachment part P as a fulcrum from the substantially upward oblique posture to the substantially vertical posture in conjunction with the downward movement of the elevating shaft 12 (from the state of FIG. 5A). (State (b)), the pressing portion 2-10 abuts against the edge of the semiconductor material X to hold the semiconductor material X (state (b) in FIG. 5). Then, when the processing operation in the manufacturing process of the semiconductor material X is completed and the rotation of the material receiver 1 is completely stopped, the elevator 14 starts operating and the elevator shaft 12 is raised. Then, each of the chuck members 1-2 interlocks with the ascending / descending movement of the elevating shaft 12, and uses the shaft attachment portion as a fulcrum from a substantially vertical posture for pressing and holding the semiconductor material X to a substantially upwardly inclined posture for releasing the holding state. The posture is changed (from the state of FIG. 5B to the state of FIG. 5A).

Therefore, the rotation of the material receiver 1 can be operated (started) in a state where the semiconductor material X carried in and received on the material receiver 1 is pressed and held. Chuck member 2-
1 can be continuously maintained until the processing operation in the manufacturing process of the semiconductor material X is completed and the rotation of the material receiver 1 is completely stopped. , Never move. Further, the semiconductor material X can be held until the rotation of the material receiver 1 is completely stopped. In other words, the semiconductor material X is positioned with respect to the axis of the material receiver 1, and the semiconductor material X can be unloaded by the loading / unloading device in a so-called centering state, so that the position of the semiconductor material X is uniquely regulated. The reliability at the time of unloading can be expected to be improved.

FIG. 6 shows another embodiment of the centrifugal processing apparatus according to the present invention. In this embodiment, the holding mechanism 2 is attached to the material receiver 1 by the chuck member 2-1 and the connecting means 2-2.
Since the connection form is different from that of the first embodiment, the description is omitted by using the same reference numerals since the other embodiments are basically the same as those in the above-described embodiment. Anyway,
In this embodiment, the position of the shaft attaching portion P of the connecting portion 2-11 of the chuck member 2-1 with respect to the mounting portion 21 of each arm rod 1-2 of the material receiver 1 is changed, and the connecting portion is connected via the connecting pin 18. While the opening position of the guide elongated hole 21 for connection with the means 2-2 is opened and located above the shaft attaching portion P, each of the connecting arm rods 2-21 of the connecting means 2-2 has the opening position. By directly attaching a rod 2-23 having a connecting portion 23 for connecting to the guide elongated hole 22 in the opening extension direction, each chuck member 2-1 is linked with the vertical movement of the elevating shaft 12, It is formed so that the posture can be changed to a substantially vertical posture in which the edge of the semiconductor material X is pressed and held with the shaft attachment portion P as a fulcrum, and a substantially upwardly inclined posture in which the held state is released. In the figure, reference numeral 24 denotes connecting means for connecting the rotating main shaft 3 and the elevating shaft 12 in the rotational direction.
This is a connecting member which is vertically movably penetrated from each connecting arm 2-21 of 2-2 toward a hole 25 formed in each arm 1-2 of the material receiver 1.

It is needless to say that the structural form of the material receiver 1 and the structural forms of the chuck member 2-1 and the connecting means 2-2 of the holding mechanism 2 are not limited to those described in detail in the above embodiment. Would. Further, as a structural form for connecting the rotating main shaft 3 and the elevating shaft 12 in the rotating direction, between the inner surface of the hole of the rotating main shaft 3 through which the elevating shaft 12 is inserted and the outer surface of the elevating shaft 12,
A vertical groove or a vertical rib which can slide in the axial direction and can be engaged and connected in the rotational direction is provided. A configuration in which a so-called spline structure is employed to link the rotation direction so that the elevating shaft 12 rotates together with the rotating main shaft 3 may be adopted, and this is optional.

[0022]

The semiconductor material centrifugal processing apparatus of the present invention has the following functions and effects because it is configured as described above. . According to the first aspect, by the movement about the shaft attachment portion of the chuck member which changes the posture in conjunction with the vertical movement of the elevating shaft, the material receiver is loaded on the material receiver before the material receiver starts rotating. The pressed semiconductor material can be held down. Further, the holding state by the chuck member can be continuously maintained until the processing operation in the semiconductor material manufacturing process is completed and the rotation of the material receiver is completely stopped. Therefore, it is possible to reliably prevent the generation of dust from the sliding contact portion due to backlash or movement as in the conventional device. In addition, since the semiconductor material can be held in a holding state until the rotation of the material receiver is completely stopped, the semiconductor material is aligned with the axis of the material receiver, and the loading / unloading device is used in a so-called centering state. It is possible to carry out the semiconductor material from the material receiver, and the position of the semiconductor material is uniquely regulated, so that the reliability at the time of carrying out can be expected to be improved.
Further, unlike the conventional apparatus, the rotation variation of the material receiver including the rotating shaft is not affected. In other words, since the chuck member is configured to operate in conjunction with the elevating shaft, there is no need to provide a drive system for operating the chuck member on the lower surface of the material receiver as in the conventional apparatus, and the material receiver and For example, it can be installed at a position below the machine frame, which is not directly related to the rotating spindle.

[0023] According to the second aspect, the connection with the elevator by the rotary union keeps the connection between the elevator shaft and the elevator free, so that the lifting shaft does not cause friction with the rotating main shaft and the chuck of the holding mechanism is used. By operating the member reliably, it is possible to press and hold the edge of the semiconductor material carried in and received by the material receiver, or to release the held state.

[0024] According to the third aspect, as described above, in addition to the free connection relationship with the elevator, the part of the connection means fixed to the upper end side is connected to the material receiver fixedly supported by the rotating main shaft. In order to maintain the established relationship, the lifting shaft is rotated together with the rotating main shaft.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing an example of a centrifugal processing apparatus for a semiconductor material of the present invention.

FIG. 2 is a plan view of the same.

FIG. 3 is an enlarged view of a main part showing a material receiving and holding mechanism, and is shown in a half section.

FIG. 4 is an exploded perspective view showing a main part of the holding mechanism.

FIG. 5 is an enlarged sectional view showing the movement of the chuck member,
(A) is a state where the chuck member is in a substantially upward oblique posture,
(B) shows the chuck member in a substantially vertical posture

FIGS. 6A and 6B are enlarged cross-sectional views of another embodiment showing the movement of the chuck member. FIG. 6A is a state in which the chuck member is in a substantially upward oblique posture, and FIG. 6B is a state in which the chuck member is in a substantially vertical posture.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Material receiver 1-1 ... Center disk part 1-2 ... Arm rod 1-3 ... Support pin 2 ... Holding mechanism 2-1 ... Chuck member 2-2 ... Connection means 2-20 ... Center disk 2-21 ... Connection Arm 2-22 ... Rod 2-23 ... Connecting rod 3 ... Rotating spindle 4 ... Processing vessel 5 ... Equipment frame 8 ... Driver 12 ... Elevating shaft 13 ... Rotary union 14 ... Elevator P ... Shaft attachment part X ... Semiconductor material

[Procedure amendment]

[Submission date] May 22, 2000 (2000.5.2)
2)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Full text

[Correction method] Change

[Correction contents]

[Document name]

Patent application title: Centrifugal processing device for semiconductor material

[Claims]

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to cleaning, etching, and chemical treatment of semiconductor materials such as semiconductor silicon wafers, glass substrates, and electronic components such as ICs and transistors using a processing solution such as a chemical solution. After performing a surface treatment such as a treatment, or washing with water through a washing treatment to wash off dust, organic or inorganic residues adhered to the surface in the manufacturing process of these various semiconductor materials.
In addition, the present invention relates to a centrifugal processing apparatus for a semiconductor material, which removes water droplets adhering to the surface of a semiconductor material by using a centrifugal force to shake off the water droplets. The present invention relates to an improvement in a so-called single-wafer processing apparatus that performs one-by-one processing while holding it so as not to attach or move.

[0002]

2. Description of the Related Art Conventionally, various types of structures have been invented and proposed as a holding structure for holding a semiconductor material in such a centrifugal processing apparatus so that the semiconductor material does not rattle or move due to centrifugal force. For example, in a processing container, a material receiver configured to receive and load the semiconductor material horizontally is fixed to a rotating spindle and rotatably installed. The material receiver has an edge of the semiconductor material by centrifugal force. 2. Description of the Related Art A centrifugal processing device having a holding mechanism in which chuck members for holding and holding a portion are provided at several locations around the device is known.

[0003]

However, in the above-described centrifugal processing apparatus in which the semiconductor material conveyed and loaded onto the material receiver is processed while being held down by centrifugal force, the rotation of the material receiver starts to rotate. To the required speed (rp
Otherwise, the holding force of the chuck member does not act on the semiconductor material. In other words, during the period from the start of rotation to the required number of rotations at which the holding force by the chuck member is applied, the semiconductor material is kept on the material receiver.
In or backlash, it is possible to move, also the dust is a problem arising from the sliding contact portion between the receiving semiconductor material and material. Further, when the processing operation is completed and the rotation of the material receiver is reduced to the number of rotations at which the holding force of the chuck member does not act on the semiconductor material, the holding force of the semiconductor material is released at that point. As described above, the semiconductor material rattles or moves on the material receiver from the time when the material is released to the time when the rotation of the material receiver stops, and dust is generated from the sliding contact portion with the material receiver. I do.

Therefore, as a solution to such a problem, the material receiver is conventionally provided with a holding mechanism which presses and holds the semiconductor material loaded and received on the material receiver before the material receiver starts rotating. In such a conventional processing apparatus, for example, the chuck member is moved from an upright posture in which the above-mentioned chuck member presses and holds the semiconductor material to an upwardly inclined position to release the holding state. Since the drive mechanism for mechanically operating the material receiver is directly provided on the lower surface of the material receiver, not only the structure around the material receiver is complicated and larger, but also the center of gravity is located on the upper side of the rotating spindle to which the material receiver is fixed. Skew, and as a result, the rotation balance of the material receiver including the rotating spindle is affected, and satisfactory processing cannot be expected. In addition, there has been a demand for improvement over many years, such as a decrease in production yield.

[0005] The present invention has been made in view of such a conventional situation, and its object is to prevent the rotation balance of the material receiver from being disrupted, from the time when the rotation starts, and to completely stop the rotation. The semiconductor material can be securely held and held until the time when it is rotated, and the position of the semiconductor material is uniquely regulated when the rotation stops due to the end of the processing work in the semiconductor material manufacturing process, thereby improving the reliability at the time of unloading. It is an object of the present invention to provide a semiconductor material centrifugal processing apparatus which can be expected.

[0006]

According to the present invention, there is provided a rotating spindle, and a material receiver fixed to an upper end of the rotating spindle so as to be horizontally rotatable, and on which a semiconductor material is horizontally loaded and received. A holding mechanism for pressing and holding an edge of the semiconductor material mounted on the material receiver so as to be able to come and go around the material receiver, wherein the rotating spindle is provided with a lifting shaft inserted through the shaft core in a penetrating manner. The holding mechanism is connected to a projecting upper end of the elevating shaft, and the material receiver is a rotating main shaft.
A few arm rods from the center disk fixed to the upper end of the semiconductor
While preparing horizontally with a length equivalent to the size of the material,
At the open end side of each arm rod, there is a shift in the loading of semiconductor material on the upper end surface.
A support pin having a guide portion to be corrected is erected and configured,
The holding mechanism is provided at the open end side of each arm rod of the material receiver.
The shaft is provided separately from the holding pin, and the shaft
Press and hold the edge of the semiconductor material mounted on the support pin of the receiver, and release it from the holding state.
A chuck member for changing the posture of the shaft to a substantially vertical posture and a substantially upward oblique posture with respect to the shaft, and is fixed to an upper end side of a lifting shaft protruding through the material receiver, and interlocked with the vertical movement of the lifting shaft. Connecting means for operating the chuck members to the respective postures, and a lower end of the elevating shaft is
Log in to the elevator installed on the machine frame that supports the
The gist is that they are connected via a data union . Further, the material receiver is fixed to an upper end of a rotating main shaft protruding from a bottom portion of the processing container, and is horizontally rotatably installed in the processing container. According to such technical means,
Semi-conductor that has been loaded onto the material receiver by the loading / unloading device
The body material is carried and loaded on the upper end surface of each support pin. this
When the loading / unloading device shifts the loading on each support pin,
It is corrected by the guide on the upper end surface. Then, the material is transferred onto each of the support pins of the material receiver by a movement about a shaft attachment portion of the chuck member, which changes a posture to a substantially vertical posture and a substantially upward oblique posture in conjunction with the vertical movement of the elevating shaft. After the held semiconductor material is pressed and held, the rotation of the material receiver can be operated. Further, the holding state by the chuck member can be continuously maintained until the processing operation in the manufacturing process of the semiconductor material is completed and the rotation of the material receiver is completely stopped. Also, via the rotary union
The elevating shaft is connected to the elevator,
The connection with the elevator is kept free.

[0007] Further, a part of the connecting means fixedly supported on the upper end side of the elevating shaft is penetrated so as to be able to move up and down on the open end side of each arm rod of the material receiver. And According to such technical means, as described above, in addition to the free connection relationship with the elevator, a part of the connection means fixed to the upper end side of the lift shaft is fixedly supported by the rotating main shaft, as described above. Are connected at the open end of each arm rod of the material receiver. That is, since the lifting shaft and the rotating main shaft are connected to each other via the arm rods of the material receiver and the connecting means, the lifting shaft rotates together with the rotating main shaft.

[0008]

Embodiments of the present invention will be described with reference to the drawings. 1 to 5 show an embodiment of a centrifugal processing apparatus according to the present invention. Reference numeral 1 denotes a material receiver which is fixed to the upper end side of a rotary spindle 3 so as to be horizontally rotatable, and on which a semiconductor material X is horizontally loaded and received. Is a holding mechanism that presses and holds the edge of the semiconductor material X placed on the material receiver 1 around the material receiver 1. As is well known, the material receiver 1 is moved by a loading / unloading device (robot) (not shown). The edge of the semiconductor material X loaded and loaded thereon is previously held down by the holding mechanism 2 so that the semiconductor material X does not rattle or move due to the centrifugal force of the rotating material receiver 1. The semiconductor material X is rotated at a rotation speed (for example, from 2000 to 3000 rpm) to perform various surface treatments in a manufacturing process of the semiconductor material X.

The material receiver 1 includes several (four, five, six, etc., four in FIG. 4) arm rods 1-2 from a center disk part 1-1 integrally fixed to the rotating main shaft 3. A length corresponding to the size of the semiconductor material X (for example, a size such as a diameter) is provided in a substantially cross shape in plan view, and the semiconductor material X is provided on the open end side of each arm rod 1-2 at the edge X. -1 support pin 1-3 with a suitable height for Nouketamawa support is erected at, the chuck members 2-1 to and below the holding mechanism 2 is adjacent said respective support pins 1-3
It is mounted on the shaft separately from the support pins 1-3, and is fixed to the upper end of the rotating main shaft 3 protruding from the bottom of the processing container 4 with a nut or a bolt, and can be horizontally rotated in the processing container 4. Installed in

[0010] The support pins 1-3, erected on the extending portion 1-20 which is extending at an obtuse angle direction at the open end side of Kakuude杆1-2, in its <br/> upper surface truncated guide portion 1-30 which has gradually tapered to protrude upward such conical is formed, loading and unloading
When the semiconductor material X is carried into the material receiver 1 by the apparatus , even if there is a slight deviation in the mounting state on each support pin 1-3, the deviation is corrected by the inclined surface of the guide portion 1-3, and each support pin 1-3 is corrected. The semiconductor material X is formed so as to be mounted on the material receiver 1 with the edge X-1 of the semiconductor material X securely placed on the upper end surface of the pin 1-3.

A rotating spindle 3 for fixing and supporting the material receiver 1 so as to be rotatable in a horizontal direction is a bearing which also serves as a column fixed on an apparatus frame 5 so as to mount and fix the bottom rear surface of the processing container 4. The processing container 4 is supported by a member 6 so as to be vertically immovable and penetrates the upper end from the bottom of the processing container 4 into the container 4, and a sprocket or pulley 7 is attached to the lower end of the processing container 4. A chain or a belt (such as a timing belt) 10 is wound around a sprocket or pulley 9 of a driving machine 8 composed of a motor or the like, and rotated by the power from the driving machine 8 to drive and rotate the material receiver 1. It has become. The drive unit 8 is provided with a transmission capable of appropriately adjusting the rotation speed, so that the rotation speed (rotation speed) of the material receiver 1 can be arbitrarily adjusted and selected according to the processing content of the semiconductor material X. ing. In the figure
Reference numeral 11 denotes a seal member provided inside the bearing member 6, which prevents transmission of liquid from the processing container 4 into the bearing member 6 along the rotating main shaft 3 and leakage of water through the member 5. .

An elevating shaft 12 is slidably inserted into the shaft core of the rotating main shaft 3 in a vertically penetrating manner, from the upper end of the rotating main shaft 3 via the center disk portion 1-1 of the material receiver 1. A connecting means 2-2 of the holding mechanism 2 described below is fixedly supported on the upper end side of the protruding elevating shaft 12 . The lower end of the lifting shaft 12 is
A rotary union 13 for rotatably supporting the elevating shaft 12 is provided. The rotary union 13 is connected to and supported by an elevating machine 14 such as a motor or an air or hydraulic cylinder installed under the apparatus frame 5 via the rotary union 13. Thus, the lift shaft 14 is moved up and down by the lift 14. In other words, the chuck member 2-1 of the holding mechanism 2 presses and holds the edge portion X-1 of the semiconductor material X mounted on each of the support pins 1-3 of the material receiver 1, or releases the holding state. The movement of the chuck member 2-1 for changing the shaft mounting posture of the material receiver 1 with respect to the arm rod 1-2 is performed by the movement of an elevating shaft 12 which moves up and down by an elevator 14, and the elevating shaft 12 is connected to a rotary union 13. Connected to and supported by the elevator 14 via the rotary shaft 3
It can rotate with it.

The holding mechanism 2 includes support pins 1-1 of the material receiver 1.
(3) The semiconductor material X carried on and loaded onto the material receiver 1 serves to hold down the edge X-1 so that the semiconductor material X does not rattle or move due to the centrifugal force of the rotating material receiver 1. the axis against alignment, in which forms a role of performing a so-called centering, the opening of each arm rod 1-2 of the material received 1
Axially mounted disposed at an end, the mounting carried onto the support pins 1-3 described above
A chuck member 2-1 for holding and holding the received semiconductor material X at its edge X-1 or changing its attitude about a shaft attachment portion P as a fulcrum so as to release the held state, and an upper end of the elevating shaft 12 ~ side
Connecting means 2 for moving the chuck members 2-1 to the respective positions in conjunction with the vertical movement of the elevating shaft 12 respectively.
-2.

The chuck member 2-1 comprises an elevating shaft 12, a connecting means 2
The semiconductor material X mounted on each support pin 1-3 of the material receiver 1 is held down at several places around the circumference in conjunction with the movement of the elevating shaft 12 by the elevating machine 14 transmitted via -2. It is composed of a rod-shaped holding part 2-10 formed on the upper half side and a substantially rectangular connecting part 2-11 formed on the lower half side, and receives the connecting part 2-11. 1. A pin is attached to the substantially U-shaped mounting portion 15 formed on the open end side of each arm rod 1-2 in plan view.
By occupying clothed axis by 16 or the like, (the state of FIG. 5 (b)) or become substantially vertical position for holding down the semiconductor material X to pivot the shaft wear portion P, substantially upwardly inclined posture for releasing the holding state (See Fig. 5 ( a )), connecting means
It is arranged on the mounting part 15 so as to be able to change the mounting posture of each arm 1-2 in conjunction with the vertical movement of the elevating shaft 12 transmitted via 2-2. Also, this chuck member 2-1
In the connecting portion 2-11 , a guide long hole 17 for converting the vertical movement of the elevating shaft 12 into each of the posture directions of the chuck member 2-1 is formed obliquely on the lower side deviated from the shaft attaching portion P. ing.

The coupling means 2-2, as well as interlocking of the chuck member 2-1 and the elevating shaft 12 in conjunction with the vertical movement of the lifting shaft 12 of each chuck member 2-1 so as to respectively operate, the chuck The elevating shaft 12 is linked to the guide slot 17 of the member 2-1.
And serves to convert the up-down movement of the vertical direction into the above-described movement in each of the posture directions with the pivot point P as a fulcrum. The connecting arm rods 2-21 are provided in a substantially cross shape in a plan view toward the chuck members 2-1 above the arm rods 1-2 of the material receiver 1. On the other hand, on each chuck member 2-1 side, a connecting pin 1
8 was inserted plan view to achieve interlocking between the chuck member 2-1
A rod 2-22 having a substantially U -shaped connecting portion 19 is provided below each arm 1-2, and each lower rod 2-22 and each upper connecting arm
By connecting 2-21 with the connecting rod 2-23 penetrated up and down through the hole 20 opened on the open end side of each arm rod 1-2 , the vertical movement of the lifting shaft 12 Each chuck member is linked
2-1 is configured so that the posture can be changed to a substantially vertical posture in which the edge X-1 of the semiconductor material X is pressed and held with the shaft attachment portion P as a fulcrum, and a substantially upward oblique posture in which the holding state is released. hand
There Ru (see FIGS. 3 to 5).

The connecting rod 2-23 is vertically connected to the hole 20 formed at the open end of the arm rod 1-2 of the material receiver 1 by a vertically movable connection. The connecting arm rod 2-21 of the moving connecting means 2-2 and the material receiver 1 fixed to the upper end of the rotating main shaft 3 are connected to each other, whereby the elevating shaft 12 moves up and down while rotating. It rotates with the main shaft 3.

A driving device for transmitting rotation to the rotating main shaft 3
8. The elevator 14 for transmitting the vertical movement to the lifting shaft 12 is electrically connected , and the operation timing of the two and the operation start and end are controlled by the control unit of the centrifugal processing device. It has become. The elevating machine 14 stops operating and keeps the stopped state when the elevating shaft 12 is moved up and down to the ascending and descending limits, respectively. That has become a shaft attachment portion P of the chuck member 2-1 to be controlled so as to maintain a substantially upward inclined posture substantially perpendicular orientation to the fulcrum.

Next, the operation of the centrifugal processing apparatus of the present embodiment configured as described above will be described below. As shown in FIGS. 1 to 3, in a state where each chuck member 2-1 of the holding mechanism 2 is held in a substantially upward and oblique posture, the semiconductor material X is transferred to each support pin of the material receiver 1 by the loading / unloading device. When loaded on 1-3 and accommodated in the processing container 4, the elevator 14 starts operating to lower the elevator shaft 12. Then, the respective chuck members 2-1 change their postures from the substantially upward oblique posture to the substantially vertical posture with the shaft attachment part P as a fulcrum in conjunction with the downward movement of the elevating shaft 12 (from the state of FIG. B) State), presser
The semiconductor material X is pressed and held by abutting 2-10 against the edge X-1 of the semiconductor material X (the state shown in FIG. 5B). Then, when the processing operation in the manufacturing process of the semiconductor material X is completed and the rotation of the material receiver 1 is completely stopped, the elevator 14 starts operating and the elevator shaft 12 is raised. Then, each of the chuck members 2-1 interlocks with the movement of the elevating shaft 12 to move from the substantially vertical posture for holding down and holding the semiconductor material X to the substantially upwardly inclined posture for releasing the holding state, with the shaft attachment portion P as a fulcrum. The posture is changed (from the state of FIG. 5B to the state of FIG. 5A).

Therefore, the rotation of the material receiver 1 can be operated (started) in a state where the semiconductor material X carried in and received on the material receiver 1 is pressed and held. Chuck member 2-
1 can be continuously maintained until the processing operation in the manufacturing process of the semiconductor material X is completed and the rotation of the material receiver 1 is completely stopped. , Never move. Further, the semiconductor material X can be held until the rotation of the material receiver 1 is completely stopped. In other words, the semiconductor material X is positioned with respect to the axis of the material receiver 1, and the semiconductor material X can be unloaded by the loading / unloading device in a so-called centering state, so that the position of the semiconductor material X is uniquely regulated. The reliability at the time of unloading can be expected to be improved.

FIG. 6 shows another embodiment of the centrifugal processing apparatus according to the present invention. In this embodiment , each arm 1-1 of the material receiver 1 is used.
Axial arrangement of chuck member 2-1 of holding mechanism 2 with respect to 2
In this embodiment , the connection form of the connecting means 2-2 to the rod 2-24 is changed. Except for such a configuration form, the same reference numerals are used because they are basically the same as those in the above-described detailed description of the embodiment. Omitted. However, in this embodiment, the position of the shaft attaching portion P of the connecting portion 2-11 of the chuck member 2-1 with respect to the mounting portion 21 of each arm 1-2 of the material receiver 1 is changed, and
Guide for connection with connection means 2-2 via 18
While the opening position of the long hole 22 is located above the shaft attaching portion P and opened, the connecting arm rods 2-21 of the connecting means 2-2 are provided.
A connecting portion that connects to the guide long hole 22 on the open end side.
By directly attaching the rod 2-24 having 23, the elevating shaft 12
In response to the vertical movement of the chuck member 2-1, each chuck member 2-1 presses and holds the edge X-1 of the semiconductor material X with the shaft attachment portion P as a fulcrum, and a substantially upwardly inclined position to release the holding state. It is formed so that the posture can be changed to the posture. In the drawing, reference numeral 24 is provided from each connecting arm 2-21 of the connecting means 2-2 to each arm 1-2 of the material receiver 1 in order to connect the rotating main shaft 3 and the elevating shaft 12 in the rotating direction. The communication member is vertically penetrated toward the hole 25.

It is needless to say that the structural form of the material receiver 1 and the structural forms of the chuck member 2-1 and the connecting means 2-2 of the holding mechanism 2 are not limited to those described in detail in the above embodiment. Would. Further, as a structural form for connecting the rotating main shaft 3 and the elevating shaft 12 in the rotating direction, between the inner surface of the hole of the rotating main shaft 3 through which the elevating shaft 12 is inserted and the outer surface of the elevating shaft 12,
A vertical groove or a vertical rib which can slide in the axial direction and can be engaged and connected in the rotational direction is provided. A configuration in which a so-called spline structure is employed to link the rotation direction so that the elevating shaft 12 rotates together with the rotating main shaft 3 may be adopted, and this is optional.

[0022]

The semiconductor material centrifugal processing apparatus of the present invention has the following functions and effects because it is configured as described above. . According to the first aspect of the invention, the motion of a fulcrum shaft attachment portion of the chuck member to change the orientation in conjunction with the vertical movement of the elevating shaft, each of the material receiving before the receiving material starts to rotate The semiconductor material carried in and received on the support pins can be held down. Further, the holding state by the chuck member can be continuously maintained until the processing operation in the semiconductor material manufacturing process is completed and the rotation of the material receiver is completely stopped. Therefore, it is possible to reliably prevent the generation of dust from the sliding contact portion due to backlash or movement as in the conventional device. In addition, since the semiconductor material can be held in a holding state until the rotation of the material receiver is completely stopped, the semiconductor material is aligned with the axis of the material receiver, and the loading / unloading device is used in a so-called centering state. It is possible to carry out semiconductor materials from the material receiver,
Since the position of the semiconductor material is uniquely controlled, the reliability at the time of unloading can be expected to be improved. Also, as in the conventional device, the rotation main
It does not affect the rotation variation of the material receiver including the shaft . In other words, since the chuck member is configured to operate in conjunction with the elevating shaft, it is not necessary to provide a drive system for operating the chuck member on the lower surface of the material receiver as in the conventional device, and the material receiver and For example, it can be installed at a position below the machine frame, which is not directly related to the rotating spindle. In addition, the connection with the elevator by the rotary union
As a result, the connection between the lifting shaft and the elevator was kept free.
As a result, the lifting shaft is kept without friction with the rotating spindle.
Make sure that the chuck member of the holding mechanism is
The edge of the semiconductor material loaded and loaded on each support pin
Can be held down or released.
Wear.

[0023] According to the second aspect of the present invention , as described above, in addition to the free connection relationship between the lift shaft and the lift, a part of the connection means fixed to the upper end side of the lift shaft is fixedly supported by the rotating main shaft. from keeping the relationships interlocking to material received that, the lifting shaft is rotated together with the rotary spindle
Can be .

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing an example of a centrifugal processing apparatus for a semiconductor material of the present invention.

FIG. 2 is a plan view of the same.

FIG. 3 is an enlarged view of a main part showing a material receiving and holding mechanism, and is shown in a half section.

FIG. 4 is an exploded perspective view showing a main part of the holding mechanism.

FIG. 5 is an enlarged sectional view showing the movement of the chuck member,
(A) is a state where the chuck member is in a substantially upward oblique posture,
(B) shows the chuck member in a substantially vertical posture

FIGS. 6A and 6B are enlarged cross-sectional views of another embodiment showing the movement of the chuck member. FIG. 6A is a state in which the chuck member is in a substantially upward oblique posture, and FIG. 6B is a state in which the chuck member is in a substantially vertical posture.

[Description of Signs] 1 ... Material receiver 1-1 ... Center disc 1-2 ... Arm rod 1-3 ... Support pin 1-30 ... Guide 2 ... Holding mechanism 2-1 ... Chuck member 2-2 ... Connecting means 2-20 ... Center disk 2-21 ... Connecting arm rod 2-22 ... Rod 2-23 ... Connecting rod 3 ... Rotating spindle 4 ... Treatment vessel 5 ... Equipment frame 8 ... Driver 12 ... Elevating shaft 13 ... Rotary union 14 ... Elevator P ... Shaft attachment part X ... Semiconductor material

[Procedure amendment 2]

[Document name to be amended] Drawing

[Correction target item name] Figure 2

[Correction method] Change

[Correction contents]

FIG. 2

[Procedure amendment 3]

[Document name to be amended] Drawing

[Correction target item name] Fig. 5

[Correction method] Change

[Correction contents]

FIG. 5

[Procedure amendment 4]

[Document name to be amended] Drawing

[Correction target item name] Fig. 6

[Correction method] Change

[Correction contents]

FIG. 6

Continued on the front page F term (reference) 4D057 AA19 AB01 AC01 AC05 AD01 AE02 AF01 BA11 5F031 CA02 HA24 HA26 HA29 HA59 MA23

Claims (3)

[Claims] 1. An internal shaft of the rotary spindle, comprising: a material receiver fixed to an upper end side of the rotary spindle, for receiving and receiving a semiconductor material; and a holding mechanism for pressing and holding the semiconductor material around the material receiver. A lifting shaft is inserted through the core in a penetrating manner,
The holding mechanism is connected and supported on the upper end side of the elevating shaft, and the holding mechanism is mounted on a material receiver to hold and hold the semiconductor material around the material receiver and to release the holding state. A chuck member that changes posture with the shaft attachment portion as a fulcrum, and coupling means that is fixed to the upper end side of the elevating shaft and moves the chuck member to each of the postures in conjunction with the up and down movement of the elevating shaft. A centrifugal processing apparatus for semiconductor materials, comprising: 2. The centrifugal processing apparatus according to claim 1, wherein a lower end of the elevating shaft is connected to the elevating machine via a rotary union. 3. The centrifugal processing apparatus according to claim 1, wherein a part of the connecting means is vertically connected to the material receiver so as to be vertically movable.