JP2002359227A5 - - Google Patents

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Publication number
JP2002359227A5
JP2002359227A5 JP2001162828A JP2001162828A JP2002359227A5 JP 2002359227 A5 JP2002359227 A5 JP 2002359227A5 JP 2001162828 A JP2001162828 A JP 2001162828A JP 2001162828 A JP2001162828 A JP 2001162828A JP 2002359227 A5 JP2002359227 A5 JP 2002359227A5
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JP
Japan
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JP2001162828A
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JP4743735B2 (ja
JP2002359227A (ja
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Priority to JP2001162828A priority Critical patent/JP4743735B2/ja
Priority claimed from JP2001162828A external-priority patent/JP4743735B2/ja
Publication of JP2002359227A publication Critical patent/JP2002359227A/ja
Publication of JP2002359227A5 publication Critical patent/JP2002359227A5/ja
Application granted granted Critical
Publication of JP4743735B2 publication Critical patent/JP4743735B2/ja
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Expired - Fee Related legal-status Critical Current

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JP2001162828A 2001-05-30 2001-05-30 基板処理装置および基板処理方法 Expired - Fee Related JP4743735B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001162828A JP4743735B2 (ja) 2001-05-30 2001-05-30 基板処理装置および基板処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001162828A JP4743735B2 (ja) 2001-05-30 2001-05-30 基板処理装置および基板処理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008257521A Division JP4837017B2 (ja) 2008-10-02 2008-10-02 基板処理装置および基板処理方法

Publications (3)

Publication Number Publication Date
JP2002359227A JP2002359227A (ja) 2002-12-13
JP2002359227A5 true JP2002359227A5 (ja) 2008-07-10
JP4743735B2 JP4743735B2 (ja) 2011-08-10

Family

ID=19005891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001162828A Expired - Fee Related JP4743735B2 (ja) 2001-05-30 2001-05-30 基板処理装置および基板処理方法

Country Status (1)

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JP (1) JP4743735B2 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004070807A1 (ja) * 2003-02-03 2004-08-19 Personal Creation Ltd. 基板の処理装置及び基板の処理方法
JP4619144B2 (ja) * 2005-01-27 2011-01-26 大日本スクリーン製造株式会社 基板処理装置
JP4906559B2 (ja) * 2007-03-29 2012-03-28 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP2008177584A (ja) * 2008-01-25 2008-07-31 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP6672091B2 (ja) * 2016-06-24 2020-03-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
CN107946214A (zh) * 2017-11-21 2018-04-20 长江存储科技有限责任公司 晶圆清洗装置
JP7138539B2 (ja) * 2018-10-18 2022-09-16 東京エレクトロン株式会社 基板処理装置及び基板処理方法
CN111640689A (zh) * 2019-03-01 2020-09-08 北京北方华创微电子装备有限公司 清洗装置及清洗腔室
US11796922B2 (en) * 2019-09-30 2023-10-24 Taiwan Semiconductor Manufacturing Co., Ltd. Method of manufacturing semiconductor devices

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4271267B2 (ja) * 1997-02-14 2009-06-03 大日本スクリーン製造株式会社 基板処理方法
JP2000119874A (ja) * 1998-10-07 2000-04-25 Toshiba Corp 基板処理装置
JP3395696B2 (ja) * 1999-03-15 2003-04-14 日本電気株式会社 ウェハ処理装置およびウェハ処理方法
US6516815B1 (en) * 1999-07-09 2003-02-11 Applied Materials, Inc. Edge bead removal/spin rinse dry (EBR/SRD) module

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