JP2002353697A - Production control system for surface mounter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide such a system that allows respective surface mounters to produce a board at an optimal balance value, in a production line comprised of a plurality of connected surface mounters capable of producing different number of boards at the same time. SOLUTION: A mounter 10 capable of producing two boards at the same time and a mounter 11 capable of producing only one board at a time are incorporated into a line. A production time per one board (production tact) in the respective mounters is adjusted so that the ratio of the production times per board of the respective mounters may be almost equal to the ratio of 2:1 in the number of respectively produced boards. In such a structure, a production time that the mounter 10 produces two boards at the same time and a production time that the mounter 11 produces one board two times are well balanced, thus making the flow of board conveyance constant and improving production efficiency.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a production control system for a surface mounting apparatus, and more particularly, a plurality of surface mounting apparatuses are incorporated in a line, and electronic components assigned to each surface mounting apparatus according to a production program are printed on a substrate. The present invention relates to a production control system for a surface mounting apparatus for mounting and producing a substrate.

[0002]

2. Description of the Related Art Conventionally, in order to increase production, a production system has been constructed by incorporating a plurality of surface mounting apparatuses (mounters) into a line. In this case, in order to increase the production efficiency, the production program is divided in consideration of the performance and capability of each surface mounting apparatus, and the number of production boards assigned to each surface mounting apparatus is adjusted (optimized division function).
This optimization division function is to divide each production tact (production time) in a line to which a surface mounting apparatus that produces one substrate at a time is connected, in order to make each production tact uniform.

[0003]

In the conventional production program division system, even if a surface mounting device capable of simultaneously producing a plurality of substrates and a device producing one substrate at a time are mixed in a line, each production device is divided into two parts. The division is made so that the production time is uniform. However, in a situation where the production time of each apparatus is uniform and the number of substrates ejected at a time is different, there is a problem that the substrate is transported waiting and the like, resulting in inefficient production.

Accordingly, the present invention has been made in order to solve such a problem, and in a line in which a plurality of surface mounting apparatuses which can simultaneously produce different numbers of substrates are connected, each surface mounting apparatus has an optimum balance. It is an object of the present invention to provide a production control system for a surface mounting apparatus capable of producing a substrate with a value.

[0005]

In order to solve the above problems, in the present invention, a plurality of surface mounting devices are incorporated in a line, and electronic components assigned to each surface mounting device are mounted on a substrate according to a production program. In the production control system for surface mounting equipment that produces substrates, the number of substrates that can be produced simultaneously by each surface mounting equipment is acquired, and the ratio of the production time per substrate between each surface mounting equipment and other surface mounting equipment is determined. In this case, the production program is changed so that the ratio is substantially equal to the ratio of the number of boards that can be simultaneously produced.

[0006] In such a system or method, a surface mounting apparatus having a large number of substrates that can be produced at the same time requires a long production time per substrate. Is almost the same as other devices that can simultaneously produce a small number of substrates, and the production balance of each surface mounting device can be maintained, so that the flow of substrate transport becomes uniform and the production efficiency is improved.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.

FIG. 1 schematically shows a board production system. In the figure, for example, two surface mounters (surface mounters) 10 and 11 are incorporated in a board production line. The electronic components are mounted on the board under the control of the control server 12 to produce the board. The control server 12 stores a production program 15 including detailed information for instructing which part on the board is to be mounted in what position and how.
Communicates with the surface mounters 10 and 11, determines the state of each surface mounter, allocates the number of mounted components to each mounter according to a production program, and outputs various commands to control board production. For example, the production program 15 has a procedure for allocating the electronic components to each mounting machine, knowing the total work amount (production amount) 15a.

Here, the surface mounter 10 can, for example, simultaneously produce two substrates and transport the two substrates.
The components are mounted on the substrates at the same time, and the substrates 13 and 14 on which the components are mounted are discharged. The surface mounter 11 following the surface mounter 10 can produce only one substrate at a time, receives the substrate 14 transferred from the surface mounter 10, and mounts the components assigned to the substrate 14. After the completion of the mounting, it is discharged to a line, and the components are mounted on the next substrate 13.

Since the surface mounter 10 can simultaneously produce two boards, if the production time per board of each mounter is the same, two boards are discharged from the surface mounter 10 at a time. On the other hand, in the next surface mounter 11, only one substrate is accepted, so that a space is needed to make the remaining one stand by.
Is connected before the mounting machine 10, a state of waiting for the board to be transported occurs.

Therefore, when a surface mounter for simultaneously producing a plurality of substrates is present in a line, the ratio of the substrate production time per substrate of each surface mounter is set to be substantially the same as the ratio of the number of simultaneously produced substrates. Modify production programs and split workload.

The method will be described with reference to the flow of FIG.

In the process of dividing the workload of the current production program, an internal parameter (balance value) indicates in what balance distribution the dividing process is executed for each mounting machine. For example, if there are two mounting machines on a line and all produce only one board, the initial balance value is (0.5, 0.5), and four mounting machines are used. In the case where there is one and only one substrate is produced, the initial balance value is (0.25, 0.25, 0.25, 0.25). The balance value corresponds to the production time (production tact) required to mount the components assigned to each mounting machine on one board. By default, each mounting machine produces one board. Production time is the same for each mounting machine.

Here, as shown in FIG. 1, when a mounting machine 10 capable of simultaneously producing two substrates is input,
Since the balance value needs to be adjusted, the number of boards that can be simultaneously produced by each mounting machine is obtained at the start of optimization (step S1). In the example of FIG. 1, the mounting machine 10 is 2, the mounting machine 1
1 becomes 1. Subsequently, this value is reflected on the balance value, and the division process is executed. That is, the balance value is weighted by the ratio of the number of simultaneously produced boards of each mounting machine (step S2). This is performed by changing the production program so that the production time ratio of each of the mounting machines 10 and 11 is equal to the ratio of the number of simultaneously produced substrates of the mounting machines 10 and 11.

Accordingly, in the example of FIG. 1, the balance value is set to (2/3, 1/3), and if the leading mounter can produce two boards at the same time with the four mounters described above, the balance value is set to (0.4, 0.2, 0.2, 0.2), the division of the work amount is executed (step S3), and the production time per substrate of another surface mounter of each surface mounter is calculated. The production time (balance value) of each surface mounter is adjusted such that the ratio becomes a ratio of the number of substrates that can be produced almost simultaneously. That is,
In the example of FIG. 1, the total work amount 1 in the production program
5a is divided at a ratio of 2: 1, so that the mounting machine 10 takes charge of 2 ratio 15b and the mounting machine 11 takes charge of 1 ratio 15c.

By such a dividing process, in a mounting machine having a large number of simultaneously produced sheets, the balance value is increased and the amount of work is increased, so that the production time (production tact) of one substrate is increased. Therefore, the mounting machine 10 mounts approximately twice as many components per board. Also, the production time per substrate is 2 hours.
Therefore, even if two substrates are produced at the same time, the substrate production rate is the same as the substrate production rate of the mounting machine 11. That is, the time for the mounting machine 10 to produce two substrates at a time is almost the same as the time for the mounting machine 11 to produce one substrate twice. In this case, the flow of the substrate transfer becomes uniform, and the production efficiency is improved.

Preferably, after the division, optimization for each mounting machine is executed (step S4), and a predicted production time of each mounting machine is calculated by a tact simulator from the optimization result (step S5). For a mounting machine capable of producing a plurality of substrates, before the balance value adjustment is started, the predicted production time of each machine is divided by the number of simultaneously produced substrates of each machine (step S6). It is evaluated whether or not it is uniform (step S7). If it is not uniform (No at Step S8), the balance value is corrected and finely adjusted (Step S9), and division is repeated again to finally establish an optimal balance.

In the case of dividing the amount of work in the production program, for a mounting machine capable of producing a plurality of substrates, the number of components is increased to increase the amount of work by increasing the production time per substrate. In addition, more parts that take a long time to load are assigned to this mounting machine,
The workload may be substantially increased.

[0019]

As described above, according to the present invention, when the number of substrates that can be simultaneously produced by a surface mounting apparatus is different, the ratio of the production time per substrate between each surface mounting apparatus and another surface mounting apparatus is reduced. Since the production time of each surface-mounting device is adjusted so that the ratio of the number of substrates simultaneously produced is substantially the same, the substrate production rate of each surface-mounting device is substantially the same, and the production balance of each surface-mounting device can be balanced. Therefore, the flow of transferring the substrate becomes uniform, and the production efficiency is improved.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram illustrating a state in which production time is adjusted in a mounting machine that can simultaneously produce different numbers of substrates.

FIG. 2 is a flowchart showing a flow of dividing a workload in a production program.

[Explanation of symbols]

 10, 11 Surface mount machine 12 Control server 15 Production program

Claims (2)

[Claims] In a production control system for a surface mounting apparatus, which incorporates a plurality of surface mounting apparatuses into a line and mounts electronic components assigned to each surface mounting apparatus on a substrate according to a production program to produce a substrate, Acquire the number of substrates that can be simultaneously produced by the device, and make the ratio of the production time per substrate in each surface mounting device and the other surface mounting device approximately equal to the ratio of the acquired number of substrates that can be produced simultaneously. A production control system for a surface mount device, characterized by changing a production program. 2. The production program is changed so that the number of electronic components mounted on one substrate in a surface mounting device having a large number of substrates that can be produced simultaneously is larger than the number of electronic components mounted in a small number of surface mounting devices. The production control system for a surface mount device according to claim 1, wherein: