JPH098492A - Part arrangement optimizing method - Google Patents
Part arrangement optimizing methodInfo
- Publication number
- JPH098492A JPH098492A JP7153080A JP15308095A JPH098492A JP H098492 A JPH098492 A JP H098492A JP 7153080 A JP7153080 A JP 7153080A JP 15308095 A JP15308095 A JP 15308095A JP H098492 A JPH098492 A JP H098492A
- Authority
- JP
- Japan
- Prior art keywords
- boards
- component
- mounting time
- mounting
- component arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Feedback Control In General (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、部品交換をせずに複数
種類の基板に部品を実装する際に、その実装時間を短く
するように部品配列を決定する部品配列最適化方法に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component arrangement optimization method for determining a component arrangement so as to shorten the mounting time when components are mounted on a plurality of types of boards without replacing the components. is there.
【0002】[0002]
【従来の技術】近年、市場のニーズの多様化に伴って製
造メーカーの生産方式は、これまでの少品種大量生産か
ら、多品種少量生産に変わり、基板に対して部品を実装
する実装機においては、基板品種の変更に対して部品の
段取り換えを極力減らすとともに実装タクトを短くする
ことが求められており、そのために部品配列を最適化す
ることが要求されている。2. Description of the Related Art In recent years, with the diversification of market needs, the manufacturing system of manufacturers has changed from conventional small-volume mass production to high-mix low-volume production. Is required to reduce the setup change of components and shorten the mounting tact as much as possible for the change of the board type. Therefore, it is required to optimize the component arrangement.
【0003】以下、従来の部品配列の最適化方法につい
て、3品種の基板を部品交換なしで生産する場合につい
て図2〜図8を参照して説明する。A conventional method of optimizing a component arrangement will be described below with reference to FIGS. 2 to 8 in the case where three types of boards are produced without exchanging components.
【0004】図2において、まず3品種(ABC)に共
通の部品を抽出し(ステップ#11)、次に2品種(A
B、BC、CA)に共通の部品を抽出し(ステップ#1
2)、次に1品種(A、B、C)毎の部品を抽出し(ス
テップ#13)、その後それらに基づいてZ軸(部品実
装時に部品供給部が移動する軸)の駆動距離が短くなる
ように各品種の基板に対する実装の優先順位を決め、そ
れぞれのケースに応じて図3〜図8に示すように部品配
列を決定している(ステップ#14)。In FIG. 2, first, parts common to three types (ABC) are extracted (step # 11), and then two types (A).
B, BC, CA) common parts are extracted (step # 1
2) Next, parts for each type (A, B, C) are extracted (step # 13), and based on them, the drive distance of the Z axis (the axis along which the component supply unit moves during component mounting) is short. Therefore, the mounting priority is determined for each type of board, and the component arrangement is determined as shown in FIGS. 3 to 8 according to each case (step # 14).
【0005】図3は、各品種の基板に対する実装時間を
短くする優先順位をA品種、B品種、C品種の順にした
場合の部品配列と、その時の各品種の基板に対して実装
する時のZ軸の動作範囲を示している。FIG. 3 shows a component arrangement in which the priority for shortening the mounting time for each type of board is set in the order of A type, B type, and C type, and when mounting on each type of substrate at that time. The operation range of the Z axis is shown.
【0006】同様に図4は、基板に対する実装の優先順
位がA品種、C品種、B品種の場合、図5はB品種、A
品種、C品種の場合、図6はB品種、C品種、A品種の
場合、図7はC品種、A品種、B品種の場合、図8はC
品種、B品種、A品種の場合をそれぞれ示している。Similarly, in FIG. 4, when the mounting priority for the board is A type, C type, and B type, FIG. 5 is B type, A type.
6 are B, C, and A, FIG. 7 is C, A, and B, and FIG. 8 is C.
The types of product, B, and A are shown respectively.
【0007】[0007]
【発明が解決しようとする課題】しかしながら、上記従
来の方法ではZ軸の駆動距離を短くするように部品配置
を決定しているだけであるため、仮に部品配列が図3〜
図8のいずれかに決まったとしても、実際に生産すると
きには各品種ごとに生産枚数が異なるために、トータル
の実装時間が最小になるとは限らないという問題があ
る。However, in the above-mentioned conventional method, since the component arrangement is only determined so as to shorten the driving distance of the Z axis, the component arrangement is assumed to be as shown in FIG.
Even if it is decided to be any one of FIG. 8, there is a problem that the total mounting time may not always be the minimum because the number of products manufactured differs for each type when actually manufactured.
【0008】また、Z軸の駆動距離を短くしても、XY
テーブルの駆動待ち時間を考慮していないことや、各共
通部品内の部品配置決めが決まっていないために、実際
に図3〜図8のどの配置が実装時間を最小にすることが
できるのかは分からないという問題がある。Further, even if the drive distance of the Z axis is shortened, XY
Which of the layouts in FIGS. 3 to 8 can actually minimize the mounting time because the drive waiting time of the table is not taken into consideration and the layout of the components in each common component is not determined. There is a problem that I do not understand.
【0009】本発明は、上記従来の問題点に鑑み、実際
の生産時間を最小にすることができる部品配列最適化方
法を提供することを目的としている。In view of the above conventional problems, it is an object of the present invention to provide a parts arrangement optimization method capable of minimizing the actual production time.
【0010】[0010]
【課題を解決するための手段】本発明の部品配列最適化
方法は、複数種類の基板に部品交換をせずに部品を実装
する際に実装時間を短くするように部品配列を決定する
部品配列最適化方法であって、各種基板に対する部品の
実装時間に各基板の生産枚数の重み付けを行い、すべて
の基板に対するトータルの実装時間を短くするように部
品配列を決定することを特徴とする。A component array optimization method according to the present invention determines a component array so as to shorten a mounting time when components are mounted on a plurality of types of boards without replacing the components. An optimization method is characterized in that the mounting time of components on various boards is weighted by the number of produced boards of each board, and the component arrangement is determined so as to shorten the total mounting time for all boards.
【0011】又は、部品配列を仮決定して各種基板の実
装時間を算出する処理を部品配列を変更して繰り返し、
各種基板の実装時間の合計が最小になるように部品配列
を決定することを特徴とする。Alternatively, the process of tentatively determining the component array and calculating the mounting time of various boards is repeated by changing the component array,
It is characterized in that the component arrangement is determined so that the total mounting time of various boards is minimized.
【0012】更には、部品配列を仮決定して各種基板に
対する部品の実装時間に各基板の生産枚数の重み付けを
行なった実装時間を算出する処理を部品配列を変更して
繰り返し、すべての基板に対するトータルの実装時間が
最短になるように部品配列を決定することを特徴とす
る。Further, the process of tentatively determining the component array and calculating the mounting time in which the mounting time of the components on various boards is weighted by the number of produced boards of each board is repeated by changing the component array, and all the boards are processed. The feature is that the component arrangement is determined so that the total mounting time is the shortest.
【0013】[0013]
【作用】本発明の部品配列最適化方法によれば、Z軸の
駆動距離に基づいて部品配置を決定するのではなく、基
板の品種毎の実装時間と生産枚数を元にトータルの実装
時間を出し、その実装時間が最小になるように部品配列
を決定することにより実装時間が短くなり、効率的な生
産を行なうことができる。According to the component arrangement optimizing method of the present invention, the component placement is not determined based on the Z-axis driving distance, but the total mounting time is determined based on the mounting time for each board type and the number of produced boards. By deciding the component arrangement so that the mounting time is minimized, the mounting time can be shortened and efficient production can be performed.
【0014】また、部品配列を仮決定して各種基板の実
装時間を算出する処理を部品配列を変更して繰り返し、
各種基板の実装時間の合計が最小になるように部品配列
を決定すると、確実に実際の実装時間を短くする部品配
列に決定できる。Further, the process of tentatively determining the component array and calculating the mounting time of various boards is repeated by changing the component array,
If the component arrangement is determined so that the total mounting time of the various boards is minimized, it is possible to surely determine the component arrangement that shortens the actual mounting time.
【0015】さらに、部品配列を仮決定して各種基板の
実装時間を算出する処理に際して生産枚数の重み付けを
行なうことにより、実際のトータルの実装時間を最短に
する部品配列に決定できる。Further, by weighting the number of products to be produced in the process of tentatively determining the component arrangement and calculating the mounting time of various boards, it is possible to determine the component arrangement that minimizes the actual total mounting time.
【0016】[0016]
【実施例】以下、本発明の部品配列最適化方法を3品種
の基板を部品交換なしで生産する場合の一実施例につい
て、図1を参照して説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the method for optimizing a component arrangement according to the present invention in which three types of boards are produced without exchanging components will be described with reference to FIG.
【0017】図1において、まず3品種(ABC)に共
通の部品を抽出し(ステップ#1)、次に2品種(A
B、BC、CA)に共通の部品を抽出し(ステップ#
2)、次に1品種(A、B、C)毎の部品を抽出する
(ステップ#3)。次に、各品種A、B、Cの生産枚数
α枚、β枚、γ枚を取り込む(ステップ#4)。次に、
図3〜図8のいずれかに示すように各品種毎にZ軸(部
品実装時に部品供給部が移動する軸)の駆動距離が短く
なるように部品配列を仮決定する(ステップ#5)。In FIG. 1, first, parts common to three types (ABC) are extracted (step # 1), and then two types (A).
B, BC, CA) common parts are extracted (step #
2) Next, parts for each type (A, B, C) are extracted (step # 3). Next, the production numbers α, β, and γ of the respective types A, B, and C are fetched (step # 4). next,
As shown in any of FIGS. 3 to 8, the component arrangement is provisionally determined so that the drive distance of the Z axis (axis on which the component supply unit moves during component mounting) becomes short for each product type (step # 5).
【0018】次に、各品種A、B、Cの実装時間をシミ
ュレートしてそれぞれの実装時間x、y、zを算出する
(ステップ#6、#7、#8)。そして、各品種A、
B、Cの実装時間にそれぞれの生産枚数をかけた各品種
毎の生産時間を合計した合計生産時間(xα+yβ+z
γ)を算出し、この合計生産時間の最小値が判明するま
でステップ#5に戻り、部品配列を順次変更して上記処
理を繰り返し、最小の合計生産時間を与える部品配列に
決定する(ステップ#9)。Next, the mounting times of the respective types A, B and C are simulated to calculate the mounting times x, y and z (steps # 6, # 7 and # 8). And each kind A,
Total production time (xα + yβ + z), which is the sum of the production time for each product type, which is obtained by multiplying the mounting time for B and C by the number of each production
γ) is calculated, the process returns to step # 5 until the minimum value of the total production time is found, the parts arrangement is sequentially changed, and the above process is repeated to determine the parts arrangement giving the minimum total production time (step # 9).
【0019】[0019]
【発明の効果】本発明の部品配列最適化方法によれば、
以上の説明から明らかなように、Z軸の駆動距離に基づ
いて部品配置を決定するのではなく、基板の品種毎の実
装時間と生産枚数を元にトータルの実装時間を出し、そ
の実装時間が最小になるように部品配列を決定すること
により実装時間が短くなり、効率的な生産を行なうこと
ができる。According to the component arrangement optimizing method of the present invention,
As is clear from the above description, the component placement is not determined based on the Z-axis drive distance, but the total mounting time is calculated based on the mounting time for each board type and the number of products to be produced, and the mounting time is calculated. By determining the component arrangement so as to minimize the mounting time, the mounting time can be shortened and efficient production can be performed.
【0020】また、部品配列を仮決定して各種基板の実
装時間を算出する処理を部品配列を変更して繰り返し、
各種基板の実装時間の合計が最小になるように部品配列
を決定すると、確実に実際の実装時間を短くする部品配
列に決定できる。Further, the process of tentatively determining the component array and calculating the mounting time of various boards is repeated by changing the component array,
If the component arrangement is determined so that the total mounting time of the various boards is minimized, it is possible to surely determine the component arrangement that shortens the actual mounting time.
【0021】さらに、部品配列を仮決定して各種基板の
実装時間を算出する処理に際して生産枚数の重み付けを
行なうことにより、実際のトータルの実装時間を最短に
する部品配列に決定できる。Furthermore, by weighting the number of products to be produced in the process of tentatively determining the component arrangement and calculating the mounting time of various boards, it is possible to determine the component arrangement that minimizes the actual total mounting time.
【図1】本発明の一実施例の部品配列最適化方法のフロ
ー図である。FIG. 1 is a flow chart of a parts arrangement optimization method according to an embodiment of the present invention.
【図2】従来例の部品配列最適化方法のフロー図であ
る。FIG. 2 is a flowchart of a conventional component arrangement optimization method.
【図3】第1の部品配列の説明図である。FIG. 3 is an explanatory diagram of a first component arrangement.
【図4】第2の部品配列の説明図である。FIG. 4 is an explanatory diagram of a second component arrangement.
【図5】第3の部品配列の説明図である。FIG. 5 is an explanatory diagram of a third component array.
【図6】第4の部品配列の説明図である。FIG. 6 is an explanatory diagram of a fourth component array.
【図7】第5の部品配列の説明図である。FIG. 7 is an explanatory diagram of a fifth component array.
【図8】第6の部品配列の説明図である。FIG. 8 is an explanatory diagram of a sixth component array.
Claims (3)
を実装する際に実装時間を短くするように部品配列を決
定する部品配列最適化方法であって、各種基板に対する
部品の実装時間に各基板の生産枚数の重み付けを行い、
すべての基板に対するトータルの実装時間を短くするよ
うに部品配列を決定することを特徴とする部品配列最適
化方法。1. A component arrangement optimizing method for determining a component arrangement so as to shorten the mounting time when the components are mounted on a plurality of types of boards without replacing the components, and the mounting time of the components on various boards. The weighting of the number of each board produced is
A component arrangement optimizing method characterized by deciding a component arrangement so as to reduce the total mounting time for all boards.
を実装する際に実装時間を短くするように部品配列を決
定する部品配列最適化方法であって、部品配列を仮決定
して各種基板の実装時間を算出する処理を部品配列を変
更して繰り返し、各種基板の実装時間の合計が最小にな
るように部品配列を決定することを特徴とする部品配列
最適化方法。2. A component arrangement optimizing method for determining a component arrangement so as to shorten the mounting time when the components are mounted on a plurality of types of substrates without replacing the component, and the provisional determination of the component arrangement is performed. A component array optimizing method characterized by repeating a process of calculating mounting times of various boards by changing a component array and determining a component array so that a total of mounting times of various boards is minimized.
を実装する際に実装時間を短くするように部品配列を決
定する部品配列最適化方法であって、部品配列を仮決定
して各種基板に対する部品の実装時間に各基板の生産枚
数の重み付けを行なった実装時間を算出する処理を部品
配列を変更して繰り返し、すべての基板に対するトータ
ルの実装時間が最短になるように部品配列を決定するこ
とを特徴とする部品配列最適化方法。3. A component arrangement optimizing method for deciding a component arrangement so as to shorten a mounting time when the components are mounted on a plurality of types of boards without replacing the component, and the component arrangement is temporarily determined. The process of calculating the mounting time by weighting the number of printed boards for each component on the mounting time of each substrate is repeated by changing the component array, and the component array is arranged to minimize the total mounting time for all the boards. A method for optimizing a component arrangement, characterized by determining.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15308095A JP3566785B2 (en) | 1995-06-20 | 1995-06-20 | Component layout optimization method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15308095A JP3566785B2 (en) | 1995-06-20 | 1995-06-20 | Component layout optimization method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH098492A true JPH098492A (en) | 1997-01-10 |
JP3566785B2 JP3566785B2 (en) | 2004-09-15 |
Family
ID=15554547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15308095A Expired - Fee Related JP3566785B2 (en) | 1995-06-20 | 1995-06-20 | Component layout optimization method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3566785B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6996440B2 (en) | 2000-08-04 | 2006-02-07 | Matsushita Electric Industrial Co., Ltd. | Method for optimization of an order of component mounting, apparatus using the same, and mounter |
WO2007004494A2 (en) * | 2005-07-05 | 2007-01-11 | Matsushita Electric Industrial Co., Ltd. | Production condition determining method, production condition determining apparatus, mounter, and program |
JP2008263138A (en) * | 2007-04-13 | 2008-10-30 | Matsushita Electric Ind Co Ltd | Mounting condition determining method |
WO2009062524A1 (en) * | 2007-11-12 | 2009-05-22 | Siemens Electronics Assembly Systems Pte. Ltd. | Method for fitting an equipping device |
JP2012243894A (en) * | 2011-05-18 | 2012-12-10 | Fuji Mach Mfg Co Ltd | Production management device and production management method for component mounting line |
JP2016042523A (en) * | 2014-08-18 | 2016-03-31 | パナソニックIpマネジメント株式会社 | Method of determining component arrangement |
-
1995
- 1995-06-20 JP JP15308095A patent/JP3566785B2/en not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6996440B2 (en) | 2000-08-04 | 2006-02-07 | Matsushita Electric Industrial Co., Ltd. | Method for optimization of an order of component mounting, apparatus using the same, and mounter |
WO2007004494A2 (en) * | 2005-07-05 | 2007-01-11 | Matsushita Electric Industrial Co., Ltd. | Production condition determining method, production condition determining apparatus, mounter, and program |
WO2007004494A3 (en) * | 2005-07-05 | 2007-06-14 | Matsushita Electric Ind Co Ltd | Production condition determining method, production condition determining apparatus, mounter, and program |
US7738985B2 (en) | 2005-07-05 | 2010-06-15 | Panasonic Corporation | Production condition determining method, production condition determining apparatus, mounter, and program |
JP2008263138A (en) * | 2007-04-13 | 2008-10-30 | Matsushita Electric Ind Co Ltd | Mounting condition determining method |
WO2009062524A1 (en) * | 2007-11-12 | 2009-05-22 | Siemens Electronics Assembly Systems Pte. Ltd. | Method for fitting an equipping device |
JP2012243894A (en) * | 2011-05-18 | 2012-12-10 | Fuji Mach Mfg Co Ltd | Production management device and production management method for component mounting line |
JP2016042523A (en) * | 2014-08-18 | 2016-03-31 | パナソニックIpマネジメント株式会社 | Method of determining component arrangement |
Also Published As
Publication number | Publication date |
---|---|
JP3566785B2 (en) | 2004-09-15 |
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