JP2002343835A - Method for manufacturing tape carrier - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce warp of a TAB tape by eliminating a development of the warp in a longitudinal direction. SOLUTION: A method for manufacturing a tape carrier comprises the steps of passing the TAB tape 1 through a heating space while imparting a reverse warp in the width direction of the tape 1, aligning sheaves 3 each recessed at a central part in a tape direction as a support of the tape 1 in two rows in the tape direction by applying the tape 1 through the heating space and then the cooling space continued to the heating space when the warp of the tape 1 in the width direction is reduced by then passing the tape 1 through the cooling space, supporting both ends of the tape 1 in the width direction to the sheaves 3, conveying the ends while imparting a reverse warp, and controlling a conveying tension so as to apply a tension of a predetermined value to reduce the warp of the tape in the width direction without increasing the warp in the longitudinal direction at the time of conveying the tape 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB (Tape Autom
ated Bonding) tape or CSP (Chip Scale Packag)
e), BGA (Ball Grid Array), COF (Chip On Fil)
The present invention relates to a method for manufacturing a tape carrier for m), and particularly to a method for correcting deformation of a tape carrier, wherein the straightening can be controlled with high accuracy and high accuracy.

[0002]

2. Description of the Related Art TAB tapes are usually formed as follows.

[0003] First, a copper foil is laminated on one side of a tape base made of a polyimide resin film or the like on which a B-stage adhesive has been formed, to form a three-layer structure of the tape base, the adhesive, and the copper foil. Subsequently, the adhesive is cured. Further, in order to form a wiring circuit of a copper foil, a wiring circuit pattern including leads is formed through coating, exposure, development, etching, and stripping steps of a photosensitive resist. Finally, in a plating step, plating is formed on the wiring circuit pattern. T
The basic structure of the AB tape is as follows. Further T
-Depending on the product type, such as BGA (Tape Ball Grid Array), a photosensitive solder resist or the like is formed as an insulating protective layer on the required portion of the surface of the wiring circuit pattern except for the terminal portion, or a 2-metal TAB tape. In such a case, a circuit pattern is formed on both surfaces of a tape substrate with copper foil or the like.

[0004] The TAB tape thus formed, T-
Tape carriers for mounting semiconductor elements such as BGA or COF tapes can be used to control the difference in the coefficient of thermal expansion between materials such as tape bases made of polyimide resin film, adhesives, copper foil and solder resist, and the thermal shrinkage of solder resist. As a result, concave warpage occurs on the solder resist side.

[0005] The warpage of the tape carrier cannot be removed in a subsequent step until the product of the semiconductor device package is completed, and the warp tends to further increase. Therefore, a product having such a warp affects a positional accuracy such as a wire bonding with respect to a semiconductor chip mounted on a tape carrier, or causes a trouble such as an obstacle to conveyance in a process.

In order to reduce the warpage of the TAB tape, Japanese Unexamined Patent Publication (Kokai) No. 6-260535 discloses a tape for reducing the warpage by heating while imparting a reverse warp and cooling while maintaining the shape. A method for manufacturing a carrier is disclosed. This publication also discloses, as a method of reducing warpage, shaping using a shaping jig curved in a direction opposite to the warpage. This molding jig is composed of a circular molding die, a positioning guide die provided with a notch on the outer periphery thereof, and a circular holding die provided on the outer periphery thereof.

However, since there are a wide variety of types of TAB tapes, it has become necessary to prepare various types of shaping jigs in the above-described molding jigs. For example, 75
Upilex S (Ube Industries, Ltd.), a polyimide resin having a thickness of μm, an adhesive X having a thickness of 12 μm (made by Hamakawa Paper) as an adhesive, and an electrolytic copper foil FQ-VLP having a thickness of 18 μm as a copper foil
(Mitsui Metal Mining Co., Ltd.) using a 70 mm-wide variety
In the case of -BGA, a correction width of about 61 to 63 mm is optimal. However, in the case where a T-BGA having a device hole in the center or a photosensitive solder resist is formed or the substrate thickness is different, the required correction width or curvature is different, and the tape width is 35 mm or 48 mm. , 105 mm, the number of shaping jigs required for them is enormous.

Therefore, generally, as a shaping method, two L-shaped guides 12 as shown in FIG. 3 are arranged on the left and right facing each other to form a U-shaped guide with a variable correction width. A method of reducing the warpage of the TAB tape by supporting both sides of the TAB tape 1 at the inner corners of the L-shaped guide 12 is used.

[0009]

However, when the U-shaped guide shown in FIG. 3 is used, friction occurs between the end of the TAB tape and the correction jig, and the end of the TAB tape, especially near the sprocket hole, causes the tape to run out. Easy to swell and deform,
Or, it may be partially reversely warped, which may be an obstacle when mounting the chip.

Accordingly, the applicant of the present invention has previously reduced the warpage uniformly and with high precision without undulation or deformation,
A method of manufacturing a tape carrier capable of obtaining a stable TAB tape is provided (Japanese Patent Application No. 2001-0098).
86). This is based on the premise that a tape carrier having a conductor pattern on one or both sides is passed through a heating space while giving a reverse warp in the width direction thereof, and then is passed through a cooling space to reduce the warpage of the tape carrier in the width direction. age,
In the heating space and the cooling space following the heating space, pulleys (roll guides) having a concave portion at the center are arranged in two rows in the tape direction to support the tape carrier, and both ends of the tape carrier in the width direction are supported. This is a method of manufacturing a tape carrier in which the tape carrier is shaped into a predetermined shape by feeding the tape carrier while giving reverse warpage. According to this manufacturing method, a tape carrier such as a TAB tape is shaped while supporting the tape carrier using a pulley having a concave central portion as a jig for shaping the tape carrier.
It is possible to supply a tape carrier having a stable shape without warping, reducing warpage uniformly and with high precision.

Further, by providing an interval adjusting mechanism to adjust the interval between both ends in the width direction of the tape carrier of the pulley to an optimal interval width in advance, the TAB tape or the B
Regarding tape warpage reduction of the tape carrier for GA and COF, it is possible to set the interval between the right and left pulleys giving reverse warpage to an optimum value, and therefore, it is possible to cope with all kinds of products, and it is stable and uniform. Can be shaped.

In short, this manufacturing method belongs to a warp reduction method of shaping with a shaping jig curved in a direction opposite to the warp, and uses a roll guide having a variable straightening width so as to be able to cope with different tape widths. This is a method for reducing the warpage of the TAB tape.

The warpage is caused by a difference in expansion and contraction between the materials caused by combining materials having different mechanical properties, and a force for generating a warp from all directions is applied. . Then, due to the rigidity of the base material, usually, only the portion having the largest difference in expansion and contraction appears as warpage.

Therefore, when one of the warps is reduced, a warp in another direction is developed. When the warp in the width direction of the tape is reduced by heating while maintaining the predetermined shape, the longitudinal direction is reduced by the Poisson's ratio. Promotes warpage.

Accordingly, an object of the present invention is to solve the above-mentioned problems and reduce the warpage of the tape carrier without developing warpage in the longitudinal direction in the shaping step of a tape carrier such as a TAB tape, and thereby achieve a stable tape. It is to enable the manufacture of a carrier.

[0016]

In order to achieve the above-mentioned object, the present invention provides a tape carrier having a conductor pattern on one or both sides thereof, passing the tape carrier through a heating space while giving a reverse warp in the width direction thereof, and then passing the tape carrier through a cooling space. In the method for manufacturing a tape carrier, which reduces the warpage of the tape carrier in the width direction by passing the tape carrier in the heating space and the cooling space following the tape carrier, the pulley having a concave portion at the center as a support of the tape carrier is moved in the tape direction. In two rows, the tape carrier is sent while supporting the both ends in the width direction of the tape carrier to give a reverse warp thereto, and at the time of transporting the tape carrier, the tape width direction is increased without increasing the warpage in the longitudinal direction. The transport tension is controlled so that a predetermined value of tension for reducing the warpage is applied, and thereby the tape carrier is formed into a predetermined shape. Characterized in that it forms (Claim 1).

In the method for manufacturing a tape carrier according to the present invention, the predetermined value of tension may be a tape cross-sectional area of 1
The transport tension is controlled so that a tension of 150 gf or more per square mm is applied (claim 2).

According to the present invention, when the TAB tape is heated and cooled in a state where the TAB tape is shaped into a predetermined shape to reduce the warpage in the width direction, the warp in the longitudinal direction is increased by controlling the predetermined transport tension. Without warpage, the warp in the width direction of the tape can be reduced, whereby a TAB tape having a stable shape can be supplied.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for manufacturing a tape carrier according to the present invention will be described with reference to the drawings.

FIG. 1 shows an outline of a shaping device, in which a TAB tape 1 as a tape carrier is unwound from an unwinder 5, and is sequentially heated by a heating furnace (heating space) 7 and a cooling unit (cooling space). 9 and is wound by a winder 8.

In the heating space of the heating furnace 7 and the cooling space of the cooling section 9 following the heating space, the pulley 3 having a concave portion at the center as a shaping jig supports both sides of the TAB tape 1 in the width direction. The tapes are arranged in two rows in the tape running direction.

In order to smoothly deform the TAB tape in the heating furnace 7, a guide roll 6 serving as a trigger is provided in front of the heating furnace 7.

FIG. 2 shows a sectional structure of the shaping jig.
This shaping jig has a pulley 3 whose outer periphery is concave
Are a first row of pulley groups 3A that support one end of the TAB tape 1 in the width direction (the left-right direction in FIG. 2) and a second row of pulley groups 3B that support the other end of the TAB tape 1. 3B are provided on the pulley support 4 respectively. The left and right pulley groups 3A and 3B are provided on the pulley support base 4 at a position supporting both ends in the width direction of the TAB tape 1 at a fixed angle and arranged in two rows in a straight line.

That is, the shafts 3a of the pulleys 3 of the left and right pulley groups 3A and 3B are inclined in a reverse U-shape between both ends in the width direction of the TAB tape 1. Therefore, T
The bending direction at both ends in the width direction of the AB tape 1 coincides with the direction of the center of the trough on the peripheral surface of the pulley, so that the bending load is reduced.
Undesirable deformation of both ends of the AB tape 1 can be prevented. The pulley support 4 is movable in the width direction of the TAB tape 1 and constitutes an interval adjusting mechanism. The interval between the first row of pulley groups 3A and the second row of pulley groups 3B, To be precise, the interval between the troughs on the peripheral surface of the pulley can be set slightly smaller than the tape width for each of various types of TAB tapes 1. Accordingly, both ends in the width direction of the TAB tape 1 are supported between the trough portions of the pulley groups 3A and 3B on the left and right sides, and the TAB tape 1 is given a reverse warp in the width direction and does not involve friction due to the pulleys. And the TAB tape 1 can be shaped into a predetermined shape.

Next, a method of shaping a TAB tape using the shaping device will be described.

The formed TAB tape 1 generally has a warp. The TAB tape 1 is unwound from an unwinding machine 5 and heated after giving a certain shaping.

In the shaping method, the TAB tape 1 is fed into a row of two pulleys 3 to give a shape opposite to the warpage (reverse warpage).

In order to smoothly deform (reversely warp) the TAB tape 1 in the heating furnace 7, a guide roll 6 is provided in front of the heating furnace 7, and the TAB tape 1 is passed through the guide roll 6. Next, while this shaping (reverse warpage) is given, T
After taking out the AB tape 1 and sufficiently cooling it through the cooling section 9, the shaping (reverse warping) is released, and the TAB tape 1 is released.
The winding machine 8 completes the winding and shaping process.

The shaping width in this shaping step is not limited to the case where the tape width is different, but also has an optimum width depending on the constituent material and the wiring circuit pattern. By adjusting the pulley group, the pulley groups 3 located at both ends in the width direction of the TAB tape 1 are adjusted.
The interval between A and 3B is set to an optimal interval width in advance. At this time, by using the pulley 3, the friction at the time of transporting the TAB tape 1 can be reduced, so that a TAB tape having a stable shape with little warpage can be manufactured without undulation or the like at the end of the TAB tape.

The conditions for shaping the TAB tape vary greatly depending on the constituent materials and wiring circuit patterns, but generally the heating time is about 1 to 3 minutes and the heating temperature is 100 ° C. to 1 °.
About 50 ° C. is desirable.

In an application that needs to be cut into pieces having a square or nearly square shape, such as a T-BGA tape,
As with the correction for the warpage in the width direction, the correction for the warpage in the longitudinal direction is also important. Therefore, the speed controller 2 is assigned to the transport roller 10 located on the side of the winder 8 in the form of a pair of rollers, and the unwinder 5 functions as a tension control reel. Then, at the time of transporting the tape carrier, the transport tension is set so that a predetermined value of tension for reducing the warp in the width direction of the tape without increasing the warp in the longitudinal direction, that is, a tension of 150 gf or more per square mm of the tape cross-sectional area is applied. Control.

More specifically, if the tension in the step of correcting the warp in the width direction is set to 800 gf with respect to the tape width, the transport tension is set to 1500 gf.

When the tension in the step of correcting the warp in the width direction is set to 800 gf with respect to the tape width, the warp direction after the warp changes from the width direction to the length direction, and the warp amount is determined before and after the correction. In the case where the transfer tension is 1500 gf, warpage in the width direction can be reduced without occurrence of warpage in the longitudinal direction.

In addition, since tension is applied at the time of straightening, elongation occurs in the dimension in the longitudinal direction. Therefore, it is assumed that the circuit is corrected in advance in consideration of the longitudinal expansion in the pattern design.

<Other Embodiments and Modifications> The present invention is not limited to general TAB tapes,
It can also be applied to tape carriers for GA and COF.

In the above embodiment, a tape carrier using an adhesive has been described. However, even in the case of a two-layer material in which copper foil is bonded without an adhesive, warping and deformation occurring during processing are not limited to the constituent materials. Therefore, the present invention can be applied to a two-layer tape carrier having no adhesive, and the same effect as described above can be obtained. The same effect can be expected in the case where the solder resist or the photosensitive solder resist is provided, regardless of the presence or absence of the adhesive.

[0037]

As described above, according to the present invention, T
As a shaping jig for a tape carrier such as an AB tape, it is shaped while supporting the tape carrier using a pulley with a concave central part, so that warping is reduced uniformly and accurately without undulation and deformation. A tape carrier having a stable shape can be supplied.

Further, when the tape carrier is transported, a predetermined value of tension for reducing the warp in the width direction of the tape without increasing the warp in the longitudinal direction, for example, one square of the tape cross-sectional area.
Since the transport tension is controlled so that a tension of 150 gf or more per mm is applied, the warpage in the width direction of the tape is reduced without increasing the warpage in the longitudinal direction, thereby supplying a TAB tape having a stable shape. be able to.

[Brief description of the drawings]

FIG. 1 is a diagram showing a method for manufacturing a TAB tape according to the present invention.

FIG. 2 is a cross-sectional view of a TAB tape shaping jig in the manufacturing method of the present invention.

FIG. 3 is a sectional view showing a conventional TAB tape shaping jig.

[Explanation of symbols]

 Reference Signs List 1 TAB tape 2 Speed controller 3 Pulley 3a shaft 3A Pulley group in first row 3B Pulley group in second row 4 Pulley support 5 Unwinder (tension control reel) 6 Guide roll 7 Heating furnace 8 Winder 9 Cooling Department

Claims (2)

[Claims] 1. A tape carrier having a conductor pattern on one or both sides is passed through a heating space while giving a reverse warp in the width direction thereof, and then is passed through a cooling space to reduce the warpage of the tape carrier in the width direction. In the method for manufacturing a tape carrier, pulleys having a concave portion at the center are arranged in two rows in the tape direction as supports for the tape carrier over the heating space and the cooling space following the heating space, and both ends of the tape carrier in the width direction are provided. Along with feeding the tape carrier while giving a reverse warp by supporting the tape carrier, at the time of transporting the tape carrier, the transport tension is applied so as to apply a predetermined value of tension that reduces tape widthwise warpage without increasing longitudinal warpage. Controlling the tape carrier into a predetermined shape by controlling the tape carrier. 2. The method of manufacturing a tape carrier according to claim 1, wherein the transport tension is controlled so that the tension of the predetermined value is 150 gf or more per square mm of the tape cross section. Carrier manufacturing method.