JP2002343828A - Package of electronic component and method of packaging it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package, which raises the reliability of the connection of a chip carrier with a mother board, also reduces the cost of the package and can maintain the early performance of a small-sized and lightweight consumer electronic equipment extending over a long period, and to provide a method of packaging an electronic component. SOLUTION: In a packaging body, conductive projections 6, which are melted by heating, are provided on the electrodes 5 on at least one side of electrodes 4 on a first electric structure 1 and electrodes 5 on a second electric structure 3, an insulative bonding resin layer 7 exists between the structures 1 and 3 to bond the projections 6 to the electrodes 4 and 5 and the electrodes 4 and 5 on the structures 1 and 3 are electrically connected with each other through the projections 6 with are melted by the heating.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of an electronic component and a method thereof, and more particularly to a mounting structure and a mounting method of an electronic component such as a chip carrier on which a semiconductor element is mounted and a motherboard.

[0002]

2. Description of the Related Art Among semiconductor devices, a BGA (ball grid array) package and an LGA (land grid array) package have been proposed. These are semiconductor devices in which external connection electrodes of a chip carrier on which a semiconductor device is mounted are arranged in a grid on the back surface of the chip carrier.

[0003] The mounted semiconductor device has an advantage that the size of the semiconductor device is greatly reduced as compared with the conventional QFP (quarter flat package) because the external connection electrodes are provided on the back surface of the package. is there.

Conventionally, the electrode pitch of a package such as a CSP (chip size package) having a BGA or LGA structure is mainly 1.27 mm. Accompanying, 0.8mm
Those having a pitch of 0.5 mm have come to be used.

In a package having terminal electrodes of these pitches, solder balls such as BGA and LGA are usually mounted on the package in advance, and the solder balls are heated in a reflow furnace or the like and soldered to establish connection with the motherboard. On the other hand, an electrical connection is made by printing a solder paste on an electrode on the motherboard side, positioning and mounting a package thereon, and heating and soldering using a reflow furnace or the like.

[0006]

However, it has been found that there is a limit to further narrowing the pitch by using a technique such as BGA or LGA that uses only solder for connection. For example, solder has a very low viscosity at high temperatures and tends to flow.Therefore, if the amount of solder is large, short-circuiting occurs between the electrodes, and if the amount of solder is small, electrodes that cannot be connected come out or repeat. When used in equipment that repeats heating and cooling, for example, used in the CPU of a computer, even if an electrical connection is initially established, repeated use breaks the connection and the equipment operates. It has been known that the disappearance also has an adverse effect on the reliability of the device. The reason is that mainly due to the difference in the coefficient of thermal expansion between the chip or its carrier substrate and the motherboard, a shear stress is applied to the solder connection part, and the connection is physically broken, especially where the stress-prone connection is insufficient. It was because.

As an example of the improvement, see, for example, JP-A-8-236.
Japanese Patent Application Publication No. 654 is proposed. In particular, a resin layer is provided on the connection terminal side of a carrier substrate using a solder ball having a diameter of 0.5 mm to 1 mm, and the solder ball is fixed. The purpose is to reduce the shear stress applied to the connection interface of the solder balls.

However, according to this method, when the connection is made at a narrower pitch, the area of the solder connection portion between the mother board and the carrier substrate is reduced, so that a large shear stress is unavoidably applied to the connection portion, and a small electronic device is required. When used in devices, the electronic devices sometimes fail due to shear failure at the solder connection portion on the motherboard side. Also, it is known that a sealing resin material for bonding between a chip carrier and a motherboard, which is generally called underfill after soldering and mounting with solder balls or the like, is poured between the carrier substrate and the motherboard. The method takes time and trouble to pour the sealing resin material, and it is difficult to completely pour the sealing resin. In addition, it takes a lot of time to cure the sealing resin material, which causes a cost increase, and Electronic devices were often forgotten. Therefore, this technology has not been used for inexpensive consumer electronic devices requiring reliability over a long period of time, and has been often used mainly for expensive commercial devices.

The present invention is directed to a mounting body and a mounting method capable of improving the reliability of connection between a chip carrier and a mother substrate and reducing the cost, and maintaining the initial performance of a small and lightweight consumer electronic device for a long period of time. The purpose is to provide.

[0010]

In order to achieve the above object, a first electronic component package according to the present invention is provided on at least one of electrodes of a first electric structure and a second electric structure. A conductive protrusion that is melted by heating; an insulating adhesive resin layer is present between the first electrical structure and the second electrical structure; And the electrodes of the second electric structure are electrically connected to each other.

Next, in the second electronic component package according to the present invention, the first electric structure and the second electric structure are electrically connected to each other through conductive protrusions which are melted by heating. A mounting structure, wherein a terminal electrode of the first electric structure and a terminal electrode of the second electric structure are bonded by an insulating adhesive resin which melts and hardens when heated; The melting temperature of the electrode is higher than the melting temperature of the adhesive resin,
After the insulating adhesive resin is melted and hardened, the conductive projections are melted and hardened, so that the terminal electrodes of the first electric structure and the terminal electrodes of the second electric structure are electrically connected. It is characterized by being connected.

Next, the first mounting method of the present invention is the first mounting method.
While the conductive protrusion provided on at least one of the terminal electrode of the electric structure or the terminal electrode of the second electric structure is not melted by heating, the terminal electrode of the first electric structure and the terminal electrode of the second electric structure are not melted. The insulating resin which is provided between the terminal electrodes of the electric structure 2 and melted and hardened by heating is softened, and the protruding electrode breaks through the insulating resin and the terminal of the first electric structure. After the electrode and the second terminal electrode are in contact with each other and the softened adhesive insulating resin is cured, the protruding electrode is melted and cured to form the terminal electrode of the first electric structure and the second electric structure. Are connected.

Next, the second mounting method of the present invention is the first mounting method.
While the conductive protrusion provided on at least one of the terminal electrode of the electric structure and the terminal electrode of the second electric structure is not melted by the heating, the terminal electrode of the first electric structure and the terminal electrode of the second electric structure are not melted. The insulating resin, which is provided between the terminal electrodes of the electric structure and is melted and hardened by heating, is softened, and the conductive protrusion breaks through the insulating resin, and the terminal electrode of the first electric structure. And the second terminal electrode contact,
After the softened adhesive insulating resin is cured, the protruding electrode is melted and cured to connect the terminal electrode of the first electric structure and the terminal electrode of the second electric structure. The sheet-like resin which is melted by heating is sandwiched and fixed between the electric structure and the second electric structure, and is fixed and heated by a heating device. 2 is characterized by connecting the terminal electrodes of the electric structure.

Next, a third mounting method of the present invention is the first mounting method.
While the conductive protrusion provided on at least one of the terminal electrode of the electric structure and the terminal electrode of the second electric structure is not melted by the heating, the terminal electrode of the first electric structure and the terminal electrode of the second electric structure are not melted. The insulating resin, which is provided between the terminal electrodes of the electric structure and is melted and hardened by heating, is softened, and the conductive protrusion breaks through the insulating resin, and the terminal electrode of the first electric structure. And the second terminal electrode contact,
After the softened adhesive insulating resin is cured, the protruding electrode is melted and cured to connect the terminal electrode of the first electric structure and the terminal electrode of the second electric structure. 1
Forming an electric structure and a second electric structure by applying a resin that is melted by heating to one of the two surfaces, and forming a terminal electrode of the first electric structure and a second electric structure. The terminal electrodes of the first electric structure and the terminal electrodes of the second electric structure are connected by positioning and fixing the terminal electrodes and heating with a heating device.

Next, the fourth mounting method of the present invention is the first mounting method.
The conductive protrusions provided on at least one of the terminal electrode of the electric structure or the terminal electrode of the second electric structure are melted by heating while the terminal is not melted. The insulating resin that is provided between the terminal electrodes of the second electric structure and melted and hardened by heating is softened, and the conductive protrusions break through the insulating resin to form the first electric structure. After the terminal electrode and the second terminal electrode are in contact with each other and the softened adhesive insulating resin is cured, the protruding electrode is melted and cured to form a terminal electrode of the first electric structure and the second electric structure. When connecting the terminal electrodes of
The electric structure and the second electric structure are positioned and fixed by sandwiching a sheet of a resin that is melted by heating between the two, and heated by applying ultrasonic vibration to the terminal electrodes of the first electric structure. And a terminal electrode of the second electric structure.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION In the package of the present invention,
The adhesive resin layer is an insulating adhesive resin layer that melts and hardens when heated, and preferably has a melting temperature of the protruding electrode higher than a melting temperature of the adhesive resin. Taking into account actual process factors such as temperature variation in the reflow process, it is preferable that there is a difference in melting temperature (melting point) of about 10 ° C. or more.

Further, in the first mounting method of the present invention, by applying pressure from both sides of the first electric structure and the second electric structure, the conductive projection provided on at least one terminal electrode is formed. Breaks through the insulating resin that is melted by heating. Thus, electrical continuity between the first electric structure and the second electric structure is established.

Further, in the first mounting method of the present invention, the conductive material which is melted by heating provided on at least one of the terminal electrodes of the first electric structure and the terminal electrodes of the second electric structure. It is preferable that the projection is made of solder.

Further, in the second mounting method of the present invention, a sheet-like material which is sandwiched between the terminal electrodes of the first electric structure and the terminal electrodes of the second electric structure and which is melted by heating between the two. It is preferable that a hole is provided in advance in a protruding electrode portion of the resin provided on one of the terminal electrode of the first electric structure and the terminal electrode of the second electric structure.

In the second mounting method of the present invention, it is preferable that the hole is filled with a conductive paste.

In the third mounting method of the present invention, the heating temperature and time of the heating device are set to the temperature and time at which the resin sheet melted by heating is melted and hardened as the first step. It is preferable that the temperature is set to a temperature at which the conductive projection melts in two stages.

Further, in the third mounting method of the present invention, the conductive protrusion provided on at least one of the terminal electrode of the first electric structure or the terminal electrode of the second electric structure is provided at least partially. It is preferable that the material contains gold, silver, or copper.

[0023]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is a sectional view of a mounting structure before mounting to explain the contents of a first embodiment of the present invention.
Shown in

A first electric structure includes a CSP having a semiconductor bare chip 1 made of silicon on an interposer 2 made of ceramic, and a motherboard 3 as a second electric structure. The semiconductor bare chip 1 is electrically connected and physically fixed and attached to an interposer 2 made of ceramic. The interposer terminal electrode 4 is provided with a conductive bump 6. Further, the substrate 3 is provided with the substrate terminal electrode 5, and a solder resist 8 is provided on a portion other than the substrate terminal electrode 5 to prevent an electrical short circuit. The solder resist 8 is also provided on the surface of the interposer terminal electrode 4 to prevent an electrical short circuit. The interposer 2 on which the semiconductor bare chip 1 provided with the conductive bumps 6 is mounted is positioned with the substrate terminal electrodes 5 of the motherboard 3 and is temporarily fixed by the load 9 via the fusion bonding sheet 7. At this time, it is desirable that the molten adhesive sheet has some tackiness. As a material of the molten adhesive sheet 7, a hot-melt type thermosetting resin adhesive sheet which once melts and is cured when heat of about 140 ° C. is applied is used. The conductive bump 6 is made of a metal that is melted by heating at about 200 ° C., for example, a solder made of an alloy of lead and tin, a conductive adhesive, or the like.

The structure before mounting, which is positioned and temporarily fixed as shown in FIG. 1, is inserted into a reflow furnace, a heating furnace, or the like, and first, for example, at a temperature at which the molten adhesive sheet 7 is melted, for example, at 15 ° C.
Heat to 0 ° C. At that time, the molten adhesive sheet 7 is melted by heating and becomes almost liquid. At this time, the interposer 2 with the conductive bumps 6 is adhered to the motherboard 3, and at the same time, the conductive bumps 6 are sunk into the adhesive sheet 7 by its own weight, and the conductive bumps 6 contact the substrate terminal electrodes 5 of the motherboard 7. I do. Thereafter, when the temperature of 150 ° C. is maintained, the molten adhesive sheet starts to be cured in about 30 seconds, and is almost cured in about 1 minute, and the interposer 2 and the motherboard 3
Are glued.

FIG. 2 shows a cross section of the mounting structure of this embodiment after mounting. When the heating temperature is increased to 230 ° C. after bonding the interposer 2 and the motherboard 3, the conductive bumps are melted, and the substrate terminal electrode 5 and the interposer terminal electrode 4 are connected as shown in FIG. At this time, since the fusion bonding sheet is almost completely cured, the conductive bumps are not melted and do not spread to the adjacent terminal electrodes. After that, by lowering the temperature, the interposer 2 and the motherboard 3 are completely cured and adhered to the interposer 2 and the motherboard 3 by the conductive bumps 6, and are physically and firmly fixed, and are also completely electrically connected.

In this embodiment, the weight of the interposer 2 on which the semiconductor bare chip 1 is mounted is
The mother board 3 and the mother board 3 are bonded to each other. For example, by applying an appropriate compressive load to the interposer 2 and the mother board 3, the conductive bump 6 is more securely connected to the board terminal electrode 5 and the interposer terminal electrode 4.

In this embodiment, the bumps have a diameter of 50 μm, a height of 50 μm, and a pitch of 250 μm.

A reliability test was performed on the sample prepared as described above. (1) Gas phase heat cycle test from -40 ° C (30 minutes) to + 125 ° C (30 minutes) (2) Liquid phase heat cycle from -55 ° C (5 minutes) to + 150 ° C (5 minutes) A test was performed, and as a method of evaluation, the resistance value of the connection was monitored, and the life when the load of the thermal cycle was applied was determined with the point at which the resistance value increased by 10% or more compared to the initial resistance as an end point. . The results are summarized in Table 1 below.

(Embodiment 2) FIG. 3 is a cross-sectional view of a mounting structure before mounting to explain a second embodiment of the present invention. Example 2 is basically the same as Example 1 except that holes 10 for connecting the conductive bumps 6 are provided in advance on the fusion bonding sheet. The hole 10 provided in the fusion bonding sheet 7 is provided between the interposer 2 on which the semiconductor bare chip 1 is mounted and the motherboard 3.
Is provided by laser processing, punching, drilling, etc., before positioning is fixed.

In this embodiment, the fusion bonding sheet 7 having the holes 10 formed thereon is bonded to the motherboard 3 and then the interposer 2 on which the semiconductor bare chip 1 is mounted is temporarily fixed, but the fusion bonding sheet 7 is bonded to the motherboard 3. After attaching, the hole 10 may be provided by laser processing or the like.

The manufacturing steps such as the heating conditions are basically the same as those in the first embodiment, but the holes 10 are formed in the molten adhesive sheet 7 so that the positioning of the interposer 2 provided with the conductive bumps 6 is easy. It is. Further, the contact between the conductive bumps 6 and the substrate terminal electrodes 5 becomes more reliable.

Further, by using the adhesive sheet 7 in which the conductive paste is filled in the holes 10, it is possible to further improve the reliability. Although various kinds of conductive pastes can be used in this case, those containing a thermosetting resin as a binder are preferable. Also, like the conductive bump, it is desirable that the melting point is higher than that of the adhesive resin by about 10 ° C. or more. In addition, a solder paste or the like can be used as the conductive paste. By filling the holes with the conductive paste, the connection reliability can be further improved, and the connection life can be improved to about 1.5 times.

In the same manner as in Example 1, the sample prepared in Example 2 was subjected to a reliability test. (1) Gas phase heat cycle test from -40 ° C (30 minutes) to + 125 ° C (30 minutes) (2) Liquid phase heat cycle from -55 ° C (5 minutes) to + 150 ° C (5 minutes) A test was performed, and as a method of evaluation, the resistance value of the connection was monitored, and the life when the load of the thermal cycle was applied was determined with the point at which the resistance value increased by 10% or more compared to the initial resistance as an end point. . The results are summarized in Table 1 below.

Comparative Example 1 For comparison, a description will be given of an example of a conventional mounting structure that is structurally disadvantageous in maintaining reliability. The interposer 2 on which the semiconductor bare chip 1 is mounted is electrically connected between the board terminal electrodes 5 and the interposer terminal electrodes 4 via the motherboard 3 and the solder balls 11 and is physically fixed.

In the manufacturing method, a solder ball is temporarily bonded in advance to the interposer terminal electrode 4 of the interposer 2 on which the semiconductor bare chip 1 is mounted, and the solder ball is temporarily fixed on the mother board 3 and the solder is melted in a reflow furnace or the like. Heat to a temperature of around 230 ° C, melt the solder,
Make a connection.

In the same manner as in Example 1, a reliability test was performed on the sample prepared in Comparative Example. (1) Gas phase heat cycle test from -40 ° C (30 minutes) to + 125 ° C (30 minutes) (2) Liquid phase heat cycle from -55 ° C (5 minutes) to + 150 ° C (5 minutes) A test was performed, and as a method of evaluation, the resistance value of the connection was monitored, and the life when the load of the thermal cycle was applied was determined with the point at which the resistance value increased by 10% or more compared to the initial resistance as an end point. . Table 1 summarizes the results of the reliability tests.

[0039]

[Table 1]

In Examples 1 and 2, which are the constitutions of the present invention, the end points of all the tests were 2,000 cycles or more, whereas the comparative examples reached the end points of 1,000 cycles or less. I have. Therefore, the sample prepared in the embodiment of the present invention has a long life.

In this embodiment, an interposer made of ceramic is used as an interposer for mounting a semiconductor bare chip. However, when an interposer made of resin is used, the end point is also 2000 cycles or more, and the reliability is extremely high. Was confirmed.

As described above, in the embodiment of the present invention, a very reliable and narrow pitch mounting becomes possible with a very simple process. In particular, the CSP and the like are simultaneously performed in the same process as other SMD (surface mounting component) components. Since the active components can also be mounted, electronic devices can be manufactured easily at low cost and the effect is extremely large.

It is desirable that the melted adhesive sheet has an appropriate flexibility. Therefore, in this embodiment, a sheet material having appropriate flexibility was used.

In order to radiate heat from the semiconductor bare chip to the motherboard through the interposer, a heat conductive filler may be added to the sheet material to improve heat dissipation.
Applications for mounting MPUs and the like that operate at high speed are further expanded.

Even when a resin material containing such a thermally conductive filler is used, the end point of the reliability test is 20 points.
It was confirmed that 00 cycles or more could be secured, and the reliability was high as in the case of an interposer using ceramic or resin.

In this embodiment, only the case where a semiconductor device having a bare chip mounted on an interposer is mounted on a glass epoxy substrate as a mounting structure is described, but other printed circuit boards such as surface mount components and package components are mounted. Obviously, it can also be applied to implementations on. Further, the present invention can also be applied to bare chip mounting such as C4. It can also be used to connect a plurality of flexible and rigid substrates.

[0047]

According to the present invention, in a very simple process,
Very reliable and narrow pitch mounting is possible, especially in the same process as other SMD (Surface Mounted Parts) components.
Since active components such as SPs can also be mounted, ultra-small portable electronic devices and the like can be manufactured at low cost and easily, and the effect is extremely large.

[Brief description of the drawings]

FIG. 1 is a sectional view of a mounting structure according to a first embodiment of the present invention before mounting.

FIG. 2 is a sectional view of the mounting structure according to the first and second embodiments of the present invention after mounting.

FIG. 3 is a sectional view of a mounting structure according to a second embodiment of the present invention before mounting.

FIG. 4 is a side view after mounting of a mounting structure for explaining a comparative example;

[Explanation of symbols]

 Reference Signs List 1 semiconductor bare chip (silicon) 2 interposer (ceramic or resin) 3 motherboard 4 interposer terminal electrode 5 substrate terminal electrode 6 conductive bump 7 fusion bonding sheet 8 solder resist 9 load 10 hole 11 solder ball

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification FI FI Theme Court II (Reference) H05K 3/34 507 (72) Inventor Hiroki Takezawa 1006 Kadoma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. ( 72) Inventor Yukihiro Ishimaru 1006 Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. EA11 5E319 AA03 AA07 AB05 AC01 BB04 BB20 CC12 CC33 CD13 GG01 GG15 5F044 KK17 KK18 LL05 LL11 QQ02 QQ03 5F061 AA01 BA03 CA22

Claims (13)

[Claims] 1. An electrode for a first electric structure and an electrode of a second electric structure, wherein at least one of the electrodes has a conductive protrusion that is melted by heating, and the first electric structure and the second electric structure are provided. An insulating adhesive resin layer exists between the electrodes, and the electrodes of the first electric structure and the second electric structure are electrically connected by the conductive protrusions that are melted by the heating. Electronic components mounted. 2. The electronic component according to claim 1, wherein the adhesive resin layer is an insulating adhesive resin layer that melts and hardens when heated, and a melting temperature of the protruding electrode is higher than a melting temperature of the adhesive resin. Implementation body. 3. The first electric structure and the second electric structure,
A mounting structure electrically connected via conductive protrusions that are melted by heating, wherein the space between the terminal electrode of the first electric structure and the terminal electrode of the second electric structure is melted and cured when heated. The melting temperature of the protruding electrode is higher than the melting temperature of the adhesive resin, and the insulating adhesive resin is melted and hardened before the conductive A mounting body for an electronic component, wherein the terminal electrodes of the first electric structure and the terminal electrodes of the second electric structure are electrically connected by melting and curing the projections. 4. The method according to claim 1, wherein the conductive projections provided on at least one of the terminal electrode of the first electric structure and the terminal electrode of the second electric structure which are melted by heating do not melt.
The insulating resin which is provided between the terminal electrode of the electric structure and the terminal electrode of the second electric structure and which is melted and cured by heating is softened, and the protruding electrode is formed of the insulating resin. After the terminal electrode of the first electric structure comes into contact with the second terminal electrode and the softened adhesive insulating resin is cured, the protruding electrode is melted and cured to form the first electric structure. Wherein the terminal electrode of the second electric structure is connected to the terminal electrode of the second electric structure. 5. An electrically conductive projection provided on at least one terminal electrode by applying pressure from both sides of the first electric structure and the second electric structure, thereby forming an insulating resin which is melted by heating. The method for mounting an electronic component according to claim 4, wherein the electronic component is pierced. 6. The method according to claim 6, further comprising the steps of:
5. The electronic component mounting method according to claim 4, wherein the conductive protrusion which is provided on at least one of the terminal electrodes of the electric structure and is melted by heating is solder. 7. The first electric structure while at least one of the terminal protrusions of the first electric structure and the terminal electrodes of the second electric structure is not melted by the conductive protrusions which are melted by heating. The insulating resin, which is provided between the terminal electrode of the second electric structure and the terminal electrode of the second electric structure and is melted and cured by heating, is softened, and the conductive protrusions pierce the insulating resin to form the first resin. After the terminal electrode of the electric structure and the second terminal electrode are in contact with each other and the softened adhesive insulating resin is cured, the protruding electrode is melted and cured to be in contact with the terminal electrode of the first electric structure. When connecting the terminal electrodes of the second electric structure, the first electric structure and the second electric structure are positioned and fixed by sandwiching a sheet-like resin which is melted by heating between the two. By heating the first electric structure. When mounting method of electronic components, characterized by connecting the terminal electrodes of the second electric structure. 8. A terminal of the first electric structure made of a sheet-like resin sandwiched between the terminal electrodes of the first electric structure and the terminal electrodes of the second electric structure and melted by heating between the two. 8. The electronic component mounting method according to claim 7, wherein a hole is provided in advance in a protruding electrode portion provided on one of the electrode and the terminal electrode of the second electric structure. 9. A terminal of the first electric structure, which is sandwiched between the terminal electrodes of the first electric structure and the terminal electrodes of the second electric structure, and is made of a sheet-like resin which is melted by heating between the two. 8. The electronic device according to claim 7, wherein a hole is provided in a protruding electrode portion provided on one of the electrode and the terminal electrode of the second electric structure, and the hole is filled with a conductive paste. Component mounting method. 10. The terminal electrode of the first electric structure or the second electrode.
Between the terminal electrode of the first electric structure and the terminal electrode of the second electric structure, while the conductive projection provided on at least one of the terminal electrodes of the electric structure does not melt. The provided insulating resin that is melted and hardened by heating is softened, the conductive protrusions pierce the insulating resin, and the terminal electrode of the first electric structure comes into contact with the second terminal electrode, After the softened adhesive insulating resin is cured, the protruding electrode is melted and cured to connect the terminal electrode of the first electric structure and the terminal electrode of the second electric structure. The first electrical structure and the second electrical structure,
Forming a resin that is melted by heating on one of the two surfaces by coating, positioning and fixing the terminal electrodes of the first electric structure and the terminal electrodes of the second electric structure, and heating with a heating device. A terminal electrode of the first electric structure and a terminal electrode of the second electric structure. 11. The heating temperature and time of the heating device are set to the first
The mounting of the electronic component according to claim 10, wherein a temperature and a time at which the resin sheet melted by heating is melted and hardened as a step are set, and a temperature at which the conductive protrusions are melted is set as a second step. Method. 12. A conductive projection provided on at least one of the terminal electrode of the first electric structure or the terminal electrode of the second electric structure is a material containing at least a part of gold, silver or copper. A method for mounting an electronic component according to claim 10. 13. The terminal of the first electric structure or the second electrode.
While the conductive projections provided on at least one of the terminal electrodes of the electric structure are melted by heating, the terminal electrodes of the first electric structure and the terminal electrodes of the second electric structure are not melted. The insulating resin that is melted and hardened by heating provided therebetween is softened, and the conductive protrusion breaks through the insulating resin, and the terminal electrode of the first electric structure and the second terminal are connected to each other.
After the terminal electrodes contact and the softened adhesive insulating resin is cured, the protruding electrodes are melted and cured, and the terminal electrodes of the first electric structure and the terminal electrodes of the second electric structure are separated. When connecting, the first electrical structure and the second electrical structure,
A resin sheet that is melted by heating is sandwiched and fixed between the two, and the terminal electrode of the first electric structure is connected to the terminal electrode of the second electric structure by heating by applying ultrasonic vibration. A mounting method of a mounted body of an electronic component, characterized in that: