JP2002341324A - Manufacturing method for liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for a liquid crystal display device, by which the occurrence of breaking and chipping are prevented. SOLUTION: After a sealing agent 3 for sealing a liquid crystal is applied on at least one inner surface of a liquid crystal driving substrate 1 and a counter substrate 2 and the both substrates are laminated to each other, the outer region parts of the liquid crystal driving substrate 1 and the counter substrate 2, corresponding to the inner region where the sealing agent 3 for sealing the liquid crystal is applied, are cut by a blade 4 for dicing to form a liquid crystal panel part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a liquid crystal display.

[0002]

2. Description of the Related Art Recently, a liquid crystal display device with a screen display has been widely used as a display device of an AV device, an OA device product, or the like. In the meantime, the liquid crystal display device itself needs to be reduced in size and size.

In order to reduce the size and size of the liquid crystal display device itself, it is necessary to reduce the size and size of the liquid crystal display substrate, the counter substrate, the liquid crystal display panel, the circuit mounting, the housing, and the manufacturing process such as modularization. In particular, in the cutting step after bonding the liquid crystal drive substrate and the counter substrate, which is one of the steps of the liquid crystal display panel manufacturing process, the conventional outer shape accuracy after cutting was about ± 0.3 mm,
Outer accuracy is ±
It must be 0.1 mm.

FIG. 4 shows an example of a conventional method for securing the outer shape accuracy after cutting. After the liquid crystal driving substrate 1 and the opposing substrate 2 are bonded together, they are cut by a dicing blade 4 to form a liquid crystal display panel. In this case, the cut portion formed by cutting the liquid crystal driving substrate and the corresponding substrate by the dicing blade 4 is as shown in FIG.

[0005]

However, the dicing blade 4 contains abrasive grains of about 10 to 100 μm. In the above-described conventional manufacturing method, the abrasive grains contained in the dicing blade 4 cause As shown in (b), chipping occurs at positions 5a to 5d, which are corners of a cut portion formed by cutting the liquid crystal driving substrate 1 and the opposing substrate 2 by the dicing blade 4. The size of the chipping varies depending on the size of the abrasive grains and the vibration of the dicing blade 4 caused by stress on the liquid crystal driving substrate 1 and the opposing substrate 2.

The chipping generated at the positions 5b and 5c in FIG. 4B destroys the liquid crystal driving wirings on the inner surface of the substrate and causes a problem as a liquid crystal display device.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to provide a method of manufacturing a liquid crystal display device capable of preventing the occurrence of chipping.

[0008]

According to a first aspect of the present invention, there is provided a method of manufacturing a liquid crystal display device, comprising applying a liquid crystal encapsulating sealant to at least one inner surface of a liquid crystal driving substrate and a counter substrate, and The substrate and the counter substrate are bonded together via the liquid crystal sealing sealant, and the liquid crystal driving substrate and the counter substrate are bonded together. A method for manufacturing a liquid crystal display device that forms a liquid crystal panel component by cutting with a blade, wherein the dicing blade,
The liquid crystal driving substrate and the opposing substrate are cut at a portion of an outer surface region corresponding to the inner surface region where the liquid crystal sealing sealant is applied. Accordingly, it is possible to prevent chipping and chipping on the inner surfaces of the liquid crystal driving substrate and the opposing substrate during cutting by the dicing blade.

According to a second aspect of the present invention, in the method for manufacturing a liquid crystal display device according to the first aspect, the dicing blade cuts the liquid crystal driving substrate and the opposite substrate. The liquid crystal sealing sealant may include an inner surface area applied to one side of a cut portion that can be formed.
Accordingly, vibration of the liquid crystal driving substrate and the opposing substrate during cutting by the dicing blade can be suppressed, and generation of chipping on the inner surfaces of the liquid crystal driving substrate and the opposing substrate can be suppressed.

According to a third aspect of the present invention, in the method for manufacturing a liquid crystal display device according to the first aspect, the dicing blade cuts the liquid crystal driving substrate and the opposite substrate. The present invention is characterized in that it includes an inner surface region where the liquid crystal sealing sealant is applied to both sides of the cut portion that can be formed. This makes it possible to suppress vibration of the liquid crystal driving substrate and the opposing substrate during cutting by the dicing blade, and to more efficiently suppress chipping and chipping on the inner surfaces of the liquid crystal driving substrate and the opposing substrate.

According to a fourth aspect of the present invention, in the method of manufacturing a liquid crystal display device according to any one of the first to third aspects, a part of the cut surface of the liquid crystal driving substrate is provided. And performing the cutting such that a part of the cut surface of the sealant for sealing the liquid crystal and a part of the cut surface of the counter substrate form a plane. Thereby, the outer shape accuracy after cutting by the dicing blade can be secured.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. Note that the embodiment described here is merely an example, and the present invention is not necessarily limited to this.

(Embodiment 1) Hereinafter, a method for manufacturing a liquid crystal display device according to Embodiment 1 will be described. FIG.
It is a figure which shows the cut surface by a dicing blade. In FIG. 1, 1 is a liquid crystal driving substrate, 2 is a counter substrate, 3 is a sealant for sealing liquid crystal, 4 is a dicing blade, and 10 is a suction table. The vertical positional relationship between the liquid crystal driving substrate 1 and the counter substrate 2 may be reversed if necessary.

First, a sealant 3 for sealing a liquid crystal is applied to at least one inner surface of the liquid crystal driving substrate 1 and the counter substrate 2. Then, the liquid crystal driving substrate 1 and the counter substrate 2 are bonded together via the liquid crystal sealing sealant 3 and placed on the suction table 10.

Then, in a state where the liquid crystal driving substrate 1 and the opposing substrate are bonded to each other, they are cut by a dicing blade 4 in a direction perpendicular to a direction in which the substrates extend.
At this time, a portion of the outer surface region of the liquid crystal driving substrate 1 and the opposite substrate 2 corresponding to the inner surface region where the liquid crystal sealing sealant 3 is applied is cut. The above-described cutting is performed so that a part of the cut surface of the liquid crystal driving substrate 1, a part of the cut surface of the liquid crystal sealing sealant 3, and a part of the cut surface of the counter substrate 2 form a plane. Shall be.

The liquid crystal driving substrate 1 and the opposing substrate 2 bonded together via the liquid crystal sealing sealant 3 are cut off by the dicing blade 4 by the thickness of the dicing blade 4, and are shown in FIG. As described above, when one side of the cut portion formed by cutting the liquid crystal driving substrate 1 and the counter substrate 2 by the dicing blade 4 includes an inner surface area where the liquid crystal sealing sealant 3 is applied, the liquid crystal driving substrate 1 and the The vibration of the opposing substrate 2 can be suppressed, and the occurrence of chipping and chipping on the inner surface of each substrate can be suppressed. In addition, as shown in FIG. 3, a case where the dicing blade 4 cuts the liquid crystal driving substrate 1 and the opposing substrate 2 on both sides of a cut portion includes an inner surface area where the liquid crystal sealing sealant 3 is applied. In addition, the vibration of the liquid crystal driving substrate 1 and the counter substrate 2 can be further suppressed, and the occurrence of chipping and chipping on the inner surface of each substrate can be suppressed more efficiently.

According to the manufacturing method of the liquid crystal display device according to the first embodiment, the inner surface of the liquid crystal driving substrate 1 and the opposite substrate 2 on which the liquid crystal sealing sealant 3 is applied by the dicing blade 4. A part of the outer surface region corresponding to the region is cut, and a part of the cut surface of the liquid crystal driving substrate 1, a part of the cut surface of the liquid crystal sealing sealant 3, and a part of the cut surface of the counter substrate 2 are cut. Since the above-mentioned cutting is performed so as to form a plane, the outer shape accuracy after the cutting can be ensured, and the occurrence of chipping and chipping on the inner surfaces of the liquid crystal driving substrate and the counter substrate can be suppressed.

[0018]

According to the method of manufacturing a liquid crystal display device according to the first aspect of the present invention, a liquid crystal encapsulating sealant is applied to at least one of the inner surfaces of the liquid crystal driving substrate and the opposing substrate. And the opposing substrate are bonded via the liquid crystal sealing sealant, and the liquid crystal driving substrate and the opposing substrate are bonded to each other. A liquid crystal display device for forming a liquid crystal panel component by cutting the liquid crystal panel component, wherein an inner surface area of the liquid crystal driving substrate and the counter substrate on which the liquid crystal sealing sealant is applied by the dicing blade. Since the portion of the outer surface region corresponding to the above is cut, it is possible to prevent the occurrence of chipping on the inner surfaces of the liquid crystal driving substrate and the counter substrate.

According to a second aspect of the present invention, in the method for manufacturing a liquid crystal display device according to the first aspect, the liquid crystal driving substrate and the opposing substrate are separated by the dicing blade. On one side of the cut portion that can be cut, by including the inner surface area where the liquid crystal sealing sealant is applied, the vibration of the liquid crystal drive substrate and the counter substrate during cutting by the dicing blade is suppressed, and
The occurrence of chipping and chipping on the inner surfaces of the liquid crystal driving substrate and the counter substrate can be suppressed.

According to a third aspect of the present invention, in the method for manufacturing a liquid crystal display device according to the first aspect, the liquid crystal driving substrate and the opposite substrate are separated by the dicing blade. On both sides of the cut portion that can be cut, by including the inner surface area where the liquid crystal sealing sealant is applied, the vibration of the liquid crystal drive substrate and the counter substrate during cutting by the dicing blade is suppressed, and
The occurrence of chipping and chipping on the inner surfaces of the liquid crystal driving substrate and the counter substrate can be suppressed more efficiently.

According to a fourth aspect of the present invention, in the method of manufacturing a liquid crystal display device according to any one of the first to third aspects, the cut surface of the liquid crystal driving substrate is provided. , A part of the cut surface of the sealant for sealing the liquid crystal, and a part of the cut surface of the counter substrate, the cutting is performed so that the outer shape accuracy after cutting is reduced. Can be secured.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an example of a cut portion after being cut by a dicing blade.

FIG. 2 is a cross-sectional view illustrating an example of a cut portion after cutting with a dicing blade.

FIG. 3 is a cross-sectional view illustrating an example of a cut portion after cutting with a dicing blade.

FIG. 4 is a cross-sectional view of a portion cut by a dicing blade in a conventional method of manufacturing a liquid crystal display device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Liquid-crystal drive board 2 Counter-substrate 3 Liquid crystal sealing sealant 4 Dicing blade 5a, 5b, 5c, 5d Chipping and chipping 10 Suction table

Continuing on the front page (72) Inventor Hitoshi Seki 1006 Kadoma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. 2H088 FA03 FA04 FA06 FA07 HA01 MA20 2H089 NA37 NA39 QA01 QA12 QA16 TA01 2H090 JA11 JA13 JB02 JC13 JD15

Claims (4)

[Claims] An inner surface of at least one of a liquid crystal driving substrate and a counter substrate is coated with a sealing agent for liquid crystal sealing, and the liquid crystal driving substrate and the counter substrate are bonded to each other via the sealing agent for liquid crystal sealing; In a method of manufacturing a liquid crystal display device, a liquid crystal panel component is formed by cutting the liquid crystal driving substrate and the counter substrate in a state of being bonded together with a dicing blade in a direction perpendicular to a direction in which the substrates extend. A liquid crystal display device, wherein the dicing blade cuts a portion of an outer surface region of the liquid crystal driving substrate and the opposite substrate corresponding to an inner surface region on which the liquid crystal sealing sealant is applied. Manufacturing method. 2. The method for manufacturing a liquid crystal display device according to claim 1, wherein the sealing agent for sealing the liquid crystal is provided on one side of a cut portion formed by cutting the liquid crystal driving substrate and the counter substrate with the dicing blade. A method for manufacturing a liquid crystal display device, comprising: an inner surface area on which is coated. 3. The method for manufacturing a liquid crystal display device according to claim 1, wherein the sealing agent for sealing the liquid crystal is provided on both sides of a cut portion formed by cutting the liquid crystal driving substrate and the counter substrate with the dicing blade. A method for manufacturing a liquid crystal display device, comprising: an inner surface area on which is coated. 4. The method for manufacturing a liquid crystal display device according to claim 1, wherein a part of the cut surface of the liquid crystal driving substrate and one of the cut surfaces of the liquid crystal sealing sealant are formed. A method for manufacturing a liquid crystal display device, characterized in that the cutting is performed such that a portion and a part of a cut surface of the counter substrate are plane.