JP2002323646A5 - - Google Patents

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JP2002323646A5
JP2002323646A5 JP2002045461A JP2002045461A JP2002323646A5 JP 2002323646 A5 JP2002323646 A5 JP 2002323646A5 JP 2002045461 A JP2002045461 A JP 2002045461A JP 2002045461 A JP2002045461 A JP 2002045461A JP 2002323646 A5 JP2002323646 A5 JP 2002323646A5
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chip
light
refractive index
communication system
optical communication
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レーザチップと該レーザチップと接続される光通信システムにおいて、前記レーザチップは発振波長が1.1μm〜1.7μmであり、光を発生する活性層の主たる元素がGa、In、N、Asからなる層、若しくはGa、In、Asよりなる層とし、レーザ光を得るために前記活性層の上部及び下部に設けられた反射鏡を含んだ共振器構造を有する面発光型半導体レーザ素子チップであって、前記反射鏡は反射波長が1.1μm以上で該反射鏡を構成する材料層の屈折率が小大と異なる値に周期的に変化し入射光を光波干渉によって反射する半導体分布ブラッグ反射鏡であるとともに、前記屈折率が小の材料層はAlxGa1−xAs(0<x≦1)とし、前記屈折率が大の材料層はAlyGa1−yAs(0≦y<x≦1)とし、かつ前記屈折率が小と大の材料層の間に該屈折率が小と大の間の値をとるAlzGa1−zAs(0≦y<z<x≦1)よりなるヘテロスパイク緩衝層の厚さを、5nm〜50nmの厚さであって、前記半導体分布ブラッグ反射鏡の反射率変化が急激に大きくならない範囲とした反射鏡であるような面発光型半導体レーザ素子チップを発光光源とした光通信システムであって、該面発光型半導体レーザ素子チップの光出射部に内接する円の直径をd、光ファイバのコア直径をFとすると、0.5≦F/d≦2であることを特徴とする光通信システム。In an optical communication system connected to a laser chip and the laser chip, the laser chip has an oscillation wavelength of 1.1 μm to 1.7 μm, and main elements of an active layer that generates light are from Ga, In, N, and As. A surface emitting semiconductor laser device chip having a resonator structure including a reflecting mirror provided on the upper and lower portions of the active layer in order to obtain laser light. The reflective mirror has a reflection wavelength of 1.1 μm or more, and the refractive index of the material layer constituting the reflective mirror periodically changes to a different value from small and large so that incident light is reflected by light wave interference, and is a semiconductor distributed Bragg reflector And the material layer with a small refractive index is AlxGa1-xAs (0 <x ≦ 1), the material layer with a large refractive index is AlyGa1-yAs (0 ≦ y <x ≦ 1), and Folding rate the thickness of the hetero spike buffer layer the refractive index composed of Alz Ga1-zAs takes a value between the small and large (0 ≦ y <z <x ≦ 1) between the small and large material layer, In an optical communication system using a surface-emitting type semiconductor laser device chip having a thickness of 5 nm to 50 nm as a light-emitting light source that is a reflecting mirror in a range in which the reflectance change of the semiconductor distributed Bragg reflecting mirror does not suddenly increase In this case, when the diameter of a circle inscribed in the light emitting portion of the surface emitting semiconductor laser element chip is d and the core diameter of the optical fiber is F, 0.5 ≦ F / d ≦ 2. Optical communication system. レーザチップと該レーザチップと接続される光通信システムにおいて、前期レーザチップは、光を発生する活性層の主たる元素がGa、In、N、Asからなる層、もしくはGa、In、Asよりなる層とし、レーザ光を得るために前記活性層の上部及び下部に設けられた反射鏡を含んだ共振器構造を有する面発光型半導体レーザ素子チップであって、前記反射鏡を構成する材料層の屈折率が小大異なる値に周期的に変化し、入射光を光波干渉によって反射する半導体分布ブラッグ反射鏡であるとともに、前記屈折率が小の材料層はAlxGa1−xAs(0<x≦1)とし、前記屈折率が大の材料層はAlyGa1−yAs(0≦y<x≦1)とし、かつ前記屈折率が小と大の材料層の間に該屈折率が小と大の間の値をとるAlzGa1−zAs(0≦y<z<x≦1)よりなるヘテロスパイク緩衝層を20nm〜50nmの厚さに設けた反射鏡であるような面発光型半導体レーザ素子チップを発光光源とした光通信システムであって、該面発光型半導体レーザ素子チップの光出射部に内接する円の直径をd、光ファイバのコア直径をFとすると、0.5≦F/d≦2であることを特徴とする光通信システム。In a laser chip and an optical communication system connected to the laser chip, the first laser chip is a layer in which the main element of the active layer for generating light is made of Ga, In, N, As, or a layer made of Ga, In, As A surface-emitting type semiconductor laser device chip having a resonator structure including reflecting mirrors provided above and below the active layer in order to obtain a laser beam, wherein the material layer constituting the reflecting mirror is refracted The refractive index is a semiconductor distributed Bragg reflector that periodically changes to slightly different values and reflects incident light by light wave interference, and the material layer having a small refractive index is AlxGa1-xAs (0 <x ≦ 1). The material layer having a large refractive index is set to AlyGa1-yAs (0 ≦ y <x ≦ 1), and the refractive index has a value between the small and large material layers between the small and large material layers. AlzGa1- In an optical communication system using a surface-emitting type semiconductor laser device chip, which is a reflecting mirror provided with a hetero spike buffer layer made of As (0 ≦ y <z <x ≦ 1) in a thickness of 20 nm to 50 nm, as a light source. In this case, when the diameter of a circle inscribed in the light emitting portion of the surface emitting semiconductor laser element chip is d and the core diameter of the optical fiber is F, 0.5 ≦ F / d ≦ 2. Optical communication system. レーザチップと該レーザチップと接続される光通信システムにおいて、前記レーザチップは、発振波長が1.1μm〜1.7μmであり、光を発生する活性層の主たる元素がGa、In、N、Asからなる層、もしくはGa、In、Asよりなる層とし、レーザ光を得るために前記活性層の上部及び下部に設けられた反射鏡を含んだ共振器構造を有する面発光型半導体レーザ素子チップであって、前記反射鏡は反射波長が1.1μm以上で該反射鏡を構成する材料層の屈折率が小大異なる値に周期的に変化し、入射光を光波干渉によって反射する半導体分布ブラッグ反射鏡であるとともに、前記屈折率が小の材料層はAlxGa1−xAs(0<x≦1)とし、前記屈折率が大の材料層はAlyGa1−yAs(0≦y<x≦1)とし、かつ前記屈折率が小と大の材料層の間に該屈折率が小と大の間の値をとるAlzGa1−zAs(0≦y<z<x≦1)よりなるヘテロスパイク緩衝層を20nm〜50nmの厚さに設けた反射鏡であるような面発光型半導体レーザ素子チップを発光光源とした光通信システムであって、該面発光型半導体レーザ素子チップの光出射部に内接する円の直径をd、光ファイバのコア直径をFとすると、0.5≦F/d≦2であることを特徴とする光通信システム。In an optical communication system connected to a laser chip and the laser chip, the laser chip has an oscillation wavelength of 1.1 μm to 1.7 μm, and main elements of an active layer that generates light are Ga, In, N, As Or a layer made of Ga, In, As, and a surface emitting semiconductor laser device chip having a resonator structure including reflectors provided above and below the active layer to obtain laser light. The reflection mirror has a reflection wavelength of 1.1 μm or more, and the refractive index of the material layer constituting the reflection mirror periodically changes to a slightly different value, and reflects the incident light by light wave interference. The material layer having a small refractive index is AlxGa1-xAs (0 <x ≦ 1), the material layer having a large refractive index is AlyGa1-yAs (0 ≦ y <x ≦ 1), and in front A hetero spike buffer layer made of AlzGa1-zAs (0 ≦ y <z <x ≦ 1) having a value between the small and large refractive index between the small and large material layers is 20 nm to 50 nm. An optical communication system using a surface-emitting type semiconductor laser device chip as a light-emitting light source such as a reflecting mirror provided in a thickness, wherein a diameter of a circle inscribed in a light emitting portion of the surface-emitting type semiconductor laser device chip is d An optical communication system, wherein the core diameter of the optical fiber is F, and 0.5 ≦ F / d ≦ 2. レーザチップと該レーザチップと接続される光通信システムにおいて、前記レーザチップは発振波長が1.1μm〜1.7μmであり、光を発生する活性層を、主たる元素がGa、In、N、Asからなる層、もしくはGa、In、Asよりなる層とし、レーザ光を得るために前記活性層の上部及び下部に設けられた反射鏡を含んだ共振器構造を有する面発光型半導体レーザ素子チップであって、前記反射鏡は反射波長が1.1μm以上で該反射鏡を構成する材料層の屈折率が小大と異なる値に周期的に変化し入射光を光波干渉によって反射する半導体分布ブラッグ反射鏡であるとともに、前記屈折率が小の材料層はAlxGa1−xAs(0<x≦1)とし、前記屈折率が大の材料層はAlyGa1−yAs(0≦y<x≦1)とした反射鏡であり、前記活性層と前記反射鏡の間に主たる組成がGaxIn1−xPyAs1−y(0<x≦1、0<y≦1)層よりなる非発光再結合防止層を設けてなる面発光型半導体レーザ素子チップを発光光源としたものであり、該面発光型半導体レーザ素子チップの光出射部に内接する円の直径をd、光ファイバのコア直径をFとすると、0.5≦F/d≦2であることを特徴とする光通信システム。  In an optical communication system connected to a laser chip and the laser chip, the laser chip has an oscillation wavelength of 1.1 μm to 1.7 μm, an active layer that generates light, and main elements are Ga, In, N, As Or a layer made of Ga, In, As, and a surface emitting semiconductor laser device chip having a resonator structure including reflectors provided above and below the active layer to obtain laser light. The reflection mirror has a reflection wavelength of 1.1 μm or more, and the refractive index of the material layer constituting the reflection mirror periodically changes to a value different from small and large, and reflects the incident light by light wave interference. In addition to a mirror, the material layer with a small refractive index is AlxGa1-xAs (0 <x ≦ 1), and the material layer with a large refractive index is AlyGa1-yAs (0 ≦ y <x ≦ 1). mirror A surface-emitting type semiconductor comprising a non-radiative recombination preventing layer comprising a GaxIn1-xPyAs1-y (0 <x ≦ 1, 0 <y ≦ 1) layer between the active layer and the reflecting mirror. A laser element chip is used as a light emitting light source. When a diameter of a circle inscribed in a light emitting portion of the surface emitting semiconductor laser element chip is d and a core diameter of the optical fiber is F, 0.5 ≦ F / d An optical communication system, wherein ≦ 2. 前記面発光型半導体レーザ素子チップと光ファイバの間にレンズもしくはレンズ系が配置され、かつ、該面発光型半導体レーザ素子チップの光出射部に内接する円の直径をd、光ファイバのコア直径をFとすると、F/d≦1であることを特徴とする請求項1乃至4のいずれか1項に記載の光通信システム。A lens or lens system is disposed between the surface emitting semiconductor laser element chip and the optical fiber, and a diameter of a circle inscribed in the light emitting portion of the surface emitting semiconductor laser element chip is d, and the core diameter of the optical fiber When the a F, an optical communication system according to any one of claims 1 to 4, characterized in that the F / d ≦ 1. 前記面発光型半導体レーザ素子チップと光ファイバがアレイ状に配列されたことを特徴とする請求項1乃至4のいずれか1項に記載の光通信システム。The optical communication system according to any one of claims 1 to 4, wherein the surface-emitting type semiconductor laser device chips and optical fibers are arranged in an array. 前記面発光型半導体レーザ素子チップと、レンズもしくはレンズ系と、光ファイバがアレイ状に配列されたことを特徴とする請求項に記載の光通信システム。6. The optical communication system according to claim 5 , wherein the surface emitting semiconductor laser element chip, a lens or a lens system, and an optical fiber are arranged in an array.
JP2002045461A 2001-02-26 2002-02-21 Optical communication system Pending JP2002323646A (en)

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