JP2002319710A - Light emitting device and its manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device that can be reduced in size and to provide a method of manufacturing the device. SOLUTION: This light emitting device is provided with a substrate 1 on the surface of which a light emitting element 2 is mounted and a transparent or translucent cover 6 covering the element 2 on the substrate 1. The substrate 1 and cover 6 are made of glass or rock crystal and the portion of the lower surface of the cover 6 facing the portion of the upper surface of the substrate 1 around the element 2 are directly joined to each other by covalently bonding atoms.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a light emitting device and a method for manufacturing the same.

[0002]

2. Description of the Related Art In a conventional light emitting device, a light emitting device mounted on a substrate surface is housed in a metal case in order to protect the light emitting device.

[0003]

The problem with the above prior art is that the light emitting device becomes large.

The reason is that, as described above, in order to protect the light emitting element, the board on which the light emitting element is mounted is housed in a case, that is, the case is provided on the outer periphery of the board.

Therefore, an object of the present invention is to reduce the size of a light emitting device.

[0006]

Means for Solving the Problems In order to achieve this object, the present invention provides a substrate having a light emitting element mounted on a surface thereof, and a transparent or translucent cover covering the light emitting element on the substrate. Wherein the substrate and the cover are made of glass or quartz, respectively, and the lower surface of the cover facing the upper surface of the light emitting element is directly bonded to the upper surface of the substrate by covalent bonding of atoms. Since the upper surface and the lower surface of the cover are directly joined to each other at the outer peripheral portion of the light emitting element by covalent bonds of atoms, a case for protecting the light emitting element is not required, and the size can be reduced.

[0007]

The invention according to claim 1 of the present invention includes a substrate having a light emitting element mounted on a surface thereof, and a transparent or translucent cover covering the light emitting element on the substrate, The substrate and the cover are made of glass or quartz, respectively, and a light-emitting device in which the lower surface of the cover facing the upper surface of the light-emitting element is directly bonded to the upper surface of the light-emitting element by covalent bonding of atoms. Since the lower surface of the cover is directly joined to the outer peripheral portion of the light emitting element by covalent bonding of atoms, a case for protecting the light emitting element is not required, so that downsizing can be achieved.

The invention according to claim 2 is the light emitting device according to claim 1, wherein a portion of the upper surface of the cover facing the light emitting element is a light transmitting portion, and an outer periphery of the light transmitting portion is covered with a light shielding film. The light from the light-emitting element is blocked by the light-shielding portion, and travels out of the cover only from the light-transmitting portion, so that light transmission is highly reliable. .

Next, according to a third aspect of the present invention, the light shielding film is a resin film,
Alternatively, in the light-emitting device according to claim 2, the light-shielding film can be easily formed on an upper surface of the cover.

The invention according to claim 4 is the light emitting device according to claim 2 or 3, wherein the surface of the cover other than the light transmitting portion is roughened, and a light shielding film is formed on the roughened surface. The adhesive strength of the light-shielding film on the upper surface is increased, and peeling is less likely to occur.

The invention according to claim 5 is the light emitting device according to any one of claims 2 to 4, wherein the outer peripheral surface of the plate-shaped cover is covered with a light-shielding film. The light from the light emitting element does not leak outward from the outer peripheral surface of the cover because the film is covered with the film, so that most of the light from the light emitting element efficiently travels to the light transmitting portion on the upper surface of the cover. Become.

The invention according to claim 6 is the light emitting device according to claim 5, wherein the outer peripheral surface of the plate-shaped cover is roughened, and a light-shielding film is formed on the roughened surface. The adhesive strength of the light-shielding film on the outer peripheral surface is increased, and the peeling is less likely to occur.

According to a seventh aspect of the present invention, in the light emitting device according to the fifth or sixth aspect, the light-shielding film covering the outer peripheral surface of the plate-shaped cover extends to a joint between the outer peripheral surface of the cover and the substrate. However, by extending the light-shielding film provided on the outer peripheral surface of the cover to the joint portion with the substrate, the joining force between the cover and the substrate can be increased.

According to an eighth aspect of the present invention, in the light emitting device according to any one of the first to seventh aspects, a convex lens protruding upward is provided integrally with the cover on the upper surface of the light transmitting portion on the upper surface of the cover. By providing a convex lens integrally on the upper surface of the light transmitting portion, light from the light emitting element can be condensed by the convex lens, and the light transmission can be improved.

Next, a ninth aspect of the present invention is the light-emitting device according to any one of the first to seventh aspects, wherein the cover has a convex lens type, and the cover itself has a convex lens type so that the light-emitting element can emit light. Light can be condensed by this convex lens to enhance its light transmission.

Next, according to a tenth aspect of the present invention, a through hole is provided in the substrate for conducting and drawing out electricity, and the inside of the through hole is sealed with a conductor.
The light emitting device according to any one of claims 1 to 9, wherein the lower surface side of the conductor protrudes downward from the substrate, and the through hole for conducting electricity provided in the substrate is merely sealed with the conductor. However, by projecting the light emitting device to the lower surface side of the substrate, the light emitting device can be used as a protruding electrode when the light emitting device is mounted on another substrate device.

Next, the invention according to claim 11 is the light-emitting device according to any one of claims 1 to 10, wherein the cover is transparent and the plate is opaque. Is not leaked to the plate side, and the light from the light emitting element travels to the light transmitting portion on the upper surface of the cover.

According to a twelfth aspect of the present invention, there is provided the light emitting device according to the eleventh aspect, wherein the plate uses colored glass. If colored glass is used, the operation of making the plate opaque can be eliminated.

Next, according to a thirteenth aspect of the present invention, a light emitting element is mounted on a surface of a glass or quartz substrate, and then a transparent or translucent cover made of glass or quartz is put on the substrate. A method of manufacturing a light emitting device in which the upper surface portion of the substrate around the light emitting element and the lower surface portion of the cover facing the light emitting element are heated in contact with each other, and the contact portion is directly joined by covalent bonds of atoms. The substrate and the cover can be easily coupled only by heating while the upper surface of the substrate and the lower surface of the cover at the outer periphery of the element are in contact with each other.

The invention according to claim 14 is the method for manufacturing a light-emitting device according to claim 13, wherein a light-shielding film is formed on the upper surface of the cover facing the light-emitting element of the cover before bonding to the substrate.
The light-shielding film can be easily formed by using the cover alone before joining with the substrate.

The invention according to claim 15 is a method of forming a light-shielding film by roughening the surface of the cover other than the light-transmitting portion facing the light-emitting element and providing a resin film or a metal film on the rough surface. Item 14. In the method for manufacturing a light-emitting device according to Item 14, since the light-shielding film is provided on the rough surface portion of the upper surface of the cover, the bonding strength between the light-shielding film and the upper surface of the cover is increased, and peeling is less likely to occur.

The invention according to claim 16 is the method for manufacturing a light emitting device according to any one of claims 13 to 15, wherein a light-shielding film is provided on the outer peripheral surface of the plate-like cover. Is covered with a light shielding film, so that light from the light emitting element does not leak outward from the outer peripheral surface of the cover, and thus most of the light from the light emitting element efficiently travels to the light transmitting portion on the top surface of the cover. It will be.

The invention according to claim 17 is the method for manufacturing a light emitting device according to claim 16, wherein the outer peripheral surface of the plate-shaped cover is roughened, and thereafter, a light shielding film is provided on the roughened surface. If provided on the surface, this light-shielding film is less likely to peel off from the outer peripheral surface of the plate-like cover.

The invention according to claim 18 is a large plate-like substrate having a plurality of light-transmitting parts at predetermined intervals on a large plate-like substrate on which a plurality of light emitting elements are mounted at predetermined intervals. By covering the cover and then heating, the upper surface of the substrate and the lower surface of the cover are directly joined by covalent bonds between atoms at the outer periphery of each light emitting element, and then the substrate and the cover at the outer periphery of each light emitting element are cut. The method for manufacturing a light emitting device according to claim 13, wherein the individual light emitting devices are formed by performing
Many light emitting devices can be manufactured efficiently.

Next, in a nineteenth aspect of the present invention, a portion of the large plate-shaped cover facing each light emitting element is a light transmitting portion, and a light shielding film is formed on the upper surface of the cover other than the plurality of light transmitting portions.
8. The method for manufacturing a light-emitting device according to item 8, wherein the light-shielding film can be easily formed at one time on the upper surface of the cover of the light-emitting device that is to be individualized later.

Next, according to a twentieth aspect of the present invention, there is provided the light emitting device according to the nineteenth aspect, wherein portions other than the respective light transmitting portions on the upper surface of the large plate-shaped cover are roughened, and a light-shielding film is formed on the roughened surface. This is a manufacturing method, in which roughening can be performed at once to make the light-shielding film difficult to peel off, resulting in high workability.

Next, according to a twenty-first aspect of the present invention, a light shielding film is provided on an outer peripheral portion of a cover of each light emitting device after cutting into individual pieces.
22. The method for manufacturing a light emitting device according to any one of 8 to 20, wherein the outer peripheral surface of the cover is covered with a light shielding film, so that light from the light emitting element leaks outward from the outer peripheral surface of the cover. Therefore, most of the light from the light emitting element efficiently travels to the light transmitting portion on the upper surface of the cover.

The invention according to claim 22 is the invention according to claim 21, wherein the outer peripheral surface of the cover of each light emitting device after cutting into individual pieces is roughened, and a light shielding film is formed on the roughened surface. In the manufacturing method, after forming a light-shielding film on the rough surface after roughening the outer peripheral surface of the cover of each light-emitting device that has been made into individual pieces, the bonding strength of the light-shielding film is increased, and the light-shielding film is hardly peeled off. .

Next, the invention according to claim 23 is a method wherein a light-shielding film is formed on the outer peripheral rough surface portion while leaving the rough surface by cutting on the outer peripheral surface of the cover of each light emitting device after cutting into individual pieces. 2
1. The method for manufacturing a light-emitting device according to item 1, wherein a light-shielding film is formed on the rough surface while leaving a rough surface generated at the time of cutting into individual pieces on an outer peripheral surface of the cover, so that the bonding strength of the light-shielding film is improved. And becomes difficult to peel off.

According to a twenty-fourth aspect of the present invention, a large plate-like substrate is provided with through holes for drawing out currents corresponding to the respective light emitting elements before joining with the large plate-like cover. In the hole,
The method for manufacturing a light emitting device according to any one of claims 18 to 23, wherein a conductor is provided and sealed after the substrate and the cover are joined, and the through holes are sealed in a large plate state. Will be good.

Next, according to a twenty-fifth aspect of the present invention, before cutting into individual pieces, each light emitting element is energized through a conductor of a substrate of each light emitting device to be an individual piece. The light-emitting device manufacturing method according to claim 24, wherein the light-transmitting portion for each light-emitting device to be a piece is determined, and the light-transmitting portion for each piece is determined by causing each light-emitting element to emit light. A transparent part can be formed.

An embodiment of the present invention will be described below with reference to the accompanying drawings.

In FIG. 1, reference numeral 1 denotes a glass substrate on which a light emitting element 2 such as a light emitting diode is mounted as shown in FIGS.

Specifically, conductive patterns 3 and 4 are provided on the substrate 1 as shown in FIGS.
An electrode (not shown) on the back side of the light emitting element 2 is electrically connected to the conductive pattern 3, and an electrode (not shown) on the front side of the light emitting element 2 is connected to the conductive pattern 4 by a wire 5. Conducted.

A glass cover 6 is provided on the substrate 1.
Are integrated.

Specifically, a recess 7 is formed in the center of the lower surface side of the cover 6 as shown in FIG. 3, so that when the cover 6 and the substrate 1 are integrated as shown in FIG. The light emitting element 2 and the conductive patterns 3 and 4 are housed in the housing. In this state, the outer peripheral portion of the concave portion 7 on the lower surface of the cover 6 and the outer peripheral portion of the upper surface of the substrate 1 abut, and at the abutting portion, the two are directly joined by covalent bonds of atoms.

In order to perform this direct bonding, the lower surface of the cover 6 and the upper surface of the substrate 1 in the contact portion are both made of glass and smooth.

Therefore, before contact, O-H
When heating is performed after the contact, moisture (H
₂ O) is removed, so that one remaining O atom is shared by the substrate 1 and the cover 6 and integrated, that is, directly joined by covalent bonds of the atoms.

Note that such direct bonding by covalent bonding of atoms between the substrate 1 and the cover 6 can be made even if both the substrate 1 and the cover 6 are formed of quartz.

Through holes 8 are formed in advance in portions of the substrate 1 facing the conductive patterns 3 and 4, and the inner walls of these through holes 8 are formed after the cover 6 and the substrate 1 shown in FIG. As shown in FIG. 5, a Cu film 9 is formed by performing Cu sputtering.

As shown in FIG. 5, the Cu film 9 includes not only the inner walls of the through holes 8 but also the through holes 3 of the conductive patterns 3 and 4.
5a and 4a and the inner wall of the recess 7 of the cover 6 corresponding thereto, whereby the interior of the recess 7 can be airtight even in the state of FIG.

Thereafter, as shown in FIG.
After the u paste is filled and sealed with a solidified conductor 10, a solder film 11 is formed on the surface thereof.

Since the conductor 10 in which the Cu paste is solidified protrudes below the substrate 1, surface mounting can be performed to mount the light emitting device on another substrate.

The light emitting section 2 of the light emitting element 2 on the upper surface of the cover 6
The opposing portion is a light transmitting portion 6a, and the outer periphery of the light transmitting portion 6a is covered with a light shielding film 12 after the cover 6 and the substrate 1 are integrated as shown in FIG. If the film 12 is covered, the light from the light emitting portion 2a of the light emitting element 2 is blocked by the light shielding film 12, and travels out of the cover 6 only from the light transmitting portion 6a. Become.

Further, as shown in FIG. 8, the outer peripheral surface of the plate-shaped cover 6 is covered with the light shielding film 13 after the formation of the light shielding film 12, and the outer peripheral surface of the cover 6 is also covered with the light shielding film 13. The light from the portion 2a does not leak outward from the outer peripheral surface of the cover 6, and from this point too, most of the light from the light emitting portion 2a of the light emitting element 2 is transmitted to the light transmitting portion 6a on the upper surface of the cover 6.
Will proceed efficiently.

The light shielding films 12 and 13 are black resin films,
Alternatively, since the light shielding films 12 and 13 are formed of a metal film, the light shielding films 12 and 13 can be easily formed on the upper surface and the outer peripheral surface of the cover 6.

At this time, the surface of the cover 6 other than the light transmitting portion 6a and the outer peripheral surface of the cover 6 are roughened, and the light shielding films 12 and 13 are formed on the roughened surface.
The adhesive strength of the layers 2 and 13 is increased, and the peeling is less likely to occur.

Further, the light-shielding film 13 covering the outer peripheral surface of the plate-shaped cover 6 is extended to the substrate 1 side from the joint between the outer peripheral surface of the cover 6 and the substrate 1 so that the cover 6 and the substrate 1 The bonding strength can also be increased.

As described above, the light emitting device of the present embodiment includes the substrate 1 having the light emitting element 2 mounted on the surface thereof, and the transparent or translucent cover 6 covering the light emitting element 2 on the substrate 1. The substrate 1 and the cover 6 are made of glass or quartz, respectively, and the lower surface of the cover 6 opposed to the upper surface of the light emitting element 2 of the substrate 1 is directly bonded by covalent bonding of atoms. As can be understood from FIGS. 1 and 2, a case for protecting the light emitting element 2 and the like are not required, and the size can be reduced.

FIG. 9 shows another embodiment of the present invention. In this embodiment, a convex lens 6b projecting upward is provided integrally with the cover 6 on the upper surface of the light transmitting portion 6a on the upper surface of the cover. If the convex lens 6b is integrally provided on the upper surface of the light section 6a, the light from the light emitting section 2a of the light emitting element 2
The light can be condensed at b to enhance the light transmission.

The reference numerals 14 and 15 in FIG. 9 denote rough surfaces of the upper surface and the outer peripheral surface of the plate-like cover 6.
10, light shielding films 12 and 13 are formed as shown in FIG.

FIG. 11 shows still another embodiment of the present invention. In this embodiment, the cover 6 itself is a convex lens type, and the light emitting portion 2a of the light emitting element 2 is formed by making the cover 6 itself a convex lens type. Light from the lens can be condensed by this convex lens to enhance the light transmission.

The cover 6 is basically transparent or translucent, but the plate 1 is preferably opaque.
If the plate 1 is made opaque, light from the light emitting section 2a of the light emitting element 2 does not leak to the plate 1 side, and thus light from the light emitting section 2a of the light emitting element 2 goes to the light transmitting section 6a on the upper surface of the cover 6. And will proceed.

For that purpose, it is also effective to make the plate 1 a colored glass, and if colored glass is used, the work of making the plate 1 opaque can be eliminated.

FIG. 12 shows a manufacturing method for forming a large number of the light emitting devices shown in FIG. 1 at one time.

First, although not shown in FIG. 12, a plurality of light-transmitting portions 6a are provided at predetermined intervals on a large plate-like substrate 1A on which a plurality of light-emitting elements 2 are mounted at predetermined intervals. By covering the large plate-shaped cover 6A and then heating, the upper surface of the substrate 1A and the lower surface of the cover 6A are directly joined at the outer peripheral portion of each light emitting element 2 by covalent bonds between atoms. The individual light emitting devices shown in FIG. 1 are formed by cutting the substrate 1A and the cover 6A on the outer peripheral portion of the element 2 along cutting lines 16 and 17.

In the case of the manufacturing method shown in FIG. 12, the portions other than the light transmitting portions 6a on the upper surface of the large plate-like cover 6A are roughened at once, and the light shielding film 12 is formed on the roughened surface at one time.

The rough surface 15 on the outer peripheral surface of the cover 6 and the light shielding film 1
3 is formed after cutting into individual pieces.

Further, in the large plate-shaped substrate 1A, through holes 8 for extracting electricity are formed corresponding to the respective light emitting elements 2 before joining with the large plate-shaped cover 6A. Inside
After the substrate 1A and the cover 6A are joined, the conductors 10 and the like are provided and sealed. Since the through holes 8 are sealed in a large plate state, workability is improved.

Further, in the case of using such a large plate-like substrate 1A and cover 6A, before cutting into individual pieces, each light emitting element 2 is energized through the conductor 10 of each light emitting device to be an individual piece. The light-transmitting portion 6a for each light-emitting device to be an individual piece is determined according to the light-emitting state of the light-emitting element 2.
Form 2

[0061]

As described above, the present invention comprises a substrate having a light emitting element mounted on its surface, and a transparent or translucent cover which covers the light emitting element on the substrate. Each is made of glass or quartz, and the lower surface of the cover facing the upper surface of the light emitting element is directly joined to the upper surface of the light emitting element by covalent bonding of atoms. Are directly joined by covalent bonds of atoms in the outer peripheral portion of the device, so that a case for protecting the light emitting element and the like are not required, and miniaturization can be achieved.

[Brief description of the drawings]

FIG. 1 is a perspective view of an embodiment of the present invention.

FIG. 2 is an exploded perspective view of the same.

FIG. 3 is an exploded sectional view showing the same manufacturing process.

FIG. 4 is a sectional view showing the manufacturing process.

FIG. 5 is a sectional view showing the same manufacturing process.

FIG. 6 is a sectional view showing the manufacturing process.

FIG. 7 is a sectional view showing the same manufacturing process.

FIG. 8 is a sectional view showing the manufacturing process.

FIG. 9 is a sectional view showing a manufacturing process according to another embodiment of the present invention.

FIG. 10 is a sectional view showing the manufacturing process.

FIG. 11 is a sectional view showing still another embodiment of the present invention.

FIG. 12 is a perspective view showing a manufacturing method of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Light emitting element 6 Cover 6a Light transmitting part

Claims (25)

[Claims] 1. A substrate having a light emitting element mounted on its surface, and a transparent or translucent cover covering the light emitting element on the substrate, wherein the substrate and the cover are made of glass or quartz, respectively. A light emitting device in which an upper surface portion of the outer periphery of the light emitting element of the substrate is directly joined to a lower surface portion of the cover facing the upper surface portion by covalent bonding of atoms. 2. The light-emitting device according to claim 1, wherein the light-emitting element-facing portion on the upper surface of the cover is a light-transmitting portion, and the outer periphery of the light-transmitting portion is covered with a light-shielding film. 3. The light emitting device according to claim 2, wherein the light shielding film is formed of a resin film or a metal film. 4. The light emitting device according to claim 2, wherein a surface of the cover other than the light transmitting portion is roughened, and a light shielding film is formed on the roughened surface. 5. The light emitting device according to claim 2, wherein an outer peripheral surface of the plate-like cover is covered with a light shielding film. 6. The light emitting device according to claim 5, wherein an outer peripheral surface of the plate-shaped cover is roughened, and a light shielding film is formed on the roughened surface. 7. The light-emitting device according to claim 5, wherein the light-shielding film covering the outer peripheral surface of the plate-like cover extends to a joint between the outer peripheral surface of the cover and the substrate. 8. The cover according to claim 1, wherein a convex lens protruding upward is provided integrally with the cover on the upper surface of the light transmitting portion on the upper surface of the cover.
The light emitting device according to any one of the above. 9. The cover according to claim 1, wherein said cover is of a convex lens type.
The light emitting device according to any one of the above. 10. A substrate is provided with a through hole for drawing out electricity.
The light emitting device according to any one of claims 1 to 9, wherein the inside of the through hole is sealed with a conductor, and the lower surface of the conductor projects downward from the substrate. 11. The light emitting device according to claim 1, wherein the cover is transparent and the plate is opaque. 12. The plate body is made of colored glass.
A light-emitting device according to claim 1. 13. A light emitting element is mounted on a surface of a glass or quartz substrate, and then a transparent or translucent cover made of glass or quartz is put on the substrate. A method of manufacturing a light emitting device in which a substrate upper surface and a cover lower surface facing the substrate are heated in contact with each other, and the contact is directly bonded by covalent bonds of atoms. 14. The method for manufacturing a light emitting device according to claim 13, wherein a light shielding film is formed on an upper surface of the cover facing the light emitting element of the cover before bonding to the substrate. 15. The light-emitting device according to claim 14, wherein a surface other than the light-transmitting portion facing the light-emitting element on the top surface of the cover is roughened, and a light-shielding film is formed by providing a resin film or a metal film on the roughened portion. Manufacturing method. 16. The method for manufacturing a light emitting device according to claim 13, wherein a light-shielding film is provided on an outer peripheral surface of the plate-like cover. 17. The method for manufacturing a light emitting device according to claim 16, wherein the outer peripheral surface of the plate-shaped cover is roughened, and then a light-shielding film is provided on the roughened surface. 18. A large plate-like cover having a plurality of light-transmitting portions at predetermined intervals is placed on a large plate-like substrate on which a plurality of light-emitting elements are mounted at predetermined intervals, and then heated. In this way, the upper surface of the substrate and the lower surface of the cover are directly joined to each other by covalent bonds between atoms at the outer periphery of each light emitting element, and then the substrate and the cover at the outer periphery of each light emitting element are cut to obtain an individual light emitting device. 14. The method for manufacturing a light emitting device according to claim 13, wherein: 19. The light-emitting device according to claim 18, wherein a portion of the large plate-shaped cover facing each light-emitting element is a light-transmitting portion, and a light-shielding film is formed on an upper surface of the cover other than the plurality of light-transmitting portions. Method. 20. The method for manufacturing a light emitting device according to claim 19, wherein a portion other than the respective light transmitting portions on the upper surface of the large plate-shaped cover is roughened, and a light shielding film is formed on the roughened surface. 21. The method for manufacturing a light emitting device according to claim 18, wherein a light shielding film is provided on an outer peripheral portion of a cover of each light emitting device after cutting into individual pieces. 22. The method according to claim 21, wherein the outer peripheral surface of the cover of each light emitting device after cutting into individual pieces is roughened, and a light shielding film is formed on the roughened surface. 23. The light-emitting device according to claim 21, wherein a light-shielding film is formed on the outer peripheral rough surface portion in a state where a rough surface is left on the outer peripheral surface of the cover of each light-emitting device after cutting into individual pieces. Production method. 24. A large plate-like substrate is provided with through holes for extracting electricity therethrough corresponding to each light emitting element before being joined to the large plate-like cover. The method for manufacturing a light emitting device according to any one of claims 18 to 23, wherein a conductor is provided and sealed after the cover is joined. 25. Before cutting into individual pieces, each light emitting element is energized via a conductor of a substrate of each light emitting apparatus to become individual pieces, and each light emitting device to become individual pieces depends on the light emitting state of each light emitting element. The method for manufacturing a light emitting device according to claim 24, wherein the light transmitting portion is determined for each light emitting device.