JP6175368B2 - Sensor panel and method for manufacturing sensor panel - Google Patents

Description

  The present invention relates to a sensor panel used for a portable device or a touch panel.

  As a conventional sensor panel, a surface panel described in Patent Document 1 has been proposed. This front panel has a configuration in which a translucent resin layer and a detection film are laminated, and a translucent electrode layer and a wiring layer connected to the electrode layer are formed on the back surface of the detection film, A decorative portion that covers the wiring layer is formed on the surface. The decorating part is formed on the surface of the base film of the detection film by painting, and is visually observed through the resin layer.

JP 2012-208857 A

In a conventional front panel as described in Patent Document 1, a connection portion of a flexible printed circuit board (FPC) (drawer wiring material) is fixed to a wiring layer by thermocompression bonding for electrical connection with a control device or the like. You may need to

  However, when FPC is thermocompression-bonded, the detection film and the decorative part are deformed by heat and pressure and strain remains, and this strain is transmitted through the resin layer and becomes visible from the outside.

  Further, since the front panel has a structure in which the FPC is bonded to the wiring layer from the back side of the detection film, there is a problem that peeling is likely to occur when an external force is applied to the FPC in an assembly or other situation.

  Therefore, the present invention provides a sensor panel and a method for manufacturing the sensor panel that can make distortion generated in the connecting portion of the lead-out wiring member invisible from the outside and can increase the bond strength between the lead-out wiring member and the substrate. Objective.

In order to solve the above problems, a sensor panel of the present invention includes a transparent substrate, a transparent electrode layer disposed on the transparent substrate, a wiring layer disposed on the periphery of the transparent substrate and connected to the transparent electrode layer, A flexible lead wiring member connected to the wiring layer; a transparent first cover layer covering the transparent electrode layer; and an opaque second cover layer covering the wiring layer; The base layer is embedded in at least one of the first cover layer and the second cover layer, the joint portion and base portion of the lead-out wiring member and the transparent substrate are covered with the second cover layer, and the base layer is embedded in the cover layer Has a molding resin and is characterized in that the base is fixed with the molding resin .

  Since the base portion of the lead-out wiring member drawn from the transparent substrate is embedded in at least one of the first cover layer and the second cover layer, the bonding strength between the lead-out wiring member and the transparent substrate can be increased. Furthermore, since the joint portion between the lead-out wiring member and the transparent substrate is covered with the second cover layer, the distortion generated in the joint portion cannot be visually recognized from the outside, and the appearance decoration can be enhanced.

  In the sensor panel of the present invention, the surface portion having the operation surface region and the side wall portion formed integrally with the peripheral portion of the surface portion and extending rearward from the operation surface region are integrated, and the surface portion is the first cover. Preferably, the side wall portion has the second cover layer, and the lead-out wiring member extends from the back side of the surface portion.

  In the sensor panel of the present invention, the surface portion having the operation surface region and the side wall portion formed integrally with the peripheral portion of the surface portion and extending rearward from the operation surface region are integrated, and the surface portion is the first cover. Preferably, the side wall portion has the second cover layer, and the lead-out wiring member extends from the back side of the side wall portion.

  In the sensor panel of the present invention, it is preferable that the first cover layer and the second cover layer are integrally formed.

  In the sensor panel of the present invention, the first cover layer is preferably formed by resin molding, and the gate trace of the first cover layer is preferably covered with the second cover layer.

  By covering the gate trace of the molding of the first cover layer with the second cover layer, it is possible to make the gate trace invisible from the outside and to enhance the appearance decoration.

In the method for manufacturing a sensor panel of the present invention, a transparent substrate in which a transparent electrode layer and a wiring layer are formed and a lead-out wiring material connected to the wiring layer is connected is disposed in the mold, and the transparent resin is molded into the mold. forming a first cover layer covering the transparent electrode layer is injected within an opaque resin and forming the second cover layer for covering the wiring layer is injected into the mold, the lead wire The base part drawn out from the transparent substrate of the material is embedded in at least one of the first cover layer and the second cover layer, the second cover layer covers the joint part and base part of the lead-out wiring material and the transparent substrate, and the base part is embedded The base portion is fixed with the molding resin of the cover layer .

  By burying the base portion drawn from the transparent substrate in at least one of the first cover layer and the second cover layer, the bonding strength between the lead-out wiring member and the transparent substrate can be increased. Furthermore, by covering the joint portion between the lead-out wiring member and the transparent substrate with the second cover layer, the distortion generated in the joint portion cannot be visually recognized from the outside, and the appearance decoration can be enhanced.

  In the sensor panel manufacturing method of the present invention, the mold includes a common mold, a first cover molding mold, and a second cover molding mold, and a transparent substrate is installed in the common mold. Preferably, the first cover layer is formed between the mold and the first cover molding mold, and then the second cover layer is formed between the common mold and the second cover molding mold.

  In the method for producing a sensor panel of the present invention, a mold includes a surface portion including a first cover layer and having an operation surface region, and a side wall portion including a second cover layer extending rearward from the operation surface region. Preferably, the lead-out wiring member is extended from the back side of the surface portion.

  In the method for producing a sensor panel of the present invention, a mold includes a surface portion including a first cover layer and having an operation surface region, and a side wall portion including a second cover layer extending rearward from the operation surface region. Preferably, the lead-out wiring member is extended from the back side of the side wall portion.

  In the method for manufacturing a sensor panel of the present invention, it is preferable to cover the gate mark of the first cover layer with the second cover layer.

  By covering the gate trace of the molding of the first cover layer with the second cover layer, it is possible to make the gate trace invisible from the outside and to enhance the appearance decoration.

  According to the present invention, it is possible to provide a sensor panel with excellent appearance or design by making distortion, wiring, and gate traces generated at the joint portion between the lead-out wiring member and the substrate invisible from the outside. Furthermore, since the bonding strength between the lead-out wiring member and the substrate can be increased, a highly durable sensor panel can be provided.

The perspective view of the sensor panel which concerns on 1st Embodiment, It is a figure which shows the structure of the sensor panel which concerns on 1st Embodiment, Comprising: (A) is sectional drawing along the II-II line | wire of FIG. 1, (B) is a partially expanded view of (A). It is sectional drawing which shows the formation process of the 1st cover layer in 1st Embodiment. It is sectional drawing which shows the formation process of the 2nd cover layer in 1st Embodiment. It is sectional drawing which shows the structure of the sensor panel which concerns on 2nd Embodiment. It is sectional drawing which shows the formation process of the 1st cover layer in 2nd Embodiment. It is sectional drawing which shows the formation process of the 2nd cover layer in 2nd Embodiment.

  Hereinafter, a sensor panel and a method for manufacturing the sensor panel according to an embodiment of the present invention will be described in detail with reference to the drawings.

<First Embodiment>
First, the configuration of the sensor panel will be described with reference to FIGS. 1 and 2. FIG. 1 is a perspective view of the sensor panel 10 according to the first embodiment as viewed from the operation side. The sensor panel 10 constitutes a part of a casing of a portable terminal device such as a mobile phone. FIG. 2B is a cross-sectional view taken along line II-II along the vertical direction (ZY plane in FIG. 1) of the sensor panel 10.

  In the following description, the upper convex side of the sensor panel 10 is the front side 11, and the lower concave side is the back side 12. In addition, the term “covered” used for the first cover layer 40 and the second cover layer 50 means that the first cover layer 40 and / or the second cover layer 50 is disposed at least above the object. Is shown. The same applies to the second embodiment.

  In the first embodiment shown in FIG. 2 and subsequent figures, the structure of a cross section along the longitudinal direction (YZ plane) of the sensor panel 10 shown in FIG. 1 will be described. A similar structure can be applied to the cross section.

  The sensor panel 10 includes a transparent substrate 21, a transparent electrode layer 22 and a wiring layer 23 disposed on the transparent substrate 21, a lead-out wiring member 30 connected to the wiring layer 23, a transparent electrode layer 22 and a wiring layer 23. A transparent first cover layer 40 for covering and an opaque second cover layer 50 for covering the wiring layer 23 are provided. A binder 25 is disposed between the transparent substrate 21 on which the transparent electrode layer 22, the wiring layer 23, and the joint portion 31 of the lead-out wiring member 30 are disposed, and the first cover layer 40.

  The sensor panel 10 includes a surface portion 60 having an operation surface region 61 and side wall portions 62 and 63 that are formed integrally with the periphery of the surface portion 60 and extend forward and rearward from the operation surface region 61. Has been. The surface portion 60 has a part of the first cover layer 40 and the second cover layer 50, and the side wall portions 62 and 63 have the second cover layer 50.

  The transparent substrate 21 is formed of a translucent material such as polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), or other resin or glass. The operation surface area 61 is a surface area facing the area where the transparent electrode layer 22 is disposed, and refers to an area operated by an operation body such as a finger.

  The transparent electrode layer 22 is provided as a plurality of translucent electrodes in a plane perpendicular to the Z direction. The transparent electrode layer 22 is formed in a predetermined pattern, for example, by sputtering of ITO (indium tin oxide), PVD (physical vapor deposition), or CVD (chemical vapor deposition).

  The wiring layer 23 is disposed at a predetermined position around the transparent substrate 21 and outside the transparent electrode layer 22. For example, the wiring layer 23 is a conductive layer in which a low-resistance conductor is contained in a binder resin, and is formed by applying, for example, a silver paste, a gold paste, or a carbon paste. Alternatively, it is formed by stacking NiCu / Cu / NiCu by sputtering using copper and nickel and further etching to have a predetermined wiring width.

  The binder 25 is applied on the transparent substrate 21 so as to embed the joint 31 of the transparent electrode layer 22, the wiring layer 23, and the lead-out wiring member 30. Application is performed, for example, by screen printing or spraying. The binder 25 is preferably a resin for increasing the bonding strength between the transparent substrate 21 and the first cover layer 40. For example, when the transparent substrate 21 is PET and the first cover layer 40 is polymethyl methacrylate (PMMA) or polycarbonate. A two-layer binder of acrylic resin and vinyl chloride / vinyl acetate copolymer resin is used.

  The lead wiring member 30 is, for example, a flexible printed circuit board (FPC). The lead-out wiring member 30 includes a joint portion 31 that is electrically connected to the wiring layer 23, a base portion 32 that extends from the joint portion 31 and is drawn from the transparent substrate 21, and a flexible lead portion 33 that extends from the base portion 32. Prepare. The joint portion 31 is electrically connected to the wiring layer 23 by, for example, thermocompression bonding, and is joined to the transparent substrate 21. The base 32 is embedded in the second cover layer 50. Further, the joint portion 31 and the base portion 32 are covered with the second cover layer 50. The flexible drawer portion 33 extends from the back side of the surface portion 60. The first cover layer 40 is formed within the surface portion 60.

  The first cover layer 40 is formed in a predetermined shape on the binder 25 by molding a translucent resin such as polymethyl methacrylate or polycarbonate. The gate mark 41 of the first cover layer 40 is covered with the second cover layer 50.

  The second cover layer 50 is formed on the upper and outer sides of the first cover layer 40 by molding an opaque resin material. The material constituting the second cover layer 50 is, for example, a material made opaque by adding a pigment to polymethyl methacrylate, polycarbonate, or other translucent resin.

Next, a method for manufacturing the sensor panel 10 will be described.
FIG. 3 is a cross-sectional view showing a process of forming the first cover layer 40, and FIG. 4 is a cross-sectional view showing a process of forming the second cover layer 50. 3 and 4 are cross-sectional views along the vertical direction of the sensor panel 10 as in FIG. 2, and are diagrams at substantially the center of the plane orthogonal to the vertical direction.

(1) First Cover Layer Formation Step Prior to the formation of the first cover layer 40, the transparent electrode layer 22 and the wiring layer 23 are formed on the transparent substrate 21, and the lead wiring member 30 is bonded to the transparent substrate 21. The transparent electrode layer 22 is formed, for example, by sputtering ITO, and the electrode pattern of the transparent electrode layer 22 is formed by masking during sputtering or etching after sputtering. The wiring layer 23 is formed, for example, by applying a silver paste in a predetermined pattern. Further, the binder 25 is applied on the transparent substrate 21 by, for example, printing so as to embed the transparent electrode layer 22, the wiring layer 23, and the bonding portion 31. Thereafter, the lead wiring member 30 is electrically connected to the wiring layer 23 and bonded to the transparent substrate 21 by, for example, thermocompression bonding with the joint portion 31 in contact with the wiring layer 23.

  Next, as shown in FIG. 3, the transparent substrate 21 on which the transparent electrode layer 22 and the wiring layer 23 are formed and the lead-out wiring material 30 connected to the wiring layer 23 is connected is formed for the first cover layer forming step. Place in the mold. This mold includes a common mold 70 that sandwiches the lead wiring member 30 and places the transparent substrate 21, and a first cover molding mold 80 that forms a cavity 81 between the common mold 70. . The transparent substrate 21 is disposed in the cavity 81. The transparent resin injected from a nozzle (not shown) is filled into the cavity 81 from the gate 82, and then cooled and solidified under a predetermined pressure and temperature condition. The solidified resin is cut at the gate 82. Thereby, while forming the operation surface area | region 61, the 1st cover layer 40 which covers the transparent electrode layer 22, the wiring layer 23, and the junction part 31 is formed (refer FIG. 4).

(2) Second Cover Layer Forming Step As shown in FIG. 4, in the second cover layer forming step, the transparent substrate 21 on which the first cover layer 40 is formed in the first cover layer forming step is fixed on the common mold 70. In this state, the second cover molding die 90 is disposed on the common die 70 instead of the first cover molding die 80. A cavity 91 having a shape different from the cavity 81 in the first cover layer forming step is formed between the second cover molding die 90 and the common die 70. Here, the common mold 70 and the second cover molding mold 90 constitute a mold for the second cover layer forming step.

  The opaque resin injected from a nozzle (not shown) is filled into the cavity 91 from the gate 92, and then cooled and solidified under predetermined pressure and temperature conditions. As a result, the second cover layer 50 that covers the wiring layer 23, the joint portion 31, the base portion 32, and the gate mark 41 when the first cover layer is formed is formed. Further, the thermocompression bonding marks 35 (FIG. 3) remaining on the transparent substrate 21 and the binder 25 are also covered with the second cover layer 50. Further, since the first cover layer 40 and the second cover layer 50 are integrated by the second cover layer forming step, the surface portion 60 including the first cover layer 40 and having the operation surface region 61 is separated from the operation surface region 61. Side wall portions 62 and 63 including the second cover layer 50 are formed integrally with each other. Further, the base portion 32 of the lead wiring member 30 is embedded in the second cover layer 50, and the flexible lead portion 33 extends from the back side of the surface portion 60.

  In the sensor panel 10 manufactured in this way, the wiring layer 23, the joint portion 31, the thermocompression bonding marks 35, and the gate marks 41 are covered with the second cover layer 50, so that these cannot be visually recognized from the outside. As a result, a sensor panel having an excellent appearance or design can be realized. Furthermore, since the base 32 of the lead-out wiring member 30 is embedded in the second cover layer 50 and the bonding strength can be increased, a highly durable sensor panel can be provided.

A modification will be described below.
In the first embodiment, the base portion 32 is embedded in the second cover layer 50. However, it is preferable that the flexible lead portion 33 is also embedded in the second cover layer 50 because the fixing strength of the lead wiring member 30 is improved.

  When the material for the transparent substrate 21 is selected so that the first cover layer 40 is easily fixed, the first cover layer 40 may be directly formed on the transparent substrate 21 without using the binder 25. In this case, it is preferable that the joining portion 31 is embedded in at least one of the first cover layer 40 and the second cover layer 50.

Second Embodiment
Next, a second embodiment of the present invention will be described. FIG. 5 is a cross-sectional view illustrating a configuration of the sensor panel 110 according to the second embodiment. FIG. 5 is a cross-sectional view along the vertical direction (YZ plane) of the sensor panel 110, and is a cross-sectional view at a substantially center of a plane orthogonal to the vertical direction.

  In the sensor panel 110 of the second embodiment, the arrangement of the first cover layer 140 and the second cover layer 150 is different from that of the sensor panel 10 of the first embodiment. Other configurations are the same as those in the first embodiment, and the same reference numerals are used for the same members, and detailed descriptions thereof are omitted.

  The sensor panel 110 includes a transparent substrate 21, a transparent electrode layer 22 and a wiring layer 23 disposed on the transparent substrate 21, a lead-out wiring member 30 connected to the wiring layer 23, the transparent electrode layer 22 and the wiring layer 23. A transparent first cover layer 140 covering the wiring layer 23, an opaque second cover layer 150 covering the wiring layer 23, and a transparent third cover layer 200 are provided. A binder 25 is disposed between the transparent substrate 21 on which the transparent electrode layer 22, the wiring layer 23, and the joint portion 31 of the lead-out wiring member 30 are disposed, and the first cover layer 140.

  The sensor panel 110 includes a surface portion 160 having an operation surface region 161 and side wall portions 162 and 163 that are integrally formed with the periphery of the surface portion 160 and extend forward and rearward from the operation surface region 161. Has been. The surface portion 160 includes the first cover layer 140, the second cover layer 150, and the third cover layer 200, and the side wall portions 162 and 163 include the second cover layer 150 and the third cover layer 200. The first cover layer 140 and the third cover layer 200 are formed so as to extend from the side wall portion 162 to the side wall portion 163 through the surface portion 160.

  The base 32 and the flexible drawer 33 are embedded in the first cover layer 140. Further, the joint portion 31, the base portion 32, and the flexible drawer portion 33 are covered with the second cover layer 150. The lead wiring member 30 extends from the back side of the side wall portion 163.

  The first cover layer 140 is formed in a predetermined shape on the binder 25 by molding a translucent resin such as polymethyl methacrylate or polycarbonate. The gate mark 141 of the first cover layer 140 is covered with the second cover layer 150.

  The second cover layer 150 is formed on the upper and outer sides of the first cover layer 140 by molding an opaque resin material. The material constituting the second cover layer 150 is, for example, a material made opaque by adding a pigment to polymethyl methacrylate, polycarbonate, or other translucent resin.

  The third cover layer 200 is formed of a translucent resin such as polymethyl methacrylate or polycarbonate on the surfaces of the first cover layer 140 and the second cover layer 150. The third cover layer 200 is formed by molding or printing, for example.

  FIG. 6 is a cross-sectional view showing a process of forming the first cover layer 140. FIG. 7 is a cross-sectional view showing a process of forming the second cover layer 150.

  Regarding the manufacture of the sensor panel 110, the common mold 170, the first cover molding mold 180, the second cover molding mold 190, and the third cover molding mold (in the shape according to the above-described configuration ( (Not shown). In the manufacturing procedure, the first cover layer forming step and the second cover layer forming step are sequentially performed similarly to the manufacturing of the sensor panel 10 of the first embodiment, and then the third cover layer 200 is formed in the third cover layer forming step. Form.

  In the first cover layer forming step, as shown in FIG. 6, the transparent electrode layer 22 and the wiring layer 23 are formed, and the transparent substrate 21 connected to the wiring layer 23 is connected to the first cover layer forming step. Place in the mold. This mold includes a common mold 170 on which the transparent substrate 21 is placed, and a first cover molding mold 180 that forms a cavity 181 between the common mold 170. The transparent substrate 21 is disposed in the cavity 181. Transparent resin injected from a nozzle (not shown) is filled into the cavity 181 from the gate 182 and then cooled and solidified under predetermined pressure and temperature conditions. The solidified resin is cut at the gate 182. Thus, the first cover layer 140 constitutes the operation surface region 161 and covers the transparent electrode layer 22, the wiring layer 23, the joint portion 31, the base portion 32, and the flexible lead portion 33 (see FIG. 7). .

  In the second cover layer forming step, as shown in FIG. 7, the first cover mold is formed while the transparent substrate 21 on which the first cover layer 140 has been formed in the first cover layer forming step is fixed on the common mold 170. Instead of the mold 180, a second cover molding mold 190 is disposed on the common mold 170. A cavity 191 having a shape different from the cavity 181 in the first cover layer forming step is formed between the second cover molding die 190 and the common die 170. Here, the common mold 170 and the second cover molding mold 190 constitute a mold for the second cover layer forming step.

  The opaque resin injected from a nozzle (not shown) is filled into the cavity 191 from the gate 192, and then cooled and solidified under predetermined pressure and temperature conditions. As a result, the second cover layer 150 that covers the wiring layer 23, the joint portion 31, the base portion 32, the flexible lead portion 33, and the gate mark 141 when the first cover layer is formed is formed. Further, the thermocompression marks 35 (FIG. 6) between 30, the wiring layer 23, and the transparent substrate 21 are also covered with the second cover layer 150. Further, since the first cover layer 140 and the second cover layer 150 are integrated by the second cover layer forming step, the surface portion 160 including the first cover layer 140 and having the operation surface region 161 is separated from the operation surface region 161. Side wall portions 162 and 163 including the second cover layer 150 are formed integrally with each other. The flexible drawer 33 extends from the back side of the side wall 163.

  In the third cover layer forming step, a third cover molding die (not shown) is shared while the transparent substrate 21 on which the second cover layer 150 is formed in the second cover layer forming step is fixed on the common die 170. Place on the mold 170. A cavity (not shown) having a shape different from the cavities 181 and 191 in the first cover layer forming step and the second cover layer forming step is formed between the third cover molding die and the common die 170. Here, the third cover molding die and the common die 170 constitute a die for the third cover layer forming step. A transparent resin injected from a nozzle (not shown) is filled into a cavity from a gate (not shown), and then cooled and solidified under predetermined pressure and temperature conditions. Thereby, the third cover layer 200 that covers the first cover layer 140 and the second cover layer 150 is formed.

  In the sensor panel 110, since the base 32 and the flexible lead portion 33 of the lead wiring member 30 are embedded in the first cover layer 140, the bonding strength of the lead wiring member 30 to the sensor panel 110 can be increased. Further, by providing the third cover layer 200, the first cover layer 140 and the second cover layer 150 can be protected, and the second cover layer 150 is peeled off by use, and the lead-out wiring member 30 and the wiring layer 23 are removed. It can be prevented from being visible from the outside.

A modification will be described.
The third cover layer 200 may be formed using a mold that is separate from the combination of the common mold 170 and the third cover molding mold.

The base 32 pulled out from the transparent substrate 21 is embedded in the second cover layer 50 in the first embodiment and embedded in the first cover layer 140 in the second embodiment. A configuration of embedding in both the cover layer and the second cover layer is also possible.
Other operations, effects, and modifications are the same as those in the first embodiment.

  Although the present invention has been described with reference to the above embodiment, the present invention is not limited to the above embodiment, and can be improved or changed within the scope of the purpose of the improvement or the idea of the present invention.

  As described above, the sensor panel according to the present invention is useful for a sensor panel having a structure in which a transparent electrode layer is provided on a transparent substrate and light can be transmitted from the front surface to the back side. It is particularly suitable for a sensor panel of a type in which a lead-out wiring material is crimped on.

DESCRIPTION OF SYMBOLS 10 Sensor panel 21 Transparent substrate 22 Transparent electrode layer 23 Wiring layer 30 Lead-out wiring material 31 Junction part 32 Base part 35 Thermocompression-bonding trace 40 1st cover layer 41 Gate trace 50 2nd cover layer 60 Surface part 61 Operation surface area 62, 63 Side wall Part 70 Common mold 80 First cover mold 90 Second cover mold 110 Sensor panel 140 First cover layer 141 Gate mark 150 Second cover layer 160 Surface part 161 Operation surface area 162, 163 Side wall part 170 Common mold 180 First cover molding mold 190 Second cover molding mold 200 Third cover layer

Claims (10)

A transparent substrate;
A transparent electrode layer disposed on the transparent substrate;
A wiring layer disposed around the transparent substrate and connected to the transparent electrode layer;
Flexible lead wiring material connected to the wiring layer;
A transparent first cover layer covering the transparent electrode layer and an opaque second cover layer covering the wiring layer;
A base portion of the lead-out wiring member drawn from the transparent substrate is embedded in at least one of the first cover layer and the second cover layer, and a joint portion and the base portion between the lead-out wiring member and the transparent substrate are the first cover layer. 2. The sensor panel , which is covered with two cover layers, in which the base portion is embedded, has a molding resin, and the base portion is fixed with the molding resin . A surface portion having an operation surface region and a side wall portion formed integrally with a peripheral portion of the surface portion and extending rearward from the operation surface region are integrated, and the surface portion has the first cover layer. The side wall portion has the second cover layer;
The sensor panel according to claim 1, wherein the lead-out wiring member extends from the back side of the surface portion. A surface portion having an operation surface region and a side wall portion formed integrally with a peripheral portion of the surface portion and extending rearward from the operation surface region are integrated, and the surface portion has the first cover layer. The side wall portion has the second cover layer;
The sensor panel according to claim 1, wherein the lead-out wiring member extends from the back side of the side wall portion.   The sensor panel according to claim 1, wherein the first cover layer and the second cover layer are integrally formed.   5. The sensor panel according to claim 1, wherein the first cover layer is formed by resin molding, and a gate mark of the first cover layer is covered with the second cover layer. A transparent substrate in which a transparent electrode layer and a wiring layer are formed and to which a lead-out wiring material conducting to the wiring layer is connected is placed in a mold, and a transparent resin is injected into the mold and the transparent electrode Forming a first cover layer covering the layer ;
A step of injecting opaque resin into the mold and forming a second cover layer covering the wiring layer,
A base portion of the lead- out wiring member drawn out from the transparent substrate is embedded in at least one of the first cover layer and the second cover layer, and the second cover layer joins the lead-out wiring member and the transparent substrate. parts and the not covering the base, the manufacturing method of the sensor panel, characterized in that to fix the base in the molding resin of the cover layer which is embedded the base.   The mold includes a common mold, a first cover mold, and a second cover mold, and the transparent substrate is installed in the common mold, and the common mold and the first mold The first cover layer is formed between the cover mold and the second cover layer, and then the second cover layer is formed between the common mold and the second cover mold. A method for manufacturing a sensor panel. In the mold, a surface portion including the first cover layer and having an operation surface region, and a side wall portion including the second cover layer extending rearward away from the operation surface region are integrally formed,
The method for manufacturing a sensor panel according to claim 6 or 7, wherein the lead-out wiring member is extended from the back side of the surface portion. In the mold, a surface portion including the first cover layer and having an operation surface region, and a side wall portion including the second cover layer extending rearward away from the operation surface region are integrally formed,
The method for manufacturing a sensor panel according to claim 6 or 7, wherein the lead-out wiring member is extended from the back side of the side wall portion.   The method for manufacturing a sensor panel according to claim 6, wherein a gate mark of the first cover layer is covered with a second cover layer.

Images