JP2019171607A - Resin molded product and mold - Google Patents

Abstract

To provide a resin molded product with elevated integration of a base film having an electrode material arranged thereon and a protection layer.SOLUTION: A resin molded product 10 has: a base film 30 with an electrode 22 arranged at least on one side; and a coat resin 40 that is arranged on one side and the other side of the base film 30, a part arranged on one side and a part arranged on the other side of the base film 30 being formed integrally.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a resin molded product and a mold.

  Patent Document 1 below discloses a liquid crystal display device incorporating a touch panel.

Japanese Patent Laying-Open No. 2018-22189 (FIG. 4)

  In the liquid crystal display device of Patent Document 1, a touch panel provided with electrodes and a front window or a protective film are disposed so as to overlap each other. Thus, when arrange | positioning a touch panel and a protective film in piles, it may stick and integrate each, but a touch panel and a protective film may peel off only by sticking.

  In view of the above facts, an object of the present invention is to obtain a resin molded product and a mold that can enhance the integrity of a base film on which an electrode material is disposed and a protective layer.

  The resin molded product according to the first aspect of the present invention includes a base film in which an electrode material is disposed on at least one side, and one side and the other side of the base film, and A coating resin in which a portion disposed on one surface side of the base film and a portion disposed on the other surface side are integrally molded.

  In the resin molded product according to the first aspect of the present invention, the coating resin is disposed on one surface side and the other surface side of the base film on which the electrode material is disposed. For this reason, both surfaces of the base film and the electrode material are not directly exposed to the outside, and the electrode material is protected.

  And as for this coating resin, the part arrange | positioned at the one surface side of the base film and the part arrange | positioned at the other surface side are shape | molded integrally. For this reason, a base film is hold | maintained inside coating resin so that it may be enclosed by coating resin. Thereby, for example, the integrity of the base film and the coating resin as the protective layer is compared with the case where separate coating resins are arranged on one side and the other side of the base film, respectively. Has been increased.

  In the resin molded product according to the second aspect of the present invention, the electrode material is formed using a copper wire or a silver wire.

  According to the resin molded product of the second aspect of the present invention, the electrode material is formed using a copper wire or a silver wire. Copper and silver have a lower electrical resistance than, for example, indium tin oxide (ITO). For this reason, compared with the case where an electrode material is formed using indium tin oxide etc., a base film can be formed largely.

  According to a third aspect of the present invention, there is provided a mold according to the present invention, comprising: a first mold including a first parting surface; and a cavity that is recessed from the first parting surface and into which molten resin is injected. A projecting piece projecting from a part of the edge of the base film in the clamped state is formed at a position facing the cavity and a second parting surface capable of being sandwiched between the first parting surface A second mold having a core, and the surface of the core is between a front position flush with the second parting surface and a rear position recessed from the second parting surface. It is formed to be movable.

  According to the mold of the present invention as set forth in claim 3, in the state where the first mold and the second mold are clamped, the protruding piece of the base film is formed between the first parting surface and the second parting surface. Sandwiched between. In the second type core, the surface of the core is formed to be movable between a front position flush with the second parting surface and a rear position recessed from the second parting surface. .

  For this reason, when the core of the second mold is moved from the front position to the rear position while the first mold and the second mold are clamped with the base film interposed therebetween, the base film and the first parting surface A space is formed between the base film and the core while being held between the two parting surfaces.

  When the resin is injected into the cavity in this state, the resin flows from the portion other than the protruding piece protruding from the base film into the space between the base film and the core. Thereby, the resin molded product with which the resin each arrange | positioned on the both surfaces side of a base film was integrated can be formed.

  The resin molded product and the mold according to the present invention have an excellent effect that the integrity of the base film on which the electrode material is disposed and the protective layer can be enhanced.

(A) is a top view which shows the resin molded product which concerns on embodiment of this invention, (B) is the BB sectional drawing in (A). It is side sectional drawing which shows the metal mold | die which concerns on embodiment of this invention. FIG. 3 is a view taken along the line 3-3 in FIG. 2, showing a state in which a base sheet is set on the core mold of the mold according to the embodiment of the present invention. It is a side view which shows the state which clamped the metal mold | die which concerns on embodiment of this invention. It is a side view which shows the state which has injected the molten resin to the cavity of the metal mold | die which concerns on embodiment of this invention. It is a sectional side view which shows the state which moved the core of the metal mold | die which concerns on embodiment of this invention from the front position to the back position. It is a sectional side view which shows the state which has injected the molten resin to the space between the core of the metal mold | die which concerns on embodiment of this invention, and a base material sheet. It is a sectional side view which shows the state which opened the metal mold | die which concerns on embodiment of this invention. (A) is a top view which shows the state immediately after taking out from the metal mold | die in the resin molded product which concerns on embodiment of this invention, (B) is a BB sectional drawing in (A).

[First Embodiment]
<Resin molded product>
The resin molded product 10 according to the embodiment of the present invention is an electronic component as an input device arranged as a touch panel component on the surface of a display device such as a liquid crystal panel. As shown in FIGS. 1A and 1B, the resin molded product 10 includes an electrode material 20, a base film 30, a coating resin 40, and a decorative film 60.

  In addition, in order to simplify illustration, the decorating film 60 is abbreviate | omitted in FIG. 1 (A). Moreover, since the base film 30 and the electrode material 20 are covered with the coating resin 40, the base film 30 and the electrode material 20 should be indicated by a broken line in FIG. Is shown by a solid line. The same applies to FIG. 9A. In addition, in FIGS. 1 to 9, in order to explain the content of the invention, the shape and configuration of the resin molded product 10, the constituent members of the resin molded product 10, and the mold 50 are simplified and exaggerated as appropriate. Yes.

(Electrode material)
The electrode material 20 is connected to an electrode 22 disposed on one surface of the base film 30, an electrode 24 disposed on the other surface, and a control unit (not shown), and is disposed on both surfaces of the base film 30. A connection terminal 26, a routing wiring 22 </ b> A that connects the electrode 22 and the connection terminal 26, and a routing wiring 24 </ b> A that connects the electrode 24 and the connection terminal 26 are provided.

  The electrode 22 is formed on one surface of the base film 30 (the surface indicated by the arrow UP in FIG. 1B. In the following description, it is referred to as “surface” for the sake of convenience), and the arrow in FIG. It extends along the direction indicated by Y.

  The electrode 24 is formed on the other surface of the base film 30 (the surface indicated by the arrow DN in FIG. 1B. In the following description, it is referred to as “back surface” for the sake of convenience), and the arrow in FIG. It extends along the direction indicated by X.

  Arrows X and Y are directions substantially orthogonal to each other. When the base film 30 is viewed from the direction perpendicular to the plane, the electrodes 22 and 24 are arranged in a lattice pattern.

  The electrodes 22 and 24 and the routing wirings 22A and 24A are formed using copper wires. The diameters of the electrodes 22 and 24 are not particularly limited, but are small enough to be difficult for the human naked eye to see. Further, the wiring method (wiring direction, density, etc.) of the electrodes 22 and 24 is not particularly limited, and can be appropriately selected according to the use and required performance of the resin molded product. For example, the electrodes 22 and 24 are not necessarily arranged linearly, and may be arranged while being refracted and patterned into a diamond shape. Furthermore, the electrode 24 and the lead wiring 24A on the back surface side of the base film 30 can be omitted.

  Further, as the electrodes 22 and 24, silver wires may be used instead of the copper wires. As an example, these copper wires and silver wires are formed by bonding a copper foil to the base film 30 and further performing etching. As a method for forming a copper wire, various methods such as copper sputtering and vapor deposition can be employed in addition to a method of bonding a copper foil. The same applies to the silver foil.

(Base film)
The base film 30 is a sheet-like (flat plate-like) member formed of PET (polyethylene terephthalate) resin, and electrodes 22 and 24 are disposed on the front surface and the back surface, respectively. A protruding piece 32 that protrudes outward in the in-plane direction of the base film 30 is formed on a part of the edge of the base film 30. A connection terminal 26 is disposed on the protruding piece 32. The protruding piece 32 protrudes outward from the coating resin 40 in order to connect the connection terminal 26 to a control unit (not shown).

  The protruding piece 32 does not necessarily have to protrude outward from the coating resin 40. If the end surface of the connection terminal 26 is exposed to the outside of the coating resin 40, for example, the protruding width of the protruding piece 32 may be formed equal to the width L1 of the covering resin 40 around the base film 30.

  Further, projecting pieces 34 and 36 are formed on a part of the edge of the base film 30 other than the part on which the projecting pieces 32 are formed. The protruding widths of the protruding pieces 34 and 36 are equal to the widths L2 and L3 of the coating resin 40 around the base film 30.

  Note that the protruding widths of the protruding pieces 34 and 36 are larger than the widths L2 and L3 as shown by two-dot chain lines as the protruding pieces 34A and 36A in the stage of setting in a mold 50 (see FIG. 2) described later. As will be described in detail later, portions of the protruding pieces 34A and 36A that protrude from the molded coating resin 40 are cut off.

(Coating resin)
The coating resin 40 is formed of a PC (polycarbonate) resin, and is disposed on the front surface side and the back surface side of the base film 30, and a portion disposed on the front surface side and a portion disposed on the back surface side are integrally molded. Has been. Specifically, as shown in FIG. 1B, a resin layer 40A disposed on the front surface side of the base film 30 and a resin layer 40B disposed on the back surface side of the base film 30 are resin layers. It is integrated by 40C.

  The resin layer 40 </ b> C is formed in a portion indicated by shading in FIG. 1, that is, a portion around the base film 30 where the protruding pieces 32, 34, and 36 are not disposed. The resin layer 40C is integrally formed using the same material as the resin layers 40A and 40B.

(Decorative film)
The decorative film 60 is a decorative resin layer formed on the front side of the resin layer 40A, and is printed in advance by appropriately combining patterns, characters, colors, etc. before assembling to the mold 50 (see FIG. 2). Has been. The decorative film 60 can be subjected to uneven processing as required in terms of design and function.

<Mold>
As shown in FIG. 2, the mold 50 for molding the resin molded product 10 includes a cavity mold 52 and a core mold 54. Note that the cavity mold 52 and the core mold 54 may be arranged so as to be overlapped along the vertical direction (vertical direction), or may be arranged along the horizontal direction (horizontal direction). In this embodiment, the case where the cavity type | mold 52 and the core type | mold 54 are arrange | positioned along with the horizontal direction as an example is demonstrated.

  The cavity mold 52 is formed with a parting surface 52A and a cavity 52B formed in a shape recessed from the parting surface 52A. When the resin molded product 10 is molded, molten resin is injected into the cavity 52B via the spool 52C and the runner 52D.

  The core die 54 is formed with a parting surface 54A, a cavity 54B formed inside the core die 54, and a through hole 54C penetrating between the parting surface 54A and the cavity 54B. . A core 56 is inserted into the through hole 54C from the cavity 54B.

  The core 56 includes an insertion portion 56A that is inserted into the through hole 54C, and a flange portion 56B that protrudes from the insertion portion 56A in the direction perpendicular to the insertion direction in the cavity portion 54B. The planar shape of the insertion portion 56A (the shape seen from the direction orthogonal to the parting surface 54A) is substantially the same as the planar shape of the cavity 52B. The surface on the cavity mold 52 side in the flange portion 56 </ b> B is biased in a direction away from the cavity mold 52 by the coil spring 58.

  Further, the surface of the flange portion 56 </ b> B opposite to the cavity mold 52 is pressed by a rod 59 that resists the biasing force of the coil spring 58. As a result, the core 56 is held inside the core mold 54 at a position (front position) where the surface 56D (the surface of the insertion portion 56A) is flush with the parting surface 54A.

  When the pressing by the rod 59 is released, the core 56 moves away from the cavity mold 52 and contacts the stopper 57 as shown in FIG. As a result, the core 56 is held inside the core mold 54 at a position (rear position) where the surface 56D is recessed from the parting surface 54A.

<Method for producing resin molded product>
In order to manufacture the resin molded product 10, first, as shown in FIG. 2, the decorative film 60 is disposed inside the cavity 52B with the cavity mold 52 and the core mold 54 in the mold 50 being opened. To do. The decorative film 60 is formed into a shape close to the shape of the cavity 52B or the shape of the cavity 52B so as to follow the shape of the cavity 52B at the time of forming.

  Next, as shown in FIG. 3, the base film 30 on which the electrode material 20 is disposed is placed on the surface 56 </ b> D of the core 56 of the core mold 54. At this time, the base film 30 is disposed so that the protruding pieces 32, 34A, and 36A cover a part of the parting surface 54A. Further, in the peripheral portion of the base film 30, portions other than the portions where the projecting pieces 32, 34 </ b> A, and 36 </ b> A are formed are arranged inside the edge of the core 56.

  A suction hole (not shown) is formed on the surface 56D of the core 56, and the base film 30 can be held at a predetermined position by sucking air out of the suction hole. Further, in a state before mold clamping, the core 56 is held at the “front position”.

  Next, as shown in FIG. 4, the cavity mold 52 and the core mold 54 are clamped. By clamping the cavity mold 52 and the core mold 54, the projecting pieces 32, 34A, 36A of the base film 30 shown in FIG. 3 are sandwiched between the parting surface 52A and the parting surface 54A. The In FIG. 4, the core mold 54 is depicted as a movable mold, but the cavity mold 52 may be a movable mold.

  Then, as shown in FIG. 5, the molten resin G is injected into the cavity 52B. When the molten resin G is filled in the cavity 52B, the rod 59 is operated to move the core 56 to the “rear position” as shown in FIG.

  Even in a state where the core 56 is disposed at the rear position, the state in which the protruding pieces 32, 34A, 36A (see FIG. 3) of the base film 30 are sandwiched between the parting surface 52A and the parting surface 54A is maintained. The For this reason, as shown in FIG. 7, by continuing the injection of the molten resin G into the cavity 52 </ b> B, the molten resin G flows into and fills the space between the surface of the core 56 and the base film 30.

  When the molten resin G is cured and the coating resin 40 is molded, the cavity mold 52 and the core mold 54 are opened as shown in FIG. Thereby, the resin molded product 10 shown to FIG. 9 (A), (B) is obtained. In the base film 30, the protruding pieces 34A and 36A sandwiched between the parting surfaces 52A and 54A (see FIG. 2) of the mold 50, and the resin filled in the spool 52C and the runner 52D are resins. It is excised from the molded article 10. In FIGS. 9A and 9B, a portion cut out from the resin molded product 10 is surrounded by a broken-line frame.

  Through the above steps, the resin molded product 10 shown in FIG. 1 is obtained.

(Action / Effect)
In the resin molded product 10 according to the present embodiment, as shown in FIGS. 1 (A) and 1 (B), one surface side and the other surface side of the base film 30 on which the electrode material 20 is disposed are covered. Resin 40 is disposed. For this reason, both surfaces of the base film 30 and the electrode material 20 are not directly exposed to the outside, and the electrode material 20 is protected.

  Moreover, as for the coating resin 40, the part (resin layer 40A) arrange | positioned at the front side of the base film 30 and the part (resin layer 40B) arrange | positioned at the back side are shape | molded integrally. For this reason, the base film 30 is held inside the coating resin 40 so as to be enclosed by the coating resin 40.

  Thereby, compared with the case where the separate coating resin is arrange | positioned, for example to the one surface side and the other surface side of the base film 30, respectively, the integrity of the base film 30 and the covering resin 40 is improved. It has been. Moreover, peeling with the base film 30 and the coating resin 40 which is a protective layer of a base film can be suppressed.

  In addition, in order to improve the integrity of the base film 30 and the coating resin 40, an undercoat agent or a binder agent may be interposed at the interface between the base film 30 and the electrode material 20 and the coating resin 40. Alternatively, the surface of the base film 30 and the electrode material 20 may be subjected to plasma treatment or corona treatment to improve the adhesion with the coating resin 40.

  Further, since the resin molded product 10 is composed of a base film 30 made of PET resin and a coating resin 40 made of PC resin, that is, different materials, the mechanical strength is improved as compared with the case where it is composed of a single material. To do.

  Moreover, in the resin molded product 10, the coating resin 40 is formed by injection molding. For this reason, by adjusting the depth of the cavity 52 </ b> B, the thickness of the resin layer 40 </ b> A disposed on the surface side of the base film 30 in the coating resin 40 can be adjusted.

  Thereby, the detection sensitivity at the time of using the resin molded product 10 as a component of a touch panel can be adjusted. If the thickness of the resin layer 40A is too thin, the detection sensitivity becomes excessive, and the malfunction of the touch panel may increase. Conversely, if the thickness of the resin layer 40A is too thick, the detection sensitivity may be insufficient and the touch panel may be difficult to function.

  Moreover, in the resin molded product 10, the electrode material 20 is formed using the copper wire or the silver wire. Copper and silver have a lower electrical resistance than, for example, indium tin oxide (ITO). For this reason, compared with the case where an electrode material is formed using indium tin oxide etc., the base film 30 can be formed largely.

  Thereby, if the resin molded product 10 is used, a large-sized touch panel can be formed. Examples of a large touch panel include a display having a size of 50 inches or more, a dashboard inside a vehicle that integrally forms a range from a driver seat to a passenger seat, and the like. The resin molded product 10 can also be used for a display having a size of 50 inches or less.

  In addition, in this embodiment, although the decorating film 60 is arrange | positioned on the front side of the coating resin 40 and the decorating film 60 is integrated with the coating resin 40, embodiment of this invention is not restricted to this. For example, you may decorate by transferring a design etc., without arranging a decoration film. In this case, for example, at the time of molding a resin molded product, a transfer film on which a design for transfer or the like is printed is placed in the cavity 52B instead of the decorative film 60. The coating resin 40 is decorated by transferring the design printed on the transfer film. For this reason, the transfer film does not need to be integrated with the coating resin 40.

  In addition, the resin molded product 10 can be decorated by printing on the surface of the base film 30 and the electrode material 20. In this case, the surface of the coating resin 40 may not be decorated.

  Moreover, the resin molded product 10 does not necessarily have to be decorated. If the resin molded product 10 is not decorated, a resin molded product having no front and back surfaces can be obtained.

  Moreover, in this embodiment, although PC resin was used as the coating resin 40 and PET resin was used as the base film 30, embodiment of this invention is not restricted to this. For example, PC resin, PMMA (acrylic) resin, and a composite material formed by stacking two or more layers can be used as the base film 30. Further, as the coating resin 40, PMMA resin, ABS resin, or the like can be used. For example, if the same material is used for the coating resin 40 and the base film 30, the base film 30 and the coating resin 40 have the same linear expansion coefficient, and therefore the base film 30 and the coating resin 40 are peeled off. The suppression effect can be increased.

  Moreover, in this embodiment, although the base film 30 is made into the sheet form (flat form), embodiment of this invention is not restricted to this. For example, an arbitrary shape such as a curved shape or a wave shape can be used. In this case, in order to suppress variations in electrode sensitivity, it is preferable that the shape of the cavity 52 </ b> B in the cavity mold 52 is also a shape along the shape of the base film 30.

  Thereby, the resin molded product 10 can be made into arbitrary solid shapes. By forming the resin molded product 10 into a three-dimensional shape, it can be used as an interface for a dashboard inside the vehicle and other various electric products. Furthermore, a touch panel can be interposed in a display device formed with a curved surface using organic EL or the like.

  Moreover, in this embodiment, although the electrode material 20 is formed using a copper wire or a silver wire, embodiment of this invention is not restricted to this. For example, even if it forms using indium tin oxide (ITO) etc., the effect which can improve the integrity of the base film 30 and the coating resin 40 can be acquired. As described above, the present invention can be implemented in various modes.

  Note that the mold 50 can be used without moving the core 56 in the molding process of the resin molded product. By using the core 56 fixed to the front position or the rear position, a resin molded product in which the coating resin is formed only on one surface side of the base sheet can be obtained.

10 Resin molded product 20 Electrode material 22 Electrode (electrode material)
24 Electrode (electrode material)
30 base film 32 protruding piece 34A protruding piece 36A protruding piece 40 coating resin 50 mold 52 cavity type (first type)
52A Parting surface (first parting surface)
52B Cavity 54 Core type (second type)
56 core

Claims (3)

A base film in which an electrode material is disposed on at least one side;
A coating resin which is disposed on one surface side and the other surface side of the base film, and a portion disposed on one surface side and a portion disposed on the other surface side are integrally molded; ,
Molded resin product.   The resin material according to claim 1, wherein the electrode material is formed using a copper wire or a silver wire. A mold for molding a resin molded product according to claim 1 or 2,
A first mold comprising: a first parting surface; and a cavity that is recessed from the first parting surface and into which molten resin is injected,
A projecting piece projecting from a part of the edge of the base film in a clamped state is formed at a position facing the cavity and a second parting surface capable of being sandwiched between the first parting surface. A second mold comprising a core,
Have
The core surface is a mold formed so as to be movable between a front position flush with the second parting surface and a rear position recessed from the second parting surface.