JP2002319617A5 - - Google Patents
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- Publication number
- JP2002319617A5 JP2002319617A5 JP2001125276A JP2001125276A JP2002319617A5 JP 2002319617 A5 JP2002319617 A5 JP 2002319617A5 JP 2001125276 A JP2001125276 A JP 2001125276A JP 2001125276 A JP2001125276 A JP 2001125276A JP 2002319617 A5 JP2002319617 A5 JP 2002319617A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001125276A JP2002319617A (ja) | 2001-04-24 | 2001-04-24 | 半導体装置及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001125276A JP2002319617A (ja) | 2001-04-24 | 2001-04-24 | 半導体装置及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002319617A JP2002319617A (ja) | 2002-10-31 |
| JP2002319617A5 true JP2002319617A5 (ja) | 2008-05-29 |
Family
ID=18974522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001125276A Pending JP2002319617A (ja) | 2001-04-24 | 2001-04-24 | 半導体装置及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002319617A (ja) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3654254B2 (ja) * | 2002-01-24 | 2005-06-02 | 松下電器産業株式会社 | コイル部品の製造方法 |
| JP4499390B2 (ja) * | 2003-09-09 | 2010-07-07 | パナソニック株式会社 | 半導体装置及びその製造方法 |
| US7936072B2 (en) | 2007-11-12 | 2011-05-03 | Renesas Electronics Corporation | Semiconductor device having dual damascene structure |
| JP2012209287A (ja) | 2011-03-29 | 2012-10-25 | Renesas Electronics Corp | 半導体装置および半導体装置の製造方法 |
| KR101728288B1 (ko) | 2011-12-30 | 2017-04-18 | 인텔 코포레이션 | 자기-폐쇄 비대칭 상호연결 구조 |
| US8772938B2 (en) | 2012-12-04 | 2014-07-08 | Intel Corporation | Semiconductor interconnect structures |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3228217B2 (ja) * | 1998-03-27 | 2001-11-12 | 日本電気株式会社 | 半導体装置の製造方法 |
| JP4108228B2 (ja) * | 1999-07-15 | 2008-06-25 | 富士通株式会社 | 半導体装置の製造方法 |
| JP2001068455A (ja) * | 1999-08-30 | 2001-03-16 | Hitachi Ltd | 半導体装置の製造方法 |
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2001
- 2001-04-24 JP JP2001125276A patent/JP2002319617A/ja active Pending