JP2002316396A - Multi-layered sheet and moldings using the multi-layered sheet - Google Patents

Multi-layered sheet and moldings using the multi-layered sheet

Info

Publication number
JP2002316396A
JP2002316396A JP2001157882A JP2001157882A JP2002316396A JP 2002316396 A JP2002316396 A JP 2002316396A JP 2001157882 A JP2001157882 A JP 2001157882A JP 2001157882 A JP2001157882 A JP 2001157882A JP 2002316396 A JP2002316396 A JP 2002316396A
Authority
JP
Japan
Prior art keywords
resin
sheet
thickness
layered sheet
packaging container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001157882A
Other languages
Japanese (ja)
Inventor
Mikio Shimizu
美基雄 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Priority to JP2001157882A priority Critical patent/JP2002316396A/en
Publication of JP2002316396A publication Critical patent/JP2002316396A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To solve the problem that wear dust is generated by a wear in the resin of a packaging material through rubbing of an electronic part with the inner face of the packaging material due to vibration or impact generated during conveyance, when the electronic part is packed using a ray and a carrier tape and provide a packaging container for an electronic part as a product to deal with this problem. SOLUTION: The multi-layered sheet has a base material layer composed of a thermoplastic resin and a face layer composed of a thermoplastic polyurethane resin formed on at least one of the sides of the sheet. The thickness of the face layer is invariably 1 μm or above and the total thickness of the face layer is equivalent to 50% or below of the overall thickness of the multi- layered sheet. Also the packaging container for an electronic part is provided.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、多層シート、特に
表面の耐摩耗性に優れる多層シートおよびそれを用いた
成形品に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer sheet, particularly to a multilayer sheet having excellent surface abrasion resistance, and a molded article using the same.

【0002】[0002]

【従来の技術】電子部品包装容器、例えばトレー、キャ
リアテープの材料としては、ポリ塩化ビニル(PVC)
樹脂、ポリエチレンテレフタレート(PET)樹脂、ス
チレン系共重合体樹脂、ポリカーボネート系樹脂などが
その特性に応じて使用されている。
2. Description of the Related Art Polyvinyl chloride (PVC) is used as a material for electronic component packaging containers, for example, trays and carrier tapes.
Resins, polyethylene terephthalate (PET) resins, styrene-based copolymer resins, polycarbonate-based resins, and the like are used according to their characteristics.

【0003】[0003]

【発明が解決しようとする課題】しかし、電子部品をト
レー、キャリアテープによって包装した場合、輸送中等
に生じる振動や衝撃により電子部品が包装材料の内面と
擦られ、これにより包装材の樹脂が摩耗することによっ
て摩耗粉が発生するといった問題が起こることがある。
本発明は、かかる課題に対応する電子部品包装容器を提
供するものである。
However, when electronic components are wrapped in trays or carrier tapes, the electronic components rub against the inner surface of the packaging material due to vibrations and shocks generated during transportation or the like, thereby causing the resin of the packaging material to wear. This may cause a problem such as generation of abrasion powder.
The present invention provides an electronic component packaging container that addresses such a problem.

【0004】[0004]

【課題を解決する手段】すなわち本発明は熱可塑性樹脂
からなる基材層と、少なくとも片面に熱可塑性ポリウレ
タン系樹脂からなる表面層を有し、該表面層の厚みはい
ずれも1μm以上でかつその合計が多層シートの全体厚
みの50%以下であることを特徴とする多層シート、お
よびそれを用いた電子部品包装容器である。
That is, the present invention has a base layer made of a thermoplastic resin and a surface layer made of a thermoplastic polyurethane resin on at least one surface, and the thickness of each of the surface layers is 1 μm or more. A multilayer sheet, wherein the total is 50% or less of the total thickness of the multilayer sheet, and an electronic component packaging container using the multilayer sheet.

【0005】[0005]

【発明の実施の形態】以下、詳細に本発明を説明する。
本発明の多層シートとは熱可塑性樹脂からなる基材層
と、少なくとも片面に熱可塑性ポリウレタン系樹脂から
なる表面層を有するものである。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.
The multilayer sheet of the present invention has a base material layer made of a thermoplastic resin and a surface layer made of a thermoplastic polyurethane resin on at least one surface.

【0006】基材層は、熱可塑性樹脂からなる。熱可塑
性樹脂としては押出機等によって加熱溶融によりシート
状に加工できるものであれば特に限定するものではな
く、例えばGPPSまたはHIPSおよびこれらの混合
物を主成分とするポリスチレン系樹脂、スチレン−ブタ
ジエンブロック共重合体、エチレンおよびプロピレンの
ホモポリマーやエチレンまたはプロピレンを主体とする
共重合体等を主成分とするポリオレフィン系樹脂、ポリ
カーボネート系樹脂、アクリロニトリル−ブタジエン−
スチレンの三成分を主体とした共重合体を主成分とする
ABS系樹脂、ポリアクリル酸およびポリメチルメタク
リレートなどのポリアクリル酸エステルを主成分とする
アクリル系樹脂、ポリアミド樹脂、ポリエステル系樹
脂、ポリウレタン系樹脂、およびこれらのアロイ系樹脂
の使用できる。これらの樹脂を主成分として更にスチレ
ン−ブタジエン共重合体の水添物、エチレン−酢酸ビニ
ル共重合体、エチレン−エチルアクリレート共重合体等
を添加したものを使用することができる。基材層は組成
の均一な単層が好ましいが、組成の異なる複数の構成か
らなるものであってもよい。基材層には更に添加剤、充
填剤、導電性物質等を添加することができる。
[0006] The base layer is made of a thermoplastic resin. The thermoplastic resin is not particularly limited as long as it can be processed into a sheet by heating and melting with an extruder or the like. Polyolefin-based resin, polycarbonate-based resin, acrylonitrile-butadiene-based on a polymer, a homopolymer of ethylene and propylene, a copolymer mainly composed of ethylene or propylene, etc.
ABS resin mainly composed of a copolymer mainly composed of three components of styrene, acrylic resin mainly composed of polyacrylate such as polyacrylic acid and polymethyl methacrylate, polyamide resin, polyester resin, polyurethane Resin and these alloy resins can be used. Those obtained by adding a hydrogenated product of a styrene-butadiene copolymer, an ethylene-vinyl acetate copolymer, an ethylene-ethyl acrylate copolymer, and the like to the main components of these resins can be used. The base layer is preferably a single layer having a uniform composition, but may be composed of a plurality of components having different compositions. Additives, fillers, conductive substances, and the like can be further added to the base layer.

【0007】表面層は熱可塑性ポリウレタン系樹脂から
なる。本発明で用いる熱可塑性ポリウレタン系樹脂は特
に限定を受けない。例えば、ポリカプロラクトン系ポリ
ウレタン、ポリカーボネート系ポリウレタン、ポリエー
テル系ポリウレタン、ポリエステル系ポリウレタンなど
が挙げられ、このうちの1種もしくは2種以上が用いら
れる。これらの熱可塑性ポリウレタンエラストマーは市
販されているもの(例えばパンデックス(大日本インキ
化学工業(株)製)、ミラクトラン(日本ミラクトラン
(株)製)、タケラック(タケダ薬品工業(株)製)、
いずれも商品名。)を用いることができる。
The surface layer is made of a thermoplastic polyurethane resin. The thermoplastic polyurethane resin used in the present invention is not particularly limited. For example, polycaprolactone-based polyurethane, polycarbonate-based polyurethane, polyether-based polyurethane, polyester-based polyurethane, and the like can be mentioned, and one or more of these are used. These thermoplastic polyurethane elastomers are commercially available (for example, Pandex (manufactured by Dainippon Ink and Chemicals, Inc.), milactran (manufactured by Nippon Milactran), Takelac (manufactured by Takeda Pharmaceutical Co., Ltd.),
All are trade names. ) Can be used.

【0008】多層シートの製造方法は特に限定されない
が、例えば通常の複数の押出成形機でフィードブロック
法またはマルチマニホールド法を用いてTダイ法による
共押出成形で製造することができる。この場合、基材層
と表面層の接着強度を持たせるために各層間に接着性樹
脂を介することもできる。表面層は基材層の表面に印刷
やコーティングによって形成することも可能である。こ
の場合も、基材層と表面層の接着強度を持たせるために
他の樹脂成分からなる層を同様な方法によって設けるこ
ともできる。
The method for producing the multilayer sheet is not particularly limited. For example, the multilayer sheet can be produced by coextrusion molding using a feed block method or a multi-manifold method with a T-die method using a plurality of extruders. In this case, an adhesive resin may be interposed between the respective layers in order to have an adhesive strength between the base material layer and the surface layer. The surface layer can be formed on the surface of the base material layer by printing or coating. Also in this case, a layer made of another resin component can be provided by a similar method in order to provide an adhesive strength between the base material layer and the surface layer.

【0009】表面層の厚みはいずれも1μm以上でかつ
その合計が多層シートの全体厚みの50%以下である。
表面層が1層したかないときはその厚みは1μm以上で
多層シートの全体厚みの50%以下である。表面層が2
層ある場合それぞれの表面層の厚みは1μm以上でかつ
その2層ある表面層の合計の厚みが多層シートの全体厚
みの50%以下である。この場合両表面層の厚みは同じ
であることが好ましいが、異なっていてもよい。1μm
未満であると表面層の厚みが十分でないために耐摩耗性
が不足してしまい、また50%を超えると二次加工性が
低下し、経済的に好ましくない。多層シートの全体厚み
は0.1mm〜3mmが好適であり、更には0.2mm
〜1.0mmが好ましい。
The thickness of each of the surface layers is 1 μm or more, and the total thereof is 50% or less of the total thickness of the multilayer sheet.
When there is no single surface layer, the thickness is 1 μm or more and 50% or less of the total thickness of the multilayer sheet. 2 surface layers
When there are layers, the thickness of each surface layer is 1 μm or more, and the total thickness of the two surface layers is 50% or less of the total thickness of the multilayer sheet. In this case, the thickness of both surface layers is preferably the same, but may be different. 1 μm
If less than 50%, the thickness of the surface layer is not sufficient, resulting in insufficient wear resistance, and if more than 50%, the secondary workability is reduced, which is not economically preferable. The total thickness of the multilayer sheet is preferably 0.1 mm to 3 mm, more preferably 0.2 mm
~ 1.0 mm is preferred.

【0010】多層シートには、必要に応じて様々な添加
剤を基材層および表面層に配合しても良い。添加剤とし
ては着色剤、顔料、染料、帯電防止剤、紫外線吸収剤、
エネルギー消光剤、光拡散剤、蛍光増白剤、酸化防止
剤、熱安定剤、スリップ剤、アンチブロック剤、フィラ
ー、艶消剤、難燃剤等がある。また少量であれば表面層
に公知の樹脂を添加することもできる。
In the multilayer sheet, various additives may be added to the base material layer and the surface layer, if necessary. Additives include colorants, pigments, dyes, antistatic agents, ultraviolet absorbers,
There are energy quenchers, light diffusers, optical brighteners, antioxidants, heat stabilizers, slip agents, antiblocking agents, fillers, matting agents, flame retardants, and the like. If the amount is small, a known resin can be added to the surface layer.

【0011】多層シートの表面には帯電防止処理を施す
ことができる。帯電防止処理の方法としては帯電防止剤
を塗布する方法、樹脂中に帯電防止剤やカーボンブラッ
ク、導電性無機微粒子、導電性高分子微粒子などの導電
性物質を練り込んだものを積層する方法など公知の様々
な方法を用いることが可能である。表面に帯電防止処理
を施すことにより、包装容器として使用した際に微細な
電子部品の静電気による破壊、張り付きや飛び出しを防
止する効果が得られる。
The surface of the multilayer sheet may be subjected to an antistatic treatment. Examples of the method of the antistatic treatment include a method of applying an antistatic agent, a method of laminating a resin into which a conductive substance such as an antistatic agent, carbon black, conductive inorganic fine particles, and conductive polymer fine particles is kneaded. Various known methods can be used. By performing the antistatic treatment on the surface, an effect of preventing destruction, sticking, or popping out of fine electronic components due to static electricity when used as a packaging container can be obtained.

【0012】上述のシートから真空成形、圧空成型、プ
レス成形等公知のシートの成形方法を利用することによ
り自由な形状の容器を得ることができる。この容器は電
子部品包装容器として好適に用いることができる。電子
部品包装容器としては例えばトレーやキャリアテープが
あり、特に微細な部品を包装するのに適する。
A container having a free shape can be obtained from the above-mentioned sheet by using a known sheet forming method such as vacuum forming, pressure forming and press forming. This container can be suitably used as an electronic component packaging container. The electronic component packaging container includes, for example, a tray and a carrier tape, and is particularly suitable for packaging fine components.

【0013】[0013]

【実施例】以下に実施例および比較例を示す。 (評価方法) (1)耐摩耗性 シート表面を爪でひっかいて傷の発生度合いについて評
価を行った。 (2)二次加工性 シートからキャリアテープ成形機(EDG社製)にて2
4mm幅キャリアテープを作成し、その成形性について
評価を行った。
EXAMPLES Examples and comparative examples are shown below. (Evaluation method) (1) Abrasion resistance The sheet surface was scratched with nails to evaluate the degree of scratch generation. (2) Secondary workability The sheet is processed with a carrier tape molding machine (manufactured by EDG).
A 4 mm wide carrier tape was prepared and its moldability was evaluated.

【0014】(実施例)基材の原料としてABS樹脂
(電気化学工業社製、SE−10)を、またその基材の
表面層の原料として熱可塑性ポリウレタン(大日本イン
キ化学工業社製、パンデックス)を用い、両面層の原料
を40mm単軸押出機、基材の原料を65mm単軸押出
機にて押出温度260℃〜300℃の範囲で同時に押
出、それぞれの溶融樹脂を2種3層フィードブロック
(厚みスリット比1:10:1)にて合流させ、700
mm巾Tダイスより押出、急冷ロールにて厚み0.50
mm、シートの厚み構成比 1(表面層):9(基材
層):1(表面層)の3層シートを作成した。このシー
トは耐摩耗性に優れると共に二次加工性も良好であっ
た。
(Example) ABS resin (SE-10, manufactured by Denki Kagaku Kogyo Co., Ltd.) was used as a base material, and thermoplastic polyurethane (PAN, manufactured by Dainippon Ink and Chemicals Co., Ltd.) was used as a base layer material. Using a 40 mm single-screw extruder and a 65 mm single-screw extruder to simultaneously extrude the raw materials for the double-sided layers at an extrusion temperature of 260 ° C. to 300 ° C. 700 at the feed block (thickness slit ratio 1: 10: 1)
Extruded from T-die with width of 0.5 mm, thickness of 0.50 with quenching roll
mm, thickness composition ratio of sheet 1 (surface layer): 9 (base layer): 1 (surface layer) to prepare a three-layer sheet. This sheet had excellent abrasion resistance and good secondary workability.

【0015】(比較例)実施例の2台押出機の両方か
ら、ABS樹脂を押出、厚み0.5mmの単層シートを
作成した。そして同様に評価を行った。ABS樹脂単層
シートは二次加工性は良好であるが、耐摩耗性が大きく
劣っている。
(Comparative Example) ABS resin was extruded from both of the two extruders of the example to form a single-layer sheet having a thickness of 0.5 mm. And it evaluated similarly. The ABS resin single-layer sheet has good secondary workability, but has poor abrasion resistance.

【0016】[0016]

【発明の効果】基材層に熱可塑性樹脂を用い表面層が熱
可塑性ウレタン系樹脂からなる容器は耐摩耗性に優れト
レーやキャリアテープに好適に用いることが出来る。
The container made of a thermoplastic resin for the base material layer and made of a thermoplastic urethane resin for the surface layer has excellent abrasion resistance and can be suitably used for trays and carrier tapes.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) B65D 85/86 B65D 85/38 D R Fターム(参考) 3E067 AA11 AB41 BA02A BA10A BA15A BB14A BB25A BC02A BC04A CA21 CA30 FA01 FC01 GD04 3E086 AD05 AD09 BA04 BA24 BA35 BB35 BB54 CA31 3E096 BA08 CA06 CA11 CB02 CC01 EA02X EA11X FA07 FA40 GA01 4F100 AK51B AK51C AK74 AT00A BA02 BA03 BA06 BA10B BA10C CA22B CA22C EH20 GB16 JB16A JB16B JB16C JK09 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) B65D 85/86 B65D 85/38 DRF Term (Reference) 3E067 AA11 AB41 BA02A BA10A BA15A BB14A BB25A BC02A BC04A CA21 CA30 FA01 FC01 GD04 3E086 AD05 AD09 BA04 BA24 BA35 BB35 BB54 CA31 3E096 BA08 CA06 CA11 CB02 CC01 EA02X EA11X FA07 FA40 GA01 4F100 AK51B AK51C AK74 AT00A BA02 BA03 BA06 BA10B BA10C CA22B CA16CEBBJ16BJBBJ16BJB16B

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】熱可塑性樹脂からなる基材層と、少なくと
も片面に熱可塑性ポリウレタン系樹脂からなる表面層を
有し、該表面層の厚みはいずれも1μm以上でかつその
合計が多層シートの全体厚みの50%以下であることを
特徴とする多層シート。
1. A multi-layer sheet comprising: a base layer made of a thermoplastic resin; and a surface layer made of a thermoplastic polyurethane resin on at least one surface. A multilayer sheet having a thickness of 50% or less.
【請求項2】帯電防止処理が施された請求項1に記載の
多層シート。
2. The multilayer sheet according to claim 1, which has been subjected to an antistatic treatment.
【請求項3】請求項1または請求項2に記載の多層シー
トからなる成形品。
3. A molded article comprising the multilayer sheet according to claim 1.
【請求項4】請求項3に記載の成形品からなる電子部品
包装容器。
4. An electronic component packaging container comprising the molded product according to claim 3.
【請求項5】キャリアテープである請求項4に電子部品
包装容器。
5. The electronic component packaging container according to claim 4, which is a carrier tape.
【請求項6】トレーである請求書4に記載の電子部品包
装容器。
6. The electronic component packaging container according to claim 4, which is a tray.
JP2001157882A 2001-04-19 2001-04-19 Multi-layered sheet and moldings using the multi-layered sheet Pending JP2002316396A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001157882A JP2002316396A (en) 2001-04-19 2001-04-19 Multi-layered sheet and moldings using the multi-layered sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001157882A JP2002316396A (en) 2001-04-19 2001-04-19 Multi-layered sheet and moldings using the multi-layered sheet

Publications (1)

Publication Number Publication Date
JP2002316396A true JP2002316396A (en) 2002-10-29

Family

ID=19001672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001157882A Pending JP2002316396A (en) 2001-04-19 2001-04-19 Multi-layered sheet and moldings using the multi-layered sheet

Country Status (1)

Country Link
JP (1) JP2002316396A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013043652A2 (en) 2011-09-19 2013-03-28 Dow Global Technologies Llc Layered structures and articles prepared therefrom
WO2013043635A1 (en) 2011-09-19 2013-03-28 Dow Global Technologies Llc Layered structures and articles prepared therefrom
CN103317779A (en) * 2012-03-20 2013-09-25 阿拉贡卡塔拉矿业股份有限公司 Opaque multi-layer container
KR101543225B1 (en) 2015-01-28 2015-08-11 (주) 모듈트레이테크널러지 Composite sheet for making electronic component tray and method of manufacturing the same
JP2020075432A (en) * 2018-11-08 2020-05-21 川口合成株式会社 Sheet material for molding container, container and container molding method using the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013043652A2 (en) 2011-09-19 2013-03-28 Dow Global Technologies Llc Layered structures and articles prepared therefrom
WO2013043635A1 (en) 2011-09-19 2013-03-28 Dow Global Technologies Llc Layered structures and articles prepared therefrom
US9487337B2 (en) 2011-09-19 2016-11-08 Dow Global Technologies Llc Layered structures and articles prepared therefrom
CN103317779A (en) * 2012-03-20 2013-09-25 阿拉贡卡塔拉矿业股份有限公司 Opaque multi-layer container
KR101543225B1 (en) 2015-01-28 2015-08-11 (주) 모듈트레이테크널러지 Composite sheet for making electronic component tray and method of manufacturing the same
JP2020075432A (en) * 2018-11-08 2020-05-21 川口合成株式会社 Sheet material for molding container, container and container molding method using the same

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