JP2002314235A - Method and apparatus for laminating resin sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that, when a resin sheet of each laminating unit cut by a cutting blade is laminated on a circuit board while heating the sheet, heat is transferred to the sheet before laminating and its adhesive properties are lost, in a method and an apparatus for laminating the sheet on the circuit board to adhere an electronic component to the board. SOLUTION: The method for laminating the resin sheet comprises the steps of again heating and laminating the resin sheet 12 of each laminating unit installed on the circuit board 14 at the position separated from the sheet 8 before laminating, after the step of installing (temporarily adhering) the sheet 12 of the laminating unit on the board 14 so as not to transfer the heat to the adjacent sheet 8 at the time of heating the sheet 12 of the laminating unit.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for attaching a resin sheet to a wiring board for attaching the resin sheet to a wiring board and an electronic component. The present invention relates to a method and an apparatus for attaching a resin sheet to prevent heat from being transmitted to a resin sheet.

[0002]

2. Description of the Related Art Conventionally, in order to bond a wiring board and an electronic component, a resin sheet is stuck on the wiring board and the resin sheet is pressed from above the resin sheet stuck on the wiring board. Is often used to bond the wiring board and the electronic component. At this time, the resin sheet attached to the back tape was cut sequentially, and the individual resin sheets were pressed while being heated and continuously attached to the wiring board, but this resin sheet was made of a thermosetting resin. Therefore, when heat is transmitted to the resin sheet before the application, the resin sheet is cured, and the heat is not transmitted to the resin sheet before the application by the following method.

[0003] Hereinafter, a conventional method of attaching a resin sheet will be described with reference to the drawings.

FIG. 7 is a flowchart showing each step of a conventional method of attaching a resin sheet.

As shown in FIG. 7, first, a wiring board made of glass epoxy or ceramic is supplied, and a resin sheet adhered to a back tape made of polyimide is supplied together with the back tape. Then, a kerf is formed in the resin sheet by a resin sheet cutting unit having a cutting blade, and the individual resin sheets separated by the kerf are positioned at predetermined positions on the wiring board. Not cut. Then, the resin sheet is attached to the upper surface of the wiring board by heating while being pressed from the upper surface of the resin sheet by the resin sheet attaching head. Here, if the resin sheet is normally attached, the next resin sheet is continuously attached on the wiring board. If the resin sheet is not attached, the resin sheet is attached again to the same position.

Next, a resin sheet sticking apparatus will be described according to the above-described resin sheet sticking flow.

FIG. 8 is a sectional view showing a resin sheet sticking apparatus for realizing the conventional resin sheet sticking method shown in FIG.

As shown in FIG. 8, when the back tape supply unit 1 rotates, the resin sheet 3 stuck to the back tape 2 is supplied above the wiring board 4, and the end of the back tape 3 is stored in the back tape. The unit 5 is accommodated by rotating in conjunction with the back tape supply unit 1. Here, by forming a cut groove in the resin sheet 3 by the resin sheet cutting unit 6 having a cutting blade, the resin sheet 3 moves before moving above the wiring board 4.
The resin sheet 3 stuck to the back tape 2 is separated into resin sheets 7 for each sticking unit by a resin sheet cutting unit 6 having a cutting blade. The resin sheet 7 for each bonding unit is heated while being pressed from above the resin sheet 7 for each bonding unit thus separated,
The resin sheet 7 for each bonding unit is bonded on the wiring board 4.

[0009]

According to the conventional resin sheet sticking method, a resin sheet to be stuck by a heater built in a resin sheet sticking head when a resin sheet for each sticking unit is stuck on a wiring board. Since it is heated, heat is also transmitted to the resin sheet before sticking, and the resin sheet before sticking is heated. Therefore, the resin sheet before pasting moves to the upper side of the wiring board in the next step, and even if it is heated again, the adhesive strength is reduced, so that there is a problem that the resin sheet cannot be pasted on the wiring board.

The present invention provides a method and an apparatus for attaching a resin sheet so that the heat applied to the resin sheet to be attached is transmitted to the resin sheet before the attachment and the adhesive strength of the resin sheet is not reduced. Is what you do.

[0011]

In order to solve the above-mentioned conventional problems, a resin sheet attaching method according to the present invention comprises the steps of attaching a resin sheet for each attaching unit sequentially from a continuous back tape onto a wiring board. In attaching, the step of cutting the resin sheet into resin sheet portions for each unit to be attached to the wiring substrate, and separating the resin sheet for each unit of attachment from the back sheet, heating and installing the resin sheet on the wiring substrate And moving the wiring board to which the resin sheet for each of the pasting units is pasted, thereby separating the resin sheet for each of the pasting units from the resin sheet adjacent to the resin sheet for each of the pasting units. Heating the resin sheet for each of the bonding units on the wiring board and pressing the same.

[0012] Accordingly, since heat is not transmitted to the resin sheet before attaching, even if the resin sheet is made of a thermosetting resin, it can be attached onto the wiring board without impairing the adhesiveness. Is possible.

[0013] In addition, in the step of heating the resin sheet for each of the attachment units and installing the resin sheet on the wiring board, and the step of heating and pressing the resin sheet for each of the attachment units on the wiring board, Is heated to 70 to 90 ° C.

Thus, the resin sheet made of a thermosetting resin having a curing temperature of 180 ° C. can be placed on the wiring board in a state of being tacky without being cured.

Further, the resin sheet sticking apparatus of the present invention is characterized in that a cutting portion for cutting the resin sheet into resin sheets for each unit of attachment to the wiring board, and at least one of the resin sheet portions for each of the unit for attachment, Positioning means for positioning on the wiring board; resin sheet bonding means for bonding the resin sheet for each bonding unit positioned on the wiring board while being heated on the wiring board; and And a stage on which the resin sheet for each of the pasting units is placed while being heated on the wiring board, and the stage on which the wiring board is mounted is moved, and the resin sheet for each of the pasting units is moved. While heating the resin sheet for each of the pasting units by the resin sheet pasting means at a position away from the resin sheet adjacent to the Crimped to the line on the substrate.

Accordingly, since heat is not transmitted to the resin sheet before the attachment, even if the resin sheet is made of a thermosetting resin, the resin sheet can be attached to the wiring board without impairing the adhesiveness. Is possible.

The pressing means is a rotating roller,
The roller is pressed while rotating on the upper surface of the resin sheet.

Thus, in addition to the effect of heating the resin sheet to improve the adhesiveness, by applying pressure,
The wiring substrate and the semiconductor element can be bonded via the resin sheet.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a resin sheet sticking method and a resin sheet sticking apparatus according to the present invention will be described below with reference to the drawings.

First, a first embodiment will be described.

FIG. 1 is a flowchart showing a method for attaching a resin sheet according to the present embodiment.

As shown in FIG. 1, first, a wiring board made of glass epoxy or ceramic is supplied, and a resin sheet attached to a back tape made of epoxy resin is supplied together with the back tape. A cutting groove is formed in the resin sheet by a resin sheet cutting unit having one row of cutting blades, and the resin sheet for each bonding unit separated by the cutting groove is positioned at a predetermined position on the wiring board. Sometimes, the backsheet is not cut. Then, the pressure is applied from the upper surface of the resin sheet for each bonding unit by the resin sheet bonding head at 80 ° C. for 3 seconds.
Heating is performed, and the resin sheet for each unit of application is placed on the upper surface of the wiring board, and the resin sheet for each unit of application is separated from the back tape.

By the way, the curing conditions of the resin sheet are a temperature of 180 to 200 ° C. and a heating time of 20 to 60 [s]. The condition under which the resin sheet becomes sticky is a heating temperature of 70 to 90 [° C.]. Therefore, at this stage, on the upper surface of the wiring board, a resin sheet is provided for each of the bonding units, which slightly generates adhesiveness.

[0024] Then, by moving the stage on which the wiring board is mounted, the resin sheet for each sticking unit placed on the wiring board is separated from immediately below the resin sheet adjacent to the resin sheet for each sticking unit. 80
By heating again under the heating conditions of [° C.] and 2 [s] and applying pressure from the upper surface of the resin sheet for each bonding unit installed on the wiring board, the resin sheet for each bonding unit is mounted on the wiring board. paste.

Next, the back tape is moved by the length of the resin sheet for each bonding unit. Here, if the resin sheet for each bonding unit is stuck at a predetermined position on the wiring board, the wiring board is carried out, and if not, the process returns to the step of supplying the resin sheet again.

FIG. 2 is a side view showing a resin sheet sticking apparatus for realizing the resin sheet sticking method of this embodiment described with reference to FIG. FIG. 2A is a side view showing a process of installing (temporarily bonding) a resin sheet on a wiring board for each bonding unit, and FIG. FIG. 4 is a side view showing a step of heating and bonding the resin sheet again.

As shown in FIGS. 2A and 2B, the back tape 9 to which the resin sheet 8 is adhered is wound around the resin sheet supply unit 10. First, by rotating the resin sheet supply unit 10, the back tape 9 to which the resin sheet 8 is adhered is moved above the resin sheet cut unit 11 having a cutting blade. Here, by raising the resin sheet cutting unit 11, the resin sheet 8 stuck on the lower side of the back tape 9 is separated for each sticking unit. Then, the resin sheet 12 is heated to 80 ° C. while being pressed by the resin sheet pasting head 13 via the back tape 9 from above the resin sheet 12 separated for each pasting unit, and is placed on the wiring board 14. Note that the pressurizing time and the heating time are set synchronously, and both are 3 [s]. Here, heat that would lower the adhesive force is not transmitted to the resin sheet before the bonding, and the resin sheet 12 for each bonding unit is completely removed from the wiring board 1.
4 is not pasted.

Thereafter, the back tape 9 is moved to 2 to 10 [mm].
Then, the wiring board 14 is moved by 2 to 10 [mm] in the direction opposite to the direction in which the back tape 9 is returned, and is separated from immediately below the resin sheet 8 adjacent to the resin sheet 12 for each unit of application. Again, the resin sheet 12 is heated to 80 ° C. while being pressed by the resin sheet pasting head 13 via the back tape 9 from above the resin sheet 12 for each pasting unit installed on the wiring board 14 and By applying pressure, the attachment of the resin sheet 12 for each attachment unit is completed. The pressurizing time and the heating time are synchronous, and both are 2 [s].

Finally, the back tape from which the resin sheet for each bonding unit has been separated is sequentially wound up by the back tape supply unit 15. Back tape storage unit 1
In the case of 0, the back tape 9 is wound on a reel, but a method of storing the back tape by suction may be used.

In this embodiment, the steps up to the step of attaching the resin sheet for each unit of attachment to the wiring board have been described. Thereafter, electronic components such as semiconductor elements are mounted on the upper surface of the resin sheet for each unit of attachment. By heating the resin sheet at 180 [° C.] for 20 [s] while applying pressure, the resin sheet is completely cured, and the wiring board and the electronic component can be bonded.

As described above, the method of attaching a resin sheet according to the present embodiment includes the first step of heating and installing (temporarily bonding) the resin sheet for each unit of attachment on the wiring board, and the method of attaching the resin sheet for each unit of attachment. A second step of heating and bonding the resin sheet for each bonding unit again at a position where the resin sheet for each bonding unit is separated from the resin sheet adjacent to the resin sheet, so that the resin sheet for each bonding unit is provided. This prevents heat from being transmitted to the unadhered resin sheet adjacent to and prevents the adhesive strength from being impaired.

The feature of the present embodiment is that the resin sheet for each bonding unit is set (temporarily bonded) on the wiring board in a first step at a low temperature and in a short time. It is possible to supply a resin sheet for each bonding unit onto the wiring board without transmitting heat.

Next, a second embodiment will be described.

The same contents as those in the first embodiment are omitted, and the same components are denoted by the same reference numerals.

FIG. 3 is a flowchart showing a method for attaching a resin sheet according to the present embodiment.

FIG. 4 is a side view showing a resin sheet sticking apparatus for realizing the resin sheet sticking method of this embodiment described with reference to FIG.

As shown in FIG. 3 and FIG. 4, after the resin sheet 12 for each bonding unit is bonded on the wiring board 14, the wiring board 14 is moved and the resin sheet 12 for each bonding unit is In the heating step, the wiring board 14 on which the resin sheet 12 for each bonding unit is bonded is moved to another position, and another resin sheet bonding head 16 is moved.
By completely heating the resin sheet 12 for each bonding unit again on the wiring board 14, the bonding is completed.

Although the resin sheet pasting head 13 and another resin sheet pasting head 16 can be operated individually, the installation (temporary adhesion) operation and the pasting operation can be performed simultaneously, respectively. It is possible to improve productivity.

In the present embodiment, in the step of heating the resin sheet for each unit of application again, the resin sheet for each unit of application is heated at a position distant from the resin sheet before application. Similarly to the above, heat is not transmitted to the resin sheet before the attachment.

Next, a third embodiment will be described.

The same contents as those of the first embodiment or the second embodiment are omitted, and the same components are denoted by the same reference numerals.

FIG. 5 is a flowchart showing a method for attaching a resin sheet according to the present embodiment.

FIG. 6 is a side view showing a resin sheet sticking apparatus for realizing the resin sheet sticking method of this embodiment described with reference to FIG.

As shown in FIG. 5 and FIG. 6, after the resin sheet 12 for each bonding unit is bonded on the wiring board 14, the wiring board 14 is moved and the resin sheet 12 for each bonding unit is again In the heating step, the wiring board 14 to which the resin sheet 12 for each bonding unit is bonded is moved to another position, and another resin sheet bonding head 17 is moved.
Thus, the resin sheet 12 for each bonding unit is completely bonded onto the wiring board while being heated again. Here, another resin sheet pasting head 17 is provided with a roller that rotates at the tip, and is pressed while rotating the roller from the resin sheet 12 for each pasting unit installed on the wiring board 14, Again, the resin sheet for each bonding unit is heated and bonded on the wiring board.

As described above, the resin sheet sticking method and the resin sheet sticking apparatus of the present embodiment press the resin sheet for each sticking unit with the rotating roller.
The resin sheet for each unit of application can be uniformly adhered to the wiring board.

[0046]

According to the resin sheet sticking method and the resin sheet sticking apparatus of the present invention, heat is not transferred to the resin sheet before the sticking when the resin sheet is stuck to the wiring board for each sticking unit. Therefore, the resin sheet for each bonding unit can be stuck on the wiring board successively without deteriorating the adhesiveness.

[Brief description of the drawings]

FIG. 1 is a flowchart showing a method for attaching a resin sheet according to an embodiment of the present invention.

FIG. 2 is a side view showing a resin sheet sticking apparatus according to an embodiment of the present invention.

FIG. 3 is a flowchart showing a method for attaching a resin sheet according to an embodiment of the present invention.

FIG. 4 is a side view showing a resin sheet sticking apparatus according to one embodiment of the present invention.

FIG. 5 is a flowchart showing a method for attaching a resin sheet according to an embodiment of the present invention.

FIG. 6 is a side view showing a resin sheet sticking apparatus according to an embodiment of the present invention.

FIG. 7 is a flowchart showing a conventional method of attaching a resin sheet.

FIG. 8 is a side view showing a conventional resin sheet sticking apparatus.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 back tape supply unit 2 back tape 3 resin sheet 4 wiring board 5 back tape storage unit 6 resin sheet cut unit 7 resin sheet 8 resin sheet 9 back tape 10 resin sheet supply unit 11 resin sheet cut unit 12 resin sheet 13 resin sheet pasting Attaching head 14 wiring board 15 back tape supply unit 16 another resin sheet pasting head 17 another resin sheet pasting head

Continuing from the front page (72) Inventor Kazuhiro Ishikawa 1006 Kadoma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. Person Koji Takemura 1006 Kadoma, Kazuma, Kazuma, Osaka Prefecture F-term in Matsushita Electric Industrial Co., Ltd.

Claims (4)

[Claims] A step of cutting the resin sheet into resin sheet portions for each unit of application to the wiring board when sequentially attaching resin sheets for each unit of application from a continuous back tape to a circuit board; Separating the resin sheet for each of the pasting units from the back sheet, heating and installing the resin sheet on the wiring board, and moving the wiring board to which the resin sheet for each of the pasting units is pasted, A step of separating the resin sheet of each of the pasting units from a resin sheet adjacent to the resin sheet of each of the pasting units, and a step of heating and pressing the resin sheet of each of the pasting units on the wiring board. A method for attaching a resin sheet, comprising: 2. The method according to claim 1, wherein the step of heating the resin sheet for each of the bonding units and installing the resin sheet on the wiring board, and the step of heating and pressing the resin sheet for each of the bonding units on the wiring board are performed separately for each of the bonding units. 7 resin sheets
The resin sheet sticking method according to claim 1, wherein the resin sheet is heated to 0 to 90 [° C]. 3. A cutting section for cutting a resin sheet into resin sheets for each unit to be attached to a wiring board, and positioning means for aligning at least one of the resin sheet portions for each unit to be attached onto the wiring board. And a resin sheet sticking means for sticking, on the wiring board, a resin sheet for each of the sticking units aligned on the wiring board, and a stage on which the wiring board is placed, wherein the sticking unit Each of the resin sheets is placed on the wiring board while being heated, and the stage on which the wiring board is placed is moved, and the resin sheet is separated from the resin sheet adjacent to the resin sheet for each of the bonding units. Affixing the resin sheet on the wiring substrate while heating the resin sheet for each of the attaching units by attaching means. Device. 4. The resin sheet sticking apparatus according to claim 3, wherein the pressing means is a rotating roller and presses the roller while rotating the roller on the upper surface of the resin sheet.