JP2002313974A - Microwave circuit package and apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve a structure where a plurality of microwave circuit packages each having a cavity section for packaging a high-frequency semiconductor and a high-frequency circuit can be overlapped, to simplify the connection between the packages, to miniaturize the packages, to reduce costs, to reduce the loss of characteristics, and to achieve the high-density packaging of the high-frequency circuit. SOLUTION: The cavity section 6 is provided which has a sufficient depth to prevent a wire 7 for connecting the high-frequency semiconductor 5 to the microwave circuit package from projecting from the uppermost surface of the package. An end section having an I/O terminal 4 of the microwave circuit package is formed in steps. When the plurality of microwave circuit packages are mutually connected, arrangement is made so that the I/O terminal 4 provided at the step-shaped end section comes into contact, thus simplifying the connection between the packages, and hence obtaining the microwave circuit package that can be miniaturized, reduce the costs, reduce the loss of the characteristics, and package the high-frequency circuit with high density.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave circuit package and a microwave circuit device for mounting a high-frequency semiconductor, and more particularly to a connection between packages.

[0002]

2. Description of the Related Art A conventional microwave circuit package will be described. 8 to 10 are views showing the structure of a conventional microwave circuit package. 8 is a perspective view, FIG. 9 is a sectional view, and FIG. 10 is a pattern diagram of an inner layer of the package. In FIG. 8, reference numeral 1 denotes a multilayer substrate in which a plurality of dielectric substrates are stacked, 2a denotes an exposed high-frequency transmission line (hereinafter, microstrip line), and 3 denotes a plated high-frequency circuit in the multilayer substrate 1 connected to a ground pattern. Through holes,
Reference numeral 4 denotes an input / output terminal for inputting / outputting signals for driving and control with respect to a high-frequency circuit inside the multilayer substrate 1;
Is a cavity for mounting the high-frequency semiconductor in the main body of the multilayer substrate 1, and is provided with a pattern for mounting the high-frequency semiconductor 5. Reference numeral 7 denotes a wire, 8 denotes a terminal provided around the cavity 6 for supplying a driving signal or a control signal to the high-frequency semiconductor 5 through the wire 7, and 11 denotes a terminal provided around the cavity 6 for sealing the high-frequency semiconductor. It is a seal ring. In FIG. 9, the same components as those in FIG. 8 are denoted by the same reference numerals. 2b is an internal high-frequency transmission line in the multilayer substrate 1, and 9 is a high-frequency circuit inside the multilayer substrate 1. 10, the same components as those in FIG. 8 are denoted by the same reference numerals.

In a conventional microwave circuit package, a high-frequency control signal and a driving signal are input from an input / output terminal 4 to a high-frequency semiconductor 5 and a high-frequency circuit 9 to perform an operation with desired high-frequency characteristics. The multilayer substrate 1 is formed by laminating dielectric substrates having the same dielectric constant over all layers.

In order to connect the conventional packages as shown in FIGS. 8 to 10, the packages are connected by wires, and the package is sealed by a seal ring 11, so that a gap is formed at the top of the package body. It was difficult to reduce the size of the package. Furthermore, there is a problem that the characteristics of the connection portion are varied due to the assembly, and the number of processes increases, thereby increasing the price. Further, a spatial area margin for mounting and assembling is required, which is called high density. There was a problem in point.

[0005]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and simplifies the connection between microwave circuit packages, reduces the deterioration of the characteristics of the package connection part, It is intended to reduce the size and cost of the package and increase the density of the high-frequency circuit.

[0006]

According to the present invention, there is provided a microwave circuit package comprising: (1) a cavity for mounting a high-frequency semiconductor, a high-frequency transmission line, and a plurality of dielectric substrates laminated. A microwave circuit package, provided on the upper or lower surface of the microwave circuit package, wherein the high-frequency transmission line has an input / output terminal for inputting / outputting a signal, and when stacking a plurality of microwave circuit packages, The input / output terminals of a plurality of microwave circuit packages are arranged so as to be in contact with each other.

(2) An end of an arbitrary one of the plurality of stacked microwave circuit packages is stacked so as to protrude or retreat from an end of another microwave circuit package, and to the protruding portion. It has an input / output terminal of a high-frequency transmission line.

(3) An input / output terminal of the high-frequency transmission line is provided at an end of the plurality of stacked microwave circuit packages, and the ends are sequentially arranged from the top of the stacked plurality of microwave circuit packages. They are arranged in a stepped or inverted staircase.

The plurality of cavities are arranged.

Further, the plurality of microwave circuit packages of (2) or (3) are arranged so that the input / output terminals at the ends are in contact with each other.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Hereinafter, the microwave circuit package according to the first embodiment will be described. FIG. 1 is a perspective view of a multilayer substrate constituting the microwave circuit package according to the first embodiment, FIG. 2 is a top view, FIG. 3 is a side sectional view taken along a line AA in FIG. 2, and FIG.
It is side surface sectional drawing in the straight line BB in a middle. In FIG. 1, 1 is a multi-layer substrate in which a plurality of dielectric substrates are stacked, 2a is a microstrip line, 3 is a metal-plated through hole,
4 is an input / output terminal, 5 is a high-frequency semiconductor, and 6 is a cavity for mounting the high-frequency semiconductor on the main body of the multilayer substrate 1, and has a pattern for mounting the high-frequency semiconductor 5. Reference numeral 7 denotes a wire, and 8 denotes a terminal provided around the cavity 6 for supplying a driving signal and a control signal to the high-frequency semiconductor 5 via the wire 7. 2, the same components as those in FIG. 1 are denoted by the same reference numerals. 3, the same components as those in FIG. 1 are denoted by the same reference numerals. Reference numeral 2b denotes an internal high-frequency transmission line in the multilayer substrate 1, reference numeral 9 denotes a high-frequency circuit, and reference numeral 10 denotes a ground pattern disposed in an upper layer and a lower layer of the internal high-frequency transmission line 2b. 4, the same components as those in FIG. 1 are denoted by the same reference numerals. The inner layer pattern of the package is the same as that of the conventional example shown in FIG.
It has a pattern similar to 0.

In the first embodiment, a plurality of the multilayer substrates shown in FIGS. 1 to 4 and FIG.
A microwave circuit package as shown in FIGS. At this time, the cavity is formed with a sufficient depth so that the wire 7 for connecting to the high-frequency semiconductor does not protrude from the uppermost surface of the microwave circuit package, and the seal ring base required in the conventional example is not used. This eliminates the gap at the top of the package body that is required for sealing ring sealing, which was required in the past.
Downsizing becomes easy.

FIG. 5A is a side view showing the configuration of the microwave circuit package according to the first embodiment. FIG.
In the figures, reference numerals 1a, 1b, 1c, and 1d denote the multilayer substrates shown in FIG. 1, which are integrated to constitute a microwave circuit package. The same components as those in FIG. 1 are denoted by the same reference numerals. FIG. 5B is a top view of the microwave circuit package.

A high-frequency circuit 9 in one multilayer substrate is connected to the other high-frequency circuit 9 or the high-frequency semiconductor 5 or the like via the input / output terminal 4 so that a microwave circuit package 1a to 1d is integrated. A high-frequency control signal and a driving signal are input from the input / output terminal 4 to the high-frequency semiconductor 5 and the high-frequency circuit 9 to perform an operation with desired high-frequency characteristics.

When connecting the microwave circuit packages shown in FIGS. 5A and 5B, FIG.
The connection is made by directly contacting the input terminals 4 with each other and the microstrip lines 2 as shown in FIG. As a result, a microwave circuit package capable of reducing the space margin and reducing the size is obtained. In FIG. 6A, 1a
1 to 1 h are the multi-layer boards shown in FIG. 1, each of which integrates 1 a to 1 d and 1 e to 1 h to constitute one microwave circuit package. FIG. 6B and FIG.
(C) is a figure showing the pattern of the contact surface.
As shown in the figure, the same pattern is provided on the contact surface, and the upper and lower surfaces are aligned to connect the packages.

Although FIGS. 1 to 4 show a multilayer substrate having only one cavity, the microwave circuit package according to the first embodiment may use a multilayer substrate having a plurality of cavities. Good.

As described above, in the first embodiment, a plurality of multi-layers having a cavity formed with a sufficient depth so that the wires connected to the high-frequency semiconductor do not protrude from the uppermost surface of the microwave circuit package. A microwave circuit package is obtained by stacking and integrating substrates, and the ends of the package are stepped, and when connecting the plurality of microwave circuit packages, the stepped ends are configured to be in contact with each other and connected. Therefore, miniaturization and high-density mounting of a high-frequency circuit are realized without using a special member such as a wire.

Embodiment 2 FIG. FIG. 7 is a diagram illustrating a side surface of the microwave circuit package according to the second embodiment.
Reference numerals 1a to 1j denote multilayer substrates having one or a plurality of cavities constituting the microwave circuit package shown in FIGS. 1 to 4, and each of the multilayer substrates 1a to 1e and 1f to 1j is integrated into one. Construct a microwave circuit package. The same components as those in the first embodiment are denoted by the same reference numerals.

In the second embodiment, as shown in FIG. 7, an end of an arbitrary stage of a multi-layered multilayer substrate is disposed so as to protrude from an end of another stage, and the same microwave circuit package of the other microwave circuit package is provided. A microwave circuit package is provided in which steps are retracted and a package is simplified without using a contact member such as a wire.

[0020]

As described above, according to the present invention, a plurality of multilayer substrates having a cavity formed with a sufficient depth so that wires connected to a high-frequency semiconductor do not protrude from the uppermost surface of a microwave circuit package. A microwave circuit package that is stacked and integrated, wherein the package ends are stepped, and when connecting the plurality of microwave circuit packages, the stepped ends are configured to be in contact with each other and connected. Therefore, miniaturization and high-density mounting of a high-frequency circuit are realized without using a special member such as a wire.

Further, one microwave circuit package is constituted by a plurality of stacked multilayer substrates as a whole, and an end of an arbitrary stage is arranged so as to protrude from another stage, and an arbitrary stage of the other microwave circuit package is arranged. Of the package is set back from the other step, and the protruding portion and the set-back portion are fitted and connected. This simplifies the contact between the packages, reduces the size and cost, and increases the density of the high-frequency circuit. It implements the implementation.

[Brief description of the drawings]

FIG. 1 is a perspective view of a multilayer substrate of a microwave circuit package according to Embodiment 1 of the present invention.

FIG. 2 is a top view of the multilayer substrate of the microwave circuit package according to the first embodiment of the present invention.

FIG. 3 is a side sectional view taken along a straight line AA of the multilayer substrate of the microwave circuit package according to the first embodiment of the present invention;

FIG. 4 is a side sectional view taken along a straight line BB of the multilayer substrate of the microwave circuit package according to the first embodiment of the present invention;

FIG. 5A is a side view of the microwave circuit package according to the first embodiment of the present invention. FIG. 2B is a top view of the stepped end of the microwave circuit package according to the first embodiment of the present invention.

FIG. 6A is a diagram illustrating a connection method of the microwave circuit package according to the first embodiment of the present invention. (B)
FIG. 3 is a stepped end contact surface of one side of the microwave circuit package according to the first embodiment of the present invention. FIG. (C) The other stepped end contact surface of the microwave circuit package according to the first embodiment of the present invention.

FIG. 7 is a diagram illustrating a connection method of the microwave circuit package according to the second embodiment of the present invention.

FIG. 8 is a perspective view illustrating a conventional microwave circuit package.

FIG. 9 is a side sectional view of a conventional microwave circuit package.

FIG. 10 is a diagram illustrating an inner layer pattern of a conventional microwave circuit package.

[Explanation of symbols]

1 multilayer board, 2a microstrip line, 2b
Internal high frequency transmission line, 3 plated through hole, 4 input / output terminals, 5 high frequency semiconductor, 6
Cavity part, 7 wire, 8 Terminal of cavity part, 9 High frequency circuit, 10 Ground pattern,
11 Seal ring base.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 25/18 // H05H 1/46

Claims (5)

[Claims] 1. A microwave circuit package formed by stacking a plurality of multilayer substrates on which dielectric substrates are stacked, wherein the multilayer substrate is a high-frequency semiconductor connected to the multilayer substrate by wires, and the wires are A cavity portion for mounting the high-frequency semiconductor having a depth not protruding from the uppermost surface of the dielectric substrate, a high-frequency transmission line, and a high-frequency transmission line provided on the uppermost surface or the lowermost surface of the multilayer substrate; Has an input / output terminal for inputting / outputting a signal, and when stacking the plurality of multilayer substrates, the microwave is characterized in that the input / output terminals of the plurality of multilayer substrates are arranged so as to be in contact with each other. Circuit package. 2. An end of a predetermined part of the multilayer substrate of the microwave circuit package is projected or retracted from an end of the remaining multilayer substrate, and an input / output terminal of a high-frequency transmission line is provided at the projected or retracted portion. The microwave circuit package according to claim 1, further comprising: 3. An end portion of the multilayer substrate of the microwave circuit package is arranged in a stepwise or inverted stepwise order from the top, and an input / output terminal of the high-frequency transmission line is provided at the stepped or inverted stepped end. 2. The method according to claim 1, wherein
Microwave circuit package as described. 4. The microwave circuit package according to claim 1, wherein a plurality of said cavity portions are arranged. 5. A microwave comprising a plurality of microwave circuit packages according to claim 2, wherein said plurality of microwave circuit packages are arranged such that input / output terminals at said ends are in contact with each other. Circuit device.