JP2002312744A - Integrated circuit device, manufacturing method therefor and ic card using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a highly reliable integrated circuit device of high quality and an IC card using it. SOLUTION: The integrated circuit device 21 is constituted by providing a resin frame body 24 on a wiring board 28 provided with a conductor 22 to be a terminal for external connection and covering an integrated circuit element 25 and a connection means 26 formed on the inner side of the resin frame body 24 with a sealing resin 27.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit device mounted on, for example, an IC card and the like, a method of manufacturing the same, and an IC card using the integrated circuit device.

[0002]

2. Description of the Related Art In recent years, ICs in which integrated circuit elements such as microcomputers and memories are mounted on plastic cards.
Cards have been put to practical use. Since this IC card has a large storage capacity and excellent security compared to magnetic stripe cards already used in large quantities,
It is being used in a wide range of applications such as for personal authentication, billing, and personal data recording.

A conventional integrated circuit device mounted on this IC card has a configuration as shown in FIGS.

[0004] That is, as shown in FIGS. 12 and 13, a wiring board 8 has a conductor 2 serving as an external connection terminal on a single-sided copper-clad glass epoxy laminated insulating board 3. Through hole 3 for electrically connecting conductor 2
a. A metal frame 4 fixed with an adhesive 9 to a wiring board 8 opposite to the surface on which the conductor of the insulating board 3 is provided.
And an integrated circuit element 5 bonded and fixed inside the metal frame 4 with a dice bond resin 10, and an input / output electrode 5a and the conductor 2 provided on the integrated circuit element 5 through a first through hole 3a. By providing a gold wire 6 electrically connected by a bonding method and an ultraviolet curable epoxy resin 7a covering the integrated circuit element 5 and the gold wire 6 to the vicinity of the upper portion of the metal frame 4 by a potting method, the thickness is increased. 0.65
An extremely thin integrated circuit device 1a of about mm is formed.

[0005] Thereafter, as shown in FIG.
A hole 12a is provided in the card material 12 of about mm.
The IC card 14 is manufactured by arranging the integrated circuit device 1a with the conductor 2 facing upward and bonding and fixing the outer edge 8a of the insulating substrate 3 using a cyanoacrylate adhesive 13 or the like.

[0006]

SUMMARY OF THE INVENTION An integrated circuit device has an IC
When assembling a card, it is required that the thickness of the card be extremely thin and that the dispersion be small. But,
In the conventional integrated circuit device 1a, since the metal frame is bonded and fixed, there is a problem that variation in the thickness direction is likely to occur. In the potting method, which is an ultraviolet curing type sealing method, the integrated circuit element 5 and the gold wire 6 are not completely sealed because the amount of supplied resin varies, and the integrated circuit element 5 and the gold wire 6 are exposed. However, there has been a problem in terms of reliability on an IC card that causes an electrical malfunction. On the contrary, when the amount of the epoxy resin 7a increases,
There is a problem that the sealing resin is higher than the upper surface of the metal frame, and the thickness accuracy required as an integrated circuit device for an IC card cannot be secured.

Further, since the metal frame 4 is bonded and fixed with an adhesive, there is a problem in terms of portability due to misalignment before the adhesive is completely cured, or because the metal frame is heavy and heavy. Was.

An object of the present invention is to provide a high-quality integrated circuit device and an IC card which solve these problems.

[0009]

According to a first aspect of the present invention, there is provided an integrated circuit device comprising: a wiring board provided with a conductor serving as an external connection terminal and having a first through hole; An integrated circuit element, an input / output electrode formed on the integrated circuit element, and connection means for electrically connecting the conductor through the first through-hole on a main surface of the wiring board opposite to the conductor. A resin frame provided so as to surround the connecting means, and a sealing resin which covers the integrated circuit element and the connecting means inside the resin frame. According to this configuration, since the resin frame body that is lighter than the metal frame body is used, the weight can be reduced, and the portability can be improved.

According to a second aspect of the present invention, in the integrated circuit device of the first aspect, the resin frame disposed on the insulating substrate is formed of a thermoplastic resin. It is characterized by the following. According to this configuration, the bending strength can be increased as compared with a resin frame made of a thermoplastic resin.

According to a third aspect of the present invention, in the integrated circuit device according to the first aspect, the insulating substrate has a second through hole for holding the resin frame. It is characterized by the following. According to this configuration, the physical strength can be excellent, and the occurrence of the displacement can be suppressed.

According to a fourth aspect of the present invention, there is provided an integrated circuit device according to the first aspect, wherein the sealing resin is formed using a molding die. According to this configuration, it is possible to obtain a sealing resin in which the amount of the resin is sealed without excess or shortage, so that the resin can be extremely thin in the thickness direction and have excellent thickness accuracy.

According to a fifth aspect of the present invention, there is provided an integrated circuit device wherein the integrated circuit device according to any one of the first to fourth aspects is bonded and fixed to a hole provided in the card. . According to this configuration, an IC card equipped with the integrated circuit of the present invention can be provided.

According to a sixth aspect of the present invention, there is provided a method of manufacturing an integrated circuit device, wherein a conductor serving as an external connection terminal is provided and a wiring board having a first through hole is provided on a side opposite to the conductor. Forming a resin frame on a main surface using a molding die, mounting an integrated circuit element inside the resin frame, and connecting the input / output electrode and the conductor of the integrated circuit element to the first surface; A step of electrically connecting through the first through-hole, and a step of covering the integrated circuit element, the through-hole, and the electrical connection portion with a sealing resin inside the resin frame. It is. According to this configuration, it is possible to improve the positional accuracy of the resin frame and prevent the occurrence of thin burrs.

According to a seventh aspect of the present invention, there is provided a method of manufacturing an integrated circuit device, wherein a conductor serving as an external connection terminal is provided and a wiring board having a first through hole is provided on a side opposite to the conductor. Forming a resin frame on the main surface, mounting an integrated circuit element inside the resin frame, and electrically connecting the input / output electrode of the integrated circuit element and the conductor through the first through hole. And a step of covering the integrated circuit element, the through hole and the electrical connection portion with a sealing resin inside the resin frame using a molding die. It is. According to this configuration, since the resin frame is molded by a molding die, the amount of resin can be sealed without excess or shortage, so that an electrical connection portion is exposed, which causes an electrical failure. Can be solved.

According to a ninth aspect of the present invention, there is provided a method of manufacturing an integrated circuit device according to the sixth or seventh aspect, wherein the integrated circuit element and the integrated circuit element are mounted on the resin frame. It has a stepped portion for enclosing a sealing resin for covering the connection means. According to this configuration, a product excellent in mass productivity can be provided.

[0017]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment) FIG. 1 is a sectional view of an integrated circuit device 21 according to an embodiment of the present invention, and FIG. 2 is a plan view thereof.

First, the wiring board 28 includes the insulating substrate 23 and
A conductor 22 serving as an external connection terminal formed on the insulating substrate 23 and a connecting means 26 provided on the insulating substrate 23
And a first through-hole 23a for passing through.

The insulating substrate 23 on which the conductor 22 is formed
The main surface on the opposite side is connected to an integrated circuit element 25 bonded with a die bond resin 29, and an input / output electrode 25a provided on the integrated circuit element 25 and the conductor 22 through a first through hole 23a. And a gold wire as means 26 are provided. Also,
A plurality of second through holes 23b are formed in the insulating substrate 23 outside the connection means 26 so as to surround the integrated circuit element 25;
The resin frame 24 is formed so as to overlap with the second through hole 23b. The integrated circuit device 21 is configured by filling the sealing resin 27 into the resin frame 24.

A method of manufacturing the integrated circuit device 21 having the above configuration will be described below.

FIG. 3 is a plan view of the wiring board 28 according to the embodiment of the present invention.

As shown in FIG. 3, an integrated circuit element 2 in which a first through hole 23a and a second through hole 23b are mounted later.
By providing a patterned conductor 22 on one main surface of a plurality of insulating substrates 23 formed so as to surround the wiring substrate 5, a wiring substrate 28 having a thickness of approximately 0.14 mm is formed.

Here, the method of providing the conductor 22 on the insulating substrate 23 is described in a printed circuit board for an IC card (JP-A-63-28163).
No. 1896). That is, a glass epoxy base material having a thickness of 0.1 mm is used as the insulating substrate 23, and a copper foil of 0.035 mm is formed thereon,
The wiring board 28 is formed by providing the three-layered conductor 22 by performing Ni plating of 1 to 3 μm on the portion exposed as the conductor 22 and Au plating of 0.3 to 0.5 μm on the Ni plating. .

Next, on the insulating substrate 23 of the wiring substrate 28,
A resin frame 24 is formed. FIG. 4 is a cross-sectional view in which the resin frame is formed.

First, as shown in FIG. 5, a molding die having an upper die 31, a lower die 30, and a gate 31b is mounted on the second through hole 23b of the wiring board 28. Next, the resin frame 2
4 is provided with a gate 31b of a molding die.
PPS (polyphenylene sulfide) resin is injected by a pin gate method. The concave portion 24a is provided to prevent the gate portion from forming a convex portion due to the remaining gate and to prevent the thickness of the integrated circuit device 21 from increasing. By this method, a resin frame 24 having a height of 0.4 mm and a width of 0.7 mm is used.
Can be formed.

In this embodiment, the method of injecting the resin by the above-described pin gate method is described. However, the gate method for forming the resin frame 24 is not limited to the side wall portion of the resin frame 24. A tunnel gate system in which resin is injected from 24b may be used.

As the material of the resin frame 24, a glass fiber reinforced PPS (polyphenylene sulfide) resin having excellent fluidity and bending strength is used, but an LCP (liquid crystal polymer) resin may be used. According to these resins, the strength can be increased as compared with a thermosetting epoxy resin. That is, while the bending strength of the thermosetting epoxy resin 7b is approximately 12 to 14 kgf / mm ² , the bending strength of the glass fiber reinforced PPS resin studied as the resin frame 24 is approximately 23 kgf / mm ² , Since the bending strength can be remarkably increased, the physical reliability when configuring the IC card can be improved.

The metal frame used in the conventional integrated circuit device 1a is usually made of bronze (Cu-Sn). Although the specific gravity of this metal frame is approximately 8, the glass frame reinforced PPS resin of the resin frame 24 in the embodiment of the present invention has a specific gravity of 1.7, so that it has the same size (approximately 0.7 mm in thickness and high height). When the resin frame 24 is formed with a thickness of 0.4 mm, the integrated circuit device 21 can be reduced in weight by 0.2 g. Since the total weight of an IC card is approximately 4 g,
The weight reduction of 0.2 g can realize a weight reduction of approximately 5% as a whole.

In forming the resin frame 24, the insulating substrate 23 and the resin frame 24 need to be in close contact with each other. It is preferable to form by activating the surface.

Further, in the present embodiment, a plurality of second substrates are provided on the insulating substrate 23 so that the resin frame 24 and the conductor 22 are in contact with each other.
Since the through hole 23b is provided, the adhesion can be physically improved.

The resin frame 24 according to the present embodiment
Is formed on the conductor 22 so as to engage with the through hole 23b provided in the insulating substrate 23, but as shown in FIG. 6, the resin is fitted into the through hole 22a provided on the conductor as well. Is also good. In this case, by making the hole 22a provided in the conductor 22 larger than the second through hole 23b provided in the insulating substrate 23, the anchor effect can be increased and the physical strength can be further improved. In the case of the configuration shown in FIG. 6, there is a possibility that a poor connection may occur with the reader / writer that communicates with the IC card.
A hole 22a penetrating through the conductor 22 must be provided in a place other than the position of the contact specified in SO7816.

Next, the integrated circuit element 25 is mounted on the insulating substrate 23 of the wiring board 28 provided with the resin frame 24. FIG. 7 is a sectional view showing the mounting of the integrated circuit element. is there.

First, as shown in FIG. 7, an integrated circuit element 25 is bonded and fixed to the inside of a resin frame 24 on an insulating substrate 23 by a known die bonding method using a dice bond resin 29.

Here, the integrated circuit element 25 is bonded and fixed on the insulating substrate 23. However, the insulating substrate 23 at the bonding and fixing place may be removed and the integrated circuit element 25 may be bonded and fixed directly on the conductor 22 in order to make it thinner. . In this case, an insulating dice bond resin is used as the dice bond resin 29 rather than a conductive dice bond resin containing Ag.

Next, connection means 26 is formed between the input / output electrode 25a formed on the integrated circuit element 25 and the conductor 22 through the first through hole 23a by a known wire bonding method. Here, the connecting means 26 has a diameter of 2
Use a 5 μm gold wire.

Thereafter, the sealing resin 2 is placed inside the resin frame 24.
7 is filled.

This sealing method is, as shown in FIG. 8, formed using a molding die having an upper die 32, a lower die 33, a gate 34, and a runner 35.

First, about 0.2 mm provided on the resin frame 24,
Align the gate 34 of the molding die with the step portion 24d of
A thermosetting epoxy resin containing silica having an average particle diameter of 15 μm is injected from the runner 35 into the resin frame 24.

After the resin is cured, the molding die is opened and the runner 3
After separating the upper mold 32 with an ejector (not shown) together with 5, the gate 34 and the runner 35 are removed to complete the integrated circuit device 21 having the sealing resin 27.

According to the present embodiment, since the resin frame 24 is formed on the wiring board 28, the resin frame 24 stops the flow of the molding resin.
The thin burrs generated on the surface can be suppressed.

The resin frame 24 according to the present embodiment
Since PPS resin or LCP resin is used, the generation of thin burrs can be suppressed. That is, when providing a resin frame of a thermosetting epoxy resin,
When the resin is injected into the mold, there is a problem that the viscosity becomes low like water and thin burrs are easily generated on the parting surface of the mold. According to the present embodiment, this problem can be solved, and there is no problem such as a trouble in assembling an IC card due to the formation of unnecessary resin due to the generation of burrs.

When mass-producing the integrated circuit device 21 of the present invention, as shown in FIG.
Is formed on a tape-shaped wiring substrate 28.

Next, an integrated circuit device 21 in this individual state can be obtained by pressing a product having a size indicated by a two-dot chain line shown in FIG.

Next, the integrated circuit device 21 according to the embodiment of the present invention is assembled on an IC card 36.

FIG. 10 is a plan view of an IC card in which the integrated circuit device 21 is assembled, and FIG. 11 is a sectional view thereof.

The card material 37 of the IC card has a thickness of 0.76 mainly composed of vinyl chloride resin or ABS resin.
Use the one of about mm. A hole 37a is provided in the card material 37, and the flat portion 37b of the hole 37a is
1 is incorporated. This hole 37a
The integrated circuit device 21 is bonded and fixed to the outer edge of the device using a cyanoacrylate-based adhesive, a so-called instant adhesive, or a heat-activated double-sided adhesive film 38. Thereby, the IC card 36 can be formed.

[0048]

As is clear from the above description of the embodiment, according to the integrated circuit device of the present invention, a resin frame excellent in positional accuracy and physical strength is provided, and a molding die is used. Since the encapsulating resin is formed by the encapsulation, it is possible to obtain a high-quality integrated circuit device with good thickness accuracy and no burrs due to leakage of the encapsulating resin. Further, by assembling such an integrated circuit device into a card, an IC card excellent in portability and electrical reliability can be provided.

[Brief description of the drawings]

FIG. 1 is a sectional view of an integrated circuit device according to an embodiment of the present invention.

FIG. 2 is a plan view of the integrated circuit device according to the embodiment of the present invention.

FIG. 3 is a plan view of the wiring board according to the embodiment of the present invention;

FIG. 4 is a cross-sectional view of a wiring board on which a resin frame according to the embodiment of the present invention is formed.

FIG. 5 is a sectional view of a wiring board on which a resin frame is formed by a molding die according to the embodiment of the present invention;

FIG. 6 is a cross-sectional view of the wiring board on which the resin frame according to the embodiment of the present invention is formed.

FIG. 7 is a sectional view of an integrated circuit device on which the integrated circuit element according to the embodiment of the present invention is mounted.

FIG. 8 is a cross-sectional view of an integrated circuit device in which a sealing resin is formed by a molding die according to the embodiment of the present invention.

FIG. 9 is a plan view showing an integrated circuit device during mass production according to the embodiment of the present invention.

FIG. 10 is a plan view of the IC card according to the embodiment of the present invention.

FIG. 11 is a sectional view of an essential part of the IC card according to the embodiment of the present invention;

FIG. 12 is a plan view of a conventional integrated circuit device.

FIG. 13 is a sectional view of a conventional integrated circuit device.

FIG. 14 is a sectional view of a main part of an IC card using a conventional integrated circuit device.

[Explanation of symbols]

 21, 1a Integrated circuit device 22, 2 Conductor 23, 3 Insulating substrate 23a First through hole 23b Second through hole 24 Resin frame 24d Step 25, 5 Integrated circuit element 25a, 5a Input / output electrode 26, 6 Connection Means 27, 7a Sealing resin 36, 14 IC card 37, 12 Card material 37a, 12a Hole provided in card material

Continued on the front page F-term (reference) 2C005 MA19 NA03 NB37 PA09 5B035 AA03 AA07 BA05 BB09 CA02 CA08 5F061 AA02 BA03 CA06 CA21 FA03

Claims (9)

[Claims] A conductor serving as an external connection terminal is provided;
And a wiring board having a first through-hole, and an integrated circuit element, an input / output electrode formed on the integrated circuit element, and the conductor provided on the main surface of the wiring board opposite to the conductor.
Connecting means for electrically connecting through the through holes, a resin frame provided to surround the connecting means, and a sealing resin which covers the integrated circuit element and the connecting means inside the resin frame. An integrated circuit device comprising: 2. The integrated circuit device according to claim 1, wherein said resin frame provided on said wiring board is formed of a thermoplastic resin. 3. The integrated circuit device according to claim 1, wherein said wiring board has a second through hole for holding said resin frame. 4. The integrated circuit device according to claim 1, wherein said sealing resin is formed using a molding die. 5. An IC card in which the integrated circuit device according to claim 1 is bonded and fixed to a hole provided in the card. 6. A conductor serving as an external connection terminal is provided,
Forming a resin frame using a molding die on a main surface of the wiring board having the first through hole opposite to the conductor; and mounting an integrated circuit element inside the resin frame. A step of electrically connecting an input / output electrode of the integrated circuit element and the conductor through the first through-hole; and forming the integrated circuit element and the through-hole with a sealing resin inside the resin frame. And a step of covering the electrical connection portion. 7. A conductor serving as an external connection terminal is provided,
Forming a resin frame on the main surface of the wiring board having the first through hole on the side opposite to the conductor; mounting an integrated circuit element inside the resin frame; Electrically connecting the input / output electrode of the element and the conductor through the first through-hole, and using a molding die to seal the integrated circuit element and the through-hole inside the resin frame with a sealing resin. And a step of covering the electrical connection portion. 8. The method for manufacturing an integrated circuit device according to claim 7, wherein said sealing resin is formed using a resin molding die. 9. The resin frame according to claim 6, further comprising a step for enclosing a sealing resin for covering the integrated circuit element and the connection means.
A manufacturing method of the integrated circuit device described in the above.