JP2002299795A - Method of manufacturing thermally conductive board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a thermally conductive board, on which a conductor for circuit formation can be positioned surely. SOLUTION: A polygonal hole 14 is formed in the conductor 12 for circuit formation, a protrusion 13 which is installed at a lower pressurization body 6 in a mold corresponding to the hole 14 is fitted, and a prescribed alignment operation is carried out.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a heat conductive substrate (high heat dissipation substrate) used for high power circuits in electronic equipment.

[0002]

2. Description of the Related Art A conventional method for manufacturing a heat conductive substrate is to polymerize a sheet-shaped thermosetting resin composition in which a thermosetting resin is filled with a thermoconductive filler, and a conductor for forming a circuit, and then heat the resin.
It is integrated by applying pressure.

[0003]

In the above-mentioned conventional method for manufacturing a heat conductive substrate, the thermosetting resin composition softens and flows when heated and pressurized. There is a problem that the conductor moves.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for manufacturing a heat conductive substrate which can position a circuit forming conductor reliably.

[0005]

To achieve this object, a method of manufacturing a heat conductive substrate according to the present invention comprises forming a polygonal hole or projection in the circuit forming conductor, and forming the hole or projection in the hole or projection. Polygonal projections or holes are provided on the contact surfaces of the corresponding molds for positioning, so that the heat conductive substrate can be reliably positioned.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a heat conductive substrate according to an embodiment of the present invention will be described below with reference to the drawings.

In FIG. 5, reference numeral 21 denotes a sheet-shaped thermosetting resin composition which comprises, for example, 70 to 95 parts by weight of an inorganic filler and 5 to 30 parts by weight of at least a thermosetting resin, a curing agent and a curing accelerator. Flexible in a semi-cured or partially cured state, at least 0.8 to 2 m thick
m, preferably 0.8 to 1.6 mm, by a doctor blade method, a coater method, an extrusion molding method or a rolling method.

Reference numeral 22 denotes a circuit forming conductor (lead frame) processed into a predetermined pattern or shape by pressing, etching, laser processing, or the like, and is made of aluminum, copper, silver, iron, or an alloy thereof. At least the side surface of the thermosetting resin composition 21 of the conductive and heat conductive metal plate is roughened to improve the adhesion. Then print solder resist on this top side,
Thereafter, this is cured by heat or ultraviolet rays to form a predetermined pattern for an electronic component to be mounted in a later step.

Reference numeral 23 denotes a heat-dissipating metal plate formed by processing a metal material having excellent thermal conductivity, such as iron, copper, aluminum, anodized aluminum, or an alloy thereof, into a predetermined shape.

Reference numeral 20 denotes an external connection terminal formed by bending the circuit forming conductor 22 or the like.

Next, a method for manufacturing a heat conductive substrate according to the present invention will be described with reference to FIG. In FIG. 1, reference numeral 11 denotes a part of the thermosetting resin composition of FIG.

Reference numeral 12 denotes a part of the circuit forming conductor shown in FIG. 5 which is made of a metal plate material such as copper or an alloy thereof formed in a predetermined pattern by pressing, etching, laser processing, or the like. (A square shape in FIG. 3).

Reference numeral 13 denotes a polygonal projection (in this embodiment, a quadrangular prism) which fits into the hole 14 and is provided at a predetermined position on the upper surface of the lower pressurizing member 6 having a mold heating portion. ing. Reference numeral 5 denotes an upper pressurizing member having a mold heating section which is movable to face the lower pressurizing member 6.

First, as shown in FIG. 1B, a projection 13 of the lower pressure body 6 is inserted into a hole 14 formed in the circuit forming conductor 12.
Is fitted and inserted, and the circuit forming conductor 12 is positioned and placed on the upper surface of the lower pressure body 6.

Subsequently, as shown in FIG. 1A, after the thermosetting resin composition 11 is laminated on the circuit-forming conductor 12, the upper pressing body 5 is lowered, heated and pressed to complete the curing. Let
The thermosetting resin composition 11 and the circuit forming conductor 12 are integrated.

Next, another embodiment of the method for manufacturing a thermally conductive substrate of the present invention will be described with reference to FIG.
In FIG. 2, reference numeral 32 denotes a part of the circuit forming conductor shown in FIG. 5 which is a metal plate material such as copper or an alloy thereof having a predetermined pattern processed by pressing, etching or laser processing.

Reference numeral 33 denotes three cylindrical projections provided at predetermined positions on the upper surface of the lower pressing body 6 having a heating portion of a mold. When it is mounted, it is positioned in contact with each predetermined location on the outer periphery of the circuit forming conductor 32.

First, as shown in FIG. 2 (b), the circuit forming conductor 32 is positioned by setting the projection 33 disposed on the upper surface of the lower pressing body 6 so as to abut a predetermined location on the outer periphery. .

Subsequently, as shown in FIG. 2A, after the thermosetting resin composition 11 is laminated on the circuit-forming conductor 32, the upper pressing body 5 is lowered, heated and pressed to complete the curing. Let
The thermosetting resin composition 11 and the circuit forming conductor 32 are integrated.

Next, another embodiment of the method for manufacturing a thermally conductive substrate of the present invention will be described with reference to FIG.
In FIG. 3, reference numeral 42 denotes a part of the circuit forming conductor shown in FIG. 5 which is formed of a metal plate material such as copper or an alloy thereof on which a predetermined pattern is formed by pressing, etching, laser processing, or the like. Is provided.

Reference numeral 43 denotes a cylindrical projection which is fitted and abutted on the notch 44, and is provided at a predetermined position on the upper surface of the lower pressurizing member 6 having a mold heating portion.

First, as shown in FIG. 3 (b), a projection 43 arranged on the upper surface of the lower pressing body 6 is fitted and abutted on a notch 44 provided in the circuit forming conductor 42 to form a circuit. The positioning conductor 42 is positioned and placed on the upper surface of the lower pressure body 6.

Subsequently, as shown in FIG. 3A, after the thermosetting resin composition 11 is laminated on the circuit-forming conductor 42, the upper pressing body 5 is lowered, heated and pressed to complete the curing. Let
The thermosetting resin composition 11 and the circuit forming conductor 42 are integrated.

Next, another embodiment of the method for manufacturing a heat conductive substrate of the present invention will be described with reference to FIG.
In FIG. 4, reference numeral 52 denotes a part of the circuit forming conductor shown in FIG. 5 which is a metal plate material such as copper or an alloy thereof on which a predetermined pattern is formed by pressing, etching, laser processing, or the like. (In this embodiment, a square shape)
Are provided.

Numeral 53 denotes a polygonal (square prism in this embodiment) convex portion (projection) which is inserted and fitted into the concave portion 54. It is provided at a predetermined position.

First, as shown in FIG. 4B, a convex portion 53 arranged on the lower pressing body 6 is inserted and fitted into a concave portion 54 provided in the circuit forming conductor 52, and the circuit forming conductor 52 is formed. Is positioned and placed on the upper surface of the lower pressure body 6.

Subsequently, as shown in FIG. 4A, after the thermosetting resin composition 11 is laminated on the circuit-forming conductor 52, the upper pressing body 5 is lowered, heated and pressed to complete the curing. Let
The thermosetting resin composition 11 and the circuit forming conductor 52 are integrated.

As described above, the circuit forming conductors 12, 32, 42,
When 52 is small, the method shown in FIG. 1 or FIG.
When the circuit forming conductors 12, 32, 42, and 52 are relatively large, the method shown in FIG. 2 or 3 is suitable, and an optimum method may be selected and used.

In the above-described embodiment, the heating and pressurizing are performed until the thermosetting resin composition 11 is completely cured by the mold. The object 11 is semi-cured (primary cured) to integrate the circuit-forming conductors 12, 32, 42, 52 and the sheet-shaped thermosetting resin composition 11, and then at a predetermined temperature (for example, 240 ° C.) using a constant temperature oven. If a method of heating the sheet-shaped thermosetting resin composition 11 to complete the curing for a predetermined time is used, the equipment can be dedicated, and more reliable curing can be achieved.

In the above embodiment, the holes 14 and the recesses 54 are formed in the circuit forming conductors 12, 32, 42, 52, respectively.
The projections 13, 33, 43 and the projections 53 are provided on the upper surface of the lower pressure body 6, but the projections and the projections are formed on the circuit forming conductor, and the holes and the depressions are formed on the upper surface of the lower pressure body 6 at predetermined positions. It is good also as a structure provided in a position.

The circuit forming conductors 12, 32, 4
Applying solder plating after nickel base plating to 2, 52 improves environmental friendliness in storage, transportation, or a post-process, and further ensures electrical connection in mounting to equipment.

[0032]

As described above, according to the method of manufacturing a heat conductive substrate according to the present invention, there is an effect that the positioning of the circuit forming conductor can be reliably performed.

[Brief description of the drawings]

FIGS. 1A and 1B are a schematic side view and a plan view illustrating a method for manufacturing a heat conductive substrate according to an embodiment of the present invention.

FIGS. 2A and 2B are schematic side views and plan views illustrating a method for manufacturing a thermally conductive substrate according to another embodiment.

FIGS. 3A and 3B are schematic side views and plan views illustrating a method for manufacturing a thermally conductive substrate according to another embodiment.

FIGS. 4A and 4B are schematic side views and plan views illustrating a method for manufacturing a thermally conductive substrate according to another embodiment.

FIG. 5 is a sectional view of the configuration of a heat conductive substrate.

[Explanation of symbols]

 5 Upper Pressing Body 6 Lower Pressing Body 11,21 Thermosetting Resin Composition 12,22,32,42,52 Circuit Forming Conductor 13,33,43 Projection 14 Hole 23 Heat Dissipation Metal Plate 20 Terminal 53 Convex 54 Recess

Continuing on the front page (72) Inventor Makoto Tsuruta 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. Reference) 5E343 AA02 AA13 AA16 BB15 BB17 BB24 BB33 BB34 BB44 BB52 BB66 DD43 DD54 DD62 DD75 ER35 ER55 GG20

Claims (8)

[Claims] 1. After laminating a sheet-shaped thermosetting resin composition having flexibility in a semi-cured or partially-cured state and a circuit-forming conductor, heating and pressing in a mold,
In the method of integrating a circuit-forming conductor and a sheet-shaped thermosetting resin composition, a polygonal hole or projection is formed in the circuit-forming conductor, and a die corresponding to the hole or projection is brought into contact with the mold. A method for manufacturing a heat conductive substrate in which a surface is provided with polygonal projections or holes for alignment. 2. The method for producing a thermally conductive substrate according to claim 1, wherein an integrated product of the circuit-forming conductor and the sheet-shaped thermosetting resin composition is taken out of a mold and heated in a thermostatic oven. 3. The method for producing a thermally conductive substrate according to claim 1, wherein a circuit-forming conductor processed and formed by press working, etching working or laser working is used. 4. The method for producing a thermally conductive substrate according to claim 1, wherein a circuit-forming conductor formed by applying a nickel base plating and a solder plating is used. 5. The method according to claim 1, wherein a circuit-forming conductor made of copper or an alloy thereof is used. 6. After laminating a sheet-shaped thermosetting resin composition having flexibility in a semi-cured or partially-cured state and a circuit-forming conductor, heating and pressing in a mold,
In the method of integrating a circuit-forming conductor and a sheet-shaped thermosetting resin composition, a projection is formed on a contact surface of a mold at at least three places on an outer periphery of the one circuit-forming conductor, and the projection is formed. A method for manufacturing a heat conductive substrate for positioning a circuit forming conductor in a mold by using the method. 7. After laminating a sheet-shaped thermosetting resin composition having flexibility in a semi-cured or partially-cured state and a circuit-forming conductor, heating and pressurizing in a mold,
In a method of integrating a circuit-forming conductor and a sheet-shaped thermosetting resin composition, a projection is formed in a mold so as to fit into at least two notches provided on the outer periphery of the one circuit-forming conductor. And a method of manufacturing a heat conductive substrate in which a circuit-forming conductor is positioned in a mold by the protrusion. 8. After laminating a sheet-shaped thermosetting resin composition having flexibility in a semi-cured or partially-cured state, and a circuit-forming conductor, heating and pressing in a mold,
In the method of integrating a circuit-forming conductor and a sheet-shaped thermosetting resin composition, a polygonal concave portion or a protrusion is formed in the circuit-forming conductor, and a convex portion provided in a mold corresponding to the concave portion or the protrusion. Alternatively, a method of manufacturing a heat conductive substrate in which holes are fitted to perform predetermined alignment.