JP2002299773A5 - - Google Patents

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Publication number
JP2002299773A5
JP2002299773A5 JP2001094074A JP2001094074A JP2002299773A5 JP 2002299773 A5 JP2002299773 A5 JP 2002299773A5 JP 2001094074 A JP2001094074 A JP 2001094074A JP 2001094074 A JP2001094074 A JP 2001094074A JP 2002299773 A5 JP2002299773 A5 JP 2002299773A5
Authority
JP
Japan
Prior art keywords
wiring board
flexible wiring
conductor pattern
reinforcing
connection terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001094074A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002299773A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001094074A priority Critical patent/JP2002299773A/ja
Priority claimed from JP2001094074A external-priority patent/JP2002299773A/ja
Publication of JP2002299773A publication Critical patent/JP2002299773A/ja
Publication of JP2002299773A5 publication Critical patent/JP2002299773A5/ja
Pending legal-status Critical Current

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JP2001094074A 2001-03-28 2001-03-28 フレキシブル配線基板及び電気光学装置 Pending JP2002299773A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001094074A JP2002299773A (ja) 2001-03-28 2001-03-28 フレキシブル配線基板及び電気光学装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001094074A JP2002299773A (ja) 2001-03-28 2001-03-28 フレキシブル配線基板及び電気光学装置

Publications (2)

Publication Number Publication Date
JP2002299773A JP2002299773A (ja) 2002-10-11
JP2002299773A5 true JP2002299773A5 (ko) 2004-11-18

Family

ID=18948324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001094074A Pending JP2002299773A (ja) 2001-03-28 2001-03-28 フレキシブル配線基板及び電気光学装置

Country Status (1)

Country Link
JP (1) JP2002299773A (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4543772B2 (ja) 2003-09-19 2010-09-15 セイコーエプソン株式会社 電気光学装置および電子機器
JP3976019B2 (ja) 2004-02-10 2007-09-12 セイコーエプソン株式会社 実装構造体、電気光学装置、および電子機器
KR20060002209A (ko) 2004-07-01 2006-01-09 삼성전자주식회사 유연성 기재 필름 본딩 방법 및 그 방법으로 본딩된 표시장치
JP3915928B2 (ja) * 2004-11-24 2007-05-16 セイコーエプソン株式会社 電子部品及びその製造方法
JP2016006829A (ja) * 2014-06-20 2016-01-14 株式会社村田製作所 樹脂多層基板
WO2019021467A1 (ja) * 2017-07-28 2019-01-31 シャープ株式会社 表示デバイス、表示デバイスの製造方法、表示デバイスの製造装置
US10847600B2 (en) 2017-07-28 2020-11-24 Sharp Kabushiki Kaisha Display device and manufacturing method for display device
WO2019030891A1 (ja) * 2017-08-10 2019-02-14 シャープ株式会社 可撓性表示装置及び可撓性表示装置の製造方法
JP6865722B2 (ja) * 2018-07-10 2021-04-28 矢崎総業株式会社 回路体とバスバと電子素子との接続構造
CN113169148A (zh) * 2018-12-19 2021-07-23 深圳市柔宇科技股份有限公司 一种柔性模组的制作方法及柔性模组

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02137061U (ko) * 1989-04-14 1990-11-15
JPH0334266U (ko) * 1989-08-11 1991-04-04
JPH07321426A (ja) * 1994-05-24 1995-12-08 Casio Comput Co Ltd フィルム配線基板およびそれを用いた電子機器

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