JP2002299773A5 - - Google Patents
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- Publication number
- JP2002299773A5 JP2002299773A5 JP2001094074A JP2001094074A JP2002299773A5 JP 2002299773 A5 JP2002299773 A5 JP 2002299773A5 JP 2001094074 A JP2001094074 A JP 2001094074A JP 2001094074 A JP2001094074 A JP 2001094074A JP 2002299773 A5 JP2002299773 A5 JP 2002299773A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- flexible wiring
- conductor pattern
- reinforcing
- connection terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 15
- 230000003014 reinforcing Effects 0.000 claims 14
- 239000000758 substrate Substances 0.000 claims 7
- 239000000463 material Substances 0.000 claims 5
- 230000000875 corresponding Effects 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001094074A JP2002299773A (ja) | 2001-03-28 | 2001-03-28 | フレキシブル配線基板及び電気光学装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001094074A JP2002299773A (ja) | 2001-03-28 | 2001-03-28 | フレキシブル配線基板及び電気光学装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2002299773A JP2002299773A (ja) | 2002-10-11 |
JP2002299773A5 true JP2002299773A5 (ko) | 2004-11-18 |
Family
ID=18948324
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001094074A Pending JP2002299773A (ja) | 2001-03-28 | 2001-03-28 | フレキシブル配線基板及び電気光学装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2002299773A (ko) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4543772B2 (ja) | 2003-09-19 | 2010-09-15 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
JP3976019B2 (ja) | 2004-02-10 | 2007-09-12 | セイコーエプソン株式会社 | 実装構造体、電気光学装置、および電子機器 |
KR20060002209A (ko) | 2004-07-01 | 2006-01-09 | 삼성전자주식회사 | 유연성 기재 필름 본딩 방법 및 그 방법으로 본딩된 표시장치 |
JP3915928B2 (ja) * | 2004-11-24 | 2007-05-16 | セイコーエプソン株式会社 | 電子部品及びその製造方法 |
JP2016006829A (ja) * | 2014-06-20 | 2016-01-14 | 株式会社村田製作所 | 樹脂多層基板 |
WO2019021467A1 (ja) * | 2017-07-28 | 2019-01-31 | シャープ株式会社 | 表示デバイス、表示デバイスの製造方法、表示デバイスの製造装置 |
US10847600B2 (en) | 2017-07-28 | 2020-11-24 | Sharp Kabushiki Kaisha | Display device and manufacturing method for display device |
WO2019030891A1 (ja) * | 2017-08-10 | 2019-02-14 | シャープ株式会社 | 可撓性表示装置及び可撓性表示装置の製造方法 |
JP6865722B2 (ja) * | 2018-07-10 | 2021-04-28 | 矢崎総業株式会社 | 回路体とバスバと電子素子との接続構造 |
CN113169148A (zh) * | 2018-12-19 | 2021-07-23 | 深圳市柔宇科技股份有限公司 | 一种柔性模组的制作方法及柔性模组 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02137061U (ko) * | 1989-04-14 | 1990-11-15 | ||
JPH0334266U (ko) * | 1989-08-11 | 1991-04-04 | ||
JPH07321426A (ja) * | 1994-05-24 | 1995-12-08 | Casio Comput Co Ltd | フィルム配線基板およびそれを用いた電子機器 |
-
2001
- 2001-03-28 JP JP2001094074A patent/JP2002299773A/ja active Pending
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