JP2002286793A - Semiconductor device test instrument - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a test instrument capable of reducing electrical connection defects without lowering heat releasability, reducing time and labor for instrument cleaning, and thereby improving efficiency of inspection in a final test process. SOLUTION: In this semiconductor device test instrument 10, plural projecting parts or plural recessed parts 14 are formed on the abutting surface with an earthing electrode 13 installed on the package bottom surface of a semiconductor device 12, to thereby reduce the abutting area of the abutting surface of a pedestal 131, and hereby a probability of adhesion of refuse such as burr is reduced, and also the refuse adhering to the semiconductor device 12 can be dropped between the plural projecting parts or into the plural recessed parts. The pedestal 131 is constituted from a base pedestal 132 and an earthing connection block 133 having the abutting surface and detachable from the base pedestal 132. Therefore, if the abutting surface of the earthing connection block 133 is deteriorated, the block can be replaced easily, and cleaning can be executed by dismounting the earthing connection block 133.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device test jig provided with a ground electrode on the bottom surface of a plastic package.

[0002]

2. Description of the Related Art In a final test of a semiconductor device (hereinafter referred to as a device) before shipment after packaging an IC chip, one of the causes for erroneously determining a non-defective device as a defective product is contact. There is a defect. The most common cause of contact failure is
Burrs and other dust are mixed into the test jig.

[0003] Mixing of dust into the test jig occurs as follows. That is, dusts such as burrs adhere to the device at the time of the molding process of packaging, which is a process before the final test. Then, in the final test, when the device is set on the test jig, the dust falls on the electrode for electrical connection of the test jig.

A test jig is generally held down by using a spring or the like connected to a pressing member of a device in order to ensure electrical connection during test measurement. Therefore, when the device is set on the test jig, dust is caught between the terminal of the device and the electrode of the test jig, and is pressed against the electrode for electrical connection. Dust such as burrs cannot be easily removed once they are pressed against the electrical connection electrode. In addition, since dust such as burrs is an electrically insulating material, the electrical connection is extremely unstable or in the worst open state even when another device is measured thereafter. For this reason, although the device itself is a non-defective product, it is determined to be a defective product, and the defective rate in the first inspection of the final test becomes very poor. turn into. However, if a device such as a burr is removed from the test jig and a defective device is further subjected to one to several final tests, the defect rate eventually becomes 1% or less. .

[0005] In order to solve the above problems, various techniques have been conventionally proposed. For example, Japanese Utility Model Application No. 4-68385
Japanese Patent Application Laid-Open Publication No. H11-157, discloses a technique using a needle-shaped connection terminal as a structure for preventing dust such as burrs from adhering to a test jig of a device.

In the test socket of a semiconductor device disclosed in Japanese Patent Application Laid-Open No. 2000-304806, when the lead terminal of the device and the connection terminal of the test jig come into contact with each other, they are slid on the connection terminal so that dust can be removed. A moving mechanism is disclosed.

Further, in the method of forming pins and grooves of a test socket disclosed in Japanese Patent Application Laid-Open No. 2000-228262, a terminal for connecting to a lead terminal of a device is provided with a lateral groove and a step, and a tip is provided with elasticity. A structure is disclosed in which the probability of dust being attached is reduced, and even if dust is attached, contact is made in the next stage.

[0008]

High-frequency semiconductor devices (hereinafter referred to as high-frequency devices) include Si and GaAs.
There are power amplifiers, mixers, low-noise amplifiers, and the like that operate in the giga-band (GHz) using a high-frequency transistor that uses GaN as a material. Among these high-frequency devices,
Particularly, in some high-frequency power amplifier ICs, a large-area ground electrode (hereinafter, referred to as a slag) is formed on the bottom surface of the package in addition to the ground terminal. This slag is used for grounding and also serves for heat dissipation.

In the final test of a high-frequency device, a semiconductor device test jig (hereinafter, referred to as a test jig) 110 shown in FIG. 17 is conventionally used. FIG.
FIG. 1 is a top view and a front cross-sectional view of a state where a high-frequency device to be inspected is mounted on a conventional test jig. FIG.
FIG. 3 is a front sectional view showing a state where dust is sandwiched when a high-frequency device is mounted on a conventional test jig.

The test jig 110 includes a ground pedestal 111 which comes into contact with a slag of the high-frequency device, a connection portion 114 with a lead terminal of the high-frequency device, a pressing member 115 for pressing the high-frequency device, and a pressing spring 116. In addition, the connecting portion 114 is connected to the insulating printed board 114.
This is a configuration in which a plurality of connection terminals 114a are formed in the upper part of FIG. The ground pedestal 111 has a plane in contact with the slag of the high-frequency device. Further, between the ground pedestal 111 and the connection portion 114, the concave portions 117a, 11
7b is provided.

The ground pedestal 111 and the plurality of connection terminals 114a are connected to an evaluation device (not shown).
The pressing member 115 and the spring 116 are not shown in the top view.

The high-frequency device 12 has a slug 13 which is a large-area ground electrode (ground electrode) on the bottom surface (lower portion) of the package, and a plurality of lead terminals 12a protruding from left and right side surfaces.

When the final test of the high-frequency device 12 is performed by the test jig 110, the high-frequency device 12 is placed so that the slug 13 of the high-frequency device 12 abuts on the ground pedestal 111 as shown in FIG. . Further, the lead terminal 12a of the high-frequency device 12 is
The test jig 110 is connected to the connection terminal 114a. Then, the package portion 12b of the high-frequency device 12 is pressed by the pressing member 115 and fixed to the test jig 110.

Since the slug 13 of the high-frequency device 12 has a larger contact area than the other lead terminals 12a, there is a very high possibility that dust such as burrs will adhere to the ground pedestal 111 where the slug 13 contacts. Therefore, the probability of an increase in the defect rate at this location is very high. In particular, the slug of the high-frequency power amplifier IC is electrically used as a terminal for taking a reference potential of a direct current and a high-frequency signal, and a heat sink for releasing heat generated in the high-frequency device to the outside as described above. Use as Therefore, in the high-frequency device 12 shown in FIG.
Need to be in close contact.

However, as shown in FIG. 18, between the ground pedestal 111 of the test jig 110 and the slag 13,
When the slug 13 of the high-frequency device 12 is inclined and comes into contact with the ground pedestal 111 due to the interposition of dust 125 such as burrs, the contact area is reduced, and the characteristics of the device are deteriorated both electrically and thermally. In the worst case, it is completely open, making it impossible to bring out the essential characteristics of the high-frequency device. As described above, even in the high-frequency device, there is a problem in that good results are not obtained in the final test due to dust such as burrs and the defective rate is increased.

Further, during the final test, the high frequency device 12 is strongly pressed from above by the pressing member 115, so that the trapped dust is removed from the test jig 110.
Is pressed against the ground pedestal 111. Therefore, 1
If dust adheres, there is almost no possibility that it can be removed from the jig during measurement.

Generally, when dust such as burrs adheres to the test jig, it is necessary to clean the test jig. Cleaning is performed after a specific lot measurement is completed, for example, using a cotton swab soaked with an organic solvent or using tweezers. The attached dust is removed by using, for example, the above method. After that, the measurement of the high-frequency device determined to be defective in the lot is performed again. This operation is 1
By repeating the process one to several times, a good product that has been determined as a defective product is picked up. As described above, one high-frequency device is measured a plurality of times, which causes a problem that the processing capability is reduced and the cost is increased.

To solve these problems, the prior art disclosed in the above publication cannot be used unfortunately in a test jig for a high-frequency device. In other words, the actual open 4-6838
The IC mounting socket disclosed in Japanese Patent Application Laid-Open No. 5-205 is for a lead terminal of a device and has a small contact area, resulting in a high connection resistance. In addition, a needle-like shape has a large parasitic inductance component. In particular, since the parasitic inductance generated between the ground and the ground adversely affects the high-frequency device, not only the high-frequency characteristics are deteriorated, but also the amplifier oscillates. In addition, there arises a problem that heat radiation, which is a problem particularly in high-frequency devices, deteriorates.

Also, Japanese Patent Application Laid-Open No. 2000-304806 discloses a socket for testing a semiconductor device.
The method for forming pins and grooves of a test socket disclosed in Japanese Patent Publication No. 262 can be used for connection with a slug of a high-frequency device, and cannot realize an electrical connection with a stable low parasitic inductance component and good heat dissipation. Further, the mechanism of the test jig is complicated, so that the reliability is poor and the cost is increased. Especially in high frequency power amplifiers,
It is difficult to adopt because the stability of the ground contact affects the characteristics very sensitively.

Therefore, the present invention has been made to solve the above-mentioned problem, and an object of the present invention is to improve the shape of the ground pedestal of the test jig so that poor electrical connection can be achieved without deteriorating heat radiation. It is intended to provide a test jig which improves inspection efficiency in a final test process by reducing the time required for jig cleaning and the like.

[0021]

The present invention has the following arrangement as means for solving the above-mentioned problems.

(1) In a semiconductor test jig having at least a pedestal having a contact surface with a ground electrode provided on a bottom surface of a package of a semiconductor device, a plurality of convex portions or a plurality of concave portions are formed on the corresponding contact surface. It is characterized by having been provided.

In this configuration, the semiconductor device test jig is a contact surface with a grounding electrode provided on the bottom surface of the package of the semiconductor device, the contact surface having a plurality of convex portions or a plurality of concave portions. At least. Therefore, by reducing the contact area of the contact surface of the pedestal, it is possible to reduce the probability that dust such as burrs will adhere. Further, dust attached to the semiconductor device can be dropped between the plurality of convex portions or into the plurality of concave portions.

(2) The pedestal is characterized by comprising a base pedestal, and a ground connection block provided with the contact surface and detachable from the base pedestal.

In this configuration, the pedestal of the semiconductor device test jig is constituted by the base pedestal and the ground connection block having the contact surface and detachable from the base pedestal. Therefore, even if the contact surface of the ground connection block deteriorates due to wear or damage, only the ground connection block needs to be replaced, and the entire semiconductor device test jig does not need to be created again. The cost of the jig can be reduced. In addition, since the ground connection block can be removed for cleaning, even if cleaning is performed by air blow or the like, dust can be easily cleaned without dust adhering to other parts of the test jig. Efficiency can be improved.

(3) One or more through holes or holes of a predetermined depth are provided between the plurality of projections or at the bottom of the plurality of recesses.

[0027] In this configuration, the semiconductor device test jig is provided between the plurality of convex portions or at the bottom of the plurality of concave portions.
One or more through holes or holes of a predetermined depth are provided. Therefore, by providing a plurality of holes or through holes between the concave portions or the convex portions of the pedestal, dust that has fallen between the convex portions or on the bottom surface of the concave portion can be further dropped into the plurality of holes or the through holes. In addition, it is possible to suppress the accumulation of dust between the convex portions or the concave portions.

(4) The ground connection block is formed by stamping a metal sheet having a predetermined thickness.

In this configuration, a ground connection block is formed by punching a metal sheet having a predetermined thickness. Therefore, the ground connection block can be easily formed, and the manufacturing cost of the semiconductor device test jig can be reduced.

(5) The base pedestal is provided with one or more second through holes that communicate with the through holes of the ground connection block when the ground connection block is mounted. .

In this configuration, the base pedestal has one or more second through holes, and when the ground connection block is attached to the base pedestal, the one or more second through holes are This is a configuration that leads to the through hole of the ground connection block. Therefore, dust that has fallen between the protrusions or on the bottom surface of the recess falls through the through-hole and the second through-hole, and is easily collected by installing a container below the second through-hole. It is possible to do. Further, the number of times of cleaning the pedestal can be reduced.

(6) The cross-section of the projection has a length a on the contact surface side with the grounding electrode and a length b on the bottom side.
It is characterized by a trapezoid having a lower base (≧ a).

In this configuration, the cross section of the projection on the contact surface of the pedestal has an upper bottom of length a on the contact surface side with the grounding electrode and a length b (≧ a) on the bottom side. It is a trapezoid with a bottom. Therefore, the contact area of the contact portion of the pedestal is reduced,
This makes it possible to reduce the probability of attachment of dust such as burrs, to reduce parasitic inductance, and to improve heat dissipation.

(7) The cross section of the recess has a top surface with a length c on the contact surface side with the grounding electrode, and a length d on the bottom side.
It is characterized by a trapezoidal shape with a lower base (≦ c).

In this configuration, the cross-sectional shape of the recess in the contact surface of the pedestal is such that the contact surface side with the ground electrode has an upper bottom of length c and a bottom portion has lower length d (≦ c). It has a trapezoidal shape with a bottom. Therefore, the contact area of the contact portion of the pedestal can be reduced, the probability that dust such as burrs adhere can be reduced, and the parasitic inductance can be reduced.
In addition, heat dissipation can be improved.

(8) The projection is characterized in that it has a hemispherical or semi-cylindrical shape.

In this configuration, the convex portion on the contact surface of the pedestal has a hemispherical or semi-cylindrical shape.
Therefore, since the convex portion of the pedestal has a shape having a curved surface, even if a test is performed by pressing a plurality of high-frequency devices with a pressing member for a long period of time in a test jig, even if the test is performed with a ground electrode of a semiconductor device. The contact surface is hardly worn out and has a plurality of protrusions, so that a contact area can be secured, and the flash resistance can be maintained while maintaining low parasitic inductance and heat dissipation in the semiconductor device. It is possible to realize a structure in which dust such as dust does not easily adhere to the semiconductor device test jig.

(9) The concave portion is provided so that a convex portion having a shape in which a plurality of semi-cylindrical columns are orthogonal to each other is formed.

In this configuration, in the semiconductor device test jig, a concave portion is provided on the abutment surface of the pedestal so that a convex portion having a shape in which a plurality of semi-circular cylinders are orthogonal to each other is formed. Therefore, since the projection of the pedestal has a shape having a curved surface, a contact area can be ensured, and dust such as burrs can enter the semiconductor device test jig while maintaining low parasitic inductance and heat dissipation in the semiconductor device. A structure that does not easily adhere can be realized.

[0040]

FIG. 1 is a front sectional view illustrating a ground electrode structure of a semiconductor device test jig according to an embodiment of the present invention. A semiconductor device test jig (hereinafter, referred to as a test jig) 10 of the present invention is obtained by improving the structure of a ground pedestal 111 in a conventional test jig 110.

The test jig 10 includes a ground pedestal 11 for contacting a slag of a high-frequency device, a connection portion 15 for connecting to a lead terminal of the high-frequency device, a pressing member 16 for pressing the high-frequency device, and a pressing spring 17. Also,
The connection section 15 has a configuration in which a plurality of connection terminals 15a are formed on an upper portion of an insulating printed board 15b. In addition, between the ground pedestal 11 and the connection portion 15, a recess 17a,
17b is provided.

The ground pedestal 11 is a high-frequency device 12
Has a plane in contact with the slag 13 and has a shape in which a plurality of convex portions 14 are formed on the contact surface. The plurality of protrusions 14 are flat at the top, have the same height, and are arranged at predetermined intervals. The ground pedestal 11 and the plurality of connection terminals 15a are connected to an evaluation device (not shown), similarly to the conventional test jig 110. The ground pedestal 21 is made of a conductive material such as brass or aluminum, for example.

When the final test of the high-frequency device 12 is performed by the test jig 10, as shown in FIG. 1, the slug 13 of the high-frequency device 12 abuts on the upper surface of the plurality of projections 14 of the ground pedestal 11. The high frequency device 12 is placed. The lead terminal 12a of the high-frequency device 11 is connected to the connection terminal 15a of the test jig 10.
Connect to Then, the upper surface of the high-frequency device 12 is pressed by a pressing member (not shown) and fixed to the semiconductor device test jig 110.

[First Embodiment] Next, the specific shape of the ground pedestal of the test jig 10 according to the first embodiment of the present invention will be described. FIG. 2 is a perspective view of a ground pedestal having a plurality of prism-shaped protrusions. FIG. 3 is an enlarged front view of the slug of the high-frequency device and the contact portion of the test jig on the ground pedestal.

As shown in FIG. 1, in the first embodiment, the vertical cross section of the convex portion of the ground pedestal of the test jig 10 is trapezoidal. Further, as a specific example, a plurality of protrusions 22 are formed in the ground pedestal 21 shown in FIG. 2 by providing a plurality of grooves 23 on a contact surface of the high-frequency device 12 with the slag 13. Have been.

The protruding portion 22 is a prism having a trapezoidal vertical cross section with the contact surface side being the upper base of the length a and the bottom side being the lower base of the length b (≧ a). In addition, the plurality of convex portions 22
Are arranged in parallel at predetermined intervals.

By setting the shape of the projection 22 as described above, the following effects can be obtained. That is, the cross section is trapezoidal, and the length of the contact surface with the slag (the length a of the upper base) can be shortened to reduce the contact area of the contact surface of the ground pedestal. The probability that dust adheres can be reduced. Further, in order to reduce the parasitic inductance as much as possible and to improve the heat radiation, the convex portion 22 is desirably in the above shape.

As shown in FIG. 3, the groove 23 is provided for dropping off dust 24 such as burrs adhered to the high-frequency device during the final test.

Debris 24 such as burrs adhered to and brought into the high-frequency device 12 from a process before the final test.
When the high frequency device 10 is mounted on the test jig 10,
Many fall into a groove (recess) 23 between a convex portion 22 provided on the ground pedestal 21 of the test jig 10 and another convex portion 22. Therefore, it is very unlikely that the dust 24 is caught between the contact surface of the ground pedestal 21 of the test jig 10 and the slag 13 of the high-frequency device 12, and the problem of an increase in the defective rate due to poor contact during the test. Can be solved.

Conventionally, the defect rate at the time of the first inspection of the lot was as high as 5 to 10%. However, by applying the present invention to the final test, it is possible to reduce the defect rate at the conventional final defect rate by one inspection. It fell below a certain 1%.

Further, since the dust that has fallen into the groove 23 is not pressed at the time of inspection, it can be easily removed and cleaned by air blow or the like, and a smooth transition can be made to test measurement of devices in a new lot.

Further, since the ground pedestal has such a shape, the contact area between the slag surface of the high-frequency device and the contact surface of the jig ground pedestal can be appropriately secured, so that an electrically stable connection can be obtained. In addition, as described above, it is possible to maintain the advantage that the heat transmitted from the high-frequency device to the jig via the slag can be efficiently radiated.

Next, another embodiment in which the shape of the convex portion is modified will be described with reference to FIG. FIG. 4 is a perspective view of a ground pedestal having a plurality of projecting protrusions. The ground pedestal 31 shown in FIG. 4 has a shape in which a plurality of protruding projections 32 are formed by providing a lattice-shaped groove 33 on a contact surface with a slag of a high-frequency device.

The protruding portion 32 has a truncated truncated shape whose bottom is a square having a side length b and a top surface (contact surface) is a square having a side length a (≦ b). Square pyramid (frustum of pyramid)
It is. Therefore, the cross-sectional shape of the convex portion 32 is a trapezoid in which the contact surface side is the upper base of the length a and the bottom side is the lower base of the length b (≧ a). The plurality of convex portions 32 are provided at equal intervals with the lattice-shaped grooves 33 as described above.

Next, another embodiment in which the shape of the convex portion is modified will be described with reference to FIG. FIG. 5 is a perspective view of a ground pedestal having a lattice-shaped protrusion. The ground pedestal 41 shown in FIG. 5 is provided with a plurality of truncated quadrangular pyramid-shaped recesses 43 on the contact surface with the slag of the high-frequency device,
The protrusions 42 are formed in a lattice shape.

The concave portion 43 has a truncated square shape whose bottom is a square having a side length d and a top surface (contact surface) is a square having a side length c (≧ d). Pyramid (frustum of pyramid)
It is. Therefore, the cross-sectional shape of the concave portion 43 is a trapezoid in which the contact surface side is the upper base of the length c and the bottom side is the lower base of the length d (≦ c). The plurality of concave portions 43 are provided at equal intervals with the lattice-shaped convex portions 42 as described above.

The shape of the abutment surface on the ground pedestal of the test jig 10 is not limited to the shapes of the convex portions and the concave portions shown in FIGS. 2, 4 and 5, and various modifications are conceivable. . For example, the shape of the contact surface side of the concave portion shown in FIG. 5 may be a triangle, a hexagon, a circle, or the like.

[Second Embodiment] Next, the shape of a ground pedestal of a test jig according to a second embodiment of the present invention will be described.
FIG. 6 is a front sectional view showing a ground pedestal shape of the test jig according to the second embodiment of the present invention. FIG. 7 is a perspective view of a ground pedestal having a plurality of semi-cylindrical protrusions. FIG. 8 is a perspective view of a ground pedestal having a plurality of hemispherical projections. FIG. 9 is a front enlarged view of a slug of the high-frequency device and a contact portion of the test jig on the ground pedestal.

As shown in FIG. 6, in the second embodiment, the vertical cross section of the convex portion of the ground pedestal of the test jig 10 is a semicircle. This reduces the number of flat surfaces as compared with the first embodiment, thereby further reducing the occurrence of problems caused by the insertion of dust such as burrs between the slug 13 of the high-frequency device 10 and the ground pedestal. It becomes possible.

The ground pedestal 61 shown in FIG. 7, which is a specific embodiment of the projection shown in FIG. 6, is provided with a plurality of grooves 63 on the contact surface with the slag of the high-frequency device, so that the vertical direction is improved. Are formed in a semicircular shape, and a plurality of convex portions 62 are formed as semicircular columns having a horizontal cross section as a bottom surface. Since a portion other than the slug 13 at the bottom of the high-frequency device 12 abuts on both ends of the ground pedestal 61, a prism 65 having a trapezoidal cross section is provided to hold the high-frequency device 12.

Next, another embodiment in which the shape of the convex portion is modified will be described with reference to FIG. Ground pedestal 71 shown in FIG.
Is a shape in which a plurality of hemispherical protrusions 72 having a cross section as a bottom surface are formed by providing a lattice-like groove 73 on a contact surface with a slag of a high-frequency device. In addition, since a portion other than the slug 13 at the bottom of the high-frequency device 12 abuts on both ends of the abutment surface of the ground pedestal 71, the prism 75 has a trapezoidal vertical cross section.
Is provided to hold the high-frequency device 12.

The same effects as in the first embodiment can be obtained in the second embodiment. That is, as shown in FIG.
When the high frequency device 10 is mounted on the test jig 10, dust 64 such as burrs that have been brought into the high frequency device 12 from the process before the final test are removed.
0 falls into the groove 63 provided on the ground pedestal 21.
Therefore, the dust 2 between the contact surface of the ground pedestal 21 of the test jig 10 and the slag 13 of the high-frequency device 12
4 is extremely reduced, and the problem of an increase in the defective rate due to poor contact at the time of testing can be solved.

Further, since the dust that has fallen into the groove 63 is not pressed at the time of inspection, it can be easily removed and cleaned by air blow or the like, and the process can be smoothly shifted to the test measurement of devices in a new lot.

Further, since the test jig 10 is provided with the ground pedestal having such a shape, the high frequency device 12
Since the contact area between the slug 13 and the contact surface of the ground pedestal in the test jig 10 can be appropriately secured, an electrically stable connection can be obtained, and as described above,
The advantage that the heat transmitted from the high frequency device to the jig via the slag can be efficiently radiated can also be maintained.

In addition, in the second embodiment, since the convex portion of the ground pedestal has a curved surface, a plurality of high-frequency devices 12 are pressed by the pressing member (not shown) for a long time in the test jig 10. Even when the test is performed, the contact surface of the high-frequency device 12 with the slag 13 is hardly worn as compared with the needle-like shape of the related art. Further, since a plurality of projections are provided, a contact area can be secured. Therefore, the high-frequency device 12
Therefore, it is possible to realize a structure in which dusts such as burrs are not easily adhered while maintaining the most important low parasitic inductance and heat radiation.

The shape of the contact surface on the ground pedestal of the test jig 10 is not limited to the shape of the projection shown in FIGS. 7 and 8, and various modifications can be considered. For example, although not shown, a vertical cross-sectional shape of the lattice-shaped protrusion shown in FIG. 5 may be a semicircle, and a protrusion having a semi-cylindrical column arranged in a lattice may be considered.

The ground pedestal shown in the first and second embodiments can be formed by cutting or casting a metal block.

[Third Embodiment] Next, a ground pedestal structure of a test jig according to a third embodiment of the present invention will be described.
FIG. 10 is a front sectional view showing a ground pedestal structure of the test jig according to the third embodiment of the present invention. FIG.
It is the perspective view and top view of the ground pedestal in the semiconductor test jig of 3rd Embodiment.

As shown in FIGS. 10 and 11, a plurality of holes or through holes 96 having a predetermined depth are provided on the bottom surface of the concave portion of the ground pedestal or the bottom surface of the groove provided between the plurality of convex portions. . As a result, dust that has fallen into the concave portions (grooves) 94
Further, since the dust can be dropped into the through hole 96, accumulation of dust in the concave portion can be suppressed. Further, by providing the cavity 97 inside the ground pedestal and installing a container or the like for collecting dust in the cavity 97, it is possible to collect dust from the lower portion of the ground pedestal 93.

The vertical cross section shown in FIG. 11 is not limited to the trapezoidal ground pedestal, but the shape shown in the first and second embodiments and other shapes can be applied. is there.

FIG. 11 shows an embodiment in which a plurality of through holes 104 are provided on the bottom surface of the groove 103. However, the present invention is not limited to this. For example, substantially the entire bottom surface of the groove 103 is defined as an opening. May be provided.

[Fourth Embodiment] Next, the shape of a ground pedestal of a test jig according to a fourth embodiment of the present invention will be described. FIG. 12 is a front sectional view for explaining the structure of the test jig of the fourth embodiment. FIG. 13 is a perspective view showing the structure of the ground pedestal in the test jig of the fourth embodiment. FIG. 14 is a perspective view showing the structure of another ground pedestal in the test jig of the fourth embodiment.

As shown in FIG. 12, the ground pedestal 13
1 includes a base pedestal 132 and a block 133 serving as a ground connection block.

The base pedestal 132 has a flat upper part,
The block 133 is removably loaded. Block 133
The upper part is a contact surface with the slag 13 of the high-frequency device 12, and has a plurality of convex portions 14 or a plurality of concave portions (grooves). The lower portion (bottom surface) of the block 133 is a plane whose area is substantially equal to the upper surface of the base pedestal 132,
When the block 133 is mounted on the base pedestal, it comes into close contact with the upper surface of the base pedestal 132.

When this embodiment is applied to the ground pedestal 21 shown in FIG. 2, as shown in FIG.
It becomes a configuration like a ground pedestal 141 composed of the block 42 and the block 143. The ground pedestal 4 shown in FIG.
When this embodiment is applied to FIG. 1, as shown in FIG.
It has a configuration like a ground pedestal 151 composed of a base pedestal 152 and a block 153.

The block is preferably made of a metal block made of a conductive material such as brass or aluminum. Further, in the case of the lattice-shaped block 153 shown in FIG. 14, it can be easily formed by punching a metal sheet having a predetermined thickness, and the manufacturing cost can be reduced. in this case,
The length a (upper bottom) of the convex portion 154 on the upper surface side is equal to the length b (lower bottom) of the convex portion 154 on the bottom surface side. However, since the contact area of the protrusion 154 with the slag 13 is large,
No problem occurs.

In the fourth embodiment of the present invention, effects similar to those of the first and second embodiments can be obtained. In addition, even if the test jig 10 performs a test by pressing a plurality of high-frequency devices with a pressing member over a long period of time, the slug of the high-frequency device 12 is higher than that of the conventional needle-like shape. Even if the contact surface with 13 deteriorates due to wear or scratches, only the block needs to be replaced, so that the cost of the test jig 10 can be reduced.

Further, when removing dust that has fallen into the groove 23, the block can be removed and cleaning can be performed.
No dust adheres to other parts, cleaning can be easily performed, and a smooth transition to test measurement of devices in a new lot can be achieved.

As the shape of the contact surface, the shape described in the first and second embodiments and other shapes can be applied.

[Fifth Embodiment] Next, the shape of a ground pedestal of a test jig according to a fifth embodiment of the present invention will be described. FIG. 15 is a front sectional view for explaining the structure of the test jig of the fifth embodiment. FIG. 16 is a perspective view showing the appearance of the ground pedestal in the test jig of the fifth embodiment.

The ground pedestal of the test jig of the fifth embodiment has a configuration in which a through hole for dropping dust is provided in the block and the base pedestal constituting the ground pedestal of the fourth embodiment. As shown in FIG. 15, the ground pedestal 161 is
It is composed of a base 162 and a block 163 which is a block for ground connection.

The base pedestal 152 has a flat upper part.
The block 163 can be placed. Block 163 is
The upper portion is a contact surface of the high-frequency device 12 with the slug 13, and has a plurality of convex portions 14 or a plurality of concave portions (grooves). The lower portion (bottom surface) of the block 163 is a plane whose outer circumference is substantially equal to the size of the outer circumference of the upper surface of the base pedestal 162. In close contact. Further, the block 163 is formed on the bottom surface of the concave portion or the groove 164.
A plurality of through holes 166 are provided.

The base pedestal 152 has one or more through holes on the upper surface. For example, base pedestal 1
When the upper surface of 52 is at the position indicated by AA ′ in FIG. 15, the base pedestal 152 has a plurality of through holes 168 on the upper surface and a cavity 167 inside. When the block 163 is placed on the base 162, the lower surface side openings of the plurality of through holes 168 provided in the block 163 and the base 162
The upper surface side openings of the plurality of through holes 168 provided are arranged so as to match each other, and the through holes 166 and the through holes 168 communicate with each other.

When the upper surface of the base pedestal 152 is at the position shown by BB 'in FIG. 15, the base pedestal 152 has a cavity 167 which is a through hole having one opening on the upper surface side. . When the block 163 is placed on the base 162, the opening on the upper surface of the base 162 is
The openings on the lower surface side of the 63 through holes 166 are not sealed but communicate with the respective openings.

Therefore, the dust that has fallen into the concave portion (groove) 164 falls into the cavity 167 through the through hole 166 or through the through hole 166 and the through hole 168. By installing such components in the cavity 167, it becomes possible to collect dust from the lower part of the ground pedestal 163.

When this embodiment is applied to the ground pedestal 141 shown in FIG. 13, the ground pedestal 171 having the base pedestal 172 and the block 173 as shown in FIG.
The configuration is as follows.

In the fifth embodiment, in addition to the effects obtained in the third embodiment, the effects obtained in the fourth embodiment can be obtained.

The shape of the contact surface of the block in this embodiment can be the shape described in the first and second embodiments, or another shape.

In FIG. 15, the base pedestal 16
Both the block 2 and the block 163 have a configuration in which a through hole is provided. However, a plurality of holes having a predetermined depth are provided only on the bottom surface of the concave portion of the block 163 or on the bottom surface of the groove provided between the plurality of convex portions. It may be a configuration. In this case, it is possible to accumulate dust in a hole having a predetermined depth.
The number of times of cleaning at 0 can be reduced. In addition, the block 163 can be removed, and cleaning can be easily performed using an air blow or the like, and the cleaning efficiency is improved.

By performing a final test of the high-frequency device using the test jig having the ground pedestal structure described above, a structure in which dust such as burrs adhered to the high-frequency device is dropped into the concave portion, and a gap between the device and the device is obtained. Trapping is greatly reduced. Therefore, it is possible to avoid an increase in the defective rate at the time of the final test, and to reduce the number of high-frequency devices that need to be re-measured. In addition, by reducing the frequency of cleaning the test jig and simplifying the cleaning work,
The time and cost for the final test can be significantly reduced. Furthermore, since the test jig incorporating the ground pedestal structure of the present invention is easy to manufacture and has a simple structure, an inexpensive and highly reliable test jig can be provided, and the test efficiency can be increased.

[0091]

According to the present invention, the following effects can be obtained.

(1) The semiconductor device test jig is a contact surface with a grounding electrode provided on the bottom surface of the package of the semiconductor device, the contact surface provided with a plurality of convex portions or a plurality of concave portions. By providing at least the pedestal having the pedestal, the contact area of the contact surface of the pedestal can be reduced, so that the probability that dust such as burrs adhere can be reduced. Further, dust attached to the semiconductor device can be dropped between the plurality of convex portions or into the plurality of concave portions.

(2) The pedestal of the semiconductor device test jig is constituted by the base pedestal and the ground connection block provided with the contact surface and detachable from the base pedestal. Even if the surface is deteriorated due to wear or damage, only the ground connection block needs to be replaced, and the entire semiconductor device test jig does not need to be created again, so that the cost of the semiconductor device test jig can be reduced. In addition, since the ground connection block can be removed for cleaning, even if cleaning is performed by air blow or the like, dust can be easily cleaned without adhering to other parts of the test jig. Efficiency can be improved.

(3) Since the semiconductor device test jig is provided with one or more through holes or holes of a predetermined depth between a plurality of convex portions or at the bottom of the plurality of concave portions, By providing a plurality of holes or through holes between the concave portions or the convex portions, dust that has fallen between the convex portions or on the bottom surface of the concave portion can be further dropped into the plurality of holes or the through holes. Accumulation of dust in the space or in the recess can be suppressed.

(4) Since the ground connection block is formed by punching a metal sheet having a predetermined thickness, the ground connection block can be formed easily, and the manufacturing cost of the semiconductor device test jig is reduced. Down can be achieved.

(5) The base pedestal may include one or more second bases.
Since the ground connection block is attached to the base, the one or more second through holes are configured to communicate with the through holes of the ground connection block.
Garbage that has fallen between the convex portions or the bottom surface of the concave portion falls through the through-hole and the second through-hole, so that the garbage can be easily collected by installing a container below the second through-hole. Can be. Further, the number of times of cleaning the pedestal can be reduced.

(6) The cross-sectional shape of the projection on the contact surface of the pedestal is such that the contact surface side with the grounding electrode has an upper bottom of length a and a bottom portion has a lower length of b (≧ a). Because of the trapezoidal shape with the bottom, the contact area of the contact portion of the pedestal can be reduced, the probability that dust such as burrs adhere can be reduced, and the parasitic inductance can be reduced and the heat dissipation can be improved. .

(7) The cross-sectional shape of the recess in the contact surface of the pedestal is such that the contact surface side with the ground electrode has an upper bottom of length c, and a bottom portion has a lower bottom of length d (≦ c). Therefore, the contact area of the contact portion of the pedestal can be reduced, the probability that dust such as burrs adheres can be reduced, and the parasitic inductance can be reduced. In addition, heat dissipation can be improved.

(8) Since the convex portion on the abutment surface of the pedestal is hemispherical or semi-cylindrical, the convex portion of the pedestal has a curved surface. Even if a test is performed by pressing a plurality of high-frequency devices with a pressing member over a long period of time, the contact surface with the ground electrode of the semiconductor device hardly wears out, and the plurality of protrusions are formed. Therefore, a contact area can be ensured, and a structure in which dust such as burrs does not easily adhere to the semiconductor device test jig can be realized while maintaining low parasitic inductance and heat dissipation in the semiconductor device.

(9) In the semiconductor device test jig, the concave portion in the abutment surface of the pedestal is provided so that a plurality of semi-cylindrical pillars are formed so as to have orthogonal shapes. With this configuration, a contact area can be ensured, and a structure can be realized in which dust such as burrs does not easily adhere to a semiconductor device test jig while maintaining low parasitic inductance and heat dissipation in the semiconductor device.

[Brief description of the drawings]

FIG. 1 is a front sectional view for explaining a ground electrode structure of a semiconductor device test jig according to an embodiment of the present invention.

FIG. 2 is a perspective view of a ground pedestal having a plurality of prism-shaped protrusions.

FIG. 3 is an enlarged front view of a slug of a high-frequency device and a contact portion of a test jig on a ground pedestal.

FIG. 4 is a perspective view of a ground pedestal having a plurality of projecting protrusions.

FIG. 5 is a perspective view of a ground pedestal having a lattice-shaped convex portion.

FIG. 6 is a front sectional view showing a ground pedestal shape of a test jig according to a second embodiment of the present invention.

FIG. 7 is a perspective view of a ground pedestal having a plurality of semi-cylindrical protrusions.

FIG. 8 is a perspective view of a ground pedestal having a plurality of hemispherical projections.

FIG. 9 is an enlarged front view of a slag of a high-frequency device and a contact portion of a ground pedestal of a test jig.

FIG. 10 is a front sectional view showing a ground pedestal structure of a test jig according to a third embodiment of the present invention.

FIG. 11 is a perspective view and a top view of a ground pedestal in a semiconductor test jig according to a third embodiment.

FIG. 12 is a front sectional view for explaining the structure of a test jig according to a fourth embodiment.

FIG. 13 is a perspective view showing a structure of a ground pedestal in a test jig according to a fourth embodiment.

FIG. 14 is a perspective view showing the structure of another ground pedestal in the test jig of the fourth embodiment.

FIG. 15 is a front sectional view for explaining the structure of a test jig according to a fifth embodiment.

FIG. 16 is a perspective view showing an appearance of a ground pedestal in a test jig according to a fifth embodiment.

17A and 17B are a top view and a front sectional view in a state where a high-frequency device to be inspected is mounted on a conventional test jig.

FIG. 18 is a front sectional view showing a state in which dust is sandwiched when a high-frequency device is mounted on a conventional test jig.

[Explanation of symbols]

 Reference Signs List 10-semiconductor device test jig 12-semiconductor device 13-ground electrode (slag) 14-recess 131-pedestal 132-base pedestal 133-ground connection block

Claims (9)

[Claims] 1. A semiconductor test jig having at least a pedestal having a contact surface with a ground electrode provided on a bottom surface of a package of a semiconductor device, wherein a plurality of convex portions or a plurality of concave portions are provided on the corresponding contact surface. A semiconductor device test jig. 2. The semiconductor device test according to claim 1, wherein the pedestal comprises a base pedestal, and a ground connection block provided with the contact surface and detachable from the base pedestal. jig. 3. The method according to claim 1, wherein one or a plurality of through holes or holes having a predetermined depth are provided between the plurality of convex portions or at the bottom of the plurality of concave portions. Semiconductor device test jig. 4. The semiconductor device test jig according to claim 2, wherein the ground connection block is formed by stamping a metal sheet having a predetermined thickness. 5. The base pedestal includes one or more second through holes that communicate with the through holes of the ground connection block when the ground connection block is mounted. Item 4. A semiconductor device test jig according to Item 3. 6. The convex portion has a cross-sectional shape in which a contact surface side with the ground electrode has an upper bottom of a length a and a bottom portion has a length b (≧
2. A trapezoid having a lower base of a).
5. The semiconductor device test jig according to any one of items 1 to 4. 7. The recess has a cross-sectional shape such that a contact surface side with the ground electrode has an upper bottom of a length c, and a bottom side has a length d (≦≦
5. The semiconductor device test jig according to claim 1, wherein the jig has a trapezoidal shape with c) as a lower base. 8. The semiconductor device test jig according to claim 1, wherein the convex portion has a hemispherical shape or a semi-cylindrical shape. 9. The semiconductor device test jig according to claim 1, wherein said concave portion is provided so as to form a convex portion having a shape in which a plurality of semi-cylindrical columns are orthogonal to each other.