JP2002280612A - Led device - Google Patents
Led deviceInfo
- Publication number
- JP2002280612A JP2002280612A JP2001073580A JP2001073580A JP2002280612A JP 2002280612 A JP2002280612 A JP 2002280612A JP 2001073580 A JP2001073580 A JP 2001073580A JP 2001073580 A JP2001073580 A JP 2001073580A JP 2002280612 A JP2002280612 A JP 2002280612A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- bonding
- substrate
- holes
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Abstract
Description
【０００１】[0001]
【発明が属する技術分野】本発明はＬＥＤ装置の基板の
電極パターンの形状に関するものである。The present invention relates to a shape of an electrode pattern on a substrate of an LED device.
【０００２】[0002]
【従来の技術】チップＬＥＤは、基板上に形成された電
極パターンのうち第１の電極にＬＥＤチップの下面電極
を接続するとともに、その上面電極は例えば金ワイヤに
より基板上の第２の電極に接続されて構成されている。
その電極パターンは、例えば図３に示すように基板４上
において、発光素子用のボンディング部である第１の電
極１と、ボンディングワイヤー用の第２ボンディング部
である第２の電極２が対向して設けられている。第１の
電極１は発光素子のための略矩形のボンディング部１
ａ、該ボンディング部に続く該ボンディング部１ａより
も巾の狭い細長い略矩形状の連結部１ｂ、連結部１ｂに
続き基板４の１側面全体を覆い基板４の裏面に達する基
板電極部１ｃとから成っている。また、第２の電極は前
記ボンディング部１ａに対向して細長い略矩形をなすボ
ンディングワイヤー用のボンディング部２ａ、及び該ボ
ンディング部２ａに続きそれと同一の巾で直線状に延び
た略矩形の連結部２ｂ、該連結部２ｂに続く基板４の他
側面全体を覆い基板４の裏面に達する基板電極部２ｃと
から成っている。また前記側面にはそれぞれ基板４を貫
通する孔をダイシングして形成された半円の溝（ここで
はスルーホールという）３，３’が形成されている。2. Description of the Related Art In a chip LED, a lower electrode of an LED chip is connected to a first electrode of an electrode pattern formed on a substrate, and the upper electrode is connected to a second electrode on the substrate by, for example, a gold wire. Connected and configured.
For example, as shown in FIG. 3, the first electrode 1 serving as a bonding portion for a light emitting element and the second electrode 2 serving as a second bonding portion for a bonding wire face each other on the substrate 4 as shown in FIG. It is provided. The first electrode 1 is a substantially rectangular bonding portion 1 for a light emitting element.
a, an elongated substantially rectangular connecting portion 1b narrower than the bonding portion 1a following the bonding portion; Made up of The second electrode includes a bonding portion 2a for a bonding wire, which is elongated and substantially rectangular, and faces the bonding portion 1a. 2b, and a substrate electrode portion 2c covering the entire other side surface of the substrate 4 following the connecting portion 2b and reaching the back surface of the substrate 4. Further, semicircular grooves (herein referred to as through holes) 3, 3 'formed by dicing holes penetrating the substrate 4 are formed on the side surfaces.
【０００３】[0003]
【発明が解決しようとする課題】前記従来の形状の電極
パターンを持ったＬＥＤ装置を回路基板に実装する場
合、基板電極部１ｃ、２ｃと電極用あるいはボンディン
グワイヤ用のボンディング部１ａ、２ａとはそれぞれ細
長い略矩形状の連結部１ｂ、２ｂにより直線的に接続さ
れているため、ＬＥＤ装置の装置電極と回路基板とを半
田で接続すると、付与した半田の一部が前記スルーホー
ル３，３’から前記電極パターンを伝って、前記発光素
子及びボンディングワイヤー部分にまで流動して半田浸
食が生じることがある。この問題を解決するため、例え
ば図４に示すように、それぞれの連結部１ｂ、２ｂにエ
ポキシ樹脂又はレジストによる半田阻止部を形成し、そ
れによって半田の流動を阻止することが行われている
が、この方法では基板に半田阻止部５を形成するための
加工が必要があり、コストがかかる上加工が煩雑であ
る。そこで、本発明は、基板に新たな加工を施すことな
く、ＬＥＤ装置の実装時に半田が前記スルーホールを伝
って来ても、ＬＥＤ電極あるいはボンディングワイヤの
ボンディング部１ａ、２ａには到達しないようすること
を目的とするものである。When the LED device having the electrode pattern of the conventional shape is mounted on a circuit board, the substrate electrode portions 1c and 2c and the bonding portions 1a and 2a for electrodes or bonding wires are formed. Since the device electrodes of the LED device and the circuit board are connected to each other by soldering, since they are connected linearly by the elongated and substantially rectangular connecting portions 1b and 2b, a part of the applied solder becomes the through holes 3 and 3 '. From the electrode pattern to the light emitting element and the bonding wire portion, and solder erosion may occur. In order to solve this problem, for example, as shown in FIG. 4, a solder blocking portion made of an epoxy resin or a resist is formed on each of the connecting portions 1b and 2b, thereby preventing the flow of solder. However, this method requires a process for forming the solder blocking portion 5 on the substrate, which is costly and complicated. Therefore, the present invention prevents the solder from reaching the bonding portions 1a and 2a of the LED electrodes or the bonding wires even when the solder is transmitted through the through holes when the LED device is mounted without performing new processing on the substrate. The purpose is to do so.
【０００４】[0004]
【課題を解決するための手段】請求項１の発明は、それ
ぞれスルーホールが設けられた基板両側部に対向して配
置され、ＬＥＤの底面電極ボンディング部またはボンデ
ィングワイヤ用のボンディング部を備えた第１及び第２
の電極を備え、前記第１及び第２の電極パターンは、そ
れぞれ前記各スルーホールから前記各ボンディング部に
至る経路に、前記スルーホール同士を結ぶ経路の領域外
となる区間を備えた形状であることを特徴とするＬＥＤ
装置である。According to a first aspect of the present invention, there is provided a semiconductor device comprising a bottom electrode bonding portion for an LED or a bonding portion for a bonding wire, which is disposed opposite to both side portions of a substrate provided with through holes. 1st and 2nd
And the first and second electrode patterns each have a shape in which a path from each of the through holes to each of the bonding portions has a section outside a region of a path connecting the through holes. LED characterized by the following
Device.
【０００５】請求項２の発明は、それぞれスルーホール
が設けられた基板両側部に対向して配置され、ＬＥＤの
底面電極ボンディング部またはボンディングワイヤ用の
ボンディング部を備えた第１及び第２の電極を備え、前
記第１及び第２の電極パターンは、前記ＬＥＤの底面電
極ボンディング部またはボンディングワイヤ用のボンデ
ィング部がいずれも前記スルーホール同士を結ぶ経路の
領域外に配置された形状であることを特徴とするＬＥＤ
装置である。According to a second aspect of the present invention, there is provided a first and a second electrode having a bottom electrode bonding portion for a LED or a bonding portion for a bonding wire, the first electrode and the second electrode being disposed opposite to both side portions of the substrate provided with through holes, respectively. Wherein the first and second electrode patterns each have a shape in which a bottom electrode bonding portion or a bonding wire bonding portion of the LED is arranged outside a region of a path connecting the through holes. Featured LED
Device.
【０００６】[0006]
【発明の実施の形態】本発明のＬＥＤ装置の１実施形態
を添付図面を参考に説明する。図１は本発明によるＬＥ
Ｄ装置のダイシング後におけるＬＥＤ装置を示し、その
構造は電極パターン以外の点は従来公知のものと同様で
あり、従来のものと同様の部分には同じ番号を付してい
る。本実施形態における電極パターンは、図１に示すよ
うに基板４上において、発光素子用のボンディング部で
ある第１の電極１と、ボンディングワイヤー用の第２ボ
ディング部である第２の電極２が対向して設けられてい
る。第１の電極１は発光素子のための略矩形のボンディ
ング部１ａ、該ボンディング部に続く該ボンディング部
１ａよりも巾の狭い細長い屈曲した連結部１ｂ、連結部
１ｂに続き基板４の１側面全体を覆い基板４の裏面に達
する基板電極部１ｃとから成っている。また、第２の電
極は前記ボンディング部１ａに対向して細長い略矩形を
なすボンディングワイヤー用のボンディング部２ａ、及
び該ボンディング部２ａに続く屈曲した連結部２ｂ、該
連結部２ｂに続く基板４の他側面全体を覆い基板４の裏
面に達する基板電極部２ｃとから成っている。ここで、
前記連結部１ｂは、前記連結部は前記装置電極部の両側
部に設けたスルーホール３、３’同士を結ぶ経路の領域
外の位置において前記基板電極部１ｃに接続され、そこ
からＬＥＤ装置の縦側面に沿って所定距離延びた部分１
ｂ’、その先端に接続されＬＥＤ装置の横側面に沿って
所定距離延びた部分１ｂ”とからなり、前記部分１ｂ”
の先端に発光素子のための略矩形のボンディング部１ａ
が設けられている。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the LED device of the present invention will be described with reference to the accompanying drawings. FIG. 1 shows an LE according to the invention.
The LED device after dicing of the D device is shown. The structure of the LED device is the same as that of the conventional device except for the electrode pattern, and the same parts as those of the conventional device are denoted by the same reference numerals. As shown in FIG. 1, the electrode pattern in the present embodiment includes a first electrode 1 serving as a bonding portion for a light emitting element and a second electrode 2 serving as a second bonding portion for a bonding wire on a substrate 4. They are provided facing each other. The first electrode 1 includes a substantially rectangular bonding portion 1a for a light emitting element, an elongated bent connecting portion 1b narrower than the bonding portion 1a following the bonding portion, and an entire side surface of the substrate 4 following the connecting portion 1b. And a substrate electrode portion 1c reaching the back surface of the substrate 4. Further, the second electrode includes a bonding portion 2a for a bonding wire, which is elongated and substantially rectangular, facing the bonding portion 1a, a bent connecting portion 2b following the bonding portion 2a, and a substrate 4 following the connecting portion 2b. And a substrate electrode portion 2c that covers the entire other side surface and reaches the back surface of the substrate 4. here,
The connecting portion 1b is connected to the substrate electrode portion 1c at a position outside a region of a path connecting the through holes 3 and 3 'provided on both sides of the device electrode portion, and the connecting portion 1b is connected to the LED device. Part 1 extending a predetermined distance along the vertical side
b ', a portion 1b "connected to the tip thereof and extending a predetermined distance along the lateral side surface of the LED device, said portion 1b"
Substantially rectangular bonding portion 1a for a light emitting element
Is provided.
【０００７】また、前記連結部２ｂは、前記連結部１ｂ
と同様に前記装置電極部の両側部に設けたスルーホール
３、３’同士を結ぶ経路の領域外の位置において前記基
板電極部２ｃに接続され、そこからＬＥＤ装置の縦側面
に沿って所定距離延びた部分２ｂ’、その先端に接続さ
れＬＥＤ装置の横側面に沿って所定距離延びた部分２
ｂ”とからなり、前記部分２ｂ”の先端にボンディング
ワイヤー用のボンディング部２ａが設けられている。前
記１ｂ、２ｂを以上のような位置に配置することによ
り、ＬＥＤ装置を実装する際に、半田が前記スルーホー
ル３，３’を通って装置電極部１ｃ、２ｃに達しても、
前記連結部１ｂ、２ｂが前記スルーホール３，３’を結
ぶ領域から外れており半田の直進が断たれるため、半田
がＬＥＤ装置ボンディング部１ａ，或いはボンディング
ワイヤーのボンディング部２ａにまで達する恐れはな
い。要するに、本発明は、ＬＥＤ装置を実装する際に、
前記スルーホール４，４’を通って装置電極部１ｃ、２
ｃに達した半田がＬＥＤのボンディング部１ａ，或いは
ボンディングワイヤーのボンディング部２ａに流動しな
いようにする、つまり電極のパターンを、前記連結部１
ｂ、２ｂが前記装置電極部の両側部に設けたスルーホー
ル３，３’同士を結ぶ経路の領域外に位置する部分を有
するような形状にし、スルーホール３，３’から流れ出
た半田の流動を前記連結部で阻み前記各ボンディング部
１ａ，２ａへの半田の浸食を防止するものである。The connecting portion 2b is connected to the connecting portion 1b.
Similarly to the above, the substrate electrode portion 2c is connected to the substrate electrode portion 2c at a position outside the region of the path connecting the through holes 3, 3 'provided on both sides of the device electrode portion, and a predetermined distance therefrom along the vertical side surface of the LED device An extended portion 2b ', a portion 2 connected to the tip and extending a predetermined distance along the lateral side surface of the LED device
b ", and a bonding portion 2a for a bonding wire is provided at the tip of the portion 2b". By arranging the 1b and 2b at the positions as described above, when mounting the LED device, even if the solder reaches the device electrode portions 1c and 2c through the through holes 3 and 3 ',
Since the connecting portions 1b and 2b are out of the region connecting the through holes 3 and 3 'and the straight movement of the solder is cut off, there is a possibility that the solder reaches the LED device bonding portion 1a or the bonding wire bonding portion 2a. Absent. In short, the present invention, when mounting the LED device,
The device electrodes 1c, 2c pass through the through holes 4, 4 '.
c is prevented from flowing to the bonding portion 1a of the LED or the bonding portion 2a of the bonding wire, that is, the electrode pattern is changed to the connection portion 1a.
b, 2b are formed so as to have a portion located outside the region of the path connecting the through holes 3, 3 'provided on both sides of the device electrode portion, and the flow of the solder flowing out of the through holes 3, 3' Is prevented by the connecting portion to prevent erosion of the solder into the bonding portions 1a and 2a.
【０００８】本発明は前記実施形態に以外にも、例えば
図２に示す形態、即ち、ＬＥＤのボンディング部１ａ，
或いはボンディングワイヤーのボンディング部２ａとを
基板４の互いに反対側に配置されたスルーホール３，
３’同士を結ぶ経路の領域外に位置するように配置する
ものであってもよい。更に、前記連結部１ｂ、２ｂの形
状は、ＬＥＤ装置を実装する際に、前記スルーホール
４，４’を通って装置電極部１ｃ、２ｃに達した半田
が、ＬＥＤのボンディング部１ａ，或いはボンディング
ワイヤーのボンディング部２ａに流動するのを阻止でき
る形状であれば、例えば、円弧状、螺旋状又はその他の
任意の形状であってもよい。The present invention is not limited to the above-described embodiment. For example, the embodiment shown in FIG.
Alternatively, the bonding portion 2a of the bonding wire and the through hole 3
It may be arranged so as to be located outside the region of the path connecting the 3's. Further, the shape of the connecting portions 1b and 2b is such that when the LED device is mounted, the solder that has reached the device electrode portions 1c and 2c through the through holes 4 and 4 'is bonded to the LED bonding portion 1a or the bonding portion 1b. For example, an arc shape, a spiral shape, or any other shape may be used as long as it can prevent the wire from flowing to the bonding portion 2a.
【０００９】[0009]
【発明の効果】本発明によれば、特許請求の範囲に記載
されたＬＥＤ装置の電極のパターンを採用することによ
って、実装時に、ＬＥＤ装置の前記スルーホールから前
記電極パターンを伝って来た半田の流動を阻止できるた
め、電極に格別な処理を施すことなく、前記発光素子及
びボンディングワイヤー部分にまで流動して半田浸食が
生じることを容易に防止することができる。According to the present invention, by adopting the electrode pattern of the LED device described in the claims, the solder that has passed down the electrode pattern from the through hole of the LED device during mounting is adopted. Can be prevented from flowing to the light emitting element and the bonding wire portion and causing solder erosion without performing any special treatment on the electrode.
【図１】 本発明のＬＥＤ装置の電極パターンの１実施
形態を示す図である。FIG. 1 is a view showing one embodiment of an electrode pattern of an LED device of the present invention.
【図２】 本発明のＬＥＤ装置の電極パターンの他に実
施形態を示す図である。FIG. 2 is a view showing an embodiment other than the electrode pattern of the LED device of the present invention.
【図３】 従来のＬＥＤ装置の電極パターンを示す図で
ある。FIG. 3 is a diagram showing an electrode pattern of a conventional LED device.
【図４】 半田浸食防止処理を施した従来のＬＥＤ装置
の電極パターンを示す。FIG. 4 shows an electrode pattern of a conventional LED device subjected to a solder erosion prevention process.
１・・・第１の電極、１ａ・・・発光素子ボンディング
部、１ｂ・・・連結部、１ｃ・・・第１の電極の装置電
極部、２・・・第２の電極、２ａ・・・ボンディングワ
イヤボンディング部、２ｂ・・・連結部、２ｃ・・・第
２の電極の装置電極部、３、３’・・・スルーホール、
４・・・基板DESCRIPTION OF SYMBOLS 1 ... 1st electrode, 1a ... Light emitting element bonding part, 1b ... Connecting part, 1c ... Device electrode part of 1st electrode, 2 ... 2nd electrode, 2a ... Bonding wire bonding portion, 2b connection portion, 2c device electrode portion of second electrode, 3, 3 'through hole,
4 ... substrate
Claims (2)
両側部に対向して配置され、ＬＥＤの底面電極ボンディ
ング部またはボンディングワイヤ用のボンディング部を
備えた第１及び第２の電極を備え、 前記第１及び第２の電極パターンは、それぞれ前記各ス
ルーホールから前記各ボンディング部に至る経路に、前
記スルーホール同士を結ぶ経路の領域外となる区間が形
成された形状であることを特徴とするＬＥＤ装置。A first electrode and a second electrode having a bottom electrode bonding portion or a bonding wire bonding portion for a bottom electrode of the LED, the first electrode and the second electrode being arranged opposite to both side portions of the substrate provided with the through holes, respectively; The first and second electrode patterns each have a shape in which a section that is outside a region of a path connecting the through holes is formed in a path from each of the through holes to each of the bonding portions. apparatus.
両側部に対向して配置され、ＬＥＤの底面電極ボンディ
ング部またはボンディングワイヤ用のボンディング部を
備えた第１及び第２の電極を備え、 前記第１及び第２の電極パターンは、前記ＬＥＤの底面
電極ボンディング部またはボンディングワイヤ用のボン
ディング部がいずれも前記スルーホール同士を結ぶ経路
の領域外に配置された形状であることを特徴とするＬＥ
Ｄ装置。2. The method according to claim 1, further comprising: a first electrode and a second electrode, each of which is disposed to face both sides of the substrate provided with the through hole, and has a bottom electrode bonding portion of the LED or a bonding portion for a bonding wire. The first and second electrode patterns each have a shape in which a bottom electrode bonding portion of the LED or a bonding portion for a bonding wire is arranged outside a region of a path connecting the through holes.
D device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001073580A JP4979107B2 (en) | 2001-03-15 | 2001-03-15 | LED device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001073580A JP4979107B2 (en) | 2001-03-15 | 2001-03-15 | LED device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010210104A Division JP2011003928A (en) | 2010-09-17 | 2010-09-17 | Light-emitting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002280612A true JP2002280612A (en) | 2002-09-27 |
| JP4979107B2 JP4979107B2 (en) | 2012-07-18 |
Family
ID=18930982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001073580A Expired - Fee Related JP4979107B2 (en) | 2001-03-15 | 2001-03-15 | LED device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4979107B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101523527B1 (en) * | 2008-12-30 | 2015-05-28 | 서울반도체 주식회사 | Lens, light emitting device and method of manufacturing the light emitting device |
| KR101573240B1 (en) | 2013-06-28 | 2015-12-02 | 서울반도체 주식회사 | Lens, light emitting device |
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| JPH11177138A (en) * | 1997-12-11 | 1999-07-02 | Stanley Electric Co Ltd | Surface-mounting type device and light emitting device or light receiving device using the device |
| JP2000133845A (en) * | 1998-10-23 | 2000-05-12 | Rohm Co Ltd | Semiconductor light-emitting element |
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| JPS6416637A (en) * | 1987-07-10 | 1989-01-20 | Inoue Japax Res | Micro fusion welding device |
| JPH0350338A (en) * | 1989-07-18 | 1991-03-04 | Honda Motor Co Ltd | Control device for automotive engine |
| JPH0546100A (en) * | 1991-08-20 | 1993-02-26 | Denki Kagaku Kogyo Kk | Light emitting diode and display plate |
| JPH0936432A (en) * | 1995-07-17 | 1997-02-07 | Sharp Corp | Lateral emission led and manufacture thereof |
| JPH11177138A (en) * | 1997-12-11 | 1999-07-02 | Stanley Electric Co Ltd | Surface-mounting type device and light emitting device or light receiving device using the device |
| JP2000133845A (en) * | 1998-10-23 | 2000-05-12 | Rohm Co Ltd | Semiconductor light-emitting element |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101523527B1 (en) * | 2008-12-30 | 2015-05-28 | 서울반도체 주식회사 | Lens, light emitting device and method of manufacturing the light emitting device |
| KR101573240B1 (en) | 2013-06-28 | 2015-12-02 | 서울반도체 주식회사 | Lens, light emitting device |
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| JP4979107B2 (en) | 2012-07-18 |
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