JP2002270998A - Method and device for manufacturing printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method/device for a printed wiring board, which can easily suppress the distribution of etching work quantity in the width direction of a wide range, reduce a circuit wiring pattern dimensional distribution, easily make the wiring of a circuit pattern fine and make projection efficiency high. SOLUTION: In the manufacturing method for the printed wiring board, a substrate where an etching resist is formed on a laminated board in which a copper foil is laminated on an insulated substrate is etched and a circuit wiring pattern is formed. A time that the substrate is exposed to etching liquid 6 is changed in the width direction perpendicular to the transport direction of the substrate in an etching processing tank 3 where a transport means transports the substrate and etching liquid 6 is spread and supplied to a substrate face by a spray nozzle.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor packaging such as an IC card terminal, a high-density wiring board, a multilayer printed wiring board, a flexible wiring board, a thin motor and various magnetic sensors incorporated in electronic equipment such as a portable information terminal. TECHNICAL FIELD The present invention relates to a method and an apparatus for manufacturing various printed wiring boards such as a coiled wiring board incorporated in a computer.

[0002]

2. Description of the Related Art In the manufacture of printed wiring boards, an etching resist is applied to a printed wiring laminate obtained by laminating copper foil on an insulating substrate such as a resin tape obtained by laminating copper foil on an insulating substrate by photolithography or printing. Unwanted portions of the formed substrate (hereinafter referred to as “resist forming substrate”) are dissolved and removed by etching using an etching solution such as an aqueous solution of ferric chloride to form a circuit wiring pattern.

[0003] An etching apparatus used for manufacturing a printed wiring board includes an etching tank, a transport mechanism for carrying a resist-formed substrate into and out of the etching tank, and an etching solution installed in the etching tank to uniformly etch the etching liquid onto the resist-formed substrate. It has a spray nozzle for spraying.

As an etching solution, a metal-soluble chemical such as an aqueous ferric chloride solution or an aqueous cupric chloride solution is used.

[0005] Spray flow rate of the etching solution,
Since the dissolution rate of the copper foil varies depending on the temperature and concentration of the etching solution, generally, these are controlled so as to be constant values during the etching process.

[0006] Depending on the form of the resist forming substrate, the conveying mechanism arranges a plurality of conveying rollers in the conveying direction, synchronously rotates them with a motor, places the resist forming substrate on the conveying rollers, and performs an etching process in which an etching solution is sprayed from a spray nozzle. A method of transporting the inside of the tank, a method of continuously unwinding a long tape-shaped resist-formed substrate from a reel, passing the etching solution through an etching processing tank sprayed from a spray nozzle, and winding the substrate on a reel rotated by a motor, etc. There is.

The etching time is controlled by controlling the time during which the resist-formed substrate is in the etching bath by setting the transport speed by the number of rotations of the motor so that the printed wiring board has a predetermined wiring size. Adjust the etching amount appropriately.

In order to make the entire surface of the printed wiring board uniform to a desired wiring size, a spray nozzle is provided in a width direction (hereinafter, referred to as “width direction”) perpendicular to the transport direction in which the resist-formed substrate is transported in the etching bath. It is necessary to control the spray pressure properly by controlling it so that it does not oscillate or clog the spray nozzles and pipes, and to adjust the spray form of spray nozzles and the arrangement of multiple spray nozzles. It also monitors the pressure of the piping system and individual spray nozzles and abnormal spray conditions to adjust the spray pressure, clean and replace the spray nozzle, distribute the spray pressure at each position in the width direction, The amount of etching in the width direction of the resist-formed substrate can be made uniform by devising the swinging form of.

For example, in Japanese Patent Application Laid-Open No. Hei 10-018058, the flow rate and pressure of an etching solution sent to a spray nozzle pipe are measured for each spray pipe, and the relationship between the measured flow rate and pressure is determined in advance. If it is out of the range, the operation of the apparatus is stopped by stopping the flow of the etching solution to each spray pipe, or the etching in the photo etching processing apparatus in which the flow rate of the pipe out of the range is forcibly increased. A liquid flow control method is disclosed.

[0010]

However, in the conventional method and apparatus for manufacturing a printed wiring board, the distribution of the etching amount is generated due to the non-uniformity of the spray pattern of the individual spray nozzles and the change over time. It is difficult to precisely control the distribution of the etching amount in the width direction because the distribution of the etching amount in a narrow range cannot be suppressed in the width direction by adjusting the spray pressure in nozzle units. In high-density circuit wiring patterns with fine wiring dimensions, fine in-plane dimensional distribution, which has not been a problem in the past, causes defects such as short-circuiting between wirings. There was a problem that it could not be handled.

Also, adjusting the amount of etching in the width direction by adjusting the spray nozzles and the arrangement thereof has a problem in that the production efficiency is reduced or the etching apparatus is stopped, which results in a loss in production.

The present invention solves the above problems,
Provided are a method and an apparatus for manufacturing a printed wiring board, in which the distribution of the etching amount in a wide width direction is easily suppressed, the size distribution of the circuit wiring pattern can be reduced, the fine wiring of the circuit pattern can be easily performed, and the production efficiency is high. The purpose is to:

[0013]

In order to achieve the above object, a method of manufacturing a printed wiring board according to the present invention is directed to a method of forming a circuit by etching a substrate in which an etching resist is formed on a laminate obtained by laminating a copper foil on an insulating substrate. A method of manufacturing a printed wiring board for forming a wiring pattern, wherein a substrate is exposed to an etching solution in an etching treatment tank in which the substrate is transported by a transporting means and the etching solution is sprayed onto the substrate surface by a spray nozzle. Is changed in the width direction perpendicular to the substrate transport direction.

In order to achieve the above object, a printed wiring board manufacturing apparatus according to the present invention forms a circuit wiring pattern by etching a substrate having an etching resist formed on a laminate obtained by laminating a copper foil on an insulating substrate. A device for manufacturing a printed wiring board, comprising a transport device for transporting a substrate, an etching tank, a spray nozzle installed in the etching tank and spraying an etchant on the substrate, and a gap between the spray nozzle and the substrate. In this configuration, a shielding plate having a length in the transport direction corresponding to the etching amount distribution in the width direction perpendicular to the transport direction of the substrate is provided.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 is a method of manufacturing a printed wiring board in which a circuit wiring pattern is formed by etching a substrate having an etching resist formed on a laminate obtained by laminating a copper foil on an insulating substrate. In an etching tank for transporting a substrate by a transport unit and supplying an etchant to the surface of the substrate with a spray nozzle, a time period during which the substrate is exposed to the etchant is set to a width perpendicular to the transport direction of the substrate. The distribution of the etching amount in the wide width direction can be easily suppressed, the size distribution of the circuit wiring pattern can be reduced, the fine circuit wiring pattern can be easily formed, and the printed wiring board can be manufactured with high production efficiency. Can be formed.

According to a second aspect of the present invention, in the first aspect, a shield plate is inserted into a gap between the spray nozzle provided in the etching tank and the substrate to change the exposure time in the width direction. It is possible to precisely correct the width distribution in the width direction only by changing the shape of the shielding plate, easily suppress the distribution of the etching amount in the wide width direction,
The size distribution of the circuit wiring pattern can be reduced, the fine circuit wiring pattern can be easily formed, and the printed wiring board can be formed with high production efficiency.

According to a third aspect of the present invention, in the second aspect, the strip-shaped shielding plates are arranged in a plurality of rows in the width direction, and each of the strip-shaped shielding plates is moved in the transport direction of the substrate. The exposure time is changed, the shape of the shielding plate can be easily changed, the width direction dimensional distribution can be precisely corrected, the distribution of etching amount in the wide width direction can be easily suppressed, and the circuit wiring pattern size distribution can be easily adjusted. The size of the printed circuit board can be reduced, the fine circuit wiring pattern can be easily formed, and the printed wiring board can be formed with high production efficiency.

According to a fourth aspect of the present invention, there is provided a printed wiring board manufacturing apparatus for forming a circuit wiring pattern by etching a substrate having an etching resist formed on a laminate obtained by laminating a copper foil on an insulating substrate, A transport device for transporting the substrate, an etching bath, a spray nozzle installed in the etching bath to spray the etching liquid onto the substrate, and a widthwise etching perpendicular to the transport direction of the substrate in a gap between the spray nozzle and the substrate. Equipped with a shielding plate with a length in the transport direction corresponding to the volume distribution, and it is easy to suppress the distribution of the amount of etching in the width direction of the substrate and to reduce the size distribution of the circuit wiring pattern without lowering the production efficiency. A printed wiring board having a circuit wiring pattern can be formed.

According to a fifth aspect of the present invention, in the fourth aspect, the shielding plate is a strip-shaped shielding plate in which a plurality of rows are arranged in the width direction, and each of the strip-shaped shielding plates is moved in the substrate transport direction. The distribution of the amount of etching in the substrate width direction can be easily suppressed, the size distribution of the circuit wiring pattern can be reduced without lowering the production efficiency, and a printed wiring board having a fine circuit wiring pattern can be easily formed.

According to a sixth aspect of the present invention, a substrate in which an etching resist is formed on a metal foil of an insulating substrate with a metal foil is carried by a carrying means, and an etching solution is sprayed and etched to form a circuit wiring pattern. A method for manufacturing a printed wiring board, which comprises changing the exposure time of a substrate to an etching solution in a width direction perpendicular to the direction in which the substrate is conveyed. The distribution of the etching amount can be easily suppressed, the size distribution of the circuit wiring pattern can be reduced, the fine circuit wiring pattern can be easily formed, and the printed wiring board can be formed with high production efficiency.

According to a seventh aspect of the present invention, there is provided a printed wiring board according to the sixth aspect, wherein an exposure time is changed in a width direction by selectively shielding an etchant sprayed on the substrate. This is a manufacturing method.By selectively shielding, the width distribution in the width direction can be precisely corrected, the distribution of the etching amount in the wide width direction can be easily suppressed, the size distribution of the circuit wiring pattern can be reduced, and the fine circuit wiring pattern can be reduced. A printed wiring board can be formed easily and with high production efficiency.

An embodiment of the present invention will be described below with reference to FIGS.

(Embodiment 1) FIG. 1 is a side view showing an apparatus for manufacturing a printed wiring board according to Embodiment 1 of the present invention. In FIG. 1, reference numeral 1 denotes a resist-formed substrate, 2 denotes a transfer device for transferring the resist-formed substrate, 3 denotes an etching tank, 4 denotes a spray nozzle, 5 denotes a shielding plate, and 6 denotes an etching solution.

As the etching solution 6, an aqueous solution of ferric chloride can be used. The solution is pumped by a solution feed pump (not shown) and sprayed by the spray nozzle 4, thereby forming droplets of the resist forming substrate 1 as droplets. To reach.

The resist forming substrate 1 is a strip-shaped substrate in which an etching resist is formed on a laminate obtained by laminating a copper foil on a polyimide film substrate via an epoxy-based adhesive, and is wound by a transport device 2 from a reel (not shown). The exposed portion of the copper foil, which is taken out and introduced into the etching bath 3 and not covered with the resist while passing through the etching bath, is exposed to the etching liquid droplets and etched to be removed to form a circuit wiring pattern. .

The shielding plate 5 is provided in the gap between the spray nozzle 4 and the resist-formed substrate 1, and prevents the etching solution 6 sprayed from the spray nozzle 4 from coming into contact with the resist-formed substrate 1.

FIG. 2 is a plan view showing an apparatus for manufacturing a printed wiring board according to Embodiment 1 of the present invention.
In FIG. 2, 1 is a resist forming substrate, 2 is a transfer device for transferring the resist forming substrate 1, 3 is an etching tank,
4 is a spray nozzle and 5 is a shielding plate.

Assuming that the length L of the etching treatment tank 3 in the transport direction and the transport speed of the resist-formed substrate 1 by the transport device 2 are v, the etching time t during which the resist-formed substrate 1 comes into contact with the etching solution 6 is expressed by the following equation (1). It is represented by

T = L / v (1) Further, when a gap width s between wirings is taken as a dimension of a circuit wiring pattern formed by etching, s with respect to the etching time t is expressed by the following equation (2).

S = a · t + c (2) In the equation (2), a and c are constants.

S at an arbitrary position as a reference in the width direction
On the other hand, when there is a difference δs in the gap width in the width direction, the length δL in the transport direction of the etching treatment tank corresponding to the etching time for compensating for the difference is represented by Expression (3).

ΔL = v · δs / a (3) The shielding plate 5 has a difference in length in the transport direction so that the etching solution 6 is shielded by a distance δL from an arbitrary reference position in the width direction. The resist-formed substrate 1
And the etching solution 6
Prevents contact with the resist-formed substrate 1, a difference occurs in the etching time in the width direction, and the gap width difference δs in the width direction, that is, the size distribution of the circuit wiring pattern can be reduced easily and reliably. .

(Embodiment 2) FIG. 3 is a plan view showing an apparatus for manufacturing a printed wiring board according to Embodiment 2 of the present invention. In FIG. 3, reference numeral 1 denotes a resist forming substrate, 2 denotes a transfer device for transferring the resist forming substrate, 3 denotes an etching tank, 4 denotes a spray nozzle, and 5 denotes a shielding plate.

The structure from the side of the apparatus for manufacturing a printed wiring board according to the second embodiment of the present invention is the same as the structure shown in FIG.

As shown in FIG. 3, the shielding plate 5 is a plurality of strip-shaped shielding plates arranged in the width direction, and both ends in the transport direction are installed so as to be positioned inside and outside the etching tank 3 respectively. You.

Each of the rectangular shielding plates is moved in the transport direction of the resist-formed substrate, and is disposed in a gap between the spray nozzle 4 and the resist-formed substrate 1.

With respect to the rectangular shielding plate at an arbitrary position as a reference in the width direction, the rectangular shielding plate at the position in the width direction is moved in the transport direction by a distance δL corresponding to the difference δs of the gap width in the width direction. By disposing at the moved position, the difference δs in the gap width in the width direction can be easily and reliably reduced.

In the above-described embodiment, the transport mechanism is a method in which the long tape-shaped resist-formed substrate is continuously unwound from the reel and is passed through the etching tank and wound onto the reel. A transport system of various other mechanisms may be used, such as a method in which a plurality of transport rollers are arranged side by side, synchronously rotated by a motor, and a resist-formed substrate is placed on the transport rollers and transported.

Although the spray nozzle is provided below the resist forming substrate, it may be provided in the upper row or both upper and lower rows depending on the type of the resist forming substrate.

Although an aqueous solution of ferric chloride is used as the etching solution, other known chemical solutions used as an etching solution can be used in the present invention. For example, cupric chloride aqueous solution and the like can be mentioned.

Further, as the substrate, a structure in which a polyimide film is used as an insulating substrate and a copper foil is laminated on the polyimide film via an epoxy-based adhesive has been described as an example, but a polyimide film, an epoxy-based adhesive, Copper foil is suitable for processing and versatility, but in the present invention,
In addition to the polyimide film, an insulating substrate used for a conventionally known printed wiring board can be used as the substrate. In addition, when performing continuous processing or winding processing, the insulating substrate preferably has flexibility and flexibility. Further, it goes without saying that other thermosetting adhesives can be used in addition to the epoxy adhesive. Further, as the metal foil, a metal foil used for a conventionally known printed wiring board can be used other than the copper foil.

[0042]

According to the method and apparatus for manufacturing a printed wiring board of the present invention, a method for manufacturing a printed wiring board which has a small size distribution of circuit wiring patterns, facilitates formation of fine circuit wiring patterns, and has high production efficiency. A manufacturing apparatus can be provided.

[Brief description of the drawings]

FIG. 1 is a side view showing a printed wiring board manufacturing apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan view showing a printed wiring board manufacturing apparatus according to Embodiment 1 of the present invention.

FIG. 3 is a plan view showing a printed wiring board manufacturing apparatus according to a second embodiment of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 resist-formed substrate 2 transfer device 3 etching treatment tank 4 spray nozzle 5 shielding plate 6 etching solution

Claims (7)

[Claims] 1. A method of manufacturing a printed wiring board, wherein a circuit wiring pattern is formed by etching a substrate having an etching resist formed on a laminate obtained by laminating a copper foil on an insulating substrate, wherein the substrate is transported by transport means. And changing the time during which the substrate is exposed to the etchant in the width direction perpendicular to the direction in which the substrate is transported in an etching treatment tank that supplies the etchant to the substrate surface with a spray nozzle. A method for manufacturing a printed wiring board, comprising: 2. The method according to claim 1, wherein a shielding plate is inserted into a gap between the spray nozzle installed in the etching processing tank and the substrate to change the time of exposure to the etching solution in the width direction. The method for manufacturing a printed wiring board according to claim 1. 3. The substrate is exposed to the etching liquid by arranging a plurality of strip-shaped shielding plates in the width direction, and moving the strip-shaped shielding plates in the transport direction of the substrate. 3. The method according to claim 2, wherein the time is changed. 4. A printed wiring board manufacturing apparatus for forming a circuit wiring pattern by etching a substrate on which an etching resist is formed on a laminate obtained by laminating a copper foil on an insulating substrate, wherein the transporting device transports the substrate. An etching tank, a spray nozzle installed in the etching tank and spraying an etching solution on the substrate, and a widthwise etching tank perpendicular to a transport direction of the substrate in a gap between the spray nozzle and the substrate. An apparatus for manufacturing a printed wiring board, comprising: a shielding plate having a length in a conveying direction corresponding to an etching amount distribution. 5. The shielding plate is a strip-shaped shielding plate arranged in a plurality of rows in the width direction, and comprises a moving mechanism for moving each of the strip-shaped shielding plates in a transport direction of the substrate. An apparatus for manufacturing a printed wiring board according to claim 4. 6. A method for manufacturing a printed wiring board, wherein a substrate having an etching resist formed on a metal foil of an insulating substrate with a metal foil is transported by transporting means, and an etchant is sprayed and etched to form a circuit wiring pattern. A method of manufacturing a printed wiring board, wherein the exposure time of the substrate to the etching solution is changed in a width direction perpendicular to a transport direction of the substrate. 7. The method for manufacturing a printed wiring board according to claim 6, wherein said exposure time is changed in a width direction by selectively shielding an etchant sprayed on said substrate.