JP2002265797A - Resin composition and its use - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a resin composition allowing little sedimentation of highly dielectric fillers, a resin varnish, and to provide an electronic member obtained using this composition and its manufacture process. SOLUTION: A resin composition containing a resin and a highly dielectric fillers is further compounded with a filler (X) having a sedimentation velocity smaller than that of the highly dielectric fillers. The resin composition is used to form an insulating layer in a wiring board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition and a varnish suitably used for electronic parts such as wiring boards, a wiring board using the resin composition, a resin film, a semiconductor package, and a wiring board mounted with a semiconductor package. And materials for wiring boards, and methods for producing them.

[0002]

2. Description of the Related Art Multilayer wiring boards have been developed in response to the demand for high-density mounting of various components on the wiring boards, and further, multilayer elements having circuit elements (coil: L, capacitor: C, resistance: R) formed therein. The use of boards is increasing. Therefore, as the resin layer forming the insulating layer, a low dielectric constant resin layer is used for a circuit portion related to high-speed signal processing, and a high dielectric constant resin layer is used for a layer corresponding to a capacitor. Are being considered. In order to form the high dielectric constant resin layer, a high dielectric constant inorganic filler such as barium titanate is blended in addition to selecting a high dielectric constant resin material.

However, when such a high dielectric constant filler is blended, the filler tends to settle in the liquid resin or the resin varnish, and cannot be left for a long time in that state. Once the filler has settled, it is difficult to redisperse the filler, and the filler cannot be reused. In view of the above, the present invention provides
It is an object of the present invention to provide a resin composition and a resin varnish in which sedimentation of a high dielectric constant filler is suppressed and the redispersibility of the filler is favorable, and a material for electronic components using the same and a method for producing the same. I do.

[0003]

In order to achieve the above object, a resin composition according to the present invention comprises a resin, a high dielectric constant filler, and a filler having a lower sedimentation velocity than the high dielectric constant filler. X). In the present invention, the filler (X) may be the same compound as the high dielectric constant filler as long as the sedimentation rate is lower. Here, the sedimentation velocity (V _f ) is obtained from the following equation (1).

(Equation 1) (Where g: gravity acceleration, ρ _p : particle density, ρ _f : fluid density, D _p : particle diameter, μ: fluid viscosity)

The above equation (1) is derived as follows. Reynolds number (Re) is _{(u r ρ f D p)} / μ (u
_r : relative velocity between fluid and particles). The terminal sedimentation velocity (V _f ) is given by

(Equation 2) (Where _CR : resistance coefficient). Where Re <
At 0.4, C _R Ｃ24 / Re = 24 μ / (V _f ρ _f D
_p ). Therefore, the above equation (1) is derived.

According to the present invention, since the filler (X) having a lower sedimentation speed than the high dielectric constant filler is contained, the sedimentation of the high dielectric constant filler is suppressed by the filler (X). Even if the high-permittivity filler is settled, the high-permittivity filler does not solidify due to the presence of the filler (X), so that the filler has good re-dispersibility. Become. Therefore, it is not necessary to prepare a resin composition or a resin varnish every time it is used, so that the work efficiency is increased, and it is easy to collect and reuse the resin composition or the resin varnish. Can be. Then, using this resin composition, a high dielectric constant filler is uniformly dispersed, and a resin layer having uniform electric characteristics can be formed.

[0006] A resin varnish according to the present invention contains the resin composition of the present invention and a solvent. Therefore, as described above, the high dielectric constant filler is unlikely to settle, and its redispersibility is good, so that a resin varnish can be provided.

[0007] The resin film according to the present invention comprises the resin composition of the present invention. Therefore, a film in which the high dielectric constant filler is uniformly dispersed is obtained, and can be suitably used as an insulating film for various electronic components, an adhesive film, or a prepreg for a wiring board.

A wiring board according to the present invention is a wiring board including an insulating layer and a wiring conductor, wherein the insulating layer has a resin, a high dielectric constant filler, and a lower sedimentation speed than the high dielectric constant filler. It is characterized by comprising a resin composition containing a filler (X). That is, since the insulating layer is composed of the resin composition of the present invention, by adjusting the composition, an insulating layer having a dielectric constant suitable for the intended use can be easily obtained. For example, by using this insulating layer as the resin layer corresponding to the capacitor, it is possible to provide a multilayer wiring board with a built-in capacitor with high functionality and capacitors with various capacities that can supply a stable power supply voltage. Since it is not necessary to mount a large number of capacitance elements, it is possible to reduce the number of circuit elements to be mounted and to further reduce the size of the electronic component. Further, from the viewpoint of impedance matching, the wiring width can be reduced, and the line length can be reduced in a resonance circuit such as an antenna or a stub, so that the size can be reduced. The wiring board of the present invention can be suitably used also as a semiconductor mounting substrate for a semiconductor package. The structure of the wiring board may be a single layer or a multilayer.

The method for manufacturing a wiring board according to the present invention includes: (1) a step of forming a first insulating layer made of the resin composition according to the present invention; and (2) a step of forming a first wiring conductor on the first insulating layer. Forming step. Further, the method further includes (3) a step of forming a second insulating layer on the first wiring conductor, and (4) a step of forming a second wiring conductor on the second insulating layer. Can be manufactured. Second
The resin composition of the present invention can also be preferably used for forming an insulating layer.

In a semiconductor package according to the present invention, a substrate for mounting a semiconductor and a semiconductor chip mounted on the substrate for mounting a semiconductor are sealed by a sealing resin. It is characterized by being made of a plate. Further, another semiconductor package according to the present invention is characterized in that the sealing resin comprises the resin composition of the present invention.

The method of manufacturing a semiconductor package according to the present invention includes: (1) a step of mounting a semiconductor chip on a semiconductor mounting substrate; and (2) a step of mounting the semiconductor mounting substrate and the semiconductor chip using the resin composition according to the present invention. And sealing the substrate. Another method for manufacturing a semiconductor package according to the present invention uses a resin varnish, and (1)
Mounting a semiconductor chip on a semiconductor mounting substrate;
(2) a step of sealing the semiconductor mounting substrate and the semiconductor chip with the resin varnish according to the present invention, and (3) a step of removing a solvent in the varnish.

A wiring board according to the present invention has a half package mounted on the wiring board according to the present invention. Further, another semiconductor package mounting wiring board according to the present invention is one in which the semiconductor package according to the present invention is mounted on a wiring board. In addition, it is also preferable to provide a wiring board according to the present invention, in which the semiconductor package according to the present invention is mounted on the wiring board according to the present invention.

A wiring board material according to the present invention includes a resin layer and a carrier film, and the resin layer is made of the resin composition according to the present invention.

The method for producing a wiring board material according to the present invention comprises:
The method includes (1) a step of applying the resin varnish according to the present invention to a carrier film, and (2) a step of removing a solvent in the varnish.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION The resin composition according to the present invention comprises a resin (base resin), a high dielectric constant filler, and a filler (X) having a lower sedimentation rate than the high dielectric constant filler. It is a thing. As the resin, one or more appropriate thermosetting resins or thermoplastic resins can be used according to the use of the composition, and among them, a thermosetting resin can be preferably used. Specifically, a thermosetting resin which is conventionally used by impregnating a glass cloth base material is preferable, and examples thereof include an epoxy resin, a bistriazine resin, a polyimide resin, a phenol resin, a melamine resin, a silicon resin, and an unsaturated polyester. Resins, cyanate ester resins, isocyanate resins, or modified resins thereof can be used. Above all, in improving the characteristics of the laminate,
Particularly, an epoxy resin, a polyimide resin, or a bistriazine resin is preferable.

Further, any epoxy resin may be used as long as it has an epoxy group in the molecule. Bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenol novolac epoxy resin Epoxy resin, cresol novolak epoxy resin, bisphenol A novolak epoxy resin, salicylaldehyde novolak epoxy resin, bisphenol F novolak epoxy resin, alicyclic epoxy resin, glycidyl ester epoxy resin, glycidylamine epoxy resin, hydantoin type Epoxy resin, isocyanurate type epoxy resin,
Aliphatic cyclic epoxy resins, and their alkyl-substituted products, halides, hydrogenated products, etc.
More than one species can be used. Among them, bisphenol A novolak epoxy resin and salicylaldehyde novolak epoxy resin are preferable because of their excellent heat resistance.

As the curing agent for such resins, those conventionally used for each resin can be used. When the resin is an epoxy resin, for example, one or more of dicyandiamide, bisphenol A, bisphenol F, polyvinyl phenol, novolak resin, bisphenol A novolak resin, and halides of these phenol resins can be used. Among them, bisphenol A novolak resin is preferable because of its excellent heat resistance. As long as the curing agent can advance the curing reaction,
There is no particular limitation. For example, in the case of an epoxy resin, preferably, 0.0 mol per 1 mol of epoxy group.
In the range of 1 to 5.0 equivalents, particularly preferably 0.8 to 1.0 equivalent.
It can be used in a range of 2 equivalents, and is preferably in a range of 2 to 100 parts by weight based on 100 parts by weight of the resin.
The amount of dicyandiamide is preferably 2 to 5 parts by weight, and the amount of other curing agents is preferably 30 to 80 parts by weight.

Further, a curing accelerator can be used in the resin composition. When the resin is an epoxy resin, an imidazole compound, an organic phosphorus compound, a tertiary amine, a quaternary ammonium salt, or the like can be used. . The ratio of the curing accelerator to the resin may be a conventionally used ratio, and is preferably in the range of 0.01 to 20 parts by weight, more preferably 0.1 to 1.0, relative to 100 parts by weight of the resin. . The curing reaction of the thermosetting resin may be performed at any temperature as long as the reaction proceeds.
It is preferable to cure in the range of ° C. This curing reaction can be performed under pressure, under atmospheric pressure, or under reduced pressure.

Examples of the thermoplastic resin include polyethylene, polypropylene, polyolefin resins such as 4-methylpentene-1 resin, polybutene-1 resin and high-pressure ethylene copolymer, styrene resins, polyvinyl chloride, and the like.
Polyvinylidene chloride, polyvinyl alcohol, polyacrylonitrile, polyacrylic plastic, diene plastic, polyamide, polyester, polycarbonate, polyacetal, fluorine resin, polyurethane plastic, and polystyrene thermoplastic elastomer, polyolefin thermoplastic elastomer,
Polyurethane-based thermoplastic elastomers can be exemplified,
These can be used alone or in combination of two or more.

As the high dielectric constant filler, any filler can be used as long as it can give a desired dielectric constant to the resin composition, and the relative dielectric constant is preferably 100 (normal temperature, 1 MHz) or more. Further, it is preferably at least 300, more preferably at least 1,000. Specifically, it may be at least one selected from the group consisting of barium titanate, strontium titanate, calcium titanate, lead titanate, barium zirconate, calcium zirconate, barium stannate, and calcium stannate. preferable. What has been surface-treated with a coupling agent in advance can also be used. As for the shape of the filler, any shape such as a granular shape, an amorphous shape, and a flake shape can be used in any combination. The particle size (average particle size) is
It is preferably about 0.1 to 20 μm,
More preferably, it is about 10 μm.

By adjusting the kind and amount of the high dielectric constant filler as described above, the desired dielectric constant can be given to the obtained resin layer. For example, in the case of large-capacity, medium-capacity and small-capacity capacitor applications, the relative permittivity of the resin composition after curing is 50, respectively.
It is preferably at least 20, 10 (normal temperature, 1 MHz).

The filler (X) used to suppress the sedimentation of the high dielectric constant filler has a lower sedimentation rate than the high dielectric constant filler. The difference in the sedimentation velocity between the two fillers can be found in _Vf of the above formula (1) by (filler (X)
Preferably V _f) / (V _f of the high dielectric constant _filler) of is 1/2 or less, the value of this ratio is more preferably 1
/ 10 or less, more preferably 1/20 or less. Due to such different sedimentation velocities, the filler (X) is arranged so as to surround the periphery of the high dielectric constant filler or fill the gap between the high dielectric constant fillers. It is considered that the sedimentation of the soil can be suppressed. The difference in the sedimentation speed as described above may be based on the difference in specific gravity between the two fillers, or may be based on the difference in particle size (average particle size). May be based on the difference between the two. If they have the same specific gravity (the same compound), the particle size of the filler (X) is about 1/3 or less, preferably 1/1, of the particle size of the high dielectric constant filler.
0 or less, and if the particles have the same particle size, if the specific gravity differs by 1 or more (if the filler (X) is smaller), the sedimentation of the high dielectric constant filler is suppressed. The effect can be obtained.

Specifically, as the filler (X), silica, alumina, titanium dioxide, zirconia, mullite,
Cordierite, magnesia, clay, talc, barium sulfate and the like. Further, it is preferable to use a filler having a high dielectric constant such as the above-mentioned metal oxide as the filler (X), since the dielectric constant of the obtained resin composition can be maintained and further increased. The same type of filler as the high dielectric constant filler can be used because it is difficult to settle by reducing the particle size. These fillers (X) may be previously surface-treated with a coupling agent.

The amount of the high dielectric constant filler and the filler (X) to be added to the resin may be appropriately set in accordance with the required dielectric constant. Preferably, the agent is contained in a total amount of 100 to 3000 parts, more preferably 200 to 1000 parts by weight. In addition, from the viewpoint of sufficiently suppressing the sedimentation of the high dielectric constant filler, the filler (X) is preferably contained in an amount of 10 to 200 parts by weight, preferably 20 to 100 parts by weight, based on 100 parts by weight of the high dielectric constant filler. A range of parts by weight is more preferred. Most preferably, the high dielectric constant filler is 200 to 700 parts by weight, and the filler (X) is 80 to 100 parts by weight of the resin.
Those containing up to 200 parts by weight are selected.

The above resin, the high dielectric constant filler and the filler (X) are essential constituents of the resin composition. In a preferred embodiment, this resin composition is used in another preferred embodiment. Agent). Further, the additional component may be a filler (for example, aluminum hydroxide or the like) other than the high dielectric constant filler and the filler (X). Other components, for example, between different materials,
In particular, a coupling agent can be blended in order to improve the interfacial bonding with the copper foil. As the coupling agent, a silane coupling agent is preferable. Such silane coupling agents include γ-glycidoxypropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-
Ureidopropyltriethoxysilane, N-β-aminoethyl-γ-aminopropyltrimethoxysilane and the like can be used. The amount of the coupling agent is preferably 0.05 to 10 parts by weight based on 100 parts by weight of the resin,
More preferably, it is 0.1 to 2 parts by weight.

When the resin composition of the present invention is used as a prepreg, a ceramic whisker can be added. Such a ceramic whisker preferably has an elastic modulus of 200 GPa or more from the viewpoint of imparting sufficient rigidity when used as a wiring board material or a wiring board. For example, one or more selected from aluminum borate, wollastonite, potassium titanate, basic magnesium sulfate, silicon nitride, and α-alumina can be used. Further, the resin composition includes a catalyst, an elastomer, a flame retardant, a release agent,
A commonly used additive such as an adhesiveness-imparting agent, a stress relieving agent, and a coloring agent can be arbitrarily added in an appropriate amount. In order to improve insulation reliability at the time of absorbing moisture, an ion supplement may be added.

The resin composition is prepared by adding a solvent as described below to the above components when the resin is not liquid,
It can be prepared by uniformly mixing with a mixer or the like by a known method. All of the various components may be added at the same time, but the order of addition may be appropriately set, and if necessary, some components may be preliminarily kneaded.

Next, the resin varnish of the present invention contains the above resin composition and a solvent. This solvent can be appropriately selected depending on the type of the resin, the use of the composition, and the like. For example, acetone, methyl ethyl ketone, toluene, xylene, methyl isobutylene, ethyl acetate, ethylene glycol monomethyl ether, methanol, ethanol, N, N-dimethylformamide, N, N-dimethylacetamide and the like can be used alone or in combination of two or more. A resin varnish can be produced by adding a filler to a varnish comprising a resin and a solvent, and optionally adding an additive, mixing and stirring by an arbitrary method, and uniformly dispersing the filler and the like in the varnish. . The ratio of the solvent to the resin composition can be appropriately set according to the type of the resin, the amount of the filler, the coating method, and the like.
From the viewpoint of workability, based on 100 parts by weight of the resin composition,
The range is preferably 40 to 900 parts by weight, and 100 to 600 parts by weight.
A range of parts by weight is more preferred.

The resin film of the present invention is obtained from the resin composition of the present invention. When the resin composition is in a liquid state, it can be used as it is or as a resin varnish by adding a solvent, and can be formed by any method. . For example, it can be formed by applying a resin varnish (or a liquid resin composition) to one surface of a substrate such as a copper foil and removing the solvent by heating and drying. Varnish can be applied by applying a shearing force in a direction parallel to the substrate such as a blade coater, a rod coater, a knife coater, a squeeze coater, a reverse roll coater, a transfer roll coater, or perpendicular to the surface of the substrate. A coating method capable of applying a compressive force in any direction can be adopted. Dry at about 130-150 ° C for 2-30
It is preferable that the heat treatment is carried out for about a minute so that the thermosetting resin is in a semi-cured state without stickiness. When a resin film is used as a prepreg, a commonly used base material such as glass cloth or paper is impregnated with a resin varnish and dried to evaporate the solvent and at the same time advance the curing of the resin to some extent. (A semi-cured state in which the material is melt-softened by pressing).

Next, an electronic component using the resin composition or the resin varnish of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view schematically showing one embodiment of a wiring board according to the present invention. The wiring board (1) includes an insulating layer or a first insulating layer (11) and a wiring conductor or a first wiring conductor (21). The insulating layer (11) includes a resin,
The resin composition of the present invention includes the high dielectric constant filler and the filler (X) having a lower sedimentation rate than the high dielectric constant filler. Although not shown in the drawing, the wiring conductor (21) may be formed on both surfaces of the insulating layer (11). FIG. 2 is a sectional view schematically showing another embodiment of the wiring board according to the present invention. The wiring board (2) is a multilayer wiring board including a first insulating layer (11), a first wiring conductor (21), a second insulating layer (12), and a second wiring conductor (22). Insulating layer (11) and second insulating layer (12)
At least one of them is composed of the resin composition of the present invention described above. Although not shown in the figure, third, fourth, fifth, etc. insulating layers and wiring conductors may be alternately laminated.

In the case of a multilayer wiring board, at least any one of the insulating layers only needs to be composed of the resin composition of the present invention. Can also be used. On the other hand, the resin layer corresponding to the circuit portion includes a resin having a low dielectric constant, for example, a polyphenylene oxide resin, a polybutadiene resin,
It is also possible to use a fluororesin or the like to form a high-density multilayer board.

The manufacture of the wiring board includes a step of forming a first insulating layer (11) and a step of forming a first wiring conductor (21) on at least one surface of the first insulating layer (11). In the case of a multilayer delivery board, a step of forming a second insulating layer (12) on the first wiring conductor (21) and a step of forming the second insulating layer (1) are further performed.
2) forming a second wiring conductor (22). The insulating layer can be formed by any known method, and a resin varnish may be applied and dried, or a resin film may be laminated and pressed.

As the wiring conductor, any conductor such as copper, silver, gold, aluminum, chromium, tungsten, and molybdenum can be used. These can be used as metal foil or formed on an insulating layer by vapor deposition, plating, etc., an inner layer circuit is formed by a subtractive method or an additive method, interconnected by through holes, and each is wired Layer, a ground layer, and a power supply layer. The wiring structure may be any of single-sided wiring, double-sided wiring, and multilayer wiring, and can be selected as needed. The wiring board may be used for mounting a semiconductor package or may be used as a substrate for mounting a semiconductor chip in a semiconductor package.

FIG. 3 is a sectional view schematically showing one embodiment of a semiconductor package according to the present invention. The semiconductor package (3) includes a semiconductor mounting substrate (10) and a semiconductor chip (30) mounted on the semiconductor mounting substrate (10) sealed with a sealing resin (40). here,
Whether the semiconductor mounting substrate (10) is a wiring board using the resin composition according to the present invention (that is, the wiring board according to the present invention),
Alternatively, it is configured such that the sealing resin (40) is the resin composition according to the present invention. Alternatively, it is also preferable that both the semiconductor mounting substrate (10) and the sealing resin (40) use the resin composition of the present invention. The semiconductor chip may be a semiconductor chip of an individual device or a semiconductor chip as a monolithic IC. In the latter case, a passive element and an active element mounted on the semiconductor chip can be used.

The method of manufacturing a semiconductor package includes a step of mounting a semiconductor chip on a substrate for mounting a semiconductor, a step of sealing a sealing resin (the resin composition of the present invention) and sealing the substrate and the semiconductor chip. , Including. When a resin varnish is used as a sealing resin, a step of mounting a semiconductor chip on a semiconductor mounting substrate, and sealing the resin varnish for sealing (the resin varnish of the present invention) to seal the substrate and the semiconductor chip. Stopping and removing the solvent in the varnish. Each step can be performed by a conventionally known method. As a method of sealing the element, a transfer molding method is most common, but an injection molding method,
A compression molding method or the like may be used. The molding conditions can be appropriately set according to the application, but it is preferable that the molding temperature is 160 to 220 ° C., the molding pressure is 2 to 12 MPa, and the molding time is 1 to 10 minutes.

FIG. 4 is a cross-sectional view schematically showing one embodiment of a wiring board mounted with a semiconductor package according to the present invention.
The semiconductor package mounting wiring board (4) is obtained by mounting the semiconductor package (3) on the wiring board (2).
At least one of the wiring board and the semiconductor package is the wiring board according to the present invention or the semiconductor package according to the present invention. Although a multi-layer wiring board is shown in the figure, a single-layer wiring board may be used.

FIG. 5 is a sectional view schematically showing one embodiment of the wiring board material according to the present invention. The wiring board material (5) includes a carrier film (50) and a resin layer (11) made of the resin composition according to the present invention. For the wiring board material, the resin composition of the present invention may be applied to a carrier film, or the resin film of the present invention may be laminated and pressed. When the resin varnish of the present invention is used, the method includes a step of applying the resin varnish to the carrier film and a step of removing the solvent in the varnish. Each step can be performed by a conventionally known method.

In addition to the above, the resin composition of the present invention can be used as a single electronic component such as a film capacitor, an LCR, a filter, and an oscillator.

[0039]

EXAMPLES In the following examples, "parts" means "parts by weight".
Represents [Examples 1 to 4, Comparative Example] As a resin varnish, an epoxy resin (YL-6262 manufactured by Yuka Shell Co., Ltd.) 100
Parts, dicyandiamide 3 parts, methyl ethyl ketone 27
And 27 parts of methylcellosolve. As a high dielectric constant filler, barium titanate (manufactured by Fuji Titanium Industry Co., Ltd. BT-100M, _{D p} (particle size): 1.50μ
m, ρ _p (particle density): 6.00 g / cm ³ )
As the filler (X), titanium dioxide (TM-1, manufactured by Fuji Titanium Co., Ltd., D _p : 0.40 μm, ρ _p : 4.2)
5g / ^cm 3), strontium titanate (Fuji Titanium Industry Co., Ltd., _{ST, D p: 1.10μm, ρ} p: 4.
90 g / cm ³ ), antimony trioxide (PATOX-U manufactured by Nippon Seiko Co., Ltd., D _p : 0.04 μm, ρ _p : 5.
20 g / cm ³ ).

The above components were blended in the composition shown in Table 1,
Using a bead mill, container 500ml, beads 150m
1. The thermosetting resin compositions of Examples and Comparative Examples were prepared at room temperature under the conditions of 1, 200 ml of sample, and 1000 rpm / 1 hour.

Fluid density, fluid viscosity, settling speed of filler (X), settling speed and settling days of barium titanate, settling time (days) of comparative examples
Was set to 1, the sedimentation time ratio of barium titanate and the redispersibility of barium titanate in Examples were determined. The number of days for sedimentation and redispersibility were visually evaluated. In the latter, the composition was placed in a plastic bottle, covered with a lid, and shaken.
Table 1 shows the results.

[0042]

[Table 1] In the composition of the comparative example containing no filler (X), the high dielectric constant filler was liable to settle, and the settled filler was solidified at the bottom of the container and could not be redispersed. On the other hand, in the composition of the example containing the filler (X),
It was found that the sedimentation of the high dielectric constant filler was suppressed and the dispersibility was excellent, and that the filler was easily redispersed after the sedimentation by re-stirring.
In particular, in Example 2, the high-dielectric-constant filler did not settle until 90 days, showing an excellent anti-settling effect.

[0043]

The resin composition of the present invention has a high dielectric constant filler that is unlikely to settle and has excellent redispersibility once the filler has settled. The work efficiency of the product or resin varnish can be improved by eliminating the trouble of preparing the product or resin varnish, and it is easy to collect and reuse the product or resin varnish. Then, using this resin composition, an insulating resin layer in which a high dielectric constant filler is uniformly dispersed can be formed. It can be an electronic component.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a wiring board of the present invention.

FIG. 2 is a sectional view showing another embodiment of the wiring board of the present invention.

FIG. 3 is a cross-sectional view showing one embodiment of the semiconductor package of the present invention.

FIG. 4 is a cross-sectional view showing one embodiment of a wiring board mounted with a semiconductor package of the present invention.

FIG. 5 is a cross-sectional view showing one embodiment of a wiring board material of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wiring board 2 Wiring board 11 Insulating layer 21 Wiring conductor 3 Semiconductor package 4 Semiconductor package mounting wiring board 5 Material for wiring board

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/46 H05K 3/46 B H01L 23/14 R (72) Inventor Masanori Yamaguchi Ogawa Oaza, Shimodate City, Ibaraki Prefecture 1500, Hitachi Chemical Co., Ltd.Research Laboratory (72) Inventor Yasushi Shimada 1500, Oji Ogawa, Shimodate City, Ibaraki Pref.Hitachi Chemical Industry Co., Ltd. Kazunori Yamamoto, Inventor, Kazunori Industrial Co., Ltd. 1500 Ogawa, Oaza, Shimodate-shi, Ibaraki Pref.Hitachi Kasei Kogyo Co., Ltd. BC031 BD031 BD101 CC031 CC181 CD001 CD021 CD051 CD061 CD091 CD131 CD141 CF211 CM041 CM051 CP031 DE0 77 DE097 DE137 DE147 DE186 DG047 DJ017 DJ037 DJ047 FD016 FD017 GQ00 5E346 AA12 AA13 AA15 AA32 AA33 AA51 CC08 CC16 CC21 CC32 CC38 CC39 DD02 DD03 EE09 EE31 EE35 GG18 GG19 GG22 GG28 HH31

Claims (23)

[Claims] 1. A resin composition comprising a resin, a high dielectric constant filler, and a filler (X) having a lower sedimentation rate than the high dielectric constant filler. 2. The resin composition according to claim 1, wherein the sedimentation speed of the filler (X) is 0.5 or less when the sedimentation speed of the high dielectric constant filler is 1. 3. The high dielectric constant filler has a relative dielectric constant of 100.
The resin composition according to claim 1 or 2, which is the above. 4. The high dielectric constant filler is selected from the group consisting of barium titanate, strontium titanate, calcium titanate, lead titanate, barium zirconate, calcium zirconate, barium stannate, and calcium stannate. The resin composition according to any one of claims 1 to 3, which is at least one kind. 5. The filler (X) is at least one selected from the group consisting of silica, alumina, titanium dioxide, zirconia, mullite, cordierite, magnesia, clay, talc, and barium sulfate. 5. The resin composition according to any one of items 1 to 4. 6. The resin composition according to claim 1, wherein the filler (X) has a lower specific gravity than the high dielectric constant filler. 7. The resin composition according to claim 1, wherein the filler (X) has a smaller particle diameter than the high dielectric constant filler. 8. A total of 100 to 3000 parts by weight of the high dielectric constant filler and the filler (X) based on 100 parts by weight of the resin.
The resin composition according to any one of claims 1 to 7, which is contained in parts by weight. 9. The resin composition according to claim 1, wherein the filler (X) is contained in an amount of 10 to 200 parts by weight based on 100 parts by weight of the high dielectric constant filler. 10. A resin varnish comprising the resin composition according to claim 1 and a solvent. 11. The resin varnish according to claim 10, wherein the solvent is contained in an amount of 40 to 900 parts by weight based on 100 parts by weight of the resin composition. 12. A resin film comprising the resin composition according to claim 1. 13. A wiring board including an insulating layer and a wiring conductor, wherein the insulating layer is made of a resin, a high dielectric constant filler, and a filler (X) having a lower sedimentation speed than the high dielectric constant filler. A wiring board comprising a resin composition comprising: 14. A step of forming a first insulating layer made of a resin composition containing a resin, a filler having a high dielectric constant, and a filler (X) having a lower sedimentation rate than the filler having a high dielectric constant, Forming a first wiring conductor on the first insulating layer. 15. The method of manufacturing a wiring board according to claim 14, further comprising: forming a second insulating layer on the first wiring conductor; and forming a second wiring conductor on the second insulating layer. . 16. A semiconductor package in which a semiconductor mounting substrate and a semiconductor chip mounted on the semiconductor mounting substrate are sealed with a sealing resin, wherein the semiconductor mounting substrate includes an insulating layer and a wiring. A semiconductor package including a conductor, wherein the insulating layer is formed of a resin composition including a resin, a filler having a high dielectric constant, and a filler (X) having a lower sedimentation rate than the filler having a high dielectric constant. 17. A semiconductor package in which a semiconductor mounting substrate and a semiconductor chip mounted on the semiconductor mounting substrate are sealed with a sealing resin, wherein the sealing resin is made of a resin A semiconductor package which is a resin composition comprising a dielectric filler and a filler (X) having a lower sedimentation rate than the high dielectric filler. 18. A resin composition comprising: a step of mounting a semiconductor chip on a semiconductor mounting substrate; a resin; a high dielectric constant filler; and a filler (X) having a lower sedimentation velocity than the high dielectric constant filler. Sealing the semiconductor mounting substrate and the semiconductor chip with an object. 19. A step of mounting a semiconductor chip on a semiconductor mounting substrate, a resin, a high dielectric constant filler, a filler (X) having a lower sedimentation velocity than the high dielectric constant filler, and a solvent. A method of manufacturing a semiconductor package, comprising: a step of sealing the semiconductor mounting substrate and a semiconductor chip with a resin varnish containing the same; and a step of removing the solvent. 20. A wiring board on which a semiconductor package is mounted on the wiring board according to claim 13. 21. A wiring board on which a semiconductor package according to claim 16 is mounted on a wiring board. 22. A wiring board material including a resin layer and a carrier film, wherein the resin layer has a resin, a high dielectric constant filler, and a filler having a lower sedimentation velocity than the high dielectric constant filler. X) and a resin composition containing the same. 23. A step of applying a resin varnish containing a resin, a high dielectric constant filler, a filler (X) having a lower sedimentation speed than the high dielectric constant filler, and a solvent to the carrier film. And a step of removing the solvent.