JP4366785B2 - Adhesive sheet, production method thereof, multilayer printed wiring board using the adhesive sheet, and production method thereof - Google Patents
Adhesive sheet, production method thereof, multilayer printed wiring board using the adhesive sheet, and production method thereof Download PDFInfo
- Publication number
- JP4366785B2 JP4366785B2 JP30035499A JP30035499A JP4366785B2 JP 4366785 B2 JP4366785 B2 JP 4366785B2 JP 30035499 A JP30035499 A JP 30035499A JP 30035499 A JP30035499 A JP 30035499A JP 4366785 B2 JP4366785 B2 JP 4366785B2
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- Prior art keywords
- resin
- wiring board
- adhesive sheet
- printed wiring
- layer circuit
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- 239000000853 adhesive Substances 0.000 title claims description 23
- 230000001070 adhesive effect Effects 0.000 title claims description 23
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 229920005989 resin Polymers 0.000 claims description 69
- 239000011347 resin Substances 0.000 claims description 69
- 239000000945 filler Substances 0.000 claims description 47
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 239000011889 copper foil Substances 0.000 claims description 17
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 claims description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims description 12
- 239000002966 varnish Substances 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 description 23
- 229920000647 polyepoxide Polymers 0.000 description 23
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 18
- 229920003986 novolac Polymers 0.000 description 14
- 239000004020 conductor Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 239000004744 fabric Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- -1 zircoaluminum Chemical compound 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 3
- 239000012765 fibrous filler Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- CRQJERFKOCCFPE-UHFFFAOYSA-N 5-methyl-1,3-bis(piperidin-1-ylmethyl)-1,3,5-triazinane-2-thione Chemical compound S=C1N(CN2CCCCC2)CN(C)CN1CN1CCCCC1 CRQJERFKOCCFPE-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- RJDOZRNNYVAULJ-UHFFFAOYSA-L [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] RJDOZRNNYVAULJ-UHFFFAOYSA-L 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明は、多層プリント配線板に用いる接着剤シートとその製造法およびその接着剤シートを用いた多層プリント配線板とその製造法に関する。
【０００２】
【従来の技術】
半導体チップ等の電子部品は、その回路の集積密度が非常に高くなっており、このような電子部品が搭載されるプリント配線板にも、配線の高密度化のために多層化や配線精度の向上が行われている。
多層プリント配線板は、通常、予め複数の基板に導体回路を形成し、その複数の基板の間にプリプレグを挟み、互いに位置合わせをして重ね、加熱・加圧して積層一体化されて製造されているが、プリプレグに、今まで使用されていたようなガラスクロスプリプレグを用いると、厚さの調整が困難になるという問題があった。
【０００３】
そこで、ガラスクロスのような補強材を用いないで、樹脂だけを用いて絶縁層を形成することが提案されている。
このような絶縁層を樹脂だけで構成して、多層プリント配線板を製造するには、キャリアフィルムや銅箔の表面に未硬化の絶縁樹脂ワニスを、塗布し、加熱・乾燥して半硬化させた接着剤シートを用いるのが効率的である。
このような接着剤シートを用いて、たとえば、内層回路を形成した基板上に重ね、加熱・加圧して積層一体化し、バイアホールとなる箇所を炭酸ガスレーザー等のレーザ光で穴あけした後に、必要な箇所にのみめっきすることにより、外層回路を形成すると共に内層回路と外層回路とを電気的に接続することによって、多層プリント配線板を製造できる。
【０００４】
【発明が解決しようとする課題】
ところが、このような接着剤シートは、ガラスクロスのような補強材を有さないため折れ曲がりやすく取り扱いが難しいという課題があった。また、絶縁層が樹脂のみで構成されているため、熱膨張率が大きく、配線板を製造する途中での寸法変化が大きく、各絶縁層の穴や導体層の接続端子の位置合わせが困難になるという課題があった。
【０００５】
その絶縁層の熱膨張率を低下させ、寸法変化を小さくする解決手段として、樹脂に高分子化した樹脂を用いたり、樹脂に繊維状のフィラーを混入する方法が提案されているが、高分子化した樹脂を用いた場合には、内層回路の回路導体間を空隙がなく埋まるようにするほどの流動性を付与することが困難で、その空隙が後の工程ではんだリフローなどの電子部品を搭載するときに膨張して剥離してしまうという課題があり、また、繊維状のフィラーを充填させた樹脂を用いた場合には、繊維の長さ方向を常に同じ方向に揃えることができず、縦横の熱膨張率が製造するたびに異なるため、製品ごとあるいは製造ロットごとに熱膨張率を測定しながら各絶縁層の穴や導体層の接続端子の位置合わせのための治工具を作ることが困難なため実用的でないという課題があった。
【０００６】
本発明は、内層回路の回路導体間を空隙なく埋めることができる程度に流動性を有し、熱膨張率が一様に低く、かつ適当な剛性があって多層プリント配線板を製造するときの作業性に優れた接着剤シートとその製造法およびその接着剤シートを用いた多層プリント配線板とその製造法を提供することを目的とする。
【０００７】
【課題を解決するための手段】
本発明の接着剤シートは、銅箔またはキャリアフィルムと絶縁樹脂層からなり、絶縁樹脂層が形状の異なる２種類以上のホウ酸アルミニウムをフィラーとして含むことを特徴とする。
【０００８】
また、本発明の接着剤シートの製造法は、熱硬化性樹脂中に、形状の異なる２種類以上のホウ酸アルミニウムをフィラーとして分散させた樹脂ワニスを、銅箔またはキャリアフィルムの片面に塗布し、加熱・半硬化することを特徴とする。
【０００９】
また、本発明の多層プリント配線板は、内層回路と、外層回路と、その内層回路と外層回路を接続するバイアホールと、内層回路と外層回路を絶縁する絶縁層に形状の異なる２種類以上のホウ酸アルミニウムをフィラーとして含むことを特徴とする。
【００１０】
また、本発明の多層プリント配線板の製造法は、熱硬化性樹脂中に、形状の異なる２種類以上のホウ酸アルミニウムをフィラーとして分散させた樹脂ワニスを、銅箔またはキャリアフィルムの片面に塗布し、加熱・半硬化した接着剤シートを、内層回路板に、樹脂が接するように重ね、加熱・加圧して積層一体化し、バイアホールを形成し、外層回路を形成することを特徴とする。
【００１１】
【発明の実施の形態】
フィラーには、繊維状、球状、鱗片状、不定形等の形状のフィラーが使用でき、しかも、異なる形状の２種類以上のフィラーを用いる。たとえば、一方のフィラーに、フィルム形成能を持たせるために、鱗片状フィラーや、繊維状フィラーを用い、それに組み合わせるフィラーには、繊維長が短いフィラーを用いることが好ましく、さらに、球状のフィラーを用いることがより好ましい。
【００１２】
また、フィラーの直径は、１〜１００μｍの範囲であることが好ましく、１μｍ未満では、剛性が得られず、作業性が低下し、１００μｍを越えると、導体回路と接触したフィラーが他の導体回路と接触する確率が高くなり、フィラーに沿って発生する銅イオンのマイグレーションによる回路間短絡事故を起こす可能性がある。
また、組み合わせるフィラーは、一方のフィラーの直径の１／２以下のものが好ましく、１／３以下のものがより好ましい。下限は、上記フィラーの直径と同じである。この組み合わせるフィラーが、一方のフィラーの直径の１／２を越えると、樹脂中に占めるフィラーの割合を大きくできず、フィラーの混合による特性の改善の効果に乏しくなる。
【００１３】
フィラーの平均粒子径は、予め目的とする大きさのものを用いても良いし、破砕等の一般的な方法、例えばボールミルやビーズミル、ナノメーカやナノマイザー等のせん断力がかかる一般的な装置を用いて、調整することができる。
【００１４】
ウィスカーの種類としては、ホウ酸アルミニウム、ウォラストナイト、チタン酸カリウム、塩基性硫酸マグネシウム、酸化マグネシウム、窒化けい素、水酸化アルミニウム、α−アルミナ、タルク等から選ばれた１種類以上のものを用いることができる。その中でも、ホウ酸アルミニウムは熱膨張係数が小さく、しかも比較的安価であるため、ホウ酸アルミニウムを用いることが好ましい。
【００１５】
用いるフィラーの配合比はどのように設定してもよく、繊維状、鱗片状等フィルム形成能を持たせるためのフィラーが少なくとも、加えるフィラーの４０重量％〜９０重量％の範囲であることが好ましい。フィルム形成能を持たせるためのフィラーが４０重量％未満であると、作製した樹脂ワニスをフィルム状に形成するのが困難となり、取り扱い性が低くなる可能性があり、６０重量％以上であればより好ましい。
【００１６】
また、プリント配線板の剛性及び耐熱性をさらに高めるのに、シランカップリング剤で表面処理したフィラーを使用することも有効である。カップリング剤で表面処理したフィラーは、樹脂との濡れ性、結合性が優れ剛性及び耐熱性を向上させることができる。このとき使用するカップリング剤は、シリコン系、チタン系、アルミニウム系、ジルコニウム系、ジルコアルミニウム系、クロム系、ボロン系、リン系、アミノ酸系等の公知のものを使用できる。
【００１７】
樹脂には、従来のガラスクロスを基材としたプリプレグに使用されている樹脂及びガラスクロス基材を含まない接着フィルムあるいは銅箔付き接着フィルムに使用されている熱硬化性樹脂を使用することができる。ここでいう樹脂とは、樹脂、硬化剤、硬化促進剤、カップリング剤（必要に応じて）、希釈剤（必要に応じて）を含むものを意味する。
【００１８】
樹脂の種類としては、例えばエポキシ樹脂、ビストリアジン樹脂、ポリイミド樹脂、フェノール樹脂、メラミン樹脂、けい素樹脂、不飽和ポリエステル樹脂、シアン酸エステル樹脂、イソシアネート樹脂、ポリイミド樹脂またはこれらの種々の変性樹脂類が好適である。この中で、プリント配線板特性上、特にビストリアジン樹脂、エポキシ樹脂が好適である。そのエポキシ樹脂としては、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ビスフェノールＳ型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビスフェノールＡノボラック型エポキシ樹脂、サリチルアルデヒドノボラック型エポキシ樹脂、ビスフェノールＦノボラック型エポキシ樹脂、脂環式エポキシ樹脂、グリシジルエステル型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、ヒダントイン型エポキシ樹脂、イソシアヌレート型エポキシ樹脂、脂肪族環状エポキシ樹脂及びそれらのハロゲン化物、水素添加物、及び前記樹脂の混合物が好適である。中でもビスフェノールＡノボラック型エポキシ樹脂またはサルチルアルデヒドノボラック型エポキシ樹脂は耐熱性に優れ好ましい。
【００１９】
このような樹脂の硬化剤としては、従来使用しているものが使用でき、樹脂がエポキシ樹脂の場合、例えばジシアンジアミド、ビスフェノールＡ、ビスフェノールＦ、ポリビニルフェノール、フェノールノボラック樹脂、ビスフェノールＡノボラック樹脂及びこれらのフェノール樹脂のハロゲン化物、水素化物等を使用できる。中でも、ビスフェノールＡノボラック樹脂は耐熱性に優れ好ましい。この硬化剤の前記樹脂に対する割合は、樹脂１００重量部に対して、２〜８０重量部の範囲が好ましく、さらには、ジシアンジアミドでは、２〜５重量部、それ以外の硬化剤では、２０〜７０重量部の範囲が好ましい。
【００２０】
硬化促進剤としては、樹脂がエポキシ樹脂の場合、イミダゾール化合物、有機リン化合物、第３級アミン、第４級アルモニウム塩等を使用する。この硬化促進剤の前記樹脂に対する割合は、樹脂１００重量部に対して、０．０１〜２０重量部の範囲が好ましく、０．１〜１．０重量部の範囲がより好ましい。
【００２１】
本発明の熱硬化性樹脂は、溶剤にて希釈して樹脂ワニスとして使用することもできる。溶剤には、アセトン、メチルエチルケトン、トルエン、キシレン、メチルイソブチルケトン、酢酸エチル、エチレングリコールモノメチルエーテル、メタノール、エタノール、Ｎ，Ｎ−ジメチルホルムアミド、Ｎ，Ｎ−ジメチルアセトアミド等を使用できる。
この希釈剤の前記に対する割合は、樹脂使用している割合でよく、樹脂１００重量部に対して１〜２００重量部の範囲が好ましく、３０〜１００重量部の範囲がさらに好ましい。
【００２２】
さらに本発明においては、樹脂中に上記した各成分の他に、必要に応じて従来より公知のカップリング剤、充填材等を適宜配合してもよい。
【００２３】
樹脂への電気絶縁性フィラーの配合量は、樹脂固形分１００重量部に対し５重量部未満であると、切断時に樹脂が細かく砕けて飛散しやすくなる等の取り扱い性が悪くなるとともに、配線板にしたときに十分な放熱性が得られない。一方フィラーの配合量が３５０重量部以上であると、熱圧成形時の内層回路の穴埋め性や回路間への樹脂充填性が損なわれ、熱圧成形後のフィラー複合樹脂層中にボイドやかすれが発生しやすくなり、配線板特性を損なう恐れがある。したがって、フィラーの配合量は、樹脂固形分１００重量部に対し５０〜３５０重量部が好ましい。さらに、内層回路の穴埋め性や回路間への樹脂充填性に優れ、なおかつ、製造した配線板が従来のガラスクロス使用のプリプレグを用いて製造した配線板と比較し、同等以上の剛性と寸法安定性とワイヤボンディング性を持つことが出来る理由から、フィラーの配合量は、樹脂固形分１００重量部に対し１００〜２３０重量部であることがより好ましい。
【００２４】
電気絶縁性ウィスカーを含む熱硬化性樹脂組成物の樹脂厚さは特に規定しないが、内層回路の内層銅厚さよりも厚いことが望ましい。内層銅厚さよりも薄い場合は、内層回路の充填性が不十分になるばかりでなく、かすれ等が発生しやすくなる。
【００２５】
【実施例】
実施例１
（電気絶縁性ウィスカーを含む熱硬化性樹脂組成物の作製）
ビスフェノールＡノボラック型エポキシ樹脂（エポキシ当量２１０）１００重量部とビスフェノールＡノボラック樹脂（エポキシ当量１２３）１００重量部、硬化促進剤としてジシアンジアミド１重量部をＭＥＫ８０重量部で希釈したワニスに主成分とする熱硬化性樹脂に平均直径０．８μｍ、平均繊維長２０μｍ、最大長さ３０μｍのホウ酸アルミニウムウィスカーと、平均粒径５μｍのホウ酸アルミニウム球状粒子（商品名アルボライト）を６：４で混合したものを、樹脂固形分１００重量部に対し１１０部になるように配合し、フィラーがワニス中に均一に分散するまで攪拌した。
このワニスを、厚さ１８μｍの銅箔にナイフコータにて塗工し、温度１５０℃で１０分間加熱乾燥して、溶剤を除去するとともに、熱硬化性樹脂を半硬化させた、ウィスカー体積分率が３０％の厚さが５０μｍの銅箔付き接着剤を作製した。この接着フィルムの樹脂流れは、ＭＩＬ法で２５％であった。
次に、厚さが２００μｍの銅箔に、銅箔付き接着剤をのせ、１７５℃、３ＭＰａで６０分間加熱、加圧して一体化した。その後、電食試験用の電極となるパターンをエッチングにより作製した。なお、実装部品の搭載部の絶縁層厚さは、測定の結果３０μｍであった。
【００２６】
実施例２
銅箔付き接着剤の作製時にサリチルアルデヒドノボラック型エポキシ樹脂（エポキシ当量２５０）１００重量部とビスフェノールＡノボラック樹脂を主成分とする熱硬化性樹脂（エポキシ当量１２３）２００重量部と使用した他は、実施例１と全く同様にして多層プリント配線板を作製した。
【００２７】
参考例１
フィラーの種類のうち、繊維状粒子を平均繊維長３０μｍのガラスフィラーに変更した他は、実施例１と同様の配合で多層プリント配線板を作製した。
【００２８】
参考例２
フィラーの組み合わせを、鱗片状の合成雲母と平均粒径が８μｍのアルミノシリケートに変更した他は、実施例１と同様の配合で多層プリント配線板を作製した。
【００２９】
比較例１
銅箔付き接着剤の作製時に用いるフィラーを針状のアルミナフィラーとした他は、実施例１と同様の配合で多層プリント配線板を作製した。なお、実装部品の搭載部の絶縁層厚さは、測定の結果３５μｍであった。
【００３０】
比較例２
銅箔付き接着剤の代わりに、６０μｍのプリプレグを使用した他は、実施例１と同様の配合で多層プリント配線板を作製した。なお、実装部品の搭載部の絶縁層厚さは、測定の結果４５μｍであった。
【００３１】
これらの方法で得られた多層プリント配線板は、表１のような特性を示した。
【００３２】
【表１】
試験方法を以下に示す。
・線膨張係数：ＪＩＳ Ｃ ６４８１のＴＭＡ法で、線膨張係数を測定。昇温速度は１０℃／分とした。
・半田耐熱性：２６０℃のフロートで、８０秒以上膨れないものを○とした。
・寸法変化率：１８μｍの銅箔に塗工して半硬化させたものと、０．６ｍｍの厚さのＦＲ−４基材とを１７５℃、３ＭＰａで６０分間加熱、加圧して一体化したものに、３００ｍｍ間隔の基準穴を四角形になるように４箇所穴をあけ、穴間距離を測定した。その後外層銅箔を全面エッチング後、１３０℃の乾燥機内で１時間乾燥し、再び基準点間の穴間距離を測定し、その寸法の変化率を算出した。
【００３４】
本発明は、内層回路板に、熱硬化性樹脂中に２種類の電気絶縁性フィラーを分散させた樹脂を配合した熱硬化性樹脂組成物を、キャリアフィルムの片面に塗布し、加熱により前記樹脂を半硬化状態にし、キャリアフィルムを除去することにより得られる接着剤シートを積層して得られる多層プリント配線板の製造方法を提供するものである。樹脂中に２種類の形状の異なるフィラーを分散させることにより、低熱膨張率を付与することができる。
本発明はしたがって、製造した絶縁ワニスを用いて得られた多層プリント配線板は、回路充填性に優れ、表面が平坦で回路加工性が良く、絶縁層が保持されるため絶縁信頼性が高く、低熱膨張性に優れるため、寸法安定性が高い。既存の設備で製造可能であり、環境にも今まで以上に大きな負荷を与えることはない。したがって、多層プリント配線板の高密度化、薄型化、高信頼性化、低コスト化に多大の貢献をする。
【００３５】
【発明の効果】
以上に説明したとおり、本発明によって、内層回路の回路導体間を空隙なく埋めることができる程度に流動性を有し、熱膨張率が一様に低く、かつ適当な剛性があって多層プリント配線板を製造するときの作業性に優れた接着剤シートとその製造法およびその接着剤シートを用いた多層プリント配線板とその製造法を提供することができる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an adhesive sheet used for a multilayer printed wiring board and a manufacturing method thereof, and a multilayer printed wiring board using the adhesive sheet and a manufacturing method thereof.
[0002]
[Prior art]
Electronic components such as semiconductor chips have a very high integration density of their circuits, and printed wiring boards on which such electronic components are mounted also have multilayering and wiring accuracy to increase wiring density. Improvements have been made.
A multilayer printed wiring board is usually manufactured by previously forming a conductor circuit on a plurality of substrates, sandwiching a prepreg between the plurality of substrates, aligning them with each other, and stacking and integrating them by heating and pressing. However, when a glass cloth prepreg as used so far is used for the prepreg, there is a problem that it is difficult to adjust the thickness.
[0003]
Therefore, it has been proposed to form an insulating layer using only a resin without using a reinforcing material such as glass cloth.
In order to manufacture a multilayer printed wiring board by constructing such an insulating layer only with a resin, an uncured insulating resin varnish is applied to the surface of a carrier film or copper foil, and heated and dried to be semi-cured. It is efficient to use an adhesive sheet.
Using such an adhesive sheet, for example, it is stacked on a substrate on which an inner layer circuit is formed, laminated by heating and pressurizing, and is necessary after forming a via hole with a laser beam such as a carbon dioxide laser. A multilayer printed wiring board can be manufactured by forming only the outer layer circuit by plating only in a certain portion and electrically connecting the inner layer circuit and the outer layer circuit.
[0004]
[Problems to be solved by the invention]
However, such an adhesive sheet has a problem that it is easy to bend and difficult to handle because it does not have a reinforcing material such as glass cloth. In addition, since the insulating layer is composed only of resin, the coefficient of thermal expansion is large, the dimensional change during manufacturing of the wiring board is large, and it is difficult to align the holes of each insulating layer and the connection terminals of the conductor layer. There was a problem of becoming.
[0005]
As a solution for reducing the thermal expansion coefficient of the insulating layer and reducing the dimensional change, a method of using a polymerized resin for the resin or a method of mixing a fibrous filler into the resin has been proposed. In the case of using a plasticized resin, it is difficult to provide fluidity so that there is no gap between the circuit conductors of the inner layer circuit. There is a problem that it expands and peels when mounted, and when using a resin filled with a fibrous filler, the length direction of the fibers cannot always be aligned in the same direction, Since the vertical and horizontal thermal expansion coefficients differ each time they are manufactured, it is possible to make jigs for aligning the holes of each insulating layer and the connection terminals of the conductor layers while measuring the thermal expansion coefficient for each product or each production lot. Difficult and practical There is a problem that it is not.
[0006]
The present invention has fluidity to such an extent that a gap between circuit conductors of an inner layer circuit can be filled without a gap, a coefficient of thermal expansion that is uniformly low, and an appropriate rigidity when manufacturing a multilayer printed wiring board. It is an object of the present invention to provide an adhesive sheet excellent in workability, a manufacturing method thereof, a multilayer printed wiring board using the adhesive sheet, and a manufacturing method thereof.
[0007]
[Means for Solving the Problems]
The adhesive sheet of the present invention comprises a copper foil or carrier film and an insulating resin layer, and the insulating resin layer contains two or more types of aluminum borate having different shapes as a filler .
[0008]
In the method for producing an adhesive sheet of the present invention, a resin varnish in which two or more types of aluminum borate having different shapes are dispersed as fillers in a thermosetting resin is applied to one side of a copper foil or a carrier film. It is characterized by heating and semi-curing.
[0009]
In addition, the multilayer printed wiring board of the present invention includes two or more kinds of different shapes in an inner layer circuit, an outer layer circuit, a via hole connecting the inner layer circuit and the outer layer circuit, and an insulating layer insulating the inner layer circuit and the outer layer circuit. It contains aluminum borate as a filler .
[0010]
Moreover, the manufacturing method of the multilayer printed wiring board of this invention apply | coats the resin varnish which disperse | distributed the 2 or more types of aluminum borate from which a shape differs in a thermosetting resin as a filler to the single side | surface of copper foil or a carrier film. Then, the heated and semi-cured adhesive sheet is stacked on the inner layer circuit board so that the resin comes into contact, and heated and pressurized to be laminated and integrated to form a via hole, thereby forming an outer layer circuit.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
As the filler, fillers having a shape such as a fibrous shape, a spherical shape, a scale shape, and an irregular shape can be used, and two or more kinds of fillers having different shapes are used. For example, in order to give one filler film-forming ability, scaly fillers or fibrous fillers are used, and it is preferable to use fillers with a short fiber length as fillers combined therewith, and spherical fillers. More preferably, it is used.
[0012]
Further, the diameter of the filler is preferably in the range of 1 to 100 μm, and if it is less than 1 μm, rigidity cannot be obtained and workability is reduced. If the diameter exceeds 100 μm, the filler in contact with the conductor circuit is in other conductor circuits. There is a possibility that a short circuit accident between circuits may occur due to migration of copper ions generated along the filler.
Further, the filler to be combined is preferably not more than 1/2 of the diameter of one filler, and more preferably not more than 1/3. The lower limit is the same as the diameter of the filler. When this combined filler exceeds 1/2 of the diameter of one filler, the proportion of the filler in the resin cannot be increased, and the effect of improving the characteristics by mixing the filler becomes poor.
[0013]
The average particle size of the filler may be of a target size in advance, or a general method such as crushing, for example, using a general apparatus that is subjected to shearing force such as a ball mill, a bead mill, a nano maker or a nanomizer. Can be adjusted.
[0014]
As the kind of whisker, one or more kinds selected from aluminum borate, wollastonite, potassium titanate, basic magnesium sulfate, magnesium oxide, silicon nitride, aluminum hydroxide, α-alumina, talc, etc. Can be used. Among these, aluminum borate is preferably used because it has a small thermal expansion coefficient and is relatively inexpensive.
[0015]
The blending ratio of the filler to be used may be set in any way, and it is preferable that the filler for imparting film-forming ability such as fibrous or scale-like is in the range of 40% to 90% by weight of the filler to be added. . If the filler for imparting film-forming ability is less than 40% by weight, it may be difficult to form the produced resin varnish into a film, and the handleability may be lowered. More preferred.
[0016]
In order to further increase the rigidity and heat resistance of the printed wiring board, it is also effective to use a filler surface-treated with a silane coupling agent. The filler surface-treated with the coupling agent has excellent wettability and bondability with the resin and can improve rigidity and heat resistance. As the coupling agent used at this time, known ones such as silicon, titanium, aluminum, zirconium, zircoaluminum, chromium, boron, phosphorus, and amino acid can be used.
[0017]
For the resin, it is possible to use a resin used for a prepreg based on a conventional glass cloth and a thermosetting resin used for an adhesive film not containing a glass cloth base or an adhesive film with a copper foil. it can. The resin here means a resin, a curing agent, a curing accelerator, a coupling agent (if necessary), and a diluent (if necessary).
[0018]
Examples of the resin include epoxy resin, bistriazine resin, polyimide resin, phenol resin, melamine resin, silicon resin, unsaturated polyester resin, cyanate ester resin, isocyanate resin, polyimide resin or various modified resins thereof. Is preferred. Among these, bistriazine resin and epoxy resin are particularly preferable in terms of printed wiring board characteristics. As the epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A novolak type epoxy resin, salicylaldehyde novolak type epoxy resin, Bisphenol F novolac type epoxy resin, alicyclic epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, hydantoin type epoxy resin, isocyanurate type epoxy resin, aliphatic cyclic epoxy resin and their halides, hydrogenated products , And mixtures of the resins are preferred. Among them, bisphenol A novolac type epoxy resin or salicylaldehyde novolac type epoxy resin is preferable because of its excellent heat resistance.
[0019]
As the curing agent for such a resin, those conventionally used can be used. When the resin is an epoxy resin, for example, dicyandiamide, bisphenol A, bisphenol F, polyvinylphenol, phenol novolac resin, bisphenol A novolac resin, and these Phenolic halides and hydrides can be used. Among them, bisphenol A novolac resin is preferable because of its excellent heat resistance. The ratio of the curing agent to the resin is preferably in the range of 2 to 80 parts by weight with respect to 100 parts by weight of the resin. Furthermore, 2 to 5 parts by weight for dicyandiamide, and 20 to 70 for other curing agents. A range of parts by weight is preferred.
[0020]
As the curing accelerator, when the resin is an epoxy resin, an imidazole compound, an organic phosphorus compound, a tertiary amine, a quaternary aluminum salt, or the like is used. The ratio of the curing accelerator to the resin is preferably in the range of 0.01 to 20 parts by weight and more preferably in the range of 0.1 to 1.0 part by weight with respect to 100 parts by weight of the resin.
[0021]
The thermosetting resin of the present invention can be diluted with a solvent and used as a resin varnish. As the solvent, acetone, methyl ethyl ketone, toluene, xylene, methyl isobutyl ketone, ethyl acetate, ethylene glycol monomethyl ether, methanol, ethanol, N, N-dimethylformamide, N, N-dimethylacetamide and the like can be used.
The ratio of the diluent to the above may be the ratio of the resin used, preferably in the range of 1 to 200 parts by weight, more preferably in the range of 30 to 100 parts by weight with respect to 100 parts by weight of the resin.
[0022]
Further, in the present invention, conventionally known coupling agents, fillers and the like may be appropriately blended in the resin, if necessary, in addition to the above-described components.
[0023]
When the blending amount of the electrically insulating filler in the resin is less than 5 parts by weight with respect to 100 parts by weight of the resin solid content, the handling property such as the resin is finely crushed and easily scattered at the time of cutting is deteriorated, and the wiring board When it is set, sufficient heat dissipation cannot be obtained. On the other hand, if the blending amount of the filler is 350 parts by weight or more, the hole filling property of the inner layer circuit and the resin filling property between the circuits at the time of hot pressing are impaired, and voids and blurring are caused in the filler composite resin layer after the hot pressing. Is likely to occur, and the wiring board characteristics may be impaired. Therefore, the blending amount of the filler is preferably 50 to 350 parts by weight with respect to 100 parts by weight of the resin solid content. In addition, it excels in filling the inner layer circuit and filling resin between the circuits, and the manufactured wiring board is equivalent to or better than the conventional wiring board using glass cloth prepreg and has stable and dimensional stability. The amount of filler is more preferably 100 to 230 parts by weight with respect to 100 parts by weight of the resin solids because of its ability to have both wire property and wire bonding property.
[0024]
The resin thickness of the thermosetting resin composition containing the electrically insulating whiskers is not particularly defined, but is desirably thicker than the inner layer copper thickness of the inner layer circuit. When the inner layer copper is thinner than the inner layer copper thickness, not only is the filling property of the inner layer circuit insufficient, but blurring or the like easily occurs.
[0025]
【Example】
Example 1
(Preparation of thermosetting resin composition containing electrically insulating whiskers)
100 parts by weight of bisphenol A novolac type epoxy resin (epoxy equivalent 210), 100 parts by weight of bisphenol A novolak resin (epoxy equivalent 123), and heat mainly composed of varnish diluted with 1 part by weight of dicyandiamide as a curing accelerator with 80 parts by weight of MEK A 6: 4 mixture of a curable resin with an aluminum borate whisker having an average diameter of 0.8 μm, an average fiber length of 20 μm, and a maximum length of 30 μm, and aluminum borate spherical particles (trade name Alborite) having an average particle diameter of 5 μm. Was mixed so as to be 110 parts with respect to 100 parts by weight of the resin solid content, and stirred until the filler was uniformly dispersed in the varnish.
The varnish was applied to a copper foil with a thickness of 18 μm with a knife coater, dried by heating at a temperature of 150 ° C. for 10 minutes to remove the solvent, and the whisker volume fraction was obtained by semi-curing the thermosetting resin. An adhesive with a copper foil having a thickness of 30% and a thickness of 50 μm was prepared. The resin flow of this adhesive film was 25% by the MIL method.
Next, an adhesive with a copper foil was placed on a copper foil having a thickness of 200 μm and integrated by heating and pressing at 175 ° C. and 3 MPa for 60 minutes. Then, the pattern used as the electrode for an electrolytic corrosion test was produced by the etching. As a result of the measurement, the insulating layer thickness of the mounting part of the mounted component was 30 μm.
[0026]
Example 2
Other than using 100 parts by weight of a salicylaldehyde novolac type epoxy resin (epoxy equivalent 250) and 200 parts by weight of a thermosetting resin (epoxy equivalent 123) based on bisphenol A novolac resin when producing an adhesive with copper foil, A multilayer printed wiring board was produced in exactly the same manner as in Example 1.
[0027]
Reference example 1
Among the types of fillers, a multilayer printed wiring board was produced with the same composition as in Example 1 except that the fibrous particles were changed to glass fillers having an average fiber length of 30 μm.
[0028]
Reference example 2
A multilayer printed wiring board was produced in the same composition as in Example 1 except that the combination of fillers was changed to scaly synthetic mica and aluminosilicate having an average particle diameter of 8 μm.
[0029]
Comparative Example 1
A multilayer printed wiring board was produced with the same composition as in Example 1 except that the filler used for producing the adhesive with copper foil was a needle-like alumina filler. As a result of the measurement, the insulating layer thickness of the mounting part of the mounted component was 35 μm.
[0030]
Comparative Example 2
A multilayer printed wiring board was produced with the same composition as in Example 1 except that a 60 μm prepreg was used instead of the adhesive with copper foil. As a result of the measurement, the insulating layer thickness of the mounting part of the mounted component was 45 μm.
[0031]
The multilayer printed wiring board obtained by these methods exhibited the characteristics shown in Table 1.
[0032]
[Table 1]
The test method is shown below.
-Linear expansion coefficient : A linear expansion coefficient was measured by the TMA method of JIS C 6481. The heating rate was 10 ° C./min.
Solder heat resistance: A float of 260 ° C. that does not swell for 80 seconds or more was rated as “Good”.
-Dimensional change rate: Uncoated and coated with 18 μm copper foil and an FR-4 substrate with a thickness of 0.6 mm were integrated by heating and pressurizing at 175 ° C. and 3 MPa for 60 minutes. Four holes were formed in the object so that the reference holes at intervals of 300 mm were square, and the distance between the holes was measured. Thereafter, the entire surface of the outer layer copper foil was etched, dried in a dryer at 130 ° C. for 1 hour, the distance between the holes between the reference points was measured again, and the rate of change in dimensions was calculated.
[0034]
In the present invention, a thermosetting resin composition in which two kinds of electrically insulating fillers are dispersed in a thermosetting resin is applied to an inner circuit board on one side of a carrier film, and the resin is heated by heating. The present invention provides a method for producing a multilayer printed wiring board obtained by laminating an adhesive sheet obtained by making a semi-cured state and removing a carrier film. A low coefficient of thermal expansion can be imparted by dispersing fillers having two different shapes in the resin.
Therefore, the multilayer printed wiring board obtained by using the manufactured insulating varnish is excellent in circuit filling properties, has a flat surface and good circuit workability, and has a high insulation reliability because the insulating layer is retained. Excellent dimensional stability due to excellent low thermal expansion. It can be manufactured with existing equipment and does not place a greater burden on the environment than ever. Therefore, the multilayer printed wiring board is greatly contributed to high density, thinning, high reliability, and low cost.
[0035]
【The invention's effect】
As described above, according to the present invention, the multilayer printed wiring has fluidity to such an extent that the space between the circuit conductors of the inner layer circuit can be filled without gaps, the coefficient of thermal expansion is uniformly low, and has an appropriate rigidity. It is possible to provide an adhesive sheet excellent in workability when manufacturing a board, a manufacturing method thereof, a multilayer printed wiring board using the adhesive sheet, and a manufacturing method thereof.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30035499A JP4366785B2 (en) | 1999-10-22 | 1999-10-22 | Adhesive sheet, production method thereof, multilayer printed wiring board using the adhesive sheet, and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30035499A JP4366785B2 (en) | 1999-10-22 | 1999-10-22 | Adhesive sheet, production method thereof, multilayer printed wiring board using the adhesive sheet, and production method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001119153A JP2001119153A (en) | 2001-04-27 |
| JP4366785B2 true JP4366785B2 (en) | 2009-11-18 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30035499A Expired - Fee Related JP4366785B2 (en) | 1999-10-22 | 1999-10-22 | Adhesive sheet, production method thereof, multilayer printed wiring board using the adhesive sheet, and production method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4366785B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6111833B2 (en) * | 2013-05-06 | 2017-04-12 | 株式会社デンソー | Multilayer substrate manufacturing method |
| WO2018008592A1 (en) * | 2016-07-04 | 2018-01-11 | 東亞合成株式会社 | Adhesive agent composition, and coverlay film, flexible copper clad laminate, and adhesive sheet using adhesive agent composition |
-
1999
- 1999-10-22 JP JP30035499A patent/JP4366785B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001119153A (en) | 2001-04-27 |
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