JP2002261138A - Standard particle coating machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To apply standard particles of different diameters on each partitioned area of a wafer for calibration and check the presence of the coat. SOLUTION: A plurality of containers 1, in which the standard particles of different diameters are put respectively, are set on a container stage 11. In the upper part of the wafer stage 8 on which the wafer 6 for calibration is put, a partitioning panel 10 is installed so as to cover the wafer 6, and this partitioning panel 10 is provided with an opening part 10a constituted by cutting out a part of the circumference in a sector shape. A nozzle 5 for jetting the standard particles is provided above this opening part 10a, and by an up-down operation and a rotation operation of the container stage 11, the container 1 to feed the standard particle is exchanged, and by interlocking with this exchanging, the wafer stage 8 is rotated, and the position facing to the opening part 10a of the wafer 6 is exchanged, and thus the standard particles of different diameters are applied to each area of one wafer. In addition, the laser that is irradiated from a laser irradiation mechanism 15 so as to pass under the opening part 10a is detected by a laser detection mechanism 16, and thus the presence of coating of the standard particles is detected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a standard particle coating machine for applying standard particles used for calibration of a foreign substance inspection apparatus for inspecting foreign substances adhered to a wafer on a calibration wafer. More specifically, the present invention relates to a technique for improving the work efficiency by enabling standard particles having different particle diameters to be applied to one calibration wafer in different regions and confirming the presence or absence of application.

[0002]

2. Description of the Related Art In a semiconductor manufacturing and assembling process, various foreign substance inspections are performed. In a foreign substance inspection apparatus which detects the number and distribution of foreign substances adhering to a wafer by comparing and inspecting particle diameters of the foreign substances, Calibration using standard particles is performed. In preparing the recipe, there is an operation of applying standard particles to a calibration wafer, and a standard particle coating machine is used for this operation.

FIG. 5 is a perspective view of a conventional standard particle applicator.
In the container 1, standard particles having a particle diameter in pure water are charged, and a standard particle solution prepared by stirring the standard particles is charged. The container mounting table 2 has a structure in which one container 1 can be set.

A suction / vaporization mechanism 3 is for sucking the solution in the container 1 and vaporizing the solution. A suction pipe 4 is put in the container 1 to suck the solution in the container 1 and evaporate the solution. And sprayed from the nozzle 5.

A wafer 6 for calibration is a wafer stage 7
And the standard particles are applied to the entire wafer 6 by spraying the standard particles from the nozzle 5 located above the wafer 6.

[0006]

In a wafer inspection process using a foreign object inspection apparatus, foreign objects having a smaller diameter are increasingly included as objects to be measured. Therefore, it is necessary to use standard particles having a plurality of particle sizes. However, in the conventional standard particle coating machine described above, in order to apply standard particles having different particle sizes, the container 1 containing pure water is once set on the container mounting table 2 and the nozzle 5 is washed. Therefore, there is a problem that the operation of setting the container 1 containing the standard particle solutions prepared with the standard particles having different particle diameters on the container mounting table 2 is required, and it is troublesome.

Further, since only one type of standard particle size particle can be applied to one wafer 6, it is necessary to replace the wafer 6 with a new one, which is troublesome and increases the amount of used wafer. There was a problem.
Furthermore, since there is no means for confirming whether the standard particles have adhered to the wafer 6, if there is insufficient adhesion, it is necessary to apply the standard particles again, which is troublesome and time-consuming.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and enables standard particles having different particle diameters to be applied to one calibration wafer in different regions, and whether or not the coating is performed is determined. It is an object of the present invention to provide a standard particle applicator capable of improving work efficiency by enabling confirmation.

[0009]

According to the present invention, there is provided a standard particle coating machine comprising: a container in which standard particles to be coated on a calibration wafer are put; a standard particle sucked from the container; In a standard particle applicator equipped with an application means for spraying, a container mounting means to which a plurality of containers containing standard particles having different particle diameters are attached, and a plurality of containers attached to the container mounting means. Container moving means for associating one container with the coating means, a wafer stage on which the wafer is mounted,
A partition plate attached to the upper side of the wafer stage so as to cover the wafer on the wafer stage and provided with an opening partly opened, and moving the wafer stage to move the wafer to the opening of the partition plate. It is provided with a wafer moving means for switching the position of the wafer and a nozzle for applying standard particles by the applying means from above the opening of the partition plate.

[0010] The standard particle applicator according to the present invention further comprises a suction means for sucking the standard particles jetted from the nozzle at a position corresponding to the opening of the partition plate and from the side of the wafer stage. It is provided. Further, the standard particle applicator according to the present invention is provided with a detecting means for detecting the presence or absence of the standard particles sprayed and applied from the nozzle.

In the present invention, standard particles having different particle sizes are
Each container is placed in a separate container, and each container is attached to the container attaching means. One of the containers attached to the container attaching means is associated with one container by the container moving means, and the standard particles contained in the container are ejected from the nozzle.

The particles ejected from the nozzle pass through the opening of the partition plate and are applied to the wafer.
The standard particles are not applied to the portion of the wafer that is covered with the partition plate, and only the portion facing the opening becomes the application region, and the standard particles are applied to the application region. The detection means detects whether or not the standard particles ejected from the nozzles are applied.

Further, the standard particles ejected from the nozzle are sucked by the suction means to be applied evenly to the coating area on the wafer, and the extra standard particles are sucked without scattering to the outside. When the application of the standard particles of a certain particle size is completed, another container is made to correspond to the application means, and the wafer stage is moved to another opening where the standard particles of the wafer are not applied to the opening of the partition plate. The standard particles of different particle sizes are applied corresponding to the portions. At this time, since the region on the wafer to which the standard particles have been previously coated is covered with the partition plate, the standard particles having a different particle size are not coated.

By repeating the above-described operation, standard particles having different particle diameters can be applied to one calibration wafer in different areas, and the presence or absence of the application can be confirmed, thereby improving the work efficiency. be able to.

[0015]

FIG. 1 is a perspective view showing an example of an embodiment of a standard particle coating machine according to the present invention. On the wafer stage 8, the wafer 6 for calibration is placed. This wafer stage 8 moves the wafer stage 8,
The wafer 6 with respect to the opening 10a of the partition plate 10 described later
Are rotationally driven in the direction of arrow a by a wafer stage drive mechanism 9 as a wafer moving means for switching the position of the wafer.

A partition plate 10 is mounted above the wafer stage 8. The partition plate 10 is provided with an opening 10a formed by cutting a part of the circumference of the partition plate into a fan shape. The opening 10a has a fan-like shape whose apex is, for example, 45 °. The wafer stage 8 is configured to rotate with respect to the partition plate 10 by the wafer stage driving mechanism 9.
The upper wafer 6 is exposed at the opening 10 a of the partition plate 10, and the other portion is covered with the partition plate 10, and is exposed by the rotation of the wafer stage 8. The structure can be changed.

In a container 1, a standard particle solution prepared by stirring an appropriate amount of standard particles having a particle diameter in pure water is placed. In order to apply standard particles having different particle diameters to the wafer 6, a plurality of containers 1 are prepared, and solutions prepared using the standard particles having different particle sizes are put into separate containers 1, respectively. Also, a container 1 containing pure water for cleaning is prepared.

A container stage 11 as a container mounting means to which a plurality of containers 1 are mounted has a structure in which a plurality of the containers 1 can be arranged and set on the same circumference, for example, five containers 1
Is set. When the number of containers 1 that can be set on the container stage 11 is five, the four containers 1 are for holding solutions respectively prepared with standard particles having different particle diameters, and the remaining one container is for cleaning. Of pure water. This makes it possible to apply four types of standard particles.

The container stage 11 serves as container moving means for associating one container 1 among a plurality of containers 1 attached to the container stage 11 with the suction pipe 4 of the suction / vaporization mechanism 3 as an application means. Are driven to rotate in the directions of arrows b and c by the container stage driving mechanism 12 and are driven to move up and down in the directions of arrows d and e. Here, the plurality of containers 1 on the container stage 11 are
1 are set so as to be arranged on the same circumference centered on the axis at the time of rotationally driving in the direction of arrow b or arrow c.

The suction / vaporization mechanism 3 sucks the solution in the container 1 and vaporizes the solution. The suction pipe 4 is inserted into the container 1 selected from the plurality of containers 1 and the container 1 The solution inside is sucked, vaporized and ejected from the nozzle 5.

The container stage 11 is rotatably driven in directions of arrows b and c by a container stage driving mechanism 12 and is driven to move up and down in directions of arrows d and e. Then, when the suction pipe 4 comes out of the selected container 1, the container 1 retreats from the suction pipe 4, and the container stage 11 becomes rotatable. Next, the container stage 11
Is rotated in the direction of arrow b or arrow c, another container 1 faces the suction pipe 4. Then, by raising the container stage 11 in the direction of the arrow e, the suction pipe 4 enters this another container 1 and becomes in a state where the solution in the container 1 can be sucked.

By this operation, it is possible to switch the container 1 to be supplied. In the present embodiment, among the five containers 1, four containers 1 contain standard particles having different diameters. If one of the four containers 1 is selected as the target container 1, the standard particles selected from the four types of standard particles can be ejected from the nozzle 5. Also,
Since the container 1 containing pure water is also prepared, if the container 1 to be supplied is the container 1 containing this pure water, the suction pipe 4 and the nozzle 5 can be washed. By arranging the containers 1 on the same circumference, the container stage 11
The container 1 can be switched by the rotation operation and the raising / lowering operation, and a mechanism for selecting one container from a plurality of containers 1 can be realized in a small space.

The nozzle 5 is provided above the partition plate 10 so as to be located near the center of the fan-shaped opening 10a provided in the partition plate 10. A suction mechanism 13 is provided on the side of the wafer stage 8 at a position corresponding to the portion where the opening 10a of the partition plate 10 is provided.
Is provided with a suction nozzle 14 for performing suction by means of. The shape of the suction nozzle 14 may be a pipe shape as shown in FIG. 1, or may be, for example, a shape having a wide mouth in accordance with the width of the opening 10 a of the partition plate 10.

The standard particles injected from the nozzle 5 are as follows:
It is applied to the calibration wafer 6 on the wafer stage 8 through the opening 10 a of the partition plate 10, and the suction is performed by the suction nozzle 14 toward the outer periphery of the wafer 6, whereby the standard The particles are uniformly applied on the wafer 6 from the center to the outer periphery of the wafer 6, and the extra standard particles are sucked by the suction nozzle 14 and are not scattered outside. Further, the standard particles are not applied to the portion of the wafer 6 covered with the partition plate 10.

Here, since the application area on the wafer 6 is switched by rotating the wafer stage 8, it is not necessary to move the nozzle 5 and the suction nozzle 14, and the apparatus can be simplified.

The laser irradiation mechanism 15 is provided between the wafer 6 on the wafer stage 8 and the partition plate 10, and
The laser beam passing under the opening 10a is irradiated. The laser detecting mechanism 16 detects the laser beam emitted from the laser irradiating mechanism 15.
Is provided at a position sandwiching the partition plate 10 and the wafer stage 8. Since the standard particles ejected from the nozzle 5 pass through the opening 10a and are applied to the wafer 6, when the standard particles are normally applied to the wafer 6, the standard particles are irradiated from the laser irradiation mechanism 15. The laser beam is blocked by the standard particles and does not reach the laser detection mechanism 16. This makes it possible to detect whether or not the standard particles have been normally applied to the wafer 6 from a change in the output of the laser detection mechanism 16. The laser irradiated by the laser irradiation mechanism 15 may be configured to pass over the partition plate 10 and over the opening 10a.
Further, a structure may be employed in which the laser irradiated by the laser irradiation mechanism 15 is irradiated on the wafer 6 on the wafer stage 8, and the reflected light is detected by the laser detection mechanism 16.
In this case, it is possible to more reliably detect whether or not the standard particles have been applied to the wafer 6.

FIG. 2 is a control block diagram of the standard coating machine of the present embodiment. The standard particle applicator having the configuration shown in FIG. 1 described above has, for example, a structure controlled by the control unit 17 shown in FIG. 2 so that the standard particles having different particle diameters are formed on one calibration wafer 6. Can be automatically performed.

That is, the control unit 17 controls the suction
By controlling the vaporizing mechanism 3, the solution in the container 1 containing the suction pipe 4 is sucked, and the solution is vaporized and ejected from the nozzle 5. Further, the control unit 17 controls the suction mechanism 13 to suck the standard particles ejected from the nozzle 5 with the suction nozzle 14, thereby opening the opening 10 a of the partition plate 10 of the wafer 6. In addition, the standard particles are applied from the center of the position opposite to the outer periphery to the outer periphery, and excess standard particles are sucked.

Further, the control section 17 controls driving means such as a motor (not shown) constituting the wafer stage driving mechanism 9 to rotate the wafer stage 8 shown in FIG. The position of the wafer 6 facing the opening 10a is switched. In the present embodiment, the wafer stage 8 has a mechanism that can be rotated in units of 90 °. Further, the control unit 17 controls driving means such as a motor (not shown) constituting the container stage driving mechanism 12 so that the container stage 1 shown in FIG.
The container 1 to be sucked by the suction pipe 4 is switched by raising and lowering and rotating 1. By switching the position of the wafer 6 facing the opening 10a in accordance with the switching of the container 1 to be suctioned, standard particles having different particle diameters can be applied to one wafer 6 in different regions. .

The controller 17 controls the laser irradiating mechanism 15 to irradiate a laser, and outputs the laser radiated from the laser irradiating mechanism 15 to the laser detecting mechanism 16 from the output of the laser detecting mechanism 16. Detecting whether or not the wafer has arrived, and controlling the suction / vaporization mechanism 3 to control the wafer 6
In the step of applying the standard particles, if the laser reaches the laser detection mechanism 16, it is considered that the application of the standard particles is not sufficiently performed because the injection from the nozzle 5 is not performed normally. to decide.

Hereinafter, the operation of the standard particle applicator according to the present embodiment will be described. First, pure water is put into the container 1,
An appropriate amount of standard particles having a certain particle size is added thereto, and the mixture is stirred to prepare a standard particle solution. In the present embodiment, a solution is prepared using four types of standard particles having different diameters, and is placed in separate containers 1. For example, when the particle diameter is 0.
The container 1 containing 1 μm standard particles is a container 1a, the container 1 containing 0.2 μm standard particles is a container 1b,
The container 1 containing the standard particles having a particle diameter of 0.5 μm is a container 1 c, and the container 1 is holding the standard particles having a particle diameter of 1.0 μm.
Is the container 1d. Further, the container 1 in which the pure water is put is referred to as a container 1e. And the container 1 (containers 1a to 1e)
Are set side by side on the same circumference on the container stage 11. In addition, a calibration wafer 6 is set on the wafer stage 8.

When the setting of the containers 1 and the wafers 6 is completed, the controller 17 controls the container stage driving mechanism 12
, The container stage 11 is rotated in the direction of arrow b. First, the container 1 containing standard particles having a particle diameter of 0.1 μm is set.
a is opposed to the suction pipe 4. And the control unit 1
7 controls the container stage drive mechanism 12 to raise the container stage 11 in the direction of arrow e, and puts the suction pipe 4 into the container 1a.

Next, the control unit 17 controls the suction / vaporization mechanism 3 to suck the solution in the container 1 a containing the suction pipe 4, vaporizes the solution, and jets the solution from the nozzle 5. . Further, the control unit 17 controls the suction mechanism 13 to suck the standard particles ejected from the nozzle 5 by the suction nozzle 14.

FIG. 3 is an explanatory view showing the operation of the present embodiment. The nozzle 5 is provided near the center of the opening 10 a of the partition plate 10, and the suction nozzle 14 is located on the side of the wafer stage 8. Since the partition plate 10 is provided at a position corresponding to the portion where the opening 10a is provided, the standard particles ejected from the nozzle 5 pass through the suction nozzle 14 along a path shown by a broken line in FIG. To the opening 10a of the partition plate 10 of the wafer 6.
Is applied from the center of the position opposed to the outer periphery to the outer periphery. In addition, extra standard particles ejected from the nozzle 5 and not adhered to the wafer 6 are sucked by the suction nozzle 14 to suppress scattering to the outside.

In the step of applying the standard particles to the wafer 6, the control section 17 controls the laser irradiation mechanism 15 to irradiate a laser as shown by a dashed line in FIG. From the output of the laser irradiation mechanism 15, the laser irradiated from the laser irradiation mechanism 15
Is detected, and if the laser does not reach the laser detection mechanism 16, it is determined that the standard particles have been applied to the wafer 6. On the other hand, when the laser has reached the laser detection mechanism 16, it is determined that the application of the standard particles is not sufficiently performed because the injection from the nozzle 5 is not normally performed. In this case, for example, processing such as prolonging the injection time from the nozzle 5 is performed, and if the laser still reaches the laser detection mechanism 16, notification of insufficient coating is notified using a not-shown alarm output unit such as a buzzer. And the like.

When the application of the standard particles from the container 1a is completed, the control unit 17 controls the container stage driving mechanism 12 to lower the container stage 11 in the direction of arrow d.
The container 1a is retracted from the suction pipe 4. Next, the container stage 11 is rotated in the direction of arrow c so that the container 1e containing pure water is opposed to the suction pipe 4. Then, the container stage 11 is raised in the direction of arrow e, and the suction pipe 4
Into the container 1e.

Next, the controller 17 controls the suction / vaporization mechanism 3 to suck the pure water in the container 1e containing the suction pipe 4, and cleans the suction pipe 4 and the like. When the cleaning is completed, the controller 17 controls the container stage driving mechanism 12
Is controlled, the container stage 11 is lowered in the direction of arrow d, and the container 1e is retracted from the suction pipe 4. Next, the container stage 11 is rotated in the direction of arrow b, and the container 1 b containing the standard particles having a particle diameter of 0.2 μ is opposed to the suction pipe 4. Then, the container stage 11 is raised in the direction of arrow e, and the suction pipe 4 is put into the container 1b. Further, the control unit 17 controls the wafer stage driving mechanism 9 to rotate the wafer stage 8 by 90 ° in the direction of arrow a.

Next, the control unit 17 controls the suction / vaporization mechanism 3 to suck the solution in the container 1 b containing the suction pipe 4, vaporizes the solution, and jets the solution from the nozzle 5. . Further, the control unit 17 controls the suction mechanism 13 to suck the standard particles ejected from the nozzle 5 by the suction nozzle 14.

Thus, the standard particles sprayed from the nozzle 5 are applied from the center of the wafer 6 at a position facing the opening 10a of the partition plate 10 toward the outer periphery. Since the wafer 6 is rotated by 90 ° with respect to the time when the standard particles in the container 1a are applied,
The position facing the partition plate 10a is switched, and the region of the wafer 1 on which the standard particles are applied is covered with the partition plate 10. Therefore, standard particles having different particle diameters can be applied to one wafer 6 in different regions.

The control unit 17 also controls the container 1b in the step of applying the standard particles of the container 1b to the wafer 6 described above.
a laser detection mechanism 1 as in the step of applying the standard particles a
The presence or absence of application is determined from the output of 6.

Thereafter, when the application of the standard particles from the container 1b is completed, the control unit 17 performs the above-described cleaning with pure water, rotates the wafer stage 8 by 90 ° to switch the application region, and switches the application region of the container stage 11. The container 1 to be suctioned by the suction pipe 4 is switched from the container 1b to the container 1c by raising and lowering and rotating, and the laser detection mechanism 1 is switched.
While the output of 6 is monitored, the application of the standard particles in the container 1c is performed. When the application of the standard particles from the container 1c is completed, the above-described cleaning with pure water is performed, and the wafer stage 8 is moved to 90
While rotating the container area, the container 1 to be suctioned by the suction pipe 4 is switched from the container 1c to the container 1d by moving the container stage 11 up and down and rotating.
While monitoring the output of the laser detection mechanism 16, the container 1d
Is applied. This makes it possible to apply four types of standard particles having different particle diameters to one wafer 6 with different application areas.

FIG. 4 is a plan view showing the relationship between the above-mentioned partition plate 10 and the coating area on the wafer 6. The partition plate 10 is provided with a fan-shaped opening 10a.
The wafer 6 that rotates at 5 ° and rotates with respect to the partition plate 10 rotates in units of 90 ° by the rotation of the wafer stage 8 by the wafer stage drive mechanism 9 described above. Also,
The wafer stage 8 has a structure that rotates around the apex of the fan-shaped opening 10 a of the partition plate 10, and the wafer 6 is placed with its center aligned with the center of the wafer stage 8.

As a result, a fan-shaped standard particle application area having a vertex of 45 ° is formed on the wafer 6. In the present embodiment, the area 6a is an application area of the 0.1 μ standard particle, the area 6b is an application area of the 0.2 μ standard particle, and the area 6a.
c is a coating area of 0.5 μm standard particles, and area 6d is 1.0
It becomes the application area of the standard particles of μ. Since a space is opened between the application areas in a fan shape having a vertex of 45 °, standard particles having different particle diameters are not applied to adjacent application areas.

As shown in FIG. 4, if the calibration of the foreign substance inspection apparatus is to be performed using the wafer 6 coated with the standard particles having different particle diameters in different regions, one wafer 6
Only with this, a recipe using standard particles having different particle diameters can be created.

[0045]

As described above, the present invention provides a container for containing standard particles to be applied to a calibration wafer,
Aspirating the standard particles from the container, and a standard particle applicator including an application unit for spraying the sucked standard particles, a container mounting unit to which a plurality of containers containing standard particles having different particle sizes are mounted. A container moving unit for associating one container from the plurality of containers attached to the container mounting unit with the coating unit, a wafer stage on which the wafer is mounted, and a wafer covering the wafer on the wafer stage. A partition plate attached to the upper side of the wafer stage and having an opening partly opened, a wafer moving means for moving the wafer stage and switching a position of a wafer with respect to the opening of the partition plate, and the partition A nozzle for applying standard particles by the coating means from above the opening of the plate.

Further, the standard particle coating machine of the present invention is provided with suction means for sucking the standard particles jetted from the nozzle at a position corresponding to the opening of the partition plate and from the side of the wafer stage. It is a thing. Further, the standard particle applicator of the present invention is provided with detection means for detecting the presence / absence of standard particles sprayed and applied from the nozzle. Therefore, according to this, standard particles having different particle diameters can be applied to one calibration wafer in different regions,
Wafer usage can be reduced.

Also, once a plurality of containers are attached,
In the step of applying standard particles having different particle diameters to one wafer, there is no need to manually replace the container, and the workability can be improved. Further, by sucking the standard particles ejected from above the wafer from the side of the wafer, the standard particles can be applied evenly to the application region on the wafer. Further, extra standard particles can be prevented from scattering outside, and the environment can be considered.

Further, by detecting the presence or absence of the application of the standard particles, whether or not the standard particles have been applied on the wafer can be confirmed at this coating stage. Can be achieved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of an embodiment of a standard particle applicator of the present invention.

FIG. 2 is a control block diagram of the standard coating machine of the present embodiment.

FIG. 3 is an explanatory diagram showing the operation of the present embodiment.

FIG. 4 is a plan view showing a relationship between a partition plate and a coating area on a wafer.

FIG. 5 is a perspective view of a conventional standard particle applicator.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Container, 3 ... Suction / vaporization mechanism, 4 ... Suction nozzle, 5 ... Nozzle, 6 ... Wafer, 8 ...
Wafer stage, 9 ... Wafer stage drive mechanism, 10 ... Partition plate, 10a ... Opening, 11 ...
・ Container stage, 12 ・ ・ ・ Container stage drive mechanism, 1
3 ... suction mechanism, 14 ... suction nozzle, 15 ...
Laser irradiation mechanism, 16 ... Laser detection mechanism, 17 ...
・ Control unit

Continued on the front page F-term (reference) 4F033 QA01 QB02Y QB05 QB12Y QB18 QD04 QD14 4F041 AA06 AB05 BA22 BA38 BA59 4F042 AA07 AB06 BA12 CA06 CB03 CB12 CC03 CC08 DF29 DF32 DF34 DH09 EB09 EB09 EC04 EB13 EC04

Claims (6)

[Claims] 1. A standard particle coating machine comprising: a container in which standard particles to be coated on a calibration wafer are placed; and a coating unit for sucking the standard particles from the container and jetting the sucked standard particles. Container mounting means to which the plurality of containers containing the standard particles having different particle diameters are attached; and container moving means for associating one container from the plurality of containers attached to the container attachment means with the coating means. A wafer stage on which the wafer is mounted, a partition plate attached to the upper side of the wafer stage so as to cover the wafer on the wafer stage, and having an opening partly opened, and moving the wafer stage Then, the wafer moving means for switching the position of the wafer with respect to the opening of the partition plate and from above the opening of the partition plate Standard particle coater, characterized in that a nozzle for applying the standard particles by serial application means. 2. The apparatus according to claim 1, further comprising suction means for sucking standard particles ejected from said nozzle at a position corresponding to an opening of said partition plate and from a side of said wafer stage. Standard particle coater as described. 3. The standard particle applicator according to claim 1, further comprising detection means for detecting the presence or absence of the standard particles sprayed and applied from the nozzle. 4. The standard particle applicator according to claim 1, wherein the shape of the opening of the partition plate is a sector shape. 5. The standard particle applicator according to claim 4, wherein the wafer moving means rotates the wafer about a vertex of a sector-shaped opening of the partition plate. 6. The container mounting means has a plurality of containers arranged side by side on the same circumference, and the container moving means rotates the container mounting means about the center of the arranged circumference of the containers as an axis. The standard particle applicator according to claim 1, wherein the coating is performed.