JP2013026369A - Cleaning apparatus and cleaning method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cleaning apparatus in which pollution due to a nozzle arm for holding a discharge head can be prevented, and to provide a cleaning method.SOLUTION: A nozzle arm 62 for holding a discharge head is moved, by means of a revolution drive unit 63, between a processing position above a substrate W and a standby position on the outside of a processing cup surrounding the substrate W. When the nozzle arm 62 used for cleaning the substrate W is located at the standby position, cleaning liquid is ejected obliquely downward from a shower nozzle 71 toward the nozzle arm 62. Three nozzle arms 62 are cleaned sequentially when they elevate or lower to traverse the flow of cleaning liquid ejected obliquely downward. Thereafter, the cleaning liquid adhering to the arm is dried by blowing nitrogen gas from a drying gas nozzle 76 toward the nozzle arm 62.

Description

  The present invention relates to a cleaning apparatus and a cleaning apparatus for a nozzle arm that holds a discharge head for supplying a processing liquid to a thin precision electronic substrate (hereinafter simply referred to as “substrate”) such as a semiconductor wafer or a glass substrate for a liquid crystal display device. It relates to the processing method.

  2. Description of the Related Art Conventionally, in a substrate manufacturing process, a substrate processing apparatus that performs a drying process after performing a surface treatment of a substrate such as a chemical treatment using a chemical solution and a rinsing treatment using pure water has been used. As such a substrate processing apparatus, a single-wafer type apparatus that processes substrates one by one and a batch-type apparatus that collectively processes a plurality of substrates are used. Single-wafer type substrate processing equipment usually performs chemical treatment by supplying chemical solution to the surface of a rotating substrate, pure water rinsing treatment by supplying pure water, and then rotating the substrate at high speed to dry it off. I do. Such a single-wafer type substrate processing apparatus is disclosed in Patent Documents 1 and 2, for example.

  The substrate processing apparatus disclosed in Patent Documents 1 and 2 includes a spin chuck that rotates while holding the substrate in a substantially horizontal posture, and a nozzle (ejection head) that supplies a processing liquid to the upper surface of the substrate held by the spin chuck. And a cup that surrounds the periphery of the spin chuck and receives the processing liquid scattered from the substrate. The apparatus disclosed in Patent Document 2 further includes a processing chamber that accommodates these components, and a partition plate that partitions the processing chamber up and down around the cup.

  In the apparatuses disclosed in Patent Documents 1 and 2, the processing liquid scattered from the rotating substrate and the spin chuck during processing may adhere to the ejection head. If such an adhering treatment liquid is left as it is, it may fall on the substrate and become a contamination source, or it may dry and become a particle generation source. Patent Document 3 discloses a technique for cleaning a processing liquid adhering to the tip of the discharge head by providing a large-diameter nozzle holder that discharges the cleaning liquid around the discharge head that discharges the processing liquid.

JP 2008-91717 A JP 2010-192686 A JP 2004-267871 A

  However, the processing liquid splashed from the rotating substrate and the spin chuck may adhere not only to the ejection head but also to the nozzle arm that holds and swings the ejection head. Even when the treatment liquid adhering to the nozzle arm is left unattended, there is a problem that the treatment liquid falls on the substrate when the arm is swung and becomes a contamination source, or the adhering treatment liquid dries and becomes a particle generation source. . Even if the technique disclosed in Patent Document 3 is applied to the substrate processing apparatuses of Patent Documents 1 and 2, the tip of the discharge head can be cleaned, but the nozzle arm that holds the discharge head is cleaned. I can't. For this reason, the problem that the nozzle arm to which the treatment liquid adheres becomes a contamination source cannot be solved.

  The present invention has been made in view of the above problems, and an object thereof is to provide a cleaning processing apparatus and a cleaning processing method capable of preventing contamination caused by a nozzle arm that holds a discharge head.

  In order to solve the above problems, the invention of claim 1 is a cleaning processing apparatus, wherein a substrate holding means for holding and rotating a substrate in a substantially horizontal posture, a cup surrounding the periphery of the substrate holding means, and the substrate A nozzle arm having a discharge head for discharging the processing liquid onto the substrate held by the holding means at the tip, and a processing position above the substrate held by the substrate holding means and a standby position outside the cup. A turning drive unit for turning the nozzle arm so that the discharge head moves, and at least one of the nozzle arms facing a substrate held by the substrate holding means when the discharge head moves to the processing position. Arm cleaning means for cleaning a portion to be cleaned.

  Further, the invention according to claim 2 is the cleaning processing apparatus according to claim 1, wherein the turning drive unit is provided outside the cup and connected to a base end of the nozzle arm, and the arm cleaning means Includes a shower nozzle that ejects cleaning liquid to the nozzle arm when the discharge head is located at the standby position.

  The invention according to claim 3 is the cleaning apparatus according to claim 2, further comprising an elevating drive unit for raising and lowering the nozzle arm, wherein the shower nozzle is fixedly installed on the outer side of the cup. And the elevation drive unit raises and lowers the nozzle arm so that the nozzle arm crosses the flow of the cleaning liquid ejected from the shower nozzle.

  According to a fourth aspect of the present invention, in the cleaning apparatus according to the third aspect of the present invention, the shower nozzle ejects cleaning liquid in a direction away from the substrate holding means.

  The invention according to claim 5 is the cleaning apparatus according to any one of claims 2 to 4, wherein at least a portion of the nozzle arm to which the cleaning liquid ejected from the shower nozzle is attached is used for drying. It is further characterized by further comprising a gas jetting part for blowing and drying gas.

  The invention according to claim 6 is the cleaning apparatus according to claim 5, wherein the gas ejection portion is for drying from the tip side of the nozzle arm when the discharge head is located at the standby position. It is provided in the position which blows gas.

  The invention according to claim 7 is the cleaning apparatus according to any one of claims 1 to 6, wherein a plurality of nozzle arms are connected in parallel to each other along the horizontal direction to the swivel drive unit. It is characterized by that.

  The invention according to claim 8 is the cleaning apparatus according to any one of claims 1 to 6, wherein the nozzle arm has a gas discharge for mixing a gas into the processing liquid discharged from the discharge head. The portion is attached to the side of the ejection head.

  The invention of claim 9 is a cleaning processing method, wherein a nozzle arm having a discharge head for discharging a processing liquid onto a substrate rotated and held in a substantially horizontal posture by a substrate holding means is provided on the substrate. A turning step for turning the discharge head to move between a processing position above the substrate held by the holding means and a standby position outside the cup surrounding the substrate holding means; And at least an arm cleaning step of cleaning a portion facing the substrate held by the substrate holding means when the ejection head moves to the processing position.

  Further, the invention of claim 10 is the cleaning method according to the invention of claim 9, wherein the arm cleaning step is configured to supply cleaning liquid from a shower nozzle to the nozzle arm when the discharge head is located at the standby position. A cleaning liquid jetting step for jetting is included.

  The eleventh aspect of the present invention is the cleaning treatment method according to the tenth aspect of the present invention, wherein in the cleaning liquid ejecting step, the cleaning liquid is ejected from the shower nozzle while being ejected obliquely downward from the shower nozzle. The nozzle arm is moved up and down so that the nozzle arm crosses the flow.

  According to a twelfth aspect of the present invention, in the cleaning method according to the eleventh aspect of the present invention, the shower nozzle ejects a cleaning liquid in a direction away from the substrate holding means.

  The invention of claim 13 is the cleaning method according to any one of claims 10 to 12, wherein at least a portion of the nozzle arm to which the cleaning liquid ejected from the shower nozzle is attached is used for drying. It further comprises an arm drying step in which gas is blown to dry.

  The invention according to claim 14 is the cleaning treatment method according to claim 13, wherein, in the arm drying step, when the discharge head is located at the standby position, drying is performed from the front end side of the nozzle arm. It is characterized by blowing gas.

  The invention of claim 15 is the cleaning method according to any of claims 9 to 14, wherein a plurality of the nozzle arms are provided in parallel to each other along the horizontal direction. To do.

  Further, the invention of claim 16 is the cleaning method according to any one of claims 9 to 14, wherein the nozzle arm has a gas discharge for mixing a gas into the processing liquid discharged from the discharge head. The portion is attached to the side of the ejection head.

  According to the first to eighth aspects of the present invention, at least a portion of the nozzle arm having the discharge head at the tip is opposed to the substrate held by the substrate holding means when the discharge head is moved to the processing position. Since the arm cleaning means is provided, at least the portion of the nozzle arm can be cleaned to prevent contamination caused by the nozzle arm.

  In particular, according to the invention of claim 3, the nozzle arm is moved up and down so that the nozzle arm crosses the flow of the cleaning liquid ejected obliquely downward from the shower nozzle. The whole can be cleaned.

  In particular, according to the invention of claim 4, since the shower nozzle ejects the cleaning liquid in a direction away from the substrate holding means, it is possible to prevent contamination due to the cleaning liquid adhering to the substrate holding means when cleaning the nozzle arm.

  In particular, according to the invention of claim 6, since the gas jetting part blows the drying gas from the tip side of the nozzle arm, the cleaning liquid blown off by the drying gas adheres to the tip side of the nozzle arm provided with the discharge head. Is prevented.

  According to the ninth to sixteenth aspects of the present invention, at least a portion of the nozzle arm having the discharge head at the tip is opposed to the substrate held by the substrate holding means when the discharge head is moved to the processing position. Therefore, at least the part of the nozzle arm can be washed to prevent contamination due to the nozzle arm.

  In particular, according to the invention of claim 11, the nozzle arm is moved up and down so that the nozzle arm crosses the flow of the cleaning liquid ejected from the shower nozzle while ejecting the cleaning liquid obliquely downward from the shower nozzle. The entire nozzle arm can be cleaned regardless of the installation width.

  In particular, according to the twelfth aspect of the present invention, the shower nozzle ejects the cleaning liquid in a direction away from the substrate holding means, so that contamination due to the cleaning liquid adhering to the substrate holding means during the cleaning of the nozzle arm can be prevented.

  In particular, according to the invention of claim 14, since the drying gas is blown from the tip side of the nozzle arm, the cleaning liquid blown off by the drying gas is prevented from adhering to the tip side of the nozzle arm provided with the discharge head. Is done.

It is a top view of the washing processing device concerning the present invention. It is a longitudinal cross-sectional view of the washing | cleaning processing apparatus of FIG. It is a side view of an upper surface process liquid nozzle. It is the front view which looked at the upper surface process liquid nozzle from the front end side. It is a figure which shows the mode of turning operation | movement of an upper surface process liquid nozzle. It is a side view of a two-fluid nozzle. It is the front view which looked at the two fluid nozzle from the front end side. It is a figure which shows the mode of turning operation | movement of a two-fluid nozzle. It is a figure for demonstrating a mode that it wash | cleans, raising / lowering three nozzle arms. It is a figure for demonstrating typically a mode that it dries, rocking three nozzle arms.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a plan view of a cleaning processing apparatus 1 according to the present invention. FIG. 2 is a longitudinal sectional view of the cleaning processing apparatus 1. In addition, in FIG. 1 and subsequent figures, in order to clarify the directional relationship, an XYZ orthogonal coordinate system in which the Z-axis direction is a vertical direction and the XY plane is a horizontal plane is appropriately attached. Further, in FIG. 1 and the subsequent drawings, the dimensions and numbers of the respective parts are exaggerated or simplified as necessary for easy understanding.

  The cleaning apparatus 1 is a single-wafer type substrate processing apparatus that processes semiconductor substrates W one by one, and performs a chemical treatment and a rinsing process using pure water on a circular silicon substrate W, followed by a drying process. I do. FIG. 1 shows a state where the substrate W is not held on the spin chuck 20, and FIG. 2 shows a state where the substrate W is held on the spin chuck 20.

  The cleaning processing apparatus 1 includes a spin chuck 20 that rotates a substrate W as a main element in a horizontal posture (a normal line is a posture along the vertical direction) in the chamber 10, and a substrate W held by the spin chuck 20. An upper surface processing liquid nozzle 60 for supplying a processing liquid to the upper surface, a two-fluid nozzle 80 for ejecting a mixed fluid of processing liquid droplets and gas onto the substrate W, and a processing cup 40 surrounding the spin chuck 20. . A partition plate 15 is provided around the processing cup 40 in the chamber 10 to partition the inner space of the chamber 10 up and down. In addition, in this specification, a process liquid is a general term including both a chemical | medical solution and a pure water.

  The chamber 10 includes a side wall 11 along the vertical direction, a ceiling wall 12 that closes an upper side of a space surrounded by the side wall 11, and a floor wall 13 that closes a lower side. A space surrounded by the side wall 11, the ceiling wall 12, and the floor wall 13 is a processing space for the substrate W. Further, a part of the side wall 11 of the chamber 10 is provided with a carry-in / out opening for carrying the substrate W in / out of the chamber 10 and a shutter for opening / closing the carry-in / out opening (both not shown).

  A fan filter unit (FFU) 14 for further purifying the air in the clean room in which the cleaning processing apparatus 1 is installed and supplying it to the processing space in the chamber 10 is attached to the ceiling wall 12 of the chamber 10. . The fan filter unit 14 includes a fan and a filter (for example, a HEPA filter) for taking in air in the clean room and sending it out into the chamber 10, and forms a downflow of clean air in the processing space in the chamber 10. In order to disperse the clean air supplied from the fan filter unit 14 uniformly, a punching plate having a large number of blowing holes may be provided directly below the ceiling wall 12.

  The spin chuck 20 includes a disc-shaped spin base 21 fixed in a horizontal posture at the upper end of a rotation shaft 24 extending along the vertical direction, and a spin motor 22 that is disposed below the spin base 21 and rotates the rotation shaft 24. And a cylindrical cover member 23 surrounding the periphery of the spin motor 22. The outer diameter of the disk-shaped spin base 21 is slightly larger than the diameter of the circular substrate W held by the spin chuck 20. Therefore, the spin base 21 has a holding surface 21a that faces the entire lower surface of the substrate W to be held.

  A plurality (four in this embodiment) of chuck members 26 are erected on the peripheral edge of the holding surface 21 a of the spin base 21. The plurality of chuck members 26 are equally spaced along the circumference corresponding to the outer circumference of the circular substrate W (if there are four chuck members 26 as in the present embodiment, the chuck members 26 are spaced at 90 ° intervals. ) Is arranged. The plurality of chuck members 26 are driven in conjunction with a link mechanism (not shown) housed in the spin base 21. The spin chuck 20 causes each of the plurality of chuck members 26 to come into contact with the edge of the substrate W to sandwich the substrate W, so that the substrate W is placed in a horizontal position close to the holding surface 21 a above the spin base 21. (See FIG. 2), and each of the plurality of chuck members 26 can be released from the edge of the substrate W to be released.

  The cover member 23 covering the spin motor 22 has a lower end fixed to the floor wall 13 of the chamber 10 and an upper end reaching just below the spin base 21. At the upper end portion of the cover member 23, a hook-like member 25 is provided that protrudes almost horizontally outward from the cover member 23 and further bends and extends downward. The spin motor 22 rotates the rotating shaft 24 in a state where the spin chuck 20 holds the substrate W by being sandwiched by the plurality of chuck members 26, thereby rotating around the rotation axis CX along the vertical direction passing through the center of the substrate W. The substrate W can be rotated. The driving of the spin motor 22 is controlled by the control unit 3.

  The processing cup 40 surrounding the spin chuck 20 includes an inner cup 41, an intermediate cup 42, and an outer cup 43 that can be moved up and down independently of each other. The inner cup 41 surrounds the periphery of the spin chuck 20 and has a shape that is substantially rotationally symmetric with respect to the rotation axis CX that passes through the center of the substrate W held by the spin chuck 20. The inner cup 41 includes an annular bottom 44 in plan view, a cylindrical inner wall 45 rising upward from the inner periphery of the bottom 44, a cylindrical outer wall 46 rising upward from the outer periphery of the bottom 44, and an inner wall The first guide portion 47 that rises from between the portion 45 and the outer wall portion 46 and extends obliquely upward in the center side (in the direction approaching the rotation axis CX of the substrate W held by the spin chuck 20) while drawing a smooth arc at the upper end portion. And a cylindrical middle wall portion 48 that rises upward from between the first guide portion 47 and the outer wall portion 46.

  The inner wall portion 45 is formed in such a length as to be accommodated with an appropriate gap between the cover member 23 and the bowl-shaped member 25 in a state where the inner cup 41 is raised most. The middle wall portion 48 is accommodated with a suitable gap between a second guide portion 52 (described later) of the middle cup 42 and the processing liquid separation wall 53 in a state where the inner cup 41 and the middle cup 42 are closest to each other. It is formed in such a length.

  The first guide portion 47 has an upper end portion 47b extending obliquely upward in the center side (in the direction approaching the rotation axis CX of the substrate W) while drawing a smooth arc. Further, a space between the inner wall portion 45 and the first guide portion 47 is a disposal groove 49 for collecting and discarding the used processing liquid. A space between the first guide portion 47 and the middle wall portion 48 is an annular inner collection groove 50 for collecting and collecting used processing liquid. Further, a space between the middle wall portion 48 and the outer wall portion 46 is an annular outer collection groove 51 for collecting and collecting different types of processing liquids from the inner collection groove 50.

  The waste groove 49 is connected to an exhaust liquid mechanism (not shown) for discharging the processing liquid collected in the waste groove 49 and forcibly exhausting the inside of the waste groove 49. For example, four exhaust fluid mechanisms are provided at equal intervals along the circumferential direction of the discard groove 49. Further, the inner recovery groove 50 and the outer recovery groove 51 have a recovery mechanism for recovering the processing liquid collected in the inner recovery groove 50 and the outer recovery groove 51, respectively, in a recovery tank provided outside the cleaning processing apparatus 1. (Both not shown) are connected. The bottoms of the inner recovery groove 50 and the outer recovery groove 51 are inclined by a slight angle with respect to the horizontal direction, and the recovery mechanism is connected to the lowest position. Thereby, the processing liquid that has flowed into the inner recovery groove 50 and the outer recovery groove 51 is smoothly recovered.

  The middle cup 42 surrounds the periphery of the spin chuck 20 and has a shape that is substantially rotationally symmetric with respect to the rotation axis CX passing through the center of the substrate W held by the spin chuck 20. The inner cup 42 is integrally provided with a second guide portion 52 and a cylindrical processing liquid separation wall 53 connected to the second guide portion 52.

  The second guide portion 52 draws a smooth arc on the outside of the first guide portion 47 of the inner cup 41 from the lower end portion 52a that is coaxial with the lower end portion of the first guide portion 47 and the upper end of the lower end portion 52a. However, it has an upper end 52b that extends obliquely upward in the center side (in the direction approaching the rotation axis CX of the substrate W) and a folded portion 52c that is formed by folding the tip of the upper end 52b downward. The lower end 52 a is accommodated in the inner collection groove 50 with an appropriate gap between the first guide portion 47 and the middle wall portion 48 in a state where the inner cup 41 and the middle cup 42 are closest to each other. The upper end portion 52b is provided so as to overlap the upper end portion 47b of the first guide portion 47 of the inner cup 41 in the vertical direction, and the first guide portion 47 is in a state where the inner cup 41 and the middle cup 42 are closest to each other. And close to the upper end portion 47b with a very small distance. Further, the folded portion 52c formed by folding the tip of the upper end portion 52b downward is in a state where the inner cup 41 and the middle cup 42 are closest to each other, and the folded portion 52c is the tip of the upper end portion 47b of the first guide portion 47. It is the length which overlaps with the horizontal direction.

  Further, the upper end portion 52b of the second guide portion 52 is formed so as to increase in thickness toward the lower side, and the treatment liquid separation wall 53 is provided so as to extend downward from the lower peripheral edge of the upper end portion 52b. It has a cylindrical shape. The processing liquid separation wall 53 is accommodated in the outer collection groove 51 with an appropriate gap between the inner wall portion 48 and the outer cup 43 in a state where the inner cup 41 and the inner cup 42 are closest to each other.

  The outer cup 43 surrounds the periphery of the spin chuck 20 outside the second guide portion 52 of the middle cup 42 and is substantially rotationally symmetric with respect to the rotation axis CX passing through the center of the substrate W held by the spin chuck 20. It has a shape. The outer cup 43 has a function as a third guide part. The outer cup 43 has a lower end portion 43a that is coaxially cylindrical with the lower end portion 52a of the second guide portion 52, and a center side while drawing a smooth arc from the upper end of the lower end portion 43a (in the direction approaching the rotation axis CX of the substrate W). The upper end portion 43b extends obliquely upward, and the folded portion 43c is formed by folding the tip end portion of the upper end portion 43b downward.

  The lower end portion 43a has an outer clearance groove with an appropriate gap between the processing liquid separation wall 53 of the inner cup 42 and the outer wall portion 46 of the inner cup 41 in a state where the inner cup 41 and the outer cup 43 are closest to each other. 51. The upper end portion 43b is provided so as to overlap the second guide portion 52 of the middle cup 42 in the vertical direction, and the upper end portion 52b of the second guide portion 52 is in a state where the middle cup 42 and the outer cup 43 are closest to each other. Close to each other with a very small distance. Further, the folded portion 43 c formed by folding the tip end portion of the upper end portion 43 b downward is in a state where the inner cup 42 and the outer cup 43 are closest to each other, and the folded portion 43 c is the same as the folded portion 52 c of the second guide portion 52. It is formed so as to overlap in the horizontal direction.

  Further, the inner cup 41, the middle cup 42, and the outer cup 43 can be moved up and down independently of each other. That is, each of the inner cup 41, the middle cup 42, and the outer cup 43 is provided with a lifting mechanism (not shown), and is lifted and lowered separately. As such an elevating mechanism, various known mechanisms such as a ball screw mechanism and an air cylinder can be employed.

  FIG. 3 is a side view of the upper treatment liquid nozzle 60. FIG. 4 is a front view of the top treatment liquid nozzle 60 as viewed from the tip side. The upper surface treatment liquid nozzle 60 is configured by attaching an ejection head 61 to the tip of each of three nozzle arms 62 provided in parallel to each other. The proximal ends of the three nozzle arms 62 are connected to the turning drive unit 63. Three nozzle arms 62 are connected to the turning drive unit 63 so as to be parallel to each other along the horizontal direction. The turning drive unit 63 is installed outside the processing cup 40. The swivel drive unit 63 is capable of swiveling around a vertical axis by a built-in swivel motor (not shown), and swivels the three nozzle arms 62 at once in a horizontal plane (in the XY plane). be able to.

  FIG. 5 is a diagram showing the state of the turning operation of the upper surface treatment liquid nozzle 60. As shown in FIG. 5, in the turning drive unit 63, the ejection head 61 moves in an arc shape between a processing position above the substrate W held by the spin chuck 20 and a standby position outside the processing cup 40. In this manner, the nozzle arm 62 is swung in a horizontal plane. The positions of the three nozzle arms 62 when the ejection head 61 has reached the processing position are indicated by dotted lines in FIG. Further, the positions of the three nozzle arms 62 when the ejection head 61 has reached the standby position are indicated by solid lines in FIG. The operation of turning the nozzle arm 62 so that the ejection head 61 moves between the processing position and the standby position is also expressed as turning the nozzle arm 62 between the processing position and the standby position.

  As shown in FIG. 3, each of the three nozzle arms 62 is connected to the turning drive unit 63 on the base end side so as to extend from the turning drive unit 63 along the horizontal direction. The tip side of each nozzle arm 62 is directed downward while drawing a smooth arc. Then, a discharge head 61 that discharges the processing liquid onto the substrate W held by the spin chuck 20 is attached to the tip of each nozzle arm 62 that faces the lower side in the vertical direction ((−Z) side). A plurality of types of processing liquids (including at least pure water) are supplied to the discharge head 61 from the processing liquid supply mechanism (not shown) via the inside of the nozzle arm 62. The processing liquid supplied to the discharge head 61 is discharged from the discharge head 61 downward in the vertical direction. The processing liquid discharged from the discharge head 61 at the processing position above the substrate W held by the spin chuck 20 is deposited on the upper surface of the substrate W. On the other hand, when the ejection head 61 is moved to the standby position outside the processing cup 40, the nozzle arm 62 is also waiting along the Y direction outside the processing cup 40 (see FIGS. 1 and 5). ).

  Further, the turning drive unit 63 is attached to the lift drive unit 64. The elevating drive unit 64 elevates and lowers the three ejection heads 61 and the three nozzle arms 62 together with the turning drive unit 63 along the vertical direction by a built-in elevating motor (not shown).

  An arm cleaning unit 70 and an arm drying unit 75 are provided in the vicinity of the standby positions of the discharge head 61 and the nozzle arm 62. The arm cleaning unit 70 includes a shower nozzle 71. The shower nozzle 71 is fixedly installed obliquely above the spin chuck 20 side ((−X) side) with respect to the nozzle arm 62 at the standby position. The shower nozzle 71 extends in parallel with the nozzle arm 62 at the standby position, that is, along the Y direction. The length of the shower nozzle 71 in the Y direction is longer than the length of the nozzle arm 62 in the Y direction. The shower nozzle 71 has a plurality of ejection holes arranged in the Y direction. The ejection direction of the plurality of ejection holes is obliquely downward toward the upper surface treatment liquid nozzle 60.

  The shower nozzle 71 is configured to be supplied with a cleaning liquid (pure water in this embodiment) from a cleaning liquid supply mechanism (not shown). When the cleaning liquid is supplied to the shower nozzle 71, the cleaning liquid is ejected from the plurality of ejection holes provided in the shower nozzle 71 toward the upper surface processing liquid nozzle 60 obliquely below (see FIGS. 3 to 5). As a result, the three nozzle arms 62 of the upper surface treatment liquid nozzle 60 are cleaned, details of which will be described later.

  The arm drying unit 75 includes two drying gas nozzles 76. The dry gas nozzle 76 is fixedly installed on the (+ Y) side of the nozzle arm 62 at the standby position and at substantially the same height as the nozzle arm 62. In the present embodiment, two dry gas nozzles 76 are provided at a position facing the nozzle arm 62 closest to the spin chuck 20 ((−X) side) among the three nozzle arms 62 at the standby position. . The two drying gas nozzles 76 of the arm drying unit 75 are arranged side by side at a predetermined interval in the vertical direction (see FIG. 3). Each drying gas nozzle 76 is provided along the horizontal direction.

The two drying gas nozzles 76 are configured to be supplied with a drying gas (nitrogen gas (N ₂ ) in the present embodiment) from a drying gas supply source (not shown). When the drying gas is supplied to the drying gas nozzle 76, the drying gas is ejected from the tip of the drying gas nozzle 76 toward the upper surface treatment liquid nozzle 60 (see FIGS. 3 and 5). Since the drying gas nozzle 76 is provided further forward ((+ Y) side) than the tip of the nozzle arm 62, the drying gas is blown from the tip side of the nozzle arm 62.

  In the cleaning processing apparatus 1, a two-fluid nozzle 80 is provided in addition to the upper surface processing liquid nozzle 60. FIG. 6 is a side view of the two-fluid nozzle 80. FIG. 7 is a front view of the two-fluid nozzle 80 as viewed from the front end side. The two-fluid nozzle 80 is a cleaning nozzle that mixes a treatment liquid such as pure water with a pressurized gas to generate droplets and injects a mixed fluid of the droplets and gas onto the substrate W. The two-fluid nozzle 80 is configured by attaching a discharge head 81 to the tip of a nozzle arm 82 and attaching a gas head 85 to a support member 86 provided so as to branch from the nozzle arm 82. The proximal end side of the nozzle arm 82 is connected to the turning drive unit 83. The turning drive unit 83 is disposed outside the processing cup 40. The turning drive unit 83 is capable of turning around a vertical axis by a built-in turning motor (not shown), and can turn the nozzle arm 82 in a horizontal plane (in the XY plane).

  FIG. 8 is a diagram illustrating a turning operation of the two-fluid nozzle 80. As shown in FIG. 8, in the turning drive unit 83, the ejection head 81 moves in an arc shape between a processing position above the substrate W held by the spin chuck 20 and a standby position outside the processing cup 40. In this manner, the nozzle arm 82 is turned in a horizontal plane. The position of the nozzle arm 82 when the discharge head 81 reaches the processing position is indicated by a dotted line in FIG. Further, the position of the nozzle arm 82 when the ejection head 81 has reached the standby position is indicated by a solid line in FIG. As in the case of the upper surface processing liquid nozzle 60, the operation of turning the nozzle arm 82 so that the ejection head 81 moves between the processing position and the standby position is performed between the processing position and the standby position. Also expressed as turning the arm 82.

  As shown in FIG. 6, the base end side of the nozzle arm 82 is connected to the turning drive unit 83 so as to extend from the turning drive unit 83 along the horizontal direction. The tip side of the nozzle arm 82 is directed downward while drawing a smooth arc. A discharge head 81 that discharges the processing liquid toward the substrate W held by the spin chuck 20 is attached to the tip of the nozzle arm 82 that faces downward in the vertical direction ((−Z) side). A treatment liquid (pure water in this embodiment) is supplied to the discharge head 81 from the treatment liquid supply mechanism (not shown) via the inside of the nozzle arm 82.

  A support member 86 is attached in the middle of the nozzle arm 82. A gas head 85 is attached to the support member 86. The gas head 85 is provided on the support member 86 so as to be positioned on the side of the ejection head 81. The gas head 85 is supplied with a pressurized inert gas (nitrogen gas in this embodiment). While discharging the processing liquid from the discharge head 81 at the processing position, the pressurized inert gas is ejected from the gas head 85 and mixed with the processing liquid from the discharge head 81 to generate droplets of the processing liquid. Then, the mixed fluid of the droplet and the inert gas is sprayed onto the upper surface of the substrate W held by the spin chuck 20. On the other hand, when the ejection head 81 is moved to the standby position outside the processing cup 40, the nozzle arm 82 is also waiting along the X direction outside the processing cup 40 (see FIGS. 1 and 8). ).

  Further, the turning drive unit 83 is attached to the elevating drive unit 84. The raising / lowering drive part 84 raises / lowers the discharge head 81, the gas head 85, and the nozzle arm 82 together with the turning drive part 83 along the vertical direction by a built-in raising / lowering motor (not shown).

  An arm cleaning unit 90 and an arm drying unit 95 are provided in the vicinity of the standby positions of the discharge head 81 and the nozzle arm 82. The arm cleaning unit 90 includes a shower nozzle 91. The shower nozzle 91 is fixedly installed obliquely above the spin chuck 20 side ((+ Y) side) from the nozzle arm 82 at the standby position. The shower nozzle 91 extends in parallel with the nozzle arm 82 at the standby position, that is, along the X direction. The length of the shower nozzle 91 in the X direction is longer than the length of the nozzle arm 82 in the X direction. The shower nozzle 91 is provided with a plurality of ejection holes arranged in the X direction. The ejection direction of the plurality of ejection holes is obliquely downward toward the two-fluid nozzle 80.

  The shower nozzle 91 is configured to be supplied with a cleaning liquid (pure water in this embodiment) from a cleaning liquid supply mechanism (not shown). When the cleaning liquid is supplied to the shower nozzle 91, the cleaning liquid is ejected from the plurality of ejection holes provided in the shower nozzle 91 toward the two-fluid nozzle 80 obliquely below (see FIGS. 6 to 8). As a result, the nozzle arm 82 of the two-fluid nozzle 80 is cleaned.

  The arm drying unit 95 includes two drying gas nozzles 96. The dry gas nozzle 96 is fixedly installed on the (−X) side of the nozzle arm 82 at the standby position and at substantially the same height as the nozzle arm 82. The two drying gas nozzles 96 of the arm drying unit 95 are arranged side by side at a predetermined interval in the vertical direction (see FIG. 6). Each dry gas nozzle 96 is provided along the horizontal direction.

  In addition to the two dry gas nozzles 96, a dry gas nozzle 97 and a dry gas nozzle 98 are provided. The dry gas nozzles 97 and 98 are provided toward the support member 86 and the gas head 85 when the nozzle arm 82 is waiting at the standby position.

  The two drying gas nozzles 96 and the drying gas nozzles 97 and 98 are configured to be supplied with a drying gas (nitrogen gas in the present embodiment) from a drying gas supply source (not shown). When the drying gas is supplied to the drying gas nozzle 96, the drying gas is ejected from the tip of the drying gas nozzle 96 toward the two-fluid nozzle 80 (see FIGS. 6 and 8). Since the drying gas nozzle 96 is provided further forward ((−X) side) than the tip of the nozzle arm 82, the drying gas is blown from the tip side of the nozzle arm 82. Further, when the drying gas is supplied to the drying gas nozzles 97 and 98, the drying gas is also ejected from the tips of the drying gas nozzles 97 and 98 toward the two-fluid nozzle 80.

  On the other hand, in addition to the upper treatment liquid nozzle 60 and the two-fluid nozzle 80, a lower treatment liquid nozzle 28 is provided along the vertical direction so as to pass through the inside of the rotating shaft 24 (see FIG. 2). The upper end opening of the lower surface treatment liquid nozzle 28 is formed at a position facing the lower surface center of the substrate W held by the spin chuck 20. A plurality of types of processing liquids are also supplied to the lower surface processing liquid nozzle 28. The processing liquid discharged from the lower surface processing liquid nozzle 28 is deposited on the lower surface of the substrate W held by the spin chuck 20.

  As shown in FIGS. 1 and 2, the partition plate 15 is provided so as to partition the inner space of the chamber 10 up and down around the processing cup 40. The partition plate 15 may be a single plate-like member surrounding the processing cup 40, or may be a combination of a plurality of plate-like members. Further, the partition plate 15 may be formed with through holes or notches penetrating in the thickness direction. In the present embodiment, the partition plate 15 supports the elevation drive units 64 and 84 of the upper treatment liquid nozzle 60 and the two-fluid nozzle 80. A through hole is formed through which a support shaft is inserted.

  The outer peripheral end of the partition plate 15 is connected to the side wall 11 of the chamber 10. Further, the edge portion surrounding the processing cup 40 of the partition plate 15 is formed to have a circular shape having a diameter larger than the outer diameter of the outer cup 43. Therefore, the partition plate 15 does not become an obstacle to the raising and lowering of the outer cup 43.

  An exhaust duct 18 is provided in a part of the side wall 11 of the chamber 10 and in the vicinity of the floor wall 13. The exhaust duct 18 is connected in communication with an exhaust mechanism (not shown). Of the clean air supplied from the fan filter unit 14 and flowing down in the chamber 10, the air that has passed between the processing cup 40 and the partition plate 15 is discharged from the exhaust duct 18 to the outside of the apparatus.

  The configuration of the control unit 3 provided in the cleaning processing apparatus 1 as hardware is the same as that of a general computer. That is, the control unit 3 stores a CPU that performs various arithmetic processes, a ROM that is a read-only memory that stores basic programs, a RAM that is a readable and writable memory that stores various information, control software, data, and the like. It is configured with a magnetic disk to be placed. When the CPU of the control unit 3 executes a predetermined processing program, each operation mechanism of the cleaning processing apparatus 1 is controlled by the control unit 3, and processing in the cleaning processing apparatus 1 proceeds.

  Next, the operation of the cleaning processing apparatus 1 having the above configuration will be described. An outline of a general processing procedure of the substrate W in the cleaning processing apparatus 1 is as follows. After supplying a chemical solution to the surface of the substrate W and performing a predetermined chemical processing, supplying pure water and performing a pure water rinsing process, The substrate W is rotated at a high speed to perform a shake-off drying process. When processing the substrate W, the substrate W is held on the spin chuck 20 and the processing cup 40 moves up and down. When performing the chemical treatment, for example, only the outer cup 43 rises, and the substrate W held by the spin chuck 20 between the upper end portion 43b of the outer cup 43 and the upper end portion 52b of the second guide portion 52 of the middle cup 42 is used. An opening is formed to surround the periphery of the. In this state, the substrate W is rotated together with the spin chuck 20, and a chemical solution is supplied to the upper and lower surfaces of the substrate W from the upper surface processing liquid nozzle 60 and the lower surface processing liquid nozzle 28. The supplied chemical liquid flows along the upper and lower surfaces of the substrate W due to the centrifugal force generated by the rotation of the substrate W, and is eventually scattered from the edge of the substrate W to the side. Thereby, the chemical treatment of the substrate W proceeds. The chemical solution splashed from the edge of the rotating substrate W is received by the upper end portion 43 b of the outer cup 43, flows down along the inner surface of the outer cup 43, and is collected in the outer collection groove 51.

  When performing the pure water rinsing process, for example, all of the inner cup 41, the middle cup 42 and the outer cup 43 are raised, and the periphery of the substrate W held by the spin chuck 20 is the first guide portion 47 of the inner cup 41. Surrounded by. In this state, the substrate W is rotated together with the spin chuck 20, and pure water is supplied to the upper and lower surfaces of the substrate W from the upper surface processing liquid nozzle 60 and the lower surface processing liquid nozzle 28. The supplied pure water flows along the upper and lower surfaces of the substrate W due to the centrifugal force generated by the rotation of the substrate W, and is eventually scattered from the edge of the substrate W to the side. Thereby, the pure water rinse process of the board | substrate W advances. The pure water splashed from the edge of the rotating substrate W flows down the inner wall of the first guide portion 47 and is discharged from the discard groove 49. In the case where pure water is collected by a path different from the chemical solution, the middle cup 42 and the outer cup 43 are raised, and the upper end portion 52b of the second guide portion 52 of the middle cup 42 and the first guide of the inner cup 41 are collected. An opening surrounding the periphery of the substrate W held by the spin chuck 20 may be formed between the upper end portion 47 b of the portion 47.

  Further, when performing the swing-off drying process, all of the inner cup 41, the middle cup 42 and the outer cup 43 are lowered, and the upper end portion 47 b of the first guide portion 47 of the inner cup 41 and the second guide portion 52 of the middle cup 42 are moved. Both the upper end portion 52 b and the upper end portion 43 b of the outer cup 43 are positioned below the substrate W held by the spin chuck 20. In this state, the substrate W is rotated at a high speed together with the spin chuck 20, and water droplets adhering to the substrate W are shaken off by a centrifugal force, and a drying process is performed.

  When the surface treatment is performed by supplying such a treatment liquid to the substrate W, most of the treatment liquid scattered from the rotating substrate W is collected by the treatment cup 40, but a part is treated as a mist. It may scatter to the outside of the cup 40. The processing liquid splashed to the outside of the processing cup 40 adheres to the nozzle arm 62 of the upper processing liquid nozzle 60 and the nozzle arm 82 of the two-fluid nozzle 80 in addition to the outer upper surface of the processing cup 40 and the upper surface of the partition plate 15. If the processing liquid adhering to the nozzle arms 62 and 82 is left as it is, the processing liquid adhering when the nozzle arms 62 and 82 are moved to the processing position falls on the upper surface of the substrate W (so-called “bottom dropping”) and becomes a contamination source. Alternatively, the attached treatment liquid may be dried and the nozzle arms 62 and 82 may become a particle generation source.

  For this reason, in the present embodiment, the cleaning process of the nozzle arm 62 of the upper processing liquid nozzle 60 and the nozzle arm 82 of the two-fluid nozzle 80 is performed as follows. The timing for performing such arm cleaning processing may be, for example, from the end of processing of one lot to the start of processing of the next lot. The nozzle arms 62 and 82 are preferably cleaned between the processing lots and after the outer upper surface 43d of the processing cup 40 is cleaned and then the upper surface of the partition plate 15 is cleaned. This is because if the partition plate 15 and the processing cup 40 are cleaned after the nozzle arms 62 and 82 are cleaned, mist generated during the cleaning may be attached to the nozzle arms 62 and 82 again. It is.

  When cleaning the three nozzle arms 62 of the upper surface processing liquid nozzle 60, the three nozzle arms 62 and the discharge head 61 are moved to the standby position outside the processing cup 40 by the turning drive unit 63, and the standby position Arm cleaning is performed at The standby position is a predetermined position where the three nozzle arms 62 arrive by the turning operation by the turning drive unit 63 regardless of the height position of the nozzle arm 62. That is, at the standby position, the ejection head 61 and the nozzle arm 62 can be moved up and down by the lifting drive unit 64.

  When the nozzle arm 62 and the discharge head 61 are located at the standby position, the cleaning liquid is ejected from the shower nozzle 71 of the arm cleaning unit 70. From the shower nozzle 71, the cleaning liquid is ejected obliquely downward toward the (+ X) side. The cleaning liquid ejected from the shower nozzle 71 is sprayed to the nozzle arm 62 of the upper surface processing liquid nozzle 60. As a result, the nozzle arm 62 is cleaned.

  However, the shower nozzle 71 has a plurality of ejection holes arranged in a line, and the liquid flow of the cleaning liquid is ejected in a line from the plurality of ejection holes. On the other hand, the upper surface treatment liquid nozzle 60 is provided with three nozzle arms 62 connected in parallel to each other along the horizontal direction in the turning drive unit 63. Therefore, it is difficult to simultaneously wash the three nozzle arms 62 with the cleaning liquid flow ejected in a line.

  For this reason, in this embodiment, the raising / lowering drive part 64 raises / lowers the nozzle arm 62 so that the nozzle arm 62 may cross the liquid flow of the washing | cleaning liquid sprayed diagonally downward from the shower nozzle 71. FIG. FIG. 9 is a diagram for schematically explaining how the three nozzle arms 62 are cleaned while being raised and lowered. As shown by the dotted line in the drawing, the lifting / lowering drive unit 64 lifts and lowers the three nozzle arms 62 at the standby position while discharging the cleaning liquid obliquely downward as shown by the dotted line in the figure. When the three nozzle arms 62 are located at the height position L <b> 1, the cleaning liquid is sprayed on the nozzle arm 62 on the most (+ X) side of the three nozzle arms 62 to be cleaned. When the elevation drive unit 64 raises the three nozzle arms 62 from the height position L1 to the height position L2, the central nozzle arm of the three nozzle arms 62 is formed at the position where the liquid flow of the cleaning liquid is formed. 62 arrives, and the cleaning liquid is sprayed onto the central nozzle arm 62 for cleaning. Further, when the lifting / lowering drive unit 64 raises the three nozzle arms 62 from the height position L2 to the height position L3, the most of the three nozzle arms 62 (( The nozzle arm 62 on the −X) side reaches, and the cleaning liquid is sprayed on the nozzle arm 62 to be cleaned.

  In this way, when the nozzle arm 62 moves up and down so that the nozzle arm 62 crosses the flow of the cleaning liquid ejected obliquely downward from the shower nozzle 71, the shower arm 71 moves the nozzle arm 62. The cleaning liquid can be sequentially jetted onto all of the nozzle arms 62 for cleaning.

  Moreover, the Y direction length of the arrangement | sequence of the several ejection hole provided in the shower nozzle 71 is longer than the Y direction length of the nozzle arm 62, and the nozzle arm 62 by the washing | cleaning liquid sprayed diagonally downward from the shower nozzle 71 is provided. The whole is washed. Accordingly, the portion of the nozzle arm 62 that faces the substrate W held by the spin chuck 20 when the discharge head 61 moves to the processing position, that is, the portion that reaches the upper side of the substrate W is surely cleaned. Can do.

  In addition, the shower nozzle 71 ejects the cleaning liquid in an obliquely downward direction toward the (+ X) side, that is, the cleaning liquid is ejected in a direction away from the spin chuck 20 that holds the substrate W. As a result, the mist of the cleaning liquid generated by spraying the nozzle arm 62 and the like is scattered toward the side wall 11 of the chamber 10 and hardly adheres to the spin chuck 20. As a result, it is possible to prevent the spin chuck 20 from being contaminated by cleaning the nozzle arm 62 of the upper surface treatment liquid nozzle 60.

  After the cleaning drive unit 64 moves up and down the three nozzle arms 62 while discharging the cleaning liquid obliquely downward from the shower nozzle 71, after all the cleaning of the three nozzle arms 62 is completed, the shower nozzle 71 stops the ejection of the cleaning liquid. Next, the three nozzle arms 62 are dried.

  Even when the three nozzle arms 62 of the upper processing liquid nozzle 60 are dried, the three nozzle arms 62 and the ejection head 61 are located at the standby position, and the arm drying is performed at the standby position. . A drying gas (nitrogen gas) is blown from the two drying gas nozzles 76 of the arm drying unit 75 to the nozzle arm 62 at the standby position. A drying gas is ejected from the drying gas nozzle 76 toward the (−Y) side in the horizontal direction. The drying gas ejected from the drying gas nozzle 76 is blown to the nozzle arm 62 of the upper surface treatment liquid nozzle 60. As a result, the nozzle arm 62 to which the cleaning liquid is adhered after the cleaning is dried.

  As shown in FIG. 3, the two drying gas nozzles 76 of the arm drying unit 75 are arranged side by side with a predetermined interval in the vertical direction. The drying gas is blown from the upper drying gas nozzle 76 to the portion extending in the horizontal direction of the nozzle arm 62, and the lower drying gas nozzle 76 dries the nozzle arm 62 toward the lower side while drawing a smooth arc. The elevation drive unit 64 adjusts the height position of the nozzle arm 62 so that the working gas is blown. Thereby, the drying gas is sprayed over the entire nozzle arm 62. As a result, at least a portion of the nozzle arm 62 to which the cleaning liquid ejected from the shower nozzle 71 is attached is sprayed with the drying gas and dried.

  However, the two dry gas nozzles 76 arranged in the vertical direction with a predetermined interval are connected to the swivel driving unit 63, although the drying gas can be sprayed to the entire nozzle arm 62. It is difficult to spray the drying gas simultaneously on the three nozzle arms 62.

  For this reason, in this embodiment, the turning drive unit 63 swings the nozzle arm 62 so that the nozzle arm 62 crosses the flow of the drying gas ejected from the drying gas nozzle 76 in the horizontal direction. FIG. 10 is a diagram for schematically explaining how the three nozzle arms 62 are dried while being swung. The swivel drive unit 63 swings the three nozzle arms 62 in a horizontal plane while ejecting a drying gas from the fixedly installed drying gas nozzle 76 toward the (−Y) side in the horizontal direction. Accordingly, the drying gas ejected from the drying gas nozzle 76 is sequentially blown to the three nozzle arms 62. As a result, the drying gas can be sprayed onto all of the three nozzle arms 62 of the upper surface treatment liquid nozzle 60 to dry it. Note that when the nozzle arm 62 is dried, the angle at which the turning drive unit 63 swings the nozzle arm 62 is such that all three nozzle arms 62 cross the flow of the drying gas ejected from the drying gas nozzle 76. It should be a degree.

  Further, since the drying gas nozzle 76 is provided further forward ((+ Y) side) than the tip of the nozzle arm 62, the drying gas is blown from the tip side of the nozzle arm 62. Thereby, even when the cleaning liquid adhering to the nozzle arm 62 is blown off by blowing the drying gas, it is blown to the base end side ((−Y) side) of the nozzle arm 62. It is possible to prevent the liquid droplets of the cleaning liquid from adhering to the distal ends of the discharge head 61 and the nozzle arm 62. As a result, the portion of the nozzle arm 62 that faces the substrate W held by the spin chuck 20 when the ejection head 61 moves to the processing position can be kept clean.

  While the drying gas is ejected from the drying gas nozzle 76 in the horizontal direction, the swivel drive unit 63 swings the three nozzle arms 62 in the horizontal plane, so that all the drying processes of the three nozzle arms 62 are performed. After the completion, the ejection of the drying gas from the drying gas nozzle 76 is stopped. In this way, the cleaning process and the drying process of the nozzle arm 62 of the upper processing liquid nozzle 60 are completed.

  According to this embodiment, even if the processing liquid adheres to the nozzle arm 62 of the upper surface processing liquid nozzle 60, the cleaning gas is sprayed from the shower nozzle 71 to the nozzle arm 62 and cleaned, and then the drying gas nozzle 76 supplies the drying gas. The treatment liquid adhering to the surface is removed by spraying out. For this reason, it is possible to prevent contamination caused by leaving the treatment liquid attached to the nozzle arm 62.

  In the present embodiment, a shower nozzle 71 that ejects the cleaning liquid and a dry gas nozzle 76 that ejects the drying gas are fixedly installed. When these elements are mounted on the upper surface processing liquid nozzle 60 itself, the piping for supplying fluid (here, cleaning liquid and drying gas) to the shower nozzle 71 and the drying gas nozzle 76 must be movable. In other words, there is no choice but to be constrained by interference with the installation space and the top treatment liquid nozzle 60. If the shower nozzle 71 and the dry gas nozzle 76 are fixedly installed, the piping for supplying fluid to them can also be fixed piping, and there is no such restriction.

  The cleaning process and the drying process of the nozzle arm 82 of the two-fluid nozzle 80 are also substantially the same as the upper surface processing liquid nozzle 60 described above. That is, the nozzle arm 82 is cleaned by ejecting cleaning liquid from the shower nozzle 91 to the nozzle arm 82 at the standby position. At this time, the raising / lowering drive part 84 raises / lowers the nozzle arm 82 so that the nozzle arm 82 crosses the liquid flow of the washing | cleaning liquid sprayed toward the (-Y) side from the shower nozzle 91 diagonally downward.

  As for the two-fluid nozzle 80, since there is one nozzle arm 82, it is not always necessary to raise and lower the nozzle arm 82 as with the upper surface treatment liquid nozzle 60, but a support member branched from the middle of the nozzle arm 82 In order to surely clean the nozzle 86, it is preferable to raise and lower the nozzle arm 82 with respect to the flow of the cleaning liquid ejected obliquely downward as described above. The lifting / lowering drive unit 84 lifts and lowers the nozzle arm 82 so that the nozzle arm 82 crosses the flow of the cleaning liquid ejected obliquely downward from the shower nozzle 91, thereby supporting the nozzle arm 82 and the support by the single shower nozzle 91. The cleaning liquid can be sequentially jetted to both the members 86 for cleaning.

  Further, the X direction length of the array of the plurality of ejection holes provided in the shower nozzle 91 is longer than the X direction length of the nozzle arm 82, and the nozzle arm 82 is caused by the cleaning liquid ejected obliquely downward from the shower nozzle 91. The whole is washed. Therefore, a portion of the nozzle arm 82 that faces the substrate W held by the spin chuck 20 when the discharge head 81 moves to the processing position can be reliably cleaned. When the ejection head 81 moves to the processing position, the support member 86 also faces the substrate W held by the spin chuck 20, but the support member 86 is washed obliquely downward as described above. In this case, the nozzle arm 82 is moved up and down.

  In addition, the shower nozzle 91 ejects the cleaning liquid in an obliquely downward direction toward the (−Y) side, that is, the cleaning liquid is ejected in a direction away from the spin chuck 20 that holds the substrate W. As a result, the mist of the cleaning liquid generated by being sprayed on the nozzle arm 82 and the like is scattered toward the side wall 11 of the chamber 10 and hardly adheres to the spin chuck 20. As a result, contamination of the spin chuck 20 due to cleaning of the nozzle arm 82 of the two-fluid nozzle 80 can be prevented.

  When the drying process of the nozzle arm 82 is performed, the drying gas is blown from the two drying gas nozzles 96 of the arm drying unit 95 to the nozzle arm 82 at the standby position. As a result, the drying gas is sprayed onto at least a portion of the nozzle arm 82 to which the cleaning liquid ejected from the shower nozzle 91 is attached, and the nozzle arm 82 is dried. A drying gas is also blown from the drying gas nozzle 97 and the drying gas nozzle 98 toward the support member 86 and the gas head 85, respectively. Thereby, the cleaning liquid adhering to the support member 86 and the gas head 85 is also dried.

  Also when the drying process of the nozzle arm 82 of the two-fluid nozzle 80 is performed, the flow of the drying gas ejected in the horizontal direction from the fixedly installed drying gas nozzle 96 is changed in the same manner as the drying of the upper surface treatment liquid nozzle 60 described above. The turning drive unit 83 may swing the nozzle arm 82 so that the nozzle arm 82 crosses. In this way, the drying gas can be reliably sprayed onto both the nozzle arm 82 and the support member 86 for drying.

  According to the present embodiment, even if the processing liquid adheres to the nozzle arm 82 of the two-fluid nozzle 80, the cleaning liquid is sprayed from the shower nozzle 91 to the nozzle arm 82 and cleaned, and then the drying gas is supplied from the drying gas nozzle 96. The treatment liquid that has been ejected and dried is removed. For this reason, it is possible to prevent contamination caused by leaving the treatment liquid adhering to the nozzle arm 82.

  In the present embodiment, a shower nozzle 91 that ejects the cleaning liquid and a dry gas nozzle 96 that ejects the drying gas are fixedly installed. For this reason, the piping that supplies the fluid to the shower nozzle 91 and the drying gas nozzle 96 can be a fixed piping, and restrictions that occur when these elements are attached to the two-fluid nozzle 80 that operates (the shower nozzle 71 and the drying gas nozzle 76). Are not subject to the same restrictions as when the nozzle is attached to the upper surface treatment liquid nozzle 60.

  While the embodiments of the present invention have been described above, the present invention can be modified in various ways other than those described above without departing from the spirit of the present invention. For example, in the above-described embodiment, the entire cleaning of the nozzle arms 62 and 82 is performed by ejecting the cleaning liquid from the shower nozzles 71 and 91 longer than the nozzle arms 62 and 82. Instead, only a part of the nozzle arms 62 and 82 may be cleaned. When cleaning a part of the nozzle arms 62 and 82, the part facing the substrate W held by the spin chuck 20 when the discharge heads 61 and 81 are moved to the processing position is surely cleaned. In other words, at least the portion of the nozzle arms 62 and 82 that faces the substrate W held by the spin chuck 20 when the ejection heads 61 and 81 move to the processing position may be cleaned. This prevents the processing liquid adhering to the nozzle arms 62 and 82 from dropping onto the upper surface of the substrate W when the ejection heads 61 and 81 move to the processing position.

  Moreover, in the said embodiment, the raising / lowering drive part 64 raises / lowers the nozzle arm 62 so that the nozzle arm 62 may cross | intersect the liquid flow of the washing | cleaning liquid sprayed diagonally downward from the shower nozzle 71, and one shower is carried out. Although the three nozzle arms 62 are cleaned by the nozzle 71, a shower nozzle that ejects the cleaning liquid at a wide angle may be used instead. If such a shower nozzle is used, all of the three nozzle arms 62 can be cleaned without moving the nozzle arms 62 up and down.

  Alternatively, a shower nozzle may be provided immediately above each of the three nozzle arms 62 at the standby position, and the three nozzle arms 62 may be cleaned by ejecting a cleaning liquid directly from the shower nozzles. Even in this case, the treatment liquid adhering to the nozzle arm 62 can be removed to prevent contamination. However, as in the above-described embodiment, the shower nozzle 71 is provided obliquely above the nozzle arm 62 at the standby position, so that the number of shower nozzles 71 can be reduced and the nozzle arm 62 is sprayed. It is possible to prevent the cleaning liquid mist from adhering to the spin chuck 20.

  In the above-described embodiment, the nozzle arms 62 and 82 are mainly cleaned and dried by the shower nozzles 71 and 91 and the drying gas nozzles 76 and 96. However, the discharge head 61 is combined with the nozzle arms 62 and 82. 81 and gas head 85 may be cleaned and dried. Of course, the discharge heads 61 and 81 and the gas head 85 are often provided with standby pods for storing them at the standby positions, and the standby pods may be used for cleaning and drying.

  Further, the substrate to be processed by the cleaning processing apparatus 1 is not limited to a semiconductor substrate, and may be a glass substrate used for a flat panel display such as a liquid crystal display device.

DESCRIPTION OF SYMBOLS 1 Cleaning processing apparatus 3 Control part 10 Chamber 11 Side wall 15 Partition plate 20 Spin chuck 21 Spin base 22 Spin motor 28 Lower surface processing liquid nozzle 40 Processing cup 41 Inner cup 42 Middle cup 43 Outer cup 60 Upper surface processing liquid nozzle 61,81 Discharge head 62, 82 Nozzle arm 63, 83 Rotation drive unit 64, 84 Lift drive unit 70, 90 Arm cleaning unit 71, 91 Shower nozzle 75, 95 Arm drying unit 76, 96, 97, 98 Dry gas nozzle 80 Two-fluid nozzle 85 Gas head 86 Support member W Substrate

Claims (16)

Substrate holding means for holding and rotating the substrate in a substantially horizontal position;
A cup surrounding the periphery of the substrate holding means;
A nozzle arm provided at the tip with a discharge head for discharging the processing liquid onto the substrate held by the substrate holding means;
A turning drive unit for turning the nozzle arm so that the discharge head moves between a processing position above the substrate held by the substrate holding means and a standby position outside the cup;
Arm cleaning means for cleaning a portion of the nozzle arm facing the substrate held by the substrate holding means when at least the discharge head moves to the processing position;
A cleaning processing apparatus comprising: The cleaning apparatus according to claim 1,
The swivel driving unit is provided outside the cup and connected to a base end of the nozzle arm,
The cleaning apparatus according to claim 1, wherein the arm cleaning unit includes a shower nozzle that ejects cleaning liquid to the nozzle arm when the discharge head is located at the standby position. The cleaning apparatus according to claim 2, wherein
Further comprising an elevating drive unit for elevating the nozzle arm;
The shower nozzle is fixedly installed outside the cup and ejects the cleaning liquid obliquely downward,
The said raising / lowering drive part raises / lowers the said nozzle arm so that the said nozzle arm may traverse the flow of the washing | cleaning liquid ejected from the said shower nozzle, The cleaning processing apparatus characterized by the above-mentioned. In the cleaning processing apparatus according to claim 3,
The cleaning apparatus is characterized in that the shower nozzle ejects cleaning liquid in a direction away from the substrate holding means. In the cleaning treatment apparatus according to any one of claims 2 to 4,
A cleaning processing apparatus, further comprising: a gas ejection unit that blows drying gas onto at least a portion of the nozzle arm where the cleaning liquid ejected from the shower nozzle is attached. The cleaning apparatus according to claim 5, wherein
The cleaning apparatus according to claim 1, wherein the gas ejection part is provided at a position where a drying gas is blown from a tip end side of the nozzle arm when the ejection head is located at the standby position. In the cleaning treatment apparatus according to any one of claims 1 to 6,
2. A cleaning apparatus according to claim 1, wherein a plurality of nozzle arms are connected in parallel to each other along the horizontal direction. In the cleaning treatment apparatus according to any one of claims 1 to 6,
2. A cleaning apparatus according to claim 1, wherein the nozzle arm is provided with a gas discharge section for mixing a gas with the processing liquid discharged from the discharge head, on a side of the discharge head. A nozzle arm having a discharge head for discharging a processing liquid onto a substrate held and rotated in a substantially horizontal posture by the substrate holding means is provided at a processing position above the substrate held by the substrate holding means and the substrate holding. A turning step for turning the discharge head so as to move between a standby position outside a cup surrounding the periphery of the means;
An arm cleaning step for cleaning a portion of the nozzle arm facing the substrate held by the substrate holding means when at least the discharge head moves to the processing position;
A cleaning method comprising the steps of: The cleaning method according to claim 9, wherein
The cleaning method according to claim 1, wherein the arm cleaning step includes a cleaning liquid ejecting step of ejecting a cleaning liquid from a shower nozzle to the nozzle arm when the discharge head is located at the standby position. The cleaning method according to claim 10, wherein
In the cleaning liquid ejecting step, the nozzle arm is moved up and down so that the nozzle arm crosses the flow of the cleaning liquid ejected from the shower nozzle while ejecting the cleaning liquid obliquely downward from the shower nozzle. Cleaning method. The cleaning method according to claim 11, wherein
The cleaning method, wherein the shower nozzle ejects cleaning liquid in a direction away from the substrate holding means. In the cleaning method according to any one of claims 10 to 12,
A cleaning method, further comprising: an arm drying step of spraying a drying gas to at least a portion of the nozzle arm where the cleaning liquid ejected from the shower nozzle is attached. The cleaning method according to claim 13,
In the arm drying step, a drying gas is blown from the front end side of the nozzle arm when the discharge head is located at the standby position. In the cleaning method according to any one of claims 9 to 14,
A cleaning method, wherein a plurality of nozzle arms are provided in parallel to each other along a horizontal direction. In the cleaning method according to any one of claims 9 to 14,
2. A cleaning method according to claim 1, wherein a gas discharge unit that mixes a gas with the processing liquid discharged from the discharge head is attached to a side of the discharge head on the nozzle arm.

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