JP4837017B2 - Substrate processing apparatus and substrate processing method - Google Patents

Description

  The present invention relates to an apparatus and method for removing unwanted materials from a substrate. The various substrates include a semiconductor wafer, a glass substrate for a liquid crystal display device, a PDP (glass substrate for a plasma display panel), and the like.

  In the manufacturing process of a semiconductor device, after forming a metal thin film such as a copper thin film on the entire surface of the front surface, back surface and end surface of a semiconductor wafer (hereinafter simply referred to as “wafer”), unnecessary portions of the metal thin film are removed by etching. Processing may be performed. For example, the copper thin film for forming the wiring only needs to be formed in the device formation region on the front surface of the wafer, and is formed on the peripheral portion of the wafer surface (for example, a portion having a width of about 3 mm from the peripheral edge of the wafer) Since the copper thin film thus made becomes unnecessary, a process for removing the unnecessary copper thin film is performed.

In addition, even when a metal thin film is selectively formed on the surface of the wafer, there is a process for removing metal ions adhering to the region other than the region on the wafer surface where the metal thin film is formed, and to the end surface and back surface of the wafer. It may be done.
For example, an apparatus for removing a metal thin film or metal ions formed on the peripheral edge of a wafer surface includes a spin chuck that rotates while the wafer is held almost horizontally, and a wafer surface held by the spin chuck. An edge rinse nozzle that discharges an etching solution toward the peripheral edge of the wafer, and a pure water nozzle that supplies pure water to substantially the center of the surface of the wafer held by the spin chuck.

When removing the metal thin film, the wafer is rotated by the spin chuck, and an etching solution is discharged from the edge rinse nozzle toward the peripheral portion of the surface of the rotating wafer. While the etching solution is being discharged from the edge rinse nozzle, pure water is supplied from the pure water nozzle toward the center of the wafer surface.
As a result, the central area (device formation area) of the wafer surface is covered with pure water, and the etching solution supplied from the edge rinse nozzle to the wafer surface moves from the central area of the wafer surface to the periphery. It is swept away by pure water flowing toward it. Therefore, even if the mist of the etching solution scatters toward the device formation region at the center of the surface of the wafer, the mist of the etching solution is not likely to be directly attached to the metal thin film formed on the device formation region. Therefore, there is no possibility that the metal thin film in the device forming region is corroded by the etching solution.

However, recently, it has been found that pure water covering the device formation region may cause damage to the device built in the device formation region.
SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing apparatus and a substrate processing method that can satisfactorily remove unnecessary materials on a substrate.

The invention according to claim 1 for achieving the above object includes a plurality of ejection means (122), and the ejection means is moved on the substrate (W) while being relatively moved along the peripheral edge of the substrate (W). In the substrate processing apparatus for removing unnecessary materials, the plurality of ejection units are arranged side by side on a straight line extending from the center of the substrate toward the peripheral edge, and approach the substrate as it goes outward of the rotation radius of the substrate. The discharge means (122a) disposed relatively outside of the plurality of discharge means discharges an etching solution for removing unnecessary substances from the substrate. is supplied to the region of the turning radius outer side of the substrate than the etching liquid supply position on the substrate Te, relatively inwardly arranged a discharge means (122b) is to sweep away the etching liquid supplied to the substrate Ejecting pure water, a substrate processing apparatus.

The invention described in claim 2 is provided with a plurality of discharge means (122), and removes unnecessary materials on the substrate while relatively moving the discharge means along the peripheral edge of the substrate (W). In the substrate processing apparatus, the plurality of ejection units are arranged side by side along the direction from the periphery of the substrate toward the inside, and in a direction inclined so as to approach the substrate toward the outside of the rotation radius of the substrate. are directed, among the plurality of discharging means, a discharge means which is disposed relatively outside (122a) ejects an etching solution for removing unwanted material to the substrate, the relatively inner side The arranged discharge means (122b) is a substrate processing apparatus that discharges pure water toward the peripheral edge of the substrate so that the etching solution supplied to the substrate is swept away .

According to these configurations, while the etching liquid is prevented from flowing toward the center portion of the substrate, it is possible to supply uniformly etchant region outside the etchant supply position on the substrate, on the substrate Can be removed satisfactorily. Furthermore, it is possible to satisfactorily prevent the etching solution and pure water supplied on the substrate from flowing toward the center of the substrate.
A third aspect of the present invention is the substrate processing apparatus according to the first or second aspect, wherein a region to which pure water is supplied is wider than a region to which an etching solution is supplied on the surface of the substrate.

According to a fourth aspect of the present invention, the etching solution discharged from the discharge means disposed on the relatively outer side is discharged from the discharge means disposed on the relatively inner side and flows in the region of pure water flowing on the surface of the substrate. It is a substrate processing apparatus as described in any one of Claims 1-3 supplied to.
According to these configurations, by the flow of pure water, the etching liquid supplied to the outer position is swept than the supply position of the pure water, the etching solution can be further prevented from flowing toward the center portion of the substrate .

According to a fifth aspect of the present invention, in the plurality of discharge means, the discharge means arranged relatively inside is controlled to discharge fluid at a timing earlier than the discharge means arranged relatively outside. It is a substrate processing apparatus as described in any one of Claims 1-4 .
According to this arrangement, the flow of pure water, the etching liquid supplied to the outer position than the supply position of the pure water is swept away, the etchant can be prevented further from flowing toward the center portion of the substrate.

As described in claim 6, wherein the substrate processing apparatus is provided with a blocking plate (23) for preventing the scattering of the fluid supplied from said plurality of discharging means to the substrate, the plurality of discharge means to said blocking plate It may be provided.
According to a seventh aspect of the present invention, the substrate processing apparatus may include a blocking plate (23) that moves relatively between a position close to the substrate upper surface and a position away from the substrate upper surface. .

The invention according to claim 8 is the substrate processing apparatus according to claim 7 , wherein an inert gas is discharged between the blocking plate and the substrate.
The invention according to claim 9, the surface of the substrate, pure water is provided with discharge means (122c) for supplying an inner inert gas than the area to be supplied, either of claims 1-8 one The substrate processing apparatus according to the item.

According to these configurations, even when mist of the etching solution is generated, the mist can be blown out of the substrate by the inert gas. Therefore, there is no possibility that the central portion of the substrate is corroded by the mist of the etchant . Furthermore, since pure water is not supplied to the central portion of the substrate, the central portion is not likely to be damaged by pure water .
The invention according to claim 10 is arranged in a straight line in the direction from the periphery to the inside of the substrate and is directed in a direction inclined so as to approach the substrate as it goes outward of the rotation radius of the substrate. The plurality of discharge means (122a) supply different fluids to the peripheral edge of the substrate while moving the discharge means (122) relatively along the peripheral edge of the substrate to remove unnecessary substances on the substrate. In order to remove unnecessary substances from the discharge means disposed relatively outside in the region of pure water supplied from the discharge means (122b) disposed relatively inside to the periphery of the substrate. This etching solution is supplied, and the etching solution is pushed away in the direction away from the center of the substrate.

According to this method, an effect similar to the effect described in relation to claims 1 and 2 can be achieved .
According to an eleventh aspect of the present invention, in the plurality of discharge means, the discharge means disposed relatively inside is controlled so as to discharge the fluid at a timing earlier than the discharge means disposed relatively outside. The substrate processing method according to claim 10 .

According to this method, an effect similar to the effect described in relation to claim 5 can be achieved.
A twelfth aspect of the present invention is the substrate processing method according to the tenth or eleventh aspect , wherein the inert gas is supplied to the inside of the surface of the substrate in a region where pure water is supplied.

According to this method, an effect similar to the effect described in relation to claim 9 can be achieved.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a diagram schematically showing a configuration of a substrate processing apparatus according to one embodiment (first embodiment) of the present invention. In this substrate processing apparatus, a metal thin film (for example, a copper thin film) is formed on the surface and end face of a wafer W, which is a substantially circular substrate, and then unnecessary on the peripheral edge and end face of the surface of the wafer W. An apparatus for removing a metal thin film.

  The substrate processing apparatus is provided with a vacuum chuck 11. The vacuum chuck 11 includes a chuck shaft 111 disposed substantially vertically and a disk-shaped suction base 112 fixed substantially horizontally to the upper end of the chuck shaft 111. The chuck shaft 111 has, for example, a cylindrical shape and has an intake passage 113 therein, and the upper end of the intake passage 113 is adsorbed via an adsorption passage formed in the adsorption base 112. The suction port formed on the upper surface of the base 112 communicates with the suction port. The chuck shaft 111 receives a rotational force from a rotational drive mechanism 114 including a motor.

  Thus, the vacuum chuck 11 evacuates the inside of the intake passage 113 in a state where the wafer W is placed on the suction base 112 with the front surface (device forming surface) facing upward, whereby the back surface ( The non-device forming surface) can be vacuum-adsorbed and held almost horizontal. In this state, a rotational force is input from the rotational drive mechanism 114 to the chuck shaft 111, whereby the wafer W sucked and held by the suction base 112 is perpendicular to the center (the center axis of the chuck shaft 111) O. Can be rotated around.

Above the vacuum chuck 11, a substantially conical blocking plate 12 and a blocking plate cleaning nozzle 13 for discharging pure water for cleaning the inclined surface of the blocking plate 12 are arranged.
The blocking plate 12 has a lower surface 121 facing the vacuum chuck 11 that is a circular plane having substantially the same diameter as the wafer W, and the lower surface 121 is opposed to the upper surface of the wafer W held by the vacuum chuck 11. It is provided to do. Further, the blocking plate 12 is provided so as to be able to move up and down, and is largely retracted upward when the wafer W is loaded into and unloaded from the vacuum chuck 11, and is lowered to a position close to the wafer W when processing the wafer W.

  As shown in FIG. 2, the lower surface 121 of the shielding plate 12 has a triple concentric circumference C1, C2, C3 centered on the center CE of the lower surface 121 and a plurality of radially extending radially from the center CE. For example, a small circular opening 122 is formed at each intersection with the straight line. Concentric circles C1, C2, and C3 are set at the peripheral edge of the lower surface 121, and the opening 122 is not formed in the central portion of the lower surface 121.

An etching solution supply path 123, a pure water supply path 124, and a nitrogen gas supply path 125 through which an etching solution, pure water, and nitrogen gas to be supplied to the wafer W are circulated are formed inside the blocking plate 12.
The etchant supply path 123 has an inclined portion 123a that is inclined downward as it goes outward in the radial direction of the lower surface 121 of the blocking plate 12. At the tip of the inclined portion 123a, the concentric circumferences C1, C2, and C3 It communicates with the opening 122a disposed on the circumference C1 having the largest diameter. The inclination angle of the inclined portion 123a is such that a straight line extending in parallel with the inclined portion 123a from the opening 122a surrounds the device forming region at the center of the surface of the wafer W (for example, about 3 mm wide from the periphery of the wafer W). And an angle that intersects the surface of the wafer W held by the vacuum chuck 11 at the etching solution supply position Pe set on the circumference centering on the rotation axis O of the wafer W. Has been. As a result, the etching solution flowing through the etching solution supply path 123 is inclined from the opening 122a to the inclined direction of the inclined portion 123a of the etching solution supply path 123 (the direction inclined so as to approach the wafer W toward the outer radius of rotation of the wafer W). ) And is supplied to the etching solution supply position Pe on the surface of the wafer W.

  The pure water supply path 124 has an inclined part 124a inclined substantially parallel to the inclined part 123a of the etching solution supply path 123. At the tip of the inclined part 124a, the circumference having the next largest diameter after the circumference C1. It communicates with the opening 122b disposed on C2. Thereby, pure water flowing through the pure water supply path 124 is discharged from the opening 122b in a direction parallel to the discharge direction of the etching liquid, and is on the wafer peripheral area and on the wafer W surface. The pure water is supplied to the pure water supply position Pd closer to the rotation axis O of the wafer W than Pe. The pure water supply position Pd is set on a circumference around the rotation axis O of the wafer W.

  Further, the nitrogen gas supply path 125 has an inclined part 125a inclined substantially parallel to the inclined part 123a of the etching solution supply path 123, and the tip of the inclined part 125a is placed on the circumference C3 having the smallest diameter. It communicates with the arranged opening 122c. As a result, the pure water flowing through the nitrogen gas supply path 125 is discharged from the opening 122c in a direction parallel to the discharge direction of the etching solution, and the rotation axis O of the wafer W is more than the pure water supply position Pd on the surface of the wafer W. Is supplied to a nitrogen gas supply position Pn close to. The nitrogen gas supply position Pn is set on a circumference around the rotation axis O of the wafer W.

  FIG. 3 is an illustrative view for explaining processing in the substrate processing apparatus. The wafer W to be processed is loaded by a transfer robot (not shown) and delivered to the vacuum chuck 11. At this time, the blocking plate 12 (see FIG. 1) is largely retracted upward so as not to hinder the loading of the wafer W. When the wafer W is held on the vacuum chuck 11, the blocking plate 12 is brought close to the surface of the wafer W, and the vacuum chuck 11 (that is, the wafer W) starts to rotate at a predetermined rotation speed.

  Thereafter, as shown in FIG. 3A, the discharge of nitrogen gas is started from the opening 122c, and nitrogen gas is supplied to the nitrogen gas supply position Pn on the surface of the wafer W obliquely from above. Further, after the discharge of the nitrogen gas is started, subsequently, as shown in FIG. 3B, the discharge of pure water is started from the opening 122b, and the pure water supply position Pd on the surface of the wafer W is inclined obliquely from above. Pure water is supplied. Further, after the discharge of pure water is started, as shown in FIG. 3C, the discharge of the etching liquid is started from the opening 122a, and the etching liquid is obliquely applied to the etching liquid supply position Pe on the surface of the wafer W from the upper side. Supplied.

  When the supply of nitrogen gas, pure water, and etching solution to the surface of the wafer W is continued for a predetermined time, the discharge of the etching solution from the opening 122a is first stopped as shown in FIG. Subsequently, as shown in FIG. 3E, the discharge of pure water from the opening 122b is stopped, and thereafter, the discharge of nitrogen gas from the opening 122c is stopped as shown in FIG. 3F. This completes the process for removing the unnecessary metal thin film from the peripheral edge and the end face of the wafer W, and the wafer W after this process is moved by the transfer robot (not shown) after the shielding plate 12 is retreated upward. It is carried out from the back surface of W toward an apparatus for removing unnecessary metal ions.

  As described above, in the substrate processing apparatus according to this embodiment, the etching solution for removing the metal thin film from the peripheral edge and the end surface of the surface of the wafer W is the etching solution supply position Pe on the surface of the rotating wafer W. The etching solution is supplied from the opening 122a disposed above the etching solution supply position Pe and inward in the rotational radius direction of the wafer W. Thus, the etching solution supplied to the etching solution supply position Pe is prevented from flowing toward the central portion of the wafer W, and the region outside the rotational radius direction of the wafer W (the wafer W) from the etching solution supply position Pe. The region where the metal thin film on the surface of the surface is to be removed) The etching liquid can be supplied uniformly to the EA, and the metal thin film formed on the region EA and the end face can be removed well.

  In addition, by starting and stopping the supply (discharge) of nitrogen gas, pure water, and etchant in the order described above, the etchant supply position Pe is supplied while the etchant is supplied to the etchant supply position Pe. Further, pure water and nitrogen gas are respectively supplied to the pure water supply position Pd and the nitrogen gas supply position Pn set inward in the rotational radius direction of the wafer W. The deionized water supplied to the deionized water supply position Pd flows from the deionized water supply position Pd toward the periphery of the wafer W, and the pure water flow causes the wafer W to move outward in the rotational radius direction from the deionized water supply position Pd. Since the etching solution supplied to the etching solution supply position Pe is pushed away, it is possible to further prevent the etching solution from flowing toward the center of the wafer W. Further, even if the mist of the etching solution is generated when the etching solution enters the etching solution supply position Pe, the mist of the etching solution is blown out of the wafer W by the nitrogen gas. There is no possibility that the thin film in the (device formation region) is corroded by the mist of the etchant.

Furthermore, since pure water is not supplied to the device formation region at the center of the wafer W, there is no possibility that the device built in the device formation region is damaged by the pure water.
FIG. 4 is a diagram schematically showing the configuration of a substrate processing apparatus according to another embodiment (second embodiment) of the present invention. In the substrate processing apparatus according to this embodiment, the unnecessary metal thin film formed on the peripheral edge and the end surface of the front surface of the wafer W is removed from the back surface of the wafer W in the substrate processing apparatus according to the above-described embodiment. It is for removing unnecessary metal ions (metal contamination) or metal thin films.

This substrate processing apparatus is provided with a spin chuck 21. The spin chuck 21 includes a chuck shaft 211 arranged substantially vertically, a spin base 212 fixed substantially horizontally to the upper end of the chuck shaft 211, and a plurality of chuck pins 213 erected on the spin base 212. have.
The spin base 212 has, for example, a plurality of (for example, six) arms extending radially in a plan view, and a chuck pin 213 is erected at the tip of each arm. For example, at the tip of every other arm (for example, a total of three arms), there is a horizontal plane that receives the peripheral edge of the back surface of the wafer W, and a vertical that restricts the movement of the wafer W so as to face the end surface of the wafer W. A fixed chuck pin 213 having a surface is fixed. A movable chuck pin 213 that can rotate (rotate) about the vertical axis is attached to the tip of every other remaining arm (for example, a total of three arms). This movable chuck pin 213 rises from the horizontal plane that receives the peripheral edge of the back surface of the wafer W, abuts against the end surface of the wafer W, and holds the wafer W in cooperation with the opposed fixed chuck pins 213. There is also a first vertical surface, and a second vertical surface that rises from the horizontal plane and that can recede outward in the radial direction of the wafer W from the first vertical surface and can regulate the end surface of the wafer W. Therefore, by rotating the movable chuck pin 213 around the vertical axis, the first vertical surface or the second vertical surface can be opposed to the end surface of the wafer W, whereby the wafer W can be sandwiched or the wafer W can be clamped. Can be loosened.

Further, a rotation drive mechanism 214 including a drive source such as a motor is coupled to the chuck shaft 211. Accordingly, the wafer W can be rotated in a horizontal plane by rotating the chuck shaft 211 by the rotation driving mechanism 214 in a state where the wafer W is held by the plurality of chuck pins 213.
Further, the chuck shaft 211 is formed in a cylindrical shape, and the back surface rinsing pipe 22 is inserted into the chuck shaft 211 in a non-rotating state. The front end of the back surface rinsing pipe 22 is opened at the front end of the chuck shaft 211, whereby the back surface for supplying the etchant to the back surface center of the wafer W held by the chuck pins 213 at the front end of the chuck shaft 211. A rinse nozzle 221 is formed.

  Above the spin chuck 21, a substantially conical blocking plate 23 and a blocking plate cleaning nozzle 24 for discharging pure water for cleaning the inclined surface of the blocking plate 23 are arranged. The blocking plate 23 has a configuration in which the opening 122a for supplying the etching solution and the etching solution supply path 123 are omitted from the blocking plate 12 shown in FIG. 1, and the lower surface 231 of the wafer W held by the spin chuck 21 is omitted. It is provided so as to face the upper surface substantially in parallel.

In FIG. 4 and FIG. 5 to be described later, portions common to the blocking plate 23 and the blocking plate 12 shown in FIG. Further, the description of the parts denoted by the same reference numerals is omitted.
FIG. 5 is an illustrative view for explaining processing in the substrate processing apparatus according to the second embodiment. The wafer W to be processed is subjected to a process for removing the metal thin film formed on the peripheral edge portion and the end face of the surface in the substrate processing apparatus shown in FIG. 1 and then carried from the substrate processing apparatus shown in FIG. Then, it is delivered to the spin chuck 21 with the surface facing upward. At this time, the blocking plate 23 (see FIG. 4) is largely retracted upward so as not to hinder the loading of the wafer W. When the wafer W is held on the spin chuck 21, the blocking plate 23 is brought close to the surface of the wafer W, and the spin chuck 21 (that is, the wafer W) starts to rotate at a predetermined rotation speed.

  Thereafter, as shown in FIG. 5A, discharge of nitrogen gas is started from the opening 122c, and nitrogen gas is supplied to the nitrogen gas supply position Pn on the surface of the wafer W obliquely from above. In addition, after the start of the discharge of the nitrogen gas, as shown in FIG. 5B, the discharge of pure water is started from the opening 122b, and the pure water supply position Pd on the surface of the wafer W is started obliquely from above. Pure water is supplied. Further, after the discharge of pure water is started, the discharge of the etching solution is started from the back surface rinsing nozzle 221 as shown in FIG. 5C, and the etching solution is supplied to the center of the back surface of the wafer W.

  When the supply of nitrogen gas, pure water and etching liquid to the surface of the wafer W is continued for a predetermined time, first, as shown in FIG. 5D, the discharge of the etching liquid from the back surface rinsing nozzle 221 is stopped. The Next, as shown in FIG. 5 (e), the discharge of pure water from the opening 122b is stopped, and thereafter, the discharge of nitrogen gas from the opening 122c is stopped as shown in FIG. 5 (f). This completes the process for removing metal ions or metal thin films from the back surface of the wafer W. After that, pure water is supplied to the back surface of the wafer W, and the etching solution adhering to the back surface of the wafer W is washed away. . The pure water for washing the back surface of the wafer W is configured so that the etching liquid or pure water can be switched and supplied to the back surface rinsing nozzle 221, and supplied from the back surface rinsing nozzle 221 to the back surface of the wafer W. Alternatively, a nozzle provided separately from the back surface rinsing nozzle 221 may be supplied to the back surface of the wafer W. After the washing process, the wafer W is unloaded by a transfer robot (not shown) after the shielding plate 23 is retracted upward.

  As described above, in the substrate processing apparatus according to the second embodiment, the etching liquid for removing the metal ions or the metal thin film adhering to the back surface of the wafer W is the center of the back surface of the rotating wafer W. To be supplied. Thereby, the etching solution can be supplied evenly over the entire back surface of the wafer W, and the metal ions or the metal thin film can be satisfactorily removed from the back surface of the wafer W by this etching solution.

  Further, the supply (discharge) of nitrogen gas, pure water and etching liquid is started and stopped in the order described above, so that the surface of the wafer W is pure while the etching liquid is supplied to the back surface of the wafer W. Pure water and nitrogen gas are supplied to the water supply position Pd and the nitrogen gas supply position Pn, respectively. The pure water supplied to the pure water supply position Pd flows from the pure water supply position Pd toward the peripheral edge of the wafer W and flows down from the peripheral edge of the wafer W. Therefore, the pure water supplied to the pure water supply position Pd flows from the back rinse nozzle 221 to the wafer W. There is no possibility that the etching solution supplied to the back surface of the wafer will wrap around the surface of the wafer W.

  Further, even if the mist of the etching solution is generated by the chuck pins 213 of the spin chuck 21 crossing the etching solution that is scattered laterally along the back surface of the wafer W, the mist of the etching solution is absorbed by the nitrogen gas by the nitrogen gas. Since the film is blown outward, the thin film in the central portion (device forming region) of the wafer W is not likely to be corroded by the mist of the etching solution.

Furthermore, since pure water is not supplied to the device formation region at the center of the wafer W, there is no possibility that the device built in the device formation region is damaged by the pure water.
As mentioned above, although two embodiment of this invention was described, this invention can also be implemented with another form. For example, in the first embodiment described above, small circular openings 122a, 122b, and 122c are formed in the lower surface 121 of the blocking plate 12, and etching liquid, pure water, and nitrogen gas are respectively supplied from these openings 122a, 122b, and 122c. Although it is discharged, three concentric annular openings centering on the center CE of the lower surface 121 are formed on the lower surface 121 of the blocking plate 12, and etching liquid, pure water, and nitrogen gas are respectively formed from these three annular openings. May be discharged. Further, a modification similar to this may be applied to the second embodiment described above.

  In the first embodiment described above, a plurality of openings 122a, 122b, 122c are formed, but at least one of the openings 122a, 122b, 122c may be formed. For example, when only one opening 122a, 122b, and 122c is formed, the openings 122a, 122b, and 122c are formed along a straight line on the lower surface 121 that passes through the center CE of the lower surface 121. Preferred (opening group A surrounded by a two-dot chain line in FIG. 2). According to this, the nitrogen gas supply position Pn, the etchant supply position Pe, and the pure water supply position Pd are provided along a straight line passing through the rotation center of the wafer W.

  Alternatively, only one opening 122a from which the etching solution is discharged may be formed, and a plurality of openings 122b and 122c from which pure water and nitrogen gas are discharged may be formed. In this case, the plurality of openings 122b and 122c are preferably provided so as to cover one opening 122a when viewed from the center CE. According to this, as viewed from the rotation center of the wafer, the etching solution supply position Pe is covered with the pure water supply position Pd and the nitrogen gas supply position Pn (opening group B surrounded by a two-dot chain line in FIG. 2). .

Furthermore, an opening may be formed near the center of the shielding plate 12, and nitrogen gas may be supplied from this opening.
Furthermore, although nitrogen gas is supplied to the surface of the wafer W from the openings 122c of the blocking plates 12 and 23, an inert gas (for example, helium gas or argon gas) other than nitrogen gas is supplied to the surface of the wafer W. May be.

Furthermore, although a semiconductor wafer has been taken up as an example of the substrate, the present invention processes other types of substrates such as glass substrates for liquid crystal display devices, glass substrates for plasma display panels, and glass substrates for photomasks. It can also be applied to an apparatus for applying.
In addition, various design changes can be made within the scope of matters described in the claims.

1 is a diagram schematically showing a configuration of a substrate processing apparatus according to an embodiment of the present invention. It is a figure which shows the structure of the lower surface of the shielding board shown in FIG. It is a figure for demonstrating the process in the substrate processing apparatus of FIG. It is a figure which shows schematically the structure of the substrate processing apparatus which concerns on other embodiment of this invention. It is a figure for demonstrating the process in the substrate processing apparatus of FIG.

Explanation of symbols

12 Blocking plate 122 Opening (Discharging means)
122a opening (discharge means)
122b Opening (discharge means)
122c Opening (Discharging means)
23 Barrier plate W Wafer

Claims (12)

A substrate processing apparatus comprising a plurality of discharge means, and removing unnecessary substances on the substrate while relatively moving the discharge means along the peripheral edge of the substrate,
The plurality of ejection means are arranged side by side on a straight line extending from the center of the substrate toward the peripheral edge, and are directed in a direction inclined so as to approach the substrate toward the outer radius of rotation of the substrate ,
Among the plurality of discharge means, the discharge means disposed on the outer side discharges an etching liquid for removing unnecessary substances from the substrate, and the rotation radius of the substrate is higher than the etching liquid supply position on the substrate. The substrate processing apparatus, wherein the discharge means that is supplied to the outer region and disposed relatively inside discharges pure water so that the etching solution supplied to the substrate is swept away . A substrate processing apparatus comprising a plurality of discharge means, and removing unnecessary substances on the substrate while relatively moving the discharge means along the peripheral edge of the substrate,
The plurality of discharge means are arranged side by side along the direction from the periphery of the substrate toward the inside, and are directed in a direction inclined so as to approach the substrate as going outward of the rotation radius of the substrate ,
Among the plurality of discharge means, the discharge means disposed relatively outside discharges an etching solution for removing unnecessary substances from the substrate, and the discharge means disposed relatively inside the substrate A substrate processing apparatus that discharges pure water toward the periphery of the substrate so as to sweep away the etching solution supplied to the substrate. 3. The substrate processing apparatus according to claim 1, wherein a region to which pure water is supplied on a surface of the substrate is wider than a region to which an etching solution is supplied. The etching solution discharged from the discharge means disposed on the relatively outer side is supplied into a region of pure water discharged from the discharge means disposed on the relatively inner side and flowing on the surface of the substrate. The substrate processing apparatus as described in any one of -3. In the plurality of discharging means, a discharge means which is disposed relatively inside is controlled to discharge fluid at a timing earlier than the ejection means disposed relatively outwardly of claim 1-4 The substrate processing apparatus as described in any one of Claims. A blocking plate for preventing scattering of fluid supplied to the substrate from the plurality of ejection means,
Wherein the plurality of discharge means is provided in the shield plate, the substrate processing apparatus according to any one of claims 1-5. And a blocking plate to relatively move between a position away from the position and the top surface of the substrate proximate to the upper surface of the substrate, the substrate processing apparatus according to any one of claims 1-6. The substrate processing apparatus according to claim 7 , wherein an inert gas is discharged between the shielding plate and the substrate. The surface of the substrate, pure water and a discharge means for supplying the inert gas inside the area to be supplied, the substrate processing apparatus according to any one of claims 1-8. A plurality of discharge means that are arranged in a straight line in the direction from the periphery of the substrate to the inside and that are oriented in an inclined direction so as to approach the substrate as it goes outward of the radius of rotation of the substrate are arranged at the peripheral edge of the substrate. While removing the unnecessary substances on the substrate by supplying different fluids to the peripheral portion of the substrate from the plurality of ejection means while relatively moving along the
An etching solution for removing unnecessary substances is supplied from the discharge means disposed relatively outside to the region of pure water supplied toward the periphery of the substrate from the discharge means disposed relatively inside. A substrate processing method in which the etchant is pushed away from the center of the substrate. In the plurality of discharging means, a discharge means which is disposed relatively inside is controlled to discharge fluid at a timing earlier than the ejection means disposed relatively outside, according to claim 10 Substrate processing method. The substrate processing method of Claim 10 or 11 which supplies an inert gas inside the area | region where a pure water is supplied in the surface of a board | substrate.

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