JP2002254189A - Laser beam machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To widen the range of the machinable plate thickness and enhance machining efficiency by providing a plurality of laser beam oscillators on one laser beam machine. SOLUTION: In the laser beam machine, a laser beam oscillators 11, 12 are mounted on both opposing sides of a traveling frame 4 which moves on a machining stand by means of traveling along a rail 2, four moving stands 5-8 moving in the direction orthogonal to the rail 2 along the traveling frame 4 are provided, machining heads 15 and optical parts which guide laser beams A, B from the laser beam oscillators 11, 12 to the machining heads 15 are provided on the moving stands 5-8, a wave synthesizing optical part 50a which superimposes the laser beam A, B from the laser beam oscillator 11, 12 on one out of the moving stands 5-8 and a switching mechanism 50 for switching the wave synthesizing optical part 50a and the optical part are provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a laser processing machine for performing processing such as cutting on a processing material using a laser.

[0002]

2. Description of the Related Art As a laser processing machine such as a laser cutting machine for cutting a steel plate, for example, there has been a laser processing machine shown in FIGS. The laser processing machine 61 is formed in a gate shape straddling the processing table 9 and runs on a rail 62 provided on both sides of the processing table 9, and is orthogonal to the rail 62 along the running frame 64. And a single moving table 65 that moves in the direction, and a laser beam A oscillated from a laser oscillator 66 mounted on the traveling frame 65.
Is irradiated from a processing head 68 mounted on a moving table 65 to a processing material 10 on the processing table 9, and the processing material 10
And processing such as cutting. For example, while irradiating the processing material 10 with the laser beam A from the processing head 68, the processing head 68 is driven by driving the traveling frame 64 and the moving table 65.
Is moved, the processing material 10 can be cut into a predetermined shape.

[0003]

However, in the above-described laser beam machine 61, the laser oscillator 66
, The plate thickness that can be processed (such as the plate thickness that can be cut) and the type of processing have been limited. In order to improve the processing efficiency, it is conceivable to mount a plurality of moving tables supporting the processing head on one traveling frame. However, a configuration for introducing a laser beam into the processing head of each moving table, etc. Therefore, at present, no suitable laser beam machine is provided.

The present invention has been made in view of the above-mentioned problems, and a plurality of laser oscillators are mounted on a single laser processing machine, and the laser beams output from the respective laser oscillators are superimposed or divided. It is an object of the present invention to provide a laser beam machine capable of expanding a range of a workable plate thickness and improving a machining efficiency.

[0005]

SUMMARY OF THE INVENTION A laser beam machine according to the present invention oscillates and outputs a traveling frame which travels on a worktable by traveling along a track, and a laser oscillator mounted on the traveling frame. A plurality of processing heads for irradiating a processing material on the processing table with the laser beam, the plurality of processing heads being arranged side by side on the traveling frame, and moving in a direction substantially orthogonal to the track along the traveling frame, respectively; A plurality of laser oscillators are mounted on the traveling frame, and a laser beam is output from each laser oscillator in a direction substantially orthogonal to the trajectory. An optical component that changes the direction of the laser beam and guides the laser beam to the processing head by being inserted and arranged in the optical path of one target laser beam is provided, and one or more movement To is characterized in that the switching mechanism for switching a plurality of the optical component and by superimposing the laser beam optical component multiplexing leading to the mobile platform of the processing head of the laser oscillator is provided.

According to this laser processing machine, the switching optical mechanism is switched between the multiplexing optical component and the optical component and inserted into the laser beam, whereby the laser beams from the plurality of laser oscillators are superimposed. It is possible to switch between irradiating the processing material from one processing head or guiding the laser beam from each laser oscillator to the processing head without overlapping, irradiating the processing material from this processing head, and using it for laser processing of the processing material Becomes As a result, the material, plate thickness (cuttable plate thickness, etc.) of the processing material that can be processed,
It is possible to widen the range of processing types and the like. Examples of the optical component include an optical component that guides the entire incident beam to the processing head by bending, such as a total reflection mirror described below, and an optical component that splits a laser beam, such as a beam splitter described below. By switching the insertion and retraction of these optical components and the multiplexing optical components with respect to the optical path of the laser beam, division and superposition of the laser beam can be switched. With this, laser processing of the processing material can be performed using a laser beam having a desired intensity, and the width of the material of the processing material that can be processed, the plate thickness (cuttable plate thickness, etc.), and the type of the processing can be reduced. It can be spread.

[0007] The laser beams output from the plurality of laser oscillators are parallel or almost parallel, and are also parallel to the direction of movement of each carriage on the traveling frame.
Overlapping by the multiplexing optical parts is possible anywhere in the moving range of the movable table provided with the multiplexing optical parts,
The processing material can be used for processing by irradiating the processing material from the processing head of the movable table. The number of laser oscillators mounted on the traveling frame may be three or more. A plurality of moving tables equipped with the switching mechanism may be provided. For example, three laser oscillators are mounted on a running frame, and a total of 3
It is possible to select a switching mechanism and a multiplexing optical component in accordance with each combination of the superposition of the laser beams. As an optical component for multiplexing, a component in which three or more laser beams are superposed can be adopted.

According to the first aspect of the present invention, there is no limitation on the mounting position of the plurality of laser oscillators on the traveling frame. For example, all the laser oscillators are collectively arranged at one end of the moving range of the movable table along the traveling frame. The configuration is also included.
However, gas laser oscillators such as carbon dioxide laser oscillators, which are frequently used as laser oscillators for cutting steel materials, generally have a very heavy weight, so that the laser oscillators are connected to both sides of the traveling frame as described in claim 4. It is advantageous from the viewpoint of the movement stability, the movement accuracy and the prevention of distortion of the running frame that it is arranged to face the moving frame and balance the load of the running frame. According to the first aspect of the present invention, the laser beams output from the plurality of laser oscillators mounted on one side of the moving range of the movable table along the traveling frame are transmitted by the optical components of the movable platform and the optical components for multiplexing. Because, also includes a configuration to perform the division, superposition, for example, when the same number of laser oscillators are mounted on both ends of the moving range of the movable table along the traveling frame, from the plurality of laser oscillators on one side of the moving range. It is also possible to adopt a configuration in which the laser beam is divided and overlapped, and the laser beam from the laser oscillator on the opposite side does not participate in the overlap.

According to a second aspect of the present invention, in the laser processing machine of the first aspect, a laser oscillator and a total reflection mirror which is an optical component for guiding a laser beam from the laser oscillator to the processing head by total reflection are provided. Between the moving table, a moving table provided with a beam splitter which is an optical component that divides a part of the laser beam, guides the processing beam to the processing head, and transmits the remaining light to the total reflection mirror, is disposed, The movable table provided with the beam splitter is provided with a support mechanism for moving the beam splitter between an insertion position where the beam splitter is disposed on the optical path of the laser beam and a retreat position where the beam splitter deviates from the optical path, and the total reflection mirror is provided. By the switching mechanism mounted on the movable table, the insertion of the total reflection mirror and the multiplexing optical component into the optical path of the laser beam is performed. Wherein the arrangement is adapted to be switched.

According to the present invention, when the beam splitter is inserted at the insertion position on the optical path of the laser beam, the laser beam is split by the beam splitter, and the processing head of the moving table provided with the beam splitter is provided with:
Processing such as cutting can be performed by irradiating a processing material with a laser beam from a processing head of a movable base provided with a total reflection mirror. That is, one laser beam can be distributed to a plurality of processing heads to process a processing material. The number of movable tables provided with the beam splitter between the movable table provided with the total reflection mirror and the laser oscillator is not limited to one, and may be plural. For example, when n movable tables provided with a beam splitter are installed between the movable table provided with the total reflection mirror and the laser oscillator, the optical path of one laser beam output from the laser oscillator is provided on the optical path of the laser beam. , N beam splitters,
By inserting one total reflection mirror, a laser beam is distributed to n plus one processing head, and can be used for laser processing of a processing material. By changing the number of beam splitters inserted into one laser beam, the division number of the laser beam is changed, whereby a laser beam having a desired intensity can be used for laser processing of a processing material. . When the number of insertions of the beam splitter with respect to the laser beam is changed and the number of divisions of the laser beam is changed, the number of processing heads used for laser processing of the processing material is also changed.

When the insertion arrangement of the total reflection mirror and the multiplexing optical component with respect to the optical path of the laser beam is switched by a switching mechanism, and the multiplexing optical component is inserted and arranged in the optical path of the laser beam, the total reflection mirror is inserted and arranged. The laser beam and another laser beam are superimposed by a multiplexing optical component and guided to a processing head supported on a movable table provided with the multiplexing optical component, and used for laser processing of a processing material. Can be used. At this time, by superimposing the laser beams, a laser beam having a large power can be obtained without using a large-sized laser oscillator. For example, cutting of a thick steel plate can be easily performed. Even when the multiplexing optical component is inserted and arranged in the laser beam, the beam splitter can be inserted and arranged in this laser beam. Laser processing of a processing material can be performed using the processing head. Note that “another laser beam” which is superimposed on the laser beam into which the total reflection mirror is inserted and arranged by the multiplexing optical component is a laser in which the total reflection mirror and the beam splitter are arranged on an optical path. A beam (a single laser beam) is a laser beam output from a different laser oscillator, and this laser beam also has another optical component such as a total reflection mirror or a beam splitter inserted therein. I don't care.

The invention described in claim 3 is the first or second invention.
In the laser beam machine described above, a support for moving the optical component between an insertion position where the optical component is arranged on the optical path of the laser beam and a retracted position that deviates from the optical path on each of the movable tables except the movable table provided with the switching mechanism. A mechanism is mounted. According to the present invention, an optical component (for example, the above-described total reflection mirror) that guides the entire optical path of the laser beam to the processing head by bending is retracted from the insertion position with respect to the laser beam. The laser beam whose component is inserted and arranged on the optical path reaches the multiplexing optical component, and a plurality of laser beams including this laser beam are superimposed by the multiplexing optical component, and the multiplexing optical component is The processing material is irradiated from a processing head supported by a movable table provided, and is used for laser processing of the processing material. When the optical component supported by the support mechanism is inserted into the optical path of the laser beam, the laser beam is guided from the optical component to a processing head supported by a moving table provided with the optical component, and a laser beam of the processing material is formed. Used for processing.

According to a fourth aspect of the present invention, in the laser beam machine according to any one of the first to third aspects, the plurality of movable tables are arranged between the laser oscillators arranged on both sides of the traveling frame. And a moving table provided with a total reflection mirror, which is an optical component for guiding a laser beam output from a laser oscillator on one side of the traveling frame to the processing head by total reflection, and a laser on the other side of the traveling frame. A movable table provided with a total reflection mirror, which is an optical component that guides the laser beam output from the oscillator to the processing head by total reflection, is adjacent to a laser oscillator that outputs a laser beam to be guided to the processing head. And a laser beam from a plurality of laser oscillators is superimposed on one of a pair of movable tables arranged next to each other. In addition, the switching mechanism for switching between the multiplexing optical component for guiding to the processing head of the movable table and the total reflection mirror is mounted, and the other movable table is provided with the total reflection mirror arranged on the optical path of the laser beam. A support mechanism for moving between a position and a retracted position deviating from the optical path is mounted.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A laser machine according to one embodiment of the present invention will be described below with reference to FIGS. Figure 1
Is a plan view of the laser beam machine 1 as viewed from above, and FIG. 2 is a front view of the laser beam machine 1 as viewed from the front.

The laser processing machine 1 is a laser cutting machine for cutting a processing material such as a steel plate placed on the processing table 9, and has a pair of rails (tracks) arranged in parallel on opposite sides of the processing table 9. 2) a traveling frame 4 that travels on the processing table 8 by traveling on the traveling frame 4, and a plurality of movable tables 5 to 8 that move along the traveling frame 4. The traveling frame 4 is, specifically, a beam having a traveling portion 4 a traveling on the rail 2 by the wheels 3 at both ends in the longitudinal direction.
It is arranged along the upper surface of the processing table 9 at a position slightly separated from the processing table 9 by the two traveling portions 4a, and extends in a direction perpendicular to the rails 2, that is, a direction perpendicular to the moving direction of the traveling frame 4. ing. The moving tables 5 to 8
A plurality (four here) of side rails 4c provided along the traveling frame 4 are provided side by side, and each of them moves along the side rails 4c.

The processing head 15 supported by the moving tables 5 to 8 is moved by the movement of the traveling frame 4 and the moving tables 5 to 8 along the traveling frame 4.
It is moved to the upper predetermined position. For example, while irradiating a laser from the processing head 15 to the processing material 10 on the processing table 9,
The target cutting operation can be performed by moving the processing head 15 by moving the traveling frame 4 and the moving tables 5 to 8. The movement of the traveling frame 4 and each of the moving tables 5 to 8 is controlled by a controller 4d mounted on the traveling frame 4. The controller 4d is provided with an operation panel 4e to which a command for a moving path of the machining head 15 and the like is input. Based on the command input from the operation panel 4e, the controller 4d operates the traveling frame 4 and each mobile platform. 5 to 8 are controlled.

The traveling frame 4 is equipped with two laser oscillators 11 and 12 for oscillating laser beams A and B.
The laser oscillators 11 and 12 are, for example, carbon dioxide laser oscillators and the like, and are respectively mounted on the left and right traveling portions 4 a of the traveling frame 4. With this configuration, the laser oscillator 1
Since the load distribution of the traveling frame 4 due to the loads 1 and 12 is balanced, stable traveling performance of the traveling frame 4 is ensured, and the processing accuracy of the processing material 10 by laser beam irradiation can be improved. The laser beams A and B from the laser oscillators 11 and 12 are output (emitted) along the traveling frame 4, specifically, with an optical path along the horizontal rail 4c, and are parallel to each other. It is also parallel to the moving direction (or moving locus) of the moving tables 5 to 8 moving along the rail 4c. In the present embodiment, the optical paths of the laser beams A and B output from the laser oscillators 11 and 12 to the opposing laser oscillators are not on the same straight line but are slightly offset (FIG. 8). However, depending on the configuration of an optical component mounted on a movable table and superimposing both laser beams A and B, the optical paths of the laser beams A and B may be arranged on the same straight line. Is also possible.

Specifically, in the laser beam machine 1, four traveling tables 5 to 8 are mounted on the traveling frame 4. In FIGS. 1 and 2, a laser oscillator 11 mounted on the left side of the traveling frame 4 is mounted on the two movable tables 5 and 6 on the left side.
Optical parts 21 and 22 for guiding the laser beam A from the laser beam to the processing head 15 are provided, and a laser beam from a laser oscillator 12 mounted on the right side of the traveling frame 4 is provided on the two movable tables 7 and 8 on the right side. Optical components 5 and 6 for guiding B to the processing head 15 are provided.

Optical parts that reflect a part of the laser beams A and B output from the laser oscillators 11 and 12 to guide them to the processing head 15 and transmit the rest are provided on the movable tables 5 and 8 located at both ends in a row. Beam splitter 2
1 and 2, a beam splitter 21 provided on the leftmost movable table 5 in FIGS. 1 and 2 is provided on the optical path of the laser beam A from the left laser oscillator 11 and is arranged side by side at the right end. The beam splitter 24 provided on the moving table 5 is provided on the optical path of the laser beam B from the laser oscillator 12 on the left side. Beam splitter 2
Reference numerals 1 and 24 denote beam split mirrors in this case. The beam split mirrors have a configuration in which a part of the laser beam is guided to the processing head 15 and the rest is transmitted to the total reflection mirrors 22 and 23 of different moving tables. Any configuration may be used, and various configurations can be adopted.

The two movable tables 6 and 7 located at the central portion of the side by side are subjected to total reflection of the laser beams A and B output from the laser oscillators 11 and 12 on both sides by the total reflection.
Total reflection mirrors 22 and 23, which are optical components for leading to the processing head 15 supported by 7, are provided. Moving tables 6 and 7 provided with these total reflection mirrors 22 and 23
1 and 2, a moving table 6 provided with a total reflection mirror 22 disposed on an optical path of a laser beam A output from a laser oscillator 11 mounted on the left side of the traveling frame 4.
Is located on the left side, and the moving table 7 provided with the total reflection mirror 23 disposed on the optical path of the laser beam B output from the laser oscillator 12 mounted on the right side of the traveling frame 4 is disposed on the right side. The positions of the processing heads 1 and 6 are determined by the total reflection mirrors 22 and 23, respectively.
5 are located on the side of laser oscillators 11 and 12 that output laser beams A and B to be guided.

Two moving stands 6, which are located at the center in a row,
The laser beams A and B from the laser oscillators 11 and 12 on both sides are superimposed on one of them (here, the right moving table 7 in FIGS. 1 and 2) and supported by the moving table 7. Optical components (total reflection mirrors 51 to 53 and a polarization beam splitter 54 shown in FIGS. 8 to 10) leading to the processing head 15 are also provided, and are switched by a switching mechanism 50 mounted on the moving table 7. , The multiplexing optical component 51
To 54 and the use of the total reflection mirror 23 can be switched. These multiplexing optical components 51 to 54 constitute an optical component unit 50a that superposes the laser beams A and B from the laser oscillators 11 and 12 on both sides.
FIG. 13 shows a state in which the optical component unit 50a is arranged on the optical path of the laser beams A and B. The optical component unit 50a also functions as a multiplexing optical component.

The optical components 21, 22, 24 provided on the moving tables 5, 6, 8 other than the moving table 7 on which the switching mechanism 50 is mounted are moved so as to move the optical path of a target laser beam. Support mechanism 30 for switching between insertion and retraction
Is installed. With respect to the optical paths of the laser beams A and B from the laser oscillators 11 and 12, the insertion and retraction of the optical components of each movable table are performed by the support mechanism 30 and the switching mechanism 50 provided on each movable table 5 to 8. , A replacement is made. Further, the optical components 21 to 24 and the multiplexing optical components of the respective moving tables 5 to 8 maintain a state where they can be inserted into the optical path of the corresponding laser beam even when the moving table is moved along the horizontal rail 4c. It is moved as it is.

Here, a specific example of the support mechanism 30 will be described.
However, for convenience of explanation, the support mechanisms shown in FIGS. 5A and 5B are denoted by reference numeral 30a, and the support mechanisms shown in FIGS. 6 and 7 are denoted by reference numeral 30b.

(Specific Example 1 of Support Mechanism) FIG.
(B) shows an example of the support mechanism. FIG.
(A), (b) shows the optical component 22 (total reflection mirror 22)
The example of the application of the mobile stand 6 provided with is shown. The support mechanism 30a is a cylinder device 3 such as an air cylinder.
The optical component 22 is moved by the expansion and contraction drive of 1 to switch between insertion and retraction of the optical component 22 into the optical path of the laser beam A. The optical component 22 moves stably by being guided by the guide rail 32 provided on the movable table. The operation of the cylinder device 31 is controlled by the controller 4d (see FIG. 1). When the cylinder device 31 expands, the optical component 22 moves to the insertion position on the optical path of the laser beam A as shown in FIG. When the cylinder device 31 contracts, the optical component 22 moves to a retracted position outside the optical path as shown in FIG. 5B. Similarly, the optical components 21 and 22 of the other moving tables 5 and 8
4 can also be moved between the insertion position and the retreat position with respect to the optical path of the laser beams A and B by the support mechanism 30a.

In addition, as the cylinder device 31, various fluid pressure cylinders such as a hydraulic cylinder other than an air cylinder can be employed. Further, the support mechanism of the first embodiment moves the optical component between the insertion position and the retreat position by linearly moving using the expansion and contraction drive of the expansion and contraction device such as the cylinder device 31 described above. However, the type of the support mechanism that moves the optical component between the insertion position and the retreat position by linear movement is not limited to this. For example, a feed mechanism of a rack meshed with a gear that is rotationally driven by a motor is used. Various configurations such as those using movement can be adopted.

(Specific Example 2 of Support Mechanism) The support mechanism 30b shown in FIGS. 6 and 7 is an example of application to the movable base 5 provided with the optical component 21 which is a beam split mirror. Similarly, the present invention can be similarly applied to another moving table 8 provided with an optical component 24 that is a beam split mirror. This support mechanism 30b radially mounts four different mirrors 41 to 44 around a shaft portion 47 that is driven to rotate by a motor 46, and secures a gap between adjacent mirrors 41 to 44. , Motor 4
By the driving of 6, the mirror 41 to 44 or the gap between the mirrors is selectively arranged with respect to the optical axis of the laser beam A. The mirrors 41 to 44 are, for example, beam split mirrors having different reflectances (or transmittances), and all correspond to the optical component 21. 6 and 7, each of the mirrors 41-44
Although the tilt angle of the laser beam A with respect to the laser beam A is constant, it can be changed as appropriate in consideration of the optical characteristics of the mirror and the like. When the motor 46 rotates the shaft portion 47 by a predetermined angle, the mirrors 41 to 44 inserted (inserted positions) on the optical path of the laser beam A are switched, or the mirrors 41 to 44 are stopped at the retreat position off the optical path. .

FIG. 6 shows an example in which the beam split mirror 21 of the moving table 5 and the total reflection mirror 22 of the moving table 6 are both arranged on the optical path of the laser beam A. As the beam split mirror 24 of the movable table 8 on the opposite side, mirrors 41 to 41 moved by the support mechanism 30b are used.
The beam split mirror 24 (41
44) and the total reflection mirror 23 of the movable base 7 are arranged on the optical path of the laser beam B output from the laser oscillator 12 on the opposite side. In the example of FIG. 6, when a beam split mirror that reflects a half of the laser beam A and transmits the rest is inserted into the optical path (insertion position) as the optical component 21, the laser from the laser oscillator 11 is inserted. The beam A is equally divided via the optical component 21, and on the other hand, the laser beam whose direction has been changed by the optical component 21 is processed by the processing head 15 of the movable base 5 provided with the optical component 21. The laser beam A that has been irradiated onto the processing material 10 on the processing table 9 from the other side, that is, the laser beam A transmitted through the optical component 21 is redirected by the total reflection mirror 22 of the moving table 6 and The work material 10 on the work table 9 is irradiated. When the beam split mirror inserted into the optical path of the laser beam A is changed to one having a different reflectance (or transmittance), the ratio of the intensity of the laser beam guided to the processing head 15 of each of the movable tables 5 and 6 is increased. Is changed. Further, when a gap between the mirrors is arranged in the optical path of the laser beam A, the laser beam A reaches the total reflection mirror 22 of the movable base 6 without being divided at all, and is transmitted from the processing head 15 of the movable base 6. The processing material 10 is irradiated and used for cutting the processing material 10.

(Specific example of optical component for multiplexing) Next, a specific example of optical component for multiplexing will be described. This specific example oscillates from the laser oscillators 11 and 12 on both the left and right sides of the running frame 4,
This is a case where the output laser beams A and B having the same wavelength are overlapped with each other. 8 to 10, three total reflection mirrors 51 to 53 and one polarization beam splitter 54.
Is a multiplexing optical component. As shown in FIG. 11, the polarization beam splitter 54 transmits a P-wave laser beam (here, laser beam A) linearly polarized in a direction parallel to the reflection surface 54a and linearly polarizes the laser beam in a direction perpendicular to the reflection surface 54a. The reflected S-wave laser beam (here, laser beam B) is reflected. As shown in FIGS. 8 to 11, in this example, one of the laser beams A and B oscillated and output from the laser oscillators 11 and 12 on both sides (here, the laser beam output from the laser oscillator 11 on the left side). The laser beam A) is applied to three total reflection mirrors 51 to 53.
In order, it is polarized 90 degrees relative to the other laser beam (here, laser beam B),
The polarized beam splitter 54 is radiated as a P-wave, transmitted therethrough, and guided to the processing head 15. The other laser beam B is applied to the polarization beam splitter 54 as an S-wave, reflected, guided to the processing head 15. The polarization beam splitter 54 is inclined with respect to the optical axes of the laser beams A and B, so that the laser beams A and B are directed toward the same point on the reflection surface 54a of the polarization beam splitter 54. And the multiplexing optical components 51 to 5
In FIG. 4, as shown in FIG.
Laser beam B folded at right angle by total reflection at 4
And the laser beam A transmitted through the polarization beam splitter 54 can be guided to the processing head 15 in a superimposed state. In the examples of FIGS. 8 to 10, the optical paths of the laser beams A and B are in the front-back direction (the moving direction of the traveling frame 4).
Are slightly offset from each other and are arranged in parallel with each other.

In FIG. 12, the Brewster angle is used to fold the laser beam B by reflection at the polarization beam splitter 54, and the laser beam B is superimposed on the laser beam A transmitted through the polarization beam splitter 54. In this case, the reflectance of the P-wave and the transmittance of the S-wave in the polarization beam splitter 54 can be increased, and a laser beam having a large power can be efficiently obtained by superimposing the laser beams A and B.

The switching mechanism 50 is not shown, but for example, the optical component 23 and the multiplexing optical components 51 to 54 are individually supported by support mechanisms as illustrated in FIGS. 5A and 5B, respectively. Various configurations, such as a configuration for supporting and switching between insertion and retraction of the laser beams A and B with respect to the optical path, can be adopted. Further, a unit in which the optical components 51 to 54 are integrated and the optical component 23 are supported by a support mechanism as illustrated in FIGS. 5A and 5B, and inserted into the optical path of the laser beams A and B. A configuration for switching the evacuation can be adopted.

In the laser beam machine 1, each of the moving tables 5,
Switching between insertion and retraction of the optical components 21, 22, and 24 provided in 6, 8 into the optical path of the laser beams A and B;
Also, by switching (selective use) of the optical components 23, 51 to 54 inserted into the optical paths of the laser beams A and B on the moving table 7, a processing head 15 used for cutting the processing material 10.
And the intensity of the laser beam applied to the processing material 10 from the processing head 15 can be selected and changed. FIG. 1 to FIG.
FIG. 4 shows an example in which two processing heads 15 are used simultaneously (processing operation 1), FIG. 4 shows an example in which two processing heads 15 are used simultaneously (processing operation 2), and FIG. 13 shows an example in which only one processing head 15 is used (processing operation 1). The processing operation 3) is shown.

(Processing operation 1) As shown in FIGS. 1 to 3, the optical components 21 and 24 as beam splitters and the optical components 22 and 23 as total reflection mirrors are all irradiated with laser beams A and B. When it is inserted and arranged on the road, the four processing heads 15 are used at the same time to
0 processing can be performed. In this case, the laser oscillators 11 and 12
Of the laser beams A and B from the laser beam are reflected by the beam splitters 21 and 24 of the movable bases 5 and 8 at the left and right ends, and guided to the processing head 15 of the movable bases 5 and 8 to process the processing base 9. The material 10 is irradiated. On the other hand, beam splitter 2
The laser beams A and B transmitted through the mirrors 1 and 24 are totally reflected by the total reflection mirrors 22 and 23 on the two movable stages 6 and 7 at the center in the horizontal direction.
Thereby, it is guided to the processing head 15 of the moving tables 6 and 7 and is irradiated on the processing material 10 on the processing table 9. by this,
In other words, each of the two laser beams A and B is divided into two parts and distributed to a total of four processing heads 15.
Using the three processing heads 15, the processing of the processing material 10 can be performed simultaneously.

FIG. 3 shows that the laser beam A from the left laser oscillator 11 is equally divided by the beam splitter 21 of the moving table 5 and is irradiated on the processing material 10 from each processing head 15 of the moving tables 5 and 6. This is an example in which the moving tables 5 and 6 are used.
In each of the processing heads 15, the processing material 10 can be processed using a laser beam having the same intensity. The laser beam B from the laser oscillator 12 on the right side
The optical components 23 and 24 of the movable tables 7 and 8 are divided by using a beam splitter 24 that divides a laser beam B having the same intensity into two.
Are arranged in the same manner, a total of four processing heads 15 are simultaneously irradiated with a laser beam of the same intensity by the processing material 10.
Can be processed. In this case, since four processes can be performed simultaneously, it goes without saying that the processing efficiency can be improved. Further, the present invention is not limited to performing the exact same cutting operation by the plurality of processing heads 15, and by controlling the movement of each processing head 15, for example, a symmetrical cutting can be easily and efficiently performed. Become.

(Processing operation 2) As shown in FIG. 4, the optical components 21 and 24 provided at the left and right ends are located at the retracted positions off the optical path, and the optical components 22 and 23 are irradiated with the laser beams A and B. When inserted on the optical path, the laser beam A from the left laser oscillator 11 is guided through the optical component 22 to the processing head 15 on which the optical component 22 is mounted, and the laser beam B from the right laser oscillator 12 Is guided through the optical component 23 to the processing head 15 on which the optical component 23 is mounted. As a result, the laser beams A and B are simultaneously irradiated onto the processing material 10 from the two processing heads 15, and the processing material 10 can be processed at two locations at the same time. Therefore, it becomes possible to perform a plurality of strokes, which has been performed by a conventional apparatus having only one processing head, twice as fast. In this case, since the laser beams A and B from the respective laser oscillators 11 and 12 are not divided, the laser beam A having a stronger intensity from the processing head 15 than the processing operation shown in FIGS. , B can be applied to process the material 10 having a larger thickness. In this processing operation, the movable tables 5 and 8 at both ends in the horizontal direction are moved to the longitudinal ends of the horizontal rails 4c and retracted to positions outside the processing table 9, and the processing tables 9
The movement of the processing heads 15 of the moving tables 6 and 7 should not be interfered with.

(Processing Operation 3) FIG. 13 shows that, on the movable table 7 on which the switching mechanism 50 is mounted, the switching mechanism 50 replaces the optical component 23 with the laser oscillators 1 on both sides.
A multiplexing optical component unit 50a (multiplexing optical components 51 to 54) is arranged on the optical path of the laser beams A and B from the laser beams A and B. , 12 from the laser beams A, B
And guided to the processing head 15 of the moving table 7,
A case where the irradiation is performed from the processing head 15 toward the processing material 10 is shown. Optical component unit 50a for multiplexing
The optical components 21, 22, 24 of each of the moving tables 5, 6, 8 other than the moving table 7 provided with are all retracted to positions deviated from the optical paths of the laser beams A, B. In this case, the laser beams A,
B is superimposed by the multiplexing optical components 51 to 54 without being divided in the middle,
(In this case, cutting). by this,
It is possible to cope with the cutting of the processing material 10 having a large plate thickness, which was impossible in the past. Each of the moving tables 5, 6, 8 other than the moving table 7 provided with the multiplexing optical component unit 50a,
It is moved to the end of the horizontal rail 4c and retracted to the outside of the processing table 9 so as not to interfere with the movement of the moving table 7 provided with the multiplexing optical component unit 50a.

In the laser beam machine 1, the above-mentioned machining operation 1
Processing operations other than -3 are also possible.

(Other Example 1) Optical Components 2 of Moving Tables 6 and 7
2 and 23 are inserted and arranged in the optical path of the laser beams A and B, and only one of the optical components 21 and 24 of the movable tables 5 and 8 is inserted and arranged in the optical path of the laser beams A and B;
If the other is retracted to the retract position with respect to the optical path of the laser beams A and B, the total reflection mirrors 22 and 2 are used as optical components.
A processing head 15 of moving tables 6 and 7 provided with 3;
Processing of the processing material 10 by simultaneously using a total of three processing heads 15 of the processing heads 15 supported by the movable tables 5 and 8 on the side where a beam splitter as an optical component is inserted and arranged in the optical path of the laser beam. It is possible to do.
However, in this case, if the intensities (laser powers) of the laser beams A and B output from the laser oscillators 11 and 12 are the same, the power of the laser beam that does not pass through the beam splitter is changed to the laser beam that passes through the beam splitter. The power of the laser beams of the three processing heads 15 is not uniform because they are larger than the beams, so that the processing material 10 can be processed using laser beams having a plurality of types of beam powers.

(Other Example 2) When the laser beams from both laser oscillators 11 and 12 are superimposed on each other using the multiplexing optical components 51 to 54 and used for processing the processing material 10, one of the movable tables 5 and 8 or Both beam splitters are inserted and arranged in the optical path of the laser beam, and one or both of the laser beams superposed by the multiplexing optical components 51 to 54 are transmitted through the beam splitter inserted and arranged in the optical path of the laser beam. It may be a beam. In this case, the processing head 15 of the movable table provided with the beam splitter inserted in the optical path of the laser beam and the processing head 15 of the movable table 7 provided with the multiplexing optical components 51 to 54 are used simultaneously. Thus, the processing material 10 can be processed by using two or three processing heads 15 at the same time.

As described above, according to the laser beam machine 1, the controller 4d controls the driving of the support mechanism 30 and the switching mechanism 50, so that the plurality of laser oscillators 11 and 12 are controlled.
Parts 21 and 2 for laser beam output from
4. A processing head 1 that can switch between insertion and retraction of the multiplexing optical components 51 to 54, and is used for processing the processing material 10.
5 can be freely changed, and the width of the intensity of the laser beam used for processing the processing material 10 can be widened. In addition, laser oscillators such as a carbon dioxide laser
It is heavy and expensive, and in particular, in the case of a high-power laser oscillator capable of oscillating a high-power laser beam used for cutting a thick steel plate or the like, further increase in weight and cost is inevitable. As in the case of the laser beam machine 1, a plurality of laser beams are superimposed on each other by using an optical component for multiplexing and used for processing the processing material 10, so that a thick steel plate or the like can be produced without mounting a high-power laser oscillator. Since a laser beam having a sufficient intensity for cutting can be obtained, there is an advantage that the size and cost of the laser oscillator mounted on the traveling frame can be reduced.

The present invention is not limited to the above-described embodiment, but can be variously modified within the scope of the technical idea. In the above-described embodiment, a laser processing machine that is a laser cutting machine has been exemplified. However, the laser processing machine according to the present invention is not limited to this. The present invention is applicable to various laser processing machines that perform any one or more of the processing. The number of laser oscillators mounted on the traveling frame is not limited to two. A plurality of laser oscillators are mounted on one side of the traveling frame so that laser beams oscillated from three or more laser oscillators are guided to a common processing head. You may comprise. However, in terms of the traveling stability of the traveling frame, it is advantageous to distribute the plurality of laser oscillators so that the weights of the opposing sides of the traveling frame are substantially equal. The multiplexing optical component is not limited to the configuration including the mirrors 51 to 54 as illustrated in FIGS. 8 and 9, and various configurations can be adopted. In FIGS. 1 and 2 and the like, between a movable table 6 provided with a total reflection mirror and a laser oscillator 11,
The number of movable tables (the movable table provided with the beam splitter) installed between the movable table 7 and the laser oscillator 12 is not limited to one, and may be plural. If the number of movable stages equipped with the beam splitter between the movable stage equipped with the total reflection mirror and the laser oscillator is large, the number of divisions of the laser beam output from the laser oscillator (can be used simultaneously) The number of processing heads) and the intensity of the laser beam by the division can be changed more variously.

[0041]

As described above, according to the laser beam machine of the present invention, a single laser beam machine is provided with a plurality of laser oscillators, and the laser beam output from these laser oscillators is irradiated on the work material. A multiplexing optical component for superposing a plurality of laser beams and guiding the laser beam to the processing head is provided on at least one of the movable tables supporting the processing head to be processed, and an optical waveguide for guiding the laser beam output from one laser oscillator to the processing head. The component and the multiplexing optical component can be switched and used by a switching mechanism, so that a high-power laser beam obtained by superposing a plurality of laser beams by the multiplexing optical component, It is possible to selectively use a low power laser beam without superposition by optical components by switching between optical components and multiplexing optical components. Can, the plate thickness can be processed by the laser beam, it is possible to widen the range of such materials. Also, 1
The simultaneous use of a plurality of processing heads for processing a processing material with laser beams from one laser oscillator provides an excellent effect that the processing efficiency of the processing material can be increased.

As described in claim 2, a laser oscillator;
In a configuration in which a moving table provided with a beam splitter is interposed between a moving table provided with a total reflection mirror that guides a laser beam from the laser oscillator to the processing head by total reflection, a supporting mechanism is used. By moving the beam splitter between the insertion position located on the optical path of the laser beam and the retracted position deviating from the optical path, the laser beam is divided and used for processing the processing material, or the processing material is processed without being divided. The use for processing can be easily switched. That is, by switching between insertion and retraction of the beam splitter in the optical path of the laser beam, the intensity of the laser beam used for processing the processing material and the number of processing heads can be easily switched. Further, on a movable table provided with the total reflection mirror, the multiplexing optical component for superimposing a laser beam on which the total reflection mirror is inserted on an optical path and another laser beam; And a switching mechanism for switching an insertion arrangement of the multiplexing optical component and the total reflection mirror with respect to a laser beam inserted on a road. The multiplexing optical component further superimposes the laser beam. Because a strong laser beam can be obtained, the intensity of the laser beam used for processing the processing material can be switched in various ways, and the laser can be used in a wide range of conditions such as the material of the processing material and the plate thickness. There is an advantage that processing by a beam can be performed.

According to a third aspect of the present invention, the optical component is placed on each of the movable tables except for the movable table provided with the switching mechanism, on the optical path of any one of the laser beams superposed by the multiplexing optical component. By adopting a configuration in which a support mechanism that moves between the insertion position to be arranged and the retracted position that deviates from the optical path is mounted, switching between insertion and retraction of the laser beam in the optical path by the support mechanism of the optical component, and multiplexing by the switching mechanism By switching between the optical components for use and the optical components, it is possible to easily switch the intensity of the laser radiating the processing material for processing and the number of processing heads to be used.

According to the fourth aspect of the present invention, the switching mechanism for switching between the multiplexing optical component and the total reflection mirror is mounted on one of the movable tables provided with the total reflection mirror and arranged next to each other. Since the other movable table has a support mechanism for moving the total reflection mirror between an insertion position where the mirror is disposed on the optical path of the laser beam and a retracted position that deviates from the optical path, total reflection of the laser beam with respect to the optical path is performed. The number of processing heads used for switching the intensity of the laser beam irradiating the processing material and the laser processing of the processing material by switching between the multiplexing optical component and the total reflection mirror by the insertion, retraction, and switching mechanism by the mirror support mechanism Can be efficiently switched.

[Brief description of the drawings]

FIG. 1 is a plan view showing a laser processing machine according to an embodiment of the present invention.

FIG. 2 is a front view of the same.

FIG. 3 is a front view showing a state in which a beam splitter provided on a moving table of the laser beam machine shown in FIG. 1 and a total reflection mirror provided on another moving table are arranged on an optical path of the same laser beam; It is.

FIG. 4 is a front view showing a processing operation by the laser processing machine shown in FIG. 1 and showing an example using two processing heads.

5A and 5B are plan views illustrating an example of a support mechanism mounted on a movable base of the laser processing machine in FIG. 1; FIG. 5A illustrates a state where an optical component is moved to an insertion position with respect to an optical path of a laser beam;
(B) shows a state where the optical component has been moved to a retracted position with respect to the optical path of the laser beam.

FIG. 6 is a front view showing another example of the support mechanism mounted on the movable base of the laser beam machine shown in FIG.

FIG. 7 is a diagram showing an attached state of an optical component in the support mechanism of FIG. 6;

FIG. 8 is a plan view showing an example of a multiplexing optical component provided in the laser beam machine shown in FIG.

FIG. 9 is a front view showing the optical component for multiplexing of FIG. 8;

FIG. 10 is a perspective view showing the optical component for multiplexing of FIG. 8;

11 is an explanatory diagram showing a state in which two laser beams are superimposed using a polarization beam splitter adopted as the optical component for multiplexing in FIG. 8;

FIG. 12 is an explanatory view showing a state in which two laser beams are superimposed using the polarization beam splitter adopted as the optical component for multiplexing in FIG. 8; The corners are adopted.

13 is a diagram showing a processing operation by the laser processing machine of FIG. 1, wherein a laser beam obtained by superimposing two laser beams by a multiplexing optical component provided on a moving table is processed from one processing head. It is a front view which shows the example which processes a processing material by irradiating a material.

FIG. 14 is a plan view of a laser processing machine showing a conventional example.

FIG. 15 is a front view showing the laser beam machine shown in FIG. 14;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Laser machine, 2 ... Rail (track), 4 ... Running frame, 5-8 ... Moving table, 9 ... Processing table, 10 ... Processing material,
11, 12: laser oscillator, 15: processing head, 21,
Reference numeral 24: optical component (total reflection mirror), 22, 23: optical component (beam splitter), 30, 30a, 30b: support mechanism, 41 to 44: optical component (beam splitter), 5
0: switching mechanism, 50a: multiplexing optical component (multiplexing optical component unit), 51 to 53: multiplexing optical component (total reflection mirror), 54: multiplexing optical component (polarizing beam splitter), A , B ... laser beam.

Claims (4)

[Claims] 1. A traveling frame that moves on a processing table by traveling along a track, and a laser beam oscillated and output by a laser oscillator mounted on the traveling frame is applied to a processing material on the processing table. A plurality of moving tables that support the processing head to be irradiated and are arranged side by side on the traveling frame, a plurality of moving tables are respectively moved along the traveling frame in a direction substantially orthogonal to the track, and the traveling frame includes the laser. A plurality of oscillators are mounted, and a laser beam is output from each laser oscillator in a direction substantially orthogonal to the trajectory. Each movable table is inserted into the optical path of a single target laser beam. Optical components are provided for guiding the laser beam to the processing head by changing the direction of the laser beam, and laser beams from a plurality of laser oscillators are provided on one or more movable stages. By superimposing over beam laser processing machine, wherein a switching mechanism for switching between the optical component and the optical component multiplexing leading to the mobile base of the machining head is provided. 2. A part of the laser beam is placed between a laser oscillator and a movable table provided with a total reflection mirror which is an optical component for guiding the laser beam from the laser oscillator to the processing head by total reflection. A moving table provided with a beam splitter, which is an optical component that divides the light into the processing head and transmits the remaining light to the total reflection mirror, is interposed, and the moving table provided with the beam splitter includes the beam splitter. A support mechanism for moving between an insertion position arranged on the optical path of the laser beam and a retracted position deviating from the optical path is mounted, and the total reflection is performed by the switching mechanism mounted on a movable base on which the total reflection mirror is provided. The insertion arrangement of a mirror and the multiplexing optical component with respect to an optical path of a laser beam may be switched. 1 laser processing machine according. 3. A support mechanism for moving the optical component between an insertion position where the optical component is disposed on the optical path of the laser beam and a retracted position that deviates from the optical path is provided on each of the movable tables except the movable table provided with the switching mechanism. The laser beam machine according to claim 1, wherein the laser beam machine is mounted. 4. A plurality of movable tables are disposed between the laser oscillators disposed on both sides of the traveling frame, and a total reflection of a laser beam output from the laser oscillator on one side of the traveling frame. A movable table provided with a total reflection mirror, which is an optical component that guides the processing head, and a total reflection mirror that is an optical component that guides the laser beam output from the laser oscillator on the other side of the traveling frame to the processing head by total reflection. Are provided adjacent to each other as a side of a laser oscillator that outputs a laser beam to be guided to the processing head, and further, one of a pair of movable tables disposed adjacent to each other. Then, the laser beam from a plurality of laser oscillators is superimposed, and the multiplexing optical component for guiding to the processing head of the movable table and the total reflection mirror are switched. The switching mechanism is mounted on the other movable table, and a support mechanism for moving the total reflection mirror between an insertion position where the total reflection mirror is disposed on the optical path of the laser beam and a retracted position that deviates from the optical path is mounted. The laser beam machine according to any one of claims 1 to 3, wherein: