JP4603764B2 - Laser processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a laser processing apparatus that realizes miniaturization regardless of an increase in laser optical path length accompanying an increase in output of a laser oscillator.
[0002]
[Prior art]
Laser processing, which performs surface processing including cutting, welding, or thermal spraying by irradiating a workpiece with laser light from a laser tool, is becoming widespread. When performing these laser processing, the laser oscillator and the laser tool are connected by a laser light path having a preset length, and the laser tool and the workpiece are moved relatively while the laser light is emitted from the laser tool. Irradiating.
[0003]
For example, when the target laser processing is cutting, a carriage equipped with a laser oscillator and capable of traveling along a rail, and a laser torch mounted on the carriage and serving as a laser tool is perpendicular to the traveling direction of the carriage. There is provided a laser cutting device having a traverse carriage that can traverse and having a laser beam path surrounded by bellows between a laser oscillator and a laser torch.
[0004]
In the above laser cutting apparatus, there is a problem that the length of the laser light path formed between the laser oscillator and the laser torch changes with the traversing of the traversing carriage and the cutting quality varies. For this reason, by providing a laser beam inverter configured to move in the same direction as the traversing carriage in the same direction as the traversing carriage, the laser beam path length can be increased regardless of the traversing carriage travel. Is made constant (see, for example, Patent Document 1).
[0005]
When the distance from the laser oscillator to the condenser lens is required to be about 10 m, the laser spot positioning accuracy becomes difficult. Therefore, the laser oscillator is arranged on the Z-axis slide, and the laser output from the laser oscillator is connected to a plurality of mirrors. There is also proposed a configuration in which the laser optical path length is made constant by being guided to the focus lens through the B-axis swivel portion while being reflected (see, for example, Patent Document 2).
[0006]
[Patent Document 1]
Japanese Patent Publication No. 1-55076 [Patent Document 2]
Japanese Patent Laid-Open No. 5-138390
[Problems to be solved by the invention]
As shown in Patent Document 1, when a laser beam inverter is provided between the laser oscillator and the laser torch and moved along with the traversing of the traversing carriage, the number of operating parts increases and the apparatus becomes complicated and control is performed. There is also a problem that becomes complicated.
[0008]
Also, the laser beam path formed between the laser oscillator and the laser torch is provided with a cover such as bellows, but if the optical axis of the laser beam shifts due to traveling of the traveling carriage, transverse movement of the traveling carriage, or other causes There are problems such as damaging the cover and adjusting the optical axis.
[0009]
On the other hand, recently, the output of a laser oscillator has increased, and it has become possible to realize laser processing with a greater load, for example, increase in the thickness that can be cut. However, there is a correlation between the output of the laser oscillator and the length of the laser optical path, and the laser optical path increases as the output of the laser oscillator increases. For example, when the output of the laser oscillator is 400 W, the laser optical path length is about 800 mm, about 4 m at 500 W, about 7 m at 1.5 kW, about 8 m at 3 kW, and about 9 m at 4 kW to 6 kW.
[0010]
As described above, it is necessary to install a laser beam path having a length corresponding to the output of the laser oscillator to be used between the laser oscillator and the laser tool. For this reason, the problem that a laser processing apparatus enlarges generate | occur | produces and the problem that the operation | work at the time of adjusting an optical axis becomes more difficult derives.
[0011]
When it is going to solve the said problem with the technique shown in patent document 2, the length of a required laser optical path will be implement | achieved by a Z-axis slide and a B-axis turning part. However, the part designated as the laser beam path is a part where the turning mechanism of the laser torch and the mechanism for detecting the distance of the laser torch from the work material are densely packed, and how to reduce the size is pursued. It is a part that. For this reason, there is a problem that it is practically impossible to absorb the laser optical path length that changes in accordance with the change in the output of the laser oscillator.
[0012]
An object of the present invention is to provide a laser processing apparatus that can be miniaturized regardless of the output of a laser oscillator and can keep the length of a laser optical path constant.
[0013]
[Means for Solving the Problems]
In order to solve the above problems, a laser processing apparatus according to the present invention is capable of traversing a traveling carriage configured to run along a rail and a direction mounted on the traveling carriage and perpendicular to the traveling direction of the traveling carriage. A traversing carriage configured as described above, a laser beam emitting section mounted on the traversing carriage, a laser torch mounted on the traversing carriage, and a laser beam emitting section and laser torch mounted on the traversing carriage is arranged, having a laser light path adjusting device arranged mirror consisting of a plane mirror on at every turning point in a zigzag-like laser beam path of which is set in the casing having an entrance aperture and an exit aperture of the laser light, wherein The length of the laser beam path from the laser beam emitting portion to the laser beam incident hole of the laser beam path adjusting device, and the length of the zigzag laser beam path formed inside the laser beam path adjusting device The length of the laser beam path from the laser beam exit hole of the laser beam path adjusting device to the laser torch, and the length of the laser beam path according to the output of the laser oscillator emitted from the laser beam emitting unit It is configured to have an optimal length .
[0014]
In the laser processing apparatus, a traveling carriage configured to be able to travel along the rail is mounted with a traversing carriage, and a laser beam emitting unit and a laser torch that emit laser light are mounted on the traversing carriage, and further, a laser beam emitting unit Since the laser beam path adjusting device is disposed between the laser torch and the laser beam path, it is not necessary to provide a laser beam path on the traveling carriage frame, and all the laser beam paths can be arranged on the traversing carriage.
[0015]
In particular, since the laser beam path set to a different length depending on the output level of the laser oscillator can be accommodated within the area of the traversing cart without the need for the traveling cart, The length of the laser beam path can be maintained at a constant value regardless of the position where the beam traverses.
[0016]
Accordingly, there is no need to arrange a movable member such as a laser beam inverter in the range of the laser beam path, the apparatus can be miniaturized and the control can be simplified, and the work of adjusting the optical axis of the laser beam is also possible. It can be done easily.
[0017]
In particular, the laser beam path adjusting device is configured by setting a zigzag-shaped laser beam path inside the casing and arranging a mirror for each turning point in the zigzag laser beam path. A laser beam path having a length corresponding to the distance and the number of zigzag folds can be formed.
[0018]
For this reason, the length of the laser beam path set at the output of the laser oscillator can be secured and the volume can be reduced, and even if the output of the laser oscillator increases and the laser beam path becomes longer, the laser processing apparatus becomes larger. Is not invited.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a preferred embodiment of the laser processing apparatus will be described with reference to the drawings. FIG. 1 is a front view of a laser cutting device as a laser processing device. FIG. 2 is a plan view of the laser cutting device. FIG. 3 is a side view of the laser cutting device. FIG. 4 is a cross-sectional view illustrating the configuration of the laser beam path adjusting device.
[0020]
1-3, the laser cutting device A has a traveling carriage 2 mounted on a pair of rails 1 laid in parallel. The traveling carriage 2 is configured as a gate-type frame having saddles 2 a arranged along the rails 1 and garters 2 b and 2 c arranged in a direction orthogonal to the rails 1.
[0021]
The saddle 2 a is provided with a traveling motor 3, and by controlling the driving of the traveling motor 3, the traveling carriage 2 can travel along the rail 1 at a desired speed. Further, a deck 4 is provided on the saddle 2 a on one side, and an operation panel 5 is arranged facing the deck 4. Therefore, it is possible to operate the laser cutting apparatus A by operating the operation panel 5 while the worker is on the deck 4.
[0022]
The garter 2b is provided with a traversing rail 2d arranged in a direction orthogonal to the rail 1, and a traversing carriage 6 is mounted on the traversing rail 2d so as to traverse. The traversing cart 6 is provided with a traversing motor 7. By controlling the driving of the traversing motor 7, the traversing cart 6 can traverse in a direction orthogonal to the rail 1 at a desired speed.
[0023]
On the other side of the saddle 4 on the upper side of the garter 2c, there is mounted a power supply control unit 9 that applies energy to the laser beam emitting unit 8 mounted on the traversing carriage 6 and controls it. They are connected via tire cables, hoses, etc. (cables, etc.) 10. On the saddle side of the garter 2c, a control panel 11 having a control device including a computer for controlling the operation of the laser cutting device A is mounted.
[0024]
The traversing carriage 6 is equipped with a laser beam emitting unit 8 and a laser torch 12. A laser beam path 13 is formed by connecting the laser beam emitting unit 8 and the laser torch 12, and a laser beam path adjusting device 14 is provided in the laser beam path 13. The length of the laser beam path 13 from the laser beam emitting unit 8 through the laser beam path adjusting device 14 to the laser torch 11 is an optimum length according to the output of the laser oscillator including the mounted laser emitting unit 8 and power supply control unit 9. Is set.
[0025]
As described above, the laser light path 13 formed between the laser light emitting part 8 and the laser torch 12 has no movable part and is formed integrally. For this reason, even when the traversing carriage 6 traverses to any position, the length of the laser light path 13 does not change, and stable laser light can be emitted from the laser torch 12.
[0026]
Here, the configuration of the laser beam path adjusting device 14 will be described with reference to FIG. The laser beam path adjusting device 14 shown in the figure has a zigzag-shaped laser beam path 13 set in the casing 14a, so that it is several times the length of the casing 14a (the length in the left-right direction in FIG. 4). A laser beam path having a length is realized so that the entire volume of the laser cutting device can be reduced.
[0027]
In particular, even if the length of the required laser beam path is increased or decreased, an optical path length several times the length of the casing 14a can be formed by appropriately setting the length of the casing 14a in the laser beam path adjusting device 14. Therefore, it is possible to cope with an increase in the output of the laser oscillator without significantly increasing the installation area of the laser processing apparatus.
[0028]
The laser beam path adjusting device 14 includes a casing 14a and mirrors 14b to 14d arranged at the turning points of the zigzag laser beam path 13 set inside the casing 14a. The number of turns of the laser beam path 13 set in the casing 14a is not limited, and is appropriately set in relation to the total length of the laser beam path corresponding to the output of the laser oscillator.
[0029]
The casing 14a has rigid frames 14e and 14f and a cover 14g provided around the frames 14e and 14f, and an incident hole 14h through which laser light enters the frame 14e and the laser light are emitted. An exit hole 14i is formed. That is, the entrance hole 14h and the exit hole 14i are formed in the same frame 14e of the casing 14a, and the laser beam can be incident and exited from the same surface.
[0030]
When the entrance hole 14h and the exit hole 14i are arranged on the same surface (frame 14e) of the casing 14a as described above, an odd number of mirrors (14b to 14d) are arranged inside the casing 14a. The zigzag optical path is formed.
[0031]
A mirror 14c is fixed between the entrance hole 14h and the exit hole 14i formed in the frame 14e. A mirror 14b is attached to the frame 14f at a position facing the entrance hole 14h, and a mirror 14d is attached at a position facing the exit hole 14i. The mounting positions of the mirrors 14b and 14d on the frame 14f are the distance between the frame 14e and 14f and the distance between the mirror 14d and the exit hole 14i with an angle corresponding to the distance between the entrance hole 14h and the mirror 14c. A seat with an angle corresponding to the above is formed, and mirrors 14b and 14d are fixed to the respective seats.
[0032]
In the laser beam path adjusting device 14 configured as described above, the distance between the frame 14e (incident hole 14h, outgoing hole 14i) constituting the casing 14a and the mirrors 14b and 14d fixed to the frame 14f is S, and the incident hole 14h When the distance between the exit aperture 14i is is W, the length of the laser beam path 13 which is set in the interior of the casing 14a ^{is, 2S + (4S 2 + W} 2) 1/2 , and the casing 14a length substantially 4 times the A laser beam path 13 having a length L can be configured. Further, by appropriately setting the number of turns inside the casing 14a, it is possible to configure the laser light path 13 having a length corresponding to the number of turns.
[0033]
Therefore, the laser beam path 13 can be set to be folded, and the entire laser beam machining apparatus can be downsized while maintaining the length of the laser beam path required by the laser oscillator.
[0034]
In particular, in the casing 14a configured as described above, since the frames 14e and 14f for fixing the mirrors 14b to 14d have rigidity, the fixing posture of the mirrors 14b to 14d does not change and can be accurately maintained. is there. For this reason, even when the optical axis is adjusted between the laser oscillator and the laser torch, the adjustment of the mirrors 14b to 14d constituting the laser optical path adjusting device 14 can be made unnecessary.
[0035]
In the above embodiment, a laser beam path that performs folding in the same plane using three mirrors is set. However, a laser beam path that allows folding in a plurality of planes is set by using more mirrors. It is also possible. In this case, it is necessary to form the casing constituting the laser beam path adjusting device in a cubic shape, but it is possible to reduce the size as compared with the case where the laser beam path itself is formed in a linear shape. Further, as each of the mirrors 14b to 14d, a plane mirror is used in this embodiment.
[0036]
In the laser cutting apparatus A configured as described above, a material to be cut (not shown) should be placed on the surface plate 20 previously installed below the traveling carriage 2 between the rails 1 and cut from the material to be cut. Product information such as shape and quantity, and cutting information such as the cutting speed and the flow rate of the assist gas injected from the laser torch are input to the control device. When the cutting operation is started, the cutting order written in advance by the control device is applied. Control is performed accordingly.
[0037]
That is, first, the traveling motor 3 and the traversing motor 7 are driven to make the laser torch 12 coincide with the piercing position set on the material to be cut. When the laser torch 12 reaches the piercing position, the power supply control unit 9 operates, energy is applied to the laser beam emitting unit 8 and laser beam is emitted. The laser beam emitted from the laser beam emitting unit 8 enters the incident hole 14h of the laser beam path adjusting device 14, is reflected by the mirrors 14b to 14d, is emitted from the emission hole 14i, reaches the laser torch 12, and the laser torch 12 Is irradiated toward the material to be cut, and at the same time, a preset amount of assist gas is injected from the laser torch 12 to make a hole in the material to be cut.
[0038]
Thereafter, the traveling motor 3 and the traversing motor 7 are driven in accordance with a cutting path corresponding to a preset cutting shape and quantity, and the laser torch 12 moves along the cutting path. During the movement process of the laser torch 12, the material to be cut is continuously irradiated with the laser hole and the assist gas, and continuous cutting is performed.
[0039]
When a series of cuts on the workpiece is completed, the application of energy to the laser hole emitting unit 8 is stopped and the supply of assist gas to the laser torch 12 is also stopped, and the cutting of the workpiece by the laser torch 12 is stopped.
[0040]
When the traversing carriage 6 moves while cutting the workpiece to be cut as described above, since the laser beam emitting unit 8 and the laser torch 12 are mounted on the traversing carriage 6 relative to each other, There is no change in position. For this reason, the distance from the laser beam emitting part 8 to the tip of the laser torch 12 is always constant, and it becomes possible to irradiate a stable laser beam.
[0041]
That is, unlike the technique described in Patent Document 1, the laser beam inverter that moves with the traversing of the traversing carriage and the control for moving the laser beam inverter are not required.
[0042]
Moreover, although the example of the laser cutting apparatus which cut | disconnects a to-be-cut material as a laser processing apparatus was demonstrated, this invention is not limited only to a laser cutting apparatus, A laser welding apparatus travels along rails, such as a laser surface processing apparatus. Any laser processing apparatus that has a possible carriage and a traversing carriage and moves the laser torch mounted on the traversing carriage in a two-dimensional manner can be applied. is there.
[0043]
【The invention's effect】
As described above in detail, in the laser processing apparatus according to the present invention, the laser beam emitting unit and the laser torch are mounted on the traversing carriage and the laser beam path adjusting device is arranged, so that the traversing carriage moves. Even so, the relative distance between the laser beam emitting portion and the laser torch can be kept constant . For this reason, there is no need to arrange a movable member such as a laser beam inverter in the range of the laser beam path, the apparatus can be miniaturized and the control can be simplified, and the operation of adjusting the optical axis of the laser beam Can also be done easily.
[0044]
In particular, the laser beam path adjusting device is configured by setting a zigzag-shaped laser beam path inside the casing and arranging a mirror for each turning point in the zigzag laser beam path. A laser beam path having a length corresponding to the distance and the number of zigzag folds can be formed. For this reason, the length of the laser beam path set at the output of the laser oscillator can be secured and the volume can be reduced, and even if the output of the laser oscillator increases and the laser beam path becomes longer, the laser processing apparatus becomes larger. Is not invited.
[Brief description of the drawings]
FIG. 1 is a front view of a laser cutting device as a laser processing device.
FIG. 2 is a plan view of a laser cutting device.
FIG. 3 is a side view of the laser cutting device.
FIG. 4 is a cross-sectional view illustrating the configuration of a laser beam path adjusting device.
[Explanation of symbols]
A Laser cutting device 1 Rail 2 Traveling cart 2a Saddle 2b, 2c Garter 2d Traverse rail 3 Traveling motor 4 Deck 5 Control panel 6 Traverse cart 7 Traverse motor 8 Laser beam emitting unit 9 Power control unit
10 Cable etc.
11 Control panel
12 Laser torch
13 Laser path
14 Laser beam path adjustment device
14a casing
14b-14d mirror
14e, 14f frame
14g cover
14h Entrance hole
14i Outgoing hole
20 Surface plate

Claims (1)

A traveling carriage configured to travel along the rail;
A traversing carriage mounted on the traveling carriage and configured to traverse in a direction orthogonal to the traveling direction of the traveling carriage;
A laser beam emitting portion mounted on the traversing carriage;
A laser torch mounted on the traversing carriage;
For each turn-back point in a zigzag-shaped laser beam path that is disposed between a laser beam emitting portion and a laser torch mounted on the traversing carriage and set in a casing having a laser beam incident hole and an output hole. A laser beam path adjusting device having a mirror made of a plane mirror,
The length of the laser light path from the laser beam emitting section to the laser light incident hole of the laser light path adjusting device, the length of the zigzag laser light path formed inside the laser light path adjusting device, and the laser light path adjusting device The length of the laser light path from the laser light exit hole to the laser torch is the optimum length of the laser light according to the output of the laser oscillator emitted from the laser light emitting part. It is comprised so that it may become . The laser processing apparatus characterized by the above-mentioned .

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