JP3752112B2 - Laser processing apparatus and laser processing head - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a laser processing apparatus and a laser processing head, by exchanging the tip nozzle portion with a single processing head, so that other parts such as a laser beam and welding power or cutting power are applied to the same part or other part of the workpiece. The machining power can be supplied at the same time without affecting the lens system of the laser beam.
[0002]
[Prior art]
Laser light is extremely directional and has a large energy, and is used for precise welding, cutting, drilling, surface modification treatment, etc. by focusing on a small point. In this case, pulse wave laser light (PW) or continuous wave laser light (CW) is used depending on the material of the workpiece and the processing technique. Generally, pulse wave laser light has a short duration, so it is suitable for drilling minute holes or spot welding without affecting the surroundings. Suitable for machining such as welding.
[0003]
A YAG laser oscillator, which is a kind of solid-state laser oscillator, uses a YAG (yttrium, aluminum, garnet) crystal doped with Nd as a laser single crystal, and a laser beam having a wavelength of 1.064 μm is converted into a pulse wave laser beam or a continuous laser beam. Output as wave laser light. Since YAG laser light is infrared laser light having a wavelength of 1.064 μm, transmission using an optical fiber is possible. As a result, in a welding apparatus or cutting apparatus using a YAG laser oscillator, laser light can be routed by an optical fiber, and the degree of freedom in design and arrangement is great.
[0004]
When laser welding is performed with such a laser welding apparatus, welding with a deep penetration depth can be performed in a narrow welding range. This is because the laser beam has a very strong light condensing property, and the laser beam functions as a powerful concentrated heat source with an extremely high energy density.
[0005]
On the other hand, TIG welding (inert gas shielded tungsten arc welding) is known as a conventional welding technique. TIG welding is a method of welding by generating an arc between a tungsten electrode and a base material in an inert gas atmosphere such as argon or helium. In such TIG welding, since the arc spreads over a wide range, welding with a wide bead width is possible and welding with a groove tolerance is possible.
[0006]
In recent years, it has been studied to simultaneously perform laser welding and TIG welding on the same welded portion so that welding with a deep penetration depth can be obtained over a wide welding range. As an apparatus studied so that laser welding and TIG welding can be performed simultaneously, there is an apparatus shown in FIG.
[0007]
In the apparatus shown in FIG. 6, the TIG welding head 1 in which the tungsten electrode 2 a is straight is disposed obliquely with respect to the surface of the base material 3, and the arc 4 is generated between the tungsten electrode 2 a and the base material 3. On the other hand, the base material 3 is irradiated obliquely with the laser beam 6 collected by the condenser lens system 5. The relative positional relationship between the TIG welding head 1 and the condenser lens system 5 is maintained so that the welding point by the arc 4 and the irradiation point by the laser beam 6 coincide.
[0008]
As a cutting device using a YAG laser oscillator, there is a device shown in FIG. In the apparatus shown in FIG. 7, cutting is performed by supplying a cutting gas 7 from around the laser beam 6 collected by the condenser lens system 5.
[0009]
[Problems to be solved by the invention]
However, in the welding apparatus shown in FIG. 6, the TIG welding head 1 and the condensing lens system so that the welding point by the arc 4 and the irradiation point of the laser beam 6 coincide with each other even if the welding position or the welding posture changes. The relative positional relationship of 5 must be maintained, and troublesome position adjustment must be performed frequently during use, which is inconvenient. Further, since the laser beam 6 is incident obliquely with respect to the base material 3, the shape of the molten pool is not symmetrical and the welded shape may be deteriorated.
[0010]
Furthermore, depending on the welding position and the welding posture, if an attempt is made to make a relative positional relationship such that the two points coincide with each other, it may interfere with surrounding members and devices, and a good relative positional relationship may not be obtained. In such a case, good welding cannot be performed.
[0011]
In the cutting apparatus shown in FIG. 7, since the cutting gas 7 is supplied from the periphery of the laser beam 6, the gas pressure (flow rate) of the cutting gas 7 is influenced by the pressure strength of the condenser lens system 5, and the gas pressure There was a limit to raising it. For this reason, there has been a restriction on the plate thickness that can be cut.
[0012]
The present invention has been made in view of the above circumstances, and a laser beam and other processing power such as welding power and cutting power are simultaneously applied to the same part of the workpiece by one laser processing head, and the lens system is affected. It is an object of the present invention to provide a laser processing apparatus and a laser processing head that can be supplied without giving the above.
[0013]
[Means for Solving the Problems]
The configuration of the laser processing apparatus of the present invention that solves the above problems includes a laser oscillator that outputs laser light, a transmission means that transmits the laser light output from the laser oscillator to the laser processing head, and a transmission that is provided in the laser processing head. A guide optical system for injecting laser light from the means, a split optical system for dividing the laser light incident from the guide optical system provided in the laser processing head into a plurality of bundles, and a laser processing head for providing the laser light to be processed A plurality of condensing optical systems for condensing light, a guide optical system that is provided in the laser processing head and that guides a plurality of bundles of laser beams divided by the dividing optical system, and a laser processing head. The processing means is interchangeably supported between the bundles of laser beams provided and collected by a plurality of condensing optical systems, and the processing portion of the processing means is defined. A support unit disposed toward the processing unit, a moving unit that holds the laser processing head and moves the laser processing head to an arbitrary position, a processing power supply unit that supplies processing power to the processing unit, a laser oscillator, and a movement And a control means for controlling the operation of the machining power supply means.
[0014]
And an imaging means for monitoring provided in the laser processing head, an optical transmission means for monitoring provided in the laser processing head, an imaging means for monitoring information on a workpiece and the laser processing head provided in the laser processing head, and And a monitoring guide optical system for guiding to the monitoring light transmission means. Further, the processing means is characterized by applying welding means and gas supply means. Further, the processing means is disposed in the laser processing head so that the angle can be adjusted, and information from the monitoring light transmission means is input to the control means, and the angle of the processing means is adjusted based on the information of the monitoring light transmission means. It is characterized by having a function to adjust.
[0015]
The laser processing head according to the present invention includes a splitting optical system that divides input laser light into a plurality of bundles, a plurality of condensing optical systems that focus the laser light on a workpiece, and a plurality of splitting optical systems. A processing means is interchangeably supported between a guide optical system that guides a bundle of laser beams to each of a plurality of condensing optical systems and a bundle of laser beams condensed by the plurality of condensing optical systems, and a processing portion of the processing means And a support part that is arranged toward the part to be processed.
[0016]
In addition, the imaging apparatus includes a monitoring imaging unit, a monitoring light transmission unit, and a monitoring guide optical system that guides information in the processing part and the head to the monitoring imaging unit and the monitoring light transmission unit. Further, the processing means is characterized by applying welding means and gas supply means. Further, the processing means is arranged so that the angle can be freely adjusted.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 shows a schematic block configuration of a laser processing apparatus provided with a laser processing head according to an embodiment of the present invention, FIG. 2 shows a configuration of a laser processing head, and FIG. 3 shows a schematic configuration showing an optical system of laser light. 4 shows a schematic configuration representing the optical system of the monitoring system, and FIG. 5 shows the configuration of the processing means.
[0018]
A schematic configuration of the laser processing apparatus will be described with reference to FIG. As shown in the figure
The laser processing apparatus 10 includes a YAG laser oscillator 11 that outputs laser light, and the laser light output from the YAG laser oscillator 11 is transmitted to the laser processing head 13 through an optical fiber 12 as a transmission means.
[0019]
The laser processing head 13 is held by a multi-axis NC robot 15 as moving means, and is positioned and moved to an arbitrary position by the multi-axis NC robot 15. Further, a cutting nozzle 16, a TIG head 17, a MIG head 18, a filler wire head 19 and a powder nozzle 20 as processing means are supported on the laser processing head 13 so as to be exchangeable and adjustable in angle.
[0020]
The laser processing apparatus 10 is provided with an accessory device 21 for processing means. The accessory device 21 includes a cooling water supply device 22, a processing gas supply device 23 for cutting processing gas (oxygen or the like), a TIG welding machine 24, a MIG welding machine 25, a filler wire supply device 26, and a powder supply unit 27. Yes.
[0021]
The operations of the YAG laser oscillator 11, the multi-axis NC robot 15, and the accessory device 21 of the processing means are controlled by a control device 31. The control device 31 includes an oscillator controller 32, an NC controller 33, a cooling water controller 34, a monitoring controller 35, an autofocus controller 36, a nozzle angle controller 37, and a monitor TV 38.
[0022]
The oscillator controller 32 controls the output of the laser beam of the YAG laser oscillator 11, the NC controller 33 controls the operation of the multi-axis NC robot 15, and the monitoring controller 35 performs various operations according to the light emission state from the monitoring optical fiber to be described later. Controls the operation of the operating unit. The autofocus controller 36 controls the optical system described later to control the focus of the laser beam, and the nozzle angle controller 37 adjusts and controls the nozzle and head angles.
[0023]
The laser processing head 13 will be described in detail with reference to FIGS.
[0024]
As shown in FIGS. 2 and 3, an optical fiber 12 is supported on the laser processing head 13, and laser light from the YAG laser oscillator 11 transmitted by the optical fiber 12 enters downward. A collimating lens group 41 as a guide optical system is provided immediately below the optical fiber 12, and the collimating lens group 41 makes the laser light from the optical fiber 12 parallel.
[0025]
A triangular prism-shaped split mirror 42 as a split optical system is provided immediately below the collimator lens group 41, and the laser light collimated (incident) by the collimator lens group 41 is divided into two horizontal lasers by the split mirror 42. Divided into light beams 43a and 43b. Laser beams 43a and 43b are reflected by reflecting mirrors 44a and 44b as guide optical systems, respectively, and laser beams 43a and 43b are collected by halved condensing lens groups 45a and 45b as condensing optical systems. The laser beam 46a, 46b is focused on one workpiece 40. As the splitting optical system, a laser beam may be split into three horizontal laser beams using a triangular pyramid splitting mirror.
[0026]
The reflection mirrors 44a and 44b are variably supported at tilt angles, and are operated based on the command from the autofocus controller 36 described above to control the focal points of the laser beams 46a and 46b.
[0027]
As shown in FIG. 2, the above-described head or nozzle is supported interchangeably as a processing means between the laser beams 46a and 46b collected by the condensing lens groups 45a and 45b, and the tip as a processing part of the head or nozzle is used. The laser processing head 13 is provided with a support portion 47 that arranges the portion toward the processed portion 40. In the illustrated example, a state in which the TIG head 17 is disposed as a processing means is shown. The support unit 47 is provided with variable means 48, which is operated based on a command from the nozzle angle controller 37, and adjusts and controls the angles of the nozzle and the head (TIG head 17).
[0028]
As shown in FIGS. 2 and 4, a CCD camera 51 as an imaging means for monitoring is provided at the rear upper part of the laser processing head 13, and the CCD camera 51 is connected to the monitor TV 38 of the control device 31 through the optical fiber 52 for image. The images in the workpiece 40 and the laser processing head 13 are transmitted. Further, a monitoring optical fiber 53 as a monitoring light transmission means is supported behind the laser processing head 13, and the light emission status of the processing target 40 is transmitted to the monitoring controller 35 of the control device 31 via the monitoring optical fiber 53.
[0029]
Between the condensing lens groups 45a and 45b, there is provided a reflection mirror 54 that reflects the state of the processed portion 40 to the rear side, and immediately below the CCD camera 51, the state of the processed portion 40 reflected by the reflective mirror 54. A semi-transmissive mirror 55 is provided that reflects the light upward and transmits the light backward. In the figure, reference numeral 56 denotes a collimator disposed between the reflecting mirror 54 and the semi-transmissive mirror 55. As shown in FIG. 4, the state of the processed part 40 reflected by the semi-transmissive mirror 55 is condensed on the input part of the CCD camera 51 by the lens group 57. The state of the workpiece 40 transmitted through the semi-transmissive mirror 55 is condensed on the monitoring optical fiber 53 by the lens group 58.
[0030]
The processing means will be described with reference to FIG.
[0031]
5A, the tungsten electrode 62 is held by the TIG head 17, and welding by the arc 63 is performed by supplying power from the TIG welding machine 24 and supplying inert gas. In the laser processing head 13, the laser beam 46 by the laser processing system (the collimating lens group 41, the split mirror 42, the reflection mirror 44, and the condensing lens group 45) is divided into two and condensed, and between the two divided laser beams 46. The TIG head 16 is disposed on the side. For this reason, laser welding and arc welding can be performed simultaneously on the same workpiece 40.
[0032]
FIG. 5B shows a cutting nozzle 16 to which, for example, oxygen gas is supplied from the processing gas supply device 23. When the cutting nozzle 16 is held in the laser processing head 13, the cutting with the laser beam 46 and the supply of the cutting gas from the cutting nozzle 16 can be simultaneously performed on the same workpiece 40 on the same axis. Since the processing gas for cutting from the cutting nozzle 16 becomes irrelevant to the lens system of the laser processing system, the pressure can be increased regardless of the pressure strength of the lens. For this reason, it becomes possible to cut deeply and it can be applied to the cutting of thick objects, and there is no restriction on the plate thickness that can be cut by adjusting the processing gas pressure.
[0033]
By adjusting the angle of the cutting nozzle 16 through the variable means by the nozzle angle controller 37 of the control device 31 according to the light emission state transmitted from the monitoring optical fiber 53, for example, the laser processing head 13 is moved backward in the traveling direction. By adjusting by tilting, the metal immediately after melting can be blown away to the rear side in the traveling direction, and deeper cutting becomes possible.
[0034]
FIG. 5C shows a MIG head 18 which performs welding by supplying power from the MIG welding machine 25 and supplying filler wire 68 from a wire feeding device 67. When the MIG head 18 is held on the laser processing head 13, welding with the laser beam 46 and MIG welding with the MIG head 18 can be performed simultaneously on the same workpiece 40.
[0035]
FIG. 5D shows a filler wire head 19 which performs welding by supplying a filler wire 73 from a wire feeder 72. When the filler wire head 19 is held on the laser machining head 13, the mutual positional relationship between the laser beam 46 and the filler wire 73 can be kept constant with respect to the workpiece 40 regardless of the moving direction and angle of the laser machining head 13. it can.
[0036]
FIG. 5 (e) shows a powder nozzle 20 from which a metal powder (for example, a metal such as iron, stainless steel, or aluminum) 75 is supplied from a powder supply unit 27. When the powder nozzle 20 is held in the laser processing head 13, the metal powder 75 is spread in an arbitrary shape by the movement of the laser processing head 13, and the laser beam 46 is irradiated and sintered for each layer. By repeating this, it is possible to perform build-up molding of an arbitrary three-dimensional shape.
[0037]
In the laser processing apparatus 10 provided with the laser processing head 13 having the above-described configuration, the multi-axis NC robot 14 is operated in accordance with an instruction from the control device 31, and the laser processing head 13 is moved and operated to a desired state to perform laser processing and welding. Processing by processing means such as cutting is performed simultaneously. During processing, cooling water is supplied from the cooling water supply device 22 according to a command from the cooling water controller 34 as necessary. A case where the TIG head 17 is held on the support 47 as a processing means will be described as an example.
[0038]
The laser light from the YAG laser oscillator 11 transmitted through the optical fiber 12 enters downward, and the laser light from the optical fiber 12 is collimated by the collimating lens group 41. The laser light that has been collimated (incident) by the collimator lens group 41 is divided into two horizontal laser light beams 43a and 43b by the split mirror 42, and the respective laser light beams 43a and 43b are reflected by the reflection mirrors 44a and 44b. Then, the light is condensed by the condensing lens groups 45a and 45b, and is condensed as one laser beam 46a and 46b on one workpiece 40.
[0039]
Further, the TIG head 17 is disposed between the laser beams 46a and 46b condensed by the condensing lens groups 45a and 45b, and the workpiece 40 is fed by the arc 63 by supplying power from the TIG welding machine 24 and supplying inert gas. Welding.
[0040]
Laser welding using the laser beams 46a and 46b and TIG welding using the arc 63 are simultaneously performed on the same workpiece 40, and welding with a deep penetration depth is performed well over a wide welding range. Since the laser processing head 13 has a structure in which the laser processing system (collimating lens group 41, split mirror 42, reflection mirrors 44a and 44b and condensing lens groups 45a and 45b) and the TIG head 17 are integrated, welding is performed. Even if the position and the welding posture are changed, the laser welded portion and the TIG welded portion always coincide with each other without any special operation. For this reason, it is possible to perform welding with good operability. Moreover, since it is an integral structure, it is compact and does not interfere with peripheral members.
[0041]
The situation inside the workpiece 40 and the laser processing head 13 is taken by the CCD camera 51 via the reflection mirror 54, the collimator 56 and the semi-transmission mirror 55, and the image is monitored by the monitor TV 38 of the control device 31 via the image optical fiber 52. Is projected on the screen. Monitoring is performed using the image on the monitor TV 38, and when a problem or the like occurs, an appropriate measure is immediately taken.
[0042]
Further, the light emission state of the workpiece 40 is input to the monitoring optical fiber 53 via the reflecting mirror 54, the collimator 56, the semi-transmissive mirror 55, and the lens group 58, and transmitted to the monitoring controller 35 of the control device 31. From the monitoring controller 35, the NC controller 33, the position of the laser processing head 13, the condensing position of the laser beams 46a and 46b, the support state of the TIG head 17 and the like are adjusted according to the light emission state of the processing part 40. Commands are issued to the autofocus controller 36 and the nozzle angle controller 37.
[0043]
The laser processing apparatus 10 provided with the laser processing head 13 described above divides a laser beam 46 by a laser processing system (a collimating lens group 41, a split mirror 42, a reflection mirror 44, and a condensing lens group 45) into two parts and condenses them. Since the processing means (TIG head 17) is arranged between the two divided laser beams 46a and 46b, it is possible to perform laser welding and arc welding at the same time by always matching the welded part to the same processed part 40. it can. Therefore, the laser beam 46a, 46b and the welding arc 63 (other processing power such as cutting gas, filler wire, metal powder, etc.) are simultaneously applied to the processing portion 40 by one laser processing head 13 and the lens. It can be supplied satisfactorily without affecting the system, and the processing efficiency can be improved by increasing the capability of other processing power.
[0044]
【The invention's effect】
The laser processing apparatus of the present invention includes a laser oscillator that outputs laser light, a transmission means that transmits the laser light output from the laser oscillator to the laser processing head, and a laser light that is provided in the laser processing head and enters the laser light from the transmission means. A guide optical system, a split optical system provided in the laser processing head for dividing the laser light incident from the guide optical system into a plurality of bundles, and a plurality of collections provided in the laser processing head for condensing the laser light on the workpiece. An optical optical system, a guide optical system that guides a plurality of bundles of laser beams that are provided in the laser processing head and are divided by the split optical system, and a plurality of condensing optics that are provided in the laser processing head The processing means is exchangeably supported between the bundles of laser beams collected by the system, and the processing part of the processing means is arranged facing the part to be processed. A holding unit, a moving means for holding and moving the laser processing head to an arbitrary position, a processing power supply means for supplying processing power to the processing means, a laser oscillator, a moving means, and a processing power supply means. Since the control means for controlling the operation is provided, it is possible to perform laser processing and other processing at the same time by always matching the processing portions even when the posture is changed with respect to the same processing portion. As a result, one laser processing head can supply the laser beam and the processing power of other processing to the processing part at the same time without affecting the lens system, and the operability is good. Machining can be performed, and the machining power can be increased to improve machining efficiency.
[0045]
In addition, a monitoring imaging means provided in the laser processing head, a monitoring light transmission means provided in the laser processing head, a monitoring imaging means for monitoring information on a workpiece and a laser processing head provided in the laser processing head, and Since the monitoring guide optical system led to the monitoring light transmission means is provided, the processing means is disposed in the laser processing head so that the angle can be freely adjusted, and information from the monitoring light transmission means is input to the control means. In addition, the function of adjusting the angle of the processing means based on the information of the monitoring light transmission means is provided, so that the angle of the laser processing head and the processing means is optimized based on the information of the part to be processed and the laser processing head. Can be adjusted.
[0046]
The laser processing head according to the present invention includes a splitting optical system that divides input laser light into a plurality of bundles, a plurality of condensing optical systems that focus the laser light on a workpiece, and a plurality of splitting optical systems. A processing means is interchangeably supported between a guide optical system that guides a bundle of laser beams to each of a plurality of condensing optical systems and a bundle of laser beams condensed by the plurality of condensing optical systems, and a processing portion of the processing means With the support part that is arranged toward the part to be processed, even if the posture is changed with respect to the same part to be processed, the processing part is always matched so that laser processing and other processing can be performed simultaneously. . As a result, one laser processing head can supply the laser beam and the processing power of other processing to the processing part at the same time without affecting the lens system. Machining can be performed, and the machining power can be increased to improve machining efficiency.
[0047]
Further, since the image pickup means for monitoring, the light transmission means for monitoring, and the monitoring guide optical system for guiding the information in the processing part and the head to the image pickup means for monitoring and the light transmission means for monitoring are provided. Since the angle is freely adjustable, the angle of the processing means can be optimally adjusted based on the information on the processing part and the laser processing head.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of a laser processing apparatus including a laser processing head according to an embodiment of the present invention.
FIG. 2 is a configuration diagram of a laser processing head.
FIG. 3 is a schematic configuration diagram showing an optical system of laser light.
FIG. 4 is a schematic configuration diagram showing an optical system of a monitoring system.
FIG. 5 is a configuration diagram of processing means.
FIG. 6 is a configuration diagram showing a conventional technique.
FIG. 7 is a configuration diagram showing a conventional technique.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Laser processing apparatus 11 YAG laser oscillator 12 Optical fiber 13 Laser processing head 15 Multi-axis NC robot 16 Cutting nozzle 17 TIG head 18 MIG head 19 Filler wire head 20 Powder nozzle 21 Attached equipment 22 Cooling water supply apparatus 23 Processing gas supply apparatus 24 TIG Welding machine 25 MIG welding machine 26 Filler wire supply device 27 Powder supply unit 31 Control device 32 Oscillator controller 33 NC controller 34 Cooling water controller 35 Monitoring controller 36 Autofocus controller 37 Nozzle angle controller 38 Monitor TV
40 Worked part 41 Collimating lens group 42 Split mirror
43a, 43b Laser beam
44a, 44b Reflective mirror
45a, 45b condenser lens group
46a, 46b Laser beam 47 Support section 48 Variable means 51 CCD camera 52 Optical fiber for image 53 Optical fiber for monitoring 54 Reflective mirror 55 Semi-transparent mirror 56 Collimator 57, 58 Lens group 62 Tungsten electrode 63 Arc 67, 72 Wire feeder 68, 73 Filler wire 75 powder metal

Claims (8)

Laser oscillator for outputting laser light, transmission means for transmitting laser light output from the laser oscillator to the laser processing head, guide optical system provided in the laser processing head for injecting laser light from the transmission means, and laser processing A split optical system that divides a laser beam incident from a guide optical system provided in the head into a plurality of bundles, a plurality of condensing optical systems that are provided in the laser processing head and condense the laser light on a workpiece, and a laser processing head A guide optical system that guides a plurality of bundles of laser light divided by the split optical system to each of the plurality of condensing optical systems, and a laser light that is provided in the laser processing head and condensed by the plurality of condensing optical systems And a laser processing head for supporting the processing means interchangeably between the bundles and arranging the processing portion of the processing means toward the processing portion. A moving means for holding and moving the laser processing head to an arbitrary position, a processing power supply means for supplying processing power to the processing means, and a control means for controlling operations of the laser oscillator, the moving means and the processing power supply means A laser processing apparatus comprising: The monitoring imaging means provided in the laser processing head, the monitoring light transmission means provided in the laser processing head, and the information on the part to be processed and the laser processing head provided in the laser processing head according to claim 1 A laser processing apparatus comprising: an imaging unit and a monitoring guide optical system that leads to a monitoring optical transmission unit. 3. The laser processing apparatus according to claim 1, wherein welding means and gas supply means are applied as the processing means. The processing means is arranged in the laser processing head so that the angle can be adjusted, and information from the monitoring light transmission means is input to the control means, and information in the monitoring light transmission means is also input to the control means. A laser processing apparatus having a function of adjusting the angle of the processing means based on the above. A splitting optical system that divides the input laser light into a plurality of bundles, a plurality of condensing optical systems that focus the laser light on the workpiece, and a plurality of concentrating laser lights that are split by the splitting optical system. The processing means is interchangeably supported between a guide optical system that leads to each of the optical optical systems and a bundle of laser beams condensed by a plurality of condensing optical systems, and the processing portion of the processing means is arranged facing the part to be processed. A laser processing head characterized by comprising a supporting portion for carrying out the processing. 6. The imaging apparatus according to claim 5, further comprising: a monitoring imaging means, a monitoring light transmission means, and a monitoring guide optical system for guiding information in the processing part and the head to the monitoring imaging means and the monitoring light transmission means. And laser processing head. 7. The laser processing head according to claim 5, wherein welding means and gas supply means are applied as the processing means. 8. The laser processing head according to claim 5, wherein the processing means is arranged so as to be adjustable in angle.

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