JP3595511B2 - Laser processing head and laser processing apparatus provided with the same - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a laser processing head and a laser processing apparatus including the laser processing head, and is useful when applied to, for example, laser welding and arc welding simultaneously.
[0002]
[Prior art]
For example, when joining metals together, there are laser welding and arc welding as a kind of welding technique. Laser welding is CO ₂ This is performed using a laser oscillator or a YAG laser oscillator. CO ₂ Since laser light must be mirror-transmitted, it takes time to adjust the laser beam. On the other hand, YAG laser light can be transmitted by an optical fiber, so that there is an increasing expectation for laser welding using a YAG laser oscillator. On the other hand, arc welding includes gas shield consumable electrode arc welding such as MIG (GMA) welding and gas shield non-consumable electrode arc welding such as TIG welding.
[0003]
In laser welding, laser light is collected by an optical device to obtain a high energy density, so that deep penetration welding can be performed in a narrow melting range, while arc welding such as MIG welding and TIG welding is possible. Since the arc spreads over a relatively wide range, welding with a wide bead width is possible, and welding with a high groove tolerance is possible. For this reason, in recent years, methods for simultaneously performing laser welding and arc welding have been studied for the purpose of performing welding with a high groove tolerance and a deep penetration depth.
[0004]
In this case, although not shown, if the laser welding head and the MIG welding head are independent, the entire head becomes very large, and the laser welding head and the MIG correspond to changes in the welding position and welding posture. It is troublesome to always keep the relative positional relationship of the welding heads constant, and is not particularly suitable for three-dimensional machining by a robot.
[0005]
In order to solve these problems and the like, a laser processing head as shown in FIG. 6 was developed. In this laser processing head, the laser beam 12 transmitted by the optical fiber 11 is reflected by the convex roof mirror 13 and the concave roof mirror 14 and divided into two parts, a first divided laser beam 12a and a second divided laser beam 12b. Thus, a space portion 17 is formed between the two, and the divided laser beams 12a and 12b are condensed by the condensing optical system 15 and irradiated onto the workpiece 16. Then, by inserting a MIG electrode (filler wire) 18 fed from a wire feeding device (not shown) into the space 17 of the divided laser beams 12a and 12b, the laser beams 12a and 12b and the MIG electrode 18 are coaxial. It is trying to become. According to this laser processing head, since the laser beams 12a and 12b and the MIG electrode 18 are coaxial, no complicated adjustment of the relative positional relationship is required, and three-dimensional processing by a robot can be easily performed. Can do.
[0006]
Laser light is also used for cutting. FIG. 7 is a configuration diagram of a conventional laser processing head for performing laser cutting. In the laser processing head shown in FIG. 7, a tapered cutting gas nozzle 22 is provided so as to surround the periphery of the laser light 21 collected by the condensing optical system 20, and the cutting gas is supplied from the tip opening 22 a of the cutting gas nozzle 22. (Assist gas) 24 is jetted to the cut portion 23 a of the work 23. For this reason, even if it tries to increase the flow velocity of the cutting gas or to narrow the tip opening 22a of the cutting gas nozzle 22 in order to efficiently feed the cutting gas 24 into the cut portion 23a, it will interfere with the laser light 21. There was a limit.
[0007]
Therefore, in order to solve such problems and the like, although not shown, by inserting a thin tubular cutting gas nozzle into the space portion 17 of the divided laser beams 12a and 12b divided into two as shown in FIG. A laser processing head was developed in which the cutting gas nozzle and the laser beams 12a and 12b are coaxial. In this laser processing head, the workpiece is cut by condensing and irradiating the divided laser beams 12a and 12b while jetting a cutting gas from a thin tubular cutting gas nozzle.
[0008]
In addition, as an in-process monitoring system, a CCD camera or a monitoring fiber may be provided in the laser processing head in order to monitor a processing state in laser welding or laser cutting. In this case, the conventional configuration is as shown in FIG. That is, image extraction and light emission extraction of the workpiece 28a in the workpiece 28 can be performed from the optical axis direction of the condensing optical system 24 (from directly above the workpiece), that is, coaxially. In order to visualize the image, an optical fiber 25 for transmitting the YAG laser light 26 is disposed on the side of the head, and the laser light 26 is emitted from the optical fiber 25 in a direction of 90 ° with respect to the optical axis of the condensing optical system 24. The laser light 26 is emitted, reflected by a mirror 27 inclined at 45 °, and guided to the condensing optical system 24.
[0009]
The mirror 27 is a mirror that totally reflects the YAG laser beam 26 and transmits the light emitted from the processed portion 28a. A mirror 31, a CCD camera 29, and a monitoring fiber (optical fiber) 30 are arranged above the mirror 27. The mirror 31 is a mirror that reflects visible light and transmits light of a specific wavelength such as infrared light. In the CCD camera 29, the light (image) of the processed portion 28a obtained through the mirror 27 and reflected by the mirror 31 is transmitted to the monitor 32, and the monitor 32 projects the image on the screen for remote monitoring. In the monitoring fiber 30, the light emitted from the processed portion 28 a obtained through the mirrors 27 and 31 is transmitted to the photoelectric conversion device 33. The photoelectric conversion device 33 photoelectrically converts the light emission and transmits it to the personal computer 34, and the personal computer 34 analyzes the intensity distribution of the light emission photoelectrically converted to check the processing quality. For example, in the case of welding, the penetration depth is confirmed, and in the case of cutting, it is confirmed whether or not the cutting is surely performed.
[0010]
[Problems to be solved by the invention]
However, in the conventional coaxial laser processing head, since the laser beam (laser beam) is once divided and an arc electrode or a cutting gas nozzle is installed at the center thereof, the NA (numerical aperture) for converging the laser beam is suppressed. There is a physical limit (because it is installed in the center of the beam), and in order to produce a convergent beam with a small NA similar to the case of a conventional laser beam alone, it is necessary to increase the lens diameter of the condensing optical system Therefore, an increase in the size of the head was inevitable. For this reason, sufficient condensing energy density could not be obtained, and the penetration capability could not be increased to the same level as a conventional laser processing head with a single laser beam. In addition, it is difficult to construct a long focus head suitable for cutting thick plates.
[0011]
In other words, in order to increase the focal length while reducing the focal spot diameter of the laser beam to ensure a high condensing energy density, it is necessary to increase the lens diameter, resulting in an increase in the size of the head. When the laser processing head is increased in size, interference between the head and the workpiece is likely to occur, so that it is difficult to apply to a workpiece having a complicated shape. On the other hand, if long focus cannot be achieved in order to avoid an increase in the size of the head, it will be difficult to cut the thick plate, and the head will approach the workpiece, so that the optical system is easily damaged by sputtering. And since it becomes easy to interfere with a workpiece | work, the application to a workpiece | work of a complicated shape becomes difficult too.
[0012]
Further, since the concave and convex roof mirrors 13 and 14 are used to divide the laser beam 12, the number of optical system elements is increased, the possibility of damage is increased, and the loss of the laser beam is also caused.
[0013]
Further, when the MIG electrode 18 is disposed between the divided laser beams 12a and 12b, since the MIG electrode 18 needs to be bent, the wire feeding resistance is increased. For this reason, as shown in FIG. 6, an expensive push-pull device using the feeding roller 19 must be provided to supplement the feeding force of the MIG electrode 18. Even when the cutting gas nozzle is arranged between the divided laser beams 12a and 12b, it is necessary to bend the cutting gas nozzle, so that the pressure loss increases and the delivery pressure of the cutting gas supply device needs to be increased.
[0014]
Further, in the case of the laser processing head shown in FIG. 8, since the laser beam 26 is incident from the side, an increase in the size of the head cannot be avoided. In addition, since the mirrors 27 and 31 are used, the number of optical system elements increases and the possibility of damage increases, and the loss of the laser light 26 and the light incident on the CCD camera 29 and the monitoring fiber 30 are also caused. .
[0015]
Therefore, in view of the circumstances as described above, the present invention has a simple configuration that does not require a mirror, can achieve a compact head, high condensing property, and long focus, and can easily supply an arc electrode, a cutting gas, and the like. It is an object of the present invention to provide a simple laser processing head and a laser processing apparatus including the same.
[0016]
[Means for Solving the Problems]
The laser processing head of the first invention that solves the above-described problem includes a collimating optical system that collimates laser light,
A half-cracked lens, and the laser beam exiting the collimating optical system by shifting the optical axis position of the half-cracked lens in a direction perpendicular to the optical axis position of the collimating optical system is half A condensing optical system for converging and irradiating the laser beam on the workpiece with this half-cracked lens,
Processing means disposed along the optical axis of the half-cracked lens is provided on the split surface side of the half-cracked lens.
[0017]
The laser processing head of the second invention is the laser processing head of the first invention, wherein the processing means is a MIG electrode, a TIG electrode, a filler wire, a thin tubular cutting gas nozzle or a powder nozzle.
[0018]
The laser processing head of the third invention is the laser processing head of the first or second invention.
The half-cracked lens is obtained by cutting and removing a portion through which laser light does not pass.
[0019]
The laser processing head of the fourth invention is the laser processing head of the first or second invention.
The processing means is a thin tubular cutting gas nozzle, and the cutting gas nozzle is a divergent nozzle.
[0020]
The laser processing head of the fifth invention is the laser processing head of the first, second, third or fourth invention.
One or both of a CCD camera that images the processed part of the workpiece and transmits an image to a monitor, and a monitoring fiber that transmits light emitted from the processed part to a processing quality analysis unit, It is characterized by being arranged on the dividing surface side.
[0021]
The laser machining apparatus of the sixth invention comprises the laser machining head of the first, second, third, fourth or fifth invention,
A laser oscillator that outputs laser light;
Laser light transmission means for transmitting laser light output from the laser oscillator to the laser processing head;
Head moving means for moving and positioning the laser processing head is provided.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0023]
1 is a system configuration diagram of a laser processing apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view showing a configuration of a laser processing head provided in the laser processing apparatus, and FIG. 3 is an AA line arrow in FIG. FIG. 4 is a configuration diagram of a laser processing head provided with various processing means, and FIG. 5 is a configuration diagram of a laser processing head provided with a CCD camera and a monitoring fiber ((a) is a BB line arrow in (b). FIG.
[0024]
<Configuration>
As shown in FIG. 1, a laser beam (laser beam) 52 output from a YAG laser oscillator 51 is transmitted to a remote laser processing head 54 through an optical fiber 53 as a laser beam transmission means. The laser processing head 54 collects the light and irradiates the work 55. At the same time, a MIG (GMA) electrode (filler wire) 57 as a processing means is fed from the wire feeder 56 to the laser machining head 54, and an arc discharge 74 from the MIG electrode 57 to the work 55 is applied by a voltage applied from the welding power source 58. Is done.
[0025]
The laser processing head 54 is moved and positioned, for example, three-dimensionally by a head moving device 59 such as a robot that is driven and controlled by NC control or the like. The control system 60 controls the head moving device 59, the YAG laser oscillator 51, the wire feeding device 56, and the welding power source 58. For example, the laser beam output from the YAG laser oscillator 51 and the arc discharge timing control from the MIG electrode 57 are performed according to the movement of the laser processing head 59.
[0026]
Here, the configuration of the laser processing head 54 will be described in detail with reference to FIGS. As shown in FIG. 2, the laser processing head 54 is provided with an optical fiber 53, a collimating optical system 62, and a condensing optical system 63 in the case 61 in order from the top to the bottom in the figure. In the figure, 64 and 65 are protective glasses.
[0027]
The collimating optical system 62 has one or a plurality of (three in the illustrated example) small-diameter lens 66, and the laser light 52 emitted from the tip of the optical fiber 53 is converted into parallel light by the lens 66. The condensing optical system 63 has one or a plurality of (four in the illustrated example) half-splitting lens 67 having a larger diameter than the lens 66 of the collimating optical system 62, and is made parallel by the collimating optical system 62. The laser beam 52 is condensed by a half-splitting lens 67 and irradiated onto the workpiece 55.
[0028]
The half-splitting lens 67 is obtained by dividing a circular large-diameter lens into two at the center (not only when cutting at the lens center and dividing into two equal parts, but at a position slightly shifted from the center of the lens and dividing into two equal parts. May be a little smaller or a little larger), and one of the divided pieces is used, and the laser light 52 emitted from the collimating optical system 62 is all incident. That is, the position of the optical axis 71 of the half-cracked lens 67 (the leftmost position in the figure of the half-cracked lens 67) is set to the optical axis 72 of the collimating optical system 62 (the center position of the lens 66). By shifting in a direction orthogonal to the left and right directions 71 and 72 (left direction in the figure), all the laser light 52 emitted from the lens 66 of the collimating optical system 62 is incident on the half-cracked lens 67 of the condensing optical system 63 (half-cracked) The light is collected through a lens 67. At this time, since the focal position of the laser beam 52 is located on the optical axis 71 of the half crack lens 67, it is located at the left end of the half crack lens 67 in the drawing.
[0029]
Further, as shown in FIG. 3, in the half-break lens 67, the portions 67a and 67b through which the laser beam 52 shown by a one-dot chain line does not pass are cut and removed, and actually only the portion shown by the solid line in the drawing. It is very compact. Therefore, the case 61 that accommodates the half crack lens 67 is also very compact.
[0030]
As shown in FIG. 2, a guide tube 73 is fixed along the optical axis 71 on the split surface 67 c side of the half-cracked lens 67, and the MIG electrode 57 is inserted through the guide tube 73. That is, since the MIG electrode 57 sent from the wire feeding device 56 is provided in the laser processing head 54 along the optical axis 71 of the half-cracked lens 67 on the split surface 67c side of the half-cracked lens 67. It is not bent as in the prior art (see FIG. 7), and is almost straight.
[0031]
Further, in place of the MIG electrode 57, other processing means shown in FIG. 4 may be arranged on the split surface 67c side of the half crack lens 67.
[0032]
In FIG. 4A, a TIG (tungsten) electrode 81 as a processing means is disposed on the split surface 67 c side of the half crack lens 67 along the optical axis of the half crack lens 67. In this case, the arc discharge 83 is performed from the TIG electrode 81 to the welded portion of the workpiece 84 by the applied voltage from the welding power source 82, and at the same time, the laser beam 52 is also irradiated to the welded portion to perform welding.
[0033]
In FIG. 4B, the filler wire 91 as a processing means is disposed on the split surface 67 c side of the half-cracked lens 67 along the optical axis of the half-cracked lens 67. A guide tube 93 is fixed along the optical axis to the split surface 67c side of the half crack lens 67, and a filler wire 91 is inserted through the guide tube 93. In this case, laser welding is performed by irradiating the welded portion with the laser beam 52 while supplying the filler wire 91 to the welded portion of the workpiece 94 by the wire feeder 92.
[0034]
In FIG. 4C, a thin tubular cutting gas nozzle 101 as a processing means is disposed on the split surface 67 side of the half crack lens 67 along the optical axis of the half crack lens 67. In this case, the cutting gas (assist gas) 103 delivered from the cutting gas supply device 102 is jetted from the tip of the cutting gas nozzle 101 to the cut portion of the work 103, and the laser beam 52 is applied to the cut portion. Irradiate to perform laser cutting. In this case, as the cutting gas nozzle 101, a nozzle (divergent nozzle) having such a shape that the flow path is once narrowed as shown in FIG. By using a divergent nozzle, the cutting gas 103 becomes supersonic and has a very elongated gas flow shape, so that cutting with a narrow kerf width can be performed at high speed.
[0035]
In FIG. 4 (e), the powder nozzle 111 as a processing means is disposed on the split surface 67 side of the half-cracked lens 67 along the optical axis of the half-cracked lens 67. In this case, the metal powder 113 delivered from the powder supply device 112 is discharged from the tip of the powder nozzle 111, and the metal powder 113 is irradiated with the laser light 52 to form an arbitrary three-dimensional shape 114.
[0036]
Further, a configuration when a CCD camera and a monitoring fiber are provided as an in-process monitoring system will be described with reference to FIG. In the laser processing head shown in FIG. 5, in the laser processing head shown in FIGS. 2 and 3, a CCD camera 121 and a monitoring fiber (optical fiber) 122 are further arranged on the split surface 67c side of the half-splitting lens 67. In parallel with the MIG electrode 57. Therefore, the CCD camera 121 and the monitoring fiber 122 receive light directly from the optical axis direction of the half-splitting lens 67 (from directly above the welded portion 55a of the workpiece 55) without passing through a mirror or the like, and Image extraction and light emission extraction of the unit 55a can be performed.
[0037]
Note that not only the MIG electrode 57 but also other processing means such as the filler wire 91 and the cutting gas nozzle 101 shown in FIG. 3 are provided, the CCD camera 121 and the monitoring fiber 122 are similarly connected to the split surface 67 c side of the half crack lens 67. Can be arranged.
[0038]
The CCD camera 121 transmits visible light (image) of the processed portion 55a to the monitor 123, and the monitor 123 displays the image on the screen for remote monitoring. The monitoring fiber 122 transmits light emitted from the processed portion 55a (light having a specific wavelength such as infrared light) to the photoelectric conversion device 124 using a light emitting diode or the like. The photoelectric conversion device 124 photoelectrically converts the light emission and transmits it to the personal computer 125, and the personal computer 125 analyzes the intensity distribution of the light emission photoelectrically converted to check the processing quality. For example, in the case of welding, the penetration depth is confirmed, and in the case of cutting, it is confirmed whether or not the cutting is surely performed.
[0039]
<Action and effect>
As described above, according to the laser processing head 54 of the present embodiment, the half-cracked lens 67 is provided, and the optical axis position of the half-cracked lens 67 is set to the optical axis position of the collimating optical system 62. By shifting in a direction perpendicular to the axis, all the laser light 52 emitted from the collimating optical system 62 is incident on the half-cracked lens 67, and the laser light 52 is condensed and irradiated onto the workpiece by the half-cracked lens 67. In addition, since the processing means such as the MIG electrode 57 and the cutting gas nozzle 101 are arranged on the dividing surface 67c side of the half crack lens 67 along the optical axis of the half crack lens 67, the following operations and effects are obtained. It is done.
[0040]
That is, since the laser beam 52 and the processing means such as the MIG electrode 52 and the cutting gas nozzle 101 are coaxial, it has the same function as a conventional coaxial laser processing head, such as being suitable for three-dimensional processing. It is possible to achieve compactness and high condensing performance and long focal length (especially effective for thick plate cutting) without being restricted by the convergence NA. In addition, in the present embodiment, since the half-cracked lens 67 obtained by cutting and removing the portions 67a and 67b through which the laser beam 52 does not pass is used, the head is further compared with the case where a simple half-cracked lens (semicircular lens) is used. Is compact.
[0041]
Further, although a large-diameter lens is used as a half-cracked lens, it can be divided into two parts (divided into two equal parts or a little smaller than that), and a laser processing head can be manufactured using only one of the divided pieces. Therefore, two sets of laser processing heads can be manufactured with one lens, and the cost can be reduced.
[0042]
Further, since the processing means such as the MIG electrode 57 and the cutting gas nozzle 102 can be provided in the laser processing head 54 without bending as in the prior art, the supply thereof becomes easy and the MIG electrode 57 is supplied. There is no need to provide a feed roller (push-pull device), a conventional MIG welding device can be used as it is, and it is not necessary to increase the delivery pressure of the cutting gas supply device 102.
[0043]
Further, since it is not necessary to use a mirror as in the conventional coaxial laser processing head, it is possible to reduce the number of optical elements and the loss of laser light.
[0044]
Further, it is possible to perform laser cutting (including drilling) by providing a thin tubular cutting gas nozzle 101. In this case, the cutting gas nozzle 101 is made to have a desired thickness and is not limited to the laser beam. The cutting gas 103 can be sent efficiently. For this reason, the cutting speed can be improved and the kerf width can be reduced. In particular, when a divergent nozzle is used as the cutting gas nozzle 101, the cutting gas can be made supersonic and a very elongated gas flow shape can be realized, so that the cutting speed and cutting quality (kerf width, etc.) can be improved. Greatly improved.
[0045]
Further, when the CCD camera 121 and the monitoring fiber 122 are provided, they are arranged on the split surface 67c side of the half-splitting lens 67 and are passed from the optical axis direction (from right above the processing portion) through a mirror or the like. In addition, since the light from the part to be processed can be received directly, the configuration is simplified, the loss of light is reduced, and image extraction and light emission extraction can be performed reliably. Further, it is not necessary to make the laser beam incident from the side and be reflected by the mirror as in the prior art, and the laser beam 52 can be incident in the optical axis direction, so the head becomes compact and the loss of the laser beam 52 is reduced. Can also be planned.
[0046]
The laser processing apparatus provided with the laser processing head 54 as described above is excellent in processing capability such as welding and cutting, and becomes a high-performance laser processing apparatus applicable to a workpiece having a complicated shape.
[0047]
【The invention's effect】
As described above in detail with the embodiment of the invention, according to the laser processing head of the first invention, the collimating optical system for collimating the laser light,
A half-cracked lens, and the laser beam exiting the collimating optical system by shifting the optical axis position of the half-cracked lens in a direction perpendicular to the optical axis position of the collimating optical system is half A condensing optical system for converging and irradiating the laser beam on the workpiece with this half-cracked lens,
Processing means disposed along the optical axis of the half-cracked lens is provided on the split surface side of the half-cracked lens.
[0048]
The laser processing head of the second invention is the laser processing head of the first invention, wherein the processing means is a MIG electrode, a TIG electrode, a filler wire, a thin tubular cutting gas nozzle or a powder nozzle.
[0049]
Therefore, according to the laser processing apparatus of the first or second invention, since the processing means such as the MIG electrode and the cutting gas nozzle and the laser beam are coaxial, the conventional coaxial laser processing head is suitable for three-dimensional processing. In addition, the head can be made compact and high condensing performance and long focal length (especially effective for cutting a thick plate) can be achieved without being restricted by the NA of convergence.
[0050]
Further, since the laser processing head can be manufactured by dividing the lens into two parts and using only one of the divided pieces, two sets of laser processing heads can be manufactured with one lens, thereby reducing the cost. be able to.
[0051]
Further, since processing means such as a MIG electrode and a cutting gas nozzle can be provided in the laser processing head without bending as in the prior art, it becomes easy to supply them, and a feeding roller ( There is no need to provide a push-pull device), and a conventional MIG welding device can be used as it is, and it is not necessary to increase the delivery pressure of the cutting gas supply device.
[0052]
Further, since it is not necessary to use a mirror as in the conventional coaxial laser processing head, it is possible to reduce the number of optical elements and the loss of laser light.
[0053]
According to the laser machining head of the third invention, in the laser machining head of the first or second invention, the half-cracked lens is obtained by cutting and removing a portion through which the laser beam does not pass. Compared with the case of using a (semicircular lens), the head is further compact.
[0054]
Further, according to the laser processing head of the fourth invention, in the laser processing head of the first or second invention, the processing means is a tubular cutting gas nozzle, and the cutting gas nozzle is a divergent nozzle. Since the cutting gas can be made supersonic and a very elongated gas flow shape can be realized, the cutting speed and cutting quality (kerf width, etc.) are greatly improved.
[0055]
Further, according to the laser processing head of the fifth invention, in the laser processing head of the first, second, third or fourth invention, a CCD camera for imaging the processed part of the workpiece and transmitting the image to the monitor By arranging one or both of the monitoring fibers for transmitting the light emission of the processed part to the processing quality analyzing means on the split surface side of the half-cracked lens, from the optical axis direction (of the processed part (From directly above) Since light from the workpiece can be received directly without going through a mirror, the configuration is simplified, light loss is reduced, and image extraction and light emission extraction are reliably performed. be able to. Further, unlike the prior art, it is not necessary to make the laser beam incident from the side and reflect it by the mirror, and the laser beam can be incident in the direction of the optical axis, so the head becomes compact and the loss of the laser beam is reduced. be able to.
[0056]
According to the laser processing apparatus of the sixth invention, the laser processing head of the first, second, third, fourth or fifth invention, the laser oscillator for outputting laser light, and the laser oscillator output By providing laser beam transmission means for transmitting laser light to the laser processing head and head moving means for moving and positioning the laser processing head, it has excellent processing capabilities such as welding and cutting, and has a complicated shape. It becomes a high-performance laser processing device applicable to workpieces.
[Brief description of the drawings]
FIG. 1 is a system configuration diagram of a laser processing apparatus according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view showing a configuration of a laser processing head provided in the laser processing apparatus.
FIG. 3 is an enlarged cross-sectional view taken along line AA in FIG. 2;
FIG. 4 is a configuration diagram of a laser processing head provided with various processing means.
FIG. 5 is a configuration diagram of a laser processing head including a CCD camera and a monitoring fiber.
FIG. 6 is a configuration diagram of a conventional laser processing head.
FIG. 7 is a configuration diagram of a conventional laser processing head.
FIG. 8 is a configuration diagram of a conventional laser processing head.
[Explanation of symbols]
51 YAG laser oscillator
52 Laser light
53 Optical fiber
54 Laser processing head
55 work
56 Wire feeder
57 MIG electrode
58 Welding power source
59 Head moving device
60 Control system
61 cases
62 Collimating optics
63 Condensing optical system
64,65 protective glass
66 lenses
67 Half-splitting lens
67a, 67b Parts where laser light does not pass (cut and removed parts)
67c Dividing surface
71, 72 Optical axis
73 Guide tube
74 Arc discharge
81 TIG electrode
82 Welding power supply
83 Arc discharge
84 Workpiece
91 Filler Wire
92 Wire feeder
93 Guide tube
94 work
101 cutting gas nozzle
102 Cutting gas supply device
103 cutting gas
104 work
111 Powder nozzle
112 Powder feeder
113 Metal powder
114 Three-dimensional object
121 CCD camera
122 Monitoring fiber
123 monitor
124 photoelectric conversion device
125 personal computer

Claims (6)

A collimating optical system that collimates the laser beam;
A half-cracked lens, and the laser beam exiting the collimating optical system by shifting the optical axis position of the half-cracked lens in a direction perpendicular to the optical axis position of the collimating optical system is half A condensing optical system for converging and irradiating the laser beam on the workpiece with this half-cracked lens,
A laser processing head, comprising processing means disposed along the optical axis of the half-cracked lens on a split surface side of the half-cracked lens. In the laser processing head according to claim 1,
The laser processing head, wherein the processing means is a MIG electrode, a TIG electrode, a filler wire, a thin tubular cutting gas nozzle or a powder nozzle. In the laser processing head according to claim 1 or 2,
The laser processing head according to claim 1, wherein the half crack lens is obtained by cutting and removing a portion through which laser light does not pass. In the laser processing head according to claim 1 or 2,
The laser processing head according to claim 1, wherein the processing means is a thin tubular cutting gas nozzle, and the cutting gas nozzle is a divergent nozzle. In the laser processing head according to claim 1, 2, 3, or 4,
One or both of a CCD camera that images the processed part of the workpiece and transmits an image to a monitor, and a monitoring fiber that transmits light emitted from the processed part to a processing quality analysis unit, A laser processing head, characterized in that it is arranged on the dividing surface side. A laser processing head according to claim 1, 2, 3, 4 or 5,
A laser oscillator that outputs laser light;
Laser light transmission means for transmitting laser light output from the laser oscillator to the laser processing head;
A laser processing apparatus comprising: a head moving unit that moves and positions the laser processing head.

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