JP2002239759A - レーザ衝撃ピーニングテープの方法及び物品 - Google Patents

レーザ衝撃ピーニングテープの方法及び物品

Info

Publication number
JP2002239759A
JP2002239759A JP2001275856A JP2001275856A JP2002239759A JP 2002239759 A JP2002239759 A JP 2002239759A JP 2001275856 A JP2001275856 A JP 2001275856A JP 2001275856 A JP2001275856 A JP 2001275856A JP 2002239759 A JP2002239759 A JP 2002239759A
Authority
JP
Japan
Prior art keywords
tape
consumable
medium
laser
metal component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2001275856A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002239759A5 (enExample
Inventor
Mark Lloyd Miller
マーク・ロイド・ミラー
Farzin Homayoun Azad
ファージン・ホマユーン・アザド
Seetha Ramaiah Mannava
シーザ・ラマイアー・マンナヴァ
Phelmon Kennard Wright Iii
フレモン・ケナード・ライト，ザ・サード
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JP2002239759A publication Critical patent/JP2002239759A/ja
Publication of JP2002239759A5 publication Critical patent/JP2002239759A5/ja
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D10/00—Modifying the physical properties by methods other than heat treatment or deformation
    • C21D10/005—Modifying the physical properties by methods other than heat treatment or deformation by laser shock processing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/902—Metal treatment having portions of differing metallurgical properties or characteristics
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31909—Next to second addition polymer from unsaturated monomers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Adhesive Tapes (AREA)
JP2001275856A 2000-09-13 2001-09-12 レーザ衝撃ピーニングテープの方法及び物品 Ceased JP2002239759A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/660967 2000-09-13
US09/660,967 US6677037B1 (en) 2000-09-13 2000-09-13 Laser shock peening tape, method and article

Publications (2)

Publication Number Publication Date
JP2002239759A true JP2002239759A (ja) 2002-08-28
JP2002239759A5 JP2002239759A5 (enExample) 2008-10-23

Family

ID=24651650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001275856A Ceased JP2002239759A (ja) 2000-09-13 2001-09-12 レーザ衝撃ピーニングテープの方法及び物品

Country Status (7)

Country Link
US (1) US6677037B1 (enExample)
EP (1) EP1188842B1 (enExample)
JP (1) JP2002239759A (enExample)
BR (1) BR0104026B1 (enExample)
CA (1) CA2356055C (enExample)
DE (1) DE60131514T2 (enExample)
SG (1) SG99954A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005238273A (ja) * 2004-02-25 2005-09-08 Mitsubishi Heavy Ind Ltd 金属材料処理方法及び装置
JP2006159290A (ja) * 2004-12-09 2006-06-22 General Electric Co <Ge> レーザ衝撃ピーニング方法およびその方法に用いるコーティングならびにその方法で作られた物品
JP2009509771A (ja) * 2005-09-30 2009-03-12 ローレンス リヴァーモア ナショナル セキュリティ，エルエルシー レーザーピーニング中の孔食を防ぐよう除去層を使用するレーザーピーニング方法及び装置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8049137B2 (en) 2004-02-13 2011-11-01 Boston Scientific Scimed, Inc. Laser shock peening of medical devices
WO2008030221A2 (en) * 2005-08-18 2008-03-13 Washington State University System and method of laser dynamic forming
DE102007056502B4 (de) * 2007-11-22 2010-07-29 Eads Deutschland Gmbh Verfahren und Vorrichtung zum Aufbau von Eigenspannungen in einem metallischen Werkstück
CN103014250A (zh) * 2012-12-25 2013-04-03 中国人民解放军空军工程大学 无污染复合吸收约束层及无污染激光冲击强化的方法
DE102015212529A1 (de) * 2015-07-03 2017-01-05 Siemens Aktiengesellschaft Pulverbettbasiertes additives Fertigungsverfahren mit Oberflächennachbehandlung und für dieses Fertigungsverfahren geeignete Anlage
CN110732779B (zh) * 2019-10-18 2021-05-04 扬州镭奔激光科技有限公司 一种整体叶盘稳定约束层的定轴旋转激光喷丸方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01298113A (ja) * 1988-05-26 1989-12-01 Hajime Watanabe レーザー光による加工用の塗布剤
JPH08218042A (ja) * 1995-02-15 1996-08-27 Modern Plast Kogyo Kk スクリーン印刷版用粘着テープ
JPH11509782A (ja) * 1996-04-26 1999-08-31 ゼネラル・エレクトリック・カンパニイ 接着テープで覆った乾式レーザ衝撃ピーニング
JPH11254157A (ja) * 1997-12-18 1999-09-21 General Electric Co <Ge> 亀裂防止レーザ衝撃ピーニング

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4237514A (en) * 1978-12-01 1980-12-02 Dayton-Granger, Inc. Lightning diverter strip
JPS5632139A (en) * 1979-08-23 1981-04-01 Fuji Photo Film Co Ltd Packing material for photosensitive material
US4937421A (en) * 1989-07-03 1990-06-26 General Electric Company Laser peening system and method
EP0666326B1 (en) * 1993-12-07 2001-03-28 Toyota Jidosha Kabushiki Kaisha Laser shock processing method utilizing light absorbing material layer of controlled thickness
US6238837B1 (en) * 1995-05-01 2001-05-29 E.I. Du Pont De Nemours And Company Flexographic element having an infrared ablatable layer
US5735044A (en) 1995-12-12 1998-04-07 General Electric Company Laser shock peening for gas turbine engine weld repair
US5674329A (en) * 1996-04-26 1997-10-07 General Electric Company Adhesive tape covered laser shock peening
US5742028A (en) 1996-07-24 1998-04-21 General Electric Company Preloaded laser shock peening
US5951790A (en) 1998-06-26 1999-09-14 General Electric Company Method of monitoring and controlling laser shock peening using an in plane deflection test coupon
US6094260A (en) 1998-08-12 2000-07-25 General Electric Company Holographic interferometry for monitoring and controlling laser shock peening
US5948293A (en) 1998-12-03 1999-09-07 General Electric Company Laser shock peening quality assurance by volumetric analysis of laser shock peened dimple
US6049058A (en) 1998-12-15 2000-04-11 Lsp Technologies, Inc. Laser peening process and apparatus with uniform pressure pulse confinement
US6245486B1 (en) * 2000-06-30 2001-06-12 Gary Ganghui Teng Method for imaging a printing plate having a laser ablatable mask layer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01298113A (ja) * 1988-05-26 1989-12-01 Hajime Watanabe レーザー光による加工用の塗布剤
JPH08218042A (ja) * 1995-02-15 1996-08-27 Modern Plast Kogyo Kk スクリーン印刷版用粘着テープ
JPH11509782A (ja) * 1996-04-26 1999-08-31 ゼネラル・エレクトリック・カンパニイ 接着テープで覆った乾式レーザ衝撃ピーニング
JPH11254157A (ja) * 1997-12-18 1999-09-21 General Electric Co <Ge> 亀裂防止レーザ衝撃ピーニング

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005238273A (ja) * 2004-02-25 2005-09-08 Mitsubishi Heavy Ind Ltd 金属材料処理方法及び装置
JP2006159290A (ja) * 2004-12-09 2006-06-22 General Electric Co <Ge> レーザ衝撃ピーニング方法およびその方法に用いるコーティングならびにその方法で作られた物品
JP2009509771A (ja) * 2005-09-30 2009-03-12 ローレンス リヴァーモア ナショナル セキュリティ，エルエルシー レーザーピーニング中の孔食を防ぐよう除去層を使用するレーザーピーニング方法及び装置

Also Published As

Publication number Publication date
CA2356055C (en) 2009-11-24
CA2356055A1 (en) 2002-03-13
DE60131514T2 (de) 2008-10-23
US6677037B1 (en) 2004-01-13
EP1188842B1 (en) 2007-11-21
BR0104026B1 (pt) 2013-11-05
EP1188842A1 (en) 2002-03-20
BR0104026A (pt) 2002-05-28
DE60131514D1 (de) 2008-01-03
SG99954A1 (en) 2003-11-27

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