JP2002231734A5 - - Google Patents
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- Publication number
- JP2002231734A5 JP2002231734A5 JP2001029424A JP2001029424A JP2002231734A5 JP 2002231734 A5 JP2002231734 A5 JP 2002231734A5 JP 2001029424 A JP2001029424 A JP 2001029424A JP 2001029424 A JP2001029424 A JP 2001029424A JP 2002231734 A5 JP2002231734 A5 JP 2002231734A5
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting adhesive
- semiconductor
- semiconductor device
- mounting
- wiring substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001029424A JP2002231734A (ja) | 2001-02-06 | 2001-02-06 | 基板ユニット、半導体素子、半導体素子の実装方法及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001029424A JP2002231734A (ja) | 2001-02-06 | 2001-02-06 | 基板ユニット、半導体素子、半導体素子の実装方法及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2002231734A JP2002231734A (ja) | 2002-08-16 |
JP2002231734A5 true JP2002231734A5 (ko) | 2005-03-10 |
Family
ID=18893778
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001029424A Pending JP2002231734A (ja) | 2001-02-06 | 2001-02-06 | 基板ユニット、半導体素子、半導体素子の実装方法及びその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2002231734A (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4506197B2 (ja) * | 2004-02-24 | 2010-07-21 | 三菱電機株式会社 | 電気部品の固定方法及び太陽電池パネル |
JP2007165594A (ja) * | 2005-12-14 | 2007-06-28 | Denso Corp | 電子部品の実装方法 |
US9429867B2 (en) * | 2014-03-27 | 2016-08-30 | Oki Data Corporation | Semiconductor apparatus, exposing head, and image forming apparatus |
JP6358826B2 (ja) * | 2014-03-27 | 2018-07-18 | 株式会社沖データ | 半導体装置、露光ヘッド及び画像形成装置 |
CN109701821B (zh) * | 2019-02-21 | 2023-05-23 | 广东晶锐半导体有限公司 | 一种用于led固晶的点胶头及点胶方法 |
JPWO2022270309A1 (ko) * | 2021-06-21 | 2022-12-29 | ||
US20240079387A1 (en) * | 2021-10-26 | 2024-03-07 | Lg Electronics Inc. | Display device using semiconductor light-emitting element |
-
2001
- 2001-02-06 JP JP2001029424A patent/JP2002231734A/ja active Pending
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